KR20160029189A

KR20160029189A - Encrypting pin pad

Info

Publication number: KR20160029189A
Application number: KR1020140117619A
Authority: KR
Inventors: 박정호
Original assignee: 노틸러스효성 주식회사
Priority date: 2014-09-04
Filing date: 2014-09-04
Publication date: 2016-03-15

Abstract

Disclosed is an encrypting pin pad which is mounted on a banking device. According to an embodiment of the present invention, the encrypting pin pad comprises: a housing; a substrate provided in the housing; a contact module whose one side comes in contact with the substrate to be electrically connected to the substrate when the encrypting pin pad is mounted on the banking device; and a control circuit to delete previously stored banking information when the substrate and the contact module are electrically shorted. The contact module comprises: a first elastic unit wherein a portion thereof is exposed to the outside of the housing to be pressed by a portion of the banking device when the encrypting pin pad is mounted on the banking device; a second elastic unit pressed by the first elastic unit; and a conductive sheet disposed on one end of the second elastic unit on the substrate side to come in contact with the substrate when the second elastic unit is pressed.

Description

Encryption pin pad {ENCRYPTING PIN PAD}

The present invention relates to an Encrypting Pin Pad (EPP).

A banking machine including a bank terminal device such as a financial automator such as an automatic teller machine (ATM) and a card reader is generally capable of reading user's card information, The process of the next step can be performed only when the password inputted by inputting the password matches the actual password of the card.

In the case of a financial device requiring such a high level of security, a keypad for receiving a password from a user may be combined with an encryption device for encrypting input data. As such an encryption device, an encryption key pad (EPP) having recently adopted a DES (Data Encryption Standard) algorithm is widely used.

The encryption pin pad has a keypad for a user to input a password and a memory (SRAM) in which an encryption key is stored. The memory is provided inside the encryption pin pad so that it can not be manipulated externally. It can be exposed to the outside so as to be operable.

However, if an unauthorized person disassembles the encryption pin pad arbitrarily to access the memory and then connects the hacking device to the memory, financial information such as password and card information may leak.

In order to solve such a problem, in the related art, a configuration for detecting whether or not the encryption pin pad is disassembled is provided, and when it is determined that the encryption pin pad is disassembled, the financial information previously stored in the memory is generally deleted. For example, it is possible to determine whether the encryption pin pad is disassembled by detecting a short circuit between the configuration and the substrate, after providing a configuration in which the substrate is electrically connected to the substrate inside the encryption pin pad.

However, according to the above-described prior art, when a clearance is generated between parts due to manufacturing tolerances of parts or deformation of parts due to use or the like, a shock (external shock) The above configuration can be easily detached from the substrate, which is mistaken for an intruder of an outside person, thereby erasing financial information.

Japanese Patent Application Laid-Open No. 10-2006-0046933

An embodiment of the present invention is to provide an encryption pin pad that can prevent financial information from being leaked by deleting financial information previously stored when an outsider approaches for an unauthorized purpose.

It is also intended to provide an encryption pin pad with low possibility of malfunction and improved stability.

According to another aspect of the present invention, there is provided an encryption pin pad comprising: a housing; a substrate provided inside the housing; a contact portion having one side thereof in contact with the substrate and electrically connected to the substrate when the encryption pin pad is mounted on the financial instrument; And a control circuit for deleting the previously stored financial information when the substrate and the contact module are electrically short-circuited, wherein the contact module is partially exposed to the outside of the housing, A first elastic unit that is pressed by a part of the financial device when the first elastic unit is mounted on the first elastic unit, a second elastic unit that is pressed by the first elastic unit, and a second elastic unit that is provided on one side of the substrate side of the second elastic unit, And a conductive sheet that contacts the substrate when it is pressed.

The elastic modulus of the first elastic unit may be greater than that of the second elastic unit.

In addition, an accommodating portion that is opened upward is formed in the second elastic unit, and the first elastic unit can be inserted into the accommodating portion.

The first elastic unit includes a guide member having an upwardly opened space therein and an outer circumferential surface thereof in contact with an inner circumferential surface of the accommodating portion, an elastic member provided in the space of the guide member, And a rod for pressing the elastic member while moving along the inner circumferential surface of the guide member.

The second elastic unit may include a first portion that is pressed by the first elastic unit and has a cylindrical shape, a second portion that is connected to the peripheral portion of the lower surface of the first portion and has a larger diameter toward the lower portion, A third portion connected to a central portion of a lower surface of the first portion and protruding to the inside of the second portion and connected to the conductive sheet on the other surface and an upper surface connected to a lower end portion of the second portion, And a fourth portion contacting the substrate and having a first through hole for contacting the substrate and the conductive sheet at a central portion thereof.

The diameter of the fourth portion may be larger than the diameter of the lower end of the second portion.

The diameter of the first through-hole is smaller than the outer diameter of the lower end of the second portion. The fourth portion is provided with a second through-hole, which is communicated with the first through- Can be formed.

According to the embodiment of the present invention, it is possible to provide an encryption pin pad which can prevent financial information from being leaked by deleting the previously stored financial information when an outsider approaches the unauthorized purpose.

Further, it is possible to provide an encryption pin pad having a low possibility of malfunction and improved stability.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram illustrating a financial device equipped with an encryption pin pad according to an embodiment of the present invention; FIG.
2 is a perspective view of an encryption pin pad according to an embodiment of the present invention.
3 is an exploded perspective view of the encryption pin pad of Fig.
4 is an enlarged view of a contact module of the encrypting pin pad of Fig. 2;
5 is a cross-sectional view taken along the line AA in Fig.
FIG. 6 is a sectional view showing a state of the contact module when the encrypting pin pad of FIG. 2 is mounted on a financial instrument; FIG.

Hereinafter, specific embodiments for implementing the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the subject matter of the present invention.

FIG. 1 is a view illustrating a financial device 1 equipped with an encryption pin pad 100 according to an embodiment of the present invention. Here, it is exemplified that the financial instrument (1) is a financial automation device such as a cash deposit / withdrawal machine. However, the present invention is not limited to this, and the financial instrument 1 may be understood as a concept including a financial terminal such as a card reader. In other words, the financial device 1 may refer to all devices that provide financial services after receiving a password from a user.

The financial instrument 1 may include a card insertion portion 2, a display portion 3, a deposit and withdrawal portion 4, and an encryption pin pad 100. A transaction can be started by inserting a card or a passbook into the card inserting portion 2 by the user, and the display portion 3 can provide the process, details and the like of the transaction to the user. In the course of the transaction, the user can input the password through the encryption pin pad 100 and can select the type of transaction or the like. The banknotes and the like that are traded by the transaction can be moved to the outside or inside of the financial instrument 1 through the deposit / withdrawal portion 4. [ In addition, a staff telephone 5 can be installed on one side of the financial instrument 1. [ When a specific problem occurs in the financial instrument 1 and manpower is required to solve the problem, the user using the financial instrument 1 can use the teleoperator 5 for calling the bank, the security officer, And the like.

The encryption pin pad 100 is a device for receiving numerals, characters, or special functions from a user, and is a device that generates an electrical signal by operating a portion exposed to the outside by a user.

On the other hand, a portion of the upper portion of the encryption pin pad 100 may be covered by the front bezel 10, which is a part of the financial instrument 1. A portion of the financial instrument 1 such as the front bezel 10 may press the contact module exposed to the outside of the encryption pin pad 100 when the encryption pin pad 100 is mounted to the financial instrument 1. [ Here, a part of the financial instrument 1 is exemplified as the front bezel 10, but other configurations other than the front bezel 10 may press the contact module depending on the specific structure of the financial instrument 1.

FIG. 2 is a perspective view of an encryption pin pad according to an embodiment of the present invention, and FIG. 3 is an exploded perspective view of the encryption pin pad 100 of FIG.

2 and 3, the encryption pin pad 100 according to the present embodiment may include a housing 110, a keypad 120, a substrate 130, and a contact module 140.

The housing 110 may provide a space in which components such as the substrate 130 can be placed. In the case of this embodiment, the housing 110 is illustrated as including a top cover 111 and a bottom cover 112. The upper cover 111 may cover the upper surface of the substrate 130 and the lower cover 112 may cover the lower surface of the substrate 130. For convenience of explanation, the upper side of the substrate 130 will be referred to as an upper surface and the lower side will be referred to as a lower side with reference to the drawing, and the upper and lower sides of the substrate 130 will be referred to as " The upper cover 111 covers the upper surface and the lower cover 112 covers the lower surface of the substrate 130. [ Depending on the viewpoint, the lower cover 112 may be understood as an upper cover covering the upper surface of the substrate 130.

1, the encryption pin pad 100 is not mounted at a position overlooking the user, but is mounted at a position facing the user, i.e., at a position such as the card insertion portion 2 or the display portion 3 The concept of up and down may not be applied precisely. In summary, the concept of the upper / lower and upper / lower surfaces referred to herein is only for explaining the relative relationship of each configuration of the encryption pin pad 100, and is not an absolute concept considering the relationship with the ground.

The upper cover 111 may include a top portion 111a and a base portion 111b. The top portion 111a protrudes upward from the base portion 111b and can have a cross sectional area smaller than that of the base portion 111b so that the rim portion of the base portion 111b is not covered by the top portion 111a, . A through hole 113 for exposing the keypad 120 to the outside may be formed on the top portion 111a.

A hole 114 through which the contact module 140 passes may be formed at the rim of the base 111b. The plurality of contact modules 140 may be provided, and the plurality of holes 114 may be provided. In this embodiment, two contact modules 140 and two holes 114 are provided.

Although not shown in FIGS. 2 and 3, the front bezel 10 shown in FIG. 1, that is, a part of the financial instrument 1, can be assembled to the financial instrument 1 so as to be positioned above the top cover 111. [ For example, the front bezel 10 may have an opening in which the top portion 111a is positioned to expose the top portion 111a and the keypad 120 to the outside. However, the front bezel 10 may not expose the base portion 111b of the upper cover 111 to the outside.

The front bezel 10 can be positioned on the rim of the base portion 111b and can press down the rim of the base portion 111b in the process of assembling. At this time, the contact module 140, which is partially exposed on the upper cover 111, can be pressed down by the front bezel 10, and the contact module 140 is pressed down by the front bezel 10 Accordingly, when the contact module 140 and the substrate 130 are electrically short-circuited, the financial information previously stored may be deleted by considering that an outsider is approaching with an unjust purpose. In a normal state after the assembly of the financial instrument is completed, the front bezel 10 can always press the contact module 140, so that the contact module 140 always maintains electrical contact with the substrate 130 It is because.

The substrate 130 may be a general printed circuit board (PCB). Various electrical components such as a processor, a memory, a conductive track, a sensor, and a circuit may be mounted on the substrate 130. For example, the contact module 140 may be electrically connected to the substrate 130 through contact with a conductive track of the substrate 130.

The keypad 120 can receive information such as a password from a user. The keypad 120 may be provided between the upper cover 111 and the substrate 130 and may be exposed to the outside through the through hole 113 of the upper cover 111. [ Herein, the keypad 120 may be pressed in a mechanical manner to transmit an electrical signal to the substrate. However, the present invention is not limited to this, and the keypad may transmit an electrical signal to the substrate in a recently-popular touch-screen method.

The contact module 140 can be electrically connected to the substrate 130 by contacting one side of the contact pin 140 when the encapsulation pin pad 100 is mounted on the financial instrument 1 as described above. In the normal state, the substrate 130 and the contact module 140 are maintained in an electrically connected state, so that when the substrate 130 and the contact module 140 are electrically short-circuited, there is an intrusion, for example, . &Lt; / RTI >

The contact module 140 may include a first elastic unit (FIGS. 3 and 141), a second elastic unit (FIGS. 3 and 142), and a conductive sheet 160. The first elastic unit 141 is exposed to the outside of the housing 110 before assembly and the encryption pin pad 100 is mounted on the financial instrument 1 and a part of the financial instrument 1, (Not shown). The second elastic unit 142 can be pressed by the first elastic unit 141 and moved to the side of the substrate 130 so that the second elastic unit 142 can be moved to the side of the substrate 130, The contact module 140 and the substrate 130 can be electrically connected to each other through the contact between the contact module 140 and the substrate 130. The contact module 140 will be described in detail with reference to FIGS. 4 to 6. FIG.

The control circuit can detect that the substrate 130 and the contact module 140 are electrically short-circuited and if the substrate 130 and the contact module 140 are electrically short-circuited, Information, for example, card information and / or password. The control circuit may be mounted on the upper surface and / or the lower surface of the substrate 130, or may be provided as a separate module at a point adjacent to the substrate 130 and may be electrically connected to the substrate 130. The control circuit that performs this function is already well known in the art and will not be described in further detail.

FIG. 4 is an enlarged view of the contact module 140 of the encryption pin pad 100 of FIG. 2, and FIG. 5 is a cross-sectional view taken along the line A-A of FIG. 4 and 5, the contact module 140 will be described in detail. 4 and 5 show the contact module 140 before the encryption pin pad 100 is mounted on the financial instrument.

As described above, the contact module 140 may include a first elastic unit 141, a second elastic unit 142, and a conductive sheet 160.

The first elastic unit 141 may include a guide member 141a, an elastic member 141c, and a rod 141d. A space 141b that is opened upward is formed in the guide member 141a and the outer circumferential surface of the guide member 141a can contact the accommodating portion of the second elastic unit 142 to be described later. The elastic member 141c may be provided in the space 141b inside the guide member 141a and may be deformed (compressed or stretched) up and down with reference to the drawing. The rod 141d can be pressed downward by a part of the financial instrument (for example, a front bezel) to compress the elastic member 141c while moving along the inner peripheral surface of the guide member 141a. The elastic member 141c is compressed so that the elastic force can be transmitted to the guide member 141a and the elastic force is transmitted to the second elastic unit 142, 142).

The second elastic unit 142 may include a first portion 142a, a second portion 142b, a third portion 142c, and a fourth portion 142d.

The first portion 142a may be a portion that is directly pressed by the first elastic unit 141 and may be a cylindrical shape having an upwardly open receiving portion therein. The first elastic unit 141 can be inserted into the receiving portion. More specifically, the outer circumferential surface of the guide member 141a of the first elastic unit 141 may be disposed so as to be in contact with the inner circumferential surface of the accommodating portion.

The second portion 142b may have a cone shape with the top cut out. For example, the upper end of the second portion 142b may be connected to the peripheral portion of the lower surface of the first portion 141a, and the diameter thereof may become larger toward the lower portion. In addition, an empty space may be provided therein.

And the third portion 142c may be in contact with the center of the lower surface of the first portion 142a. The third portion 142c may protrude downward from the lower surface of the first portion 142a through the empty space inside the second portion 142b and the conductive sheet 160 may be connected to the lower surface thereof.

The upper surface of the fourth portion 142d may be connected to the lower end of the second portion 142b, and the lower surface may be in contact with the substrate 130. [ A first through hole 150 for contacting the substrate 130 and the conductive sheet 160 may be formed at the center of the fourth portion 142d.

For reference, the diameter herein refers to the diameter of the circular cross section of each configuration when the contact module 140 is viewed from top to bottom in FIG.

6 is a cross-sectional view showing a state of the contact module 140 when the encryption pin pad 100 of FIG. 2 is mounted on a financial instrument.

A part of the financial instrument such as the front bezel 10 presses a part of the contact module 140 exposed to the outside of the housing 110 when the encryption pin pad 100 is mounted on the financial instrument, . More specifically, as shown in the figure, the front bezel 10 can press down the rod 141d of the first elastic unit 141 exposed to the outside of the upper cover 111. The rod 141d can compress the elastic member 141c while moving down along the guide member 141a. The elastic force formed by the compression of the elastic member 141c can be transmitted to the lower surface of the guide member 141a and the elastic force can be transmitted to the second elastic unit 142 which can directly contact the lower surface of the guide member 141a, Lt; / RTI > of the first portion 141a of the first portion 141a.

When the second elastic unit 142 starts to be pressed by the first elastic unit 141 through the first part 142a receiving the elastic force from the guide member 141a, The first portion 142a and the third portion 142c and the conductive sheet 160 that can be connected to the third portion 142c can be gradually moved toward the substrate 130 side. At the same time, the second portion 142b is also deformed to change the angle with respect to the substrate 130 to induce movement of the first portion 142a, the third portion 142c, and the conductive sheet 160 as described above have.

When the first portion 142a and the third portion 142c of the second elastic unit 142 and the conductive sheet 160 are moved downward, the conductive sheet 160 is in contact with the substrate 130 Whereby the conductive sheet 160 can be electrically connected to the substrate 130. For example, a conductive track may be formed on the substrate 130, and the conductive sheet 160 may be in contact with the conductive track so that the two are electrically connected to each other. The control circuit may be connected to the conductive track and sense whether the conductive sheet 160 and the conductive track are electrically short-circuited.

When the outsider attempts to approach the encryption pin pad 100 starting from the removal of the front bezel 10 in the above state, the front bezel 10 no longer moves the rod 141d of the first elastic unit 141 The elastic member 141c can be extended upward again so that the second elastic unit 142 can also return to the shape as shown in Fig. As a result, the conductive sheet 160 and the substrate 130 can be electrically short-circuited, and the control circuit can delete the previously stored financial information after sensing it.

In the case of the encryption pin pad 100 according to the present embodiment, as described above, the contact module 140 having a dual structure is implemented by arranging the two elastic units 141 and 142 successively. That is, a first elastic unit 141 that receives a pressing force directly from the outside, and a second elastic unit 141 that is pressed by the first elastic unit 141 to contact the substrate 130 (more precisely, the conductive sheet 160 The second elastic unit 142 may contact the substrate 130). This double structure can improve the operational airtightness and stability of the contact module 140.

Also, the possibility of malfunction can be significantly reduced compared to when the contact module 140 is provided in a single structure. In more detail, in the related art, a contact module of a single structure usually has a contact with the substrate and is electrically connected to the substrate. However, due to manufacturing tolerances of the components or deformation of the components due to use, In this case, the contact module may easily fall off the substrate if there is an external impact (such as a simple impact, not an unjust purpose) on the financial instrument, and the control circuit may mistake this as an intrusion of an external person and delete the financial information.

In order to prevent such a malfunction, in the case of this embodiment, the second elastic unit 142 directly contacting the substrate 130 (more precisely, the conductive sheet 160 is contacted to the substrate 130) (For example, the front bezel 10) and indirectly pressurized by the first elastic unit 141. In this case,

Also, as described above, the elastic modulus of the first elastic unit 141 is designed to be larger than the elastic modulus of the second elastic unit 142. That is, when the first elastic unit 141 and the second elastic unit 142 are compared with each other, it is assumed that the elastic force provided by the first elastic unit 141 is equal to that of the second elastic unit 142 ) May be larger than the elastic force provided by the elastic member.

In order to mount the encryption pin pad 100 on a financial instrument, a part of a financial instrument such as the front bezel 10 must press the first elastic unit 141 exposed to the outside of the housing 110, 141 have a relatively high elastic modulus, they generate a relatively high elastic force and can press the second elastic unit 142. The second elastic unit 142 can be urged toward the substrate 130 side by a stronger force than when it is a single structure. In other words, in the case of this embodiment, a relatively large force is required to assemble a part of a financial instrument such as the front bezel 10 to a financial instrument, compared with a single structure (a first elastic unit 141 having a relatively large elastic modulus ), And this large force can be transmitted to the second elastic unit 142. [0064] The second elastic unit 142 is urged toward the substrate 130 side by a relatively high elastic force (the second elastic unit 142 is more in the case of a single structure than in the case of a single structure) The possibility of a malfunction in which the conductive sheet 160 and the board 130 are short-circuited electrically due to a temporary external impact and the financial information is deleted may be significantly lowered.

In addition, since the second elastic unit 142 applies a direct physical force to the substrate 130 with the conductive sheet 160 interposed therebetween, there is a restriction on the selection of the material thereof, and it can be usually formed of silicon rubber. The silicone rubber material has a limitation in obtaining a strong pressing force. In this embodiment, the first elastic unit 141 having a spring pin structure can be employed to overcome the above limitations. Specifically, it is possible to use a relatively rigid guide member 141a and a rod 141d, and an elastic member 141c such as a spring capable of selecting a high elastic modulus, so that a strong pressing force (elastic force) (The elastic member 141c) and can transmit it to the second elastic unit 142 without loss (the guide member 141a and the rod 141d of rigid material).

In addition, when the double elastic structure is implemented as in the present embodiment, the overall stroke length of the elastic units 141 and 142 can be increased. In the case of a single structure of the conventional silicone rubber, the stroke length is only about 1-2 mm, and even if there is a slight tolerance or clearance, a short circuit phenomenon occurs with the substrate. However, in the case of this embodiment, a larger elastic force can be applied to the second elastic unit 142 by the first elastic unit 141, so that the entire elastic units 141, 142 including the stroke of the first elastic unit 141, 142 can be increased to about 6-7 mm. Thereby, the second elastic unit 142 may not be short-circuited from the substrate.

4 to 6, the fourth portion 142d of the second elastic unit 142 will be described. As shown, the fourth portion 142d may be in the form of a disc whose diameter may be greater than the diameter of the lower end of the second portion 142b. That is, the fourth portion 142d may protrude further to the side of the contact module 140 relative to other portions. The upper surface of the fourth portion 142d can be pressed by another component provided inside the encryption pin pad 100 so that the second elastic unit 142 is prevented from being detached from the substrate 130 . For example, the upward movement of the fourth portion 142d may be limited by the protrusion protruding from the upper cover 111, or may be pressed downward.

4, a second through hole 151 may be formed in the fourth portion 142d. The second through hole 151 may communicate with the first through hole 150 formed at the center of the fourth portion 142d and at least a part may not be covered by the second portion 142b. The second through hole 151 is formed so that the second portion 142b is deformed in the direction in which the second portion 142b totally approaches the substrate 130 as the conductive sheet 160 and the first and third portions 142a and 142c move downward The air in the space inside the second portion 142b can be discharged to the outside. The conductive sheet 160 and the first and third portions 142a and 142c may be restricted from moving downward unless the air existing in the space inside the second portion 142b is discharged, It may also interfere with maintaining a firm contact between the substrates 130. Therefore, in the present embodiment, the second through hole 151 is additionally formed in the fourth portion 142d to prevent the above-described problems.

It is to be understood that the embodiments described above are merely illustrative of some examples of the technical idea and the scope of the technical idea is not limited to the illustrated embodiments, It will be understood that various changes, substitutions, and alterations may be made therein without departing from the spirit and scope of the invention.

1: Financial equipment 2: Card insertion part
3: display unit 4: deposit and withdrawal unit
5: Telephone for caller 10: Front bezel
100: Encryption pin pad 110: Housing
120: keypad 130: substrate
140: contact module 141: first elastic unit
142: second elastic unit 150: first through hole
151: second through hole 160: conductive sheet

Claims

CLAIMS 1. An encryption pin pad mounted on a financial instrument,
housing;
A substrate provided inside the housing;
A contact module having one side thereof in contact with the substrate and electrically connected to the substrate when the encryption pin pad is mounted on the financial instrument; And
And a control circuit for deleting the previously stored financial information when the substrate and the contact module are electrically short-circuited,
The contact module comprises:
A first elastic unit which is partially pressed by the part of the financial instrument when the encryption pin pad is exposed to the outside of the housing and is mounted on the financial instrument;
A second elastic unit pressed by the first elastic unit; And
And a conductive sheet provided on one side of the substrate side of the second elastic unit and contacting the substrate when the second elastic unit is pressed.

The method according to claim 1,
Wherein the elastic modulus of the first elastic unit is greater than the modulus of elasticity of the second elastic unit.

The method according to claim 1,
Wherein an accommodating portion that is opened upward is formed in the second elastic unit, and the first elastic unit is inserted into the accommodating portion.

The method of claim 3,
Wherein the first elastic unit comprises:
A guide member having an outer circumferential surface in contact with an inner circumferential surface of the accommodating portion;
An elastic member provided in the space of the guide member; And
And a rod which is pressed by said part of said financial instrument and compresses said elastic member while moving along said inner circumferential surface of said guide member.

The method according to claim 1,
The second elastic unit may include:
A first portion which is pressed by the first elastic unit and is in a cylindrical shape;
A second portion connected to the peripheral portion of the lower surface of the first portion and having a larger diameter toward the lower portion;
A third portion having an upper surface connected to a central portion of a lower surface of the first portion, another surface protruding into the second portion, and the conductive sheet connected to the other surface; And
And a fourth portion having a top surface connected to a lower end portion of the second portion, a bottom surface contacting the substrate, and a center portion formed with a first through hole for contacting the substrate and the conductive sheet.

6. The method of claim 5,
Wherein the diameter of the fourth portion is larger than the diameter of the lower end of the second portion.

6. The method of claim 5,
Wherein a diameter of the first through hole is smaller than an outer diameter of a lower end portion of the second portion and a second through hole is formed in the fourth portion so as to communicate with the first through hole and at least a portion not covered by the second portion Encryption pin pad.