KR20160007289A - micro holes forming apparatus and forming method using thereof - Google Patents

micro holes forming apparatus and forming method using thereof Download PDF

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Publication number
KR20160007289A
KR20160007289A KR1020140087780A KR20140087780A KR20160007289A KR 20160007289 A KR20160007289 A KR 20160007289A KR 1020140087780 A KR1020140087780 A KR 1020140087780A KR 20140087780 A KR20140087780 A KR 20140087780A KR 20160007289 A KR20160007289 A KR 20160007289A
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KR
South Korea
Prior art keywords
substrate
thin film
film sheet
sheet
fine
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KR1020140087780A
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Korean (ko)
Inventor
김덕종
김재현
이학주
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한국기계연구원
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Priority to KR1020140087780A priority Critical patent/KR20160007289A/en
Publication of KR20160007289A publication Critical patent/KR20160007289A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)

Abstract

Disclosed herein is a fine hole forming apparatus for forming fine holes using a fluid pressure or a collision of fine particles in a fluid with a large-area two-dimensional nanomaterial, and a method for forming fine holes using the same.
SUMMARY OF THE INVENTION The present invention provides a means for solving the above-mentioned technical problems, which comprises a first substrate made of a porous material and having a plurality of voids formed therein for transmitting fluid, a second substrate disposed in parallel with the first substrate, A second substrate on which a thin film sheet is mounted and which forms a target pore groove having a desired fine pore size on a surface facing the first substrate and a thin film sheet portion mounted on the pore groove of the second substrate, And a pressure supply means for supplying a physical force to the first substrate so as to be pierced by the first substrate, and a method of forming fine holes using the same.

Description

[0001] The present invention relates to a micro hole forming apparatus and a micro hole forming method using the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine hole forming apparatus and a fine hole forming method using the same, and more particularly, to a fine hole forming apparatus using a fine hole And a method of forming fine holes using the same.

As is known, the filter has a large flow resistance, so it has been pointed out that it is important to reduce the consumption of kinetic energy for oilseed permeation. Since the flow resistance is usually proportional to the length of the fluid flow path, minimizing this is advantageous in reducing the flow resistance of the filter.

On the other hand, two-dimensional nanomaterials such as graphene are very thin and have mechanical strength, chemical safety, and fluid impermeability, and if a suitable size through hole is formed therein, it is possible to realize a filter having excellent permeability. Therefore, the development of a process of forming fine holes in the range of nm to um uniformly in a large-sized two-dimensional nanomaterial is an essential requirement for the two-dimensional nanomaterial to enter the filter industry.

However, as far as drilling of 2D nanomaterials is done at the laboratory level, processes that are not suitable for industrial use such as 'Focused Ion Beam' have been utilized.

Korea Patent Publication No. 2010-053213

It is an object of the present invention to provide a fine hole forming apparatus capable of forming a fine hole more easily and quickly on a large-area two-dimensional nanomaterial and a method of forming a fine hole using the same. .

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device including a first substrate made of a porous material and having a plurality of voids formed therein to transmit a fluid, A second substrate on which a target pore groove having a small pore size is formed on a surface facing the first substrate and on which a thin film sheet is mounted; And a pressure supply means for supplying a physical force to the first substrate to be pierced by the physical force.

Further, the pressure supply means may include a hydraulic pressure generating means for supplying hydraulic pressure to the first substrate.

The pressure supply means may include fine particles having a size smaller than the pore of the first substrate and having a charge on the surface thereof and fine particles connected to the first substrate and the second substrate, And an electric field applying unit for applying an electric field to the fine holes.

In addition, the fine particles provide a fine hole forming apparatus having carbon nanotubes or nanowires.

Further, there is provided a fine hole forming apparatus, further comprising transfer means for transferring the first substrate or the second substrate and adjusting the interval between the first substrate and the second substrate.

Further, there is provided a fine hole forming apparatus, further comprising a packing section for sealing the rim of the first substrate and the second substrate.

The pierced hole may be recessed inwardly of the second substrate, or may be formed through the second substrate.

Further, the thin film sheet has a thickness of nm units, and the voids formed on the first substrate have voids of 탆 or more units.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: mounting the thin film sheet between the first substrate and the second substrate; and supplying the hydraulic pressure from the pressure supply means to the first substrate, Wherein the thin film sheet has a portion of the thin sheet seated in the perforated hole through the hydraulic pressure applied through the first substrate is punctured at the mechanical deformation end.

Applying the thin film sheet between the first substrate and the second substrate; and applying an electric field between the first substrate and the second substrate through the electric field application unit, wherein the electrophoresis or dielectrophoresis Wherein the fine particles collide with the thin film sheet, and a part of the thin sheet seated in the perforation groove is punctured by mechanical damage.

According to the present invention as described above, fine holes can be formed more easily and quickly on a large-area two-dimensional nanomaterial.

Furthermore, it is possible to form a fine hole in the two-dimensional nanomaterial, thereby minimizing the length of the flow path of the fluid, thereby making it possible to produce a filter in which the flow resistance of the fluid is remarkably reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a structure of a fine hole forming apparatus according to an embodiment of the present invention;
2 is a view showing a structure of a fine hole forming apparatus according to another embodiment of the present invention,
3 is a view showing a structure of a fine hole forming apparatus according to another embodiment of the present invention,
FIG. 4 is a view showing a process of forming fine holes using the apparatus for forming fine holes shown in FIG. 1;
FIG. 5 is a view showing a process of forming fine holes using the apparatus for forming fine holes shown in FIG. 2. FIG.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine hole forming apparatus and a fine hole forming method using the same, and more particularly, to a fine hole forming apparatus using a fine hole And a method of forming fine holes using the same.

FIG. 1 is a view showing the structure of a fine hole forming apparatus according to an embodiment of the present invention, and FIG. 4 is a view illustrating a process of forming fine holes using the fine hole forming apparatus shown in FIG.

A fine hole forming apparatus according to an embodiment of the present invention includes a first substrate 100 made of a porous material and having a plurality of voids 110 formed therein to allow fluid to pass therethrough, , A second substrate (200) having a perforation groove (210) having a target micro hole size formed on a surface facing the first substrate (100) and on which the thin film sheet (10) A pressure supply means 300 for supplying a physical force to the first substrate 100 such that a part of the thin sheet 10 mounted on the perforation groove 210 of the second substrate 200 is punctured by a physical force ).

The first substrate 100 and the second substrate 200 are arranged in parallel to each other and the thin sheet 10 is sandwiched between the first substrate 100 and the second substrate 200 .

Since the first substrate 100 is made of a fluid permeable material, when a physical force such as hydraulic pressure is supplied to the first substrate 100, the first substrate 100 is fixed between the first substrate 100 and the second substrate 200 A physical pressing force supplied to the first substrate 100 is transmitted to the thin film sheet 10 and the second substrate 200. [ The thin film sheet 10 is mounted on a second substrate 200 which is not mounted on the second substrate 200 or on the second substrate 200, Mechanical deformation or mechanical damage is generated in the thin film sheet 10 not supported on the second substrate 200 by the physical pressing force supplied through the first substrate 100. Finally, The fine holes 20 may be formed.

According to an embodiment of the present invention, the pressure supply means 300 is provided as the hydraulic pressure generation means 310 for supplying the hydraulic pressure to the first substrate 100.

Meanwhile, the method for forming micro-lifetime according to an embodiment of the present invention uses the apparatus for forming micro-holes described above, in which the thin sheet 10 is placed between the first substrate 100 and the second substrate 200 And supplying the hydraulic pressure to the first substrate (100) from the pressure supply means (300). Thereafter, a portion of the thin sheet 10 mounted on the perforated groove 210 through the hydraulic pressure applied through the first substrate 100 is punctured at the mechanical deformation end.

The hydraulic pressure generating means 310 may include a hydraulic pump and a hydraulic hose connecting the first substrate 100 and the hydraulic pump. That is, the hydraulic pressure generated in the hydraulic pump can be supplied to the first substrate 100 through the hydraulic hose. As described above, the first substrate 100 is made of a porous material having a plurality of voids 110 formed therein. When hydraulic pressure is applied to the first substrate 100 through the hydraulic pressure generating means 310, The hydraulic pressure supplied to the first substrate 100 is transmitted to the thin sheet 10 and the second substrate 200 fixed between the first substrate 100 and the second substrate 200. By the hydraulic pressure, The micropores 20 are formed in the shape of the pierced hole 210 at the end of the mechanical deformation.

FIG. 2 is a view showing a structure of a fine hole forming apparatus according to another embodiment of the present invention, and FIG. 5 is a view showing a process of forming fine holes using the fine hole forming apparatus shown in FIG.

According to an embodiment of the present invention, the pressure supply means 310 includes fine particles 322 having a size smaller than the void 110 of the first substrate 100 and having a charge on the surface thereof, And an electric field applying unit 321 connected to the first substrate 100 and the second substrate 200 to apply an electric field between the first substrate 100 and the second substrate 200.

Meanwhile, the micro-lifetime forming method according to another embodiment of the present invention uses the above-described fine hole forming apparatus, and the thin sheet 10 is placed between the first substrate 100 and the second substrate 200 And applying an electric field between the first substrate 100 and the second substrate 200 through the electric field application unit 321. [ Thereafter, as the fine particles 322 collide with the thin film sheet 10 by electrophoresis or dielectrophoresis, a part of the thin sheet 10 held in the perforation groove 210 is punctured by mechanical damage .

According to an embodiment of the present invention, the fine particles 322 may be formed of carbon nanotubes or nanowires, and the surface of the fine particles 322 may have a pointed shape.

When an electric field is applied between the first substrate 100 and the second substrate 200 through the electric field applying unit 321 by applying charges to the surface of the fine particles 322 as described above, The fine particles 322 collide with the thin film sheet 10 by a phenomenon such as deformation or dielectrophoresis. The thin film sheet 10 is mounted on the second substrate 200 which is not mounted on the perforated groove 210 or on which the perforated groove 210 is not formed. Mechanical damage may be caused by repetitive collision of the fine particles 322 in the unsupported thin sheet 10 and thus the fine holes 20 may be formed in the form of the pierced hole 210.

3 is a view showing a structure of a fine hole forming apparatus according to another embodiment of the present invention.

According to an embodiment of the present invention, the first substrate 100 or the second substrate 200 may be transported to transport the transport substrate 400 ).

When the thin film sheet 10 is sandwiched between the first substrate 100 and the second substrate 200 when the conveying means 400 is provided as described above, the first substrate 100 and the second substrate 200 So that the thin sheet 10 can be easily fixed. When the physical pressing force is supplied through the pressure supply means 300, the gap between the first substrate 100 and the second substrate 200 is fixed so as not to expand so that the operation of puncturing the thin sheet 10 is smooth .

According to an embodiment of the present invention, the apparatus further includes a packing unit 500 for sealing the edges of the first substrate 100 and the second substrate 200.

The packing part 500 may be made of an elastic material such as silicone, rubber or the like. The packing part 500 seals the rim of the first substrate 100 and the second substrate 200 so that the hydraulic or fine particles 322 supplied between the first substrate 100 and the second substrate 200 ) Is prevented from escaping to the outside. When the edges of the first substrate 100 and the second substrate 200 are sealed by the packing unit 500 as described above, the hydraulic or fine particles supplied between the first substrate 100 and the second substrate 200, The thin film sheet 10 can be used to mechanically press or damage only the thin film sheet 10 without allowing the thin film sheet 322 to escape to the outside.

According to an embodiment of the present invention, the perforation groove 210 is formed to be recessed inside the second substrate 200 or through the second substrate 200.

For example, the perforation groove 210 is formed on one surface of the second substrate 200 facing the first substrate 100, and is recessed inward. The hydraulic or fine particles 322 supplied between the first substrate 100 and the second substrate 200 are punctured by the thin sheet 10 and the first substrate 100 100). As another example, the perforation groove 210 may be formed by punching the second substrate 200. In the above case, the hydraulic or fine particles 322 supplied between the first substrate 100 and the second substrate 200 to puncture the thin film sheet 10 are discharged through the first substrate 100 100).

According to an embodiment of the present invention, the thin film sheet 10 may be formed of a material having a thickness of nm units such as graphene, and the air gap 110 formed on the first substrate 100 may have a thickness So that the hydraulic pressure and the fine particles 322 supplied from the pressure supply means 300 can be passed through.

According to the present invention as described above, it is possible to more easily and quickly form fine holes in a two-dimensional nanomaterial having a large area, and as the fine holes are formed in the two-dimensional nanomaterial as described above, So that it is possible to manufacture a filter in which the flow resistance of the fluid is remarkably reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention.

Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

10: Thin sheet
20: fine holes
100: first substrate
110: air gap
200: second substrate
210: piercing groove
300: pressure supply means
310: Hydraulic generating means
321:
322: Fine particles
400: conveying means
500: packing part

Claims (10)

An apparatus for forming fine holes in a thin sheet,
A first substrate made of a porous material and having a plurality of voids formed therein for transmitting fluid;
A second substrate disposed in parallel to the first substrate and having a target perforation groove having a target micro hole size formed on a surface facing the first substrate, the thin film sheet being mounted on a surface of the second substrate;
And a pressure supplying means for supplying a physical force to the first substrate such that a part of the thin film sheet placed in the perforation groove of the second substrate is punctured by a physical force. The method according to claim 1,
Wherein the pressure supply means is an oil pressure generating means for supplying oil pressure to the first substrate. The method according to claim 1,
The pressure supply means comprises:
Fine particles having a size smaller than the pore of the first substrate and having a charge on the surface;
And an electric field applying unit connected to the first substrate and the second substrate and applying an electric field between the first substrate and the second substrate. The method of claim 3,
Wherein the fine particles are formed of carbon nanotubes or nanowires. The method according to claim 1,
Further comprising transport means for transporting the first substrate or the second substrate and adjusting an interval between the first substrate and the second substrate. The method according to claim 1,
Further comprising a packing part for sealing an edge of the first substrate and the second substrate. The method according to claim 1,
Wherein the perforation groove is formed to be recessed inside the second substrate or through the second substrate. The method according to claim 1,
Wherein the thin film sheet has a thickness of nm units and the voids formed on the first substrate have voids of not less than 1 mu m. A method for forming fine holes in a thin film sheet using the apparatus according to claim 2,
Mounting the thin film sheet between the first substrate and the second substrate;
Wherein the thin film sheet has a part of the thin sheet seated in the perforation groove through the hydraulic pressure applied through the first substrate to the end of the mechanical deformation Wherein the micropores are perforated. A method for forming fine holes in a thin film sheet using the apparatus according to claim 3,
Mounting the thin film sheet between the first substrate and the second substrate;
And applying an electric field between the first substrate and the second substrate through the electric field application unit, wherein the fine particles collide with the thin film sheet by electrophoresis or dielectrophoresis, Wherein a portion of the sheet is punctured by mechanical damage.
KR1020140087780A 2014-07-11 2014-07-11 micro holes forming apparatus and forming method using thereof KR20160007289A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200642A1 (en) 2016-01-20 2017-07-20 Mando Corporation ELECTRONIC POWER STEERING DEVICE AND METHOD FOR REDUCING TORQUE INCREASE IN A LOW TEMPERATURE SITUATION OF THE ELECTRONIC POWER STEERING DEVICE

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100053213A (en) 2008-11-12 2010-05-20 포항공과대학교 산학협력단 Method for formation of nanoholes using carbothermal reduction

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100053213A (en) 2008-11-12 2010-05-20 포항공과대학교 산학협력단 Method for formation of nanoholes using carbothermal reduction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200642A1 (en) 2016-01-20 2017-07-20 Mando Corporation ELECTRONIC POWER STEERING DEVICE AND METHOD FOR REDUCING TORQUE INCREASE IN A LOW TEMPERATURE SITUATION OF THE ELECTRONIC POWER STEERING DEVICE

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