KR20160005541A - Apparatus for rf antenna and temperature detecting system having the same - Google Patents

Abstract

An embodiment of the present invention relates to a temperature detecting system having a high frequency antenna device. According to an embodiment of the present invention, a temperature detecting apparatus comprises: a ground substrate; an antenna unit having a first conducting wire and a second conducting wire; a first feeder in which one end is connected to the first conducting line, and the other end is connected to the ground substrate; and a second feeder connected to the second conducting wire, arranged to be separated from the first feeder by a first distance, and arranged to be separated from the ground substrate by a second distance.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a high frequency antenna device,

The present invention relates to a high frequency antenna apparatus and a temperature detection system having the same.

Generally, in a high-temperature thermal processing apparatus such as a semiconductor oven, a temperature detecting system for directly measuring temperature from inside is required to precisely control the temperature.

Conventionally, the temperature is detected using a SAW (Surface Acoustic Wave) sensor, which is a non-power source and a wireless sensor applicable to a structure or equipment that is difficult to measure. However, a PCB (Printed Circuit Board ) And coaxial cables could only be used in environments below 160 ℃ due to the nature of the coating and dielectric material.

For this reason, in an extreme environment at a high temperature (over 500 ° C.) such as a high-temperature thermal processing apparatus such as a semiconductor oven, there has been a difficulty in limiting wireless communication using a SAW sensor and an antenna for detecting temperature and the like.

The following Patent Document 1 relates to a coaxial dipole antenna, but does not provide a solution to the above-mentioned problem.

Korean Patent Publication No. 10-2005-0108879

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems of the prior art, and it is an object of the present invention to provide a plasma display apparatus and a plasma display apparatus, which are capable of generating high frequency signals even in a high temperature environment, A high-frequency antenna device is provided.

The first technical aspect of the present invention proposes a high frequency antenna apparatus. The high frequency antenna apparatus includes a ground substrate, an antenna unit having a first conductor and a second conductor, a first feeder line having one end connected to the first conductor and the other end connected to the ground substrate, And a second feed line spaced apart from the first feed line by a first distance and spaced apart from the ground substrate by a second gap.

In one embodiment, the high frequency antenna device may further include a third feeder line having one end connected to the second feeder line and the other end connected to the connection terminal to transmit a high-frequency signal between the second feeder line and the connection terminal The third feeder line may include an inner conductor connected between the second feeder line and the connection terminal, and an outer conductor connected to the grounding substrate and including an inner space for receiving the inner conductor.

A second technical aspect of the present invention proposes a temperature detection system. Wherein the temperature detection system comprises: a temperature sensor for sensing a surrounding temperature and outputting a high frequency signal including temperature information of the surrounding; a high frequency antenna device for receiving a high frequency signal from the temperature sensor; And a control unit for receiving the high-frequency signal through the high-frequency antenna apparatus and detecting temperature information included in the high-frequency signal.

In one embodiment, the high frequency antenna device includes a ground substrate, an antenna portion having a first conductor and a second conductor, a first feeder having one end connected to the first conductor and the other end connected to the ground substrate, A first feeder line connected to the first feeder line and spaced apart from the first feeder line by a first distance, a second feeder line spaced apart from the grounding substrate by a second gap, and a second feeder line connected between the second feeder line and the connection terminal, And a third feed line connected to the conductor and the ground substrate and having an outer conductor including an inner space for receiving the inner conductor.

According to one embodiment of the present invention, wireless communication can be performed even in an extreme environment such as a high temperature by using the principle of the microstrip structure and the principle of the coaxial cable.

In addition, the impedance can be freely adjusted as needed by adjusting the interval between the signal line and the ground.

1 is a block diagram illustrating a temperature detection system according to an embodiment of the present invention.
2 is a view for explaining an embodiment of a high frequency antenna device according to an embodiment of the present invention.
3 is a view for explaining an embodiment of a high frequency antenna apparatus according to another embodiment of the present invention.
4 is a side view for explaining an embodiment of the third feed line of FIG. 3;
FIG. 5 is a perspective view for explaining an embodiment of the third feeder line of FIG. 3. FIG.
6 is a view for explaining a state in which the high frequency antenna device according to the embodiment of the present invention is installed in an oven.
7 is a view for explaining an embodiment of a high frequency antenna device according to another embodiment of the present invention.
8 is a graph for explaining the resonance frequency band of the high frequency antenna device of FIG.
FIG. 9 is a graph of the high frequency antenna device of FIG. 3 measured by a network analyzer.
10 is a Smith chart measuring the high frequency antenna device of FIG. 3 with a network analyzer.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

In the drawings referred to in the present invention, elements having substantially the same configuration and function will be denoted by the same reference numerals, and the shapes and sizes of the elements and the like in the drawings may be exaggerated for clarity.

1 is a block diagram illustrating a temperature detection system according to an embodiment of the present invention.

Referring to FIG. 1, a temperature detection system 1 according to an embodiment of the present invention includes a temperature sensor 10, a high frequency antenna apparatus 20, and a control unit 30.

The temperature sensor 10 senses the ambient temperature and can output a high frequency signal according to the ambient temperature. Here, the temperature sensor 10 may be a surface acoustic wave sensor. A surface acoustic wave (SAW) sensor is a non-power sensor using a piezoelectric substrate and is widely used in structures or equipment that is difficult to access or difficult to measure. When the temperature sensor 10 receives the drive signal from the controller 30 through the high frequency antenna device 20, it can sense the ambient temperature and output the corresponding high frequency signal. In one embodiment, the surface acoustic wave sensor may sense pressure, torque, vibration, gas or mass in addition to the ambient temperature and output a corresponding high frequency signal.

The high frequency antenna device 20 receives the driving signal from the control unit 30 and transmits the driving signal to the temperature sensor 10 and the high frequency signal from the temperature sensor 10 to the control unit 30. Here, the temperature sensor 10 and the high frequency antenna device 20 may be installed inside an object for detecting temperature, and the object may be a high temperature device such as a semiconductor cure oven.

The high frequency antenna device 20 will be described in more detail below with reference to Figs. 2 to 6. Fig.

The control unit 30 transmits a driving signal to the temperature sensor 10 through the high frequency antenna apparatus 20 and receives a high frequency signal from the temperature sensor 10 and calculates a temperature value corresponding to the high frequency signal . Here, the control unit 30 may be connected to the high frequency antenna apparatus 20 through a wired line such as a coaxial cable.

2 is a view for explaining an embodiment of a high frequency antenna device according to an embodiment of the present invention.

2, a high frequency antenna device 20 according to an embodiment of the present invention includes a ground substrate 100, an antenna unit 200, a first feeder line 300, and a second feeder line 400.

The ground substrate 100 may be connected to one surface of the first feeder line 300 and may be spaced apart from the second feeder line 400 by a second distance d2. In one embodiment, when the high frequency antenna apparatus 20 is installed inside a high-temperature oven apparatus, the ground substrate 100 may be formed of stainless steel (SUS).

The antenna unit 200 may include a first wire 210 and a second wire 220. The first lead wire 210 may be connected to one end of the first feeder line 300 and the second lead wire 220 may be connected to one end of the second feeder line 400. The first lead wire 210 and the second lead wire 220 may be installed in different longitudinal directions on the same extension line.

The sum of the lengths of the first conductor 210 and the second conductor 220 may be a length of a half wavelength of a driving signal and a high frequency signal transmitted / received to / from the temperature sensor 10. For example, when the high frequency antenna device 20 transmits and receives a signal of 1 GHz with the temperature sensor 10, since the wavelength in air of 1 GHz is 30 cm, the first conductor 210 and the second conductor 210 of the antenna unit 200, The sum of the lengths of the first and second wires 210 and 220 may be about 15 cm and the sum of the lengths of the first and second wires 210 and 220 may be about 90 cm when transmitting / 35 cm.

In one embodiment, the first lead 210 and the second lead 220 may be formed of a copper-free Cu wire to enable use in a high temperature environment.

One end of the first feeder line 300 may be connected to the first wire 210 and the other end thereof may be connected to the ground substrate 100 to serve as a grounding bar.

Here, the first feeder line 300 and the ground substrate 100 may be connected in various forms necessary for implementation, and are not limited to the connection structure shown in FIG.

The second feeder line 400 is connected to the second lead 220 and may be spaced apart from the first feeder line 300 by a first distance d1 and may be spaced apart from the grounding substrate 100 by a second distance d2 Can be spaced apart. Although not shown in FIG. 2, the second feeder line 400 may be connected to the controller 30 to transmit the high-frequency signal received through the antenna unit 200 to the controller 30, And can transmit a driving signal to the antenna unit 200.

The first feed line 300 and the second feed line 400 may be horizontally spaced apart from each other by a first distance d1 and the first lead 210 and the second lead 220 may be disposed horizontally with respect to the first feed line 300 and the second feeder line 400 at different positions corresponding to each other.

In one embodiment, the first feeder line 300 may be formed of stainless steel (SUS) to be used in a high temperature environment, and the second feeder line 400 may be formed of a brass material.

The first feeder line 300 and the second feeder line 400 are spaced apart from each other by a first distance d1 so that a first space a is formed between the first feeder line 300 and the second feeder line 400 The first space a can be understood as an air dielectric layer.

That is, the first feeder line 300 serving as a grounding bar, the first space a as an air dielectric layer, and the second feeder line 400 transmitting signals can form a microstrip line structure.

The second feeder line 400 may be spaced apart from the ground substrate 100 by a second distance d2 and may include an air dielectric layer between the second feeder line 400 and the ground substrate 100, Structure can be formed.

Generally, a PCB (Printed Circuit Board) having a microstrip structure for transmitting signals is connected to a high frequency antenna. However, it can be used only at 150 ° C or less due to the characteristics of the material of the cover or dielectric used for the PCB. Therefore, it can not be used in an environment at a higher temperature (for example, 500 DEG C).

However, according to an embodiment of the present invention, a microstrip structure is formed using a feed line formed of a heat-resistant material, a ground, and an air dielectric layer, so that the signal can be transmitted even in an extreme environment of 500 ° C or higher.

FIG. 3 is a view for explaining an embodiment of a high frequency antenna device according to another embodiment of the present invention, FIG. 4 is a side view for explaining an embodiment of the third feeder line of FIG. 3, 3 is a perspective view for explaining an embodiment of the third feeder line of FIG. 3, and FIG. 6 is a view for explaining a state in which the high frequency antenna device according to the embodiment of the present invention is installed in an oven.

3, a high frequency antenna device 20 according to another embodiment of the present invention includes a ground substrate 100, an antenna unit 200, a first feeder line 300, a second feeder line 400, And may include a feeder line 500. In one embodiment, the high frequency antenna apparatus 20 may further include a first gap adjusting unit 700 or a second gap adjusting unit 800, as shown in FIG.

3 to 6, the ground substrate 100, the antenna unit 200, and the first feeder line 300 are the same as those of the above-described embodiment in this embodiment.

The second feeder 400 may have one end connected to the second lead 220 and the other end connected to the third feeder 500. Here, the second power feeder 400 may extend from the ground substrate 100 while maintaining a second gap d2, and may be connected to the third power feeder 500. [

3, the second feeding part 400 may be formed in a 'C' shape so as to maintain the second gap d2 between the grounding substrate 100 and the third feeding part 400, And may be connected to the power feeder 500.

However, the shape of the second power feeder 400 is not limited to such a shape, and can be easily changed by a person skilled in the art.

The third feeder 500 may be connected to the second feeder line 400 at one end and to the connection unit 600 at the other end for connection to the controller 30. In one embodiment, the third feeder 500 may be connected to the control unit 30 using a coaxial cable. In this case, the connection unit 600 may be a connector to which the coaxial cable is connected.

4 to 5, the third feeder 500 may include an internal conductor 510 connected between the second feeder line 400 and the connection unit 600 to transmit a signal, May include an outer conductor 520 connected to the inner conductor 100 and including an inner space b for receiving the inner conductor.

One end of the inner conductor 510 may be connected to the second feeder line 400. The grounding substrate 100 may have a hole to allow the inner conductor 510 to be connected to the second feeder line 400. [

The other end of the inner conductor 510 may be connected to the connection unit 600 to be connected to the control unit 30. Here, the inner conductor 510 may be formed of a brass material.

The outer conductor 520 may be connected to the ground substrate 100 and may have an inner space capable of accommodating the inner conductor 510. The outer conductor 520 may be formed in a tubular shape and the inner conductor 510 is disposed at the center of the outer conductor 520 and spaced apart from the inner circumferential surface of the outer conductor 520 by a certain distance, A second space b may be formed between the conductors 520. [

Here, the second space b between the inner conductor 510 and the outer conductor 520 can be understood as an air dielectric layer.

Accordingly, the third feeder line 500 can form a coaxial cable structure including the inner conductor 510, the outer conductor 520, and the second space b, which is an air dielectric layer formed therebetween .

Here, the outer conductor 520 may be formed of stainless steel (SUS), and the inner conductor 510 may be formed of a brass material.

Thus, the high-frequency antenna apparatus 20 according to the present embodiment is formed of a heat-resistant material and forms a coaxial cable structure including the air dielectric layer, so that a high-frequency signal can be transmitted to the controller 30 or the temperature sensor 10 ). ≪ / RTI >

Here, the impedance of the third feeder 500 can be determined by the following equation (1).

Where Z is the impedance of the third feeder line,? Is the dielectric constant of the air dielectric layer, D is the diameter of the outer conductor, d is the diameter of the inner conductor,

The third feeder line 500 may further include a gap retainer 530 inserted between the inner circumferential surface of the outer conductor 520 and the inner conductor 510 to maintain a constant gap therebetween, As shown in FIG.

In one embodiment, the high frequency antenna device 20 may be installed inside a high temperature equipment such as the oven 40, as in FIG.

In this case, the ground substrate 100 of the high frequency antenna device 20 can be attached to a wall surface 42 inside the housing of the oven 40. At this time, the wall surface 42 can be attached to the housing 40 of the oven 40, A tubular hole 44 through which the third feeder line 500 is passed may be formed in order to be connected to the control unit 30 located outside.

In this case, the tubular hole 44 can serve as the outer conductor 520 of the third feeder 500. That is, the third feeder line 500 may be formed only of the inner conductor 510 except for the outer conductor 520.

Here, the diameter of the tubular hole 44 can be determined according to the above-mentioned equation (1) according to the target impedance, the diameter of the inner conductor, and the dielectric constant of the air dielectric layer.

7 is a view for explaining an embodiment of a high frequency antenna device according to another embodiment of the present invention.

7, a high frequency antenna device 20 according to another embodiment of the present invention includes a ground substrate 100, an antenna unit 200, a first feeder line 300, a second feeder line 400, And may include a feeder line 500, a first gap adjusting unit 700, and a second gap adjusting unit 800.

The first gap adjusting part 700 may adjust the first gap d1 between the first feeder line 300 and the second feeder line 400. The first gap adjusting unit 700 may further include a micro gauge 710 for finely adjusting an interval between the first feed line 300 and the second feed line 400.

The second gap adjusting part 800 may be attached to the ground substrate 100 and the second feeder line 400 to adjust the second gap d2.

Here, the first interval d1 and the second interval d2 may be the same, and the first interval d1 to the second interval d2 may be determined by the following equation (2).

, W: 제2 급전선의 넓이, t: d1 또는 d2, Z: 제2 급전선의 임피던스)
(here,

, W: width of the second feeder line, t: d1 or d2, and Z: impedance of the second feeder line)

FIG. 8 is a graph for explaining the resonance frequency band of the high-frequency antenna apparatus of FIG. 3, FIG. 9 is a graph of the high-frequency antenna apparatus of FIG. 3 measured by a network analyzer, As shown in FIG.

For example, when the impedance Z of the second feeder line 400 is 50 Ω and the width W of the second feeder line 400 is 4.1 mm, the first interval d1 and the second interval d2 ) Is 0.83 mm. When the impedance of the third feeder 500 is Z = 50 Ω and the diameter W of the inner conductor of the third feeder 500 is 4.1 mm, the diameter of the outer conductor according to Equation 1 is 9.5 mm do.

The graphs of FIGS. 8 to 9 and the Smith chart of FIG. 10 are for explaining frequency bands and characteristics of the antenna apparatus according to the above example.

8 shows the return loss and dBs (1, 1) according to the frequency of the high-frequency antenna apparatus 20 according to the above example. From this, the high-frequency antenna apparatus 20 according to the above- It can be seen that selecting a point 3 dB away from the maximum gain can operate in a wide band between 150 and 770 MHz. 9 to 10, it can be seen that the center frequency of the high frequency antenna device according to the above example is 436 Mhz, and the characteristic impedance at this time is matched with the third feeder line 500 having 50? .

In the high frequency antenna apparatus according to the above-described embodiment, the antenna substrate having the air layer as a dielectric is composed of only metal and ceramic material, and can be installed in a higher temperature (~ 1000 ° C) environment. This high temperature antenna can be used for real time wireless communication such as SAW (Surface Acoustic Wave) pressure, strain, torque, temperature, vibration, gas and mass sensor which can monitor the extreme environment, And the like.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the particular forms disclosed. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: Temperature detection system
10: Temperature sensor
20: High frequency antenna device
30:
40: Oven
100: ground substrate
200:
210: first conductor
220: 2nd conductor
300: first feeder line
400: second feeder line
500: 3rd feeder line
510: internal conductor
520: outer conductor
600: connection
700: first interval adjusting section
800: second interval adjusting section

Claims (17)

Ground substrate;
An antenna unit having a first conductor and a second conductor;
A first feed line having one end connected to the first lead and the other end connected to the ground substrate; And
A second feeder connected to the second lead, spaced apart from the first feeder by a first distance, and spaced apart from the ground substrate by a second distance;
Frequency antenna device.
The method according to claim 1,
A third feeder line having one end connected to the second feeder line and the other end connected to the connection terminal to transmit a high frequency signal between the second feeder line and the connection terminal; Frequency antenna device.
The plasma display apparatus according to claim 2,
An inner conductor connected between the second feeder line and the connection terminal; And
An outer conductor connected to the ground substrate and including an inner space for receiving the inner conductor;
Frequency antenna.
The method according to claim 1,
Wherein the first interval and the second interval are the same.
The method according to claim 1,
Wherein the first interval or the second interval is determined by the following equation (2).

&Quot; (2) "

(here,

, W: width of the second feeder line, t: first interval or second interval, and Z: impedance of the second feeder line)
The method according to claim 1,
And a first gap adjusting unit adjusting the first gap.
The method according to claim 1,
And a second gap adjusting unit adjusting the second gap.
The light emitting device according to claim 1,
A high frequency antenna device formed of stainless steel (SUS).
The plasma display apparatus according to claim 2, wherein the second feeder line and the third feeder line
A high frequency antenna device formed of brass.
Ground substrate;
An antenna unit having a first conductor and a second conductor;
A first feed line having one end connected to the first lead and the other end connected to the ground substrate; And
A second feed line connected to the first lead, spaced apart from the first feed line by a first distance, and spaced apart from the ground substrate by a second distance;
A third feeder having an inner conductor connected between the second feeder line and the connection terminal, and an outer conductor connected to the ground substrate and including an inner space for accommodating the inner conductor; Frequency antenna device.
11. The method of claim 10,
And a first gap adjusting unit adjusting the first gap.
11. The method of claim 10,
And a second gap adjusting unit adjusting the second gap.
A temperature sensor for sensing a surrounding temperature and outputting a high frequency signal including the temperature information of the surrounding;
A high frequency antenna device for receiving a high frequency signal from the temperature sensor; And
A control unit that transmits a driving signal to the temperature sensor through the high frequency antenna device, receives the high frequency signal through the high frequency antenna device, and detects temperature information included in the high frequency signal; Gt;
14. The method of claim 13,
Wherein the temperature sensor is a surface acoustic wave sensor.
14. The high-frequency antenna apparatus according to claim 13,
Ground substrate;
An antenna unit having a first conductor and a second conductor;
A first feed line having one end connected to the first lead and the other end connected to the ground substrate;
A second feed line connected to the first lead, spaced apart from the first feed line by a first distance, and spaced apart from the ground substrate by a second distance; And
A third feeder having an inner conductor connected between the second feeder line and a connection terminal connected to the control unit, and an outer conductor connected to the ground substrate and including an inner space for accommodating the inner conductor; Gt;
16. The high-frequency antenna apparatus according to claim 15,
And a first gap adjusting unit adjusting the first gap.
16. The high-frequency antenna apparatus according to claim 15,
And a second gap adjusting unit adjusting the second gap.

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