KR20150141075A - Solid electrolytic capacitor containing a multi-layered adhesion coating - Google Patents

Abstract

The present invention provides a solid electrolytic capacitor which comprises: an anode body; a dielectric substance located on and/or in the anode body; an adhesion coating placed on the dielectric substance; and a solid electrolyte placed on the adhesion coating including the dielectric substance and a conductive polymer. The adhesion coating is multi-layered and used by combining nano-projections of a plurality of discrete manganese oxides such as discrete manganese with a resin layer.

Description

SOLID ELECTROLYTIC CAPACITOR CONTAINING A MULTI-LAYERED ADHESION COATING < RTI ID = 0.0 >

The present invention is a priority application to U.S. Provisional Application No. 61 / 822,514 filed on May 13, 2013.

Solid electrolytic capacitors (eg, tantalum capacitors) have made a major contribution to the miniaturization of electronic circuits and made it possible to apply the circuitry in extreme environments. Conventional solid electrolytic capacitors can be formed by pressing a metal powder (e.g., tantalum) around a metal conductor, sintering the pressed portion, anodizing the sintered anode, and then applying a solid electrolyte. Polymers that are inherently conductive are often used as solid electrolytes because of their advantages, low equivalent series resistance (" ESR ") and " non-combustion / non-ignition " failure modes. Such an electrolyte can be formed through polymerization reaction in situ of a monomer in the presence of a catalyst and a dopant. Alternatively, the prepared conductive polymer slurry may also be used. Regardless of how it is formed, one of the problems with conducting polymer electrolytes is that it is difficult to penetrate and uniformly coat the pores of the anode. This not only reduces the point of contact between the electrolyte and the dielectric, but also allows the polymer to smoothly peel off from the dielectric during mounting or use. As a result of these problems, it is often difficult to obtain very low ESR and / or leakage current values in conventional conductive polymer capacitors.

Thus, there is a need for an improved electrolytic capacitor comprising a conductive polymer solid electrolyte.

BRIEF DESCRIPTION OF THE DRAWINGS The complete and enabling description of the invention, which is intended for a person of ordinary skill in the art, including the best mode of the invention, is described in more detail in the remainder of the specification with reference to the accompanying drawings.
Figure 1 is a schematic illustration of one embodiment of a capacitor that may be formed in accordance with one embodiment of the present invention.
Repeated use of the same symbols in the present specification and drawings is used for the purpose of indicating the same or similar features or elements in the present invention.

According to one embodiment of the present invention, there is provided a solid electrolytic capacitor comprising an anode body, a dielectric overlying the anode body, an adhesive coating overlying the dielectric, and a solid electrolyte overlying the dielectric and the adhesive coating. The adhesive coating comprises a discontinuous precoat layer and a resin layer, wherein the discontinuous precoat layer comprises a plurality of discrete manganese oxide nanoprojections. The solid electrolyte comprises a conductive polymer layer.

According to another embodiment of the present invention, a method of forming a solid electrolytic capacitor is provided. The method includes contacting an anode comprising an anode body and a dielectric with a multilayer adhesive coating, wherein the solution is applied to the anode comprising a manganese precursor precursor and forming a plurality of discrete manganese oxide nano projections Forming a discontinuous precoat layer by thermally decomposing the precursor; and forming a resin layer by applying a solution to the anode including the natural or synthetic resin.

Other features and aspects of the present invention will be described in more detail below.

It will be understood by those skilled in the art that the content herein is for the purpose of describing the embodiments only and is not intended to limit the scope of the invention.

Generally, the present invention relates to a solid electrolytic capacitor comprising an anode body, a dielectric disposed on and / or within the anode body, an adhesive coating overlying the dielectric, and a solid electrolyte overlying the adhesive coating comprising the dielectric and conductive polymer . In particular, the adhesive coating is a multi-layered, nano-projection of a plurality of discrete manganese oxide (e.g., manganese dioxide) and a resin layer are used in combination. The inventors of the present invention have found through this unique arrangement that the adhesive coating can significantly improve the electrical performance of the resulting capacitor. For example, but not limited to, the discrete nanoprojections may be easily penetrated into the small pores of the anode body because of their small size, which is not possible with conventional conductive polymers. Nano projections, when deposited on a dielectric, can be embedded in the conductive polymer layer as it is formed, which improves the adhesion between the dielectric and the conductive polymer layer. In addition, the resin layer contains a relatively stable material at high temperatures, so that the resin layer serves as a mechanism to anchor and stabilize both the nanoprojections and the conductive polymer layer when using the capacitor in a variety of different conditions can do. Thus, the combination of pre-coating and resin layers provides a unique and effective multilayer adhesive coating to reduce the possibility of delamination of the conductive polymer layer, which can ultimately improve capacitance while minimizing leakage current and ESR.

Various embodiments of the present invention will now be described in more detail.

I. Anode

The anode may be formed from a powder having a specific electric charge of about 2,000 microfarads * volts ("μF * V / g") to about 350,000 μF * V / g per gram. As is known, the capacitance is multiplied by the used anodizing voltage used for vision, and the result is divided by the weight of the anodized electrode body. In certain embodiments, the powder has a high specific charge of greater than about 70,000 μF * V / g, in some embodiments greater than about 80,000 μF * V / g, and in some embodiments greater than about 90,000 μF * V / In certain embodiments from about 10,000 to about 30,000 μF * V / g, and in some embodiments from about 120,000 to about 250,000 μF * V / g. The inventors of the present invention have nevertheless discovered that the conductive polymer can easily penetrate into the pores of the anode using the multilayer adhesive coating of the present invention, although non-conductive high powders have a generally dense packing structure. Of course, the powder may be present in an amount of about 70,000 μF * V / g or less, in some embodiments about 60,000 μF * V / g or more, in some embodiments about 50,000 μF * About 40,000 μF * V / g, and in some embodiments about 5,000 to about 35,000 μF * V / g.

The powder may comprise individual particles and / or agglomerates of such particles. The compound for forming the powder may include valve metal-based compounds such as valve metals (e.g., oxidizable metals) or tantalum, niobium, aluminum, hafnium, alloys thereof, oxides thereof, have. For example, the valve metal composition may have an atomic ratio of niobium to oxygen of 1: 1.0 ± 1.0, in some embodiments 1: 1.0 ± 0.3, in some embodiments 1: 1.0 ± 0.1, and in some embodiments 1: 1.0 ± 0.05 < / RTI > of electrically conductive niobium oxide. For example, the niobium oxide can be _{0 .7} NbO, NbO _{1 .0, 1 .1} NbO and NbO _2. Examples of such valve metal oxides are disclosed in Schnitter U.S. Patent Publication No. 2005/0019581; Schnitter et al. , U. S. Patent Publication No. 2005/0103638; US Patent Publication No. 2005/0013765 to Thomas et al. , As well as US Patent No. 6,322,912 to Fife ; Fife et al. , U.S. Patent No. 6,416,730; US Patent No. 6,527,937 to Fife ; Kimmel et al. , U.S. Patent No. 6,576,099; Fife et al. , U.S. Patent No. 6,592,740; Kimmel et al. , U.S. Patent No. 6,639,787; And Kimmel et al. , U. S. Patent No. 7,220, 397.

The apparent density of the powder (or Scott (Scott) density), but can vary as needed, generally cubic about 1 to about 8 grams (g / cm ^3), in some embodiments from about 2 to about 7 per cm g / cm ^3, some embodiments may be from about 3 to about ^3. 6 g / cm. In order to achieve the desired level of packing and bulk density, the size and shape of the particles (or chunks) can be carefully controlled. For example, the shape of the particles may be generally spherical or nodular. The average size of the particles may be from about 0.1 to about 20 micrometers, in some embodiments from about 0.5 to about 15 micrometers, and in some embodiments from about 1 to about 10 micrometers.

The powder may be formed by a known technique. For example, a precursor tantalum powder may be prepared by dissolving a tantalum salt (e.g., potassium fluorotantalate (K ₂ TaF ₇ ), sodium fluorotantalate (Na ₂ TaF ₇ ), tantalum pentachloride (TaCl ₅ ) , Sodium, potassium, magnesium, calcium, etc.). These powders may be subjected to one or more heat treatment steps at a temperature of from about 700 ° C to about 1400 ° C, in some embodiments from about 750 ° C to about 1200 ° C, and in some embodiments from about 800 ° C to about 1100 ° C, Can be assembled in a way. The heat treatment may occur in an inert or reducing atmosphere. For example, heat treatment can occur in an atmosphere that partially sinters the powder and contains hydrogen or hydrogen-releasing compounds (e.g., ammonium chloride, calcium hydride, magnesium hydride, etc.) to reduce impurities (e.g., fluorine content). If necessary, agglomeration may be performed in the presence of a getter material such as magnesium, etc. After the heat treatment, the highly reactive rough lumps can be passivated by progressive air ingress. Technologies include Rao 's U.S. Patent No. 6,576,038, Wolf et al , 6,238,456, Pathare et al. , 5,954,856, Rerat , 5,082,491, Getz , 4,555,268, Albrecht et al. , 4,483,819, Getz et al. , 4,441,927, and Bates et al. , 4,017,302, and the like.

The desired size and / or shape of the particles is achievable by controlling various known process parameters such as parameters related to powder formation (e.g., reduction process) and / or agglomeration (e.g., temperature, A milling technique to achieve a desired size of the precursor powder may also be used. Any of a variety of milling techniques may be used to achieve desirable particle properties. For example, the powder may be initially dispersed in a fluid medium (e.g., ethanol, methanol, fluorinated liquid, etc.) to form a slurry. The slurry can then be combined with a grinding media (e.g., a metal ball such as tantalum) in a mill. The number of milling media may generally vary depending on the size of the mill, from about 100 to about 2000, in some embodiments from about 600 to about 1000. The starting powder, fluid medium and grinding media can be combined in any ratio. For example, the ratio of the starting powder to the milling media may be from about 1: 5 to about 1: 50. Likewise, the ratio of the volume of the fluid medium to the volume of the starting powder may be from about 0.5: 1 to about 2: 1, and in some embodiments from about 0.5: 1 to about 1: 1. Examples of mills that can be used in the present invention are described in U.S. Patent Nos. 5,522,558; 5,232,169; 6,126,097; And 6,145,765. Milling can occur for a predetermined amount of time required to achieve the target size. For example, the milling time may be from about 30 minutes to about 40 hours, in some embodiments from about 1 hour to about 20 hours, in some embodiments from about 5 hours to about 15 hours. The milling may be carried out at any desired temperature, including room temperature or elevated temperature. After milling, the fluid medium may be separated or removed from the powder by air drying, heating, filtration, evaporation, and the like.

Various other conventional processing methods can be used in the present invention to improve the properties of the powder. For example, in certain embodiments, the particles may be treated with sinter retardants in the presence of a dopant such as an aqueous acid (e.g., phosphoric acid). The amount of dopant added is dependent in part on the surface area of the powder, but is generally less than about 200 million parts per million (ppm). The dopant may be added before, during, and / or after the heat treatment step (s).

The particles may also be subjected to one or more deoxidation treatments to enhance ductility and reduce leakage current in the anode. For example, the particles may be exposed to getter materials such as those described in U.S. Patent No. 4,960,471. The amount of the getter material may be present in a weight ratio of from about 2% to about 6%. The temperature at which the deoxidation occurs can vary, but can generally range from about 700 ° C to about 1600 ° C, in some embodiments from about 750 ° C to about 1200 ° C, and in some embodiments from about 800 ° C to about 1000 ° C have. The total time of the deacidification treatment (s) may range from about 20 minutes to about 3 hours. Deoxidation also preferably occurs in an inert atmosphere (e.g., argon). After the deoxidation treatment (s), magnesium and other getter materials generally evaporate and form precipitates on the cold walls of the furnace. However, to assure removal of the getter material, the fine aggregates and / or coarse aggregates may undergo one or more acid leaching steps together with nitric acid, hydrofluoric acid, and the like.

To facilitate the composition of the anode, certain components may be additionally included in the powder. For example, optionally, the binder and / or lubricant may be mixed into the powder to allow the particles to adhere sufficiently to one another when pressed to form the anode body. Suitable binders include, for example, poly (vinyl butyral); Poly (vinyl acetate); Poly (vinyl alcohol); Poly (vinylpyrrolidone); Cellulosic polymers such as carboxymethylcellulose, methylcellulose, ethylcellulose, hydroxyethylcellulose, and methylhydroxyethylcellulose; Atactic (hybrid) polypropylene, polyethylene; Polyethylene glycols such as Carbo waxes from Dow Chemical; Polystyrene, poly (butadiene / styrene); Polyamides, polyimides, and polyacrylamides, high molecular weight polyethers; Copolymers of ethylene oxide and propylene oxide; Fluoropolymers such as polytetrafluoroethylene, polyvinylidene fluoride, and fluoro-olefin copolymers; Sodium polyacrylate, poly (lower alkyl acrylate), poly (lower alkyl methacrylate); low alkyl acrylates and methacrylate copolymers; And fatty acids such as stearic acid and other soap fatty acids, vegetable waxes, micro waxes (refined paraffin), and waxes. The binder may be dissolved and dispersed in a solvent. The solvent according to an embodiment may include water, alcohol, and the like. When utilized, the proportion of binder and / or lubricant may range from about 0.1% to about 8% per weight of total mass. However, it should be understood that binders and / or lubricants are not necessarily required in the present invention.

The resulting powder may be compressed to form a pellet using any conventional powder pressurizing device. For example, a press mold may be used which is a single station compression press including a die and one or more punches. Alternatively, an anvil type compression press mold using only a die and a single low punch may be used. Single station compression press molds can be used as single acting, double acting, floating die, movable platen, opposed ram, screw, impact, hot pressing, May be provided in several basic types such as cam, toggle / knuckle and eccentric / crank press with various functions such as coining or sizing, . The powder may be compressed around the anode lead (e.g., tantalum wire). Alternatively, it should be understood that the anode lead may be attached (e.g., welded) to the anode body after pressing and / or sintering of the anode body.

After compression, any binder / lubricant can be removed by heating the pellet at a certain temperature (e.g., from about 150 캜 to about 500 캜) for several minutes. Alternatively, the binder / lubricant may be removed by contacting the pellet with an aqueous solution as described in U.S. Patent No. 6,197,252 to Bishop et al . The pellets are then sintered to form a porous, integral mass. For example, according to one embodiment, the pellets may be sintered in a vacuum or inert atmosphere at a temperature of from about 1200 ° C to about 2000 ° C, in some embodiments from about 1500 ° C to about 1800 ° C. After sintering, the pellets shrink due to the growth of bonds between the particles. The pressed density of the pellets after sintering may vary but is generally from about 2.0 to about 7.0 grams per cubic centimeter, in some embodiments from about 2.5 to about 6.5 grams, and in some embodiments from about 3.0 to about 7.0 grams per cubic centimeter 6.0 grams. Press density is determined by dividing the amount of material by the capacity of the pressurized pellet.

The anode may also have a relatively low carbon and oxygen content. For example, the carbon content of the anode can be less than or equal to 50 ppm, and in some embodiments less than or equal to 10 ppm. Likewise, the oxygen content of the anode can be less than or equal to 0.15 ppm / μC / g, and in some embodiments less than or equal to 1.10 ppm / μC / g. The oxygen content can be measured by a LECO Oxygen Analyzer and the oxygen content includes bulk oxygen in the tantalum particles and natural oxygen on the tantalum surface. The bulk oxygen content is controlled by the crystal lattice period of the tantalum, which increases linearly with increasing oxygen content in the tantalum until the solubility limit is reached. This method is described in Pozdeev-Freeman et al., &Quot; Critical Oxygen Content In Porous Anodes of Solid Tantalum Capacitors in Solid Tantalum Capacitors ", published in Journal of Materials Science: Materials In Electronics (1998) 309-311 In the manner described, X-ray diffraction analysis (XRDA) was used to measure the tantalum crystal lattice period. Oxygen in the sintered tantalum can be confined to thin natural surface oxides, while the bulk of the tantalum is substantially free of oxygen.

The thickness of the anode may be selected to enhance the electrical performance of the capacitor, but is not required. For example, the thickness of the anode can be less than about 4 millimeters, in some embodiments from about 0.05 to about 2 millimeters, and in some embodiments from about 0.1 to about 1 millimeter. The shape of the anode can also be selected to improve the electrical properties of the resulting capacitor. For example, the shape of the anode may be curved, sinusoidal, rectangular, U-shaped, V-shaped, and the like. The anode also includes one or more furrows, grooves, depressions, or indentations to increase the surface area for capacitance, thereby minimizing ESR and extending the frequency response of the capacitance Quot; fluted " form. ≪ / RTI > Such an " vertically grooved " anode is described in US Patent Application Publication No. 2005/0270725 to Hahn et al ., As well as in Webber et al. , U.S. Patent Nos. 6,191,936; Maeda et al. , 5,949, 639; And 3,345,545 to Bourgault et al .

II . dielectric

The anode is also coated with a dielectric. The dielectric can be formed by oxidizing (" anodizing ") the sintered anode dynamically so that a dielectric layer is formed on and / or within the anode. For example, the tantalum (Ta) anode may be anodized to form tantalum pentoxide (Ta ₂ O ₅ ). In general, the anodizing treatment is performed by initially applying a solution to the anode such that the anode is supported in the electrolyte. And a solvent such as water (deionized water) is generally used. To improve the ionic conductivity, compounds capable of forming ions separated from the solvent may be used. Examples of such compounds include the acids described below with respect to the electrolytes. For example, the acid (e.g., phosphoric acid) may be present in an amount of from about 0.01 wt.% To about 5 wt.%, In some embodiments from about 0.05 wt.% To about 0.8 wt.%, And in some embodiments, from about 0.1 wt. % To about 0.5 wt.%.

An electric current flows in the anodizing treatment solution so as to form the dielectric layer. The value of the forming voltage controls the thickness of the dielectric layer. For example, the power supply may be initially set in the galvanostatic mode until the required voltage is reached. Then, the power supply can be switched to the constant current mode so that a desired dielectric thickness is formed on the entire surface of the anode. Of course, other known methods such as pulse or constant-potential step method and the like can also be used. The voltage at which anodization occurs may generally range from about 4 to about 250 V, in some embodiments from about 9 to about 200 V, and in some embodiments from about 20 to about 150V. Upon oxidation, the anodizing solution may be maintained at an elevated temperature of about 30 ° C or higher, in some embodiments about 40 ° C to about 200 ° C, and in some embodiments about 50 ° C to about 100 ° C. Anodic oxidation may occur below ambient temperature. The resulting dielectric layer can be formed on the surface of the anode and in its pores.

If desired, each step of the anodization may be repeated in one or more cycles to achieve the desired dielectric thickness. In addition, the electrolyte may be removed by rinsing or rinsing the anode with another solvent (e.g., water) after the first and / or second step.

III . Adhesive coating

As discussed above, the adhesive coating of the capacitor is a multilayer, comprising a discontinuous precoat layer and a resin layer that may be present in an essentially continuous or discontinuous state. The specific arrangement of these layers may vary as needed. According to one embodiment, for example, a pre-coating may be initially formed on the dielectric, and then the resin layer may be applied to the zoned dielectric. In these embodiments, the precoat layer is over a dielectric and the resin layer is over the precoat layer and may contact the precoat layer and / or the dielectric. Despite the presence of a resin layer, it is believed that the coated nanoprojections of the precoat layer can still be embedded in the conductive polymer layer. In yet another embodiment, the resin layer may be applied to the dielectric in the beginning, and then the free layer may be formed thereon. In these embodiments, the resin layer is over the dielectric and the precoat layer is over the resin layer. The various embodiments of these layers will be described in more detail below.

A. Precoat layer

The precoat layer includes a plurality of discrete manganese oxide nanoprojections (e.g., manganese dioxide) that can penetrate into the small pores of the anode body and eventually be embedded in the conductive polymer layer. Because the precoat layer is formed as discrete nano-projections rather than a continuous layer, the conductive polymer can also be in direct contact with a significant portion of the dielectric, either directly or through another layer. A relatively large direct contact between the conductive polymer and the dielectric can further reduce the ESR. To obtain the desired results without adversely affecting the overall performance of the capacitor, the average size (e.g., diameter) of the nano projections is such that the adhesion is improved but not so large that it can not penetrate into the pores of the anode. In this regard, nano-projections generally have an average size of from about 5 nanometers to about 500 nanometers, in some embodiments from about 6 nanometers to about 250 nanometers, and in some embodiments from about 8 nanometers to about 8 nanometers 150 nanometers, and in some embodiments from about 10 nanometers to about 110 nanometers. The term " average diameter " may, for example, indicate an average value (maximum diameter) for the major axis of the nanoprojections as viewed from above. Such a diameter is achievable using known techniques such as photon correlation spectroscopy, dynamic light scattering, quasi-elastic light scattering, and the like. A variety of particle size analyzers can be used to measure the diameter in this manner. An example is the Corouan VASCO 3 particle size analyzer. Nanoprojections may also have a narrow particle size distribution, in which case the properties of the capacitor may be further improved, but are not limited thereto. For example, nanoprojections greater than about 50%, in some embodiments greater than about 70%, and in some embodiments greater than about 90%, may have an average size within the ranges described above. The number of nanoprojections having a particular size can be determined using the techniques described above, where the percent volume can be correlated to the number of particles having a specific absorbance unit (" au ").

In addition to the size of the nano-projections, the surface coverage of the nano-projections on the dielectric can be selectively controlled to help achieve the desired electrical performance. In other words, if the surface coverage is too low, the ability of the conductive polymer layer to better adhere to the dielectric can be limited, whereas if the coverage is too large, the ESR of the capacitor may be adversely affected. In this regard, the surface roughness of nanoprojections generally ranges from about 0.1% to about 40%, in some embodiments from about 0.5% to about 30%, and in some embodiments from about 1% to about 20%. The degree of surface coverage can be calculated in various ways, for example by dividing the "actual capacitance" value by the "normal capacitance" value and multiplying by 100. The "actual capacitance" is determined by penetrating the anode into the conductive polymer solution after forming the nanoprojections, while the "actual capacitance" forms the nanoprojections, penetrates the anode with the conductive polymer solution, After washing the polymer solution, the anode is dried and dehumidified and then determined.

Various types of techniques may be used to form the precoat layer of the present invention. As is well known, manganese oxide (e.g., manganese dioxide) is generally prepared by pyrolytic decomposition of precursors such as those described in Sturmer et al. , U.S. Patent No. 4,945,452 (e.g., manganese nitrate (Mn (No ₃ ) ₂ )). ≪ / RTI > For example, the dielectric-coated anode body may be heated to contact the solution comprising the precursor (e.g., dipping, dipping, spraying, etc.) and then deforming into an oxide. If desired, a plurality of application steps may be used. The time for the anode body to contact the manganese oxide precursor solution can vary as needed. For example, the anode body may be dipped into the above-described solution for a time of about 10 seconds to about 10 minutes.

The manganese oxide precursor solution may optionally contain a surfactant. Such a surfactant is known to improve the penetration of solution into the anode body by reducing the surface tension, but is not limited thereto. Particularly suitable nonionic surfactants include polyglycol ethers such as polyoxyethylene alkyl ethers, nonylphenoxy poly- (ethyleneoxy) ethanol (e.g., Igepal CO-630); (E.g., Triton X-100), benzyl ether octylphenol-ethylene oxide condensate (e.g., Triton CF-10), 3,6-dimethyl-4-octyne-3,6-diol (Eg, Surfynol 82). It is generally preferred that the concentration of the surfactant is controlled to within a certain range in order to achieve a desirable improvement in the penetration power of the manganese oxide precursor without adversely affecting other properties of the capacitor. For example, the solution in which the anode body is supported may contain from about 0.01 wt.% To about 30 wt.%, In some embodiments from about 0.05 wt.% To about 25 wt.%, And in some embodiments from about 0.1 wt.% To about 20 wt. Lt; RTI ID = 0.0 > surfactant. ≪ / RTI > Likewise, the precursor (s) (e.g., manganese nitrate) may be present in an amount from about 1 wt% to about 55 wt%, in some embodiments from about 2 wt% to about 15 wt%, and in some embodiments from about 5 wt% 10 wt%. Carriers such as water can also be used in the solution. For example, the aqueous solution of the present invention may comprise from about 30 wt% to about 95 wt%, in some embodiments from about 40 wt% to about 99 wt%, and in some embodiments from about 50 wt% to 95 wt% . The actual amount of constituents in the solution may vary depending on such factors as the particle size and distribution of particles in the anode, the temperature at which decomposition occurs, the identity of the dispersant, and the identity of the carrier.

If desired, the anode body may be in contact with a humidified atmosphere at a pretreatment step that occurs prior to contact with the manganese oxide precursor solution. The inventors of the present invention believe, but are not limited to, that the presence of a certain amount of water vapor can retard the thermal decomposition reaction of manganese dioxide to form dispersed nanoprojections. For example, in the pre-treatment step, the anode body is about 1 to 30 grams per cubic meters of air, some embodiments, from about 4 to about 25g / m ^3, In addition, in some embodiments the atmosphere having a humidity of about 5 to about 20g / m ³ Lt; / RTI > Likewise, the relative humidity may range from about 30% to about 90%, in some embodiments from about 40% to about 85%, and in some embodiments from about 50% to about 80%. The temperature of the humidifying atmosphere may range from about 10 째 C to about 50 째 C, in some embodiments from about 15 째 C to about 45 째 C, and in some embodiments from about 20 째 C to about 40 째 C. In addition to the pretreatment step, the anode body may also be in contact with the humidifying atmosphere in the intermediate treatment step that occurs after contact with the manganese oxide precursor solution. The humidifying atmosphere in the intermediate treatment step may have the same or different conditions as the humidifying atmosphere of the pre-treatment step, but generally has the above-mentioned range.

Regardless, once contact with the precursor solution for a desired amount of time, the portion is heated to a temperature sufficient to thermally decompose the precursor (e.g., manganese nitrate) into an oxide. The heating may occur in the furnace at a temperature of, for example, from about 150 ° C to about 300 ° C, in some embodiments from about 180 ° C to about 290 ° C, and in some embodiments from about 190 ° C to about 260 ° C. The heating may be carried out in a humid or dry atmosphere. In certain embodiments, for example, heating in a humidifying atmosphere may be performed, which is the same as or different from the atmospheres used in the pretreatment and intermediate processing steps described above, and does not substantially depart from the above-described conditions. The time required for the conversion depends on the furnace temperature, the heat transfer rate and the atmosphere, but is generally about 3 to 5 minutes. After pyrolysis conversion, the leakage current can often be high, due to damage experienced by the dielectric film during manganese dioxide deposition. To reduce this leakage, the capacitors can be improved by an anodization bath according to known techniques. For example, the capacitor can be immersed in the electrolyte as described above before allowing the DC current to flow.

B, the resin layer

The resin layer may generally comprise a natural or synthetic resin which is a solid or naturally polymeric, semi-solid material that can be polymerized, cured or cured. It is preferable that the resin naturally has a relatively insulative property. As used herein, " relatively insulative " generally means that it is more resistant than a conductive polymer that primarily forms a conductive polymer layer. For example, according to some embodiments, a relatively resin having an insulating property is at 20 ℃, about 1000Ω-cm or more, in some embodiments, from about 10,000 Ω-cm or more, in some embodiments, about 1 × 10 ⁵ Ω-cm or more, and In some embodiments, it may have a resistivity of at least about 1 x ¹⁰ < ¹⁰ > ohm-cm. Examples of suitable resins that may be used include, but are not limited to, polyurethanes, polystyrenes, unsaturated or saturated fatty acid esters (e.g., glycerides), and the like. For example, suitable fatty acid esters include, but are not limited to, lauric acid esters, myristic acid, palmitic acid, stearic acid, eleostearic acid, oleic acid, linoleic acid, linolenic acid, allureitic acid, These fatty acid esters have been found to be particularly useful when forming a " drying oil " using relatively complex combinations, which allows the resulting film to polymerize rapidly into a stable layer. Such drying oils may include mono-, di-, and / or tri-glycerides with one, two, and three esterified fatty acyl residues in the glycerol backbone. For example, suitable drying oils that may be used include, but are not limited to, olive oil, linseed oil, castor oil, tung oil, soybean oil, and shellac. Especially suitable are shellac, which is considered to include esters of various aliphatic and alicyclic hydroxy acids (such as allylic acid and shell acid). The above resin materials and other resin materials are described in detail in US Patent No. 6,674,635 to Fife et al .

When used, the fatty acid esters described above may be naturally occurring or purified from natural sources. For example, soybean oil is obtained from soybeans through purification by solvent extraction with petroleum hydrocarbons or by screw press operations. After extraction, the obtained soybean oil is primarily composed of triglycerides of oleic acid, linoleic acid, and linolenic acid. On the other hand, tung oil is often dry oil that does not require such purification. In some cases, it may be desirable to further esterify the fatty acid mixture by reacting with an alcohol. These fatty acid / alcohol ester derivatives can generally be obtained using any alcohol capable of reacting with fatty acids. For example, in some embodiments, less than 8 carbon atoms of a hydroxyl and / or polyhydric alcohol, and in some embodiments less than 5 carbon atoms, hydroxyl and / or polyhydric alcohols may be used in the present invention. Specific embodiments of the present invention include the use of methanol, ethanol, butanol as well as various glycols such as propylene glycol, hexylene glycol and the like. According to one particular embodiment, the shellac may be esterified by mixing the shellac with an alcohol as described above. Specifically, shellac is a resinous excrement of insects that is considered to contain a somewhat esterified fatty acid mixture complex. Thus, when mixed with alcohol, the fatty acid groups of the shellac are more esterified through reaction with the alcohol.

The resin layer may be formed by various other methods. For example, according to one embodiment, the anode may be supported in a solution of the desired resin (s). Such a solution can be formed by dissolving a selected protective resin in a solvent such as water or a non-aqueous solvent. Some suitable non-aqueous solvents include, but are not limited to, various glycols such as propylene glycol, hexylene glycol, di (ethylene acetate) glycol and the like, as well as methanol, ethanol, butanol. Particularly preferred non-aqueous solvents are those having a boiling point in excess of about 80 占 폚, in some embodiments having a boiling point of about 120 占 폚, and in some embodiments, greater than about 150 占 폚. As described above, the formation of a solution using a non-aqueous solvent results in the fatty acids being more esterified when such resin materials are utilized. The anode can be supported on the solution more than once according to the desired thickness. For example, in some embodiments, a plurality of resin layers of 2 to 10 layers may be used, and in some embodiments, 3 to 7 layers may be used. Each layer may have a target thickness of, for example, less than or equal to about 100 nanometers, and in some embodiments less than or equal to about 30 nanometers, and in some embodiments less than or equal to about 10 nanometers. In addition to dipping, conventional coating methods such as sputtering, screen printing, electrophoretic coating, electron beam deposition, vacuum deposition, spraying, etc. can also be used You will have to understand.

After the resin layer formation, the anode portion can be heated or cured. The heating may facilitate evaporation of any solvent used in the application and may assist in the esterification and / or polymerization of the resin materials. In order to facilitate the esterification and / or polymerization reaction, a curing agent may also be added to the resin layer. For example, there may be sulfuric acid as a hardener that can be used with shellac. The time and temperature at which heating takes place generally depends on the particular resin material utilized. Generally, each layer is heated at a temperature of from about 30 DEG C to about 300 DEG C, in some embodiments from about 50 DEG C to about 150 DEG C, for a time of from about 1 minute to about 60 minutes, in some embodiments from about 15 minutes to about 30 minutes Lt; / RTI > It should also be understood that it is not necessary to utilize heating after application of each resin layer.

IV . Solid electrolyte

As discussed above, solid electrolytes include nano-projections and dielectric and a conductive polymer layer that overlies and bonds directly or through the resin layer. Conductive polymers are generally? -Linked and have electrical conductivity after oxidation or reduction, such as an electrical conductivity of at least about 1 μS / cm after oxidation or reduction. Such π-bonded conductive polymers include, for example, polyheterocycles (eg, polypyrrole, polythiophene, polyaniline, etc.), polyacetylene, poly-p-phenylene and polyphenolate. According to one embodiment, for example, the polymer is a substituted polythiophene, generally having the structure:

Wherein T is O or S;

D is an optionally substituted C ₁ to C ₅ alkylene group (e.g., methylene, ethylene, n-propylene, n-butylene, n-pentylene, etc.);

R7 is a linear or branched, optionally substituted C ₁ to C ₁₈ alkyl group such as methyl, ethyl, n- or iso-propyl, n-, iso-, sec- or tert- Methylbutyl, 1-ethylpropyl, 1,1-dimethylpropyl, 1,2-dimethylpropyl, 2,2-dimethylpropyl, n-hexyl, n- Octyl, 2-ethylhexyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-hexadecyl, n-octadecyl and the like;

Optionally substituted C ₅ to C ₁₂ cycloalkyl group substituted with (e.g., such as cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, bicyclo-nonyl, bicyclo-decyl); An optionally substituted C ₅ to C ₁₄ aryl group (e.g., phenyl, naphthyl, etc.); An optionally substituted C ₇ to C ₁₈ aralkyl group such as benzyl, o-, m-, p-tolyl, 2,3-, 2,4-, 2,5-, 2-6, 3-4-, Xylyl, mesityl, etc.); An optionally substituted C ₁ to C ₄ hydroxyalkyl group, or a hydroxyl group;

q is an integer from 0 to 8, in some embodiments from 0 to 2, and in one embodiment 0;

n is from 2 to 5,000, in some embodiments from 4 to 2,000, and in one embodiment from 5 to 1,000. Examples of the substituent of the group "D" or "R _7" is for example, alkyl, cycloalkyl, aryl, aralkyl, alkoxy, halogen, ether, thioether, disulfide, sulfoxide, sulfone, sulfonate, amino, aldehyde, keto , Carboxylic acid esters, carboxylic acids, carbonates, carboxylates, cyano, alkylsilanes and alkoxysilane groups, carboxylamide groups and the like.

Particularly suitable thiophene polymers include those in which " D " is an optionally substituted C ₂ To C ₃ alkylene group, there are thiophene polymer. For example, the polymer is generally an optionally substituted poly (3,4-ethylenedioxythiophene) having the structure:

The method of forming the conductive polymer as described above is a known technique. For example, US Patent No. 6,987,663 to Merker et al . Discloses various methods of forming substituted polythiophenes in monomer precursors. The monomer precursor may, for example, have the following structure:

Here, T, D, R ₇ , and q are as described above. Particularly suitable thiophene monomers include thiophene monomers wherein " D " is an optionally substituted C ₂ to C ₃ alkylene group. For example, an optionally substituted 3,4-alkylenedioxythiophene may be used which has the following structure:

Here, R7 and q are as described above. According to one particular embodiment, " q " is zero. A commercially suitable example of 3,4-ethylenedioxythiophene is Heraeus Precious Metals GmbH ≪ / RTI > Other suitable monomers are also described in U.S. Patent No. 5,111,327 to Blohm et al . And U.S. Patent No. 6,635,729 to Groenendaal et al . Derivatives of such monomers, such as dimers or trimer of the above monomers, may also be used. Derivatives of the higher polymers, i.e., tetramers, pentamers, etc. of the above monomers are suitable for use in the present invention. Derivatives may be composed of the same or different monomer units, and may be used in pure form or in combination with other monomers. Oxidized forms or reduced forms of these precursors may also be used.

The conductive polymer may be formed in situ or may be over-polymerized and then applied to the anode body in the form of a dispersant. In order to form the in-situ polymerized layer, the monomer may optionally be chemically polymerized with the presence of an oxidation catalyst. The oxidation catalyst generally contains transition metal cations such as iron (III), copper (II), chromium (VI), cerium (IV), manganese (IV), manganese (VII), or ruthenium . A dopant may also be used to provide extra charge to the conductive polymer and to stabilize the conductivity of the polymer. The dopant generally comprises an inorganic or organic anion, such as an ion of a sulfonic acid. In certain embodiments, the oxidation catalyst has both a catalyst and a doping function in that it includes a cation (e.g., a transition metal) and an anion (e.g., a sulfonic acid). For example, the oxidation catalyst is iron (III) halides: such as (for example, FeCl ₃₎ and iron (III) a transition metal salt containing the cation, or Fe (ClO _{4) 3} or Fe ₂ (SO _{4) 3,} such Iron (III) salts of inorganic acids, and iron (III) salts of inorganic acids including organic acids and organic acids. Examples of iron (III) salts of inorganic acids containing inorganic groups include iron (III) salts of sulfonic acid monoesters of C ₁ to C ₂₀ alkanols, such as iron (III) salts of lauryl sulfate, . Likewise, examples of iron (III) salts of organic acids include, for example, iron (III) salts of C ₁ to C ₂₀ alkanesulfonic acids such as methane, ethane, propane, butane or dodecane sulfonic acid; Iron (III) salts of aliphatic perfluorosulfonic acids such as trifluoromethanesulfonic acid, perfluorobutanesulfonic acid, or perfluorooctanesulfonic acid; Iron (III) salts of aliphatic C ₁ to C ₂₀ carboxylic acids such as 2-ethylhexylcarboxylic acid; Iron (III) salts of aliphatic perfluorocarboxylic acids such as trifluoroacetic acid or perfluorooctanoic acid; An iron (III) salt of an aromaticsulfonic acid optionally substituted by C ₁ to C ₂₀ alkyl groups such as benzenesulfonic acid, o-toluenesulfonic acid, p-toluenesulfonic acid, or dodecylbenzenesulfonic acid; Iron (III) salts of cycloalkanesulfonic acids such as camphorsulfonic acid, and the like. Mixtures of the abovementioned iron (III) salts may also be used. Iron (II) -p-toluenesulfonate, iron (III) -o-toluenesulfonate, and mixtures thereof are particularly suitable. An example of a commercially suitable iron (III) -p-toluenesulfonate is Heraeus Precious Metals GmbH ≪ / RTI >

The oxidation catalyst and the monomer may be applied sequentially or together to initiate the polymerization reaction. Suitable techniques for applying these components include screen printing, dipping, electrophoreti coating, and spraying. As an example, the monomer may be initially mixed with the oxidation catalyst to form a precursor solution. The thus formed mixture may be applied to the anode portion and then polymerized to form a conductive coating on the surface. Alternatively, the oxidation catalyst and the monomer may be sequentially applied. According to one embodiment, for example, the oxidation catalyst may be applied as a dipping solution after being dissolved in an organic solvent (e.g., butanol). The anode portion may then be dried to remove the solution. The part can then be carried on a solution containing the monomer. In any event, depending on the oxidant used and the desired reaction time, the polymerization reaction is generally carried out at a temperature of from about -10 ° C to about 250 ° C, in some embodiments from about 0 ° C to about 200 ° C. Suitable polymerization techniques as described above may be described in more detail in US Patent No. 7,515,396 to Biler . Other addition for applying such conductive coating (s), methods may be described in U.S. Patent No. 5,729,428, and Kudoh of U.S. Patent No. 5,812,367 the outer of U.S. Patent No. 5,457,862, U.S. Pat. No. of outer Sakata 5,473,503, Sakata et Sakata have.

V. Other layers

If desired, the capacitor may also include other layers known in the art. For example, the portion may be coated with a carbon layer (e.g., graphite) and a silver layer, respectively. The silver coating may function as a solderable conductor, a contact layer and / or a charge collector for the capacitor, for example, and the carbon coating may limit contact of the silver coating with the solid electrolyte. Such a coating may cover some or all of the solid electrolyte.

VI . End terminations )

The capacitors may include terminations, particularly when applying a surface mount. For example, the capacitor may include a cathode end to which the anode lead of the capacitor element is electrically connected and a cathode end to which the cathode of the capacitor element is electrically connected. Any conductive material, such as a conductive metal (e.g., copper, nickel, silver, nickel, zinc, tin, palladium, lead, copper, aluminum, molybdenum, titanium, iron, zirconium, magnesium, Can be used. Particularly suitable conductive metals may include, for example, copper, copper alloys (e.g., copper-zirconium, copper-magnesium, copper-zinc, or copper-iron), nickel, and nickel alloys such as nickel-zinc. The thickness of the distal end is generally chosen to minimize the thickness of the capacitor. For example, the thickness of the distal end may range from about 0.05 to 1 millimeter, in some embodiments from about 0.05 to about 0.5 millimeters, and from about 0.07 to about 0.2 millimeters. An example of a conductive material is a copper-zinc alloy sheet available from Wieland (Germany). If desired, the surface of the distal end can be electroplated with nickel, silver, gold, tin, etc., in a known manner, so that the final portion is mountable to the circuit board. According to one particular embodiment, both surfaces of the distal end are plated with nickel and silver flash, respectively, and the mounting surface may also be plated with a tin solder layer.

1 illustrates an embodiment of an electrolytic capacitor 30 that includes an anode end 62 and a cathode end 72 that are electrically coupled to a capacitor element 33. The anode end 62 is a cathode terminal. The capacitor element 33 has an upper surface 37, a lower surface 39, a front surface 36 and a rear surface 38. The cathode end 72 is in electrical contact with any surface of the capacitor element 33 but in the illustrated embodiment is in electrical contact with the bottom surface 39 and the back surface 38. More specifically, the cathode end 72 includes a first component 73 disposed substantially perpendicular to the second component 74. The first component 73 is in electrical contact with and generally parallel to the bottom surface 39 of the capacitor element 33. The second component 74 is in electrical contact with the rear face 38 of the capacitor element 33 and is disposed generally parallel. Although shown as an integral part, the parts may be provided separately rather than integrally, and may be directly connected to each other or may be connected through additional conductive elements (e.g., metal). Also, according to certain embodiments, the second component 74 may be removed from the cathode tip portion 72. Likewise, the anode terminal 62 may comprise a first component 63 disposed substantially perpendicular to the second component 64. The first component 63 is in electrical contact with the lower surface 39 of the capacitor element 33 and is disposed generally parallel. The second component 64 includes a carrying area 51 carrying the anode lead 16. According to the illustrated embodiment, the region 51 has " U-shape " to further improve surface contact and mechanical stability of the lead 16. [

The ends can be connected to the capacitor element using any known technique. According to one embodiment, a lead frame may be provided that defines, for example, the cathode end portion 72 and the anode end portion 62. To attach the electrolytic capacitor element 33 to the lead frame, a conductive adhesive may be initially applied to the surface of the cathode terminal portion 72. The conductive adhesive may comprise, for example, conductive metal particles comprising the resin composition. The metal particles can be silver, copper, gold, platinum, nickel, zinc, bismuth, and the like. The resin composition may include a thermoplastic resin (e.g., an epoxy resin), a curing agent (e.g., an acid anhydride), and a coupling agent (e.g., a silane coupling agent). Suitable conductive adhesives may be described in U.S. Patent Publication No. 2006/0038304 to Osako et al . Any of a variety of techniques may be used to apply the conductive adhesive to the cathode end 72. For example, printing technology can be used because of its practicality and cost savings.

Various methods can generally be used to attach the ends to the capacitor. According to one embodiment, for example, the second component 64 of the anode end 62 and the second component 74 of the cathode end 72 initially bend upwardly to the position shown in FIG. The capacitor element 33 is then disposed on the cathode end portion 72 such that the lower surface 39 thereof contacts the adhesive and the anode lead 16 is received in the upper U-shaped region 51. An insulating material (not shown), such as a plastic pad or tape, may be attached to the bottom surface 39 of the capacitor element 33 and the first component 63 of the anode terminal 62 to electrically disconnect the anode and cathode ends As shown in FIG.

The anode lead 16 is then electrically connected to the region 51 using any known technique such as mechanical welding, laser welding, conductive adhesive, and the like. For example, the anode lead 16 may be welded to the anode end 62 using a laser. Lasers typically include a laser medium capable of emitting photons by induced emission and a resonator comprising an energy source that stimulates the elements of the laser medium. One suitable type of laser consists of aluminum and yttrium garnet (YAG) doped with neodymium (Nd). The stimulation particles are neodymium ions Nd ^{3 +.} The energy source may be discharged to provide continuous energy to the laser medium to emit a continuous laser beam or to emit a pulsed laser beam. After the anode lead 16 is electrically connected to the anode terminal 62, the conductive adhesive can be cured. For example, heat and pressure may be applied using a hot press to cause the electrolytic capacitor element 33 to properly adhere to the cathode end 72 by an adhesive.

Once the capacitor element is attached, the lead frame may be sealed inside the resin casing and then filled with silica or other known encapsulating material. The width and length of the case may vary depending on the intended application. Suitable casings include, for example, "A", "B", "C", "D", "E", "F", "G", "H" , "N", "P", "R", "S", "T", "V", "W", "Y", "X" . Regardless of the case size used, the capacitor element is encapsulated such that at least a portion of the anode and cathode ends are exposed for mounting to the circuit board. 1, for example, the capacitor element 33 is encapsulated in the case 28 such that a portion of the anode terminal portion 62 and a portion of the cathode terminal portion 72 are exposed.

The resulting capacitors can exhibit good electrical properties, regardless of the method used to form them. An equivalent series resistance (" ESR ") is measured at a frequency of 100 kHz, in the absence of harmonics, at a voltage of 2.2 volts DC and a 0.5 volts peak to peak sinusoidal signal, such as less than about 300 milliohms , In some embodiments less than about 200 milliohms, and in some embodiments from about 1 to about 100 milliohms. Also, the leakage current, generally referred to as the current flowing from one conductor to another adjacent conductor through an insulator, can be maintained at a relatively low level. For example, the leakage current may be less than about 40 μA, in some embodiments less than about 25 μA, and in some embodiments less than 15 μA. Likewise, the numerical value of the normalized leakage current of the capacitor may be less than or equal to about 0.2 [mu] A / F * V, in some embodiments 0.1 [mu] A / F * V, Microampere, and μF * V is the result of capacitance and rated voltage. ESR and normalized leakage current values can be maintained at relatively high temperatures. For example, the values may be maintained after reflow (e.g., for 10 seconds) at a temperature of from about 100 ° C to about 350 ° C, and in some embodiments from about 200 ° C to about 300 ° C have.

The invention will be better understood with reference to the following examples.

Experimental Procedure

Equivalent series resistance ESR )

The equivalent series resistance can be measured using a Kelvin Leads 2.2 volt DC bias and a 0.5 volt peak to peak sinusoidal signal and a Keithley 3330 Precision LCZ meter. The operating frequency may be 100 kHz and the temperature may be 23 ° C ± 2 ° C.

Capacitance Capacitance )

The capacitance can be measured using a Kelvin Leads 2.2 volt DC bias and a 0.5 volt peak-to-peak sinusoidal signal and a Keithley 3330 Precision LCZ meter. The operating frequency may be 120 Hz and the temperature may be 23 ° C ± 2 ° C.

Leakage current:

The leakage current (" DCL ") can be measured using a leakage test set measuring leakage current at about 25 ° C and 60 seconds at the rated voltage (eg, 4V).

Example 1

200,000 μFV / g tantalum powder was used to form the anode sample. Each anode was pressed to a density of the sample is embedded with tantalum wire, and sintered at 1250 ℃, 5.8g / cm ^3. The resulting pellets had a size of 0.76 x 1.22 x 0.67 mm. The pellets were anodized to 10.4 V in a 0.1 wt.% Nitric acid electrolyte for 10 hours to form a dielectric layer. To form the precoat layer, the anode portion was placed in a humidified atmosphere (30 ° C., 8 g / m ³ of humidity) for 30 minutes followed by a manganese nitrate (specific gravity of 1.09) and 1 wt.% Polyalkylether surfactant Lt; / RTI > solution. The part was placed in another humidifying atmosphere (30 캜, 8 g / m ³ of humidity) for 120 minutes and then heat-treated at 250 캜 in an atmosphere having a relative humidity of 80%. The resulting idealized manganese nano-projections had an average size of about 10 nanometers and a surface coverage of about 10%.

Reformation was performed at 8.4 V in a 0.1 wt.% Acetic acid electrolyte for 20 minutes. The anode portion was then loaded in a solution containing 0.8 wt.% Shellac and ethanol for 30 seconds and then heat treated at 125 占 폚 for 30 minutes. In order to form the conductive polymer layer, the anode portion was formed by mixing a part of a 3,4-ethylenedithiophene monomer, 6.4 parts (50 wt.% Iron p-toluenesulfonate) of an oxidizing agent, 6 parts of ethanol, And 1 part of water for 30 seconds. The monomers were polymerized at 20 DEG C for 60 minutes in an atmosphere containing 80% relative humidity and then washed in a solution containing water, butanol, and p-toluenesulfonate (2 wt.%). The reformation was carried out at 8.4 V for 30 minutes in an electrolyte containing 0.01 wt.% Phosphoric acid. Then, the anode portion was supported for 30 seconds in a solution containing an oxidizing agent (55 wt.% Iron p-toluenesulfonate) and then dried at 85 캜 for 5 minutes, and 3,4-ethylenedithiophene monomer , And then polymerized at 20 DEG C for 5 to 60 minutes in an atmosphere having a relative humidity of 80%. The portion was washed with a solution containing water, butanol, and p-toluenesulfonate (2 wt.%). The part was then carried on a graphite dispersion, dried, loaded on a silver dispersion and then dried.

After the test, it was determined that the capacitance was 45.5 μF, the ESR was 91 mΩ, and the leakage current was 14.6 μA. (The normalized leakage current was 0.051 μA / μF * V for a rated voltage of 6.3 V).

Example 2

150,000 μFV / g tantalum powder was used to form the anode sample.

Each anode was pressed to a density of the sample is embedded with tantalum wire, and sintered at 1300 ℃, 5.8g / cm ^3. The resulting pellets had a size of 1.01 x 1.52 x 0.57 mm. The pellets were anodized to 10.4 V in a 0.1 wt.% Nitric acid electrolyte for 10 hours to form a dielectric layer. To form the precoat layer, the anode portion was placed in a humidified atmosphere (30 ° C., 8 g / m ³ of humidity) for 30 minutes followed by a manganese nitrate (specific gravity of 1.09) and 1 wt.% Polyalkylether surfactant Lt; / RTI > solution. The part was placed in another humidifying atmosphere (30 캜, 8 g / m ³ of humidity) for 120 minutes and then heat-treated at 250 캜 in an atmosphere having a relative humidity of 80%. The resulting idealized manganese nano-projections had an average size of about 11 nanometers and a surface coverage of about 10%. Reformation was performed at 8.4 V in a 0.1 wt.% Acetic acid electrolyte for 20 minutes. The anode portion was then loaded in a solution containing 0.8 wt.% Shellac and ethanol for 30 seconds and then heat treated at 125 占 폚 for 30 minutes. The remaining portions of the capacitor including the conductive polymer layer were formed as described in Example 1.

After the experiment, it was determined that the capacitance was 46.6 μF, the ESR was 71 mΩ, and the leakage current was 12.1 μA (the normalized leakage current was 0.041 μA / μF * V for a rated voltage of 6.3 V).

Example 3

100,000 μFV / g tantalum powder was used to form the anode sample. Each anode sample was embedded with tantalum wire, sintered at 1325 DEG C, and pressed at a density of 6.0 g / cm < ³ >. The resulting pellets had a size of 0.70 x 1.08 x 0.57 mm. The pellets were anodized to 19.4 V in a 0.1 wt.% Nitric acid electrolyte for 8 hours to form a dielectric layer. To form the precoat layer, the anode portion was placed in a humidified atmosphere (30 ° C., 8 g / m ³ of humidity) for 30 minutes followed by a manganese nitrate (specific gravity of 1.09) and 1 wt.% Polyalkylether surfactant Lt; / RTI > solution. The part was placed in another humidifying atmosphere (30 캜, 8 g / m ³ of humidity) for 120 minutes and then heat-treated at 250 캜 in an atmosphere having a relative humidity of 80%. The resulting manganese dioxide nano-projections had an average size of about 11 nanometers and a surface coverage of about 10%. Reformation was performed at 17.4 V in 1 wt.% Acetic acid electrolyte for 20 minutes. The anode portion was then loaded in a solution containing 0.8 wt.% Shellac and ethanol for 30 seconds and then heat treated at 125 占 폚 for 30 minutes. The remaining portions of the capacitor including the conductive polymer layer were formed as described in Example 1.

After the experiment, it was determined that the capacitance was 9.8 μF, the ESR was 132 mΩ, and the leakage current was 0.3 μA (the normalized leakage current was 0.003 μA / μF * V for a rated voltage of 10 V).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims (42)

As solid electrolytic capacitors,
An anode body;
A dielectric overlying the anode body;
An adhesive coating overlying the dielectric; And
And a solid electrolyte overlying the dielectric and the adhesive coating,
Wherein the adhesive coating comprises a discontinuous precoat layer and a resin layer, the discontinuous coating layer comprising a plurality of discrete manganese oxide nanoprojections.
The method according to claim 1,
Wherein the anode body comprises tantalum and the dielectric comprises tantalum pentoxide.
3. The method according to claim 1 or 2,
The nano-projections may have a thickness of about 5 nanometers to about 500 nanometers, preferably about 6 nanometers to about 250 nanometers, more preferably about 8 nanometers to about 150 nanometers, even more preferably about 10 nanometers ≪ / RTI > to about 110 nanometers.
4. The method according to any one of claims 1 to 3,
Wherein at least about 50%, preferably at least about 70%, more preferably at least about 90% of the nano-projections have an average size of from about 10 nanometers to about 110 nanometers.
5. The method according to any one of claims 1 to 4,
Wherein the surface coverage of the nano-projections is from about 0.1% to about 40%, preferably from about 0.5% to about 30%, more preferably from about 1% to about 20%.
6. The method according to any one of claims 1 to 5,
Wherein the manganese oxide is manganese dioxide.
7. The method according to any one of claims 1 to 6,
Wherein the precoat layer overlies the dielectric and the resin layer overlies the precoat layer.
7. The method according to any one of claims 1 to 6,
Wherein the resin layer overlies the dielectric and the precoat layer overlies the resin layer.
9. The method according to any one of claims 1 to 8,
Wherein the resin layer comprises a natural or synthetic resin.
10. The method of claim 9,
The resin is relatively insulative.
10. The method of claim 9,
Wherein the resin is a polymer.
10. The method of claim 9,
Wherein the resin is formed from polyurethane, polystyrene, esters of unsaturated or saturated fatty acids, or combinations thereof.
10. The method of claim 9,
Wherein the resin is formed from a shellac.
14. The method according to any one of claims 1 to 13,
Wherein the conductive polymer layer comprises a chemically polymerized conductive polymer.
15. The method of claim 14,
Wherein the conductive polymer is a substituted polythiophene.
16. The method of claim 15,
Wherein said substituted polythiophene is poly (3,4-ethylenedioxythiophene).
17. The method according to any one of claims 1 to 16,
Wherein the carbon layer and / or the silver layer is deposited on the solid electrolyte.
18. The method according to any one of claims 1 to 17,
Further comprising an anode termination electrically connected to the anode and a cathode end electrically connected to the solid capacitor.
19. The method according to any one of claims 1 to 18,
Wherein the capacitor exhibits an ESR of less than or equal to about 300 milliohms, preferably less than or equal to about 200 milliohms, and more preferably less than or equal to about 1 milliohm, determined at a frequency of 100 kHz.
20. The method according to any one of claims 1 to 19,
Wherein the capacitor exhibits a normalized leakage current of less than about 0.2 [mu] A / [mu] F * V, preferably less than or equal to about 0.1 [mu] A / .
As a solid electrolytic capacitor forming method,
Forming a discontinuous precoat layer by applying a solution to the anode comprising a manganese oxide precursor and pyrolyzing to form a plurality of discrete manganese oxide nano-projections; And
A method of forming a solid electrolytic capacitor, comprising: adhering an anode comprising an anode body and a dielectric to a multilayer adhesive coating by a method comprising forming a resin layer by applying a solution to said anode comprising a natural or synthetic resin .
22. The method of claim 21,
Wherein the manganese oxide precursor is manganese nitrate.
22. The method of claim 21,
The solution may contain a surfactant in an amount of from about 0.01 wt.% To about 30 wt.%, Preferably from about 0.05 wt.% To about 25 wt.%, More preferably from about 0.1 wt.% To about 20 wt. ≪ / RTI >
22. The method of claim 21,
Further comprising contacting the anode with a humidifying atmosphere prior to contacting the solution with the solution comprising the manganese oxide precursor.
22. The method of claim 21,
Further comprising contacting said anode with a solution comprising a manganese oxide precursor but contacting said precursor with a humidifying atmosphere prior to pyrolysis conversion.
22. The method of claim 21,
Wherein the precursor is thermally decomposed and converted in a humidified atmosphere.
27. The method of claim 24, 25, or 26,
Wherein the humidifying atmosphere has a humidity of from about 1 to about 30 g / m ³ , preferably from about 4 to about 25 g / m ³ , and more preferably from about 5 to about 20 g / m ³ , in a solid electrolytic capacitor forming method .
27. The method of claim 24, 25, or 26,
Wherein the humidifying atmosphere has a relative humidity of from about 30% to about 90%, preferably from about 40% to about 85%, more preferably from about 50% to about 80%.
22. The method of claim 21,
Wherein the precursor is thermally decomposed at a temperature of about 150 < 0 > C to about 300 < 0 > C.
22. The method of claim 21,
Wherein the anode body comprises tantalum and the dielectric comprises tantalum pentoxide.
22. The method of claim 21,
The nano-projections may have a thickness of about 5 nanometers to about 500 nanometers, preferably about 6 nanometers to about 250 nanometers, more preferably about 8 nanometers to about 150 nanometers, even more preferably about 10 nanometers ≪ / RTI > to about 110 nanometers.
22. The method of claim 21,
Wherein at least about 50%, preferably at least about 70%, more preferably at least about 90% of the nanoprojections have an average size of about 10 nanometers to about 110 nanometers.
22. The method of claim 21,
Wherein the surface coverage of the nano-projections is from about 0.1% to about 40%, preferably from about 0.5% to about 30%, more preferably from about 1% to about 20%.
22. The method of claim 21,
Wherein the manganese oxide is manganese dioxide.
22. The method of claim 21,
Wherein the conductive polymer layer is formed by chemically polymerizing monomers.
36. The method of claim 35,
Wherein the monomer is 3,4-ethylenedioxythiophene.
22. The method of claim 21,
Wherein the resin is relatively insulative.
22. The method of claim 21,
Wherein the resin is formed from a shellac.
22. The method of claim 21,
Wherein the resin-containing solution also comprises a non-aqueous solvent, a curing agent, or a combination thereof.
22. The method of claim 21,
Further comprising the step of heat treating the resin-containing solution after application to the anode.
22. The method of claim 21,
Wherein the resin layer is formed after the pre-coating layer.
22. The method of claim 21,
Wherein the precoat layer is formed after the resin layer.

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