KR20150060049A - Manufacturing Method for Touch Screen Panel - Google Patents

Abstract

The present invention relates to a manufacturing method for a touch screen panel. According to the present invention, the manufacturing method for a touch screen panel comprises: a step of forming a first electrode on a substrate; a step of forming an insulating film to cover the first electrode; a step of flattening the insulating film; and a step of forming a routing electrode and a pad portion by using a printing process on the flattened insulating film.

Description

Technical Field [0001] The present invention relates to a manufacturing method of a touch screen panel,

The present invention relates to a method of manufacturing a touch screen panel capable of simplifying a process.

The display devices are used in various electronic products such as a TV, a computer monitor, a notebook computer, a mobile phone, a display portion of a refrigerator, a personal digital assistant, and an automated teller machine. The display devices constitute a user interface based on input devices such as an input button, a jog shuttle, a keyboard, and a mouse.

2. Description of the Related Art Recently, there has been a tendency to use a user interface using a touch screen panel, which facilitates the use of display devices and is advantageous in miniaturizing the size of a display device. The touch screen panel is divided into a resistive type, a capacitive type or an electro-magnetic type according to a method of detecting a touched portion of the panel.

A capacitive touch screen panel will now be described with reference to FIG. 1 is a cross-sectional view of a capacitive touch screen panel.

1, a black matrix 2 and an index layer 3 are formed on a substrate 1, and a routing wiring 4 is formed on an index layer 3. Then, after the first electrode 5 is formed to cover the routing wiring 4, the insulating film 6 is formed. Next, a second electrode 7 orthogonal to the first electrode 5 is formed on the insulating film 6.

In the touch screen panel, each pattern forms a layer, and after the mask is aligned, it is subjected to various processes such as a photolithography process and an etching process.

In recent years, a printing process such as gravure printing is used to improve the inconvenience of the etching process in the process of forming the metal wiring pattern. For example, Korean Patent Laid-Open Publication No. 10-2013-0033888 (titled: manufacturing method of touch panel) proposes a technique of simplifying the manufacturing process of a touch panel by forming a transparent electrode using a printing process.

However, since the routing wiring 4 of the touch screen panel is formed on the insulating film 6 having a severe curvature as shown in the drawing, it is difficult to use the printing process. In addition, since the routing wiring 4 of the touch screen panel is a fine pattern of 10 to 20 탆, when the gravure process is used, the defect occurrence ratio is very high. This is because when the pattern is formed using the gravure process, the shape of the pattern is cut off or the pattern is worn.

The present invention provides a method of manufacturing a touch screen panel capable of simplifying a manufacturing process.

The present invention also provides a method of manufacturing a touch screen panel in which a metal wiring such as a routing wiring can be formed in a fine pattern of 20 μm or less.

A method of manufacturing a touch screen panel according to the present invention includes: forming a first electrode on a substrate; Forming an insulating film to cover the first electrode; Planarizing the insulating film; And forming a routing electrode and a pad portion on the planarized insulating film using a printing process.

The present invention can simplify the manufacturing process of a touch screen panel by forming a routing wiring using a printing process.

Particularly, the present invention can prevent defects occurring in the process of forming a fine pattern in the printing process by changing the shape of the routing wiring.

1 is a cross-sectional view of a conventional touch screen panel.
2 is a plan view of a touch screen panel according to the present invention.
3A to 3D are views showing a method of manufacturing a touch screen panel according to the present invention.
Figs. 4 and 5 are views showing an embodiment of a method of forming a routing wiring using a gravure process. Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Like reference numerals throughout the specification denote substantially identical components. In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 2 is a plan view of a touch screen panel according to the present invention, and FIG. 3 is a cross-sectional view taken along a cutting plane I-I 'shown in FIG.

2 and 3, the touch screen panel according to the present invention includes an electrode forming area A, a routing wiring part B, a dummy pattern 45, and a pad part C. As shown in FIG.

The electrode formation area A is formed on the display surface of the substrate 10 and includes first electrodes 21 and second electrodes 22. [ A plurality of first electrodes 21 are formed in parallel to one another in the longitudinal direction of the substrate 10. A plurality of second electrodes 22 are formed in parallel along the lateral direction of the substrate 10, ≪ / RTI > The first electrodes 21 and the second electrodes 22 are in the form of intersecting on a plane, but they are electrically insulated by the insulating film 17 shown in FIG. 3 (d).

The routing wiring part B connects the first electrode 21 and the first pad 51 and connects the second electrode 22 and the second pad 52. The routing wiring part B connects the first electrode 21 and the second pad 52, . The first routing wires 41 are connected to the first electrodes 51 and the second routing wires 42 are connected to the second electrodes 22.

The dummy pattern 45 is formed in the dummy region where the second routing wirings 42 are not formed. The number of the second routing wirings 42 differs from the side of the electrode formation area A where the second electrode 22 and the second routing wiring 42 are connected to a certain width d. For example, as shown in the drawing, three second routing wirings 42 are formed for a constant width d at the h1 point, and two second routing wirings 42 are formed for the constant width d at the h2 and h3 points. Two routing wirings 42 and one routing wiring 42 are formed. The dummy pattern 45 serves to compensate for the variation in the number of the second routing wirings 42 in accordance with the position as described above. A metal pattern including the second routing wiring 42 and the dummy pattern 45 for the same width So that the same number is obtained. This dummy pattern 45 is for preventing a pattern defect in a process to be described later and is not electrically connected to the second routing wiring 42 or the second electrode 22. [

The wiring coating portion 25 shown in FIG. 3 (d) is formed so as to cover the routing wiring 42, thereby preventing the routing wiring 42 from being exposed to the outside and being corroded.

The pad portion C includes first and second pads 51 and 52. The first pad 51 is connected to the first electrode 21 through the first routing wiring 42. The second pad 52 is connected to the second electrode 22 through the second routing wiring 42. The plane of the pad portion C is formed in the form of a polygon formed by sides larger than the width of the routing wiring portion B to secure an electrical contact surface. In particular, the pad portion C includes an open region e in which no conductive material is formed in the inner region. The pad portion C is formed in the form of a sharp point at an end contacting with the routing wiring portion B. The open area e formed at the pad part C and the end of the sharp shape are patterns for preventing defects in the process of forming the pad part C through the gravure process.

Hereinafter, a method of forming the touch screen panel will be described with reference to FIG. 2 and FIGS. 3A to 3D.

Referring to FIGS. 2 and 3A, the touch screen panel sequentially forms a black matrix 13, an index matching 15, and a first electrode 21 on a substrate 10. The black matrix 13 can be formed along the boundary between the pixel forming region A and the pixel through the photolithography process. The index matching 15 is for improving refractive index and visibility and may be formed on the entire surface of the panel. The first electrodes 21 are formed in a row in the electrode formation region A, respectively. The first electrode 21 may be formed through a photolithography process using a transparent electrode (Indium-Tin-Oxide).

2 and 3B, after the first electrode 21 is formed, an insulating film 17 is formed over the entire surface of the electrode forming region A. As shown in FIG. In order to form the insulating film 17, an insulating material is formed over the entire area of the substrate 10, and a planarization process is performed so that the index matching 15 formed on the black matrix 13 is exposed. That is, the entire area on the substrate 10 is a flat surface that exposes the insulating film 17 and the index matching 15.

2 and 3C, a routing wiring 42 is formed after the entire area on the substrate 10 has become a flat surface. The routing wiring 42 and the pad portion C are formed. The routing wiring 42 and the pad portion C are simultaneously formed using a metal material, and a printing process such as a gravure process can be used. 3B, since the entire area on the substrate 10 is flattened through the planarization process in the process of forming the insulating film 17, the routing wiring 42 and the pad portion C are formed using the printing process It is easy to do.

Referring to FIG. 2 and FIG. 3D, after the routing wiring 42 and the pad portion C are formed, the second electrode 22 and the wiring coating film 25 are formed. Each second electrode 22 is formed so as to cross the first electrode 21 vertically. The wiring coating film 25 is formed so as to cover the routing wiring 42. The second electrode 22 and the wiring coating film 25 may be simultaneously formed through a photo process after ITO is formed to cover the insulating film 17 and the routing wiring 42.

The method of forming the touch screen panel according to the present invention can simplify the process because the routing wiring 42 and the pad portion C are formed through the printing process. Particularly, as shown in FIG. 2, the pad portion C according to the present invention can prevent the pattern defect from occurring in the printing process by forming the opening region e.

The gravure process for forming the routing wiring 42 and the pad portion C as shown in FIG. 3 (c) will now be described.

4 is a view illustrating a process of transferring the paste filled in the concave pattern 113 of the roller 110 to the blanket 120. FIG 5 is a view showing a process of transferring the pattern from the blanket 120 to the substrate 10 FIG.

The gravure process first forms engraved engraved patterns 113 on the roller 110 so as to correspond to the shapes of the routing wiring 42 and the pad portion C. [ At this time, the engraved pattern 113 is formed to correspond to the shape of the open region e of the pad portion c. In other words, the engraved pattern 113 is formed to include a non-piercing opening pattern 115 so that the conductive material is not filled in the shape of the open area e.

Then, a paste-type conductive material is applied to the roller 110 to fill the engraved pattern 113 with a conductive material. Then, the extra conductive material remaining in the engraved pattern 113 is removed using the knife 115.

The conductive material filled in the engraved pattern 113 of the roller 110 is transferred to the rotating blanket 120 so that the conductive material on the surface of the blanket 120 has a conductive property corresponding to the engraved pattern 113 of the roller 110. [ The conductive pattern 30 of the material is adhered.

The conductive pattern 30 adhered to the surface of the blanket 120 is transferred from the blanket 120 to the substrate 10, as in FIG. 5, by rotating the blanket 120 on the substrate 10. The viscosity of the conductive material forming the conductive pattern 30 in the process of transferring the conductive pattern 30 from the blanket 120 to the substrate 10 becomes an important factor for maintaining the accuracy of the transferred pattern.

If the viscosity of the conductive material is too high, the transfer process from the blanket 120 to the substrate 10 is not properly performed. Therefore, a conductive material having a relatively low viscosity is used. However, if the viscosity of the conductive material is too low, the conductive material may not spread in the substrate 10 or be absorbed in the resin-based blanket 120 too much without maintaining the shape of the conductive pattern 30 during the transfer process, ) Can be reduced.

Since the viscosity is inversely proportional to the area, the conductive pattern 30 including the void space therein maintains an appropriate level of viscosity in a state of being adhered to the blanket 120. That is, the opening pattern 31 prevents the conductive pattern 30 from being excessively low in viscosity and can be prevented from being transferred to the blanket 120 by being absorbed.

Similarly, by making the ends of the pad portions C in contact with the routing wirings 41 and 42 sharp, it is possible to prevent pattern defects.

In addition, the dummy pattern 45 prevents the pattern defect of the second routing wiring 42. In the absence of the dummy pattern 45, the conductive pattern 30 transferred to the blanket 120 is also absorbed into the region where the conductive pattern 30 is not formed due to the diffusion phenomenon. For example, the conductive pattern 30 transferred to the blanket 120 is absorbed into the adjacent region to form the second routing wiring 45 at the 'h3' position, And is formed of a small amount of conductive material. Therefore, the size of the resistance of the second routing wiring 42 varies depending on the position. The dummy pattern 45 serves to compensate for this. When the conductive pattern 30 for the second routing wiring 42 is formed in the blanket 120, the conductive pattern 30 is diffused from the blanket 120 to the adjacent region .

The copper (Cu) paste may be used as the conductive material for forming the routing interconnections 41 and 42 and the pad portion C through the gravure process. As the copper (Cu) paste, copper (Cu) in an amount of 60 to 90 parts by weight can be used. When the weight percentage of copper (Cu) is less than 60, the electrical conductivity is low and the function as a wiring can not be smoothly performed. When the weight is more than 90, the content of the solvent is small and it is not suitable for the printing process.

As the conductive material, any one of silver (Ag), carbon nanotube (carbon nanotube), and graphene may be used.

The embodiment of the present invention has been described with respect to a touch screen panel in which routing wirings 41 and 42 and a pad portion C are formed using a gravure process. Similarly, the black matrix and the insulating film of the touch screen panel may be formed using a gravure process.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

10: substrate 21, 22: first and second electrodes
41, 42: routing wiring 51, 52: first and second pad portions
45: dummy pattern

Claims (10)

Forming a first electrode on a substrate;
Forming an insulating film to cover the first electrode;
Planarizing the insulating film; And
And forming a routing electrode and a pad portion on the planarized insulating film using a printing process.
The method according to claim 1,
Forming a black matrix pattern on the substrate; And
And forming an index matching to cover the substrate and the black matrix pattern,
Wherein the first electrode is formed on the index matching.
The method according to claim 1,
And forming a second electrode orthogonal to the first electrode on the insulating layer.
The method of claim 3,
Wherein the step of forming the second electrode further comprises the step of forming a wiring coating film so as to cover the routing wiring.
The method according to claim 1,
Wherein forming the routing wiring and the pad portion comprises:
Wherein the printing process is performed so that an opening area in which the conductive material is not formed is formed in the pad of the pad part.
6. The method of claim 5,
Wherein forming the routing wiring and the pad portion comprises:
Wherein the printing process is performed so that a tip end of the pad portion, which abuts the routing wiring, becomes a sharp shape so as to be narrowed in a direction toward the pad portion.
6. The method of claim 5,
The step of forming the routing wiring
And forming a dummy pattern in an area where the routing wiring is not formed, the wiring pattern being parallel to the routing wiring and not electrically connected to the routing wiring or the first and second electrodes. ≪ / RTI >
8. The method according to any one of claims 5 to 7,
Wherein forming the routing electrode and the pad portion comprises:
Forming a concave pattern on the roller;
Filling the concave pattern with a conductive material;
Forming a conductive pattern on the blanket by transferring the conductive material filled in the concave pattern to a blanket; And
And transferring the conductive pattern transferred to the blanket to the substrate,
Wherein the step of forming the concave pattern is patterned to correspond to the shape of the open area inside the pad and the sharp end of the pad.
9. The method of claim 8,
Wherein the conductive material is a copper paste having a weight of 60 to 90 parts by weight.
10. The method of claim 9,
Wherein the conductive material comprises at least one of Ag, carbon nanotube, and graphene.

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