KR20150048695A - Thin film coil, case assembly, non-contact power receiving device, and electronic device having the same - Google Patents

Abstract

The present invention relates to a thin film coil, a case assembly, a non-contact power receiving device and an electronic device including the same. The thin film coil according to an embodiment of the present invention is a thin film coil disposed at a non-contact power transmitting device for transmitting power wirelessly or a non-contact power receiving device for receiving the power transmitted from the non-contact power transmitting device. The thin film coil comprises: a flexible substrate; a first coil strip formed on one surface of the flexible substrate and including a spiral pattern and a withdrawal pattern withdrawing from one end, which has been arranged in the spiral pattern, to the outside of the spiral pattern; a second coil strip formed on the other surface of the flexible substrate; and a plurality of vias for detour penetrating the flexible substrate at a position adjacent to the withdrawal pattern and connecting the first coil strip and the second coil strip.

Description

TECHNICAL FIELD [0001] The present invention relates to a thin film coil, a case assembly, and a contactless power receiving apparatus, and an electronic apparatus having the same. BACKGROUND OF THE INVENTION 1. Field of the Invention [0002]

The present invention relates to a thin film coil, a case assembly, and a contactless power receiving apparatus and an electronic apparatus having the same.

2. Description of the Related Art In recent years, a system for transmitting electric power wirelessly, that is, a non-contact type, has been studied in order to charge a secondary battery built in a portable terminal or the like.

Generally, the non-contact power transmission device includes a non-contact power transmission device for transmitting electric power and a non-contact power receiving device for receiving and storing electric power.

These contactless power transmission devices transmit and receive electric power using electromagnetic induction. For this purpose, a coil is provided in each of them.

The prior art non-contact power transmission device is configured such that the coil is wound in parallel with the bottom surface (i.e., the outer contact surface). Further, the coil is configured to be fixed to the bottom surface by an adhesive, an adhesive sheet, or the like.

However, in the conventional case, since a coil of a general wire shape is used, the coils are wound in a laminated state when the coils are wound. Therefore, there is a problem that the thickness of the contactless power transmission device becomes thick due to the thickness of the coil and the number of windings of the coil.

Therefore, in order to cope with recent trends favoring thin devices, it is necessary to develop a non-contact power transmission device with a thinner thickness.

Also, in the conventional case, since a single-wire type coil is mainly used, there is a problem that the AC resistance value is increased due to the eddy current or skin effect at a low frequency and loss is generated.

Japanese Patent Application Laid-Open No. 2008-172872

It is an object of the present invention to provide a thin film coil, a case assembly, and a contactless power receiving device which are formed in a thin shape and an electronic apparatus having the same.

It is another object of the present invention to provide a contactless power transmission device capable of minimizing the thickness by using a thin film coil.

It is another object of the present invention to provide a contactless power transmission device capable of minimizing loss caused by eddy currents, skin effect, etc. at low frequencies.

A thin film coil according to an embodiment of the present invention is a thin film coil provided in a contactless power transmission apparatus that transmits power wirelessly or a contactless power reception apparatus that receives power transmitted from the contactless power transmission apparatus, ; A first coiled strand formed on one surface of the flexible substrate, the first coiled strand including a spiral pattern and a drawing pattern drawn out of the spiral pattern at one end disposed inside the spiral pattern; A second coil strand formed on the other surface of the flexible substrate; And a plurality of bypassing vias passing through the flexible substrate at a position adjacent to the drawing pattern and connecting the first coil strand and the second coil strand.

Also, the non-contact power receiving apparatus according to the present embodiment is a non-contact power receiving apparatus that wirelessly receives power transmitted from a non-contact power transmitting apparatus, comprising: a flexible board; A first coiled strand formed on one surface of the flexible substrate, the first coiled strand including a spiral pattern and a drawing pattern drawn out of the spiral pattern at one end disposed inside the spiral pattern; A second coil strand formed on the other surface of the flexible substrate; And a plurality of bypassing vias passing through the flexible substrate at a position adjacent to the drawing pattern and connecting the first coil strand and the second coil strand.

Also, the electronic apparatus according to the present embodiment may include: a contactless power receiving device for receiving power wirelessly; And a case housing the contactless power receiving device, wherein the contactless power receiving device includes: a flexible substrate; A first coiled strand formed on one surface of the flexible substrate, the first coiled strand including a spiral pattern and a drawing pattern drawn out of the spiral pattern at one end disposed inside the spiral pattern; A second coil strand formed on the other surface of the flexible substrate; And a plurality of bypassing vias passing through the flexible substrate at a position adjacent to the drawing pattern and connecting the first coil strand and the second coil strand.

The thin film coil according to the present embodiment is a thin film coil provided in a contactless power transmission apparatus that transmits power wirelessly or a contactless power reception apparatus that receives power transmitted from the contactless power transmission apparatus. A first spiral pattern formed on one surface of the flexible substrate; A second spiral pattern formed on the other surface of the flexible substrate; An extraction pattern formed on one surface of the flexible substrate, the extraction pattern connecting the inside of the first helical pattern and the outside of the first helical pattern; And a bypass path in which the first helical pattern is formed so as to partially share the second helical pattern so as to bypass the drawing pattern at a portion where the drawing pattern is disposed, wherein the first helical pattern and the second helical pattern The pattern may share the fetch pattern.

In addition, the case assembly according to the present embodiment is a case assembly of a portable device that receives power wirelessly, and includes a thin film coil; And a case of the portable device disposed on the other side of the thin film coil, wherein the thin film coil comprises: a flexible substrate; A first spiral pattern formed on one surface of the flexible substrate; A second spiral pattern formed on the other surface of the flexible substrate; An extraction pattern formed on one surface of the flexible substrate, the extraction pattern connecting the inside of the first helical pattern and the outside of the first helical pattern; And a bypass path in which the first helical pattern is formed so as to partially share the second helical pattern so as to bypass the drawing pattern at a portion where the drawing pattern is disposed, wherein the first helical pattern and the second helical pattern The pattern may share the fetch pattern.

Since the thin film coil according to the present invention does not use a wire type coil but forms a coil pattern on a thin thin film substrate as in the prior art, the thickness of the thin film coil can be made very thin.

In addition, the thin film coil according to the present invention has one coil pattern formed by a plurality of coil strands connected in parallel. Therefore, a coil (e.g., Litz wire) formed by twisting a plurality of strands of wires ) Can be obtained. When a twisted coil is used as described above, it is possible to minimize the loss (e.g., AC resistance value) caused by eddy current and skin effect at low frequencies.

Further, in the thin film coil according to the present invention, all of the contact pads can be disposed outside the coil pattern without using a multilayer board or a bridge. Therefore, it is possible to reduce the time and cost of manufacturing the thin-film coil and to reduce the overall thickness of the thin-film coil or the electronic equipment having the thin-film coil.

1 is a perspective view schematically showing an electronic apparatus according to an embodiment of the present invention.
2 is a cross-sectional view taken along line A-A 'in Fig.
3 is an exploded perspective view schematically showing the contactless power receiving apparatus of FIG. 2 of the present invention.
4 is an exploded cross-sectional view taken along line B-B 'of FIG. 3;
5 is a cross-sectional view of the contactless power receiving apparatus of FIG. 4;
Fig. 6 is a partial perspective view enlargedly showing a portion C in Fig. 3; Fig.
7 is a perspective view showing a lower surface of a thin-film coil according to an embodiment of the present invention.
8 is a partial perspective view enlargedly showing part E of Fig.
FIG. 9 is a partial cross-sectional view showing a cross section taken along the line D-D 'in FIG. 6; FIG.
10 is a perspective view schematically showing a thin-film coil according to another embodiment of the present invention.

Prior to the detailed description of the present invention, the terms or words used in the present specification and claims should not be construed as limited to ordinary or preliminary meaning, and the inventor may designate his own invention in the best way It should be construed in accordance with the technical idea of the present invention based on the principle that it can be appropriately defined as a concept of a term to describe it. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that, in the drawings, the same components are denoted by the same reference symbols as possible. Further, the detailed description of known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some of the elements in the accompanying drawings are exaggerated, omitted, or schematically shown, and the size of each element does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present embodiment, the contactless power transmission apparatus generally refers to a contactless power transmission apparatus for transmitting power and a contactless power reception apparatus for receiving and storing power.

FIG. 1 is a perspective view schematically showing an electronic device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A 'of FIG.

1 and 2, the electronic device according to the present embodiment may be a portable device 10 or a charging device 20, and may also be a noncontact power supply (not shown) provided in the portable device 10 or the charging device 20, Reception device 100 or the non-contact power transmission device 200. [

The portable device 10 may include a battery 12 and a contactless power receiving apparatus 100 for supplying power to the battery 12 to charge the battery 12. [

The battery 12 may be a secondary battery capable of charging and discharging, and may be detachably attached to the portable device 10.

The contactless power receiving apparatus 100 may be accommodated in the case 11 of the portable device 10 and attached directly to the inner surface of the case 11 or disposed as close as possible.

In addition, the charging device 20 according to the present embodiment is a portable And is provided to charge the battery 12 of the device 10. To this end, the charging device 20 may include a non-contact power transmission device 200 inside the case 21.

The charging device 20 can convert the household AC power supplied from the outside into DC power and convert the DC power to an alternating voltage of a specific frequency to provide the AC power to the contactless power transmitter 200. [ To this end, the charging apparatus 20 may include a voltage converting unit 22 for converting the household AC power source into an AC voltage having a specific frequency.

When the AC voltage is applied to the thin film coil (not shown) in the non-contact power transmission device 200, the magnetic field around the thin film coil changes. Accordingly, in the non-contact power receiving apparatus 100 of the electronic apparatus 10 disposed adjacent to the non-contact power transmitting apparatus 200, the voltage is applied in accordance with the change of the magnetic field, whereby the battery 12 is charged.

Hereinafter, the non-contact power receiving apparatus 100 provided in the portable device 10 will be described in more detail.

FIG. 3 is an exploded perspective view schematically showing the contactless power receiving apparatus of FIG. 2, FIG. 4 is an exploded sectional view taken along line B-B 'of FIG. 3, Sectional view.

3 to 5, the non-contact power receiving apparatus 100 includes a magnetic portion 120 and a thin-film coil 110.

The magnetic portion 120 is formed in a flat plate shape (or sheet shape), and is disposed on one side of the thin film coil 110 and fixedly attached to the thin film coil 110. The magnetic portion 120 is provided to efficiently form a magnetic path of a magnetic field generated by the coil pattern 113 of the thin-film coil 110. For this, the magnetic portion 120 is formed of a material that can be easily formed into a magnetic path, and a ferrite sheet may be used.

However, the magnetic part 120 according to the present embodiment is not limited to the above-described configuration, and various applications such as forming a ferrite powder or a magnetic material solution on one surface of the thin film coil 110 can be applied.

On the other hand, although not shown, a metal sheet may be additionally provided on the outer surface of the magnetic portion 120 as needed in order to autonomously cut electromagnetic waves and leakage flux. The metal sheet may be made of aluminum or the like, but is not limited thereto.

The contactless power receiving apparatus 100 according to the present embodiment may further include a bonding portion between the thin film coil 110 and the magnetic portion 120 so that the thin film coil 110 and the magnetic portion 120 are firmly fixed to each other. 140 may be interposed.

The adhesion portion 140 is disposed between the thin film coil 110 and the magnetic portion 120 and bonds the magnetic portion 120 and the thin film coil 110 to each other. The bonding portion 140 may be formed of an adhesive sheet or an adhesive tape and may be formed by applying an adhesive or a resin having adhesiveness to the surface of the substrate 112 or the magnetic portion 120. At this time, it is also possible to configure the bonding portion 140 to contain ferrite powder so that the bonding portion 140 has magnetism together with the magnetic portion 120.

The thin film coil 110 may include a substrate 112 and a coil pattern 113 formed on the substrate 112.

The substrate 112 of the thin film coil 110 according to the present embodiment may be a thin film substrate, for example, a flexible PCB. However, the present invention is not limited thereto, and can be variously used as long as it is a thin film such as a film or a thin printed circuit board and can form a wiring pattern.

FIG. 6 is an enlarged partial perspective view of part C of FIG. 3, and FIG. 7 is a perspective view of a lower surface of the thin-film coil according to the embodiment of the present invention. 8 is an enlarged partial perspective view of part E of FIG. 7, and FIG. 9 is a partial sectional view of a section taken along line D-D 'of FIG.

The coil pattern 113 according to the present embodiment is formed in the form of a wiring pattern on both sides of the substrate 112 and can be formed in a spiral shape on a plane formed by the substrate 112. [

The coil pattern 113 may include a plurality of coiled strands 117, 118 arranged side by side. At this time, the coil strands 117 and 118 may be connected to each other in parallel to form a single coil pattern 113. In this embodiment, the coil strands 117 and 118 are formed on both sides of the substrate 112, respectively, to form one coil pattern 113.

In order to connect the coil strands 117 and 118 in parallel, the thin film coil 110 according to the present embodiment may include a plurality of conductive connection vias 114. The connecting vias 114 may electrically connect the coil strands 117, 118 at opposite ends of the coil strands 117, 118 with each other.

As shown in FIG. 6, in this embodiment, the connection via 114 is formed at the inner end of the contact pad 119 and the spiral pattern 117a, respectively. However, the present invention is not limited thereto, and various shapes and various shapes can be formed at various positions according to the shape and structure of the coil pattern 113. [

The coil pattern 113 according to the present embodiment is configured such that any one of the coil strands 117 and 118 (hereinafter referred to as a first coil strand) formed on both sides of the substrate 112 has a helical pattern 117a, And a drawing pattern 117d arranged to cross the spiral pattern 117a at one end disposed inside the pattern 117a.

The lead pattern 117d is provided to connect the end of the spiral pattern 117a to the outside of the coil pattern 113, that is, the contact pad 119 described later. Therefore, the lead-out pattern 117d is formed in the form of a pattern that electrically connects the end of the innermost spiral pattern 117a to the contact pad 119. [

9, the helical pattern 117a of the first coil strand 117 is formed so as to bypass the center of the drawn pattern 117d at the portion where the drawn pattern 117d is disposed. That is, the spiral pattern 117a of the first coil strand 117 is formed with at least one bypass path via the other surface of the substrate 112 at the portion where the drawing pattern 117d is disposed, The coil shape can be maintained without interfering with the drawing pattern 117d.

The bypass path may be formed so as not to contact the coil strand (hereinafter referred to as the second coil strand) disposed on the other side of the substrate 112 (not shown). In this case, the bypass path may be disposed in the space between the second coil strands 118.

In this case, however, the entire area of the thin film coil is increased due to the bypass path.

Therefore, the thin film coil 100 according to the present embodiment forms a bypass path by using the second coil strand 118. That is, the bypass path according to the present embodiment is configured to partially share the second coil strand 118.

As shown in Figs. 6 and 9, the conductive spiral vias 115 are disposed in the spiral pattern 117a according to the present embodiment at portions where the spiral patterns 117a are cut off by the extraction pattern 117d. The first coil strand 117 is electrically connected to the second coil strand 118 by the bypassing via 115.

Thus, one bypass path according to the present embodiment includes two bypass vias 115 and a portion of the second coil strand 118 disposed between the bypass vias 115 (S in Fig. 9, Section). This bypass path may be formed by a number corresponding to the number of turns of the helical pattern 117a.

The coil pattern 113 according to the present embodiment is formed such that the positions of the first coil strand 117 and the second coil strand 118 are mutually projected through the substrate 112 . Accordingly, when the via holes 115 are formed perpendicular to the substrate 112, the first coil strand 117 and the second coil strand 118 are electrically connected to each other by the via holes 115, As shown in FIG.

The first and second coil strands 117 and 118 are independently disposed on both sides of the substrate 112 to the position where the lead pattern 117d is formed, The second coil strand 118 on the other side of the substrate 112 is shared with the portion where the lead pattern 117d is formed.

The coil pattern 113 is formed so that the coil strands 117 and 118 are electrically connected to each other only by the number of turns of the coil pattern 113 in the middle of the pattern, And are electrically connected to each other.

In this embodiment, the lead pattern 117d is formed on the first coil strand 117 formed on the upper surface of the substrate 112. In this case, However, the present invention is not limited to this, and it is also possible to form a drawing pattern on the lower surface, that is, the second coil strand 118, rather than the upper surface of the substrate 112.

In the present embodiment, the coil strands 117 and 118 formed on both sides of the substrate 112 are formed at positions projected from each other via the substrate 112. However, It is not limited. That is, the coil strands 117 and 118 formed on the respective surfaces of the substrate 112 may be formed at mutually offset positions instead of being projected to each other. In this case, the bypassing vias may be formed in an oblique direction or stepped shape that is not perpendicular to the substrate to connect the coil strands.

In this embodiment, the coil pattern 113 is formed as a quadrangular spiral shape. However, the present invention is not limited thereto, and various applications such as a circular or polygonal spiral shape are possible.

In addition, an insulating protective layer (for example, a resin insulating layer, not shown) for protecting the coil pattern 113 from the outside can be added to the upper portion of the coil pattern 113 as needed.

On the other hand, a contact pad 119 for electrically connecting the coil pattern 113 to the outside may be formed on one side of the substrate 112, that is, outside the coil pattern 113.

Both ends of the coil pattern 113 are electrically connected to the contact pad 119. At least two of the coil patterns 113 may be provided.

Further, the contact pads 119 according to the present embodiment are all disposed on the outside of the coil pattern 113. Even though all of the contact pads 119 are disposed outside the coil pattern 113 as described above, the thin film coil according to the present embodiment has both ends of the coil pattern 113 via the bypass path and the lead-out pattern 117d described above, (Not shown).

6, the contact pads 119 according to the present embodiment may be arranged to protrude from the rectangular substrate 112 to one side of the substrate 112. In this case, Therefore, the contact pad 119 according to the present embodiment is exposed to the outside of the magnetic portion 120 even when the thin film coil 110 and the magnetic portion 120 are coupled.

Therefore, the thin film coil 110 according to the present embodiment can easily electrically connect the coil pattern 113 and other components (for example, a battery, a voltage converter, and the like) after the magnetic coil 120 is coupled with the coil.

In the present embodiment, the coil strands 117 and 118 formed on the respective surfaces of the substrate 112 are formed as one strand, but the present invention is not limited thereto. And may be formed of a plurality of strands as in the example.

The thin film coil 110 according to the present embodiment is configured such that the number of the coil strands 117 and 118 that can be formed on one side of the substrate 112 is set according to the size of the substrate 112, .

In other words, when the size of the substrate 112 is large, a plurality of coil strands other than one may be formed on one side of the substrate 112 as shown in FIG. 10, Only one coil strand 117 and 118 may be formed on one side of the substrate 112 as in the present embodiment.

The contactless power receiving apparatus 100 according to the present embodiment is configured to transmit power generated in the coil pattern 113 of the thin film coil 110 to the battery (12 in Fig. 2) of the electronic device 10 The thin film coil 110 may further include a connection member for electrically connecting the contact pad 119 of the thin film coil 110 and the battery.

A conductive wire may be used as the connecting member, and a thin film circuit board (for example, a flexible board) having a wiring pattern formed therein may be used.

The contactless power receiving apparatus 100 according to the present embodiment uses a coil pattern 113 formed on a thin thin film substrate 112 without using a wire type coil as in the prior art, It is possible to form the coil 110 with a very thin thickness.

In addition, in the thin film coil 110 according to the present embodiment, one coil pattern 113 is formed by a plurality of coil strands 117 and 118 connected in parallel. Accordingly, although the coil pattern 113 according to the present embodiment is formed in a pattern on the substrate 112, a coil (for example, a Litz wire) in the form of a twisted wire formed by twisting a plurality of strands of wires, Can be obtained. When a twisted coil is used as described above, it is possible to minimize the loss (e.g., AC resistance value) caused by eddy current and skin effect at low frequencies.

Thus, even when the coil pattern 113 is formed in a twisted shape, the thickness of the thin film coil 110 can be minimized (for example, 0.1 mm or less) The overall thickness of the device 100 can be reduced.

In addition, in the contactless power receiving apparatus 100 according to the present embodiment, the contact pads 119 of the thin film coil are all disposed on the side surface of the substrate 112. Another advantage is that a separate structure is not added to the substrate 112 for disposing the contact pad 119 on the side surface of the substrate 112. [ This is explained as follows.

Among the contact pads 119 connected to both ends of the coil pattern 113, the contact pads 119 connected to the coil pattern 113 which is wound toward the inside (that is, the center) of the coil pattern 113, 113, but is easily disposed inside the pattern. In this case, the contact pads disposed inside the coil pattern 113 should be electrically connected to the outside through a separate conductive wire or a connection board (e.g., FPCB).

In order to dispose the contact pad on the outside of the coil pattern 113 as in the present invention, a bridge may be formed on the coil pattern 113 with an insulating material to form a pattern, or a multilayer substrate Should be used.

In this case, a manufacturing time or a manufacturing cost is additionally required to form a bridge on the substrate or to manufacture a multilayer substrate, and the overall thickness of the substrate 112 also becomes thick.

However, in the thin film coil 100 according to the present embodiment, all the contact pads 119 can be disposed outside the coil pattern 113 without using a multilayer board or a bridge. Therefore, the manufacturing time and manufacturing cost can be reduced and the thickness of the thin film coil 100 or the non-contact power receiving apparatus 100 can be prevented from becoming thicker than in the above case.

The configuration of the thin film coil 100 described above can be similarly applied to the non-contact power transmission device 200 provided in the charging device 20. [ Therefore, detailed description of the non-contact power transmission device 200 will be omitted.

The thin film coil according to the embodiment described below is constructed in a similar structure to the thin film coil (110 in FIG. 6) of the above-described embodiment, and has a difference only in the form of the coil pattern. Therefore, the same reference numerals are used for the same constituent elements, detailed description thereof will be omitted, and the coil pattern will be described in more detail.

10 is a perspective view schematically showing a thin-film coil according to another embodiment of the present invention.

Referring to FIG. 10, the thin film coil 110 according to the present embodiment may include a thin film substrate 112 and a coil pattern 113 formed on the substrate 112 as in the above embodiment have.

The coil pattern 113 according to the present embodiment includes a plurality of coil strands 117a to 117c arranged side by side. At this time, the plurality of coil strands 117a to 117c are all electrically connected to the same contact pad 119. Accordingly, the respective coil strands 117a to 117c are connected in parallel to each other to form one coil pattern 113.

In this embodiment, the coil pattern 113 is formed on one surface of the substrate 112 as three coil strands 117a to 117c. In this case, the coil strands 117a to 117c of the coil pattern 113 are spaced apart from each other at regular intervals.

As in the above embodiment, the coil pattern 113 according to the present embodiment also includes the drawing pattern 117d and a plurality of bypassing vias 115. [ Therefore, since it is not necessary to use a multilayer board or a bridge, the contact pad 119 can be disposed outside the coil pattern 113 without increasing the thickness of the substrate 112, thereby reducing the overall thickness of the thin film coil or the non- Which can reduce manufacturing time and manufacturing costs.

On the other hand, FIG. 10 shows an example in which the lead pattern 117d is formed by one coil strand. However, the present invention is not limited to this, and the lead pattern 117d may be formed of a plurality of coil strands like the other portions of the coil pattern 113. [

In addition, in the case of the coil strand (not shown) formed on the lower surface of the substrate 112, a plurality of coil strands (not shown) like the coil strands 117a to 117c formed on the upper surface of the substrate 112 may be formed. However, the present invention is not limited thereto. That is, the coil strands 117a to 117c formed on the upper surface of the substrate 112 are formed on the lower surface of the substrate 112 through the via holes 115, such that only one coil- But may be formed in various forms as needed, as long as the coil can be electrically connected to the coil strand.

The thin film coil and the electronic apparatus having the thin film coil according to the present invention described above are not limited to the above-described embodiments, and various applications are possible. For example, although the case where the contact pads of the thin-film coil are arranged in the same direction of the substrate is described as an example in the above-described embodiments, various applications such as arranging the contact pads on both sides of the substrate as necessary are possible.

In the above-described embodiments, the thin film coil provided in the non-contact power transmission device of the electronic device has been described as an example.

However, the present invention is not limited thereto, and can be widely applied to electronic parts and electronic devices such as a transformer and a motor in which coils are used.

10 ..... Electronic devices
11, 12 ..... case
12 ..... Battery 20 ..... Charging device
100 ..... Solid state power receiver
110 ..... Thin film coil 112 ..... Substrate
113 ..... coil pattern
114 ..... Via connection 115 ..... Via for bypass
117 ..... first coil strand
117a ..... Spiral pattern 117d ..... Draw pattern
118 ..... second coil strand
120 ..... magnetic part 140 ..... adhesive part
200 ..... Solid state power transmitter

Claims (13)

A thin-film coil provided in a non-contact power transmission apparatus that transmits power wirelessly or a non-contact power reception apparatus that receives power transmitted from the non-contact power transmission apparatus,
A flexible substrate;
A first coiled strand formed on one surface of the flexible substrate, the first coiled strand including a spiral pattern and a drawing pattern drawn out of the spiral pattern at one end disposed inside the spiral pattern;
A second coil strand formed on the other surface of the flexible substrate; And
A plurality of bypass vias passing through the flexible substrate at a location adjacent to the drawing pattern and connecting the first coil strand and the second coil strand;
.
The method according to claim 1,
At least one bypass path is formed in the flexible substrate,
The bypass path includes:
Two of the bypassing vias disposed on both sides of the drawing pattern with the drawing pattern as a center; And
A shared section disposed between the two of the second coil strands;
And a thin film coil.
The method according to claim 1,
And two contact pads which are disposed outside the spiral pattern and in which both ends of at least one of the first coil strand or the second coil strand are electrically connected to each other.
4. The apparatus of claim 3, wherein the first coil-
And one end is connected to the contact pad through the lead pattern.
2. The method of claim 1, wherein the first coil strand and the second coil strand
A thin film coil connected in parallel with each other.
The method of claim 1, wherein the second coil-
Wherein conductive via vias are disposed on both ends of the thin film coil, and the thin film coil is electrically connected to the first coil strand by the connection via.
2. The method of claim 1, wherein the first coil strand and the second coil strand
Wherein the flexible substrate is disposed at a position corresponding to a vertical direction on both sides of the flexible substrate.
A contactless power receiving apparatus for wirelessly receiving power transmitted from a contactless power transmitting apparatus,
A flexible substrate;
A first coiled strand formed on one surface of the flexible substrate, the first coiled strand including a spiral pattern and a drawing pattern drawn out of the spiral pattern at one end disposed inside the spiral pattern;
A second coil strand formed on the other surface of the flexible substrate; And
A plurality of bypass vias passing through the flexible substrate at a location adjacent to the drawing pattern and connecting the first coil strand and the second coil strand;
And a second power supply terminal connected to the second power supply terminal.
A contactless power receiving device for receiving power wirelessly; And
A case housing the contactless power receiving device therein;
/ RTI >
The non-contact power receiving apparatus includes:
A flexible substrate;
A first coiled strand formed on one surface of the flexible substrate, the first coiled strand including a spiral pattern and a drawing pattern drawn out of the spiral pattern at one end disposed inside the spiral pattern;
A second coil strand formed on the other surface of the flexible substrate; And
A plurality of bypass vias passing through the flexible substrate at a location adjacent to the drawing pattern and connecting the first coil strand and the second coil strand;
.
10. The wireless communication device according to claim 9,
And is directly or indirectly disposed on the inner surface of the case.
10. The method of claim 9,
And a battery for storing power received through the non-contact power receiving device.
A thin-film coil provided in a non-contact power transmission apparatus that transmits power wirelessly or a non-contact power reception apparatus that receives power transmitted from the non-contact power transmission apparatus,
A flexible substrate;
A first spiral pattern formed on one surface of the flexible substrate;
A second spiral pattern formed on the other surface of the flexible substrate;
An extraction pattern formed on one surface of the flexible substrate, the extraction pattern connecting the inside of the first helical pattern and the outside of the first helical pattern; And
A bypass path in which the first helical pattern is formed so as to partially share the second helical pattern so as to bypass the drawing pattern at a portion where the drawing pattern is disposed;
/ RTI >
Wherein the first spiral pattern and the second spiral pattern share the drawing pattern.
A case assembly for a portable device that receives power wirelessly,
Thin film coil; And
A case of the portable device disposed on the other side of the thin film coil;
/ RTI >
The thin-
A flexible substrate;
A first spiral pattern formed on one surface of the flexible substrate;
A second spiral pattern formed on the other surface of the flexible substrate;
An extraction pattern formed on one surface of the flexible substrate, the extraction pattern connecting the inside of the first helical pattern and the outside of the first helical pattern; And
A bypass path in which the first helical pattern is formed so as to partially share the second helical pattern so as to bypass the drawing pattern at a portion where the drawing pattern is disposed;
Lt; / RTI >
Wherein the first spiral pattern and the second spiral pattern share the withdrawal pattern.

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