KR20150042993A - Rubber-based pressure-sensitive adhesive composition for optical material - Google Patents
Rubber-based pressure-sensitive adhesive composition for optical material Download PDFInfo
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- KR20150042993A KR20150042993A KR20130121896A KR20130121896A KR20150042993A KR 20150042993 A KR20150042993 A KR 20150042993A KR 20130121896 A KR20130121896 A KR 20130121896A KR 20130121896 A KR20130121896 A KR 20130121896A KR 20150042993 A KR20150042993 A KR 20150042993A
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- 239000000203 mixture Substances 0.000 title claims abstract description 67
- 229920001971 elastomer Polymers 0.000 title claims abstract description 50
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims description 81
- 230000003287 optical effect Effects 0.000 title description 3
- 239000000463 material Substances 0.000 title description 2
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 46
- 239000010410 layer Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
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- 239000000853 adhesive Substances 0.000 abstract description 6
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- 239000002313 adhesive film Substances 0.000 description 5
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- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 5
- 239000003999 initiator Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
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- 230000000704 physical effect Effects 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 2
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- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- DHMBUENCUGKPAD-UHFFFAOYSA-N 2-(dimethylamino)-2-ethyl-1-(4-morpholin-4-ylphenyl)-3-phenylpropane-1,3-dione Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(N(C)C)(CC)C(=O)C1=CC=CC=C1 DHMBUENCUGKPAD-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
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- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
광학소재용 고무계 점착제 조성물에 관한 것이다.
Sensitive adhesive composition for optical materials.
근래, PDA, 이동통신 단말기 또는 차량용 네비게이션 등과 같은 전자 기기가 큰 시장을 형성하고 있다. 이와 같은 전자 기기에 있어서, 추구되는 기술적 목표는 주로 박형화, 경량화, 저전력 소비화, 고해상도화 및 고휘도화 등을 들 수 있다. 2. Description of the Related Art In recent years, electronic devices such as a PDA, a mobile communication terminal, or a navigation system for a vehicle have formed a large market. In such electronic devices, the technical goals pursued are mainly thinning, lightening, low power consumption, high resolution and high brightness.
한편, 입력 조작부에 터치스크린 또는 터치패널 스위치가 설치된 전자 기기는, 경량화 및 깨짐 방지 등을 위하여, 투명 도전성 플라스틱 필름이 사용되고 있다. 그 예로는, 폴리에틸렌테레프탈레이트(PolyEthylenTerephthalate, PET) 필름을 기재로 하고, 그 일면에 인듐 주석 산화물(Indium Tin Oxide, ITO) 등의 도전층을 형성한 필름이 있으며, 상기 필름은 점착제층에 의해 전도성 유리, 보강재 또는 데코 필름 등에 적층되어 있다. On the other hand, a transparent conductive plastic film is used as an electronic device provided with a touch screen or a touch panel switch on the input operation section for lightening and preventing breakage. An example of such a film is a film made of a polyethylene terephthalate (PET) film as a substrate, and a conductive layer such as indium tin oxide (ITO) is formed on one surface of the film. Glass, a reinforcing material or a deco film.
터치스크린 또는 터치패널에서 투명 도전성 필름의 부착에 사용되는 점착제에는 데코필름에 의한 인쇄 단차를 흡수할 수 있는 단차 흡수성; 고온 또는 고습조건과 같은 가혹 조건에 노출되었을 경우 백탁현상의 발생을 억제할 수 있는 내구성 등의 다양한 물성이 요구된다.
The pressure-sensitive adhesive used for attaching the transparent conductive film on the touch screen or the touch panel includes a step-difference absorbing property capable of absorbing a printed step by a decolour film; When exposed to severe conditions such as high temperature or high humidity conditions, various physical properties such as durability that can suppress the occurrence of opacity are required.
본 발명의 일 구현예는 분자량이 일정한 폴리이소부틸렌을 포함하여 상온 및 고온에서 낮은 저장탄성율을 구현하는 고무계 점착제 조성물을 제공한다.
One embodiment of the present invention provides a rubber-based pressure-sensitive adhesive composition comprising polyisobutylene having a constant molecular weight and realizing a low storage modulus at room temperature and high temperature.
본 발명의 일 구현예에서, 분자량이 약 1,500kg/mol 이상인 폴리이소부틸렌을 포함하는 고무계 점착제 조성물을 제공한다.In one embodiment of the present invention, there is provided a rubber-based pressure-sensitive adhesive composition comprising polyisobutylene having a molecular weight of about 1,500 kg / mol or more.
상기 폴리이소부틸렌은 이소부틸렌의 중합체일 수 있다. The polyisobutylene may be a polymer of isobutylene.
전체 고무계 점착제 조성물 100중량%에 대해서 상기 폴리이소부틸렌을 약 10중량% 내지 약 50중량%를 포함할 수 있다. And about 10% by weight to about 50% by weight of the polyisobutylene based on 100% by weight of the whole rubber-based pressure-sensitive adhesive composition.
상기 폴리이소부틸렌 외에 열경화제 및 광개시제를 추가로 포함할 수 있다. In addition to the polyisobutylene, a thermosetting agent and a photoinitiator may be further included.
상기 폴리이소부틸렌 100중량부에 대하여 상기 열경화제를 약 1중량부 내지 약 10중량부 포함할 수 있다. About 1 part by weight to about 10 parts by weight of the thermosetting agent may be added to 100 parts by weight of the polyisobutylene.
상기 폴리이소부틸렌 100중량부에 대하여 상기 광개시제를 약 0.05중량부 내지 약 3중량부 포함할 수 있다. About 0.05 part by weight to about 3 parts by weight of the photoinitiator may be added to 100 parts by weight of the polyisobutylene.
약 30℃에서의 상기 고무계 점착제 조성물 저장탄성율과 약 60℃에서의 상기 고무계 점착제 조성물 저장탄성율의 차이가 약 0.1이하일 수 있다. The difference between the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at about 30 ° C and the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at about 60 ° C may be about 0.1 or less.
상기 고무계 점착제 조성물의 저장탄성율(G’)이 약 30℃에서 약 0.09MPa 내지 약 0.2MPa일 수 있다. The rubber-based pressure-sensitive adhesive composition may have a storage elastic modulus (G ') of about 0.09 MPa to about 0.2 MPa at about 30 ° C.
상기 고무계 점착제 조성물의 저장탄성율(G’)이 약 60℃에서 약 0.09MPa 내지 약 0.2MPa일 수 있다. The rubber-based pressure-sensitive adhesive composition may have a storage elastic modulus (G ') of about 0.09 MPa to about 0.2 MPa at about 60 ° C.
상기 고무계 점착제 조성물로 형성된 점착제층의 박리력이 약 800g/in 내지 약 1300g/in일 수 있다.
The peel strength of the pressure-sensitive adhesive layer formed from the rubber-based pressure-sensitive adhesive composition may be from about 800 g / in to about 1300 g / in.
상기 고무계 점착제 조성물은 낮은 저장탄성율을 가지는바 초기 변형을 유지함으로써 단차흡수능을 향상시킬 수 있다.
The rubber-based pressure-sensitive adhesive composition has a low storage elastic modulus and can maintain the initial deformation, thereby improving the step absorption ability.
도 1은 실시예1, 비교예 2 및 3의 측정된 저장탄성율을 그래프로 나타낸 것이다. 1 is a graph showing the measured storage moduli of Example 1, Comparative Examples 2 and 3. FIG.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구항의 범주에 의해 정의될 뿐이다.
Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.
본 발명의 일 구현예에서, 분자량이 1,500kg/mol 이상인 폴리이소부틸렌을 포함하는 고무계 점착제 조성물을 제공한다.
In one embodiment of the present invention, there is provided a rubber-based pressure-sensitive adhesive composition comprising polyisobutylene having a molecular weight of 1,500 kg / mol or more.
통상의 고무계 점착제 조성물은 기존의 아크릴계 점착제 조성물 보다 저장탄성률이 높기 때문에 OLED 및 터치스크린 등 전자재료로 사용될 경우 단차흡수능이 현저히 감소하는 문제점이 있었다. 상기의 문제점을 극복하기 위하여 다양한 분자량을 가지는 고무계 수지 중에 일정 분자량을 가지는 폴리이소부틸렌 (Polyisobutylene, PIB)을 조성물에 포함시킴으로써 상온에서 저장탄성률이 낮고 고온에서도 낮은 저장탄성률의 상온과 동일 또는 유사한 범위를 가져 초기 변형을 유지함으로 단차흡수능을 향상시킬 수 있다.
The conventional rubber-based pressure-sensitive adhesive composition has a higher storage elastic modulus than that of the conventional acrylic pressure-sensitive adhesive composition, and thus has a problem in that the step absorption ability is significantly reduced when used as an electronic material such as an OLED and a touch screen. In order to overcome the above problems, polyisobutylene (PIB) having a certain molecular weight in a rubber resin having various molecular weights is included in the composition, so that the storage elastic modulus at room temperature is low and the same or similar range So that the step difference absorption ability can be improved by maintaining the initial deformation.
상기 폴리이소부틸렌의 분자량은 약 1,500kg/mol이상일 수 있다. 상기 폴리이소부틸렌은 이소부틸렌((CH3)2C=CH2)의 중합체로 폴리이소부텐 (Polyisobutene)이라고도 할 수 있다. The molecular weight of the polyisobutylene may be about 1,500 kg / mol or more. The polyisobutylene is a polymer of isobutylene ((CH 3) 2 C = CH 2) and may be referred to as polyisobutene.
상기 폴리이소부틸렌의 분자량은 구체적으로 약 1,500kg/mol 내지 약 5,000 kg/mol, 보다 구체적으로 약 1,500kg/mol 내지 약 2,500kg/mol일 수 있다. 상기 분자량은 중량평균 분자량을 일컫는바, 이는 분자량 분포가 있는 고분자 화합물의 성분 분자종의 분자량을 중량 분율로 평균하여 얻어지는 평균 분자량은 의미한다.The molecular weight of the polyisobutylene may be specifically from about 1,500 kg / mol to about 5,000 kg / mol, more specifically from about 1,500 kg / mol to about 2,500 kg / mol. The molecular weight refers to the weight average molecular weight, which means the average molecular weight obtained by averaging the molecular weight of the component molecular species of the polymer compound having the molecular weight distribution by the weight fraction.
상기 폴리이소부틸렌은 다양한 분자량을 가질 수 있으나, 상기 폴리이소부틸렌의 분자량이 약 1,500kg/mol 미만인 경우 폴리이소부틸렌의 결합(chain)이 부드럽지(soft) 않음으로 모듈러스가 높아 단차흡수능 현저히 감소할 우려가 있어 흡수성능이 저하하는 문제점이 있다. 반면, 상기 폴리이소부틸렌의 분자량을 약 1,500kg/mol 이상으로 유지함으로써 폴리이소부틸렌의 결합(chain)이 유연해진다는 점에서 단차흡수성능의 효과를 용이하게 구현할 수 있다.
The polyisobutylene may have various molecular weights, but when the molecular weight of the polyisobutylene is less than about 1,500 kg / mol, the chain of polyisobutylene is not soft, so that the modulus is high, There is a possibility of remarkable decrease and the absorption performance is deteriorated. On the other hand, since the molecular weight of the polyisobutylene is maintained at about 1,500 kg / mol or more, the chain of polyisobutylene becomes flexible, so that the effect of the step difference absorption performance can be easily realized.
전체 고무계 점착제 조성물 100중량%에 대해서 상기 폴리이소부틸렌을 약 10중량% 내지 약 50중량%를 포함할 수 있다. 상기 고무계 점착제 조성물은 폴리이소부틸렌을 포함함으로써, 점착제 조성물에 적용되는 온도와 관계없이 고무계 점착제 조성물의 저장탄성율을 낮게 유지할 수 있다.And about 10% by weight to about 50% by weight of the polyisobutylene based on 100% by weight of the whole rubber-based pressure-sensitive adhesive composition. Since the rubber-based pressure-sensitive adhesive composition contains polyisobutylene, the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition can be kept low regardless of the temperature applied to the pressure-sensitive adhesive composition.
구체적으로, 상기 폴리이소부틸렌을 전체 고무계 점착제 조성물 100중량%에 대해서 약 10중량% 미만으로 포함하는 경우 상기 고무계 점착제 조성물을 포함한 점착필름의 성형이 제대로 이루어 지지 않을 우려가 있고, 약 50중량%를 초과하여 포함하는 경우 점착필름의 형태가 고르지 않은 문제점이 있는바, 상기 범위를 유지함으로써 점착필름의 성형을 용이하게 할 수 있다.
Specifically, when the polyisobutylene is contained in an amount of less than about 10% by weight based on 100% by weight of the total rubber-based pressure-sensitive adhesive composition, there is a possibility that the pressure-sensitive adhesive film containing the rubber- , There is a problem that the shape of the adhesive film is uneven. By keeping the above range, the molding of the adhesive film can be facilitated.
상기 폴리이소부틸렌 외에 열경화제를 추가로 포함할 수 있다. 상기 열경화제는 폴리이소부틸렌과 상용성이 좋은 자외선 경화형 수지를 포함할 수 있다. 예를 들어, 아크릴레이트 수지, 메타아크릴레이트 수지, 이소시아네이트 수지, 멜라민 수지, 우레탄 수지, 에폭시 수지, 산 무수화물, 폴리아민수지 및 카르복시기 포함 중합체 중에서 선택 될 수 있다.
In addition to the polyisobutylene, a thermosetting agent may be further included. The thermosetting agent may include an ultraviolet curable resin having good compatibility with polyisobutylene. For example, it may be selected from an acrylate resin, a methacrylate resin, an isocyanate resin, a melamine resin, a urethane resin, an epoxy resin, an acid anhydride, a polyamine resin and a polymer containing a carboxyl group.
상기 폴리이소부틸렌 100중량부에 대하여 상기 열경화제를 약 1중량부 내지 약 10중량부 포함할 수 있다. 상기 폴리이소부틸렌 100중량부에 대하여 열경화제를 상기 범위로 포함함으로써 폴리이소부틸렌 구조 내의 이중결합이 열개시제와 반응한다는 점에서 유리하여 경화도를 향상시킬 수 있고, 상기 범위를 벗어나는 경우 미반응 열경화제가 많이 남게되어 고무계 점착제 조성물의 물성에 악영향을 줄 수 있다.
About 1 part by weight to about 10 parts by weight of the thermosetting agent may be added to 100 parts by weight of the polyisobutylene. By including the thermosetting agent within the above range with respect to 100 parts by weight of the polyisobutylene, the double bond in the polyisobutylene structure is advantageous in that it reacts with the thermal initiator, so that the degree of curing can be improved. A large amount of a thermosetting agent remains, which may adversely affect the physical properties of the rubber-based pressure-sensitive adhesive composition.
상기 폴리이소부틸렌 외에 광개시제를 추가로 포함할 수 있다. 상기 광개시제는 벤조인계 개시제, 히드록시 케톤계 개시제, 아미노 케톤계 개시제 카프로락탐 및 이들의 조합으로 이루어진 군으로부터 선택된 하나 이상일 수 있다. In addition to the polyisobutylene, a photoinitiator may be further included. The photoinitiator may be at least one selected from the group consisting of a benzoin-based initiator, a hydroxyketone-based initiator, an amino ketone-based initiator caprolactam, and combinations thereof.
상기 광개시제의 예로는 벤조인메틸에테르, 2,4,6-트리메틸벤조일 디페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일) 페닐포스핀옥사이드, α,α-메톡시-α-하이드록시아세토페논, 2-벤조일-2-(디메틸아미노)-1-[4-(4-몰포닐) 페닐]-1-부타논 및 2,2-디메톡시-2-페닐아세토페논으로 이루어진 군으로부터 선택된 하나 이상을 들 수 있다.
Examples of the photoinitiator include benzoin methyl ether, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide,?,? -Methoxy-? From the group consisting of 2-benzoyl-2- (dimethylamino) -1- [4- (4-morpholyl) phenyl] -1-butanone and 2,2-dimethoxy- One or more selected.
상기 폴리이소부틸렌 100중량부에 대하여 상기 광개시제를 약 0.05중량부 내지 약 3중량부 포함할 수 있다. 상기 폴리이소부틸렌 100중량부에 대하여 광개시제를 상기 범위로 포함함으로써 특정 파장의 UV램프를 사용하여 경화가 가능하다는 점에서 유리하며 광개시제 함량 조절을 통해 경화도를 향상시킬 수 있다.
About 0.05 part by weight to about 3 parts by weight of the photoinitiator may be added to 100 parts by weight of the polyisobutylene. By including the photoinitiator within the above range with respect to 100 parts by weight of the polyisobutylene, it is advantageous in that it can be cured using a UV lamp having a specific wavelength, and the degree of curing can be improved by controlling the photoinitiator content.
약 30℃에서의 상기 고무계 점착제 조성물 저장탄성율과 약 60℃에서의 상기 고무계 점착제 조성물 저장탄성율의 차이가 약 0.1Mpa 이하일 수 있다. The difference between the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at about 30 ° C and the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at about 60 ° C may be about 0.1 Mpa or less.
상온, 즉 약 20℃ 내지 약 30℃에서의 고무계 점착제 조성물 저장탄성율과 고온, 즉 약 60℃ 내지 약 70℃에서의 고무계 점착제 조성물의 저장탄성율은 동일 또는 유사할 수 있고, 각각의 온도에서의 저장탄성율 차이는 약 0.1Mpa이하인바, 상기 고무계 점착제 조성물을 사용한 점착필름의 공정이 주로 상온에서 이루어짐에도 불구하고, 상온에서도 고온에서도 동일 또는 유사한 저장탄성율을 가짐으로써 단차를 잘 흡수하여 메꿀 수 있고, 고온에서 기포가 발생하지 아니한다는 점에서 고온과 상온에서 저장탄성율의 차이가 큰 고무계 접착제 조성물 보다 단차 흡수성능 면에서 유리하다.
The rubber-based pressure-sensitive adhesive composition storage elastic modulus at room temperature, i.e., from about 20 ° C to about 30 ° C, and the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at high temperature, that is, from about 60 ° C to about 70 ° C may be the same or similar, The difference in elastic modulus is about 0.1 Mpa or less. Even though the process of the pressure-sensitive adhesive film using the rubber-based pressure-sensitive adhesive composition is mainly carried out at room temperature, it has the same or similar storage elastic modulus at room temperature or high temperature, It is advantageous in terms of level difference absorption performance over a rubber adhesive composition having a large difference in storage elastic modulus at a high temperature and a normal temperature.
예를 들어, 양자 고무계 점착제 조성물 저장탄성율이 동일하게 유지되어 차이가 약 0인 경우, 상기 고무계 점착제 조성물은 외부 온도에 관계 없이 우수한 단차흡수성능을 가지는 것으로, 인쇄층 상부에 고무계 점착제 조성물을 도포하는 경우에 인쇄층으로 인한 단차를 깔끔하게 매꿀 수 있다.
For example, when the storage elastic modulus of the quantum rubber-based pressure-sensitive adhesive composition is kept the same, and the difference is about 0, the rubber-based pressure-sensitive adhesive composition has excellent step-difference absorption performance regardless of the external temperature. The step due to the printing layer can be neatly cleaned.
또한, 이소부틸렌과 소량의 이소프렌의 공중합체로 구성되어 있는 부틸고무를 포함하는 고무계 점착제 조성물의 경우 고온에서도 저온에서도 폴리이소부틸렌을 포함한 고무계 점착제 조성물 보다 저장탄성율이 높아 단차흡수능이 우수하지 못하였다.
Further, in the case of a rubber-based pressure-sensitive adhesive composition comprising a butyl rubber composed of a copolymer of isobutylene and a small amount of isoprene, the storage elasticity is higher than that of a rubber-based pressure-sensitive adhesive composition containing polyisobutylene even at a low temperature, Respectively.
나아가, 부틸고무에 올레핀계 수지를 혼합하여 사용하는 경우, 고온에서의 저장탄성율은 폴리이소부틸렌을 포함한 고무계 점착제 조성물 보다 낮았지만, 저온에서의 저장탄성율보다는 높아, 온도에 따라 저장탄성율이 달라지는바, 단차흡수성능이 일정하게 유지되지 못함을 알 수 있었다. 그러므로, 상기 고무계 점착제 조성물은 폴리이소부틸렌을 포함함으로써, 상온 뿐만 아니라 고온에서도 고무계 점착제 조성물의 저장탄성율을 낮게 유지할 수 있다.
Further, when the butyl rubber is mixed with the olefin resin, the storage elastic modulus at high temperature is lower than that of the rubber-based pressure sensitive adhesive composition containing polyisobutylene, but is higher than the storage elastic modulus at low temperature, It was found that the step difference absorption performance was not maintained constant. Therefore, since the rubber-based pressure-sensitive adhesive composition contains polyisobutylene, the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition can be kept low not only at room temperature but also at high temperature.
상기 고무계 점착제 조성물의 저장탄성율(G’, storage modulus)이 30℃에서 약 0.09MPa 내지 약 0.2MPa일 수 있다. 또한, 상기 고무계 점착제 조성물의 저장탄성율(G’)이 60℃에서 약 0.09MPa 내지 약 0.2MPa일 수 있다. 상기 고무계 점착제 조성물의 저장탄성율이 상온 및 고온에서 상기 범위를 유지함으로써 높은 단차흡수능 및 고온 고습조건 하에서 우수한 내구성을 가질 수 있다.The rubber-based pressure-sensitive adhesive composition may have a storage modulus (G ') of about 0.09 MPa to about 0.2 MPa at 30 ° C. Also, the rubber-based pressure-sensitive adhesive composition may have a storage elastic modulus (G ') of about 0.09 MPa to about 0.2 MPa at 60 ° C. By maintaining the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at room temperature and high temperature within the above range, it is possible to obtain excellent durability under high temperature and high humidity conditions.
상기 저장탄성율은 동적 탄성률이라고 하는바, 온도, 주파수, 진동의 함수를 도출하는 동적기계분석법(Dynamic Mechanical Analysis, DMA/DMTA)을 통해 저장탄성율을 측정할 수 있다. 또는 압축모드로 압력(strain)을 가하여 각주파수(angular frequency)를 주어 측정하는 ARES(Advanced Rheometric Expansion System)을 사용하여 저장탄성율을 측정할 수 있다. The storage elastic modulus is referred to as a dynamic elastic modulus, and the storage elastic modulus can be measured by Dynamic Mechanical Analysis (DMA / DMTA) that derives a function of temperature, frequency, and vibration. Or an ARES (Advanced Rheometric Expansion System) measuring the angular frequency by applying a strain in a compression mode to measure the storage modulus.
약 30℃ 및 약 60℃에서 상기 고무계 점착제 조성물의 저장탄성율을 상기 범위로 유지함으로써 상기 고무계 점착제 조성물을 포함하는 점착필름의 공정이 상온에서 이루어지는바, 상온에서도 고온에서와 같은 낮은 모듈러스를 가져 인쇄 단차를 잘 흡수한다라는 점에서 유리하며, 별도의 특정 조건을 주지 않더라도 온도에 관계없이 단차 흡수능이 향상된 효과를 확보할 수 있다. By maintaining the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition within the above range at about 30 ° C and about 60 ° C, the pressure-sensitive adhesive film containing the rubber-based pressure-sensitive adhesive composition is produced at room temperature. As a result, And it is possible to secure an effect of improving the step absorption ability regardless of the temperature even if no specific condition is given.
상기 고무계 점착제 조성물로 형성된 점착제층의 박리력이 약 800g/in 내지 약 1300g/in일 수 있다. 상기 점착제 조성물을 경화함으로써 점착제층을 형성할 수 있는바, 형성된 점착제층의 박리력을 측정할 수 있다. The peel strength of the pressure-sensitive adhesive layer formed from the rubber-based pressure-sensitive adhesive composition may be from about 800 g / in to about 1300 g / in. Since the pressure-sensitive adhesive layer can be formed by curing the pressure-sensitive adhesive composition, the peeling force of the pressure-sensitive adhesive layer formed can be measured.
구체적으로, 상기 점착제층이 상기 범위의 박리력을 유지함으로써 고무계 점착제 조성물을 사용했음에도 불구하고 점착증진제 없이도 상기 박리력의 범위를 유지할 수 있고, 유리 및 플라스틱 기재에 탈착 등의 문제가 없다는 점에서 유리하다. 상기 박리력은 하기 실험예와 같은 방법으로 측정할 수 있다.
Specifically, the pressure-sensitive adhesive layer maintains the peeling force within the above range, so that the range of the peeling force can be maintained even without using the pressure-sensitive adhesive, even though the rubber-based pressure-sensitive adhesive composition is used, Do. The peeling force can be measured in the same manner as in the following Experimental Example.
구체적으로, 상기 점착제층의 두께는 약 10㎛ 내지 약 70㎛일 수 있다. 상기 점착제층의 두께를 상기 범위로 유지함으로써 충분한 점착력을 확보할 수 있고, 공정 조건을 안정하게 유지할 수 있다. 나아가, 상기 점착제 조성물 및 점착제층은 광학소자용으로 OLED 및 터치스크린의 전자재료에 사용될 수 있다.
Specifically, the thickness of the pressure-sensitive adhesive layer may be about 10 μm to about 70 μm. By maintaining the thickness of the pressure-sensitive adhesive layer within the above range, a sufficient adhesive force can be secured and the process conditions can be stably maintained. Further, the pressure-sensitive adhesive composition and the pressure-sensitive adhesive layer can be used for the electronic material of the OLED and the touch screen for the optical element.
이하에서는 본 발명의 구체적인 실시예들을 제시한다. 다만, 하기에 기재된 실시예들은 본 발명을 구체적으로 예시하거나 설명하기 위한 것에 불과하며, 이로서 본 발명이 제한되어서는 아니된다.
Hereinafter, specific embodiments of the present invention will be described. However, the embodiments described below are only intended to illustrate or explain the present invention, and thus the present invention should not be limited thereto.
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실시예Example
및 And
비교예Comparative Example
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하기 표 1에 고무계 점착제 조성물의 실시예 및 비교예를 나타내었다.
Examples of the rubber-based pressure-sensitive adhesive composition and comparative examples are shown in Table 1 below.
(분자량 1,500kg/mol)PIB 30 wt%
(Molecular weight 1,500 kg / mol)
(분자량 1,800kg/mol)PIB 50 wt%
(Molecular weight 1,800 kg / mol)
(분자량 1,300kg/mol)
(Molecular weight 1,300 kg / mol)
및 올레핀계 수지 40중량%
And 40% by weight of an olefin resin
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실험예Experimental Example
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고무계Rubber system
점착제 조성물의 물리적 특성 Physical properties of the pressure-sensitive adhesive composition
상기 실시예 및 비교예의 고무계 점착제 조성물을 제조하였다. 용제로서 톨루엔을 혼합하여 코팅액을 준비하고, 상기 코팅액이 이형처리된 폴리에틸렌테레프 탈레이트 필름(두께: 75 ㎛)에 UV 경화 후 점착제층의 두께가 50㎛가 되도록 바코터를 이용하여 코팅하였다. 이 후, UV 램프를 이용하여 자외선을 10 분 동안 조사하여 경화시킴으로써 점착 필름을 제조하였다.
The rubber-based pressure-sensitive adhesive compositions of the above Examples and Comparative Examples were prepared. The coating liquid was prepared by mixing toluene as a solvent, and the polyethylene terephthalate film (thickness: 75 占 퐉) having the coating liquid was subjected to UV curing and coated with a bar coater so that the thickness of the pressure sensitive adhesive layer became 50 占 퐉. Thereafter, an ultraviolet ray was irradiated for 10 minutes using a UV lamp to cure, thereby producing an adhesive film.
1) 단차 흡수능: 10㎛ 내지 15㎛의 높이로 인쇄단차가 각기 다르게 인쇄된 유리(Glass)에 상기 실시예 및 비교예의 점착필름을 부착 후 또 다른 유리(Glass)를 합지하여 버블(Bubble)의 발생정도를 측정하였다. 이때, 상기 실시예 및 비교예의 점착필름 두께 대비 버블(Bubble)이 발생되지 않는 인쇄단차를 상대비교하여 단차 흡수능을 측정하였다.
1) Step absorption ability: Adhesive films of the above-mentioned examples and comparative examples were adhered to glass printed with different printing steps at a height of 10 탆 to 15 탆, and another glass was laminated to form a bubble The degree of occurrence was measured. At this time, the step difference absorption performance was measured by comparing the printed steps that did not generate bubbles relative to the thickness of the adhesive films of the examples and the comparative examples.
2) 박리력 측정: 상기 실시예 및 비교예의 점착필름을 25mmX40mm (가로X세로)로 제작하여, 상기 점착필름을 무처리 PET상에 2kg 롤러로 1 왕복하여 부착하고, 상기 부착된 점착 필름면에 대하여 180° 방향으로 300mm/분으로 잡아당겨 박리시킬 때의 박리력을 측정하였다.
2) Peeling force measurement: The pressure-sensitive adhesive films of the examples and comparative examples were made to be 25 mm x 40 mm (width X length), and the pressure-sensitive adhesive films were attached to the untreated PET with one round of 2 kg rollers, Was peeled off at 180 mm in the direction of 300 mm / min to measure the peeling force.
3) 저장탄성율 : ARES G2를 사용하고, 각주파수(Angular frequency) 1rad/sec, 변형율(Strain 10%), 온도 -20℃ 내지 100℃의 조건하에서 상기 점착제층을 적층한 압축모드(Compression mode)로 저장탄성율을 측정하였다.
3) Storage elastic modulus: Compression mode in which the pressure-sensitive adhesive layer is laminated under conditions of ARES G2, angular frequency of 1 rad / sec, strain (strain 10%) and temperature of -20 캜 to 100 캜, To measure the storage modulus.
분자량이 1,500kg/mol 이상인 폴리이소부틸렌을 포함하는 실시예 1 및 2의 경우, 저장탄성율이 상온 및 고온에서 일정하게 낮은상태로 측정되었는바, 단차흡수능이 탁월하게 우수하였다. 또한 일정수준 이상의 박리력을 확보하였는바, 점착성능 또한 우수함을 알 수 있었다.
In the case of Examples 1 and 2 including polyisobutylene having a molecular weight of 1,500 kg / mol or more, the storage elastic modulus was measured at a constant low temperature at room temperature and high temperature, and the step absorption ability was excellent. In addition, it was found that the peel strength was more than a certain level, and the adhesive performance was also excellent.
반면, 분자량이 1,500kg/mol 미만인 폴리이소부틸렌을 포함하는 비교예 1 및 부틸고무를 포함하는 비교예3의 경우 상온 및 고온에서 저장탄성율이 실시예 1 및 2에 비해 높았는바, 단차흡수능이 우수하지 아니하였다. On the other hand, in Comparative Example 1 containing polyisobutylene having a molecular weight of less than 1,500 kg / mol and Comparative Example 3 containing butyl rubber, the storage elastic modulus at room temperature and high temperature was higher than those of Examples 1 and 2, It was not excellent.
또한, 비교예 2의 경우 점착제 조성물에 폴리올레핀계 수지를 투입하였는바, 상기 올레핀계 수지가 가소제의 역할을 함으로써, 점착제 조성물의 전체적인 저장탄성율을 낮추는 것이 아니라, 상온에서는 높은 저장탄성율을 고온에서는 낮은 저장탄성율을 가지게 함으로써 온도에 따라 단차흡수 성능을 달라지게 하였다.
In addition, in the case of Comparative Example 2, when the polyolefin-based resin is added to the pressure-sensitive adhesive composition, the olefin-based resin serves as a plasticizer so that the storage elastic modulus of the pressure- The modulus of elasticity was varied so that the step difference absorption performance varied depending on the temperature.
도 1은 실시예1, 비교예 2 및 3의 측정된 저장탄성율을 그래프로 나타낸 것으로, 도 1을 참고하면, 실시예 1의 저장탄성율이 상온 및 고온에서 일정하게 유지되었는바 이를 통해 분자량이 1,500kg/mol이상인 폴리이소부틸렌을 포함하는 고무계 점착제 조성물을 포함한 실시예 1의 점착필름이 단차흡수능이 탁월함을 확인할 수 있다. 1 is a graph showing the measured storage elastic moduli of Example 1, Comparative Examples 2 and 3. Referring to FIG. 1, the storage elastic modulus of Example 1 was kept constant at room temperature and high temperature, the pressure-sensitive adhesive film of Example 1 including the rubber-based pressure-sensitive adhesive composition comprising polyisobutylene having a weight-average molecular weight of not less than 10 kg / mol can be confirmed to be excellent in step absorption ability.
Claims (10)
고무계 점착제 조성물.
Containing polyisobutylene having a molecular weight of 1,500 kg / mol or more
Based pressure-sensitive adhesive composition.
상기 폴리이소부틸렌은 이소부틸렌의 중합체인
고무계 점착제 조성물.
The method according to claim 1,
The polyisobutylene is a polymer of isobutylene
Based pressure-sensitive adhesive composition.
전체 고무계 점착제 조성물 100중량%에 대해서 상기 폴리이소부틸렌을 10중량% 내지 50중량%를 포함하는
고무계 점착제 조성물.
The method according to claim 1,
A pressure-sensitive adhesive composition comprising 100% by weight of a total rubber pressure-sensitive adhesive composition and 10% by weight to 50% by weight of the polyisobutylene
Based pressure-sensitive adhesive composition.
상기 폴리이소부틸렌 외에 열경화제 및 광개시제를 추가로 포함하는
고무계 점착제 조성물.
The method according to claim 1,
In addition to the polyisobutylene, a thermosetting agent and a photoinitiator
Based pressure-sensitive adhesive composition.
상기 폴리이소부틸렌 100중량부에 대하여 상기 열경화제를 1중량부 내지 10중량부 포함하는
고무계 점착제 조성물.
5. The method of claim 4,
Wherein the thermosetting agent is contained in an amount of 1 to 10 parts by weight based on 100 parts by weight of the polyisobutylene,
Based pressure-sensitive adhesive composition.
상기 폴리이소부틸렌 100중량부에 대하여 상기 광개시제를 0.05중량부 내지 3중량부 포함하는
고무계 점착제 조성물.
5. The method of claim 4,
Wherein the photoinitiator is contained in an amount of 0.05 to 3 parts by weight based on 100 parts by weight of the polyisobutylene,
Based pressure-sensitive adhesive composition.
30℃에서의 상기 고무계 점착제 조성물 저장탄성율과 60℃에서의 상기 고무계 점착제 조성물 저장탄성율의 차이가 0.1이하인
고무계 점착제 조성물.
The method according to claim 1,
The difference between the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at 30 DEG C and the storage elastic modulus of the rubber-based pressure-sensitive adhesive composition at 60 DEG C is not more than 0.1
Based pressure-sensitive adhesive composition.
상기 고무계 점착제 조성물의 저장탄성율(G’)이 30℃에서 0.09MPa 내지 0.2MPa인
고무계 점착제 조성물.
The method according to claim 1,
(G ') of the rubber-based pressure-sensitive adhesive composition is from 0.09 MPa to 0.2 MPa at 30 캜.
Based pressure-sensitive adhesive composition.
상기 고무계 점착제 조성물의 저장탄성율(G’)이 60℃에서 0.09MPa 내지 0.2MPa인
고무계 점착제 조성물.
The method according to claim 1,
Wherein the rubber-based pressure-sensitive adhesive composition has a storage elastic modulus (G ') of from 0.09 MPa to 0.2 MPa
Based pressure-sensitive adhesive composition.
상기 고무계 점착제 조성물로 형성된 점착제층의 박리력이 800g/in 내지 1300g/in인
고무계 점착제 조성물. The method according to claim 1,
Wherein the pressure-sensitive adhesive layer formed from the rubber-based pressure-sensitive adhesive composition has a peeling strength of 800 g / in to 1300 g / in
Based pressure-sensitive adhesive composition.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20170089096A (en) * | 2016-01-25 | 2017-08-03 | 주식회사 엘지화학 | Rubber adhesive composition with excellent heat stability |
| WO2017183833A1 (en) * | 2016-04-22 | 2017-10-26 | 주식회사 엘지화학 | Optical adhesive composition and optical adhesive layer containing cured product thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170089096A (en) * | 2016-01-25 | 2017-08-03 | 주식회사 엘지화학 | Rubber adhesive composition with excellent heat stability |
| WO2017183833A1 (en) * | 2016-04-22 | 2017-10-26 | 주식회사 엘지화학 | Optical adhesive composition and optical adhesive layer containing cured product thereof |
| JP2019508566A (en) * | 2016-04-22 | 2019-03-28 | エルジー・ケム・リミテッド | Optical pressure-sensitive adhesive composition and optical pressure-sensitive adhesive layer containing the cured product |
| US10647894B2 (en) | 2016-04-22 | 2020-05-12 | Lg Chem, Ltd. | Adhesive composition for optical use and adhesive layer for optical use comprising cured product thereof |
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