KR20150012723A - Apparatus for recognizing wafer's mark - Google Patents

Apparatus for recognizing wafer's mark Download PDF

Info

Publication number
KR20150012723A
KR20150012723A KR1020130088595A KR20130088595A KR20150012723A KR 20150012723 A KR20150012723 A KR 20150012723A KR 1020130088595 A KR1020130088595 A KR 1020130088595A KR 20130088595 A KR20130088595 A KR 20130088595A KR 20150012723 A KR20150012723 A KR 20150012723A
Authority
KR
South Korea
Prior art keywords
mark
wafer
reflecting
reflection mirror
recognizing
Prior art date
Application number
KR1020130088595A
Other languages
Korean (ko)
Inventor
배재현
Original Assignee
주식회사 엘지실트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지실트론 filed Critical 주식회사 엘지실트론
Priority to KR1020130088595A priority Critical patent/KR20150012723A/en
Publication of KR20150012723A publication Critical patent/KR20150012723A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

According to the embodiment, the wafer mark recognizing device for recognizing marks engraved on each wafer accommodated in a cassette includes: a mark reflecting mirror for reflecting a mark engraved on the wafer; a video photographing portion for photographing a mark reflected from the mark reflecting mirror; And a robot arm that mounts a reflective mirror and an image capturing unit and draws a mark reflecting mirror into a cassette so that a mark reflective mirror approaches the mark of the wafer.

Description

[0001] Apparatus for recognizing wafer marks [

An embodiment relates to a wafer mark recognition apparatus.

1 is a view schematically showing an existing wafer mark recognition apparatus.

Referring to FIG. 1, the conventional wafer mark recognition apparatus 10 includes robot arms 32 and 34 and a camera 40.

The wafers 20, 22, 24 display their own identification in the form of a mark on the front or back side. The conventional wafer mark recognizing apparatus 10 uses the robot arm 32 to identify these marks so that the wafers 22 and 24 housed in the corresponding ports 52 and 54 of the two ports 52 and 54, And transfers the gripped wafers 22 and 24 to the mark recognition stage (not shown) in the direction of the arrow 60. [

Thereafter, a mark engraved on the wafer 20 is photographed using the camera 40, and the mark of the wafer 20 gripped through the photographed result is recognized. In this way, in order to recognize a mark engraved on the wafer 20, the robot arm 32 grasps the wafers 22 and 24. [ Therefore, there is a problem that damage such as scratch may be caused in the portion where the robot arm 32 grasps the wafers 20, 22, 24, or contamination may be caused by particles or metal.

The embodiment provides a wafer mark recognizing device capable of recognizing a mark engraved on a wafer without grasping the wafer.

According to the embodiment, the wafer mark recognizing device for recognizing a mark engraved on each of the wafers accommodated in the cassette includes: a mark reflecting mirror for reflecting the mark engraved on the wafer; An image capturing unit for capturing the mark reflected from the mark reflection mirror; And a robot arm mounting the mark reflection mirror and the imaging section and drawing the mark reflection mirror into the cassette so that the mark reflection mirror approaches the mark of the wafer.

The width of the mark reflective mirror may be less than the spacing between neighboring wafers housed in the cassette.

The mark reflecting mirror includes a reflecting surface for reflecting the mark; And a coupling surface coupled to the robot arm.

The reflective surface may be a flat surface or a curved surface.

The image capturing unit may recognize the photographed mark. Alternatively, the wafer mark recognizing device may further comprise: a cable for transmitting the result of the image picked up by the image pickup unit as an electrical signal; And a mark recognizer for recognizing the mark by analyzing the electrical signal transmitted through the cable.

The reflected mark may be a general mark spaced apart from the notch of the wafer by a predetermined distance, or may be at least one of a general mark and an orientation mark.

The wafer mark recognition apparatus further includes a translucent lens disposed between the mark reflection mirror and the image pickup section and mounted on the robot arm to transmit the mark reflected from the mark reflection mirror to the image pickup section can do.

The wafer mark recognizing apparatus according to the embodiment does not need to grasp the wafer because the wafer mark recognizing apparatus indirectly photographs the wafer mark and recognizes it indirectly through the mark reflecting mirror unlike the conventional method of directly photographing the mark of the wafer. Therefore, defects such as scratches of the wafer, In contrast to the conventional wafer mark recognition apparatus which can prevent contamination of wafers from particles or metals and recognize marks of transferred wafers after they have been moved to the mark recognition stage after grasping the wafers, Since the marks are recognized by inserting the mark reflection mirror into the gap between the wafers, the marks engraved on the wafers can be recognized much earlier than before, and the process time based on the mark recognition can be shortened to improve the productivity. Further, The mark recognition device of It may also reduce the space occupied.

1 is a view schematically showing an existing wafer mark recognition apparatus.
2 is a view schematically showing an apparatus for recognizing a wafer mark according to an embodiment.
Figs. 3A and 3B show plan views of wafers engraved with marks. Fig.
FIG. 4 shows an enlarged view of the 'A' portion of FIG. 2 according to an embodiment of the present invention.
FIG. 5 is a view showing another embodiment of the enlarged view of the 'A' portion shown in FIG. 2. FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to facilitate understanding of the present invention. However, the embodiments according to the present invention can be modified into various other forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the invention are provided to more fully describe the present invention to those skilled in the art.

2 is a view schematically showing an apparatus for recognizing a wafer mark according to an embodiment.

2, the apparatus for recognizing a wafer mark according to the embodiment includes a mark reflecting mirror 130, an image capturing unit 140, and a robot arm 150. [

The wafer 120 may be received in a cassette 110 in the form of a bundle. Here, although only one cassette 110 is shown, a plurality of cassettes may be arranged. For example, as many as twenty-five wafers 120 can be accommodated in the cassette 110 at the same time, the embodiment is not limited to this. Each wafer 120 can be fit and accommodated in the groove 110A of the cassette 110 as illustrated in FIG. 2, but the embodiment is not limited to this accommodated form of the wafer 120.

When the robot arm 150 is loaded between the wafers 120 of the cassette 110, the mark reflection mirror 130 may reflect the mark engraved on the wafer 120 to the image pickup unit 140 .

Figs. 3A and 3B show plan views of wafers 120A and 120B marked with marks. The wafers 120A and 120B are embodiments of the wafer 120 illustrated in Fig.

3A, the mark reflected by the mark reflecting mirror 130 is a regular mark M1 (M1) spaced apart by a predetermined distance DELTA d1, for example, 8.22 mm from the notch 122 of the wafer 120A. ). Here, the general mark is a mark indicating general information on the wafer 120A. For example, as general information, there may be a specification of the wafer 120A, an identification (or a unique number), a grade, a manufacturing number, or user data based on user necessity.

3B, the mark reflected by the mark reflection mirror 130 may be the orientation mark M2 in addition to the general mark M1 described above. Here, the orientation mark M2 means a mark for indicating the crystal orientation of the wafer 120B. This orientation mark M2 indicates the crystal orientation of the wafer 120B instead of the notch 122. [ That is, when the orientation mark M2 is engraved on the wafer 120B, a notch is not necessary. The bearing mark M2 may have the form of at least one of a symbol, a number, or a figure (?,?,?,?,?). In addition, the bearing mark M2 may have a size and shape that can be visually recognized, and may have a size and shape that can be read by an optical reader.

One of the existing techniques for laser marking the crystal orientation without using the orientation flat or the notch is disclosed in Japanese Patent Laid-Open Publication No. JP1994-124996 (published on May 6, 1994).

In Fig. 3B, the general mark M1 may be inscribed as a bar code at a position spaced apart from the orientation mark M2 by a predetermined distance? D2, for example, 2 mm to 10 mm, in order to be distinguished from the orientation mark M2.

3A and 3B, the marks M1 and M2 are shown engraved on the front side of the wafers 120A and 120B, but the embodiments are not limited thereto. That is, the marks M1 and M2 may be engraved on the back or edge side of the wafers 120A and 120B, not on the front surfaces of the wafers 120A and 120B.

3A and 3B, the notch 122, the common mark M1 and the orientation mark M2 are not the effective portions 120A-1 and 120B-1 of the wafers 120A and 120B, May be disposed in the ineffective portions 120A-2 and 120B-2, but the embodiments are not limited thereto. Here, the ineffective portions 120A-2 and 120B-2 refer to portions of the wafer 110 that are not covered by the quality assurance.

FIGS. 4 and 5 show views of the embodiments A1 and A2 in which the 'A' portion shown in FIG. 2 is enlarged. Here, reference numerals 130A and 130B denote embodiments of the mark reflecting mirror 130 shown in FIG.

2, 4 and 5, the width w1 of the mark reflecting mirrors 130, 130A, and 130B is equal to the distance between the neighboring wafers 120-1 and 120-2 housed in the cassette 110 (d) (or the width of the slot). If the width w1 of the mark reflecting mirrors 130, 130A and 130B is equal to or greater than the distance d, then the mark reflecting mirrors 130, 130A and 130B are adjacent to the adjacent wafers 120- 1 and 120-2, and the marks M1 and M2 can not be reflected. For this purpose, the cassette 110 can be manufactured such that the distance d between the grooves 110A can be greater than the width w1 of the mark reflecting mirrors 130, 130A, 130B.

Here, the width w1 is equal to or greater than the width of the mark reflection mirrors 130, 130A, and 130B as well as the width w2 of the portion 150A of the robot arm 150 disposed below the mark reflection mirrors 130, 130A, ). However, since the width w2 is smaller than the width of the mark reflecting mirrors 130, 130A, and 130B, the width w1 is assumed to be not included in the width w2 for convenience of explanation.

Generally, when the diameter of the wafer 120 is 450 mm, the distance d between adjacent wafers 120-1 and 120-2 is about 12 mm. In this case, the width w1 of the mark reflecting mirrors 130, 130A, and 130B may be less than 12 mm.

4 and 5, the mark reflective mirrors 130A and 130B include reflective surfaces 132A and 132B and a mating surface 134. [

The reflecting surfaces 132A and 132B serve to reflect the marks M1 and M2 engraved on the wafer 120-1 to the image capturing unit 140. [ The reflecting surface 132A may be a flat surface as illustrated in Fig. As described above, when the reflective surface 132A is a flat surface, the mark is reflected in the direction of the arrow 182 and can be photographed by the image capturing unit 140, as shown in FIG.

Alternatively, the reflecting surface 132B may be a curved surface as illustrated in Fig. When the reflective surface 132B is a curved surface as illustrated in FIG. 5, the reflective surface 132B has a curvature that is suitable for the marks M1 and M2 engraved on the wafer 120 to be reflected to the image capturing unit 140 (Or radius of curvature). When the reflecting surface 132B is a curved surface, as shown in FIG. 5, the mark may be reflected in the direction of the arrow 182 and photographed by the image capturing unit 140. In this case, the radius of curvature of the reflecting surface 132B can be determined so that a much clearer image can be taken when the reflecting surface 132A is a flat surface.

The coupling surface 134 is a surface coupled to the robot arm 150. The mirror reflection mirrors 130A and 130B can be mounted on the robot arm 150 through the coupling surface 134. [

The image photographing unit 140 photographs the marks M, M1 and M2 of the wafer 120-1 reflected from the mark reflecting mirror 130 in the arrow directions 182 and 184. The image capturing unit 140 may be implemented as an optical character reader (OCR) that photographs the marks M, M1, and M2 reflected from the mark reflecting mirror 130. [

According to one embodiment, the image capturing unit 140 itself can recognize (or read) the photographed marks M, M1, and M2.

According to another embodiment, the wafer mark recognizing apparatus may further include a cable 170 and a mark recognizing section 172 as illustrated in FIG. The cable 170 serves to transmit the photographed result of the image capturing unit 140 to the mark recognizing unit 172 as an electrical signal. The mark recognition unit 172 analyzes the electrical signal transmitted through the cable 170 and recognizes the marks M, M1, and M2 based on the analysis result.

Meanwhile, the robot arm 140 illustrated in FIGS. 2, 4, and 5 mounts the mark reflection mirrors 130, 130A, and 130B and the image capturing unit 140. The robotic arm 140 is also mounted on the cassette 110 so that the mark reflection mirrors 130, 130A and 130B approach the marks M, M1 and M2 of the wafers 120 and 120-1, 130A and 130B from the cassette 110 or unloading the mark reflection mirrors 130, 130A and 130B from the cassette 110. In addition,

The wafer mark recognizing apparatus illustrated in FIG. 2 may further include an arm driving unit 160. The arm driving unit 160 drives the robot arm 150 so that the mark reflecting mirrors 130, 130A and 130B enter between the neighboring wafers 120-1 and 120-2, 2).

In addition, not only the mark reflecting mirrors 130, 130A, 130B but also the image capturing section 140 may be drawn in the distance d between the neighboring wafers 120-1, 120-2, It does not.

A plurality of wafers 120 may be aligned with respect to the notches 122 or aligned with respect to the orientation mark M2 as illustrated in Fig. 3B and housed in the cassette 110 as illustrated in Fig. 3A. The arm driving unit 160 calculates the mark position of the wafer 120-1 on which the marks M1 and M2 are engraved using the position of the cassette 110 and the distance between the wafers 120-1 and 120-2 . Using the calculated result, the arm driving unit 160 can control the movement of the robot arm 150 so that the mark reflecting mirrors 130, 130A, and 130B approach the mark position of the cassette 110. [

Further, the wafer mark recognizing apparatus according to the embodiment may further include a translucent lens 190 as illustrated in FIG.

The translucent lens 190 is disposed between the mark reflecting mirror 130A and the image capturing unit 140 and can be mounted on the robot arm 150. [ The translucent lens 190 serves to transmit the mark reflected from the mark reflecting mirror 130A to the image capturing unit 140.

The translucent lens 190 may have a light transmittance of 40% to 60% so that the contrast and density of the transmitted mark become uniform. The translucent lens 190 may be arranged close to the mark reflection mirror 130A so that the mark reflected by the mark reflection mirror 130A can be emitted to the image pickup unit 140. [

As described above, when the mark reflected by the mark reflecting mirror 130A passes through the translucent lens 190, a mark having uniform brightness and density can be photographed by the image capturing unit 140. [

The conventional wafer mark recognition apparatus 10 shown in Fig. 1 grasps the wafers 20, 22 and 24 for transfer to a mark recognition stage in order to recognize marks engraved on the wafers 20. On the other hand, the wafer mark recognizing apparatus according to the above-described embodiment has the mark reflection mirrors 130, 130A, and 130B in the space d between the adjacent wafers 120-1 and 120-2 without holding the wafer 120 It is unnecessary to grasp the wafer 120 because the marks M, M1 and M2 are reflected and the reflected marks are photographed and photographed by the image photographing unit 140. [ Therefore, the apparatus for recognizing the wafer mark according to the embodiment has no contact with the wafer 120 for recognizing the marks M, M1 and M2 of the wafer 120, It is possible to prevent contamination of the wafer 120 from particles or metals as well as defects such as scratches.

In addition, while the conventional wafer mark recognition apparatus 10 grasps the wafers 22 and 24, moves to the mark recognition stage once and then recognizes the mark of the transferred wafer 20, The apparatus recognizes the marks M, M1, M2 by drawing the mark reflecting mirrors 130, 130A, 130B into the space d without grasping the wafer 120. [ Therefore, since the marks (M, M1, M2) engraved on the wafer 120 can be recognized much earlier than before, the process time based on the mark recognition can be shortened and the productivity can be improved.

Further, in the case of the wafer mark recognition apparatus according to the embodiment, a mark recognition stage in which the wafers 22 and 24 are once transferred to recognize the mark engraved on the wafers 20, 22 and 24 is unnecessary. Therefore, the space occupied by the wafer mark recognizing device can be reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

110: cassette 110A: cassette groove
120, 120-1, 120-2: wafer 122: notch
130: mark reflection mirror 140: image pickup section
150: Robot arm 160:
170: Cable 172: Mark recognition unit
190: Translucent lens

Claims (10)

A wafer mark recognizing apparatus for recognizing a mark engraved on each wafer accommodated in a cassette,
A mark reflecting mirror for reflecting the mark engraved on the wafer;
An image capturing unit for capturing the mark reflected from the mark reflection mirror; And
And a robot arm mounted with the mark reflection mirror and the image pickup section and drawing the mark reflection mirror into the cassette so that the mark reflection mirror approaches the mark of the wafer. 2. The wafer mark recognition apparatus of claim 1, wherein a width of the mark reflection mirror is smaller than an interval between neighboring wafers accommodated in the cassette. 2. The apparatus of claim 1, wherein the mark reflecting mirror
A reflecting surface for reflecting the mark; And
And a coupling surface coupled to the robot arm. The wafer mark recognition apparatus according to claim 3, wherein the reflective surface is a flat surface. The wafer mark recognition apparatus according to claim 3, wherein the reflective surface is a curved surface. The apparatus of claim 1, wherein the image capturing unit recognizes the photographed mark. The apparatus according to claim 1, wherein the wafer mark recognition device
A cable for transmitting an image signal obtained by the image capturing unit as an electrical signal; And
And a mark recognition unit for analyzing the electrical signal transmitted through the cable and recognizing the mark. The wafer mark recognition apparatus according to claim 1, wherein the reflected mark is a general mark spaced apart from the notch of the wafer by a predetermined distance. The apparatus according to claim 1, wherein the reflected mark is at least one of a general mark and an orientation mark. The lithographic apparatus according to claim 1, further comprising a translucent lens disposed between the mark reflection mirror and the image pickup section, the translucent lens being mounted on the robot arm and transmitting the mark reflected from the mark reflection mirror to the image pickup section Mark recognition device.
KR1020130088595A 2013-07-26 2013-07-26 Apparatus for recognizing wafer's mark KR20150012723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130088595A KR20150012723A (en) 2013-07-26 2013-07-26 Apparatus for recognizing wafer's mark

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130088595A KR20150012723A (en) 2013-07-26 2013-07-26 Apparatus for recognizing wafer's mark

Publications (1)

Publication Number Publication Date
KR20150012723A true KR20150012723A (en) 2015-02-04

Family

ID=52488698

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130088595A KR20150012723A (en) 2013-07-26 2013-07-26 Apparatus for recognizing wafer's mark

Country Status (1)

Country Link
KR (1) KR20150012723A (en)

Similar Documents

Publication Publication Date Title
JP4461203B2 (en) Stocker robot teaching method, stocker robot teaching apparatus, and recording medium
US8233696B2 (en) Simultaneous wafer ID reading
JP7183155B2 (en) Defect inspection method and apparatus on transparent substrate
CN105358961A (en) A surface feature manager
US20200298409A1 (en) Calibration method for robot arm and calibration device thereof
TW201738551A (en) Inspection device for transparent plate surface, inspection method of transparent plate surface, and manufacturing method of glass plate with improved inspection precision
CN103513494A (en) An optical device including a camera and a diaphragm
US20180100811A1 (en) Ferrule endface inspecting device and method for optical communication modules
JP2007322421A (en) Method and device for examining end face of light guide
JP6031751B2 (en) Glass substrate inspection apparatus and glass substrate manufacturing method
US6011586A (en) Low-profile image formation apparatus
KR20150012723A (en) Apparatus for recognizing wafer's mark
US20140354800A1 (en) Detection system and detection method
CN112927190A (en) Type-C multi-station multi-defect unified measurement system based on deep learning
US20120314050A1 (en) Imaging apparatus and control method therefor
US20220228852A1 (en) Apparatus and method for edge detection when machining workpieces
WO2019114760A1 (en) Imaging method, device and system
US20050276467A1 (en) Apparatus for real-time monitoring of a workpiece
JP2008128865A (en) Lead wire position detecting method and device
CN110168424B (en) Slide imaging apparatus
KR100697992B1 (en) Instructing method, instructing device and recording materials for stocker robot
JP5280918B2 (en) Shape measuring device
US20230358690A1 (en) Inspection tool and inspection method
US20230228648A1 (en) Apparatus and System for Visual Inspection of Fiber Ends and Image Analysis Tool for Detecting Contamination
CN214151179U (en) Lens barrel for camera module, camera module and electronic equipment

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E601 Decision to refuse application