KR20140134517A - Non-welding solder mount type shunt - Google Patents

Non-welding solder mount type shunt Download PDF

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Publication number
KR20140134517A
KR20140134517A KR1020130054501A KR20130054501A KR20140134517A KR 20140134517 A KR20140134517 A KR 20140134517A KR 1020130054501 A KR1020130054501 A KR 1020130054501A KR 20130054501 A KR20130054501 A KR 20130054501A KR 20140134517 A KR20140134517 A KR 20140134517A
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KR
South Korea
Prior art keywords
shunt
shunt body
body portion
current
kelvin sensing
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KR1020130054501A
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Korean (ko)
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유병길
소병일
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(주)에이치엔티
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Priority to KR1020130054501A priority Critical patent/KR20140134517A/en
Publication of KR20140134517A publication Critical patent/KR20140134517A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

The purpose of the present invention is to provide a non-welding solder mount type shunt. The composition of the present invention includes a shunt body part (22) connected to a current measurement circuit to allow a current to flow. The shunt body part (22) includes: a first shunt body part (22A); a second shunt body part (22B) connected to one end part of the first shunt body part (22A) and located in a position facing the first shunt body part (22A). Manufacture is facilitated without a welding part, and the costs are reduced using a self-jig use manufacturing method after the cutting process of Mn plate. Various current models can be applied by changing the thickness of the Mn plate without increasing additional costs to implement a sensing point because a kelvin sensing terminal is implemented in cutting the Mn plate as well.

Description

Non-welding solder mount type shunt

The present invention relates to a solderless solderless shunt, more particularly to a solderless solderless shunt which is easy to manufacture due to its lack of a welded part, Solder mount shunt which can be applied to various current models only by changing the thickness of the net signboard.

Generally, a shunt is basically an element used for measuring a current. A shunt is connected to an energizing circuit of an electric / electronic device, a voltage is measured using a resistance value generated when a current flows through the shunt, The voltage measurement makes it possible to measure the current. The voltage applied to both ends of the shunt is measured and converted into a current value to measure the current. At this time, the shunt may also be referred to as a classifier. The shunt is basically a resistor having a sufficiently low resistance as compared with the load. For example, a shunt having a resistance sufficiently lower than that of the motor is connected to the energizing circuit so that the current applied to the motor can be measured , Load voltage measurement and ultimate load current measurement. The shunt is a standard resistor to extend the current measurement range of the ammeter and is wired with an ammeter to allow the load current to be measured through an ammeter.

On the other hand, although the secondary battery is not permanent, it can be used by charging current repeatedly. Therefore, a secondary battery is often used as a power source for various electric and electronic devices such as a mobile phone, a PDA, and an MFP 4. For example, By mounting a shunt on the circuit configured for current measurement in the system, the current applied to the secondary battery battery system can be measured through the circuit and shunt. Although the secondary battery is employed in electric and electronic devices such as mobile phones, it is employed as a main power source for a hybrid vehicle or an electric vehicle, so it is important to measure the current for the secondary battery using the shunt.

A battery system used in an electric vehicle or a fuel cell vehicle such as the above-described hybrid vehicle includes a plurality of unit cells (secondary cells) connected in series to generate a voltage and generate high power using the voltage. In order to generate such power, a current of several tens to hundreds of amperes (A) flows through the battery system. As a method of measuring the current of the battery system, there is a method of measuring the current using a shunt resistor. That is, the current measurement can be performed by connecting the shunt to the circuit of the battery system.

On the other hand, the shunt can be regarded as a standard resistor used for current measurement, so that it can be a shunt resistor (standard resistance), so that accurate current measurement can be performed without distortion in current measurement.

In addition, heat is generated when the current flows through the shunt, and resistance increases when the heat is generated. Therefore, the initial resistance of the shunt and the resistance when the current flow, and the resistance after the shunt are used are not constant, It is important to design such that the resistance characteristic of the shunt is not changed (designed so as not to increase the resistance value).

Therefore, the shunt itself is made of manganese to manganese alloy in order to prevent the change of resistance value of the shunt by heat. That is, a metal such as a common copper increases its resistance when the heat is increased, but the manganese or manganese alloy maintains the resistance characteristic of resistance even when the heat rises, so the shunt is made of manganese or manganese alloy .

In addition, it is common that the resistance value changes by about 10,000 ppm when the resistance heat value increases by about 10 ° C. In the case of the shunt case, the constant current flows only when the heat value is about 15 to 50 ppm per 1 ° C, so that the current measurement accuracy can be guaranteed. If the calorific value changes by 1 ° C and the resistance change value of the shunt is changed to 1% or more based on the total resistance value, the shunt resistor (that is, the standard resistance) can not be used. Shunt can be used when the current change value specification of shunt should be within ± 0.2% ~ 0.5% in the range of 10 ℃ ~ 15 ℃ change of calorific value. When the current change value of the shunt at the low current becomes 1% or more based on the total current value, it can not be used as a shunt. That is, the current change value of the shunt should not be more than 1% at the low current.

However, in the related art, too much resistance is generated between the shunt and the circuit board in order to electrically connect the shunt to the circuit board for current measurement, and when too much resistance is generated, the current charging object, for example, There is a problem that the charging current of the secondary battery is measured to be too small. When the measured current of the secondary battery is measured to be too small, the secondary battery that is the object of charging may be charged with an excessive amount of current. As a result, . An excessively low current value is measured at the time of measuring the current of not only the secondary battery but also other elements or parts, and thus excessive current is charged in other parts or devices other than the secondary battery, thereby causing damage due to overcurrent Serious problems arise.

Specifically, as shown in Fig. 1, a shunt frame 2 for holding a shunt 1 for measuring a current, and a pair of copper materials arranged to face each other on the shunt frame 2 A bolt 4 for fixing the shunt bracket 3 to the shunt frame so as to be energetically connected to the circuit board and a shunt bracket 3 for fixing the shunt bracket 3 to the shunt bracket 3, And a shunt support unit including an electrically conductive connecting piece (which may be a metal piece or a wire) connected between the connecting bolt 5 and the circuit board, A current measuring device such as an ammeter is connected to both terminals of the shunt 1 via connecting means 7 such as electric wires in a state in which both ends of the shunt 1 are fixed to the shunt frame 2 facing each other by soldering soldering Connect the current It is cleansed.

The shunt current measurement structure includes a soldering resistor (soldering resistance of the substrate) for connecting the connecting bolt and the circuit board so as to be energized so as to constitute the current measuring shunt circuit, a resistance (connecting piece resistance) of the connecting piece itself, The resistance of the shunt bracket itself (the shunt bracket itself is made of copper and can be referred to as copper resistance by the shunt bracket itself, and the resistance of the shunt bracket itself is referred to as the copper resistance for convenience) A resistance (bolt resistance) of a bolt that fixes the bracket to the shunt support frame so that the bracket can be energized to the circuit board, a resistance (silver solder resistance) to the shunt bracket that fixes the end of the shunt to the shunt bracket, The resistance of the connecting piece, the first bolt resistance, the second bolt resistance, and the soldering solder resistance, The charging current of the secondary battery, which is the current charging / discharging target, is measured to be excessively small, and the measured current of the secondary battery is measured to be too small, so that the secondary battery is excessively charged The secondary battery is liable to be charged with a large amount of current, resulting in serious problems such as the secondary battery being blown.

Also, when the amount of heat generated by the resistor increases by about 10 DEG C, the resistance value changes by about 10,000 ppm. As described above, conventionally, the resistance value is significantly increased due to a considerable amount of heat generated in a place where the resistance is considerably large. there is a problem. In the case of shunt, the current measurement accuracy can be guaranteed only when the heating value is about 15 to 50 ppm per 1 ° C. If the shunt resistance value changes to 1% or more based on the total resistance value, the shunt resistance In other words, the resistance value can not be used as a standard resistance. In the past, since the resistance value is generated at a considerably large number of points, the resistance value is much more than 1%, and the shunt itself can not be used. In other words, when the shunt current change specification is within ± 0.2% ~ 0.5% in 10 ℃ ~ 15 ℃ range of change of calorific value and shunt current change value is 1% It is impossible to satisfy the requirement that the current change value specification should be within the range of ± 0.2% to 0.5% in the range of 10 ° C. to 15 ° C. change in the calorific value due to the resistance occurring at such a large number of places as described above, It is impossible to satisfy the condition that the current change value of the shunt should be within 1% based on the total current value, so that the shunt can not be used as a result.

Conventionally, both ends of the shunt are fixed to two opposing shunt brackets by silver solder. When a current flows in the shunt or current flow is interrupted, the shunt bracket itself is fixed with bolts, while the shunt itself A crack occurs in the soldering solder portion of the shunt due to an external impact or the like. When such a crack is generated, the resistance value is increased and the charging current of the current charging / discharging subject (secondary battery or the like) So that the above-mentioned various problems are caused. If a crack is released to the soldering solder portion between the shunt and the shunt bracket, the current can not be properly measured due to excessive rise of the resistance value, and the current of the secondary battery can not be properly charged and discharged. As a result, Resulting in discharge.

On the other hand, the shunt has a large capacity shunt that is used when the current measuring capacity is relatively high. Such a large capacity shunt (hereinafter referred to simply as " shunt for convenience ") is configured to be significantly larger than the width of the both-side portion where the widths of the side portions are orthogonal to each other (relatively larger than the side portions of the low- And the side portions of the shunt are set up in a vertical direction (a direction parallel to the vertical direction of the shunt bracket) while being fixed to two opposing shunt brackets by soldering.

However, when the shunt is installed upright in the vertical direction as described above, the current can not stably and uniformly flow, the current fluctuation phenomenon occurs depending on the relative position of the shunt, and the accurate measurement of the current can not be performed . In other words, when a current flows through the shunt, the shunt itself is also a resistance, and the soldering solder portion connecting both ends of the shunt to the shunt bracket is also a resistor. Since the shunt is a manganese or manganese alloy, the temperature of the soldering solder rises, When the temperature of the soldering portion rises, the length of the current flow circuit in which the current flows along the shunt increases while the soldering solder resistance rises. As the current flow circuit becomes long, the resistance fluctuates and the current fluctuates. A difficult problem arises. That is, the noise, which is a disturbance factor of the current measurement, is also amplified, resulting in a failure to accurately measure the current.

2, when a current flows through one shunt bracket 3 and a current passes through the silver solder 8 and the shunt 1 itself and flows through the other shunt bracket 3 When the current flows through the path denoted by C1 when the current flows in, the temperature of the portion of the silver solder 8 corresponding to the C1 point is increased, and the temperature of the solder solder 8) When the temperature rises, the resistance increases and the current flows in the direction indicated by C2. When the current flows to the point C2, the temperature of the portion of the soldering solder 8 corresponding to the point C2 increases and the resistance of the portion increases. When the current flows through the C3 path, the temperature of the soldering solder 8 at the point corresponding to C3 rises and the resistance rises. Therefore, the current again flows through the path above C3 A current flow process is performed to cause a variation in resistance and a variation in resistance, so that a current fluctuation occurs. Therefore, the noise, which is a current disturbing factor as described above, is also amplified and accurate current measurement is performed It is the result that can not be supported. On the other hand, if the current flows along the C4 path, the temperature becomes lower again at a point other than C4 (that is, the point where the temperature has previously been raised), and the resistance becomes lower again when the temperature at the other point becomes lower. (For example, a point C1). As a result, a current fluctuation occurs. As a result, the current measurement accuracy as described above does not come out properly, resulting in various problems as described above will be. This current fluctuation phenomenon becomes more severe as the high capacity (the current measurement range is high capacity), and the higher the capacity, the more the current measurement accuracy is lowered. For example, if the measurement error (ampere difference) of the current is doubled, the power error (wattage) is quadrupled. If the current measurement error is 10 times, the power error is 100 times different. Is more likely to fall.

Conventionally, as described above, resistance fluctuation and current fluctuation occur in accordance with the vertical position of the shunt 1 (that is, the vertical position of the shunt side portion 23), but the current flowing through the shunt 1 is measured The surface of the shunt 1 is scratched off and a current measuring device such as an ammeter is connected to the scraped portion of the shunt 1 to measure the current. ) Scratching the surface of the surface will result in very poor productivity. In the case of scraping the surface of the shunt (1), there is a problem in that a skilled technician is not able to produce shunt (1) in a day. That is, in the case of the conventional shunt 1, there is a problem that the productivity is very low when scratching the surface of the shunt 1 as described above (scratching the surface) so that correct current measurement is performed.

SUMMARY OF THE INVENTION The present invention has been developed in order to solve the above problems, and an object of the present invention is to provide a method of manufacturing a self- Solder mount shunt that can be applied to various current models only by changing the thickness of the net board is provided without the additional cost to implement the sensing point since the Kelvin sensing terminal is also realized at the cutting time.

It is another object of the present invention to provide a method and apparatus for preventing current from being amplified together with noise, which is a disturbing factor of the current measurement, so that accurate current measurement can be performed, and a scratch is formed on the shunt surface itself The present invention provides a new solderless solderless shunt that is advantageous in terms of productivity in comparison with the conventional one.

According to an aspect of the present invention, there is provided a shunt device including: a shunt body part connected to a current measuring circuit to allow a current to flow, the shunt body part including: a first shunt body part; And a second shunt body part disposed at a position opposite to the first shunt body part with one end connected to the first shunt body part.

Wherein the first shunt body portion and the second shunt body portion are configured to be relatively small in width as compared with the widths of both side portions where the widths of the side portions are orthogonal to each other, Wherein both side portions of the first shunt body portion and the second shunt body portion are arranged in the vertical direction with respect to the circuit board and the both side portions are arranged in a direction facing the circuit board, Wherein the first shunt body part and the second shunt body part are arranged such that the relatively wide side surfaces of the first shunt body part and the second shunt body part are laid down in the horizontal direction.

Wherein the first shunt body portion is connected to the circuit board constituting the current measuring circuit and the distal end portion of the second shunt body portion is connected to the distal end portion of the first shunt body portion via a middle connecting body portion, Is configured to be connected to the circuit board.

The first shunt body portion and the second shunt body portion are spatially separated from other portions with respect to a boundary space on the proximal end side of the first shunt body portion and the second shunt body portion, Respectively.

Wherein each of the first shunt body portion and the second shunt body portion has a hole shape extending in the longitudinal direction of the first shunt body portion and the second shunt body portion, And is spatially separated from the other part while continuing to be energized.

Wherein the boundary spaces are disposed in pairs on both sides of the Kelvin sensing end and each of the Kelvin sensing ends extends to the base end side of the first shunt body portion and the second shunt body portion, And a pair of connection terminals are disposed at both positions of the Kelvin sensing terminal by a space.

At least one of the pair of connection stages is further provided with a subspace formed concavely in a direction away from the Kelvin sensing stage.

The first shunt body portion and the second shunt body portion are spatially separated from other portions with respect to a boundary space on the proximal end side of the first shunt body portion and the second shunt body portion, And a connection end is provided at a position opposite to the Kelvin sensing end, and a connection space is formed at the connection end, the auxiliary space being recessed in a direction away from the Kelvin sensing end.

Wherein the boss space has a first auxiliary space facing the inner surface of the Kelvin sensing end and a second auxiliary space formed in the first auxiliary space in a concave shape in a direction away from the Kelvin sensing end relative to the first auxiliary space, And a second auxiliary space connected by a second auxiliary space.

Wherein the Kelvin sensing end is protruded from at least one side surface of the first shunt body part and the second shunt body part so that the boundary between the Kelvin sensing end and the first shunt body part and the side surface part of the second shunt body part, Space is provided.

Wherein a connection support piece extending in a direction intersecting the longitudinal direction is provided on a base end side of the first shunt body portion and the second shunt body portion, the connection support piece is spatially separated from other portions with respect to a boundary space, And a Kelvin sensing terminal connected to the first shunt body part and the second shunt body part so as to be energized, respectively.

The welding-free solder mount shunt of the present invention has the first shunt body part and the second shunt body part connected to both ends of the connecting body part so that the first shunt body part and the second shunt body part face each other, Since the first shunt body portion of the alloy, the connecting body portion, and the second shunt body portion are continuously and integrally connected (a welded portion removing structure), the manufacturing process is quicker than the conventional one, The manufacturing cost can be reduced by employing a manufacturing method using a post-self-jig.

Also, it is possible to prevent excessive resistance from occurring between the shunt and the circuit board in order to electrically connect the weldingless solder mount shunt of the present invention to the circuit board for current measurement, and to prevent excessive resistance from occurring It is possible to solve the problem that the charging capacity current of the secondary battery as the current charging object is measured to be too small. However, since the shunt of the present invention is mainly used for charging and discharging current in a secondary battery, it can be understood that the secondary battery described in the present invention has the above merits only when charging or discharging the overcurrent of the secondary battery. However, It should be understood that it is one of materials or devices. That is, it should be understood that the advantages of the present invention are not only applied to charge and discharge of the secondary battery, but also to other applications utilizing the shunt of the present invention in addition to the secondary battery.

The present invention does not occur when resistance fluctuation and current fluctuation occur in accordance with the vertical position of the shunt (that is, the vertical position of the side portion of the shunt), and when the current flowing through the shunt is measured (resistance is measured) There is an advantage to prevent cases. In other words, according to the present invention, since the side portions with relatively small widths are arranged vertically and the relatively wide side portions are provided so as to lie in the horizontal direction, the current fuluctuation phenomenon It is possible to prevent the occurrence of an excessive amount of current, thereby contributing to an increase in the current measurement precision.

Further, the present invention does not occur when resistance fluctuation and current fluctuation occur in accordance with the vertical position of the shunt (that is, the vertical position of the side portion of the shunt), so that when the current flowing through the shunt is measured The surface of the shunt is scratched off, and a current measuring device such as an ammeter is connected to the scraped part of the shunt, so that it is not necessary to perform the operation of measuring the current. Therefore, have. In other words, when scraping the surface of the shunt so that accurate current measurement can be performed through the shunt, there is a problem that the skilled artisan does not have enough shunt production per day. However, in the present invention, such a scratch operation of the shunt surface is not required And it has the advantage of being highly productive compared to the existing ones. In the present invention, a kelvin sensing stage is formed at the same time when a shunt is produced (for example, by blanking operation) in the form of a press or the like, and a shunt is produced. Measurement can be performed. Therefore, it is not necessary to scrape the surface of the shunt gently to accurately measure the current, and to connect the ammeter to the shunt surface. Therefore, the productivity is very high compared with the conventional one.

In addition, since the Kelvin sensing short circuit is also realized when the shunt of the present invention is produced (at the time of cutting the net board), there is an advantage that the additional cost for implementing the sensing point is not increased. That is, there is no additional cost for implementing the sensing point, so that the production cost can be lowered.

Further, the present invention is advantageous in that it can be applied to various current models only by changing the thickness of itself (thickness of the mesh board). In other words, it is an important feature that the thickness of the shunt itself can be changed so as to be compatible with current measurement of all capacities.

1 is an external perspective view showing a shunt structure for a conventional current measurement;
Fig. 2 is a front view schematically showing a main portion of the shunt structure shown in Fig. 1 and a current flow state; Fig.
3 is an external perspective view of a weldingless solder mount shunt according to the present invention.
Figure 4 is an external perspective view of a modified embodiment of the weldless solder mount shunt shown in Figure 3;
5 is a perspective view schematically showing a state in which the weldingless solder mount shunt shown in Fig. 3 is mounted on a circuit board; Fig.
6 is a front view schematically showing a currentless flow state and a weldingless solder mount shunt according to the present invention;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and advantages of the present invention will be more readily understood by reference to the accompanying drawings and the following detailed description. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The present invention should not be construed as limited to the embodiments described in Figs.

Referring to the drawings, a solderless solderless shunt according to an embodiment of the present invention includes a shunt body portion 22 connected to a current measuring circuit through which a current is passed to measure a current, 22 includes a first shunt body portion 22A and a second shunt body portion 22B disposed at a position facing the first shunt body portion 22A with one end connected to the first shunt body portion 22A, Respectively. The present invention can be referred to as a weldless solder mount medium capacity bending shunt.

The first shunt body portion 22A and the second shunt body portion 22B are arranged to face each other. The first shunt body portion 22A and the second shunt body portion 22B are formed by bending substantially the middle portion of the shunt machined flat iron made of manganese to manganese alloy (for example, a mixed alloy of manganese and copper) And are arranged in a direction facing each other. A substantially columnar connecting body portion 22C is provided on the distal end side of the first shunt body portion 22A and the second shunt body portion 22B. The first shunt body portion 22A and the second shunt body portion 22B are connected to both ends of the columnar connecting body portion 22C so that the first shunt body portion 22A and the second shunt body portion 22B, The first shunt body portion 22A of the manganese or manganese alloy and the connecting body portion 22C and the second shunt body portion 22B are continuously and integrally formed in a single body, Have. The structure in which the welded portion is provided on the following path of the shunt body portion 22 is omitted.

The first shunt body portion 22A and the second shunt body portion 22B are configured to be relatively small in width as compared with the width of the both side portions 24 where the widths of the both side portions 23 are orthogonal to each other. Therefore, when the shunt body portion 22 is viewed from the top, it is formed in a flat surface shape having a surface that is wide in the direction of both side surface portions 23.

A connection support piece (first connection support piece) is provided on the proximal end side of the first shunt body portion 22A in a form bent in a direction substantially perpendicular to the longitudinal direction. The first connection support piece is provided with a Kelvin sensing end. The first connection support piece is provided with a hole-shaped boundary space 26 communicating from the inner side to the outer side so that the Kelvin sensing end 27 is spatially separated from the other part One end of the Kelvin sensing terminal 27 is connected to the first shunt body 22A so as to be energized. The inner end of the Kelvin sensing end 27 is configured to face the inner end of the connection end with respect to the boundary space 26. That is, the boundary space 26 is provided between the inner end of the Kelvin sensing terminal 27 and the inner end of the connection end.

A connection support piece (second connection support piece) is provided on the proximal end side of the second shunt body portion 22B and a connection stage partitioned on both sides by a boundary space 26 and a Kelvin sensing stage 27 . The boundary space 26, the connection end, and the Kelvin sensing terminal 27 of the second shunt body portion 22B are the same as those of the first shunt body portion 22A, and therefore redundant description will be omitted.

In summary, the boundary space 26 is formed in the shape of a hole extending in the longitudinal direction of the first shunt body portion 22A and the second shunt body portion 22B, and each of the Kelvin sensing ends 27 One shunt body portion 22A and the second shunt body portion 22B are electrically connected to each other and are spaced apart from other portions.

At this time, the boss space has a first auxiliary space 29 facing the inner surface of the Kelvin sensing end 27, and a second auxiliary space 29 in a direction that is relatively farther away from the Kelvin sensing end 27 than the first auxiliary space 29 And a second auxiliary space 29 formed by recesses in the first auxiliary space 29 while being formed concavely.

The proximal ends of the first shunt body portion 22A and the second shunt body portion 22B are connected to a circuit board 32 constituting a current measuring circuit. In the present invention, the connection support piece provided on the base end side of the first shunt body portion 22A and the second shunt body portion 22B is inserted into the connection hole of the circuit board 32 and soldered to the circuit board 32 by soldering soldering. Respectively. Soldering connection is made to the circuit board 32 by soldering solder in a state where a connection end provided in the connection support piece and a part of the Kelvin sensing end 27 are inserted into the connection hole of the circuit board 32. [ At this time, the connection support pieces are bent in a direction substantially orthogonal to the longitudinal direction of the first shunt body portion 22A and the second shunt body portion 22B, respectively, so that the first shunt body portion 22A, When the connection support pieces of the two shunt body portion 22B are soldered to the circuit board 32, both side portions 23 of the first shunt body portion 22A and the second shunt body portion 22B are connected to the circuit board 32 and the upper and lower portions of the first shunt body portion 22A and the second shunt body portion 22B are disposed in a direction facing the circuit board 32. [ That is, both the first shunt body portion 22A and the second shunt body portion 22B have relatively wide both-side portions 24 arranged horizontally.

The welding-free solder mount shunt of the present invention having the above-described configuration is characterized in that both ends of the solder mount shunt are electrically connected to the circuit board 32 (that is, the connection pieces provided on both connection body pieces are electrically connected to the circuit board 32 A current measuring device such as an ammeter is connected to a Kelvin sensing terminal 27 provided at both ends of the shunt body 22 and a current measuring device such as an ammeter is connected to the Kelvin sensing terminal 27, (On the substrate 32), the amount of current of the current measurement object is measured in a state in which the current measurement object is connected in an energizable manner. A current measurement method using a shunt is a type of current measurement known as Kelvin sensing which causes current to flow between two terminals of a shunt and the voltage difference between terminals of such a shunt And measure the current using Ohm's law. That is, a shunt is mounted on a circuit of a board for current measurement, and a current is measured while a current measuring device such as an ammeter is connected to a Kelvin sensing point provided in the shunt.

The weldingless solder mount shunt according to the present invention is mainly used for measuring the amount of current (current charge amount) of the secondary battery by the Kelvin sensing. As described above, the first shunt body portion 22A and the second shunt body portion 22A constituting the shunt of the present invention, A current measuring device such as an ammeter is connected to both ends of the two-shunt body portion 22B. The secondary battery is electrically connected to the negative terminal and the positive terminal on a shunt circuit (on the circuit board 32 on which the shunt of the present invention is mounted) The current flowing to the shunt of the present invention is detected in a state in which it is connected to be energized so as to measure the current charge amount of the secondary battery.

At this time, the welding-free solder mount shunt of the present invention has the distal ends of the first shunt body portion 22A and the second shunt body portion 22B connected to both ends of the connecting body portion 22C, and the first shunt body portion 22A And the second shunt body portion 22B are arranged so as to face each other so that the first shunt body portion 22A of the manganese or manganese alloy, the connecting body portion 22C and the second shunt body portion 22B are integrally formed Since it has a continuous structure (welded part removing structure), the manufacturing process is quick compared with the conventional one, and the manufacturing cost is also reduced by adopting the self-jig manufacturing method after cutting the net board.

In addition, it is possible to prevent excessive resistance from occurring between the shunt and the circuit board 32 for electrically connecting the weldingless solder mount shunt of the present invention to the circuit board for current measurement, And the charging current of the secondary battery, which is the object of current charging, is measured to be too small.

Specifically, as shown in Fig. 5, according to the shunt of the present invention, connection support pieces are provided on both ends of the shunt body portion 22 (i.e., connection body pieces constituting both ends of the shunt body portion 22) The connecting terminal and the Kelvin sensing terminal 27 provided on the connection support piece are connected to the circuit board 32 in such a manner that they can be energized by soldering. The Kelvin sensing terminal 27 provided in the connection supporting piece is supplied with current So that only the connection resistance (substrate connection resistance, solder soldering resistance) between the connecting terminal provided at the proximal end side of the circuit board 32 and the shunt body portion 22 and the Kelvin sensing terminal 27 is formed It is possible to have a structure in which the resistance generating part is remarkably reduced compared with the conventional case. Therefore, the case where the charging capacity current of the secondary battery, which is the current charging / discharging target, is measured to be too small, The secondary battery can be prevented from being seriously damaged by charging the secondary battery with an excessive amount of current as it is eradicated when the measured current of the secondary battery is measured to be too small. The same advantages are obtained in the case of charging and discharging other devices other than the secondary battery.

As described above, the present invention significantly reduces the resistance source generated at a considerable number of places, thereby preventing the resistance value from being extremely increased due to a considerable amount of heat generated. It is possible to ensure that the measurement is performed accurately. In the case of shunt, the current measurement accuracy can be guaranteed only when the heating value is about 15 to 50 ppm per 1 ° C. If the shunt resistance value changes to 1% or more based on the total resistance value, the shunt resistance In other words, the present invention avoids the case where the resistance change value exceeds 1% due to the complete avoidance of the structure in which the resistance is generated at a considerably large number of points as compared with the conventional art. Therefore, It is advantageous to block the problem of not being able to use. In other words, when the shunt current change specification is within ± 0.2% ~ 0.5% in 10 ℃ ~ 15 ℃ range of change of calorific value and shunt current change value is 1% In the present invention, since the resistance generation sources as described above are completely eliminated, it is possible to satisfy the requirement that the current change value specification should be within the range of ± 0.2% to 0.5% in the range of 10 ° C. to 15 ° C. And the condition that the current change value of the shunt at the low current should be within 1% based on the total current value can also be satisfied. As a result, there is no problem that the shunt can not be used at all.

In addition, conventionally, both end portions of the flat-topped shunt are fixed to the shunt bracket by silver solder, and a phenomenon that the shunt is elongated and shrunk is accumulated, so that a crack occurs in the soldered solder portion due to external impact or the like, There is a possibility that the current charging amount of the secondary battery is measured to be excessively low due to the high resistance. However, the present invention does not occur when a crack occurs in the silver soldering connection portion on the shunt and the current measuring circuit. The resistance of the secondary battery is increased, so that the secondary battery has an advantage that it does not occur when the amount of current of the secondary battery is measured too low.

In the present invention, the connection body pieces on both sides of the shunt body portion 22 are provided with a Kelvin sensing end 27 having a relatively smaller cross-sectional area than the other portions by a space, and are spaced apart from each other by the space, A current measuring device such as an ammeter is connected to the Kelvin sensing terminal 27 connected to the shunt body 22 so as to be able to conduct current, so that the amount of current of the current measuring object such as the secondary battery can be measured. That is, there is a disadvantage in that a current is not accurately measured due to a crack in the silver solder portion which is connected to the shunt in the conventional manner. However, in the present invention, it is possible to prevent the case where the current measurement accuracy is not properly brought out due to the crack of the silver solder portion And also has a preferable characteristic in that

Further, the present invention does not occur when resistance fluctuation and current fluctuation occur in accordance with the vertical position of the shunt (that is, the vertical position of the shunt side portion 23), so that when the current flowing through the shunt is measured There is an advantage that it is prevented that the user does not come out correctly. In other words, according to the present invention, the side portions 23 having a relatively small width are arranged vertically and the relatively wide side portions 24 are arranged to be laid horizontally, so that the shunts are arranged vertically It is possible to prevent the occurrence of excessive current fulcation phenomenon, which can contribute to enhancement of the current measurement accuracy.

Further, the present invention does not occur when resistance fluctuation and current fluctuation occur in accordance with the vertical position of the shunt (that is, the vertical position of the shunt side portion 23), so that when the current flowing through the shunt is measured The surface of the shunt is gently scratched and the current is not measured by connecting a current measuring device such as an ammeter to the scraped portion of the shunt. There is an advantage to be improved. In other words, when scraping the surface of the shunt so that accurate current measurement can be performed through the shunt, there is a problem that the skilled artisan does not have enough shunt production per day. However, in the present invention, such a scratch operation of the shunt surface is not required And it has the advantage of being highly productive compared to the existing ones. In the present invention, a kelvin sensing terminal (27) is also formed at the same time when a shunt is produced (such as a blanking operation) so as to produce a shunt with a press or the like and a current measuring device such as an ammeter is applied to the Kelvin sensing terminal It is possible to precisely measure the current by connecting it in a circuit, so that it is not necessary to scrape the surface of the shunt gently to accurately measure the current and to connect the ammeter to the portion thereof. Therefore, It will be increased.

In addition, since the Kelvin sensing stage 27 is also realized when the shunt of the present invention is produced (at the time of cutting the net board), there is no additional cost for implementing the sensing point. That is, there is no additional cost for implementing the sensing point, so that the production cost can be lowered.

Further, the present invention is advantageous in that it can be applied to various current models only by changing the thickness of itself (thickness of the mesh board). In other words, it is an important feature that the thickness of the shunt itself can be changed so as to be compatible with current measurement of all capacities.

In the present invention, the Kelvin sensing end 27 is formed by the hole-shaped boundary space 26, and the connection support piece (first connection support piece) of the first shunt body portion 22A and the connection support piece When the connection end formed on the connection support piece (second connection support piece) of the body portion 22B and the Kelvin sensing terminal 27 are soldered to the circuit board 32, the silver solder passes from the connection terminal to the Kelvin sensing terminal 27 It is possible to prevent the Kelvin sensing terminal 27 from being used properly as a sensing point for Kelvin sensing due to the shielding of the Kelvin sensing terminal 27 due to silvering. That is, the connection of the first shunt body portion (22A) and a second shunt body portion (22B) When the support pieces are welded to the circuit board 32 by soldering solder, when the silver solder is touched from the connection end to the Kelvin sensing end 27 to cover the Kelvin sensing end 27, a current measurement such as an ammeter is applied to the Kelvin sensing end 27 The current measurement value at the Kelvin sensing terminal 27 can not be precisely measured even if the device is connected in a circuit manner. In the present invention, the Kelvin sensing terminal 27 is connected to the other part (in particular, So that the silver solder does not invade and cover the Kelvin sensing terminal 27. Therefore, the function of the Kelvin sensing terminal 27 can be properly implemented, and the current measurement accuracy can be surely guaranteed It will be.

The connection end disposed at a position facing the Kelvin sensing terminal 27 is further provided with a auxiliary space 29 concaved in a direction away from the Kelvin sensing terminal 27. The boss space is connected to the Kelvin sensing terminal 27 And the first auxiliary space 29 and the first auxiliary space 29 are formed concavely in a direction that is relatively farther away from the Kelvin sensing end 27 than the first auxiliary space 29, In this case, the Kelvin sensing terminal 27 can double the spacing apart from other parts (in particular, the connection terminal), so that the soldering solder It is possible to more reliably prevent the Kelvin sensing terminal 27 from being invaded and covered, and thus the function of the Kelvin sensing terminal 27 can be properly implemented to more surely assure the current measuring accuracy.

The boundary space 26 is formed so that the Kelvin sensing end 27 of each of the first shunt body portion 22A and the second shunt body portion 22B is electrically connected and spatially spaced apart from the other portion, The boundary space 26 in the form of a long hole is also formed in the shape of a long hole extending in the longitudinal direction of the body portion 22A and the second shunt body portion 22B. Thereby preventing the Kelvin sensing terminal 27 from being blocked by the silver soldering.

6 is a perspective view illustrating a structure of a weldingless solder mount shunt according to another embodiment of the present invention. In another embodiment of the present invention shown in FIG. 6, 26 are arranged in a pair such that each of the Kelvin sensing ends 27 extends to the base end side of the first shunt body portion 22A and the second shunt body portion 22B, And a pair of connection stages 28a, b are disposed at both positions of the Kelvin sensing terminal 27 by spaces 26a, 26b. At least one of the pair of connection ends 28a and 28b may be further provided with a supporting space 29 recessed in a direction away from the Kelvin sensing end 27. [ A gap can be formed between the connection end and the Kelvin sensing terminal 27 by the auxiliary space 29 with a relatively larger distance.

7 is a perspective view illustrating a structure of a solderless solderless shunt according to another embodiment of the present invention. In another embodiment of the present invention shown in FIG. 7, the Kelvin sensing terminal 27 includes a first shunt The first shunt body portion 22A and the second shunt body portion 22B protrude from at least one side portion 23 of the body portion 22A and the second shunt body portion 22B, And a side space 23 of the first and second side walls 22A and 22B.

6 to 7, the advantages of the above-described embodiments remain the same, and a detailed description thereof will be omitted. However, in the embodiment of FIG. 6, two boundary spaces 26 are secured on both sides of the Kelvin sensing terminal 27, which is the best in terms of Kelvin sensing accuracy. It can be one of the main features of the example.

It is to be understood that the terms "comprises", "comprising", or "having" as used in the foregoing description mean that a component can be implanted unless specifically stated to the contrary, But should be construed as further including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

1. Shunt 2. Shunt frame
3. Shunt bracket 4. Bolt
5. Connecting bolts 7. Connecting means
8. Silver shim 22. Shunt body part
22A. The first shunt body portion 22B. The second shunt body portion
23. Side portions 24. Both side portions
25. Connecting body part 26. Boundary space
27. Kelvin sensing terminal 32. Circuit board

Claims (11)

And a shunt body portion (22) connected to the current measuring circuit to allow the current to flow,
The shunt body portion (22)
A first shunt body portion 22A;
And a second shunt body part (22B) disposed at a position facing the first shunt body part (22A) with one end connected to the first shunt body part (22A) Shunt.
The method according to claim 1,
The first shunt body portion 22A and the second shunt body portion 22B are configured to be relatively smaller in width than the width of the both side portions 24 where the widths of the side portions 23 are orthogonal to each other, The first shunt body part 22A and the second shunt body part 22B are connected to the circuit board 32 constituting the current measuring circuit and the first shunt body part 22A and the second shunt body part 22B 22B are arranged in the vertical direction with respect to the circuit board 32 and the both side portions 24 are arranged in the direction facing the circuit board 32, (22) and the second shunt body portion (22B) are arranged so that the both side portions (24) are horizontally laid down.
3. The method of claim 2,
The first shunt body portion 22A is connected to the circuit board 32 constituting the current measuring circuit at its proximal end side and the distal end portion of the second shunt body portion 22B is connected to the first shunt body portion 22A. And the proximal end portion is connected to the circuit board (32) via an intermediate connecting body portion (22C).
The method according to claim 1,
The first shunt body portion 22A and the second shunt body portion 22B are spatially separated from other portions with respect to the boundary space 26, And a Kelvin sensing terminal (27) connected to the second shunt body (22B) so as to be conductive.
5. The method of claim 4,
The boundary space 26 is formed in the shape of a hole extending in the longitudinal direction of the first shunt body portion 22A and the second shunt body portion 22B, Wherein the first shunt body portion (22A) and the second shunt body portion (22B) are electrically connected to each other so as to be spatially separated from other portions of the shunt body portion (22A) and the second shunt body portion (22B).
6. The method of claim 5,
The boundary spaces 26 are arranged in pairs on both sides of the Kelvin sensing terminal 27 so that each of the Kelvin sensing terminals 27 is connected to the first shunt body 22A, A pair of connection ends 28a and 28b are disposed at both sides of the Kelvin sensing terminal 27 by the pair of boundary spaces 26a and 26b Welded solder mount shunt.
The method according to claim 6,
Wherein at least one of the pair of connection ends (28a, b) is further provided with a supplementary space (29) recessed in a direction away from the Kelvin sensing end (27).
5. The method of claim 4,
The first shunt body portion 22A and the second shunt body portion 22B are spatially separated from other portions with respect to the boundary space 26, And the second shunt body portion 22B are each provided with a Kelvin sensing terminal 27 which is electrically connected to the Kelvin sensing terminal 27. A connection terminal is provided at a position facing the Kelvin sensing terminal 27, Further comprising a secondary space (29) recessed in a direction away from the Kelvin sensing end (27).
9. The method of claim 8,
The boss space has a first auxiliary space 29 facing the inner surface of the Kelvin sensing end 27 and a second auxiliary space 29 in a direction that is relatively farther away from the Kelvin sensing end 27 , And a second auxiliary space (29) formed by recesses in the first auxiliary space (29) while being recessed.
5. The method of claim 4,
The Kelvin sensing terminal 27 is protruded from at least one side surface 23 of the first shunt body 22A and the second shunt body 22B so that the Kelvin sensing terminal 27, Wherein the boundary space (26) is provided between the first shunt body portion (22A) and the side portion (23) of the second shunt body portion (22B).
The method according to claim 1,
The first shunt body portion 22A and the second shunt body portion 22B are provided at the proximal end side thereof with connection support pieces extending in the direction crossing the longitudinal direction, And a Kelvin sensing terminal (27) which is spaced apart from the other part and which is connected at one end to the first shunt body part (22A) and the second shunt body part (22B), respectively. Welded solder mount shunt.
KR1020130054501A 2013-05-14 2013-05-14 Non-welding solder mount type shunt KR20140134517A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101725990B1 (en) * 2016-05-13 2017-04-12 주식회사 탑런에너지솔루션 Structure of shunt
KR101725989B1 (en) * 2016-05-13 2017-04-12 주식회사 탑런에너지솔루션 solder mount type shunt
EP3330720A1 (en) * 2016-11-30 2018-06-06 Top Run Energy Solution Co., Ltd. System for charge-discharge cycler
CN108462084A (en) * 2018-04-09 2018-08-28 广东电网有限责任公司 Insulated platform for installing high-voltage circuit-breaker switching on-off coil series resistance
KR101959734B1 (en) 2017-09-11 2019-03-20 (주)유양디앤유 Shunt resistor using for cycler and production method of it
CN113866468A (en) * 2021-09-01 2021-12-31 杭州西力智能科技股份有限公司 Anti-interference shunt of hard joint and electric energy meter
US20230326633A1 (en) * 2022-04-08 2023-10-12 Cyntec Co., Ltd. Structure of resistor device and system for measuring resistance of same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101725990B1 (en) * 2016-05-13 2017-04-12 주식회사 탑런에너지솔루션 Structure of shunt
KR101725989B1 (en) * 2016-05-13 2017-04-12 주식회사 탑런에너지솔루션 solder mount type shunt
EP3330720A1 (en) * 2016-11-30 2018-06-06 Top Run Energy Solution Co., Ltd. System for charge-discharge cycler
US10514424B2 (en) 2016-11-30 2019-12-24 Yuyang Dnu Co., Ltd. System for charge-discharge cycler
KR101959734B1 (en) 2017-09-11 2019-03-20 (주)유양디앤유 Shunt resistor using for cycler and production method of it
CN108462084A (en) * 2018-04-09 2018-08-28 广东电网有限责任公司 Insulated platform for installing high-voltage circuit-breaker switching on-off coil series resistance
CN113866468A (en) * 2021-09-01 2021-12-31 杭州西力智能科技股份有限公司 Anti-interference shunt of hard joint and electric energy meter
US20230326633A1 (en) * 2022-04-08 2023-10-12 Cyntec Co., Ltd. Structure of resistor device and system for measuring resistance of same

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