KR20140121663A - Heat discharging paint and sheet using graphene and method for manufacturing the same - Google Patents
Heat discharging paint and sheet using graphene and method for manufacturing the same Download PDFInfo
- Publication number
- KR20140121663A KR20140121663A KR20130038173A KR20130038173A KR20140121663A KR 20140121663 A KR20140121663 A KR 20140121663A KR 20130038173 A KR20130038173 A KR 20130038173A KR 20130038173 A KR20130038173 A KR 20130038173A KR 20140121663 A KR20140121663 A KR 20140121663A
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- Prior art keywords
- graphene
- heat dissipation
- metal particles
- heat
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Links
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 132
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims description 13
- 239000003973 paint Substances 0.000 title claims description 13
- 238000007599 discharging Methods 0.000 title 1
- 239000002923 metal particle Substances 0.000 claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 150000003839 salts Chemical class 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 4
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- 229910003771 Gold(I) chloride Inorganic materials 0.000 claims description 3
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 claims description 3
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 230000007847 structural defect Effects 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1606—Graphene
Abstract
The present invention relates to a heat dissipation coating and a heat dissipation sheet, and more particularly, to a heat dissipation coating using a graphene, a heat dissipation sheet and a manufacturing method thereof. The present invention relates to a graphene having a multilayer structure; Metal particles distributed between the graphenes of the multi-layer structure; And a solvent in which the graphene and the metal particles are dispersed.
Description
The present invention relates to a heat dissipation coating and a heat dissipation sheet, and more particularly, to a heat dissipation coating using a graphene, a heat dissipation sheet and a manufacturing method thereof.
As materials composed of carbon atoms, fullerene, carbon nanotube, graphene, graphite and the like exist. Among them, graphene is a structure in which carbon atoms are composed of one layer on a two-dimensional plane.
In particular, graphene is not only very stable and excellent in electrical, mechanical and chemical properties, but it is also a good conductive material that can move electrons much faster than silicon and can carry much larger currents than copper, It has been proved through experiments that a method of separation has been discovered.
Such graphene can be formed in a large area and has electrical, mechanical and chemical stability as well as excellent conductivity, and thus is attracting attention as a basic material for electronic circuits.
In addition, since graphenes generally have electrical characteristics that vary depending on the crystal orientation of graphene of a given thickness, the user can express the electrical characteristics in the selected direction and thus design the device easily. Therefore, graphene can be effectively used for carbon-based electric or electromagnetic devices.
As described above, graphene is excellent in thermal conductivity and can be applied to a heat radiating material that emits heat.
Disclosure of Invention Technical Problem [8] The present invention provides a heat dissipation coating, a heat dissipation sheet, and a manufacturing method thereof using graphene that can effectively transfer heat generated from a heat source not only in a horizontal direction but also in a vertical direction.
According to a first aspect of the present invention, there is provided a graphene having a multi-layer structure; Metal particles distributed between the graphenes of the multi-layer structure; And a solvent in which the graphene and the metal particles are dispersed.
Here, when the total amount of graphene and metal particles is taken as a total amount, the content of the graphene may be 50 to 99.5 wt%, and the content of the metal particles may be 0.5 to 50 wt%.
Here, the metal particles may include any one of Pt, Au, Ag, Cu, and Ni.
According to a second aspect of the present invention, there is provided a graphene having a multi-layer structure; And a heat dissipation layer including metal particles distributed between the graphenes of the multi-layer structure.
Here, the content of graphene may be 50 to 99.5 wt%, and the content of the metal particles may be 0.5 to 50 wt%.
Here, the metal particles can be adsorbed and distributed on the graphene surface.
On the other hand, the metal particles may include any one of Pt, Au, Ag, Cu, and Ni.
According to a third aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: preparing a dispersion in which graphene or oxide graphene is dispersed; Adding a metal salt to the dispersion to adsorb the metal salt to the graphene or the oxidized graphene; Reducing at least any one of the graphene oxide and the metal salt to produce a heat dissipation layer material in which metal particles are distributed between the multi-layer graphenes; And drying the heat dissipation layer material.
Here, the metal salt may include at least one of H 2 PtCl 6 , AuCl 3 , AgCl, CuCl 2 , and NiCl 2 .
Here, the content of graphene or graphene oxide may be 50 to 99.5 wt%, and the content of the metal salt may be 0.5 to 50 wt%.
On the other hand, it may further include a step of rolling the heat dissipation layer material.
The method may further include the step of attaching a thermally conductive adhesive layer to the heat dissipation layer material.
The present invention has the following effects.
First, the heat-radiating sheet of the present invention adheres to a heat source so that heat generated from a heat source can be efficiently discharged.
Graphene is a material composed of a single layer of hexagonal carbon atoms, and is known to have a very high thermal conductivity due to the abundance of pi electrons on the plane side.
However, if a heat dissipation coating is formed using graphene, it may have structural defects such that the vertical thermal conductivity is relatively low compared to the horizontal thermal conductivity due to the interstices between the structures.
Therefore, heat can be easily moved in the vertical direction by using the metal particles in the gaps in the stacked gaps of the graphenes, thereby improving the heat radiation characteristics.
That is, the thermal conductivity in the horizontal direction can be improved mainly through the graphene, and the thermal conductivity in the vertical direction can be improved by the metal particles adsorbed thereon.
1 is a schematic view showing an example of a heat radiating paint using graphene.
Fig. 2 is a schematic view showing the action of the heat radiating paint using graphene. Fig.
3 is a schematic view showing an example of a heat-radiating sheet using graphene.
4 is a schematic view showing the action of the heat-radiating sheet using graphene.
5 is a flowchart showing an example of a process of manufacturing a heat-radiating sheet using graphene.
6 is a schematic view showing a state in which graphene or oxide graphene is distributed in the dispersion liquid.
7 is a schematic view showing a state in which a metal salt is adsorbed on graphene or oxide graphene.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. Rather, the intention is not to limit the invention to the particular forms disclosed, but rather, the invention includes all modifications, equivalents and substitutions that are consistent with the spirit of the invention as defined by the claims.
It will be appreciated that when an element such as a layer, region or substrate is referred to as being present on another element "on," it may be directly on the other element or there may be an intermediate element in between .
Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and / or regions, such elements, components, regions, layers and / And should not be limited by these terms.
1 is a schematic view showing an example of a heat radiating paint using graphene.
The heat
When the total amount of the
Also, under the same conditions, the content of the
As described above, the
At this time, the
Further, the
The
The
First, a metal salt such as platinum, gold, silver, copper, and nickel may be added to the oxidized graphene to adsorb a metal salt or metal ion on the surface of the oxidized graphene.
Oxidized graphene refers to a state in which carbon particles are oxidized by an acid. Oxidative graphene is usually produced by oxidizing graphite with a strong acid such as sulfuric acid. In some cases, a mixture of sulfuric acid and hydrogen peroxide can be used for oxidation.
Graphite has a plate-like structure. When a strong acid is added to such graphite, it is oxidized. Graphene oxide is a state in which such a graphite is chemically prepared in a small particle state.
Since the graphene oxide has non-conductive non-conductive characteristics and thermal conductivity of several tens W / mK, heat generated from the heat source can be effectively transmitted.
As described above, such an oxidized graphene can be made into graphene through a reduction process.
Since the thermal conductivity of such graphene is as high as 3000 to 5000 W / mK, the
Therefore, by reducing the metal salt or the oxidized graphene adsorbed on the metal ion, the
At this time, the graphene solution containing the metal salt or the oxidized graphene adsorbed on the metal ion can be reduced simultaneously with the oxidized graphene and the metal ion by using the reducing agent.
The
As described above, the
The effect of the heat radiating paint will be described with reference to FIG.
Graphene is a material composed of a single layer of hexagonal carbon atoms, and is known to have a very high thermal conductivity due to the abundance of pi electrons on the plane side.
However, if a heat dissipation coating is formed using graphene, it may have structural defects such that the vertical thermal conductivity is relatively low compared to the horizontal thermal conductivity due to the interstices between the structures.
Therefore, heat can be easily moved in the vertical direction by using the
That is, the thermal conductivity in the horizontal direction can be improved mainly through the
3 is a schematic view showing an example of a heat-radiating sheet using graphene.
The
Here, it is advantageous that the content of the
Also, under the same conditions, the content of the
As described above, the
At this time, the
Further, the
The
The thermally conductive
Accordingly, such a thermally conductive
The matrix of the thermally conductive
When a polymer material is used as the matrix of the thermally conductive
As noted above, the thermally conductive
More specifically, these heat conductive material, Cu, Al, Bn, AiN, Al 2 O 3, MgO, graphene, graphite (graphite) and carbon nanotubes; can include at least one of the (carbon nano tube CNT) have.
The heat conduction material may be mixed with the polymer material constituting the thermally conductive
Here, the thermally conductive
More specifically, when the thermally conductive
As described above, the heat-radiating
The effect of the heat-radiating sheet will be described with reference to FIG.
Graphene is a material composed of a single layer of hexagonal carbon atoms, and is known to have a very high thermal conductivity due to the abundance of pi electrons on the plane side.
However, if a heat-radiating coating is formed using graphene, it can be structurally laminated and have a structural defect with a significantly lower vertical thermal conductivity than the horizontal thermal conductivity due to a gap between the layers.
Therefore, heat can be easily moved in the vertical direction by using the
That is, the thermal conductivity in the horizontal direction can be improved mainly through the
5 is a flowchart showing an example of a process of manufacturing a heat-radiating sheet using graphene. Hereinafter, a manufacturing process of the heat radiation sheet will be described with reference to FIG.
First, as shown in FIG. 6, a
The oxidized
Such a
Alternatively, instead of using the
7, the
Here, the
In addition, the content of the
Next, at least one of the
When the
Thereafter, the process of drying the heat dissipation layer material (S40) is performed.
As described above, if the water is primarily removed using the sieve, the drying process (S40) can be further shortened.
Thereafter, the heat-radiating sheet material produced by this process is rolled (S50), and the heat-radiating
Further, the method may further include the step of attaching the thermally conductive
As described above, the heat-radiating
It should be noted that the embodiments of the present invention disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.
100: heat radiation paint 101: heat radiation sheet
110: graphene 111: oxidized graphene
120: metal particle 121: metal salt
130: solvent 140: thermally conductive adhesive layer
200: heat source
Claims (12)
Metal particles distributed between the graphenes of the multi-layer structure; And
And a solvent in which the graphene and the metal particles are dispersed.
And a heat dissipation layer including metal particles distributed between the graphenes of the multi-layer structure.
Adding a metal salt to the dispersion to adsorb the metal salt to the graphene or the oxidized graphene;
Reducing at least any one of the graphene oxide and the metal salt to produce a heat dissipation layer material in which metal particles are distributed between the multi-layer graphenes; And
And drying the heat dissipation layer material. A method of manufacturing a heat dissipation sheet using graphene,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130038173A KR20140121663A (en) | 2013-04-08 | 2013-04-08 | Heat discharging paint and sheet using graphene and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130038173A KR20140121663A (en) | 2013-04-08 | 2013-04-08 | Heat discharging paint and sheet using graphene and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140121663A true KR20140121663A (en) | 2014-10-16 |
Family
ID=51993098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20130038173A KR20140121663A (en) | 2013-04-08 | 2013-04-08 | Heat discharging paint and sheet using graphene and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20140121663A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783769A (en) * | 2017-01-06 | 2017-05-31 | 上海增华电子科技有限公司 | A kind of conductive and heat-conductive film assembly |
| US9853487B2 (en) | 2015-10-13 | 2017-12-26 | Samsung Electro-Mechanics Co., Ltd. | Magnetic field shielding sheet and wireless power charging apparatus including the same |
| CN112054007A (en) * | 2019-06-06 | 2020-12-08 | 恒劲科技股份有限公司 | Semiconductor package carrier, method for fabricating the same and electronic package |
-
2013
- 2013-04-08 KR KR20130038173A patent/KR20140121663A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9853487B2 (en) | 2015-10-13 | 2017-12-26 | Samsung Electro-Mechanics Co., Ltd. | Magnetic field shielding sheet and wireless power charging apparatus including the same |
| CN106783769A (en) * | 2017-01-06 | 2017-05-31 | 上海增华电子科技有限公司 | A kind of conductive and heat-conductive film assembly |
| CN112054007A (en) * | 2019-06-06 | 2020-12-08 | 恒劲科技股份有限公司 | Semiconductor package carrier, method for fabricating the same and electronic package |
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