KR20140078820A - Sawing device - Google Patents

Sawing device Download PDF

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Publication number
KR20140078820A
KR20140078820A KR1020120147958A KR20120147958A KR20140078820A KR 20140078820 A KR20140078820 A KR 20140078820A KR 1020120147958 A KR1020120147958 A KR 1020120147958A KR 20120147958 A KR20120147958 A KR 20120147958A KR 20140078820 A KR20140078820 A KR 20140078820A
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South Korea
Prior art keywords
unit
pneumatic
valve
cutting
power supply
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KR1020120147958A
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Korean (ko)
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방효영
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한미반도체 주식회사
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Priority to KR1020120147958A priority Critical patent/KR20140078820A/en
Publication of KR20140078820A publication Critical patent/KR20140078820A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a cutting device. The cutting device, according to the present invention, comprises: an absorption unit which fixes a substrate by adsorbing and enables a linear reciprocating movement and a rotational movement; a cutting unit for cutting the substrate into individual units along a cutting path by being provided to enable up and down movement relative to the adsorption unit; a main pneumatic unit for providing air pressure to the adsorption unit to adsorb the substrate when a normal power supply is provided; a secondary pneumatic unit for providing air pressure to the adsorption unit when the power supply is abnormally terminated and a substrate is provided to the adsorption unit; and a recognition storage unit for recognizing a position of the cutting unit on the cutting path in real-time to store the position information and the cutting path.

Description

[0001] Sawing device [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting apparatus for semiconductor manufacturing that can be used for cutting a substrate such as a strip or a wafer, which is an aggregate of semiconductor packages, on an individual basis. More specifically, when the power supply is abnormally stopped during the cutting of the substrate using the cutting device and the power supply is resumed within a predetermined time, the process before the power supply interruption is memorized, and when the power supply is resumed, And more particularly to a cutting apparatus capable of performing such a cutting operation.

In order to manufacture a semiconductor package, a semiconductor chip is mounted on a substrate such as a strip, and the semiconductor chip and the substrate are electrically connected. Then, a molding process is performed to protect the semiconductor chip. Subsequently, And then sorting by package. The semiconductor package manufacturing apparatus corresponds to a device for cutting and cutting a substrate such as a strip, which has been subjected to a molding process, by disposing a semiconductor chip and electrically connected thereto.

The semiconductor package manufacturing apparatus includes a suction unit for suctioning and fixing the substrate, and a cutting unit for cutting the substrate fixed to the suction unit. Subsequently, the substrate, which is an aggregate of semiconductor packages, is cut into individual units, sorted according to the quality, and loaded.

However, the conventional semiconductor package manufacturing apparatus or the like has a problem in that, when the power supply is abnormally stopped due to power failure or emergency, and the power supply is restarted, the process before the power supply can not be continuously performed and the process must be performed again from the beginning do. That is, the conventional semiconductor package manufacturing apparatus and the like do not provide the function of storing the process at the time when the power supply is stopped when the power supply is interrupted. Therefore, even if the power supply is resumed, it is not possible to know to what extent the process has progressed at the time of the power supply interruption, so the process must be restarted from the beginning.

For example, if the power supply is interrupted during cutting of the substrate by the driving of the suction unit and the cutting unit, if the position of the cutting unit on the cutting path, that is, the stop position, The process before the power supply can not be continuously performed. Therefore, in the conventional apparatus, when the power supply is abnormally terminated and the power supply is restarted, the substrate can not be successively processed successively, and the substrate on which the process has been performed is removed, and a new substrate is introduced to perform the process again from the beginning. In this case, the removed substrate is discarded, which leads to a problem of cost loss and economic damage. In addition, when the substrate removed from the apparatus is cut through manual operation or the like, it must be cut manually by hand, which requires a considerable amount of time and effort. Since manual cutting is an extremely difficult operation, Is frequently discarded. Disposal of the substrate results in the same economic loss as described above.

SUMMARY OF THE INVENTION The present invention provides a cutting apparatus capable of continuously performing a process at a point of time when power supply is stopped when power supply is abnormally terminated and restarted when cutting a semiconductor package to solve the above problems There is a purpose.

The above and other objects can be accomplished by the provision of an adsorption unit capable of linearly reciprocating and rotationally moving a substrate by suction, a cutting unit provided vertically movably with respect to the adsorption unit, A main pneumatic unit that provides pneumatic pressure to the adsorption unit to adsorb the substrate upon normal powering, an auxiliary pneumatic unit that provides pneumatic pressure to the adsorption unit when power supply is abnormally terminated, And a recognition storage unit for recognizing the position of the unit in real time and storing the position information and the cutting path.

Specifically, the cutting apparatus abnormally stops supplying power, and when the suction unit is provided with a substrate, the stop position on the cutting path is stored in the recognition storage unit, and the air is supplied by the auxiliary pneumatic unit do. Furthermore, the cutting device provides pneumatic pressure by the main pneumatic unit when the power supply is resumed, and the cutting unit cuts the substrate again along the cutting path at the rest position.

For example, the main pneumatic unit may include a first pneumatic passage communicating with the adsorption unit and a first pneumatic portion providing pneumatic pressure along the first pneumatic passage, and further, And a first valve that opens and closes one pneumatic flow path. In this case, the first valve may be a single acting solenoid valve that is opened when electric power is applied and is closed when electric power is interrupted. Further, the first pneumatic flow path may further include a first check valve interlocked with opening and closing of the first valve, which is opened when the first valve is opened, and is closed together when the first valve is closed.

The auxiliary pneumatic unit may include a second pneumatic passage connected to the adsorption unit, and a second pneumatic portion selectively providing pneumatic pressure along the second pneumatic passage. In this case, the second pneumatic portion may be composed of a vacuum generator for powerfully driving compressed air using the venturi principle, the second pneumatic passage may include a compressed air supply source for supplying compressed air for driving the second pneumatic portion, Can be connected.

The auxiliary pneumatic unit may further include a second valve that opens and closes the second pneumatic flow passage so as to selectively supply the compressed air supplied from the compressor supply source. The second valve is closed when electric power is applied, If it is blocked, it can be opened.

The auxiliary pneumatic unit may further include a third valve provided at the front end of the second valve along the second pneumatic flow path, the third valve being opened by an electrical open signal and being closed by an electrical close signal. The third valve may be opened when the power supply to the cutting device is terminated abnormally and the substrate is supplied to the adsorption unit.

Further, the second pneumatic flow path may further include a second check valve interlocked with the opening and closing of the second valve, the second check valve being opened when the second valve is opened, and being closed together when the second valve is closed.

On the other hand, in the cutting apparatus according to another embodiment, the main pneumatic unit includes a first pneumatic flow path communicating with the adsorption unit, a first pneumatic part providing air pressure along the first pneumatic flow path, And a second valve for opening and closing the second pneumatic flow passage, wherein the second pneumatic flow passage is connected to the adsorption unit, the second pneumatic flow passage for supplying air pressure along the second pneumatic flow passage, And a third valve provided in the second pneumatic flow passage to be opened together with the operation of the first valve when the first valve is opened during normal power supply and closed together when the first valve is closed . Here, the third valve is opened by an electrical open signal and is closed by an electrical close signal.

The auxiliary pneumatic unit may further include a power supply unit for driving the second pneumatic unit when the power supply is abnormally terminated.

Further, the apparatus may further include a fourth valve for selectively connecting the first pneumatic flow path and the second pneumatic flow path to the adsorption unit, and the fourth valve may be configured such that when the power supply to the cutting device is abnormally terminated The second pneumatic flow path is connected to the adsorption unit by the power supply device, and when the power supply is resumed, the first pneumatic flow path and the adsorption unit can be connected.

On the other hand, the cutting unit may be spaced a predetermined distance from the substrate by the power supply unit when the power supply to the cutting apparatus is abnormally terminated.

Meanwhile, the recognition storage unit may include a recognition unit for recognizing the position of the cutting unit on the cutting path in real time and transmitting the position information, and the cutting path, and stores the position information transmitted from the recognition unit in real time And a storage unit.

The cutting apparatus according to the present invention can successively perform the process at the point of time when the power supply is abnormally stopped during the cutting process for manufacturing the semiconductor package and the power supply is stopped when the power supply is restarted again. Thus, even when the power supply is unexpectedly stopped, it is possible to prevent economic loss such as disposal of the substrate on which the process is performed.

Further, the cutting apparatus according to the present invention is provided with an auxiliary pneumatic unit so as to maintain the alignment of the substrate even when the power supply is abnormally stopped, so that generation of defective products in the process after power supply resumption can be minimized.

In addition, the auxiliary pneumatic unit can be driven at a lower power than the main pneumatic unit, or in a structure requiring power supply only at the time of initial driving, and a simple and simple structure can be provided for the cutting apparatus.

1 is a plan view showing a semiconductor manufacturing apparatus equipped with a cutting apparatus of the present invention,
Fig. 2 is a perspective view showing the cutting apparatus in Fig. 1,
3 is a schematic view schematically showing a configuration of a cutting apparatus according to an embodiment,
4 is a schematic view schematically showing a configuration of a cutting apparatus according to another embodiment.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the drawings.

1 shows a semiconductor package manufacturing apparatus 10 for manufacturing a semiconductor package. In order to manufacture a semiconductor package, a semiconductor chip is mounted on a substrate such as a strip, and the semiconductor chip and the substrate are electrically connected. Then, a molding process is performed to protect the semiconductor chip. Subsequently, And then sorting by package.

The semiconductor package manufacturing apparatus 10 according to FIG. 1 corresponds to an apparatus for cutting and sorting a substrate such as a strip, which has been subjected to a molding process by mounting a semiconductor chip and electrically connected thereto, and for sorting, for example, 'Sawing and Placement Equipment (Sawing and placement apparatus). First, a general configuration of the semiconductor package manufacturing apparatus 10 will be described. Next, a cutting apparatus 1000 according to an embodiment of the present invention will be described.

1, a semiconductor package manufacturing apparatus 10 supplies a substrate such as a strip in a loading section 12, and a substrate supplied from a loading section 12 is conveyed by a first picker unit 14 to a suction unit (not shown) 16). The first picker unit 14 is provided so as to reciprocate in one direction, for example, and conveys the substrate supplied from the loading unit 12 to a suction unit 16 to be described later.

The suction unit 16 adsorbs and fixes the supplied substrate to move the substrate when the substrate is cut by the cutting unit 18, which will be described later, and securely fix the substrate. To this end, the adsorption unit 16 is provided with a adsorption unit 100 (see FIG. 2) for adsorbing the substrate and further includes a moving unit 200 (see FIG. 2) for moving the adsorption unit 100. The adsorption unit 100 may include a suction table 110 (see FIG. 2) or the like where the substrate is adsorbed and fixed by air pressure. Further, the moving unit 200 is configured to reciprocate and rotate the suction unit 100 a predetermined distance. On the other hand, the adsorption unit 16 is connected to a pneumatic unit (not shown) for providing pneumatic pressure, the pneumatic unit including a pneumatic unit (not shown), such as a vacuum pump, And a pneumatic passage (not shown) communicating the pneumatic pressure provided by the pneumatic portion. The construction and operation of the adsorption unit 16 and the pneumatic unit will be described in detail later.

On the other hand, the moving unit 200 moves the substrate fixed to the suction unit 100 to cut the substrate along various paths when the substrate is cut by the cutting unit 18. That is, a plurality of semiconductor packages are provided on the substrate, and may be provided in a lattice form, for example, on a substrate. In this case, if the adsorption unit 16 is provided so as to be capable of rotating and reciprocating, the adsorption unit 16 reciprocates in one direction to perform unidirectional cutting by the cutting unit 18, It is possible to perform cutting in the other direction by the rotation and the reciprocating motion. Therefore, by the rotation and reciprocating motion of the suction unit 16 as described above, the cutting unit 18 can cut the substrate into individual units in a lattice form. On the other hand, since a foreign substance may be scattered when the substrate is cut, the brush 20 for removing the foreign substance may be provided adjacent to the cutting unit 18 and / or the suction unit 16. [

The substrate cut in the individual unit as described above is moved by the second picker unit 22 and passes through the clearing unit 24 to perform a cleaning operation such as the removal of foreign matter and then the drying process is performed in the drying unit 26 Performed ..

The substrate of the individual unit in which the drying process has been completed is conveyed to the rotary table 30 by the third picker unit 28. The rotary table 30 is rotatably and linearly movable. When the substrate is loaded by the third picker unit 28, the rotary table 30 is moved toward the sorting picker unit 32 by linear motion.

The sorting picker unit 32 sorts the boards cut in individual units according to the quality, and classifies them into the tray 34 and mounts them. In this case, a vision device 36 for inspecting the substrate may be provided. The substrate is inspected by the vision device 36, the substrate is classified according to a preset reference, and the sorting picker unit 32 separates the tray 34 ).

The semiconductor package manufacturing apparatus 10 as described above is an aggregate of semiconductor packages by the operation of the various components described above, for example, various picker units, adsorption units 16, cutting units 18, rotary tables 30, The substrate can be cut in individual units, and can be sorted and loaded according to the quality. The semiconductor package manufacturing apparatus 10 as described above is driven by various devices such as the above-described devices. When an abnormal power supply interruption occurs in an emergency such as a power failure or an emergency, Waiting for the supply to be resumed, or providing an auxiliary power supply or the like in preparation for such an emergency situation. That is, when the power supply is interrupted due to a failure or the like of the main power supply apparatus while the semiconductor package manufacturing apparatus 10 is driven by the main power supply apparatus, the power supply is resumed or provided by the main power supply apparatus A necessary time elapses in order to supply electric power through the auxiliary power device or the like.

However, in the conventional semiconductor package manufacturing apparatus and the like, when the power supply is interrupted and restarted, the process before the power supply can not be performed successively, and the process must be performed again from the beginning. That is, the conventional semiconductor package manufacturing apparatus and the like do not provide the function of storing the process at the time when the power supply is stopped when the power supply is interrupted. Therefore, even if the power supply is resumed, it is not possible to know to what extent the process has progressed at the time of the power supply interruption, so the process must be restarted from the beginning.

Particularly, when the power supply is interrupted during the cutting of the substrate by the driving of the suction unit 16 and the cutting unit 18, significant damage may occur. Specifically, when the power supply is stopped while the substrate is adsorbed and fixed by the adsorption unit 16 and the adsorption unit 16 is moved and the substrate is cut along the predetermined cutting path by driving the cutting unit 18 . In this case, if the position of the cutting unit 18 on the cutting path at the point of time when the power supply is interrupted, that is, the stop position, can not be known, the process before power supply can not be continued even if the power supply is restarted.

Accordingly, when the power supply is abnormally terminated and restarted as described above, the conventional apparatus can not continuously perform the process on the substrate, and the substrate on which the process has been performed is removed, and a new substrate is charged to perform the process again from the beginning . In this case, disposal of the removed substrate may lead to cost loss, which may cause economic damage to the manufacturer. In addition, when the substrate removed from the apparatus is cut through manual operation or the like, it must be cut manually by hand, which requires a considerable amount of time and effort. Since manual cutting is an extremely difficult operation, Is frequently discarded. Disposal of the substrate results in the same economic loss as described above. Hereinafter, a configuration for solving the above problems will be described. First, a configuration of a cutting apparatus having a suction unit and a cutting unit will be described, and a cutting apparatus for solving the above problems will now be described.

Fig. 2 shows an adsorption unit 16 capable of reciprocating and rotating motion by adsorbing and fixing the substrate, a cutting unit 18 cutting the substrate, and a pneumatic unit (not shown) for providing pneumatic pressure to the adsorption unit 16 It is a perspective.

Although the above-described semiconductor package manufacturing apparatus 10 is provided as one apparatus in which various components are spatially connected to each other to produce a semiconductor package, the semiconductor package manufacturing apparatus 10 may be variously detailed in accordance with a specific process and / Devices. For example, when the substrate is moved from the loading section 12 to the adsorption unit 16 by the first picker unit 14, the adsorption unit 16 and the cutting unit 18 are driven, . In this case, a combination of the suction unit 16, the cutting unit 18, and the pneumatic unit (not shown) for cutting the substrate in individual units can be divided into one cutting device 1000.

That is, the cutting apparatus 1000 defined in this specification includes an adsorption unit 16 capable of adsorbing and fixing a substrate and reciprocating and rotating, a cutting unit (not shown) for cutting the substrate fixed to the adsorption unit 16 on an individual unit, And a pneumatic unit (not shown) for providing a pneumatic pressure for sucking the substrate to the adsorption unit 16 can be provided. The cutting apparatus 1000 may constitute a part of the semiconductor package manufacturing apparatus 10 as described above, but it is of course possible to drive it by a separate individual apparatus. A device for feeding a substrate when the cutting device is provided as an individual device and a device for inspecting and sorting the substrate cut in individual units may be separately provided. Hereinafter, the configuration of the cutting apparatus 1000 will be described in detail with reference to the drawings.

2, the cutting apparatus 1000 includes an adsorption unit 16 capable of reciprocating and rotationally moving at least one adsorbing and fixing a substrate such as a strip, which is an aggregate of semiconductor packages, A cutting unit 18 which is vertically movable to cut the substrate in individual units along a cutting path and a pneumatic unit (not shown) which provides pneumatic pressure to suck the substrate to the suction unit 16 .

As described above, the suction unit 16 sucks and fixes the substrate to move the substrate when the substrate is cut by the cutting unit 18 on an individual basis, and at the same time, serves to firmly fix the substrate. The process of cutting the substrate into individual units is a very sophisticated operation and requires more sophistication when the size of the substrate is reduced. Therefore, when cutting the substrate by the cutting unit 18, it is necessary to securely fix the substrate so that the cutting unit 18 can cut the substrate according to a predetermined path. To this end, the adsorption unit 16 includes a adsorption unit 100 for adsorbing a substrate, and further includes a moving unit 200 for reciprocating and rotating the adsorption unit 100.

The adsorption unit 100 may include a suction table 110 on which the substrate is adsorbed and fixed by the pneumatic pressure. As shown in the figure, the suction table 110 is provided with a plurality of suction holes 111, through which air is supplied through the suction holes 111, and the substrate is fixed to the upper portion of the suction table 110. The substrate can be firmly fixed to the upper portion of the suction table 110 by the air pressure provided through the suction holes 111. The suction hole 111 is connected to a pneumatic unit (not shown) having a pneumatic portion such as a vacuum pump through a pneumatic passage (not shown). Therefore, by providing the pneumatic pressure through the pneumatic passage by driving the pneumatic portion, it becomes possible to adsorb and fix the substrate through the suction holes 111. [

Further, the moving unit 200 is configured to reciprocate and rotate the suction unit 100 a predetermined distance. The moving unit 200 may include a rotation unit 300 for rotating the suction table 110 and a linear motion unit 400 for linearly reciprocating the absorption table 110 at a predetermined distance. The rotation unit 300 may include a support unit 310 for supporting the suction table 110 and a motor unit 330 for rotating the support unit 310. When the motor unit 330 is driven, the supporting unit 310 is rotated, and the suction table 110 is rotated together with the suction unit.

The linear motion part 400 includes a plate 410 on which the rotary part 300 is mounted, a driving part 430 for providing a driving force to move the plate 410, a guide 430 for guiding the movement of the driving part 430, 450 may be provided. The guide part 450 is provided along a straight path by a predetermined distance and the driving part 430 moves along the upper part of the guide part 450. In this case, the driving unit 430 may be configured in various forms such as an LM (linear motor) guide, a belt, and the like.

On the other hand, the pneumatic unit (not shown) includes a pneumatic portion (not shown) for providing an adsorption force for providing a pneumatic pressure, such as a vacuum pump, for adsorbing the substrate, and a pneumatic flow path (not shown) for communicating the pneumatic pressure provided by the pneumatic portion do. The pneumatic passage is provided inside the pneumatic pipe 500, the linear motion part 400 and the rotary part 300 connected to one side of the linear motion part 400 and communicates with the suction hole 111 of the suction table 110 . Therefore, the pneumatic pressure provided by the pneumatic portion is supplied to the suction hole 111 through the pneumatic flow passage, whereby the substrate can be adsorbed and fixed. Although not shown in the figure, the pneumatic pipe 500 is shown connected to the rectilinear motion part 400, but the present invention is not limited thereto. The pneumatic pipe 500 may be connected to the rotary part 300, It is also possible.

On the other hand, a cutting unit 18 is provided on the upper portion of the adsorption unit 16. The cutting unit 18 has a cutting means such as a blade 19 capable of cutting the substrate to cut the substrate in individual units. Needless to say, the cutting means is not limited to the blade but can be realized in various forms such as a laser or a water jet. The cutting unit 18 is provided so as to be vertically movable with respect to the suction unit 16 by a predetermined distance. When the cutting process for cutting the substrate is started, if the blade 19 rotates and rotates at a sufficient rpm, the cutting unit 18 is moved downward to perform a cutting process on the substrate. Further, when the cutting process is completed, the cutting unit 18 is moved upward to be separated from the substrate by a predetermined distance, and then the rotation of the blade 19 is stopped.

However, in the case where the power supply is interrupted and restarted as described above, it is necessary to store the interrupted process of the cutting unit 18 in the case where the power supply is interrupted in order to continuously carry out the process before the power supply. To store the breakpoint of the process at the point of time when the power supply is interrupted, and to perform the process again at the breakpoint when the power supply is resumed. If the power supply is restarted, the subsequent process is performed in the interrupted process to save the economic loss due to the disposal of the substrate and the cost and time wasted by manual operation. .

In addition, in order to supply power by the auxiliary power supply apparatus when the power supply is interrupted due to a failure of the main power supply apparatus, a predetermined time is required for driving the auxiliary power supply apparatus. The predetermined time may cause a very lethal result in the semiconductor package manufacturing apparatus 10 or the cutting apparatus 1000 and the like. For example, if the power supply is stopped when the substrate is fixed by the suction unit 16 and the substrate is cut by the cutting unit 18, the suction unit 16 can no longer suck the substrate. Therefore, the substrate is not fixed to the adsorption unit 16 and the alignment of the substrate on the adsorption table 110 can be interrupted. If cutting is performed by the cutting unit 18 in a state where the substrate is misaligned, it is impossible to accurately cut the substrate in individual units, so that defective products are mass-produced and the substrate to be discarded eventually increases. Therefore, there is a need for a means capable of continuously adsorbing and fixing the substrate so that alignment of the substrate is not interrupted even when power supply is abnormally stopped, such as a power failure. Hereinafter, a configuration for solving the above problems will be described in detail.

3 is a schematic view showing a configuration of a cutting apparatus 1000 according to an embodiment of the present invention.

3, the cutting apparatus 1000 includes an adsorption unit 16 capable of adsorbing and fixing at least one substrate and performing a linear reciprocating motion and a rotational motion, and an adsorption unit 16 And a cutting unit 18 for cutting the substrate in individual units along a predetermined cutting path. Since the suction unit 16 and the cutting unit 18 have been described in detail with reference to FIG. 2, repetitive description will be omitted and differences will be mainly described.

The cutting apparatus 1000 includes a main pneumatic unit 600 that together with the adsorption unit 16 and the cutting unit 18 provide pneumatic pressure to the adsorption unit 16 to adsorb the substrate upon normal power supply, An auxiliary pneumatic unit (700) for providing pneumatic pressure to the suction unit (16) when the substrate is abnormally terminated and the substrate is supplied to the suction unit (16), a position of the cutting unit And a recognition storage unit 900 for storing the position information and the cutting path.

The main pneumatic unit 600 may have a first pneumatic portion 610 that provides pneumatic pressure, such as a vacuum pump, and provides pneumatic pressure to the adsorption unit 16 via the first pneumatic flow path 630.

The main pneumatic unit 600 may further include a first valve 650 for opening and closing the first pneumatic passage 630 in the first pneumatic passage 630. The first valve 650 may be a so-called 'single acting sol valve' composed of a single acting cylinder which is opened or closed according to the presence or absence of electric power application. Specifically, it is preferably a single acting cylinder which is in an open state when power is applied and is in a closed state when power is interrupted, in order to switch to a closed state when power supply is interrupted. The function and effect of the first valve 650 will be described later in detail.

The first pneumatic passage 630 may further include a first check valve 670 for controlling the flow of air in the first pneumatic passage 630. The first check valve 670 is provided along the first pneumatic flow path 630 at the rear end of the first valve 650, that is, between the first valve 650 and the adsorption unit 16. The first check valve 670 is driven in conjunction with the opening and closing of the first valve 650. That is, the first check valve 670 is opened together when the first valve 650 is opened and closed together when the first valve 650 is closed, thereby preventing the air flow from flowing backward.

Meanwhile, the cutting apparatus 1000 according to the present embodiment may further include a separate pneumatic unit together with the main pneumatic unit 600, and may further include an auxiliary pneumatic unit 700, for example. The driving of the main pneumatic unit 600 and the auxiliary pneumatic unit 700 will now be described.

The auxiliary pneumatic unit 700 may have a second pneumatic flow path 730 in communication with the adsorption unit 16 and a second pneumatic portion 710 that selectively provides pneumatic pressure along the second pneumatic flow path 730 . Further, the auxiliary pneumatic unit 700 may further include a second valve 830 for opening and closing the second pneumatic passage 730.

The second valve 830 may be a so-called single-acting solenoid valve that is opened or closed depending on whether electric power is applied or not. Specifically, it is preferable that the second valve 830 is closed when power is applied, and is opened when power supply is interrupted. Accordingly, when the power is supplied, the second valve 830 is closed and the second pneumatic part 710 is not driven. On the other hand, when the power supply is interrupted, the second valve 830 is opened to open the second pneumatic part 710, Whereby a vacuum is formed in the adsorption unit 16. In this case, The function and effect of the second valve 830 will be described later in detail.

The second pneumatic passage 730 may further include a second check valve 750 for controlling the flow of air in the second pneumatic passage 730. The second check valve 750 is provided along the second pneumatic passage 730 at the rear end of the second valve 830, that is, between the second pneumatic portion 710 and the adsorption unit 16. The second check valve 750 is driven by interlocking with the opening and closing of the second valve 830. That is, the second check valve 750 is opened together when the second valve 830 is opened, and is closed together when the second valve 830 is closed, thereby preventing the air flow from flowing backward.

When the cutting process is performed by the cutting apparatus 1000 according to the present embodiment, the pneumatic pressure is supplied to the suction unit 16 by the main pneumatic unit 600 in the normal operation state, The cutting process is performed. However, when the power supply is abnormally terminated such as an unexpected situation such as a power failure, the main pneumatic unit 600 can not generate air pressure because the power supply is interrupted. In this case, the substrate can not be fixed by the suction unit 16, and the alignment of the substrate is interrupted. Therefore, even if the interruption process of the cutting unit 18, that is, the stop position on the cutting path is stored by the above-described recognition storage unit 900, even if the alignment of the substrate on the suction unit 16 is broken and the power supply is resumed, Thereby making it difficult to carry out the process. Therefore, the auxiliary pneumatic unit 700 is provided to supply air to the suction unit 16 when the power supply is terminated abnormally as described above and the driving of the main pneumatic unit 600 is stopped.

However, the auxiliary pneumatic unit 700 must generate a pneumatic pressure in an emergency situation in which the power supply is abnormally stopped, such as a power failure, so that it is necessary to provide a different structure from the main pneumatic unit 600 described above. That is, the second pneumatic portion 710 of the auxiliary pneumatic unit 700 requires a significantly lower power than the first pneumatic portion 610 of the main pneumatic unit 600, or even if there is no continuous power supply, It is preferable to have a structure capable of generating the above-mentioned structure. If the structure is such that the auxiliary pneumatic unit 700 is operated by supplying power to the auxiliary pneumatic unit 700 in an emergency where the power supply is abnormally stopped and the power supply must be maintained until the power supply is resumed, Since the capacity of the power supply device for supplying power to the auxiliary pneumatic unit 700 must be large, the volume occupied by the power supply device becomes large, and further, the power supply device is generally very expensive, .

Therefore, in the present invention, a vacuum pump driven by compressed air using the venturi principle can be employed as the auxiliary pneumatic unit 700. A typical example of this is a vacuum pump manufactured by Piab. Hereinafter, the vacuum pump of the present invention will be collectively referred to as a vacuum pump manufactured by Piab. The structure of the vacuum pump of the 'Piab' company discloses a structure in which compressed air is flowed by driving an initial valve or the like to supply pneumatic pressure by sucking ambient air without continuous power supply have. The vacuum pump structure of the 'Piab' company is well known in the related art, so a detailed description thereof will be omitted. Therefore, if a vacuum pump or the like of 'Piab' is employed as the second pneumatic unit 710 of the auxiliary pneumatic unit 700, it becomes possible to supply the pneumatic pressure without continuous power supply when the power supply is interrupted.

Generally, a manufacturing facility provided with a semiconductor package manufacturing apparatus is provided with a compressed air supply source 800 (for example, a compressor) for supplying compressed air regardless of electric power. Therefore, even if power supply is interrupted, May be continuously supplied from the compressed air supply source (800). Thus, in this embodiment, the second pneumatic flow path 730 is connected to the compressed air supply source 800 by the extended flow path 805, whereby the compressed air supply source 800 is connected to the second pneumatic part 710 Thereby supplying compressed air to be driven. More specifically, the second pneumatic valve 710 and the second check valve 750 are provided along the second pneumatic passage 730, and the second valve 830 is connected to the compressor supply source 800 And opens and closes the second air pressure passage 730 to selectively supply the supplied compressed air. As a result, the second valve 830 is provided between the compressed air supply source 800 and the second pneumatic portion 710 along the second pneumatic flow path 730. With the above arrangement, it is possible to drive the second pneumatic part 710 when the power supply is interrupted in an emergency situation. The second valve 830 is opened to supply the compressed air to the second pneumatic part 710 constituted by a vacuum pump of 'Piab' by the compressed air supply source 800, The air is pulled in accordance with the flow of the compressed air, so that a vacuum is generated due to the suction of the air.

However, in the above-described configuration, even when the power supply is abnormally terminated in the absence of the substrate in the adsorption unit 16, the auxiliary air pressure unit 700 provides air pressure to the adsorption unit 16. For example, when the substrate is removed, or when the supply of electricity is stopped before the substrate is supplied, the first valve 650 described above is closed by the power cutoff, and the second valve 830 is opened. When the second valve 80 is opened, compressed air is supplied from the compressed air supply source 800 to the second pneumatic portion 710 along the second pneumatic flow path 730. Thereby, air is supplied to the adsorption unit 16. This would unnecessarily provide pneumatic pressure to the adsorption unit 16, and thus a structure for preventing such driving is required.

Accordingly, in this embodiment, a third valve 810, which is provided at the front end of the second valve 830 along the second pneumatic passage 730, is opened by an electrical opening signal and is closed by an electrical closing signal . That is, the third valve 810 may be provided between the compressed air supply source 800 and the second valve 830 along the second pneumatic path 730. Here, the third valve 810 may be a double acting cylinder that is opened or closed according to an electrical signal. Further, the third valve 810 can be opened when the electric power supply to the cutting apparatus 1000 is terminated abnormally and the substrate is supplied to the suction unit 16. In this case, the electric opening signal may be supplied with electric power by a power supply device described later and an electric opening signal may be applied.

When the substrate is supplied to the adsorption unit 16 at the time of normal power supply, the first valve 650 of the first pneumatic flow path 630 is opened so that the third valve 810 is opened by an electrically open signal. However, since the second valve 830 is closed when the power is supplied, the second pneumatic part 710 is not driven and a pneumatic pressure is generated in the suction unit 16 by the first pneumatic part 610. On the other hand, at the time of removing the substrate of the adsorption unit 16 in the normal power supply condition, the first valve 650 is closed by shutting off the power supply of the first valve 650, and the third valve 810 is closed by the electric close signal Lt; / RTI > As a result, the vacuum state to the adsorption unit 16 by the first pneumatic part 610 is released. At the time of normal power supply, the second valve 830 is in a closed state, so that the second driving unit 710 is not driven at this time.

Conversely, when the substrate is supplied to the adsorption unit 16, or when power supply is interrupted during cutting, the first valve 650 is switched from the open state to the closed state, while the third valve 810 is switched to the electrical signal The solenoid valve does not receive the electrical closing signal and maintains the open state. In addition, the second valve 830 is opened because it is a single acting cylinder that is opened when power is interrupted. As a result, the second valve 830 and the third valve 810 are opened to communicate with the adsorption unit 16 through the second pneumatic flow path 730 connected to the compressed air supply source 800 for supplying compressed air. . In addition, as the compressed air is supplied, the second pneumatic portion 710 sucks the surrounding air in accordance with the flow of the compressed air, thereby generating air pressure in the adsorption unit 16.

On the other hand, when the substrate is not supplied to the adsorption unit 16, the first valve 650 is closed and the third valve 810 is also closed. Therefore, when the power supply is abnormally stopped in the state that the substrate is not supplied to the adsorption unit 16 as described above, the first valve 650 is kept closed when the power is cut off, (830) is opened because it is a single acting cylinder that opens when power is interrupted. In this case, the third valve 810 maintains the closed state as the first valve 650 since the electrical opening signal is not applied. As a result, when the power supply is interrupted while the substrate is not supplied to the adsorption unit 16, the first valve 650 and the third valve 810 are kept closed, so that the adsorption unit 16 is not provided with pneumatic pressure .

Meanwhile, although a compressed air supply source for supplying compressed air is provided as described above, a separate vacuum pump (for example, a water-sealed vacuum pump) is generally employed for the semiconductor package manufacturing apparatus. This is because there is a large difference in capacity between the vacuum pump of the 'Piab' company and the vacuum-type vacuum pump. As described above, the substrate holding force in the suction unit during substrate cutting is an important factor determining the cutting quality of the substrate. In order to overcome the rotational force of the high-speed cutting unit 18 and adsorb and fix the substrate, a strong holding force Is required. Therefore, the vacuum pump of the 'Piab' company is not applicable to the semiconductor package manufacturing apparatus. Accordingly, in order to temporarily hold the substrate with a vacuum force enough to hold the substrate without disturbing the power supply when the power supply is interrupted, the second pneumatic unit 710 of the auxiliary pneumatic unit 700 is connected to a vacuum pump a vacuum pump having a large capacity of a few horsepower is used as the first pneumatic unit 610 of the main pneumatic unit 600 when cutting the substrate at normal power supply or power supply resumption And the work is performed by adsorbing and fixing the material.

However, even in the case where the second pneumatic part 710 is provided as described above, a device for supplying power at the time of stopping the power supply may be required. For example, when a vacuum pump of 'Piab' is employed as the second pneumatic part 710, a second valve 830 for opening / closing the second pneumatic line 730, When the first valve 650 is opened and closed by an electrical signal, the first valve 650 is closed and the second pneumatic part 710 is started when the power supply is stopped, There is a need for a device that is capable of supplying power that allows the second valve 830 to be opened. This is because the power supply is difficult in a normal way when the power is stopped.

Further, even when the second pneumatic part 710 requiring a significantly lower power than the first pneumatic part 610 of the main pneumatic unit 600 is employed, a device capable of supplying power in an emergency such as a power failure in need. Therefore, in the present embodiment, it is possible to provide a power supply device capable of supplying power capable of driving the auxiliary pneumatic unit 700 when the power supply is abnormally terminated like a power failure.

The power supply device may be constituted by a so-called 'uninterruptible power supply (UPS)' capable of supplying power during a power failure, for example. The power supply requires power to start the second pneumatic unit 710 or requires significantly less power than the main pneumatic unit 600 to drive the second pneumatic unit 710 It is possible to have a small capacity. Specifically, in the case of employing the vacuum pump of the above-mentioned 'Piab', a power supply having a capacity enough to open and close the first valve 650 or the second valve 830 is sufficient.

Meanwhile, the cutting apparatus 1000 may include a recognition storage unit 900 for recognizing the position of the cutting unit 18 on the cutting path in real time and storing the position information and the cutting path. Specifically, the recognition storage unit 900 includes a recognition unit 910 for recognizing the position of the cutting unit 18 on the cutting path in real time and transmitting the position information, and a recognition unit 910 for storing the cutting path, And a storage unit 930 for storing location information transmitted in real time.

When the substrate is cut by the cutting unit 18, the substrate is cut along a predetermined path according to the shape of the semiconductor package. Specifically, the cutting unit 18 determines the cutting path to be cut, stores the cutting path in the storage unit 930, and cuts the substrate along the cutting path. In this case, the recognition unit 910 recognizes the position of the cutting unit 18, specifically, the position of the cutting unit 18 (or the position of the blade 19) on the predetermined cutting path in real time, 930 to transmit the position information. The recognition unit 910 may be configured in various ways, such as recognizing a position with a camera device such as a vision, or recognizing a position with a motor value of a cutting unit.

The storage unit 930 stores the cutting path and further stores the position information transmitted from the recognition unit 910 in real time. In this embodiment, the storage unit 930 may include a so-called 'non-volatile memory (NVM)' capable of continuously retaining stored information even when power supply is interrupted. For example, if a storage unit is configured with a 'volatile memory', since the already stored location information is erased when a situation such as a power failure occurs, the process can not be continuously performed when the power supply is resumed.

On the other hand, the storage unit 930 may periodically store the position information at predetermined time intervals. However, if the emergency information such as a power failure occurs, the position information of the power failure point is stored . That is, if the power is interrupted during the period in which the position information is stored, there is a problem that the accurate position information of the point of time when the power is stopped can not be known. Accordingly, it is preferable that the storage unit 930 stores the positional information transmitted from the recognition unit 910 in real time.

On the other hand, since the storage capacity may be larger than necessary in order to continuously store the position information, the position information may be stored in units of substrates and the stored position information may be deleted when the cutting process is completed for one substrate. For example, when the substrate is sucked and fixed to the absorption unit 16 and the cutting process is started, the storage unit 930 stores the position information transmitted from the recognition unit 910 in real time. On the other hand, if the cutting process is normally terminated without stopping, the storage unit 930 deletes the position information stored during cutting the substrate, thereby securing a storage space for storing the position information of the subsequent substrate. Accordingly, the storage unit 930 can efficiently store the position information of the cutting unit 18 despite the small capacity.

Hereinafter, driving of the cutting apparatus 1000 having the above-described structure will be described with reference to the drawings.

3, the main pneumatic unit 600 is connected to the adsorption unit 16 by the first pneumatic flow path 630 and the auxiliary pneumatic unit 700 is connected to the adsorption unit 163 by the second pneumatic flow path 730. [ 16). In this case, the second pneumatic passage 730 and the first pneumatic passage 630 connected to the adsorption unit 16 may be branched via a manifold, for example.

When the power is normally supplied, the first pneumatic portion 610 of the main pneumatic unit 600 is driven to vacuum the adsorption unit 16 along the first pneumatic flow path 630 to adsorb and fix the substrate do. At this time, the first pneumatic part 610 of the first pneumatic unit 600 may be a water-pneumatic vacuum pump having a capacity of a horsepower which is driven when electric power is supplied.

When the substrate to be cut is supplied to the suction unit 16, electricity is applied to the first valve 650 to maintain the first valve 650 in an open state when power is normally supplied. When the first valve 650 is opened, the first pneumatic portion 610 of the main pneumatic unit 600 and the adsorption unit 16 communicate with each other through the first pneumatic flow path 630, and the first pneumatic portion 610 ) Forms a vacuum in the adsorption unit 16 to adsorb and fix the substrate. Then, the cutting process is performed by reciprocating motion and rotational motion of the adsorption unit 16 and driving of the cutting unit 18. The cutting unit 18 carries out the cutting process by cutting the substrate along a predetermined cutting path. In this case, the recognition unit 910 recognizes the position of the cutting unit 18 on the cutting path in real time, and transmits the position to the storage unit 930. The storage unit 930 stores the transmitted location information in real time. On the other hand, when the power is normally supplied to the auxiliary pneumatic unit 700, the second valve 830 is not opened and is not driven.

Conversely, when the cutting operation of the substrate is completed and the substrate is removed from the adsorption unit 16, or when no substrate is supplied to the adsorption unit 16, the power of the first valve 650 is cut off, 650) to the closed state. When the first valve 650 is closed, the first pneumatic portion 610 of the main pneumatic unit 600 is disconnected from the adsorption unit 16 and the vacuum is released to the adsorption unit 16, The substrate can be removed. It is preferable that the first valve 650 is a single acting cylinder which is opened or closed according to the presence or absence of electric power application as described above. Of course, it is possible to adopt a double-acting cylinder which is opened or closed by an electrical signal, but it is preferable that the single-acting cylinder is used for fast and smooth driving of the second pneumatic part 710 using compressed air as a driving source by using the venturi principle .

Then, when an emergency such as a power failure occurs and the power supply is abnormally stopped, the main pneumatic unit 600 is not driven by power interruption, and no pneumatic pressure is generated through the first pneumatic flow path 630. Of course, as described above, since the first valve 650 of the main supply unit 600 is switched to the closed state by the power interruption, the connection between the first pneumatic flow path 630 and the adsorption unit 16 is interrupted It is also not supplied with air pressure.

In this case, the auxiliary pneumatic unit 700 is driven. That is, by driving the auxiliary pneumatic unit 700, a vacuum is formed in the adsorption unit 16, so that the adsorption unit 16 can continuously adsorb and fix the substrate. On the other hand, when the power supply is interrupted, the recognition unit 910 does not transmit the position information any more, and the storage unit 930 stores the position information at the time when the power supply is stopped.

As mentioned above, the second pneumatic portion 710 of the auxiliary pneumatic unit 700 is typically used to powerfully supply compressed air supplied from a compressed air supply source 800, such as a compressor, It is preferable to use a vacuum pump. Since the compressed air is supplied irrespective of the interruption of the power supply.

The second valve 830 is also provided in the second pneumatic passage 730 connecting the auxiliary pneumatic unit 700 and the adsorption unit 16 like the main pneumatic unit 600. The second valve 830 is provided in the second air pressure passage 730 to selectively connect the compressed air supply source 800 and the second air pressure portion 710. Accordingly, when power is normally supplied, the second valve 830 is closed to cut off the communication between the compressed air supply source 800 and the second pneumatic part 710, and when the power supply is interrupted, the second valve 830 Is opened to connect the compressed air supply source 800 and the second pneumatic part 710 to provide the pneumatic pressure to the suction unit 16 by the second pneumatic part 710. For this, the second valve 830 is preferably a single acting solenoid valve which is opened or closed depending on whether or not electric power is applied as described above.

Specifically, the second valve 830 is preferably closed when electricity is applied and opened when the supply of electricity is interrupted. Accordingly, when the power is supplied, the second valve 830 is closed and the second pneumatic part 710 is not driven. On the other hand, when the power supply is interrupted, the second valve 830 is opened to open the second pneumatic part 710, And the second pneumatic portion 710 forms a vacuum in the adsorption unit 16. [

In addition to the cutting operation of the substrate, the power supply may be interrupted due to an emergency such as a power failure or an emergency. In this case, it is preferable that the second pneumatic part 710 is driven so that the vacuum is not formed in the absorption unit 16, so that the second pneumatic part 710 is not driven. That is, when the substrate is supplied to the adsorption unit 16, or when the supply of electricity is interrupted during cutting, the adsorption unit 16 should be kept at the vacuum pressure to maintain the adsorption fixed state of the substrate. However, when the supply of electricity is stopped in the state in which the substrate is removed from the adsorption unit 16 or before the substrate is supplied to the adsorption unit 16, it is not necessary to maintain the vacuum pressure of the adsorption unit 16, It is preferable to drive the second driving unit 710 in accordance with the presence or absence of the substrate of the absorption unit 16. [ Accordingly, the third valve 810 may be provided in the second pneumatic passage 730 as described above. The third valve 810 is opened and closed in conjunction with the first valve 650 when normal power is supplied. That is, in normal power supply, the third valve 810 is opened when the first valve 650 is opened, and closed when the first valve 650 is closed. The third valve 810 is preferably a double acting cylinder which is opened or closed in accordance with an electrical signal.

When the substrate is supplied to the adsorption unit 16 during normal power supply, the first valve 650 of the first pneumatic flow path 610 is opened, and accordingly, the third valve 810 is also opened. However, since the second valve 830 is closed when the power is supplied, the second pneumatic part 710 is not driven and a pneumatic pressure is generated in the suction unit 16 by the first pneumatic part 610.

On the other hand, at the time of removing the substrate of the adsorption unit 16 in the normal power supply condition, the first valve 650 is shut off by shutting off the power supply to the first valve 650, thereby closing the third valve 810 as well. As a result, the vacuum state of the adsorption unit 16 by the first pneumatic part 610 is released. At the time of normal power supply, the second valve 830 is in a closed state, so that the second driving unit 710 is also not driven.

However, when the substrate is supplied to the adsorption unit 16 or when the power supply is abnormally stopped during the cutting process, the first valve 650 is switched from the open state to the closed state, Is a double acting solenoid valve which is opened and closed by an electrical signal, and thus the solenoid valve remains open. In addition, the second valve 830 is also opened because it is a single-acting cylinder that is opened when power is interrupted. Accordingly, the second valve 830 and the third valve 810 are opened to communicate with the adsorption unit 16 through the second pneumatic flow path 730 connected to the compressed air supply source 800 that supplies compressed air. . In addition, as the compressed air is supplied, the second pneumatic portion 710 sucks the surrounding air in accordance with the flow of the compressed air, thereby generating air pressure in the adsorption unit 16.

On the other hand, when the substrate is not supplied to the adsorption unit 16, the first valve 650 is closed and the third valve 810 is also closed. Therefore, when the power supply is abnormally stopped in the state that the substrate is not supplied to the adsorption unit 16 as described above, the first valve 650 is kept closed when the power is cut off, (830) is opened because it is a single acting cylinder that opens when power is interrupted. In this case, the third valve 810 maintains the closed state as the first valve 650 since the electrical opening signal is not applied. As a result, when the power supply is interrupted while the substrate is not supplied to the adsorption unit 16, the first valve 650 and the third valve 810 are kept closed, so that the adsorption unit 16 is not provided with pneumatic pressure .

Of course, the first valve 650 may be a double-acting cylinder that is opened and closed by an electrical signal. In this case, the first valve 650 can be opened and closed by the power supply device described above. The capacity of the power supply device is sufficient to close the first valve (OFF).

Specifically, when the power supply is interrupted, the power supply supplies electric power to the control unit, and the control unit closes the first valve 650 by applying a closing signal to the first valve 650. When the power supply is resumed within a predetermined time after the power supply is abnormally stopped as described above, an open signal is applied to the first valve 650 to be supplied to the suction unit 16 by the main pneumatic unit 600 Again provide pneumatic. On the other hand, when the power supply is resumed, the position information (stop position) of the cutting path and the power supply stop time is stored in the storage unit 930, so that the cutting unit 18 moves the cutting path Then, the cutting process is started again.

Similarly, when the second valve 830 of the auxiliary pneumatic unit 700 is a double-acting cylinder that is opened and closed by an electrical signal, the second valve 830 can be opened by the power supply when the power supply is interrupted. The capacity of the power supply device is sufficient to allow the second valve to be turned ON.

Specifically, when the power supply is interrupted, the power supply supplies power to the control unit, and the control unit applies the open signal to the second valve 830 to open the second valve 830. When the power supply is resumed within a predetermined time after the power supply is abnormally stopped as described above, the main pneumatic unit 600 provides the pneumatic pressure to the suction unit 16 again. In this case, when the power supply is resumed, the resumed power applies the closing signal to the second valve 830, while the position information (stop position) at the time when the cutting path and the power supply are stopped is stored in the storage portion Thus, the cutting unit starts the cutting process again along the cutting path at the stop position.

4 is a schematic view showing a configuration of a cutting apparatus 1000 according to another embodiment. 4 is provided with a fourth valve 690 composed of a three-way valve and is connected to the first pneumatic flow path 630 of the main pneumatic unit 600 and the second pneumatic flow path 630 of the auxiliary pneumatic unit 700, (730) to the suction unit (16). Hereinafter, the differences will be mainly discussed.

4, the cutting apparatus 1000 includes an adsorption unit 16, a cutting unit 18, and a recognition storage unit 900. The components are similar to the above-described embodiment, Is omitted.

The cutting apparatus 1000 according to the present embodiment includes a main pneumatic unit 600 and the main pneumatic unit 600 is connected to the suction unit 16 through the first pneumatic flow path 630. [ The second pneumatic flow path 730 of the auxiliary pneumatic unit 700 is connected to the first pneumatic flow path 630 through the fourth valve 690. The fourth pneumatic flow path 730 includes a third valve 690, Gt; 630 < / RTI >

That is, the second pneumatic passage 730 of the auxiliary pneumatic unit 700 is connected to the fourth valve 690 and is connected to the first pneumatic passage 630, thereby being connected to the adsorption unit 16. The fourth valve 690 connects the first pneumatic part 610 and the second pneumatic part 710 to the suction unit 16 selectively.

In this case, the power supply device described above controls the opening and closing by supplying electric power to the fourth valve 690. That is, when the power is normally supplied, the fourth valve 690 connects the first pneumatic flow path 630 and the adsorption unit 16, and supplies the pneumatic pressure to the adsorption unit 16 by the main pneumatic unit 600 do. However, when the power supply is abnormally stopped, such as a power failure, the power supply apparatus controls the fourth valve 690 to connect the second pneumatic flow path 730 to the suction unit 16, To provide air pressure to the adsorption unit (16). When the power supply is resumed, the power supply unit controls the fourth valve 690 to cut off the connection between the second pneumatic path 730 and the adsorption unit 16, and the first pneumatic path 630 and the adsorption unit 16).

On the other hand, if the power supply is abnormally stopped during driving of the cutting unit 18, that is, while the blade 19 is rotating, the blade 19 is still in contact with the substrate. In this case, if power is normally supplied again and the blade 19 is rotated immediately in a state in contact with the substrate, cutting is performed on the substrate in a state in which the rotation rpm is not sufficient, so that the cutting process is not smoothly performed, And the substrate may be damaged. Therefore, in the case where the power supply is abnormally stopped during driving of the cutting unit 18, that is, while the blade 19 is rotating, the power supply apparatus can supply electric power such that the cutting unit 18 can move upward by a predetermined distance have. In this case, since the electric power required to simply move the cutting unit 18 upward by a predetermined distance is required, the electric power supply device may suffice with a low capacity.

For example, if the power supply is abnormally stopped during driving of the cutting unit 18, that is, while the blade 19 is rotating, the power supply supplies electric power to the cutting unit 18, Is moved upward by a predetermined distance to separate the cutting unit 18 from the substrate by a predetermined distance. Then, when the power supply is resumed, the cutting unit 18 moves downward again to cut the substrate by the blade 19 when the blade 19 rotates at a sufficient rpm.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. You can do it. It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

10 semiconductor package manufacturing apparatus 16 ... absorption unit
18 ... cutting unit 100 ... suction unit
110 ... suction table 200 ... moving part
300 ... rotational motion part 400 ... linear motion part
600 ... main pneumatic unit 700 ... auxiliary pneumatic unit
800 ... recognition storage unit

Claims (20)

An adsorption unit capable of performing linear reciprocating motion and rotational motion by adsorbing and fixing a substrate;
A cutting unit which is vertically movable with respect to the suction unit and cuts the substrate in individual units along a cutting path;
A main pneumatic unit that provides pneumatic pressure to the adsorption unit to adsorb the substrate upon normal power supply;
An auxiliary pneumatic unit that provides pneumatic pressure to the adsorption unit when the power supply is abnormally terminated; And
And a recognition storage unit for recognizing the position of the cutting unit on the cutting path in real time and storing the position information and the cutting path. The method according to claim 1,
Wherein the stop position on the cutting path is stored in the recognition storage unit when the power supply to the cutting apparatus is interrupted, and the pneumatic pressure is provided by the auxiliary pneumatic unit. 3. The method of claim 2,
Providing a pneumatic pressure by said main pneumatic unit when power supply to said cutting device is resumed, said cutting unit being further to cut said substrate along said cutting path at said rest position. The method according to claim 1,
The main pneumatic unit
A first pneumatic passage communicating with the adsorption unit; And
And a first pneumatic portion that provides pneumatic pressure along the first pneumatic flow path. 5. The method of claim 4,
Further comprising a first valve for opening and closing the first pneumatic flow passage in the first pneumatic flow path. 6. The method of claim 5,
Wherein the first valve is opened when power is applied and closed when power is interrupted. 6. The method of claim 5,
Further comprising a first check valve connected to the first pneumatic flow path in association with opening and closing of the first valve and opened when the first valve is opened and closed when the first valve is closed. . The method according to claim 1,
The auxiliary pneumatic unit
A second pneumatic passage connected to the adsorption unit;
And a second pneumatic portion selectively providing pneumatic pressure along the second pneumatic flow path. 9. The method of claim 8,
Wherein the second pneumatic portion is a vacuum generator that uses a venturi principle to drive compressed air with power. 9. The method of claim 8,
Wherein the second pneumatic flow path is connected to a source of compressed air for supplying compressed air for driving the second pneumatic portion. 11. The method of claim 10,
The auxiliary pneumatic unit
Further comprising a second valve for opening / closing the second pneumatic flow passage so as to selectively supply the compressed air supplied from the compressor supply source. 12. The method of claim 11,
Wherein the second valve is closed when power is applied and is opened when power is interrupted. 13. The method of claim 12,
Further comprising a third valve provided at a front end of the second valve along the second pneumatic flow passage, the third valve being opened by an electrical open signal and being closed by an electrical close signal, When the supply is abnormally terminated and the substrate is supplied to the adsorption unit. 12. The method of claim 11,
Further comprising a second check valve in the second pneumatic flow passage that is interlocked with the opening and closing of the second valve and opens together when the second valve is opened and closes when the second valve is closed. . The method according to claim 1,
The main pneumatic unit
A first pneumatic passage communicating with the adsorption unit, a first pneumatic portion providing pneumatic pressure along the first pneumatic passage, and a first valve opening / closing the first pneumatic passage,
Wherein the auxiliary pneumatic unit includes a second air pressure passage connected to the adsorption unit, a second air pressure portion for providing air pressure along the second air pressure passage, a second valve for opening and closing the second air pressure passage, And a third valve that is opened when the first valve is opened in conjunction with the operation of the first valve when normal power is supplied, and is closed together when the first valve is closed. 16. The method of claim 15,
Wherein the third valve is opened by an electrical open signal and is closed by an electrical close signal. 17. The method of claim 16,
Wherein the auxiliary pneumatic unit further comprises a power supply device for driving the second pneumatic part when the power supply is abnormally terminated. 18. The method of claim 17,
Further comprising a fourth valve for selectively connecting the first pneumatic flow path and the second pneumatic flow path to the adsorption unit,
The fourth valve connects the second pneumatic flow path and the adsorption unit by the power supply device when the power supply to the cutting device abnormally ends, and when the power supply is resumed, the fourth pneumatic pressure And connects the flow path and the adsorption unit. The method according to claim 1,
Wherein the cutting unit is spaced a predetermined distance from the substrate when the power supply to the cutting device is abnormally terminated. The method according to claim 1,
The recognition storage unit
A recognition unit for recognizing the position of the cutting unit on the cutting path in real time and transmitting the position information; And
And a storage unit for storing the cutting path and storing the position information transmitted from the recognition unit in real time.
KR1020120147958A 2012-12-18 2012-12-18 Sawing device KR20140078820A (en)

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