KR20140062552A - Substrate processing module and substrate processing system having the same - Google Patents

Abstract

The present invention relates to a substrate processing system and, more particularly, to a substrate processing module and a substrate processing system having the same, which can perform substrate process such as ion radiation on a substrate. The disclosed substrate processing module includes a processing chamber forming a sealed processing space, performs substrate process when a rectangular substrate is seated on one or more substrate processing positions set on a tray, and includes a substrate arranging unit for arranging the position of the substrate on the substrate processing position set on the tray.

Description

[0001] DESCRIPTION [0002] Substrate processing module and substrate processing system having same [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing system, and more particularly, to a substrate processing module for performing substrate processing such as irradiating a substrate with ions and a substrate processing system having the same.

There are a thermal diffusion method and an ion irradiation method as a method of forming a semiconductor region, that is, a pn junction structure in a semiconductor substrate, a glass substrate for an LCD panel, a substrate for an OLED panel, and a solar cell substrate.

However, when the impurity is implanted by the thermal diffusion method, the process uniformity is not uniform when doping POCl3 for impurity implantation. In the case of using POCl3, removal of the PSG film formed as a byproduct on the substrate surface after deposition, And removal of side semiconductor structure (edge isolation) are complicated and the whole process time is prolonged.

On the other hand, the ion irradiation method in which ions are injected into a substrate by irradiating ions is easier to control than a thermal diffusion method, and impurities can be injected precisely.

On the other hand, the substrate processing module for irradiating ions to the surface of the substrate as described above generally includes an ion beam source and a configuration for injecting ions into the substrate by irradiating the ion beam generated from the ion beam source to a substrate placed in a station provided in a closed processing space do.

However, in the conventional substrate processing module as described above, the ion irradiation process is performed by a single ion beam source, so that the ion irradiation pattern is limited and it is difficult to mass-process the ion irradiation.

Further, in order to perform the ion irradiation process with various patterns, it is required to be performed by a plurality of substrate processing modules, so that the processing is complicated, the apparatus is expensive, and the space occupied by the apparatus becomes large.

In addition, the conventional substrate processing module is complicated and requires a long process time, such as a substrate replacement after the ion implantation and a device for moving the ion beam as the ion implantation is performed while moving the ion beam while the substrate is fixed, There is a problem.

In order to solve such a problem, a substrate processing module has been disclosed in which, as another conventional substrate processing module, an ion beam irradiating device for scanning an ion beam is fixed and a tray on which at least one substrate is placed is passed through an irradiation area irradiated with an ion beam .

However, since a conventional substrate processing module using a tray requires a larger number of substrates to be loaded and introduced when the substrate is introduced into the process chamber, the size of the tray on which the substrate is loaded increases, There is an increasing problem.

In addition, since the conventional substrate processing module using the tray is loaded in the standby state, the substrate is loaded into the process chamber in the vacuum pneumatic state after the substrate is loaded, and moisture is absorbed into the tray of the graphite material in the atmospheric environment, There is a problem in that the entire process speed is lowered and the productivity is lowered.

Also, in the conventional substrate processing module using a tray, a mask is installed in a process chamber, and ions are injected while a tray moves, so that only ion implantation with a line-shaped pattern is possible and ion implantation with various patterns is impossible .

Furthermore, there is no alignment device for aligning the position of the substrate with respect to the mask in the patterned ion implantation on the substrate, so that there is a problem that precise patterned ion implantation is not possible.

It is an object of the present invention to further provide a substrate alignment unit for aligning the position of a substrate to a predetermined substrate processing position on a tray when the substrate processing is performed with at least one substrate placed on a tray, And a substrate processing system having the substrate processing module.

It is another object of the present invention to provide a substrate processing apparatus and a substrate processing method which can perform a substrate processing of a wider variety of patterns by providing a mask for performing patterned substrate processing on a tray on which a substrate is placed and further arranging a substrate alignment unit for aligning the position of the substrate with respect to the mask And a substrate processing system having the substrate processing module.

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a process chamber for forming a closed process space, in which a rectangular substrate is placed at one or more substrate processing positions set in a tray A substrate processing module for performing a substrate processing, the substrate processing module further comprising a substrate aligning portion for aligning the position of the substrate with the substrate processing position set in the tray.

The substrate aligning unit includes a first stopper and a second stopper corresponding to a substrate processing position set in the tray and restricting movement of the substrate in the X-axis direction and the Y-axis direction, respectively, and a second stopper And a second substrate linear movement unit for aligning the substrate by moving the substrate toward the second stopper in the Y axis direction.

The first substrate linear moving part and the second substrate linear moving part may include a plurality of rollers installed vertically through the incision part formed in the tray and supporting the bottom surface of the substrate to move the substrate by rotation .

At least one of the first stopper and the second stopper is installed to vertically move through a cut portion formed in the tray so as to be vertically movable and may protrude upward from the tray only when the position of the substrate is aligned.

The first stopper and the second stopper may be installed in the tray.

The substrate processing module may perform the substrate processing while the tray on which the substrate is mounted moves in the process chamber.

The process chamber may include an ion beam irradiator installed in the process chamber to irradiate ions to a substrate transferred by the tray.

Wherein either one of the process chamber and the tray is provided with a mask having an opening pattern for irradiating a patterned ion beam onto the substrate and the substrate processing position may be an alignment position with respect to the mask.

Wherein the transfer path is set such that the ion beam is irradiated to the substrate placed on the tray by the ion beam irradiating unit and the ion beam irradiating section is irradiated with the ion beam irradiating section, And a tray return section connecting the front end and the rear end of the ion beam irradiation section to be circulated.

In the tray return period, a loading position at which the tray receives the substrate from the outside and an unloading position at which the substrate is taken out may be set.

The process chamber may be formed with a first gate to which the substrate is introduced adjacent to the loading position and a second gate to which the substrate is transferred adjacent to the unloading position.

Wherein the process chamber is provided with a first substrate transferring portion for supporting the substrate when the substrate is introduced from the outside at the loading position and positioning the substrate on the tray at a predetermined substrate position for substrate processing, The second substrate transferring unit may be provided to support and move the substrate and take it out to the outside from the tray positioned at the unloading position.

The present invention also relates to a substrate processing module having the above-described structure; A first buffer module coupled to the substrate processing module to transfer a tray through a first gate of the process chamber; And a second buffer module coupled to the substrate processing module to receive a tray through a second gate of the process chamber.

The first buffer module and the second buffer module may be maintained at a vacuum pressure, or the pressure may be changed between an atmospheric pressure and a process pressure.

Wherein the first buffer module transfers each of the substrates loaded in the cassette to a tray positioned at a loading position in the substrate processing module after a cassette on which a plurality of substrates are loaded is loaded, The substrate can be loaded into the cassette from the tray located at the unloading position in the substrate processing module after the cassette on which the substrates of the substrate are loaded.

A substrate processing module and a substrate processing system having the substrate processing module according to the present invention include a substrate aligning portion for aligning a position of a substrate to a predetermined substrate processing position on a tray when the substrate processing is performed while one or more substrates are placed on a tray By additionally providing the substrate processing apparatus, there is an advantage that more accurate substrate processing can be performed.

Further, the substrate processing module and the substrate processing system having the substrate processing module according to the present invention may further include a substrate aligning part for arranging a mask for performing patterned substrate processing on the tray on which the substrate is placed and aligning the position of the substrate with respect to the mask So that there is an advantage that the substrate processing of a wider variety of patterns can be performed.

Further, the substrate processing module and the substrate processing system having the substrate processing module according to the present invention may be configured such that the tray is circulated only in the process chamber, the substrate is received from the outside and is loaded on the tray, There is an advantage in that the size of the antenna can be minimized.

Also, in the case of an in-line system comprising a load lock module, a substrate processing module and an unload lock module, a conventional substrate processing system for performing ion implantation while loading and transporting a substrate to and from a tray, It is difficult to perform a smooth ion implantation process. However, in the substrate processing module and the substrate processing system having the same according to the present invention, the tray is circulated only in the process chamber, There is no problem that only the substrate is introduced into the substrate processing module and the tray is not exposed to the atmosphere to absorb moisture and foreign matter into the tray, Can be performed.

In particular, when water remains in the tray, the time required for the vacuum pressure conversion in the load lock chamber increases, thereby increasing the overall process time. However, the present invention is not limited to this, There is no problem, and there is an advantage that a faster ion implantation process can be performed.

1 is a conceptual view showing a substrate processing system according to a first embodiment of the present invention.
2A is a plan view illustrating a process of introducing a substrate into the substrate processing module in FIG.
2B is a plan view showing the first substrate alignment unit and the second substrate alignment unit of the substrate processing system of FIG.
FIGS. 3A and 3B are side views illustrating the process of introducing a substrate into the substrate processing module in FIG.
4 is a conceptual diagram showing a substrate processing system according to a second embodiment of the present invention.

Hereinafter, a substrate processing module and a substrate processing system having the substrate processing module according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 4, the substrate processing module 100 includes a process chamber 110 for forming a closed processing space S, and a tray (not shown) on which at least one substrate 10 is placed A substrate processing module for performing substrate processing in a state in which a substrate (10) is seated in at least one substrate processing position set in a substrate (20) And an alignment unit is further provided.

As shown in FIGS. 1 and 4, the ion beam irradiating unit 150 may be used to process the substrate by the substrate processing module 100, Various arrangements such as ion implantation while moving the tray 20 are possible.

1 to 3B, the substrate processing module 100 according to the first embodiment of the present invention forms an enclosed processing space S and includes at least one gate 111 And a transfer path 120 through which one or more trays 20 are circulated is installed and a processing chamber 110 for irradiating ions to the substrate 10 transported by the tray 20, And an ion beam irradiating unit 150 installed in the ion beam irradiating unit 150.

Here, the substrate 10 to be treated may be a semiconductor substrate, a glass substrate for an LCD panel, a substrate for an OLED panel, a substrate for a solar cell, or the like.

Particularly, the substrate 10 to be subjected to the substrate processing of the substrate processing module 100 according to the present invention is preferably a silicon substrate for a solar battery. At this time, ions irradiated by the ion beam irradiating unit 150 are irradiated onto the surface of the substrate 10, And may be ions forming a semiconductor region.

When the substrate to be processed is a silicon substrate for a solar cell, the semiconductor region formed on the surface of the substrate 10 may be a selective emitter or an n-type semiconductor region and a p-type semiconductor region for forming an IBC .

The tray 20 is installed in the process chamber 110 so as to circulate therein, and can be configured in various ways as a structure for loading and transporting one or more substrates 10.

For example, the tray 20 may have any structure as long as it can stably support the substrate 10 such as graphite.

The tray 20 may have a rectangular shape in plan view. The linear movement direction of the substrate 10 loaded on the tray 20 at a loading position and an unloading position, which will be described later, And the direction orthogonal to the longitudinal direction (X-axis direction) is the width direction (Y-axis direction), the tray 20 is arranged in an nx m array (n is a natural number of 1 or more and m is a natural number of 2 or more).

The tray 20 may also be configured to circulate in a line or circulate in a plurality of rows along the transport path 120 within the process chamber 110.

Particularly, the tray 20 circulating along the conveyance path 120 set in the process chamber 110 may be composed of one or a plurality of materials. In consideration of the loading and unloading time of the substrate 10, It can be installed in an appropriate number.

Also, the tray 20 may be fixedly or removably installed with a mask 30 having one or more openings for irradiating the substrate 10 with patterned ion beams.

Here, the mask 30 can be opened frontward and rearward along the linear movement direction for introduction or ejection of the substrate 10 loaded on the tray 20 at the loading position and the unloading position.

The mask 30 may be installed between the process chamber 100 and the transfer path 120 through which the tray 20 is transferred, instead of being coupled to the tray 20.

The process chamber 110 has a configuration in which an ion beam can be injected into the substrate 10 by the ion beam irradiating unit 150 and a transfer path 120 through which the tray 20 is circulated is set, It is possible.

The process chamber 110 may include, for example, a chamber body and an upper lid that are detachably coupled to each other to form a closed processing space S.

The chamber body may be formed with one or more gates 111 and 112 for the entrance and exit of the tray 20 and may be connected to the exhaust system for exhaust and pressure control in the process space S. [

The first gate 111 and the second gate 112 may be opened and closed by gate valves 210 and 220 for stable ion beam irradiation and may be connected to the first buffer module 400, When the first buffer module 400 and the second buffer module 500 are maintained at a vacuum pressure, the first buffer module 400 and the second buffer module 500 are kept open without being opened and closed by the gate valves 210 and 220, .

The ion beam irradiating unit 150 guides the ion beam generated from the ion beam source and controls the intensity and concentration of the ion beam to irradiate an irradiation region suitable for ion implantation on the surface of the substrate 10 to the substrate 10 ) Surface.

The transfer path 120 is set in the process chamber 110 so that one or more trays 20 are circulated and an ion beam is irradiated onto the substrate 10 placed on the tray 20 by the ion beam irradiating unit 150 Ion beam irradiation period.

The conveyance path 120 is a path through which the tray 20 is circulated in the process chamber 110 and a plurality of conveyance rollers 130 are installed in accordance with the conveyance method of the tray 20 .

The transfer roller 130 is driven by a driving device (not shown) installed in the process chamber 110 and is installed in the process chamber 110 to support the bottom surface of the tray 20, 20 can be conveyed.

For example, the conveying roller 130 may be rotatably installed by a frame (not shown) installed in the process chamber 110, and may be rotatably driven by various methods such as a chain, a belt, and a gear.

The transfer path 120 may include an ion beam irradiating the substrate 10 placed on the tray 20 by the ion beam irradiating unit 150 so as to circulate the tray 20 in the process chamber 110. [ And a tray return section connecting the front end and the rear end of the ion beam irradiation section such that the tray 20 is circulated together with the ion beam irradiation section.

The transport path 120, and particularly the tray return period, may be a loading position in which the tray 20 receives the substrate 10 from the outside, and an unloading position in which the substrate 20 is unloaded from the tray 20 Respectively.

The loading position and the unloading position are positions at which the tray 20 receives the substrate 10 from the outside and positions at which the tray 20 is transferred from the ion beam irradiation section to the outside, And may be positioned in the process chamber 110 in an appropriate position depending on the manner of introduction and discharge of the substrate 10.

As an example, the process chamber 110 may be formed of a material that is introduced through a first gate 111 formed at one side in the process chamber 110 and formed at a position opposite the first gate 111, 2 gate 112, the loading position and the unloading position are located adjacent to the first gate 111 and the second gate 112, respectively, in the process chamber 110.

Also, when the process chamber 110 is formed with one gate in the process chamber 110, and the substrate 10 is introduced and discharged therefrom, the loading position and the unloading position are the same at the transfer path 120 Can be set.

On the other hand, at the loading position, alignment of the substrate 10, for example, alignment with respect to the mask 30 provided on the tray 20, can be performed after the introduction of the substrate 10 with the substrate aligning portion described later.

Here, of course, the substrate aligning part may be arranged at the front end between the ion implanting areas in addition to the loading position so that the alignment of the substrate 10, for example, alignment with respect to the mask 30 provided on the tray 20, can be performed.

The transfer path 120 may be configured in various ways according to the circulation manner of the tray 20 in the process chamber 110. For example, the transfer path 120 may include a first path 121 forming a part of a tray return period, And a second path 122 positioned above the path 121 and forming a part of the tray return period and an ion beam irradiation period.

Here, the loading position and the unloading position are determined according to the position where the first gate 111 formed in the process chamber 110 and the second gate 112 are formed, as described above.

When the first path 121 and the second path 122 are vertically disposed, the process chamber 110 is moved up from the first path 121 to the second path 122 by raising the tray 20 (Not shown) for conveying the tray 20 from the second path 122 to the first path 121 may be installed on the first path 121 .

The first tray transfer unit and the second tray transfer unit are installed in the process chamber 110 to support the tray 20 so as to raise or lower the tray 20. The tray 20 is supported by the tray 20, Various methods are possible.

At this time, the conveying rollers 130 installed on the second path 122 are moved in the vertical direction of the tray 20 to prevent the trays 20 from interfering with the raising or lowering of the tray 20 by the first tray transmitting unit and the second tray transmitting unit. It is preferable to be provided so as to be movable in the width direction.

That is, when the tray 20 positioned in the second path 122 is conveyed to the first path 121 by the first tray conveying unit, the conveying rollers 130 installed in the first path 1221 may have a width When the tray 20 is moved to the first path 121, the tray 20 is moved in the opposite direction to move the tray 20 along the first path 121 while supporting the tray 20.

The tray 20, which has been moved along the first path 121, is moved to the second path 122 by the support and descent of the second tray transfer part. At this time, the conveying roller 130 is moved to extend the opposite width to prevent interference when the tray 20 is lowered. After the tray 20 is lowered, the conveying roller 130 is moved in the opposite direction to move along the second path 122 And supports the next tray 20 to be transported.

The loading position and the unloading position may be located at the same position, or may be positioned at various positions such as located at both ends of the first path 121 or the second path 122, respectively.

On the other hand, in the process chamber 110, when the tray 20 is not provided in the transfer beam irradiation section, the inner wall of the process chamber 110 is exposed to the ion beam, thereby damaging the inner wall of the process chamber 110.

The process chamber 110 may further include an ion beam blocking unit 180 for preventing the ion beam from being irradiated to the process chamber 110.

The ion beam cutoff unit 180 may have any structure as long as it can prevent the ion beam from being irradiated to the process chamber 110.

For example, as shown in FIG. 1, the ion beam blocking portion 180 may have a plurality of irregularities formed on its upper surface to scatter the irradiated ion beam.

The plurality of irregularities scatter the ion beam irradiated to the ion beam shielding part 180, thereby minimizing the temperature rise of the ion beam shielding part 180 according to the irradiation of the ion beam and suppressing the evaporation effect.

1, the ion beam blocking portion 180 may include at least one upper plate portion irradiated with an ion beam and at least one cooling portion coupled to a bottom surface of the upper plate portion to cool the upper plate portion .

The upper plate is preferably made of a material resistant to ion beams such as aluminum, aluminum alloy, graphite, carbon reinforced fiber, carbon composite, SiC, and the like. Here, the upper plate is preferably made of a non-metal material rather than a metal material.

For example, the upper plate portion may include a base material (not shown) made of a metal such as aluminum or an aluminum alloy, a nonmetal layer formed on the base material, And may include a coating layer of an electrically conductive material coated on the non-metallic layer. Here, the base material may be made of a non-metallic material, and the coating layer of the electrically conductive material is preferably a material containing Si.

The upper plate may have any one of graphite and SiC. At this time, the upper plate is preferably coated with a coating material containing Si.

On the other hand, the upper plate part is formed of a separate member from the cooling part, and can be coupled to various parts of the cooling part such as being placed on the cooling part without any coupling or being mechanically coupled with bolting, welding or the like.

The cooling unit may have any structure as long as it can cool the upper plate portion to cool the upper plate portion heated by the ion beam irradiation.

Unlike the conventional substrate processing module in which the substrate 10 is loaded on the tray 20 and introduced into the process chamber 110, the substrate processing module 100 includes a substrate 110, The substrate 10 needs to be moved on the tray 20 as it is introduced into or discharged from the tray 20 circulating inside the process chamber 110 through the tray 20.

Any one of the process chamber 110 and the tray 20 may be provided with the substrate 10 on the tray 20 positioned at the loading position and the unloading position when the substrate 10 is introduced or discharged from the process chamber 110 10 are moved.

The substrate can be configured in various ways such as a structure for moving the substrate 10 on the tray 20 placed at the loading position and the unloading position, such as being installed in the tray 20 or installed in the process chamber 110 Do.

The substrate transferring unit is installed in the process chamber 110 at a loading position to support and move the substrate 10 when the substrate 10 is introduced from the outside, A first substrate placed at a predetermined substrate position for processing and a second substrate placed in the processing chamber at a loading position in an unloading position to support and move the substrate, The second substrate may be configured as a transmitting portion.

The first substrate transferring unit and the second substrate transferring unit are installed at the loading and unloading positions respectively in the process chamber 110. When the tray 20 is positioned at the loading position and the unloading position, So as to move the substrate 10.

The first substrate transferring part and the second substrate transferring part can have various configurations according to the transferring method, and various configurations such as a combination of a belt and a pulley to be described later, rollers 610 and 640, May have a configuration similar to that of the first substrate linear moving part, or may be configured as the first substrate linear moving part.

The process chamber 110 and further the first buffer chamber 410 and the second buffer chamber 510 to be described later are spaced apart from each other by the gap between the chambers 110, 410 and 520 and the gates 111, 491, 112 and 591 One or more auxiliary rollers may be installed along the moving direction of the substrate 10 in consideration of the distance between the cassette 40 and the tray 20 to be described later.

The feeding of the first substrate and the feeding of the second substrate may be performed by a driving unit (not shown) provided in the process chamber 110 or a driving unit (not shown) provided in the tray 20 Can be driven.

The first substrate transferring unit and the second substrate transferring unit may be installed to be movable up and down to prevent interference with the movement of the tray 20 in the horizontal direction.

At this time, in the tray 20, one or more cutouts (not shown) are vertically opened to support the bottom surface of the substrate 20 by moving the first substrate transferring part and the second substrate transferring part through the tray 20 21 are formed.

Particularly, in order to prevent the substrate 20 from friction with the upper surface of the tray 20 when the first substrate and the second substrate are moved upward through the tray 20, It is preferable that a portion of the substrate 2 supporting the substrate 10 is projected slightly higher than the upper surface of the tray 20.

As another example of the substrate transferring unit, the substrate transferring unit is installed in the tray 20 to support and move the substrate 10 when the substrate 10 is introduced from the outside at the loading position, One substrate may be configured to be placed at a predetermined substrate position for processing or to move the substrate 10 while supporting the substrate 10 at the unloading position and to take it out to the outside from the tray positioned at the unloading position.

1, the substrate processing module 100 may include a first buffer module 400, a substrate processing module 100 (see FIG. 4), a second buffer module ) And the second buffer module 500 in the same manner.

4, the substrate processing module 100 according to the second embodiment of the present invention includes a transfer path 120 (see FIG. 4) of the tray 20 in comparison with the substrate processing module 100 according to the first embodiment, ) Is configured in an inline manner rather than in a circulating manner.

The substrate alignment unit may be any structure as long as it can align and move the substrate 10 as a structure for aligning the position of the substrate 10 to the substrate processing position set in the tray 20. [

Here, the substrate processing position may be variously set according to the substrate processing as the position of the substrate required for the substrate processing such as ion implantation on the tray 20.

2 to 3B, movement of the substrate 10 in the X-axis direction and the Y-axis direction is performed corresponding to the substrate processing position set in the tray 20, as an example of the substrate aligning portion, A first stopper 631 and a second stopper 632 for restricting the first stopper 631 and a second stopper 632 for moving the substrate 10 toward the first stopper 631 in the X- Wow; Axis direction moving the substrate 10 toward the second stopper 632 in the Y-axis direction to align the substrate 10.

The first stopper 631 and the second stopper 632 support one side of the substrate 10 to which the first substrate linear movement unit and the second substrate linear movement unit move linearly, Any configuration is possible.

3A and 3B, at least one of the first stopper 631 and the second stopper 632 may be fixed to the tray 20, (22) vertically so as to be movable up and down.

When the first stopper 631 and the second stopper 632 are installed so as to vertically move through the tray 20 up and down, only when the position of the substrate 10 is aligned, So that the influence of the substrate 10 on the substrate 10 is minimized and the substrate 20 is discharged from the tray 20 when the substrate 10 is arranged in a row on the tray 20. [ It is possible to prevent interference with movement.

The first substrate linear moving part and the second substrate linear moving part move the substrate 10 in the X-axis direction or the Y-axis direction and move together with the first stopper 631 or the second stopper 632 in the X- 620 and pulleys as long as it can linearly move the substrate 10 in the X-axis direction or the Y-axis direction as a configuration for aligning the substrate 10 in the Y-axis direction.

A driving device (not shown) for driving the first substrate linear moving part and the second substrate linear moving part is installed in the process chamber 110 or the tray 20.

In addition, as shown in FIGS. 2A to 3B for the installation of the first substrate linear moving part and the second substrate linear moving part, one or more cut-out parts 21 are formed in the tray 20, .

The cut-out portion 21 is provided with an opening, a cutting groove, and the like so that the moving portion of the first substrate linear moving portion and the moving portion of the second substrate linearly moves through the tray 20 so as to support the bottom surface of the substrate 10 And may be variously formed in the tray 20.

As shown in Figs. 2A to 3B, a plurality of (for example, two or more) substrates for supporting the bottom surface of the substrate 10 and moving the substrate 10 by rotation may be provided as an example of the first substrate linear moving part and the second substrate linear moving part, Rollers 610 and 620. In this embodiment,

The rollers 610 and 620 are driven by a drive unit (not shown) installed in the process chamber 110 and installed in the process chamber 110 to support the bottom surface of the tray 20, (20).

For example, the rollers 610 and 620 are rotatably installed by the frames 611 and 621 installed in the process chamber 110, and may be rotatably driven by various methods such as a chain, a belt, and a gear.

It is preferable that the first substrate linear moving part and the second substrate linear moving part protrude upward of the tray 20 only at the time of substrate alignment. When the first substrate linear moving part and the second substrate linear moving part are protruded, It is preferable that the cutout portion 21 formed in the tray 20 is vertically penetrated and vertically movable.

At this time, it is preferable that the portion supporting the substrate 10 protrudes slightly higher than the upper surface of the tray 20 when the first substrate linear moving portion and the second substrate moving portion linearly move.

In addition, when the X-axis direction and the Y-axis direction are simultaneously performed, the bottom surface of the substrate 10 may be damaged. In this case, the first substrate linear shape moves in the X- And the second substrate linear moving part is configured to move up and down independently of each other.

That is, when the substrate 10 is introduced, the substrate 10 is moved in the X-axis direction. After the first substrate linear-shaped moving part is projected upward of the tray 20 to complete alignment of the substrate 10 in the X-axis direction, The alignment of the substrate 10 in the Y-axis direction can be performed by lowering the linear moving part and moving the moving part of the second substrate linearly.

On the other hand, the first substrate linear moving part is configured to move the substrate 10 in the X-axis direction on the tray 20 in a direction in which the substrate 10 is introduced from the outside of the process chamber 110, A substrate which is installed in the process chamber 110 at the loading position and supports the substrate 10 when the substrate 10 is introduced from the outside and places the substrate 10 at a predetermined substrate position on the tray 20 And can function as a sending unit.

It is a matter of course that the substrate transfer unit installed at the unloading position and carrying the substrate 10 out of the tray 20 to the outside may be configured similar to the configuration of the first substrate linear transfer unit.

Meanwhile, the substrate alignment unit having the above-described structure may be installed in the process chamber 110 or the tray 20.

The substrate aligning portion is provided with a first stopper 631 and a second stopper 632 on a tray 20, and a part of the constitution of the substrate aligning portion includes a first substrate linear moving portion and a second substrate linear moving portion The moving part can be installed in the process chamber 110.

In addition, the substrate alignment unit may be installed to move up and down in the process chamber 110, since it may interfere with movement of the tray 20 after substrate alignment if at least a portion of the structure is installed in the process chamber 110.

The substrate aligning unit may be disposed between the pair of conveying rollers 130 to prevent interference with the conveying rollers 130 installed in the conveying path 120.

Meanwhile, as shown in FIG. 1, the substrate processing module 100 having the above-described structure may constitute a substrate processing system together with the first buffer module 400 and the second buffer module 500.

The substrate alignment unit described above may be installed in the first buffer module 400 without being installed in the substrate processing module 100 because the substrate alignment is performed before the substrate processing.

The first buffer module 400 is coupled to the substrate processing module 100 to transfer the tray 20 through the first gate 111 of the process chamber 110. The first buffer module 400 includes one or more gates 491 and 492 And a buffer chamber 410 in which the buffer chambers 493 and 493 are formed.

The second buffer module 500 is coupled to the substrate processing module 100 to receive the substrate 20 from the tray 20 through the second gate 112 of the process chamber 110, And a buffer chamber 510 in which one or more gates 591, 592 and 593 are formed.

The gates 491, 492, 493, 591, 592 and 593 formed in the buffer chambers 410 and 510 constituting the first buffer module 400 and the second buffer module 500 are respectively connected to separate gate valves 210, 220, 231, 232, 241, 242, respectively.

The first buffer module 400 and the second buffer module 500 temporarily store the substrate 10 when the substrate processing module 100 introduces or discharges the substrate 10, Such as a load lock module or an unload lock module, in which pressure is converted between atmospheric pressure and process pressure.

At this time, the first buffer module 400 and the second buffer module 500 are connected to the pressure and exhaust system for pressure conversion.

Meanwhile, the substrate processing system is configured to circulate the tray 20, which supports and transports the substrate 10 only in the substrate processing module 100, so that the substrate exchange with the substrate processing module 100 must be performed smoothly do.

Accordingly, the substrate processing system can be configured such that the substrate 10 is introduced into the substrate processing module 100 by using the cassette 40 on which the plurality of substrates 10 are stacked in exchange of the substrate with the substrate processing module 100, And discharges it from the processing module 100.

1 to 3B, the first buffer module 400 includes a plurality of substrates 10, a cassette 40 on which the substrate 10 is introduced into the buffer chamber 410, Each of the substrates 10 loaded on the cassette 40 is configured to be transferred to a tray 20 located at a loading position in the substrate processing module 100 and the second buffer module 500 is configured to transfer a plurality of substrates 10, The substrate 10 is carried out to the buffer chamber 510 by the cassette 40 in which the substrates 10 are loaded and is loaded from the tray 20 located in the unloading position in the substrate processing module 100 to the cassette 40 Lt; / RTI >

When the substrate is exchanged with the substrate processing module 100, the first and second buffer modules 400 and 500 are respectively provided with upper and lower moving parts 420 and 520 for moving the cassette 40 up and down, Respectively.

The upper and lower movable parts 420 and 520 are configured such that the substrate 10 mounted on the cassette 40 sequentially transfers the substrate 10 to or from the substrate processing module 100, For example, supports 421 and 521 for supporting the cassette 40 and support parts 421 and 521 for moving the cassette 40 up and down And up and down driving parts 422 and 522 for driving.

The first buffer module 400 and the second buffer module 500 may move the cassette 40 in the horizontal direction so that the cassette 40 can be introduced or discharged according to the introduction or discharge of the cassette 40 A horizontal moving part (not shown) may be additionally provided.

The horizontal moving part may have various configurations such as a linear moving device for transferring the cassette 40 from the first buffer module 400 and the second buffer module 500, respectively.

The cassette 40 may have any structure as long as the substrate 10 can be stacked up and down with a space therebetween as a structure for stacking and transferring the substrates 10 up and down.

Meanwhile, the substrate 10 mounted on the cassette 40 is introduced into or discharged from the tray 20 in the substrate processing module 100, and the substrate transfer unit 30, which discharges or introduces the substrate 10 from the cassette 40, It needs to be installed.

The substrate transferring unit may be variously configured as a structure for discharging or introducing the substrate 10 from the cassette 40 as it is introduced into or discharged from the tray 20 in the substrate processing module 100.

1 to 3B, the substrate transfer unit may be provided in the cassette 40 or may be provided in the first buffer module 400 And the second buffer module 500, respectively.

That is, as an example of the substrate transfer unit, the substrate transfer unit is installed in each of the first buffer module 400 and the second buffer module 500 to take out the substrate 10 loaded on the cassette 40, The substrate 10 can be transferred to the cassette 40 by transferring the substrate 10 from the tray 20 placed at the unloading position.

The substrate transfer unit may have various configurations such as a combination of a belt and a pulley, a roller, and the like in accordance with the conveying method.

At this time, the cassette 40 may have a suitable structure to support and move the substrate of the substrate transfer part such as supporting only the edge of the substrate 10 and passing through the center part vertically.

3A and 3B, the substrate transfer unit 41 is installed on the cassette 40 to move the substrate 10 to the tray 20 positioned at the loading position, The substrate 10 can be introduced or the substrate 10 can be received from the tray 20 positioned at the unloading position and loaded on the cassette 40. [

The substrate transfer section 41 may be configured in various manners such as a combination of a belt and a pulley, a roller, and the like in accordance with a transfer method of the substrate 10.

The substrate transfer unit 41 is driven by a driving unit (not shown) provided in each of the first buffer module 400 and the second buffer module 500 or a driving unit (not shown) provided in the cassette 40 And the like.

When the cassette 40 completes the substrate exchange with the substrate processing module 100, the cassette 40 after the substrate exchange is transferred to the new cassette 40 through the load lock module 200 or the unloading lock module 300, . Here, the cassette 40 is transferred in various manners and is replaced with a new cassette 40 through the load lock module 200 or the unload lock module 300.

However, if the replacement with the new cassette 40 is delayed, there is a problem that the introduction of the substrate into the substrate processing module 100 or the ejection of the substrate is delayed, and the whole substrate processing speed is lowered.

Therefore, as shown in FIG. 1, the first buffer module 400 and the second buffer module 500 may have a buffer space for temporarily storing the cassette 40.

A cassette transfer path (not shown) from the first buffer module 400 to the second buffer module 500 is formed and the empty cassette 40 after the substrate transfer in the first buffer module 400 is transferred to the outside The second buffer module 500 can be used to transfer the substrate 10 from the substrate processing module 100 without being discharged.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: substrate 20: tray
30: mask 40: cassette
100: substrate processing module 200: load lock module
300: unload lock module 400: first buffer module
500: second buffer module
120: Feed path

Claims (15)

A substrate processing module comprising a process chamber defining an enclosed process space, the substrate processing module performing substrate processing with a rectangular substrate positioned at one or more substrate processing locations set in the tray,
Further comprising a substrate aligning portion for aligning the position of the substrate to the substrate processing position set in the tray. The method according to claim 1,
The substrate alignment unit may include:
A first stopper and a second stopper respectively corresponding to the substrate processing positions set in the tray and restricting movement of the substrate in the X-axis direction and the Y-
A first substrate linear moving part moving the substrate toward the first stopper in the X axis direction to align the substrate,
And a second substrate linear moving part moving the substrate in the Y axis direction toward the second stopper to align the substrate. The method of claim 2,
The first substrate linear moving part and the second substrate linear moving part include a plurality of rollers installed vertically through the incision part formed in the tray to support the bottom surface of the substrate and move the substrate by rotation . The method of claim 2,
Wherein at least one of the first stopper and the second stopper protrudes upward from the tray only when the position of the substrate is aligned when the substrate is aligned, characterized in that the at least one of the first stopper and the second stopper is vertically movable through the cut- Substrate processing module. The method of claim 2,
Wherein the first stopper and the second stopper are installed in the tray. The method according to any one of claims 1 to 5,
Wherein the substrate processing module performs substrate processing while moving the tray on which the substrate is mounted, in the process chamber. The method of claim 6,
Wherein the process chamber includes an ion beam irradiating unit installed in the process chamber to irradiate ions to a substrate transferred by the tray. The method of claim 7,
Wherein one of the process chamber and the tray is provided with a mask having an opening pattern for irradiating a patterned ion beam onto the substrate,
Wherein the substrate processing position is an alignment position with respect to the mask. The method of claim 6,
Wherein the process chamber is set with a transport path through which one or more trays are circulated,
Wherein the transfer path includes an ion beam irradiation section in which an ion beam is irradiated onto a substrate placed on the tray by the ion beam irradiating section,
And a tray return section connecting the front end and the rear end of the ion beam irradiation section such that the tray is circulated together with the ion beam irradiation section. The method of claim 9,
Wherein the tray return section is set at a loading position at which the tray receives the substrate from the outside and an unloading position at which the substrate is taken out to the outside. The method of claim 10,
Wherein the process chamber is formed with a first gate to which the substrate is introduced adjacent to the loading position and a second gate to which the substrate is transferred adjacent to the unloading position. The method of claim 10,
The process chamber includes:
A first substrate transferring portion for supporting and moving the substrate when the substrate is introduced from the outside at the loading position and positioning the substrate on the tray at a predetermined substrate position for substrate processing,
And a second substrate transfer section for transferring the substrate from the tray positioned at the unloading position by moving the substrate while supporting the substrate at the unloading position. A substrate processing module according to any one of claims 1 to 5;
A first buffer module coupled to the substrate processing module to transfer a tray through a first gate of the process chamber;
And a second buffer module coupled to the substrate processing module to receive a tray through a second gate of the process chamber. 14. The method of claim 13,
Wherein the first buffer module and the second buffer module are maintained at a vacuum pressure or the pressure is changed between an atmospheric pressure and a process pressure. 14. The method of claim 13,
The first buffer module transfers each of the substrates loaded in the cassette to a tray positioned at a loading position in the substrate processing module after a cassette on which a plurality of substrates are loaded is loaded,
Wherein the second buffer module loads the substrate from the tray placed in the unloading position in the substrate processing module into the cassette after the cassette on which the plurality of substrates are loaded is loaded.

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