KR20140011606A - Manufacturing method for a touch pad and a touch pad manufactured by the method - Google Patents

Abstract

The present invention relates to a method for manufacturing a touch pad and a touch pad manufactured by the method. According to the embodiment of the present invention, the method for manufacturing a touch pad includes a step of preparing a substrate having a conductor layer formed on a pattern part; and a pattern formation step of forming a touching sensor pattern and a ling part by patterning the conductor layer.

Description

Method of manufacturing a touch pad and a touch pad manufactured by the above method TECHNICAL FIELD

The present invention relates to a method of manufacturing a touch pad, and more particularly, to a method of manufacturing a touch pad capable of preventing corrosion occurring in a manufacturing process. The present invention also relates to a touch pad manufactured by the above manufacturing method.

Recently, smart phones, tablet computers, game machines, learning aids, and cameras are widely used due to the development of portable devices. The input method of such portable devices is evolving from a mouse or keyboard input method to a touch input method. Since the touch input method can directly select an icon or a program on the screen while viewing the screen, the user can not only intuitively use the device, but also has advantages in downsizing and lightening the device.

A touch panel is used as a means for inputting by touch as described above. In general, the touch panel includes a touch pad having a touch sensor pattern formed thereon and driving means for driving the touch pad. The touch pad generally includes a transparent substrate, a touch sensor pattern formed on the transparent substrate, and a wiring portion connecting the touch sensor pattern and the driving means. In addition, the touch pad may include a connection wiring part for connecting to an FPCB or the like for connection with the main body of the device. The touch sensor pattern and the wiring part of the touch pad are patterned and formed by etching, and the like, and corrosion may occur during the formation of the pattern.

Specifically, the touch pad may be manufactured by forming a pattern by etching the transparent conductive material or metal from a transparent conductive material such as ITO or a metal-coated transparent film. Etching is performed for such etching, and corrosion may occur in the etching process. This corrosion occurs mainly in the wiring section. The wiring part corresponds to a part for connecting a touch sensor pattern formed on the touch pad to a driving circuit or connecting the touch pad to a main body of the device, wherein the wiring part has a structure in which a metal layer is laminated on a transparent conductive material layer for electrical characteristics. There are many cases. In this case, corrosion in the etching process mainly occurs in the metal layer.

If such corrosion occurs, a defect may occur in the wiring part, which eventually leads to a failure of the touch pad and the touch panel using the touch pad. Therefore, it is necessary to prevent the defect in the wiring portion as described above.

The present inventors have studied to prevent the corrosion from occurring in the touch pad. As a result, the present inventors have found that, in the manufacturing process of the touch pad, when the wiring part is grounded, the corrosion can be prevented from occurring.

In the present invention, to provide a method of manufacturing a touch pad that can prevent the corrosion occurs in the wiring portion. Another object of the present invention is to provide a touch pad in which corrosion is prevented in the wiring part. In addition, the present invention is to provide a touch panel including the touch pad.

An example of the present invention provides a method of manufacturing a touch pad used in a touch panel.

According to one or more exemplary embodiments, a method of manufacturing a touch pad includes: preparing a substrate having a pattern portion and a dummy portion disposed outside the pattern portion, wherein the pattern portion includes a conductive material layer; And a pattern forming step of forming a touch sensor pattern and a wiring part by patterning the conductive material layer, wherein the dummy part is conductive, and the wiring part is formed to be electrically connected to the dummy part in the pattern forming step. .

According to an example of the present invention, the conductive material layer may include at least one of a transparent conductive oxide layer and a metal layer.

According to an example of the present invention, the preparing of the substrate may include forming a conductive material layer, and the forming of the conductive material layer may include forming a transparent conductive oxide layer on the substrate; And forming a metal layer on the transparent conductive oxide layer.

According to one embodiment of the present invention, the conductive material layer includes a transparent conductive oxide layer and a metal layer formed on the transparent conductive oxide layer, and the pattern forming step is a touch sensor having a transparent conductive oxide layer and a metal layer by patterning the conductive material layer. A first etching step of forming a pattern and a wiring part; And a second etching step of removing the metal layer from the touch sensor pattern.

According to an example of the present invention, the wiring part may be formed to extend to the dummy part in the pattern forming step.

According to the exemplary embodiment of the present invention, the conductive connection part may be formed at the end of the wiring part in the pattern forming step so that the conductive connection part is connected to the dummy part.

According to an example of the present invention, the wiring unit may include a metal layer.

According to an example of the present invention, the touch sensor pattern may include a transparent conductive oxide (TCO) layer.

According to an example of the present invention, the transparent conductive oxide (TCO) layer may include at least one of an ITO layer, an IZO layer, and an AZO layer.

According to an example of the present invention, the dummy part may be a grounding part.

According to an example of the present invention, the dummy part may include a metal layer.

The method of manufacturing a touch pad according to an example of the present invention may further include removing the dummy part.

In one embodiment of the present invention provides a touch pad manufactured by the manufacturing method.

According to the present invention it is possible to prevent the corrosion generated during the manufacturing process of the touch pad. As a result, defects that may occur in the manufacturing process of the touch pad may be prevented, thereby making the process more efficient. In addition, it is possible to prevent a defect of the touch panel using the touch pad according to the present invention.

1 is a diagram illustrating an example of a substrate 100 having a pattern portion 300 and a dummy portion 200.
2A to 2I are schematic diagrams showing an example of pattern formation in a step of manufacturing a touch pad.
3 is a diagram illustrating a touch sensor pattern 400 and a wiring part 500 formed on the pattern part 300 inside the dummy part 200 in one example of a touch pad manufactured by a conventional method.
4 is an enlarged view illustrating a portion A of FIG. 3.
FIG. 5 is a view illustrating corrosion of the wiring unit 500 (area denoted by B) in the touch pad manufactured by the conventional method.
Figure 6 is a photograph showing the wiring terminal end of the touch pad manufactured by a conventional method.
7 is a diagram illustrating a touch sensor pattern 400 and a wiring part 500 formed on the pattern part 300 inside the dummy part 200 in one example of the touch pad manufactured by the method according to the present invention. .
8A is a view showing in detail an end portion of the dummy part 200 and the wiring part 500 in one example of the touch pad manufactured by the method according to the present invention (part C of FIG. 7).
8B is a view showing in detail an end portion of the dummy part 200 and the wiring part 500 in another example of the touch pad manufactured by the method according to the present invention.
8C is a view illustrating in detail an end portion of the dummy part 200 and the wiring part 500 in another example of the touch pad manufactured by the method according to the present invention.
Figure 9 is a photograph showing the wiring terminal end of the touch pad manufactured by the method according to the present invention.

Hereinafter, the present invention will be described in more detail with reference to specific examples.

The present invention will be described based on the embodiments disclosed in the accompanying drawings. However, the scope of the present invention is not limited to the embodiments and drawings described below. The accompanying drawings are merely selected and expressed as examples suitable for describing the present invention among various embodiments.

In the accompanying drawings, for ease of understanding, each component and its shape may be briefly drawn or exaggerated, and components of the actual product may not be represented and omitted. Therefore, the drawings should be construed as to aid understanding. Meanwhile, elements that play the same role in the drawings are denoted by the same reference numerals.

It will also be understood that where a layer or element is described as being on the " top " of another layer or element, it is to be understood that not only where such layer or element is disposed in direct contact with the other layer or element, To the case where the third layer is disposed interposed between the first and second layers.

In one embodiment of the present invention, having a pattern portion 300 and the dummy portion 200 disposed outside the pattern portion, the pattern portion 300 is a step of preparing a substrate 100 having a conductive material layer formed; And a pattern forming step of forming the touch sensor pattern 400 and the wiring part 500 by patterning the conductive material layer. Here, the dummy part 200 is conductive, and in the pattern forming step, the wiring part 500 is formed to be electrically connected to the dummy part 200.

1 shows a substrate 100 used in the manufacture of a touchpad according to an example of the present invention. As shown in FIG. 1, a pattern part 300 is disposed on the substrate 100, and a dummy part 200 is disposed outside the pattern part 300.

According to an example of the present invention, the dummy part 200 may serve as a grounding part. On the other hand, the dummy part 200 may include a metal layer. When the dummy part 200 includes a metal layer, the dummy part 200 may function as a metal ground pad.

A conductive material layer is formed on the pattern part 300, and the conductive material layer may include at least one of a transparent conductive oxide layer 110 (also referred to simply as “TCO”) and a metal layer 120.

According to an example of the present invention, the preparing of the substrate may include forming the conductive material layer. The forming of the conductive material layer may include forming a transparent conductive oxide layer 100 on the substrate 100; And forming a metal layer 120 on the transparent conductive oxide layer 110.

According to one embodiment of the present invention, the conductive material layer includes a transparent conductive oxide layer 110 and the metal layer 120 formed on the transparent conductive oxide layer 110, the pattern forming step, by patterning the conductive material layer Forming a touch sensor pattern and a wiring part including the transparent conductive oxide layer 110 and the metal layer 120; And a second etching step of removing the metal layer 120 from the touch sensor pattern.

2A to 2I schematically illustrate an example of a manufacturing process of a touch pad. The touch pad manufactured by the above process may be applied to the touch panel.

The touch pad may be manufactured by patterning a substrate on which a transparent conductive oxide (TCO) layer and a metal layer are stacked. That is, as shown in FIG. 2A, the touch pad may be manufactured using a laminate in which the transparent conductive oxide 110 layer and the metal layer 120 are stacked on the substrate 100.

The laminate may be prepared in various ways as needed. After forming the transparent conductive oxide 110 layer on the substrate 100, the metal layer 120 may be laminated to form the laminate, or the substrate 100 having the transparent conductive oxide 110 layer may be purchased. Thereafter, the laminate may be further formed by further forming a metal layer 120 on the transparent conductive oxide 110 layer, and a laminate in which the transparent conductive oxide 110 layer and the metal layer 120 are stacked on the substrate 100. Sieves can also be purchased and used.

As the substrate 100, a substrate in the form of a transparent film may be used. As an example of such a substrate, for example, a PET substrate may be used, and of course, a PI substrate, a PE substrate, or the like may be used in addition to the PET substrate.

Referring to FIG. 2A, a transparent conductive oxide 110 layer is formed on the substrate 100. As the transparent conductive oxide applied to the transparent conductive oxide layer 110, ITO, IZO, AZO, or the like may be used. In general, ITO is widely used as the transparent conductive oxide. When ITO is laminated on the transparent film type substrate as described above, this is also referred to as "ITO film".

The metal layer 120 is stacked on the transparent conductive oxide 110 layer. Examples of the metal for forming the metal layer include Au, Al, Cu, Mo, Nb, Ti, W, and the like. The metal layer 120 may include at least one selected from the group consisting of Au, Al, Cu, Mo, Nb, Ti, and W. The metal layer 120 may be formed of a single metal layer or may be formed of two or more metal layers. For example, the metal layer 120 may have a structure in which a second metal layer including Ag is stacked on the first metal layer including Nb. The metal forming the first metal layer and the metal forming the second metal layer may vary as necessary. The first metal layer and the second metal layer may be formed of Al and Cu, or Cu and Ag, Mo and Ag, or Cu and Au, respectively. The layer structure of the metal layer and the type of metal included in the metal layer may be appropriately selected by those skilled in the art as necessary.

As shown in FIG. 2A, the laminate of the substrate 100, the TCO layer 120, and the metal layer 130 is also referred to as a raw material. The laminate of the substrate 100, the TCO layer 120, and the metal layer 130 may be manufactured and used, or a commercially available product may be purchased and used.

Hereinafter, for the purpose of unification of the description, a transparent PET film is used as the substrate 100, an ITO layer is used as the transparent conductive oxide layer 120, and a layer containing Nb and Ag is used as the metal layer 130. An example will be described. The above example is merely selected one of the various embodiments in order to simplify the description by avoiding confusion and complexity of the description, the scope of the present invention is not limited by the selected example.

As shown in FIG. 2B, a photoresist 130 is coated on the laminate of the substrate 100, the TCO layer 120, and the metal layer 130. Subsequently, although not shown in the drawings, the photoresist 130 may be selectively removed after exposure using a mask and then developed, as shown in FIG. 2C. Next, as shown in FIG. 2D, etching is performed to form a pattern. Although not specifically illustrated in the drawings, the etching may be performed in two steps, metal etching and TCO etching. After the etching, the photoresist residue is removed as shown in FIG. 2E to complete the primary pattern. The above process corresponds to the first etching step. In FIG. 2E, the inner pattern may correspond to the position of the touch sensor pattern 400, and the outer pattern may correspond to the position of the wiring part 500.

Next, as shown in FIG. 2F, the photoresist 140 is secondarily applied on the first pattern and the substrate formed by the first etching process. Similarly, although not shown in the drawings, the mask is selectively exposed and developed using a mask to selectively remove the secondary photoresist 140 as shown in FIG. 2G. Next, as shown in FIG. 2H, the metal layer 120 is removed from the internal pattern to leave only the transparent conductive oxide layer 110, that is, the ITO layer. After the etching, as shown in FIG. 2I, the photoresist residue is removed to complete the secondary pattern. The above process corresponds to the second etching step. In FIG. 2I, an inner pattern becomes a transparent conductive oxide layer 110, that is, a touch sensor pattern 400 in which only an ITO layer is left, and an outer pattern includes a metal layer 120 disposed on the transparent conductive oxide layer 110. It becomes the wiring part 500.

As described above, the method for manufacturing a touch pad according to an example of the present invention undergoes two etching steps. The first etching step may be referred to as a step for obtaining a pattern shape, and the second etching step is a step for obtaining a pattern made of the transparent conductive oxide layer 110 by removing the metal layer from the touch sensor pattern 400 which is an inner pattern. It can be said. The secondary etching step is a necessary step to obtain a transparent touch sensor pattern 400.

In the method of manufacturing a touch pad according to an embodiment of the present invention, the wiring part 500 is formed to be electrically connected to the dummy part 200 in the primary pattern formed by the primary etching step. As shown in FIG. 6, in the touch pad manufactured by the manufacturing method according to the exemplary embodiment of the present invention, the turf sensor pattern 400 is electrically connected to the wiring unit 500 and the wiring unit 500. Is electrically connected to the dummy part 200.

At this time, the dummy part 200 functions as a ground part. After the touch pad is manufactured through the steps as described above, the dummy part 200 may be removed for commercialization. That is, after manufacturing the touch pad having the touch sensor pattern 400 and the wiring part 500, the method may further include removing the dummy part 200.

On the other hand, in the manufacturing process of the conventional touch pad, the secondary etching is performed while the wiring unit 500 is not connected to the dummy unit 200. That is, as shown in FIG. 3, the wiring part 500 and the dummy part 200 are electrically disconnected from each other.

Specifically, the conventional touch pad disclosed in FIG. 3 is for electrically connecting the touch sensor pattern 400 including the plurality of sensor electrodes 410 and the touch sensor pattern 400 to a driving circuit or an external FPCB. The wiring part 500 is included. The wiring part 500 includes a connection electrode 520 electrically connected directly to a driving circuit or an external FPCB, etc., and a lead wire 510 connecting the touch sensor pattern 400 to the connection electrode 520. . The lead wire 510 and the connection electrode 520 are formed in plural and are directly connected to a series of sensor electrodes 410 constituting the touch sensor pattern 400.

In the conventional touch pad disclosed in FIG. 3, the wiring part 500 is not electrically connected to the dummy part 200 in the first pattern formed after the first visual step. 4 is an enlarged view of part A, which is a region including a portion of the wiring part 500 and the dummy part 200 in FIG. As such, when the second etching process is performed while the wiring unit 500 is not electrically connected to the dummy unit 200, it can be observed that corrosion occurs at the end of the wiring unit.

It can be observed that the corrosion occurs more particularly, the narrower the wiring width and wiring spacing. This corrosion is also clearly observed at the connection of the touch sensor pattern 400 and the wiring portion 500. That is, the corrosion is apparent at the portion where the sensor electrode 410 of the touch sensor pattern 400 and the lead wire 510 of the wiring part 500 are connected. Corrosion may be regarded as galvanic corrosion, which occurs at a portion where a metal and ITO are laminated or connected, that is, a laminate or a connection portion of a conductor and a conductor.

5 is a view showing that corrosion occurs in the wiring unit 500 in the touch pad manufactured by the conventional method. Corrosion is clearly observed in the area marked B in FIG. 5. On the other hand, Figure 6 is a photograph showing that the corrosion occurs at the end of the wiring portion of the touch pad manufactured by a conventional method.

In the exemplary embodiment of the present invention, the wiring unit 500 may be electrically connected to the dummy unit 200 serving as the ground terminal, thereby preventing corrosion that may occur during manufacturing of the touch panel.

7 is a diagram illustrating a touch sensor pattern 400 and a wiring part 500 formed on the pattern part 300 inside the dummy part 200 in the touch pad manufactured by the method according to the present invention. The pattern part 300 includes a touch sensor pattern 400 having a plurality of sensor electrodes 410 and a wiring part 500 for electrically connecting the touch sensor pattern 400 with a driving circuit or an external FPCB. It is provided. The wiring part 500 includes a connection electrode 520 electrically connected directly to a driving circuit or an external FPCB, etc., and a lead wire 510 connecting the touch sensor pattern 400 to the connection electrode 520. .

Referring to FIG. 7, it can be seen that the wiring part 500 is electrically connected to the dummy part 200.

8A to 8C illustrate examples of the connection relationship between the wiring part 500 and the dummy part 200 at the end of the wiring part 500.

FIG. 8A is a portion corresponding to "C" in FIG. 7, and the wiring part 500 itself extends to the dummy part 200. That is, the dummy electrode 200 may be connected to the connection electrode 520 of the wiring part 500.

8B and 8C, the conductive connection part 530 is formed at the end of the wiring part 500. Specifically, the connection part 520 is formed to extend from the connection electrode 520 of the wiring part 500 so that the connection part 520 is connected to the dummy part.

Specifically, in FIG. 8B, the connection part 530 is formed by the transparent conductive oxide layer 100, and in FIG. 8C, the connection part 530 is formed in the same form as the lead wire 510.

In the present invention, two etching steps are performed as described in FIGS. 2A to 2I. As shown in FIGS. 2G to 2I, the secondary etching step corresponds to a process of removing the metal layer 120 existing on the transparent conductive oxide layer 110 in the touch sensor pattern 400, which is an internal pattern. In this case, as shown in FIG. 2B, the photoresist 140 is applied before the metal layer 120 is etched to protect the external pattern, that is, the metal layer 120 of the wiring part 500, but conventionally, in the secondary etching step Corrosion partially occurred in the metal layer 120 of the wiring part 500. In the present invention,

In one example of the present invention, a secondary etching step is performed in a state in which the wiring unit 500 is electrically connected to the dummy unit 200 as described above. Specifically, in the first etching step, the wiring part 500 undergoes a second etching step in a state in which a first pattern is formed to be electrically connected to the dummy part 200, thereby preventing corrosion in the wiring part 500. You can prevent it.

Figure 9 shows the appearance of the wiring terminal end of the touch pad manufactured by the method according to an example of the present invention. In the present invention, the wiring unit 500 may be connected to the dummy unit 200 serving as a ground terminal, thereby preventing corrosion of the wiring unit.

A mechanism for preventing corrosion in the wiring portion may be found in the principle of galvanic corrosion.

Galvanic corrosion is the movement of electrons due to the potential difference between two metals when the two metals are in contact or electrically connected in a corrosive or electrolyte solution, thereby causing corrosion. In the present invention, it can be inferred that the potential difference is suppressed by connecting the wiring part with the ground terminal, and thus, the movement of electrons is suppressed, thereby preventing corrosion of the wiring part.

When the touch center pattern 400 and the wiring part 500 are formed, the dummy part 200 may be cut out to complete the touch pad. In the process of removing the dummy part 200, the extension part or the conductive connection part 530 of the connection electrode 520 may also be removed.

One example of the present invention also provides a touch pad manufactured as described above. The touch pad may be applied to a touch panel.

100: substrate 110: ITO layer
120: metal layer 130, 140: photoresist layer
200: dummy portion 300: pattern portion
400: touch sensor pattern 410: sensor electrode
500: wiring portion 510: lead wire
520: connecting electrode 530: conductive connection

Claims (13)

Preparing a substrate having a pattern portion and a dummy portion disposed outside the pattern portion, the conductive portion layer is formed on the pattern portion; And
And a pattern forming step of patterning the conductive material layer to form a touch sensor pattern and a wiring part.
The dummy part is conductive,
In the pattern forming step, the wiring portion is a manufacturing method of the touch pad, characterized in that formed to be electrically connected to the dummy portion. The method of claim 1, wherein the conductive material layer comprises at least one of a transparent conductive oxide layer and a metal layer. The method of claim 1, wherein preparing the substrate includes forming a conductive material layer.
The forming of the conductive material layer may include forming a transparent conductive oxide layer on a substrate; And forming a metal layer on the transparent conductive oxide layer. The method of claim 1, wherein the conductive material layer comprises a transparent conductive oxide layer and a metal layer formed on the transparent conductive oxide layer,
The pattern forming step may include: a first etching step of patterning the conductive material layer to form a touch sensor pattern and a wiring part having a transparent conductive oxide layer and a metal layer; And
A second etching step of removing the metal layer from the touch sensor pattern;
Method of manufacturing a touch pad comprising a. The method of claim 1,
In the pattern forming step, the wiring portion manufacturing method of the touch pad, characterized in that formed to extend to the dummy portion. The method of claim 1,
In the pattern forming step, a conductive connection portion is formed at the end of the wiring portion, so that the conductive connection portion is connected to the dummy portion manufacturing method of the touch pad. The method of claim 1, wherein the wiring part comprises a metal layer. The method of claim 1, wherein the touch sensor pattern comprises a transparent conductive oxide (TCO) layer. The method of claim 8, wherein the transparent conductive oxide (TCO) layer comprises at least one of an ITO layer, an IZO layer, and an AZO layer. The method of claim 1, wherein the dummy part is a grounding part. The method of claim 1, wherein the dummy part comprises a metal layer. The method of claim 1, further comprising removing the dummy part. A touch pad manufactured by the manufacturing method according to any one of claims 1 to 12.

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