KR20140003000A - Touch sensing apparatus and method for manufacturing the same - Google Patents

Abstract

The present invention provides a multi-layered wiring structure of a touch sensor, comprising: a substrate: a plurality of conductive patterns disposed on one surface of the substrate; a plurality of metal lines electrically connected to at least one of the conductive patterns; and an insulating layer provided between the conductive patterns and the metal lines, wherein the insulating layer does not include a via hole and is provided to expose only part of each of the conductive patterns; and the conductive patterns are connected to at least one of the metal lines through the exposed part.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch sensing device and a method of manufacturing a touch sensing device,

The present invention relates to a touch sensing device and a manufacturing method of the touch sensing device.

The touch sensing device is one of an input device constituting an interface between an information communication device using various displays and a user, and it is a device that allows a user to perform input easily by directly touching a screen using an input tool such as a hand or a pen It says.

The touch sensing device can be divided into a resistance film type, a capacitive type, an ultrasonic type, and an infrared type according to the operation method. Among them, the capacitive type touch sensing device is thin in thickness, durable, Recently, mobile devices have been widely applied.

The electrostatic capacitive touch sensing device uses a self-capacitance that is generated between a contact object and an electrode without applying a separate driving signal to determine a contact input, And a method of determining contact input using a change in mutual capacitance between a driving electrode and a sensing electrode, which are formed by electrode layers and are caused by contact of a contact object.

The method of using the self capacitance is characterized in that the circuit configuration is simple and easy to implement while the multi-touch determination is not easy, and the method using the mutual capacitance has advantages over the method using the self capacitance in the multi- And a sensing electrode for detecting the touch position must be implemented as a two-layer structure.

In recent years, according to the trend of thinning of the touch sensing device, a technique of concentrating the electrode of the mutual capacitive touch sensor, which should be implemented with a two-layer structure, in one layer is being developed. Accordingly, a more complex electrode pattern shape is applied to the touch sensing device than the conventional electrode pattern, and a more complicated wiring structure is required for the external wiring area connected to the electrode pattern. Therefore, a complicated process is required in manufacturing the external wiring region of the touch sensing device, and the defect rate is also increased.

An object of the present invention is to provide a touch sensing device and a manufacturing method of a touch sensing device for reducing a defective rate caused by a step of a metal wiring pattern in manufacturing an external wiring area.

According to a first aspect of the present invention, there is provided a semiconductor device comprising a substrate, a plurality of conductive patterns disposed on one surface of the substrate, a plurality of metal wirings electrically connected to at least one of the plurality of conductive patterns, Wherein the insulating layer is formed so as not to include a via hole and only a portion of each of the conductive patterns is exposed, and the plurality of conductive patterns And the pattern is connected to at least one of the plurality of metal wirings through the exposed portion.

And the plurality of conductive patterns are formed of a transparent conductive material.

And the insulating layer is formed in a step-like shape over a plurality of adjacent conductive patterns.

According to a second aspect of the present invention, there is provided a touch sensing apparatus comprising: a substrate; a contact detection region formed on one surface of the substrate, the contact detection region forming a number of sensing regions for sensing a capacitance change; And a contact detection panel disposed on the outer periphery of the contact detection region and including an external wiring region provided outside the contact detection region, wherein the contact detection region includes a plurality of A plurality of patch electrodes of a conductive material which are arranged in a plurality of first axes to form a part of the sensing area and are adjacent to the plurality of columns and a plurality of patch electrodes And a plurality of internal wires connected to the plurality of patch electrodes and extending to the external wiring region, A multilayer wiring structure including a plurality of internal wiring end portions, a plurality of metal wirings, and a plurality of internal wiring end portions and an insulating layer formed between the plurality of metal wirings is formed, and the insulating layer includes a via hole And is connected to the plurality of metal wirings by being formed to expose only a part of the plurality of internal wiring end portions.

And the substrate further includes a printing layer formed on the external wiring region.

And the plurality of patch electrodes arranged in the same second axis direction are electrically connected through the metal wiring pattern.

And the plurality of internal wiring end portions in the external wiring region are arranged in such a manner that their extending lengths sequentially increase.

A plurality of patch electrodes arranged in the same second axial direction among the plurality of internal wiring end portions are formed to have the same length extending in the external wiring region.

And the metal wiring pattern is formed to pass through a predetermined area of the internal wiring terminal end to be electrically connected on the external wiring area.

And the metal wiring pattern is formed in a shape in which a wave pattern is repeated.

According to a third aspect of the present invention, there is provided a method of manufacturing a semiconductor device comprising the steps of preparing a substrate, forming a plurality of conductive patterns on the substrate, and forming a part of the plurality of conductive patterns And forming a plurality of metal wirings on a part of the exposed conductive pattern and the insulating layer.

The forming of the plurality of metal wirings may include forming each of the plurality of metal wirings to be electrically connected to at least one of the plurality of conductive patterns.

Wherein the plurality of metal wirings are formed such that a step formed by a portion of the exposed conductive pattern and an adjacent insulating layer is minimized due to the insulating layer formed in an open portion in a part of the conductive pattern.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of preparing a substrate, forming a plurality of column electrodes of a conductive material extending in a first axis direction, A plurality of patch electrodes of a conductive material arranged in a plurality of first axes so as to be adjacent to the columns and a plurality of patch electrodes arranged in the same layer as the plurality of patch electrodes and connected to the plurality of patch electrodes, Forming a plurality of conductive patterns including a plurality of internal wirings on the substrate; forming an insulating layer such that only a part of the ends of the plurality of internal wirings are exposed without forming a via hole on the conductive pattern; , Forming a plurality of metal wirings on the insulating layer and a part of the end portions of the exposed inner wirings.

In the present invention, in the external wiring region of the touch sensing device, an insulating layer not including a via hole is formed to expose a portion of a plurality of internal wiring end portions, and is configured to be connected to the wiring pattern through an exposed portion of the internal wiring end portion. Thereby, the wiring is formed so as not to pass through the steps of the circular shape due to the via holes, but to pass through only the step of the linear shape, and the defect rate can be greatly reduced at the time of manufacturing the external wiring region of the touch sensing device.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view schematically showing a touch detection area and an external wiring area of a touch sensing device according to an embodiment of the present invention; Fig.
2 is a partial cross-sectional view including an external wiring region of a touch sensing apparatus according to an embodiment of the present invention.
3 is a view schematically showing the structure of an external wiring region of a touch sensing apparatus according to an embodiment of the present invention.
4 is a view showing a shape of a pattern of a pre-tearing pattern in an external wiring region of a touch sensing apparatus according to an embodiment of the present invention
5 is a view showing the shape of a metal wiring pattern of a touch sensing apparatus according to an embodiment of the present invention.
6 is a view showing a structure of an insulation layer of a touch sensing device according to an embodiment of the present invention
7 is a view showing another example of an insulation layer of a touch sensing apparatus according to an embodiment of the present invention.
8 is a flowchart illustrating a manufacturing operation of the touch sensing apparatus according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an apparatus and an operation method of the present invention will be described in detail with reference to the accompanying drawings. It will be appreciated that those skilled in the art will readily observe that certain changes in form and detail may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims. To those of ordinary skill in the art. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Throughout the description of the present invention, the same reference numerals are used for the same or similar components. In the drawings, the sizes and thicknesses of the respective components are arbitrarily shown for convenience of explanation, and the present invention is not limited thereto. In the drawings, the thickness is enlarged in order to clearly represent layers and regions.

Also, when a section such as a layer, a film, an area, a plate, or the like is referred to as being "on" or "on" another part, this includes not only the case where it is "directly on" another part but also the case where there is another part therebetween . Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

The present invention provides a touch sensing device including an external wiring region that minimizes steps generated in wiring and a method of manufacturing the same. This method can be applied to a touch sensing device formed by integrating a driving electrode and a sensing electrode of a mutual capacitance type touch sensor to be a two-layer structure in a one-layer structure. Such a touch sensing device can be implemented as a structure described in Korean Patent Application No. 10-2007-0021332 titled " Contact Position Sensing Panel with Simple Lamination Structure ", filed March 7, 2007 , The contents of which are incorporated herein by reference.

FIG. 1 is a view schematically showing a touch detection area and an external wiring area of a touch sensing device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a touch sensing device according to an embodiment of the present invention. to be. 1 and 2, a touch sensing apparatus according to an embodiment of the present invention includes a substrate 100, a print layer 400 disposed in an external wiring region 120 of the substrate 100, An insulating layer 300 for electrically separating the conductive pattern 200 and the metal wiring pattern 500 from each other and a conductive pattern 200 formed on at least one of the conductive patterns 200, And a metal wiring pattern (500). The metal wiring pattern 500 is connected to a touch sensor chip (not shown) to electrically connect the conductive pattern 200 and the touch sensor chip.

The substrate 100 may function as a support for supporting the print layer 400, the conductive pattern 200, and the insulating layer 300. [ The substrate 100 may be a transparent substrate. When the substrate 100 is used as a transparent substrate, the substrate 100 may be formed of a rigid material such as a reinforced glass, an acrylic resin, or a hard PET (Polyethylene Terephthalate), PC (Polycarbonate), PES (Polyethersulfone) , PI (Polyimide), PMMA (PolyMethly MethaAcrylate), or the like. Further, the substrate 100 may be a cover glass applied to a touch screen. In this case, the cover glass is made of a reinforced glass or a high hard plastic material, and has a predetermined thickness of 0.3 T or more. Is designed.

One surface of the substrate 100 may include a contact detection region 110 located at the center of one surface and an external wiring region 120 located outside the contact detection region 110. The contact detection region 110 is formed with a conductive pattern 200 including a plurality of electrodes, and a plurality of internal wirings for connecting electrodes and wiring patterns. In the external wiring region 120, the end portions of the plurality of internal wirings and the metal wiring pattern 500 are formed. The conductive pattern 200 may extend to the external wiring region 120 through the internal wiring.

1, the external wiring region 120 is positioned at the upper and lower ends of the outer edge of the contact detection region 110. However, the external wiring region 120 may be located at the left end of the contact detection region 110, It may be located in the right end. In another embodiment, the external wiring region 120 may be an area surrounding the contact detection region 110. [

The touch detection area 110 according to the embodiment of the present invention may be a display area in which an image or an image is displayed and the external wiring area 120 may be a non-display area in which an image or an image is not displayed. The contact detection region 110 may be a contact detection region receiving a touch input of the user and the external wiring region 120 may transmit a signal to the contact detection region 110 or may be a signal generated in the contact detection region 110 And a metal wiring pattern for transferring the metal wiring pattern. Although the contact detection region 110 and the external wiring region 120 are separated for the sake of convenience of description, the contact detection region 110 and the external wiring region 120 may be integrated.

The print layer 400 may be formed on a portion of one side of the substrate 100. In one embodiment of the present invention, the print layer 400 may be disposed more than one print layer 400 on the external wiring area 120 on one side of the substrate 100, . As described above, the external wiring region 120 may be a non-display region, and the external wiring region 120 may be a region where a metal wiring pattern or the like exists. Therefore, in order to hide the metal wiring patterns existing in the external wiring area 120, one or more print layers 400 are formed on the external wiring area 120 because the external wiring area 120 is an area which the user does not need to visually recognize. Can be formed. In some embodiments, the print layer 400 may be comprised of an opaque material. For example, the printing layer 400 may be composed of a material that is visible in black. For convenience of explanation, the print layer 400 is formed of one layer. However, in order to more completely hide the metal wiring pattern, the print layer 400 may be formed of a plurality of layers. For example, , And the printing layer 400 may be composed of a 1-degree printing layer and a 2-degree printing layer.

A plurality of conductive patterns 200 may be disposed on one surface of the substrate 100. The conductive pattern 200 may be formed of a transparent conductive material. Examples of applicable transparent conductive materials include oxides such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and ZO (Zinc Oxide), carbon nanotubes, metal nanowires, and conductive polymers. Though the thickness of the conductive pattern 200 may differ depending on the transparent conductive material, it may be about 10 nm to 10 μm.

The conductive pattern 200 may be integrally formed on one surface of the substrate 100 by performing bulk sputtering on one surface of the substrate 100 and then etching the conductive pattern 200 according to the shape of the conductive pattern 200. [ For example, the conductive pattern 200 is formed in such a manner that a transparent conductive material such as ITO is collectively sputtered on one surface of the substrate 100 at about 130 ° C to 150 ° C and then etched according to the shape of the conductive pattern 200 can do.

The conductive pattern 200 may be disposed on one side of the substrate 100 and may be disposed on the external wiring region 120. The sensing electrodes 111 and 112 may be disposed in the contact detection region 110 and the metal wiring pattern 500 may be disposed in the external wiring region 120. [

Referring to FIG. 1, a conductive pattern 200 according to an exemplary embodiment of the present invention includes a plurality of columns arranged at regular intervals on a first axis to sense input coordinates in a first axis (horizontal direction) Electrode 111 and a plurality of patch electrodes 112 arranged at regular intervals on the second axis to sense the input coordinates of the second axis (longitudinal direction).

The plurality of column electrodes 111 are formed in a bar shape extending in the second axial direction, and the plurality of patch electrodes 112 are arranged on the same side of the patch electrodes 112 arranged in the same first axis direction, And the patch electrodes 112 located at the same position are electrically connected to each other in the external wiring region 120.

The column electrodes 111 and the patch electrodes 112 may be formed of a conductive material, for example, a transparent conductive material such as ITO. The column electrodes 111 and the patch electrodes 112 extend to the external wiring region 120 through the internal wiring and the external wiring region in which the internal wiring end portion and the plurality of metal wirings are formed 120 are located. The wirings of the external wiring region 120 are connected to a touch sensor chip (not shown) connected to the touch screen.

The conductive pattern 200 may include a metal wiring pattern that transmits a sensing signal from the sensing electrode, the driving electrode, and / or the sensing electrode, or transmits a driving signal to the driving electrode. In FIG. 1, the conductive pattern 200 is formed of a combination of bar, patch, and lines. However, the shape of the sensing electrode and the driving electrode and the shape of the metal wiring pattern can be variously designed.

On the other hand, the metal wiring pattern 500 shown in FIG. 2 shows a cross section when the metal wiring pattern 500 having a repeated wave pattern is formed as described in FIG. 7 to be described later. FIG. 2 shows only the metal wiring pattern 500 connected to the conductive pattern 200 shown in FIG. 2 among the plurality of metal wiring patterns 500, and the remaining metal wiring patterns 500 are omitted.

1, in the touch sensing apparatus according to an embodiment of the present invention, the patch electrodes 112 located at the same position on the second axis are electrically connected through one wiring in the external wiring region 120 . Such a wiring structure will be described with reference to FIG.

3 is an enlarged view of a part of the external wiring region 105 shown in FIG. FIG. 4 is a view showing the shape of a conductive pattern in an external wiring region of a touch sensing apparatus according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view illustrating a metal wiring pattern of a touch sensing apparatus according to an embodiment of the present invention FIG. 6 is a view illustrating the shape of an insulation layer of a touch sensing device according to an embodiment of the present invention. Referring to FIG.

3 and 4, the external wiring region 120 of the touch sensing apparatus according to an embodiment of the present invention includes internal wiring terminal portions extending from the patch electrodes 112 formed in the contact detection region 110, And are arranged in a shape in which the length is long or in a shape in which the length is shortened in order. However, the ends of the internal wiring to be electrically connected to each other have the same length.

The metal wiring pattern 500 has one end connected to the touch sensor chip and the other end connected to the conductive line pattern 200 extending from the plurality of patch electrodes, that is, the inner wiring end. For this, as shown in FIGS. 3 and 5, the metal wiring pattern 500 is formed to pass through the inner wiring ends extending from the patch electrodes to be connected.

3 and 6, the connection between the conductive pattern 200 and the metal wiring pattern 500 is not limited to the connection with the conductive pattern 200 other than the conductive pattern 200 to which the metal wiring pattern 500 is to be connected. An insulating layer 300 is formed. The insulating layer 300 according to an exemplary embodiment of the present invention is formed in a region other than a partial region of the end of the conductive pattern 200, which is sequentially different in length. That is, the insulating layer 300 is not formed entirely (closed type) in the external wiring region 120 but is formed to be open only to the portion where the internal wiring end is formed. The insulating layer 300 is formed in a step-like shape over a plurality of adjacent conductive patterns. Depending on the shape of the insulating layer 300, the metal wiring pattern 500 may be electrically connected to the patch electrodes located at the same position on the second axis of the contact detection area, And is short-circuited electrically.

The process of forming the insulating layer 300 is the same as that of forming the general insulating layer 300. In one embodiment of the present invention, the insulating layer 300 may be formed of a photo solder resist. That is, a process of removing a substance such as an oxide, which adversely affects the adhesion between the surface of the substrate and the photo-solder resist, to form a roughness, a printing process of applying a photo solder resist ink onto the substrate surface, A pre-curing process for removing the adhesion of the resist layer to remove the adhesion, an exposure process for curing the resist by irradiating ultraviolet rays to necessary portions of the insulating layer 300, The insulating layer 300 may be formed through a post-cure process for curing the epoxy resin or the like contained in the insulating layer 300. [ The photo solder resist ink is not related to any commonly used ink. Meanwhile, the process of forming the insulating layer 300 may further include a UV curing process after the final curing process (Post cure).

According to an embodiment of the present invention, the insulating layer 300 may include any protrusion (not shown) corresponding to the conductive pattern 200. This can be implemented as a structure described in Korean Patent Application No. 10-2011-0146144 entitled " Wiring Substrate and Wiring Board Manufacturing Method " filed on December 29, 2011, Which is incorporated herein by reference.

The insulating layer 300 is formed so as to cover the external wiring region 120 so that the conductive pattern 200 and the metal wiring pattern 500 are insulated from each other, A via hole may be formed in only a part of the region where the first electrode 500 overlaps with the second electrode. However, in such a case, the metal wiring pattern must be filled in the via hole, and the thickness of the wiring line may be thinned along the outer portion of the circular via hole due to the stepped shape of the circular shape caused by the via hole.

The touch sensing apparatus according to the embodiment of the present invention forms an insulating layer in the form of a step so as not to cover a part of the internal wiring terminal extending to the external wiring region 120 without forming the insulating layer 300 as a whole in the external wiring region A step is generated only in a linear form in one direction in the section where the wiring line passes. Accordingly, the step difference can be reduced compared to the method of forming the insulating layer through the via hole, and the defect rate can be lowered when manufacturing the external wiring region.

7 is a view showing another example of a metal wiring pattern of the touch sensing device according to an embodiment of the present invention.

5, the metal wiring pattern 500 according to an embodiment of the present invention may be formed in any shape (for example, a metal wiring pattern) that passes through a portion where the insulating layer is not formed at the end of the conductive pattern 200 . ≪ / RTI > For example, the metal wiring pattern 500 may be formed by deforming to form a wavy pattern as shown in FIG. By the deformation of the metal wiring pattern, the contact area between the conductive pattern 200 and the metal wiring pattern 500 can be increased, and the length of the step difference can be reduced.

On the other hand, Fig. 2 shows a cross section when the metal wiring pattern 500 having such a wave pattern structure is formed. FIG. 2 shows only one metal wiring pattern 500 connected to the conductive pattern 200 shown in the plurality of metal wiring patterns 500, and the remaining metal wiring patterns 500 are omitted.

8 is a flowchart illustrating a manufacturing operation of the touch sensing apparatus according to an embodiment of the present invention.

Referring to FIG. 8, in the method of manufacturing the touch sensing apparatus according to the present embodiment, a substrate is prepared (S110). Since the substrate is substantially the same as the substrate of Figs. 1 to 7, duplicate description is omitted. At least one print layer is disposed on the second area 120 on one side of the substrate (S111). Since the print layer is substantially the same as the print layer of Figs. 1 and 2, duplicate description is omitted. Subsequently, a plurality of conductive patterns are arranged on one surface of the substrate (S112). Disposing the conductive pattern may include disposing a conductive pattern on the print layer on the second area of one side of the substrate. Since the conductive pattern is substantially the same as the conductive pattern shown in Figs. 1 to 7, duplicate description is omitted.

Next, an insulating layer is formed on one surface of the substrate and the conductive pattern (S113). Since the insulating layer is substantially the same as the shape of the insulating layer in Figs. 1 to 7, the overlapping description will be omitted. The arrangement relationship between the insulating layer and the conductive pattern is substantially the same as the arrangement relationship between the insulating layer and the conductive pattern in Figs. 1 to 7, and thus a duplicate description will be omitted.

Next, the metal wiring pattern 500 is formed on one surface of the substrate on which the insulating layer is formed. The configuration of the metal wiring pattern 500 and the arrangement relationship between the metal wiring pattern 500 and the conductive pattern 200 and the insulating layer 300 are the same as those of the metal wiring pattern 500 of FIGS. The conductive pattern 200, and the insulating layer 300 are substantially the same as each other.

As described above, the method of manufacturing a wiring board and a wiring board according to an embodiment of the present invention can be performed. While the present invention has been described with respect to specific embodiments thereof, Can be carried out without departing from the scope.

100: substrate 110: contact detection area
111: first electrode 112: second electrode
120: external wiring area 200: conductive pattern
300: insulating layer 500: metal wiring pattern
400: printing layer

Claims (20)

Board,
A plurality of conductive patterns arranged on one surface of the substrate,
A plurality of metal wirings electrically connected to at least one of the plurality of conductive patterns,
And an insulating layer formed between the plurality of conductive patterns and the plurality of metal wirings,
The insulating layer does not include a via hole and is formed to expose only a portion of each conductive pattern, and the plurality of conductive patterns are connected to at least one of the plurality of metal wires through the exposed portions. Multilayer wiring structure of a touch sensor. The method of claim 1,
And the plurality of conductive patterns are made of a transparent conductive material. The method of claim 1,
And the insulating layer is formed in a step shape over a plurality of adjacent conductive patterns. The method of claim 1,
Touch sensing device comprising a multi-layered wiring structure of the touch sensor. In the touch sensing device,
Board,
A contact detection area formed on one surface of the substrate, the contact detection area forming a number of sensing areas for sensing a change in capacitance;
And a contact detection panel disposed on one side of the substrate and including an external wiring region provided outside the contact detection region,
Wherein the contact detection region includes a plurality of column electrodes of a conductive material forming a part of the sensing region and extending in a first axis direction, a plurality of column electrodes forming part of the sensing region, A plurality of patch electrodes of a conductive material arranged on the first axis and a plurality of internal wirings arranged in the same layer as the plurality of patch electrodes and connected to the plurality of patch electrodes to extend to the external wiring region and,
A multilayer wiring structure is formed in the external wiring region, the multilayer wiring structure including the plurality of internal wiring end portions, the plurality of metal wirings, and the plurality of internal wiring end portions and the insulating layer formed between the plurality of metal wirings,
And the insulating layer does not include a via hole and is formed to expose only a portion of the plurality of internal wire end portions, thereby connecting the plurality of metal wires. The touch sensing apparatus according to claim 5, wherein the substrate further comprises a print layer formed on the external wiring region. The touch sensing device of claim 5, wherein the plurality of patch electrodes arranged in the same second axis direction are electrically connected to each other through the metal wiring pattern. The touch sensing device according to claim 5, wherein the plurality of internal wiring end portions in the external wiring region are arranged in such a manner that the extending lengths of the internal wiring end portions sequentially increase. The touch sensing apparatus of claim 8, wherein the plurality of patch electrodes arranged in the same second axial direction among the plurality of internal wire end parts have the same length extending in the external wire area. The touch sensing apparatus of claim 8, wherein the metal wiring pattern is formed to pass through a predetermined region of the inner wiring end portion to be electrically connected on the outer wiring region. The touch sensing device of claim 8, wherein the metal wiring pattern is formed in a shape in which a wave pattern is repeated. Preparing a substrate,
Forming a plurality of conductive patterns on the substrate;
Forming an insulating layer to expose only a part of the plurality of conductive patterns without forming a via hole on the conductive pattern;
And forming a plurality of metal wirings on the insulating layer and a part of the exposed conductive pattern. The method as claimed in claim 12, wherein the step of forming the plurality of metal wirings includes forming each of the plurality of metal wirings to be electrically connected to at least one of the plurality of conductive patterns. A method of forming a wiring structure. 13. The method according to claim 12, wherein the plurality of metal wirings are formed such that the occurrence of a step formed by a portion of the exposed conductive pattern and an adjacent insulating layer is minimized due to the insulating layer formed in an open- Wherein the step of forming the multi-layer wiring structure comprises the steps of: Preparing a substrate,
A plurality of column electrodes of a conductive material extending in a first axis direction, and a plurality of patches of conductive material formed on a plurality of first axes to form a portion of the sensing region and to be adjacent to the plurality of columns ( patch) forming a plurality of conductive patterns on the substrate, the plurality of conductive patterns including electrodes and a plurality of internal wires disposed on the same layer as the plurality of patch electrodes and connected to the plurality of patch electrodes to extend to the external wiring area; ,
Forming an insulating layer such that only a part of the ends of the plurality of internal wirings are exposed without forming a via hole on the conductive pattern;
And forming a plurality of metal wires on a portion of the exposed inner wire end portions and the insulating layer. 16. The method of claim 15, wherein preparing the substrate further comprises forming a printed layer on the external wiring region. The method of claim 15, wherein the plurality of patch electrodes arranged in the same second axis direction are electrically connected to each other through the metal wiring pattern. 16. The manufacturing method of a touch sensing device according to claim 15, wherein the plurality of internal wiring terminal portions in the external wiring region are arranged in such a manner that their extending lengths sequentially increase. 19. The method of claim 18, wherein the plurality of patch electrodes arranged in the same second axis direction among the plurality of internal wire end portions have the same length extending in the external wire area. . The method of claim 15, wherein the metal wiring pattern is formed in a shape in which a wave pattern is repeated.

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