KR20130129236A - Pressure-sensitive adhesive composition, pressure-sensitive adhesive, and presure-sensitive adhesive sheet using same - Google Patents

Pressure-sensitive adhesive composition, pressure-sensitive adhesive, and presure-sensitive adhesive sheet using same Download PDF

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KR20130129236A
KR20130129236A KR1020137017711A KR20137017711A KR20130129236A KR 20130129236 A KR20130129236 A KR 20130129236A KR 1020137017711 A KR1020137017711 A KR 1020137017711A KR 20137017711 A KR20137017711 A KR 20137017711A KR 20130129236 A KR20130129236 A KR 20130129236A
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meth
acrylate
ethylenically unsaturated
unsaturated compound
adhesive
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KR101881618B1 (en
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코우소우 칸다
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닛폰고세이가가쿠고교 가부시키가이샤
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

활성 에너지선 조사에 의해 경화되는 높은 점착력과 응집력을 갖는 점착제를 제공한다. 본 발명은 아크릴계 수지(A), 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B), 에틸렌성 불포화기를 2개 이상 갖는 에틸렌성 불포화 화합물(C), 및 광중합 개시제(D)를 함유하는 점착제 조성물이며, 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B)로서 지환식 구조 함유 에틸렌성 불포화 화합물(B1), 및 수산기 함유 에틸렌성 불포화 화합물(B2)을 함유하는 것을 특징으로 하는 점착제 조성물에 관한 것이다.Provided is an adhesive having high adhesive strength and cohesive force, which are cured by active energy ray irradiation. The present invention is an adhesive containing an acrylic resin (A), an ethylenically unsaturated compound (B) having one ethylenically unsaturated group, an ethylenically unsaturated compound (C) having two or more ethylenically unsaturated groups, and a photopolymerization initiator (D). It is a composition and contains an alicyclic structure containing ethylenically unsaturated compound (B1) and a hydroxyl-containing ethylenically unsaturated compound (B2) as an ethylenically unsaturated compound (B) which has one ethylenically unsaturated group, In the adhesive composition characterized by the above-mentioned. It is about.

Description

점착체 조성물, 점착제, 및 이를 사용하여 이루어진 점착 시트{Pressure-sensitive adhesive composition, pressure-sensitive adhesive, and presure-sensitive adhesive sheet using same}Pressure-sensitive adhesive composition, pressure-sensitive adhesive, and presure-sensitive adhesive sheet using same}

본 발명은, 점착제 조성물, 점착제, 및 이를 이용하여 이루어진 점착 시트에 관한 것이며, 자세하게는 높은 점착력과 높은 응집력을 갖는 점착제, 그 중에서도 특히 내부식성이 필요하게 되는 전자 부재나 광학 부재용에 적합한 점착제, 및 이를 이용한 점착 시트에 관한 것이다.The present invention relates to a pressure-sensitive adhesive composition, a pressure-sensitive adhesive, and a pressure-sensitive adhesive sheet formed using the same, in detail, a pressure-sensitive adhesive having a high adhesive force and a high cohesive force, in particular, an adhesive suitable for an electronic member or an optical member that requires corrosion resistance, And it relates to an adhesive sheet using the same.

점착제에는, 피착체를 강고하게 장기간 붙이는 것을 목적으로 하는 강점착성의 점착제나, 붙인 후에 피착체로부터 박리하는 것을 전제로 하는 박리 타입의 점착제 등 여러 가지 타입이 존재하고 있어, 각종 분야마다 최적의 점착제가 설계되어 사용되고 있다.There exist many types of adhesives, such as a strong adhesive which aims at sticking a to-be-adhered body firmly for a long time, and a peeling-type adhesive which presupposes peeling from a to-be-adhered body after sticking, and it is an optimal adhesive for every field | area. Is designed and used.

예를 들면, 강점착성을 나타내는 타입의 점착제에서는, 통상, 점착제 중에 산성의 관능기를 많이 도입하거나 점착 부여 수지를 대량으로 사용하거나 하는 것에 의해서 높은 점착력이 부여되고 있으며, 여러 가지의 강점착성이 필요하게 되는 분야에서 사용되고 있다 (예를 들면, 특허 문헌 1 참조.).For example, in the adhesive of the type which shows strong adhesiveness, high adhesive force is normally provided by introducing many acidic functional groups in an adhesive or using a large amount of tackifying resin, and various strong adhesiveness is needed. It is used in the field which becomes (for example, refer patent document 1).

그런데 이들 강점착성의 점착제는, 도입되고 있는 산성의 관능기 때문에 피착체를 부식해 버리거나 산성의 관능기에 유래하는 아웃 가스가 발생해 버리기 때문에, 전자 부재, 특히 정밀 전자 부재에 붙여 이용하는 정보 라벨 용도나, 전자 부재 고정용도에는 적합하지 않은 것이었다. By the way, since these strongly adhesive adhesives corrode a to-be-adhered body or generate | occur | produce the outgas derived from an acidic functional group because of the acidic functional group introduce | transduced, the information label use used for an electronic member, especially a precision electronic member, It was not suitable for the electronic member fixing use.

따라서, 이들 광학 용도로 사용하는 점착제에는, 산을 이용하지 않는 타입 (산 부재)의 점착제 (예를 들면, 특허 문헌 2 참조)를 사용하는 것이 필요하였다.Therefore, it was necessary to use the adhesive (for example, refer patent document 2) of the type (acid member) which does not use an acid for the adhesive used for these optical uses.

JPJP 2007-2176742007-217674 AA JPJP 2003-2683352003-268335 AA

그러나 특히 터치 패널 등에 이용되는 ITO 투명 전극이나 PDP 등에 이용되는 금속 메쉬 등의 금속 및 금속 산화물 등이 사용되는 전자 디스플레이 등의 광학 기기나, 디지털 만능 디스크 등의 광학적 기록 디스크 (광학적 기록 매체) 등의 광학 용도로 사용하는 점착제에는, 내부식성에 더하여 내열성 등의 엄격한 내구성이 필요하기 때문에, 높은 응집력과 높은 점착력을 갖는 점착제가 필요로 하지만, 특허 문헌 2와 같이 일반적인 산 부재의 점착제에서는, 내부식성에는 뛰어나지만, 점착력, 응집력이 충분하지 않기 때문에, 광학 용도의 점착제로서는 사용할 수 없었다.However, in particular, optical devices such as electronic displays in which metals such as ITO transparent electrodes used in touch panels, metal meshes used in PDPs, and the like and metal oxides are used, and optical recording discs (optical recording media) such as digital universal disks. In addition to corrosion resistance, a pressure-sensitive adhesive used for optical applications requires a strict durability such as heat resistance, so that a pressure-sensitive adhesive having a high cohesive force and a high adhesive force is required. Although it was excellent, since adhesive force and cohesion force were not enough, it could not be used as an adhesive for optical uses.

따라서, 뛰어난 내부식성과 점착 물성 (점착력, 응집력)을 겸비한 점착제의 개발이 요구되고 있었다.Accordingly, there has been a demand for the development of an adhesive having excellent corrosion resistance and adhesive properties (adhesive strength, cohesion).

따라서, 본 발명에서는 이러한 배경하에서 높은 점착력과 높은 응집력을 가지며, 또한 산성기를 함유하지 않는 경우에는 내부식성이 뛰어난 점착제를 얻기 위한 점착제 조성물의 제공을 목적으로 한다.Therefore, an object of the present invention is to provide a pressure-sensitive adhesive composition for obtaining a pressure-sensitive adhesive having high adhesion and high cohesion under such a background and containing no acidic groups and excellent in corrosion resistance.

따라서, 본 발명자는, 이와 같은 사정을 감안하여 예의연구를 거듭한 결과, 아크릴계 수지, 단관능성 불포화 모노머, 다관능성 불포화 모노머, 및 광중합 개시제로 이루어진 무용제 타입의 활성 에너지선 경화형 점착제에서, 단관능성 불포화 모노머로서 지환식 구조 함유 에틸렌성 불포화 화합물과 수산기 함유 에틸렌성 불포화 화합물을 병용함으로써, 점착력과 응집력이 균형있게 뛰어난 점착제를 얻을 수 있다는 것을 발견하여 본 발명을 완성하기에 이르렀다.Accordingly, the present inventors have made intensive studies in view of such circumstances, and in the active energy ray-curable pressure-sensitive adhesive of a solvent-free type consisting of an acrylic resin, a monofunctional unsaturated monomer, a polyfunctional unsaturated monomer, and a photopolymerization initiator, monofunctional unsaturated By using together an alicyclic structure containing ethylenically unsaturated compound and a hydroxyl group containing ethylenically unsaturated compound as a monomer, it discovered that the adhesive which was excellent in the balance of adhesive force and cohesion force was obtained, and completed this invention.

즉, 본 발명의 요지는, 아크릴계 수지(A), 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B), 에틸렌성 불포화기를 2개 이상 갖는 에틸렌성 불포화 화합물(C), 및 광중합 개시제(D)를 함유하는 점착제 조성물이며, 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B)로서 지환식 구조 함유 에틸렌성 불포화 화합물(B1), 및 수산기 함유 에틸렌성 불포화 화합물(B2)을 함유하는 것을 특징으로 하는 점착제 조성물에 관한 것이다.That is, the summary of this invention is an acrylic resin (A), the ethylenically unsaturated compound (B) which has one ethylenically unsaturated group, the ethylenically unsaturated compound (C) which has two or more ethylenically unsaturated groups, and a photoinitiator (D). A pressure-sensitive adhesive composition containing 1), containing an alicyclic structure-containing ethylenically unsaturated compound (B1) and a hydroxyl group-containing ethylenically unsaturated compound (B2) as an ethylenically unsaturated compound (B) having one ethylenically unsaturated group. It relates to an adhesive composition.

또한, 본 발명은 점착제, 이들을 이용하여 얻어진 점착 시트에 관한 것이다.Moreover, this invention relates to an adhesive and the adhesive sheet obtained using these.

본 발명은 이하의 형태를 포함한다.The present invention includes the following aspects.

[1] 아크릴계 수지(A), 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B), 에틸렌성 불포화기를 2개 이상 갖는 에틸렌성 불포화 화합물(C), 및 광중합 개시제(D)를 함유하는 점착제 조성물이며, 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B)로서 지환식 구조 함유 에틸렌성 불포화 화합물(B1), 및 수산기 함유 에틸렌성 불포화 화합물(B2)을 함유하는 것을 특징으로 하는 점착제 조성물.[1] Pressure-sensitive adhesive containing acrylic resin (A), ethylenically unsaturated compound (B) having one ethylenically unsaturated group, ethylenically unsaturated compound (C) having two or more ethylenically unsaturated groups, and photopolymerization initiator (D) It is a composition and contains an alicyclic structure containing ethylenically unsaturated compound (B1) and a hydroxyl-containing ethylenically unsaturated compound (B2) as an ethylenically unsaturated compound (B) which has one ethylenically unsaturated group, The adhesive composition characterized by the above-mentioned.

[2] 아크릴계 수지(A)는 현탁중합에 의해 얻어진 드라이 레진인 것을 특징으로 하는 [1]에 기재된 점착제 조성물.[2] The pressure-sensitive adhesive composition according to [1], wherein the acrylic resin (A) is a dry resin obtained by suspension polymerization.

[3] 아크릴계 수지(A)는 지환식 구조 함유 (메타)아크릴산 에스테르계 모노머를 함유하는 공중합 성분을 공중합하여 이루어진 아크릴계 수지인 것을 특징으로 하는 [1] 또는 [2]에 기재된 점착제 조성물.[3] The pressure sensitive adhesive composition according to [1] or [2], wherein the acrylic resin (A) is an acrylic resin formed by copolymerizing a copolymerization component containing an alicyclic structure-containing (meth) acrylic acid ester monomer.

[4] 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B) 중에 있어서의 지환식 구조 함유 에틸렌성 불포화 화합물(B1) 및 수산기 함유 에틸렌성 불포화 화합물(B2)의 합계량의 함유 비율은 10∼70중량%인 것을 특징으로 하는 [1] 내지 [3] 중 어느 하나에 기재된 점착체 조성물.[4] The content ratio of the total amount of the alicyclic structure-containing ethylenically unsaturated compound (B1) and the hydroxyl group-containing ethylenically unsaturated compound (B2) in the ethylenically unsaturated compound (B) having one ethylenically unsaturated group is 10 to 70. It is weight%, The adhesive composition in any one of [1]-[3] characterized by the above-mentioned.

[5] 실질적으로 산을 포함하지 않는 것을 특징으로 하는 [1] 내지 [4] 중 어느 하나에 기재된 점착제 조성물.[5] The pressure-sensitive adhesive composition according to any one of [1] to [4], which is substantially free of an acid.

[6] 용제를 함유하지 않는 것을 특징으로 하는 [1] 내지 [5] 중 어느 하나에 기재되는 것을 특징으로 하는 점착제 조성물.[6] The pressure-sensitive adhesive composition according to any one of [1] to [5], wherein the adhesive composition does not contain a solvent.

[7] [1] 내지 [6] 중 어느 하나에 기재된 점착제 조성물이, 활성 에너지선 조사에 의해 경화되어 이루어진 것을 특징으로 하는 점착제.[7] The pressure sensitive adhesive according to any one of [1] to [6], wherein the pressure sensitive adhesive composition is cured by active energy ray irradiation.

[8] 기재와 [7]에 기재된 점착제로 이루어진 점착제층을 함유하는 것을 특징으로 하는 점착 시트.[8] An adhesive sheet containing a pressure-sensitive adhesive layer made of the base material and the pressure-sensitive adhesive according to [7].

본 발명의 점착제 조성물로 이루어진 점착제는, 강고한 점착력과 뛰어난 응집력을 갖는 것이며, 이 때문에 고온 환경하에서도 기재로부터가 박리가 생기기 어렵고, 특히 광학 부재 첩합용의 점착제, 점착 시트로서 유용하다. 또한, 점착제 중에 산을 함유시키지 않아도 점착력과 응집력이 뛰어난 것이 되기 때문에, 금속이나 금속 산화물 등에 대해서 내부식성이 요구되는 전자 디스플레이 등의 광학 기기나, 디지털 만능 디스크 등의 광학적 기록 디스크 (광학적 기록 매체)를 붙이기 위한 광학용 점착 시트로서 특히 유효하다.The pressure-sensitive adhesive made of the pressure-sensitive adhesive composition of the present invention has strong adhesive strength and excellent cohesive force, and therefore, peeling hardly occurs from the substrate even under a high temperature environment, and is particularly useful as an adhesive for adhesive bonding to an optical member and an adhesive sheet. In addition, since the adhesive is excellent in adhesive strength and cohesion even without containing acid, optical recording disks such as an electronic display such as an electronic display requiring a corrosion resistance against metals and metal oxides, and optical recording disks such as digital universal disks (optical recording media) It is especially effective as an adhesive sheet for optics for pasting.

이하, 본 발명을 상세하게 설명하지만, 이들은 바람직한 실시형태의 일례를 나타내는 것이다. 또한, 본 발명에서, (메타)아크릴은 아크릴 또는 메타크릴을, (메타)아크릴로일은 아크릴로일 또는 메타크리로일을, (메타)아크릴레이트은 아크릴레이트 또는 메타크릴레이트를 각각 의미하는 것이다.EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated in detail, these show an example of preferable embodiment. In the present invention, (meth) acryl refers to acrylic or methacryl, (meth) acryloyl refers to acryloyl or methacryloyl, and (meth) acrylate refers to acrylate or methacrylate, respectively.

우선, 본 발명의 점착제 조성물에 대해 설명한다.First, the adhesive composition of this invention is demonstrated.

본 발명의 점착제 조성물은, 아크릴계 수지(A), 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B), 에틸렌성 불포화기를 2개 이상 갖는 에틸렌성 불포화 화합물(C), 및 광중합 개시제(D)를 함유하는 것이다.The adhesive composition of this invention is an acrylic resin (A), the ethylenically unsaturated compound (B) which has one ethylenically unsaturated group, the ethylenically unsaturated compound (C) which has two or more ethylenically unsaturated groups, and a photoinitiator (D). It contains.

아크릴계 수지(A)는, 공중합 성분으로서 (메타)아크릴산 에스테르계 모노머 (a1)를 주성분으로 하고, 필요에 따라, 관능기 함유 공중합성 모노머(a2), 그 외의 공중합성 모노머(a3)를 함유하여 이루어진 공중합 성분을 공중합하여 얻을 수 있다.The acrylic resin (A) has a (meth) acrylic acid ester monomer (a1) as a main component as a copolymerization component and, if necessary, contains a functional group-containing copolymerizable monomer (a2) and other copolymerizable monomers (a3). It can obtain by copolymerizing a copolymerization component.

(메타)아크릴산 에스테르계 모노머(a1) (다만, 후술의 (a2)를 제외함)로서는, (메타)아크릴산 알킬에스테르계 모노머(a1-1), 지환식 구조 함유 (메타)아크릴산 에스테르계 모노머(a1-2) 등을 들 수 있다. As a (meth) acrylic acid ester monomer (a1) (but except (a2) mentioned later), (meth) acrylic-acid alkylester monomer (a1-1) and alicyclic structure containing (meth) acrylic acid ester monomer ( a1-2) etc. are mentioned.

이와 같은 (메타)아크릴산 알킬에스테르계 모노머 (a1-1)로서는, 알킬기의 탄소수가, 통상 1∼20이며, 특히 바람직하게는 1∼10, 더욱 바람직하게는 1∼8, 특히 바람직하게는 1∼4이며, 구체적으로는, 예를 들면, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, n-부틸(메타)아크릴레이트, 이소-부틸(메타)아크릴레이트, tert-부틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, n-헥실 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소-옥틸아크릴레이트, 노닐 (메타)아크릴레이트, 이소데실 (메타)아크릴레이트, 라우릴(메타)아크릴레이트, 세틸(메타)아크릴레이트, 스테아릴 (메타)아크릴레이트, 이소―스테아릴아크릴레이트 등을 들 수 있다. 이들은 1종을 단독으로 또는 2종 이상을 함께 이용할 수 있다.As such a (meth) acrylic-acid alkylester type monomer (a1-1), carbon number of an alkyl group is 1-20 normally, Especially preferably, it is 1-10, More preferably, it is 1-8, Especially preferably, 1- 4, specifically, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, and iso-butyl (meth) acryl Late, tert-butyl (meth) acrylate, n-propyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, iso- Octyl acrylate, nonyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, iso-stearyl acrylate, etc. Can be mentioned. These can be used individually by 1 type or in combination of 2 or more types.

이들 (메타)아크릴산 알킬에스테르계 모노머 중에서도, 공중합성, 점착 물성, 취급의 용이함 및 원료 입수의 용이함 때문에, 에틸(메타)아크릴레이트, n-부틸(메타)아크릴레이트가 바람직하게 이용되며, 내구성이 뛰어난다는 점에서 n-부틸(메타)아크릴레이트가 더욱 바람직하게 이용된다.Among these (meth) acrylic acid alkyl ester monomers, ethyl (meth) acrylate and n-butyl (meth) acrylate are preferably used because of the copolymerizability, adhesive properties, ease of handling and availability of raw materials. N-butyl (meth) acrylate is more preferably used in that it is excellent.

상기 지환식 구조 함유 (메타)아크릴산 에스테르계 모노머 (a1-2)로서는, 지환식 구조의 탄소수가, 통상, 탄소수 4∼20이며, 특히 바람직하게는 6∼10이며, 구체적으로는, 시클로 펜틸(메타)아크릴레이트, 시클로헥실 (메타)아크릴레이트, 트리시크로데카닐(메타)아크릴레이트, 2-메틸시클로헥실(메타)아크릴레이트, 트리시클로[5.2.1.02,6]데칸-8-일(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 디시클로펜테닐(메타)아크릴레이트, 2-디시클로펜타닐옥시에틸(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 4-t-부틸시클로헥실(메타)아크릴레이트, 1,4-시크로헥산디메탄올모노(메타)아크릴레이트 등을 들 수 있지만, 이들 중에서도 점착 물성, 모노머와의 상용성 때문에 이소보닐(메타)아크릴레이트가 바람직하게 이용된다.As said alicyclic structure containing (meth) acrylic-ester type monomer (a1-2), carbon number of alicyclic structure is C4-C20 normally, Especially preferably, it is 6-10, Specifically, cyclopentyl ( Meta) acrylate, cyclohexyl (meth) acrylate, tricyclodecanyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5.2.1.02,6] decane-8-yl (meth) ) Acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, 2-dicyclopentanyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, 4-t-butylcyclo Hexyl (meth) acrylate, 1, 4-cyclohexane dimethanol mono (meth) acrylate, etc. are mentioned, Among these, an isobornyl (meth) acrylate is used preferably because of adhesive property and compatibility with a monomer. do.

(메타)아크릴산 에스테르계 모노머(a1)의 공중합 성분 중에 있어서의 함유량으로서는, 바람직하게는 60∼100중량%, 특히 바람직하게는 70∼95중량%, 더욱 바람직하게는 80∼90중량%이며, (메타)아크릴산 에스테르계 모노머(a1)의 함유량이 너무 적으면, 점착제로서 사용했을 경우의 점착력이 부족하는 경향이 있다. As content in the copolymerization component of a (meth) acrylic acid ester monomer (a1), Preferably it is 60-100 weight%, Especially preferably, it is 70-95 weight%, More preferably, it is 80-90 weight%, ( When content of the meta) acrylic acid ester monomer (a1) is too small, there exists a tendency for the adhesive force at the time of using as an adhesive to run short.

본 발명의 점착제 조성물을 경화하여 얻어진 점착제에 투명성이 요구되는 경우에는, 헤이즈 변화를 억제할 수 있다는 점에서, (메타)아크릴산 에스테르계 모노머(a1)로서 지환식 구조 함유 (메타)아크릴산 에스테르계 모노머를 이용하는 것이 바람직하다.When transparency is required for the adhesive obtained by hardening the adhesive composition of this invention, since a haze change can be suppressed, it is an alicyclic structure containing (meth) acrylic acid ester monomer as a (meth) acrylic acid ester monomer (a1). It is preferable to use.

또, 이와 같은 환식 구조 함유 (메타)아크릴산 에스테르계 모노머(a1-2)와 (메타)아크릴산알킬에스테르계 모노머(a1-1)와의 함유 비율 (중량비)로서는, (a1-2): (a1-1)=5:95∼95:5가 바람직하고, 특히 바람직하게는 (a1-2): (a1-1)=10:90∼90:10, 더욱 바람직하게는 (a1-2): (a1-1)=20:80∼80:20이다.Moreover, as a content ratio (weight ratio) of such a cyclic structure containing (meth) acrylic-acid ester monomer (a1-2) and a (meth) acrylic-acid alkylester monomer (a1-1), it is (a1-2): (a1- 1) = 5: 95-95: 5 are preferable, Especially preferably, (a1-2): (a1-1) = 10: 90-90: 10, More preferably, (a1-2): (a1 -1) = 20: 80 to 80:20.

관능기 함유 공중합성 모노머(a2)로서는, 수산기 함유 모노머, 옥시 알킬렌기 함유 모노머, 아미드기 함유 모노머, 아미노기 함유 모노머, 질소 함유 모노머, 글리시딜 함유 모노머 등의 관능기 함유 모노머를 들 수 있고 이들로부터 선택되는 1종 또는 2종 이상이 이용된다. 이들 중에서도, 높은 응집력을 얻을 수 있다는 점에서, 수산기 함유 모노머가 바람직하게 이용되며, 특히 바람직하게는, 2-히드록시 에틸(메타)아크릴레이트이다.Examples of the functional group-containing copolymerizable monomer (a2) include a functional group-containing monomer such as a hydroxyl group-containing monomer, an oxyalkylene group-containing monomer, an amide group-containing monomer, an amino group-containing monomer, a nitrogen-containing monomer, and a glycidyl-containing monomer. 1 type or 2 or more types are used. Among these, a hydroxyl group containing monomer is used preferably at the point which can obtain a high cohesion force, Especially preferably, it is 2-hydroxy ethyl (meth) acrylate.

수산기 함유 모노머로서는, 예를 들면, 2-히드록시 에틸(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 5-히드록시펜틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 8-히드록시옥틸(메타)아크릴레이트, 10-히드록시데실 (메타)아크릴레이트, (4-히드록시메틸시클로헥실)메틸(메타)아크릴레이트 등의 (메타)아크릴산히드록시알킬에스테르, 카프로락톤 변성 2-히드록시에틸(메타)아크릴레이트 등의 카프로락톤 변성 모노머, 2-아크릴로일옥시에틸-2-히드록시에틸프탈산, N-메틸올(메타)아크릴아미드, N-히드록시에틸(메타)아크릴아미드 등의 1급 수산기 함유 모노머;2-히드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트, 3-클로로-2-히드록시프로필(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트 등의 2급 수산기 함유 모노머; 2,2-디메틸-2-히드록시에틸(메타)아크릴레이트 등의 3급 수산기 함유 모노머를 들 수 있다.As a hydroxyl-containing monomer, 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, 6-hydroxyhexyl (meth), for example (Meth) acrylic acid hydroxyalkyl esters such as acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate Caprolactone-modified monomers such as caprolactone-modified 2-hydroxyethyl (meth) acrylate, 2-acryloyloxyethyl-2-hydroxyethyl phthalic acid, N-methylol (meth) acrylamide, and N-hydroxy Primary hydroxyl group containing monomers, such as ethyl (meth) acrylamide; 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxy-3- phenoxypropyl (meth) acryl Rate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2- De-hydroxy-3-phenoxypropyl (meth) secondary hydroxyl group-containing monomers such as acrylate; may be mentioned 2,2-dimethyl-2-hydroxyethyl (meth) monomers containing a tertiary hydroxyl group, such as acrylate.

또, 디에틸렌글리콜(메타)아크릴레이트, 폴리에틸렌글리콜모노(메타)아크릴레이트 등의 폴리에틸렌글리콜 유도체, 폴리프로필렌글리콜모노(메타)아크릴레이트 등의 폴리프로필렌글리콜유도체, 폴리에틸렌글리콜-폴리프로필렌글리콜-모노(메타)아크릴레이트, 폴리(에틸렌글리콜테트라메틸렌글리콜)모노(메타)아크릴레이트, 폴리(프로필렌글리콜테트라메틸렌글리콜)모노(메타)아크릴레이트 등의 옥시 알킬렌 변성의 수산기 함유 모노머를 이용해도 된다.Polypropylene glycol derivatives such as diethylene glycol (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol derivatives such as polypropylene glycol mono (meth) acrylate, polyethylene glycol polypropylene glycol mono ( Oxyalkylene-modified hydroxyl-containing monomers, such as meta) acrylate, poly (ethylene glycol tetramethylene glycol) mono (meth) acrylate, and poly (propylene glycol tetramethylene glycol) mono (meth) acrylate, may be used.

옥시알킬렌기 함유 모노머로서는, 예를 들면, 2-메톡시에틸(메타)아크릴레이트, 2-에톡시에틸(메타)아크릴레이트, 3-메톡시부틸(메타)아크릴레이트, 2-부톡시에틸(메타)아크릴레이트, 2-부톡시디에틸렌글리필(메타)아크릴레이트, 메톡시디에틸렌글리필(메타)아크릴레이트, 메톡시트리에틸렌글리콜(메타)아크릴레이트, 에톡시디에틸렌글리필(메타)아크릴레이트, 메톡시디프로필렌글리필(메타)아크릴레이트, 메톡시폴리에틸렌글리필(메타)아크릴레이트, 옥토시폴리에틸렌글리콜폴리프로필렌글리콜모노 (메타)아크릴레이트, 라우록시폴리에틸렌글리필(메타)아크릴레이트, 스테아록시폴리에틸렌글리콜모노(메타)아크릴레이트 등의 지방족계의 (메타)아크릴산 에스테르나, 2-페녹시에틸(메타)아크릴레이트, 페녹시폴리에틸렌글리필(메타)아크릴레이트, 페녹시폴리에틸렌글리콜-폴리프로필렌글리필(메타)아크릴레이트, 노닐 페놀에틸렌옥사이드 부가물 (메타)아크릴레이트 등의 방향족계의 (메타)아크릴산 에스테르 등을 들 수 있다.As an oxyalkylene group containing monomer, 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, 2-butoxyethyl ( Meth) acrylate, 2-butoxydiethylene glycol (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate , Methoxy dipropylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, octosi polyethylene glycol polypropylene glycol mono (meth) acrylate, lauoxy polyethylene glycol (meth) acrylate, stearoxy Aliphatic (meth) acrylic acid esters such as polyethylene glycol mono (meth) acrylate, 2-phenoxyethyl (meth) acrylate, phenoxy polyethyleneglycol (meth) acrylate, And the like polypropylene article refill (meth) acrylate, nonylphenol ethylene oxide adduct (meth) acrylate, aromatic (meth) acrylate of - noksi polyethylene glycol.

아미드기 함유 모노머로서는, 예를 들면, 아크릴아미드, 메타크릴아미드, N-(n-부톡시알킬)아크릴아미드, N-(n-부톡시알킬)메타크릴아미드, N,N-디메틸(메타) 아크릴아미드, N,N-디에틸(메타)아크릴아미드, N,N-디메틸아미노프로필(메타)아크릴아미드, 아크릴아미드-3-메틸부틸메틸아민, 디메틸아미노알킬아크릴아미드, 디메틸아미노알킬메타크릴아미드 등을 들 수 있다.As an amide group containing monomer, acrylamide, methacrylamide, N- (n-butoxyalkyl) acrylamide, N- (n-butoxyalkyl) methacrylamide, N, N-dimethyl (meth), for example Acrylamide, N, N-diethyl (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide, acrylamide-3-methylbutylmethylamine, dimethylaminoalkylacrylamide, dimethylaminoalkylmethacrylamide Etc. can be mentioned.

아미노기 함유 모노머로서는, 예를 들면, 디메틸아미노에틸(메타)아크릴레이트, 디에틸아미노에틸(메타)아크릴레이트나 그 4급 화물 등을 들 수 있다.As an amino-group containing monomer, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, its quaternary cargo, etc. are mentioned, for example.

질소 함유 모노머로서는, 예를 들면, 아크릴로일모르폴린 등을 들 수 있다.As a nitrogen containing monomer, acryloyl morpholine etc. are mentioned, for example.

글리시딜 함유 모노머로서는, 예를 들면, 글리시딜 (메타)아크릴레이트, 알릴글리시딜에테르를 들 수 있다.As a glycidyl containing monomer, glycidyl (meth) acrylate and allyl glycidyl ether are mentioned, for example.

관능기 함유 공중합성 모노머 (a2)의 공중합 성분 중에 있어서의 함유 비율은, 바람직하게는 0.01∼20중량%, 특히 바람직하게는 0.1∼15중량%, 더욱 바람직하게는 0.2∼10중량%이며, 관능기 함유 공중합성 모노머 (a2)가 너무 적으면 관능기간의 상호작용이 작아져 응집력이 저하하는 경향이 있고, 너무 많으면 점착력이 너무 내리는 경향이 있다.The content ratio in the copolymerization component of a functional group containing copolymerizable monomer (a2) becomes like this. Preferably it is 0.01-20 weight%, Especially preferably, it is 0.1-15 weight%, More preferably, it is 0.2-10 weight%, The functional group containing When there are too few copolymerizable monomers (a2), the interaction of a functional period will become small and cohesion force will fall, and when too many, adhesive force will fall too much.

그 외의 공중합성 모노머(a3)로서는, 아크릴로니트릴, 메타크릴로니트릴, 스틸렌,α-메틸스틸렌, 초산비닐, 프로피온산 비닐, 스테아린산 비닐, 염화비닐, 염화비닐리덴, 알킬비닐에테르, 비닐톨루엔, 비닐피리딘, 비닐피롤리돈, 이타콘산 디알킬에스테르, 푸마르산 디알킬에스테르, 알릴알코올, 아크릴클로라이드, 메틸비닐케톤, N-아크릴아미드메틸트리메틸 암모늄클로라이드, 알릴트리메틸암모늄클로라이드, 디메틸아릴비닐케톤 등을 들 수 있다.Examples of the other copolymerizable monomer (a3) include acrylonitrile, methacrylonitrile, styrene, α-methylstyrene, vinyl acetate, vinyl propionate, vinyl stearate, vinyl chloride, vinylidene chloride, alkyl vinyl ether, vinyl toluene, and vinyl. Pyridine, vinylpyrrolidone, itaconic acid dialkyl ester, fumaric acid dialkyl ester, allyl alcohol, acryl chloride, methyl vinyl ketone, N-acrylamide methyl trimethyl ammonium chloride, allyl trimethyl ammonium chloride, dimethyl aryl vinyl ketone, etc. are mentioned. have.

그 외의 공중합성 모노머(a3)의 공중합 성분 중에 있어서의 함유 비율은, 바람직하게는 0∼40중량%, 특히는 바람직하게는 3∼30 중량%, 더욱 바람직하게는 8∼20 중량%이며, 그 외의 공중합성 모노머(a3)의 함유량이 너무 많으면 점착 성능이 저하하기 쉬운 경향이 있다.The content ratio in the copolymerization component of the other copolymerizable monomer (a3) is preferably 0 to 40% by weight, particularly preferably 3 to 30% by weight, more preferably 8 to 20% by weight. When there is too much content of another copolymerizable monomer (a3), there exists a tendency for adhesive performance to fall easily.

본 발명으로 이용되는 아크릴계 수지(A)는, 내부식성이 뛰어난다는 점에서 산성기를 함유하지 않는 것인 것이 바람직하다.It is preferable that acrylic resin (A) used by this invention does not contain an acidic group from the point which is excellent in corrosion resistance.

상기 (메타)아크릴산 에스테르계 모노머(a1), 필요에 따라서 관능기 함유 공중합성 모노머(a2), 그 외의 공중합성 모노머(a3)를 공중합 성분으로서 중합함으로써 아크릴계 수지(A)를 제조하는 것이지만, 이와 같은 중합에서는, 용액 라디칼 중합, 현탁중합, 괴상 중합, 유화 중합 등 당업자 주지의 방법에 따라 제조할 수 있다.Although acrylic resin (A) is manufactured by superposing | polymerizing the said (meth) acrylic-ester type monomer (a1), a functional group containing copolymerizable monomer (a2), and other copolymerizable monomer (a3) as a copolymerization component as needed, In polymerization, it can manufacture according to well-known methods, such as solution radical polymerization, suspension polymerization, block polymerization, emulsion polymerization, and the like.

이들 중에서도, 현탁중합이 분자량의 큰 폴리머를 얻을 수 있고, 또 생성 폴리머의 단리도 용이하기 때문에 바람직하게 이용되며, 아크릴계 수지(A)는, 현탁중합에 의해 얻어진 드라이 레진인 것이 바람직하다.Among these, suspension polymerization is preferably used because a polymer having a large molecular weight can be obtained and isolation of the produced polymer is easy, and the acrylic resin (A) is preferably a dry resin obtained by suspension polymerization.

상기 중합에 즈음해, 필요에 따라서, 폴리비닐 알코올 등의 분산 안정제나, 아조비스 이소부티로니트릴 등의 중합 개시제를 첨가할 수 있다.In the case of the said superposition | polymerization, dispersion stabilizers, such as polyvinyl alcohol, and polymerization initiators, such as azobis isobutyronitrile, can be added as needed.

또한, 일반적으로, 점착제 조성물에 이용되는 아크릴계 수지는, 그 제조시에 유기용제를 사용하는 용제계 중합에 의해 제조되는 것이 많다. 이러한 용제계 중합의 아크릴계 수지를 점착제 조성물에 이용하는 경우, 점착제 조성물 용액을 고온으로 건조하는 것을 필요로 하기 때문에, 많은 에너지가 필요하거나 또, 유기용제는 인화하기 쉬울 뿐만 아니라 대기오염도 일으키기 때문에, 용제의 대규모 회수 장치나 안전 장치가 필요하다. 그러나 상기 현탁중합에 의해 얻어진 드라이 레진의 아크릴계 수지(A)를 이용하면, 이들 유기용제를 함유하지 않고 점착제 조성물을 제조할 수 있다.Moreover, generally, acrylic resin used for an adhesive composition is manufactured by solvent-type superposition | polymerization which uses the organic solvent at the time of the manufacture. When the acrylic resin of such solvent-based polymerization is used in the pressure-sensitive adhesive composition, it is necessary to dry the pressure-sensitive adhesive composition solution at a high temperature, and thus a lot of energy is required, and since the organic solvent not only ignites but also causes air pollution, Large recovery or safety devices are needed. However, when acrylic resin (A) of dry resin obtained by the said suspension polymerization is used, an adhesive composition can be manufactured without containing these organic solvents.

아크릴계 수지(A)의 중량 평균 분자량 (Mw)은 50만∼300만인 것이 바람직하고, 특히 바람직하게는 85만∼250만, 더욱 바람직하게는 100만∼200만이다. 아크릴계 수지(A)의 중량 평균 분자량이 너무 작으면, 활성 에너지선 조사에 의해서 얻어지는 점착제의 응집력이 저하하는 경향이 있고, 너무 크면, 균일하게 상용한 점착제 조성물이 얻기 어려워지는 경향이 있다.It is preferable that the weight average molecular weights (Mw) of acrylic resin (A) are 500,000-3 million, Especially preferably, it is 850,000-2,500,000, More preferably, it is 1 million-2 million. When the weight average molecular weight of acrylic resin (A) is too small, there exists a tendency for the cohesion force of the adhesive obtained by active energy ray irradiation to fall, and when too large, there exists a tendency for the uniformly compatible adhesive composition to become difficult to obtain.

아크릴계 수지(A)의 분산도 (Mw/Mn)는, 7 이하인 것이 바람직하고, 특히 5 이하, 4 이하인 것이 더더욱 바람직하다. 아크릴계 수지(A)의 분산도 (Mw/Mn)가 너무 크면, 응집력이나 점착 물성에 대해 활성 에너지선 조사 조건에 의한 편차가 커지는 경향이 보인다. 또, 분산도 (Mw/Mn)의 하한치로서는 통상 2이다. 또한, 상기 Mn은 수평균 분자량을 말한다.The dispersion degree (Mw / Mn) of the acrylic resin (A) is preferably 7 or less, and more preferably 5 or less and 4 or less. When dispersion degree (Mw / Mn) of acrylic resin (A) is too big | large, there exists a tendency for the dispersion | variation by active energy ray irradiation conditions to become large about cohesion force and adhesive physical property. Moreover, as a lower limit of dispersion degree (Mw / Mn), it is 2 normally. In addition, said Mn means a number average molecular weight.

아크릴계 수지(A)의 유리 전이 온도 (Tg)는, -70∼20℃인 것이 바람직하고, 특히 바람직하게는 -60∼0℃, -55∼-10℃가 더더욱 바람직하다. 아크릴계 수지(A)의 유리 전이 온도 (Tg)가 너무 낮으면, 응집력이 저하하는 경향이 보여 너무 높으면, 점착제의 취질화를 초래하는 경향이 보인다.It is preferable that the glass transition temperature (Tg) of acrylic resin (A) is -70-20 degreeC, Especially preferably, -60-0 degreeC and -55-10 degreeC are still more preferable. When the glass transition temperature (Tg) of acrylic resin (A) is too low, the cohesion force tends to fall and when too high, the tendency which will lead to the brittleness of an adhesive is seen.

또한, 본 발명에서 중량 평균 분자량은 표준 폴리스티렌 분자량 환산에 의한 중량 평균 분자량을 말하며, 구체적으로는, 고속 액체 크로마토그래피 (일본 Waters 사제, 「Waters 2695 (본체)」와「Waters 2414 (검출기)」)에, 컬럼:Shodex GPC KF-806 L (배제 한계 분자량:2×107, 분리 범위:100∼2×107, 이론단수:10, 000단/개, 충전제 재질:스틸렌-디비닐벤젠 공중합체, 충전제 입자지름:10㎛)의 3개 직렬을 이용하는 것으로 측정되는 것이다. 수평균 분자량에 대해서도 동일하게 상기 측정 장치를 이용하여 측정되는 것이다.In addition, in this invention, a weight average molecular weight means the weight average molecular weight by conversion of a standard polystyrene molecular weight, and specifically, high performance liquid chromatography ("Waters 2695 (body)" and "Waters 2414 (detector)" by the Japan Waters company)) Column: Shodex GPC KF-806L (exclusion limit molecular weight: 2 × 10 7 , separation range: 100 to 2 × 10 7 , theoretical number of stages: 10,000 stages / piece, filler material: styrene-divinylbenzene copolymer It is measured by using three series of filler particle diameters: 10 micrometers). The number average molecular weight is also measured using the above-mentioned measuring apparatus.

또, 본 발명에서 유리 전이 온도는 하기 Fox의 수학식 1로 산출되는 것이다.In addition, in this invention, a glass transition temperature is computed by following formula (1) of Fox.

Figure pct00001
Figure pct00001

Tg: 공중합체의 유리 전이온도 (K)Tg: glass transition temperature of the copolymer (K)

Tga: 모노머 A의 호모폴리머의 유리 전이온도 (K) Wa: 모노머 A의 중량분율Tga: glass transition temperature of homopolymer of monomer A (K) Wa: weight fraction of monomer A

TgB: 모노머 B의 호모폴리머의 유리 전이온도 (K) Wb: 모노머 B의 중량분율TgB: glass transition temperature (K) of homopolymer of monomer B Wb: weight fraction of monomer B

Tgn: 모노머 N의 호모폴리머의 유리 전이온도 (K) Wn: 모노머 N의 중량분율Tgn: glass transition temperature (K) of homopolymer of monomer N Wn: weight fraction of monomer N

(Wa+ Wb +…+Wn =1)
(Wa + Wb +… + Wn = 1)

아크릴계 수지(A)의 함유량은, 아크릴계 수지(A)와 후술의 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B)의 합계 100 중량부에 대해서, 5∼50 중량부인 것이 바람직하고, 특히 바람직하게는 7∼45 중량부, 더욱 바람직하게는 10∼40 중량부이다.It is preferable that content of acrylic resin (A) is 5-50 weight part with respect to a total of 100 weight part of acrylic resin (A) and the ethylenically unsaturated compound (B) which has one ethylenically unsaturated group mentioned later, and it is especially preferable. Preferably it is 7-45 weight part, More preferably, it is 10-40 weight part.

아크릴계 수지(A)의 함유량이 너무 적으면, 점도가 너무 낮아서 도공하기 어려워지는 경향이 있고, 너무 많으면 점도가 높아 도공하기 어려워지는 경향이 있다.When there is too little content of acrylic resin (A), there exists a tendency for a viscosity to be too low and to be difficult to coat, and when too large, a viscosity will become high and it will become difficult to coat.

에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B) (이하, 「단관능성 불포화 화합물(B)」이라고 기재하기도 함)로서는, 지환식 구조 함유 에틸렌성 불포화 화합물(B1) 및 수산기 함유 에틸렌성 불포화 화합물 (B2)을 함유하는 것이 필요하다.As an ethylenically unsaturated compound (B) which has one ethylenically unsaturated group (henceforth a "monofunctional unsaturated compound (B)"), an alicyclic structure containing ethylenically unsaturated compound (B1) and hydroxyl-containing ethylenically unsaturated It is necessary to contain the compound (B2).

본 발명에서는, 이와 같은 (B1) 및 (B2)을 필수 성분으로서 병용함으로써, 특히 지환식 구조 함유 에틸렌성 불포화 화합물(B1)에 유래하는 점착제의 이형억제 효과에 의한 높은 점착력과 특히 수산기 함유 에틸렌성 불포화 화합물(B2)에 유래하는 수소결합에 의한 높은 응집력이 균형있게 발휘되는 것이다.In this invention, by using such (B1) and (B2) together as an essential component, especially high adhesive force by the release inhibitory effect of the adhesive derived from an alicyclic structure containing ethylenically unsaturated compound (B1), and especially hydroxyl-containing ethylenic The high cohesion force by the hydrogen bond derived from an unsaturated compound (B2) is exhibited in balance.

지환식 구조 함유 에틸렌성 불포화 화합물(B1)로서는, 지환식 구조 함유 (메타) 아크릴레이트계 화합물인 것이 바람직하고, 지환식 구조의 탄소수로서는, 통상, 탄소수 4∼20이며, 특히 바람직하게는 6∼10이며, 구체적으로는, 시클로펜틸(메타)아크릴레이트, 시클로헥실 (메타)아크릴레이트, 트리시클로데카닐(메타)아크릴레이트, 2-메틸시클로헥실 (메타)아크릴레이트, 트리시클로[5.2.1.02,6]데칸-8-일(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 디시클로펜테닐(메타)아크릴레이트, 2-디시클로펜타닐옥시에틸(메타)아크릴레이트, 이소보로닐(메타)아크릴레이트, 4-t-부틸시클로헥실(메타)아크릴레이트, 1,4-시클로헥산디메탄올모노(메타)아크릴레이트 등을 들 수 있지만, 이들 중에서도, 아크릴계 수지(A)와의 상용성이 뛰어난 점에서, 시클로헥실(메타)아크릴레이트가 바람직하고, 특히 바람직하게는 시클로헥실아크릴레이트이다.As an alicyclic structure containing ethylenically unsaturated compound (B1), it is preferable that it is an alicyclic structure containing (meth) acrylate type compound, As carbon number of an alicyclic structure, it is C4-C20 normally, Especially preferably, it is 6- 10. Specifically, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, tricyclodecanyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5.2.1.02 , 6] decane-8-yl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, 2-dicyclopentanyloxyethyl (meth) acrylate, isoboroyl Although (meth) acrylate, 4-t-butyl cyclohexyl (meth) acrylate, 1, 4- cyclohexane dimethanol mono (meth) acrylate, etc. are mentioned, Among these, compatibility with acrylic resin (A) is mentioned. In this outstanding point, cyclohex Sil (meth) acrylate is preferable, and cyclohexyl acrylate is particularly preferable.

수산기 함유 에틸렌성 불포화 화합물(B2)로서는, 수산기 함유 (메타)아크릴레이트계 화합물인 것이 바람직하고, 예를 들면, 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 5-히드록시펜틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 8-히드록시 옥틸(메타)아크릴레이트, 10-히드록시데실(메타)아크릴레이트, (4-히드록시메틸시클로헥실)메틸(메타)아크릴레이트 등의 (메타)아크릴산 히드록시알킬에스테르, 카프로락톤 변성 2-히드록시에틸(메타)아크릴레이트 등의 카프로락톤 변성 모노머, 2-아크릴로일옥시에틸-2-히드록시에틸프탈산, N-메틸올(메타)아크릴아미드, N-히드록시에틸(메타)아크릴아미드 등의 1급 수산기 함유 에틸렌성 불포화 화합물;2-히드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트, 3-클로로-2-히드록시프로필(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트 등의 2급 수산기 함유 에틸렌성 불포화 화합물; 2,2-디메틸-2-히드록시에틸(메타)아크릴레이트 등의 3급 수산기 함유 에틸렌성 불포화 화합물을 들 수 있다.As hydroxyl-containing ethylenically unsaturated compound (B2), it is preferable that it is a hydroxyl-containing (meth) acrylate type compound, For example, 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate , 4-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxy octyl (meth) acrylate, 10-hydroxydecyl Caprolactone modification, such as (meth) acrylic-acid hydroxyalkyl esters, such as (meth) acrylate and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate, and caprolactone modification 2-hydroxyethyl (meth) acrylate Primary hydroxyl group-containing ethylenically unsaturated compounds such as monomers, 2-acryloyloxyethyl-2-hydroxyethyl phthalic acid, N-methylol (meth) acrylamide, and N-hydroxyethyl (meth) acrylamide; Hydroxypropyl (meth) acrylic , 2-hydroxybutyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxy-3 Secondary hydroxyl group-containing ethylenically unsaturated compounds such as -phenoxypropyl (meth) acrylate; And tertiary hydroxyl group-containing ethylenically unsaturated compounds such as 2,2-dimethyl-2-hydroxyethyl (meth) acrylate.

이들 중에서도, 1급 수산기 함유 에틸렌성 불포화 화합물이 바람직하고, 점도 및 아크릴계 수지와의 상용성이 뛰어나 입수의 용이함 때문에 특히 바람직하게는 4-히드록시부틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트이며, 더욱 바람직하게는, 4-히드록시부틸(메타)아크릴레이트이다.Among these, a primary hydroxyl group-containing ethylenically unsaturated compound is preferable, and in particular, 4-hydroxybutyl (meth) acrylate and 2-hydroxypropyl () are preferable because of excellent viscosity and compatibility with acrylic resins and ease of obtaining. Meth) acrylate and 2-hydroxyethyl (meth) acrylate, More preferably, it is 4-hydroxybutyl (meth) acrylate.

단관능성 불포화 화합물(B)로서는, 본 발명의 효과를 해치지 않는 범위에서, 상기 지환식 구조 함유 에틸렌성 불포화 화합물(B1), 수산기 함유 에틸렌성 불포화 화합물(B2) 이외의 에틸렌성 불포화기를 1개 갖는 불포화 화합물(B3) (이하, 「단관능성 불포화 화합물(B3)」이라고 기재하기도 함)을 이용하는 것이 바람직하지만, 내부식성이 뛰어난 점에서, 산성기를 갖는 화합물은 이용하지 않는 것이 바람직하다.As a monofunctional unsaturated compound (B), it has one ethylenically unsaturated group other than the said alicyclic structure containing ethylenically unsaturated compound (B1) and hydroxyl-containing ethylenically unsaturated compound (B2) in the range which does not impair the effect of this invention. Although it is preferable to use an unsaturated compound (B3) (henceforth a "monofunctional unsaturated compound (B3)"), it is preferable not to use the compound which has an acidic group from the point which is excellent in corrosion resistance.

단관능성 불포화 화합물(B3)로서는, 예를 들면, 알킬기의 탄소수가 1∼30의 (메타)아크릴산 알킬에스테르를 들 수 있어 구체적으로는, 에틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, n-부틸(메타)아크릴레이트, 이소-부틸(메타)아크릴레이트, tert-부틸(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소-옥틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 노닐(메타)아크릴레이트, n-디실 (메타)아크릴레이트, 이소-데실 (메타)아크릴레이트, 메틸(메타)아크릴레이트 등을 들 수 있다. 그 중에서도, 바람직하게는 알킬기의 탄소수가 2∼20, 특히 바람직하게는 4∼18, 더욱 바람직하게는 4∼10의 (메타)아크릴산 알킬에스테르를 들 수 있고, 특히는, 2-에틸헥실(메타)아크릴레이트, n-부틸(메타)아크릴레이트가 바람직하게 이용된다.As monofunctional unsaturated compound (B3), the C1-C30 (meth) acrylic-acid alkylester of an alkyl group is mentioned, for example, Ethyl (meth) acrylate and n-propyl (meth) acrylate specifically, are mentioned. , n-butyl (meth) acrylate, iso-butyl (meth) acrylate, tert-butyl (meth) acrylate, n-octyl (meth) acrylate, iso-octyl (meth) acrylate, 2-ethylhexyl (Meth) acrylate, nonyl (meth) acrylate, n-disyl (meth) acrylate, iso-decyl (meth) acrylate, methyl (meth) acrylate, etc. are mentioned. Especially, Preferably, the alkyl group has 2-20 carbon atoms, Especially preferably, 4-18, More preferably, 4-10 alkyl (meth) acrylic-acid alkylester is mentioned, Especially 2-ethylhexyl (meth) is mentioned. ) Acrylate and n-butyl (meth) acrylate are used preferably.

또, 단관능성 불포화 화합물(B3)로서는, 상기 이외, 글리시딜(메타)아크릴레이트, 알릴글리시딜(메타)아크릴레이트 등의 글리시딜 함유 불포화 모노머;t-부틸 아미노에틸(메타)아크릴레이트, 디에틸아미노에틸(메타)아크릴레이트, 디메틸아미노에틸(메타)아크릴레이트 등의 아미노기 함유 모노머; 2-(아세트아세톡시)에틸(메타)아크릴레이트, 알릴아세트아세테이트 등의 아세트아세틸기 함유 모노머; 2-메톡시에틸(메타)아크릴레이트, 3-메톡시에틸(메타)아크릴레이트, 메톡시디에틸렌글리필(메타)아크릴레이트 등의 알콕시 (폴리)알킬렌글리콜모노(메타)아크릴레이트류;N-아크릴아미드메틸트리메틸 암모늄클로라이드, 아릴트리메틸 암모늄클로라이드, 디메틸아릴비닐케톤 등의 알릴 화합물류; N-(메타)아크로일옥시메틸렌석신이미드, N-(메타)아크릴로일-2-옥시디메틸렌석신이미드, N-(메타)아크릴로일-3-옥시트리메틸렌석신이미드, N-(메타)아크릴로일-4-옥시테트라메틸렌석신이미드, N-(메타)아크릴로일-5-옥시펜타메틸렌석신이미드, N-(메타)아크릴로일-6-옥시헥사메틸렌석신이미드 등의 석신이미드류; N-비닐피롤리돈, 프로피온산 비닐, 스테아린산 비닐, 염화비닐, 염화 비닐리덴, 초산 비닐, 스틸렌 등의 비닐계 모노머 등을 이용해도 된다.Moreover, as monofunctional unsaturated compound (B3), glycidyl containing unsaturated monomers, such as glycidyl (meth) acrylate and allyl glycidyl (meth) acrylate, are mentioned other than the above; t-butyl amino ethyl (meth) acryl Amino group-containing monomers such as acrylate, diethylaminoethyl (meth) acrylate and dimethylaminoethyl (meth) acrylate; acetacetyl group-containing monomers such as 2- (acetoxy) ethyl (meth) acrylate and allyl acetacetate Alkoxy (poly) alkylene glycol mono (meth) acrylates, such as 2-methoxyethyl (meth) acrylate, 3-methoxyethyl (meth) acrylate, and methoxydiethyleneglycol (meth) acrylate; Allyl compounds such as N-acrylamide methyltrimethyl ammonium chloride, aryltrimethyl ammonium chloride, and dimethylaryl vinyl ketone; N- (meth) acryloyloxymethylenesuccinimide, N- (meth) a Liloyl-2-oxydimethylene succinimide, N- (meth) acryloyl-3-oxytrimethylene succinimide, N- (meth) acryloyl-4-oxytetramethylene succinimide, N- Succinimides such as (meth) acryloyl-5-oxypentamethylene succinimide and N- (meth) acryloyl-6-oxyhexamethylene succinimide; N-vinylpyrrolidone, vinyl propionate, stearic acid Vinyl monomers, such as vinyl, vinyl chloride, vinylidene chloride, vinyl acetate, and styrene, etc. may be used.

이들 단관능성 불포화 화합물(B3) 중에서, 1종을 단독으로, 또는 2종 이상을 병용하여 이용하면 된다.In these monofunctional unsaturated compounds (B3), 1 type may be used individually or in combination of 2 or more types.

단관능성 불포화 화합물(B) 전체에 대한, 지환식 구조 함유 에틸렌성 불포화 화합물(B1)의 함유 비율로서는, 바람직하게는 0.5∼70 중량%, 특히 바람직하게는 1∼60 중량%, 더욱 바람직하게는 3∼50 중량%, 특히 바람직하게는 5∼40 중량%이다. 지환식 구조 함유 에틸렌성 불포화 화합물(B1)의 함유 비율이 너무 높거나 너무 낮아도 점착력이 저하하는 경향이 있다.As content rate of an alicyclic structure containing ethylenically unsaturated compound (B1) with respect to the whole monofunctional unsaturated compound (B), Preferably it is 0.5 to 70 weight%, Especially preferably, it is 1 to 60 weight%, More preferably 3 to 50% by weight, particularly preferably 5 to 40% by weight. Even if the content rate of an alicyclic structure containing ethylenically unsaturated compound (B1) is too high or too low, there exists a tendency for adhesive force to fall.

단관능성 불포화 화합물(B) 전체에 대한, 수산기 함유 에틸렌성 불포화 화합물(B2)의 함유 비율로서는, 바람직하게는 1∼70 중량%, 특히 바람직하게는 3∼60 중량%, 더욱 바람직하게는 5∼50 중량%, 특히 바람직하게는 7∼40 중량%이다. 수산기 함유 에틸렌성 불포화 화합물(B2)의 함유 비율이 너무 높으면, 응집력이 너무 높아지는 경향이 있어, 너무 낮으면 내구성이 저하하는 경향이 있다.As content rate of a hydroxyl-containing ethylenically unsaturated compound (B2) with respect to the whole monofunctional unsaturated compound (B), Preferably it is 1 to 70 weight%, Especially preferably, it is 3 to 60 weight%, More preferably, it is 5 to 50 wt%, particularly preferably 7-40 wt%. When the content ratio of the hydroxyl group-containing ethylenically unsaturated compound (B2) is too high, the cohesion force tends to be too high, and when too low, the durability tends to decrease.

단관능성 불포화 화합물(B) 전체에 대한, 지환식 구조 함유 에틸렌성 불포화 화합물(B1) 및 수산기 함유 에틸렌성 불포화 화합물(B2)의 합계량의 함유 비율로서는, 바람직하게는 10∼75 중량%, 특히 바람직하게는 20∼70 중량%, 더욱 바람직하게는 25∼65 중량%, 특히 바람직하게는 30∼60 중량%이다. 지환식 구조 함유 에틸렌성 불포화 화합물(B1) 및 수산기 함유 에틸렌성 불포화 화합물(B2)의 합계량의 함유 비율이 너무 높으면, 응집력이 너무 높아지는 경향이 있고, 너무 낮으면 본 발명의 효과를 충분히 얻을 수 없는 경향이 있다.As a content rate of the total amount of an alicyclic structure containing ethylenically unsaturated compound (B1) and a hydroxyl-containing ethylenically unsaturated compound (B2) with respect to the whole monofunctional unsaturated compound (B), Preferably it is 10-75 weight%, Especially preferable Preferably from 20 to 70% by weight, more preferably from 25 to 65% by weight, particularly preferably from 30 to 60% by weight. If the content ratio of the total amount of the alicyclic structure-containing ethylenically unsaturated compound (B1) and the hydroxyl group-containing ethylenically unsaturated compound (B2) is too high, the cohesion force tends to be too high, and if too low, the effect of the present invention cannot be sufficiently obtained. There is a tendency.

지환식 구조 함유 에틸렌성 불포화 화합물(B1)과 수산기 함유 에틸렌성 불포화 화합물(B2)의 함유 비율 (중량비)은, (B1): (B2)=10:90∼90:10인 것이 바람직하고, 특히 바람직하게는 (B1):(B2)=20:80∼80:20, 더욱 바람직하게는 (B1):(B2)=30:70∼70:30이다. 수산기 함유 에틸렌성 불포화 화합물(B2)에 대한 지환식 구조 함유 에틸렌성 불포화 화합물(B1)의 함유 비율이 너무 높으면 응집력이 저하기 쉬운 경향이 있고, 너무 낮으면 점착력이 저하하기 쉬운 경향이 있다.It is preferable that the content ratio (weight ratio) of an alicyclic structure containing ethylenically unsaturated compound (B1) and a hydroxyl group containing ethylenically unsaturated compound (B2) is (B1) :( B2) = 10: 90-90: 10, Especially Preferably, it is (B1) :( B2) = 20: 80-80: 20, More preferably, it is (B1) :( B2) = 30: 70-70: 30. When the content ratio of the alicyclic structure-containing ethylenically unsaturated compound (B1) to the hydroxyl group-containing ethylenically unsaturated compound (B2) is too high, the cohesion force tends to be low, and when too low, the adhesive force tends to decrease.

단관능성 불포화 화합물(B)의 함유량은, 아크릴계 수지(A)와 단관능성 불포화 화합물(B)의 합계 100중량부에 대해서, 50∼95중량부인 것이 바람직하고, 특히 바람직하게는 55∼93중량부, 더욱 바람직하게는 60∼90중량부이다. 단관능성 불포화 화합물(B)의 함유량이 너무 많으면, 점도가 너무 낮아서 도공하기 어려워지는 경향이 있고, 너무 낮으면 점도가 높아 도공하기 어려워지는 경향이 있다.It is preferable that content of a monofunctional unsaturated compound (B) is 50-95 weight part with respect to a total of 100 weight part of acrylic resin (A) and a monofunctional unsaturated compound (B), Especially preferably, it is 55-93 weight part More preferably, it is 60-90 weight part. When there is too much content of a monofunctional unsaturated compound (B), there exists a tendency for a viscosity to be too low and to become difficult to coat, and when too low, a viscosity becomes high and it becomes difficult to coat.

에틸렌성 불포화기를 2개 이상 함유하는 에틸렌성 불포화 화합물(C) (이하, 「다관능성 불포화 화합물(C)」이라고 기재하기도 한다.)로서는, 예를 들면, 2관능의 (메타)아크릴레이트계 모노머, 3관능 이상의 (메타)아크릴레이트계 모노머나, 우레탄(메타)아크릴레이트계 화합물, 에폭시(메타)아크릴레이트계 화합물, 폴리에스테르(메타)아크릴레이트계 화합물을 이용할 수 있다. 또, 이들은 단독으로 또는 2종 이상 함께 이용할 수 있다.As an ethylenically unsaturated compound (C) containing two or more ethylenically unsaturated groups (Hereinafter, it may be described as a "polyfunctional unsaturated compound (C).)) For example, a bifunctional (meth) acrylate type monomer , A trifunctional or higher (meth) acrylate monomer, a urethane (meth) acrylate compound, an epoxy (meth) acrylate compound, or a polyester (meth) acrylate compound can be used. Moreover, these can be used individually or in combination of 2 or more types.

2관능의 (메타)아크릴레이트계 모노머로서는, (메타)아크릴로일기를 2개 함유하는 모노머면 되고, 예를 들면, 에틸렌디글리필(메타)아크릴레이트, 디에틸렌글리콜디(메타)아크릴레이트, 테트라에틸렌글리콜디(메타)아크릴레이트, 폴리에틸렌글리콜디(메타)아크릴레이트, 프로필렌글리콜디(메타)아크릴레이트, 디프로필렌글리콜디(메타)아크릴레이트, 폴리프로필렌글리콜디(메타)아크릴레이트, 부틸렌글리콜디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 에틸렌옥사이드 변성 비스페놀 A형 디(메타)아크릴레이트, 프로필렌 옥사이드 변성 비스페놀 A형 디(메타)아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 1,6-헥산디올 에틸렌옥사이드 변성 디(메타)아크릴레이트, 글리세린디(메타)아크릴레이트, 펜타에리스리톨디(메타)아크릴레이트, 에틸렌글리콜디글리시딜에테르디(메타)아크릴레이트, 디에틸렌글리콜디글리시딜에테르디(메타)아크릴레이트, 프탈산디글리시딜에스테르디(메타)아크릴레이트, 히드록시 피바린산 변성 네오펜틸글리콜디(메타)아크릴레이트, 이소시아눌산에틸렌옥사이드 변성 디아크릴레이트, 2-(메타)아크릴로일옥시에틸애시드포스페이트디에스테르 등을 들 수 있다.As a bifunctional (meth) acrylate type monomer, what is necessary is just a monomer containing two (meth) acryloyl groups, For example, ethylene diglyfil (meth) acrylate, diethylene glycol di (meth) acrylate, Tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, butylene Glycoldi (meth) acrylate, neopentyl glycoldi (meth) acrylate, ethylene oxide modified bisphenol A type di (meth) acrylate, propylene oxide modified bisphenol A type di (meth) acrylate, 1,6-hexanediol Di (meth) acrylate, 1,6-hexanediol ethylene oxide modified di (meth) acrylate, glycerin di (meth) acrylate, pentaerythritol di (meth) acrylate , Ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, phthalic acid diglycidyl ester di (meth) acrylate, hydroxy pivaric acid modified neopentyl Glycol di (meth) acrylate, isocyanuric acid ethylene oxide modified diacrylate, 2- (meth) acryloyloxyethyl acid phosphate diester, and the like.

3관능 이상의 (메타)아크릴레이트계 모노머로서는, (메타)아크릴로일기를 3개 이상 함유하는 모노머면 되고, 예를 들면, 트리메티롤프로판트리(메타)아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 디펜타에리스리톨트리(메타)아크릴레이트, 디펜타에리스리톨테트라(메타)아크릴레이트, 디펜타에리스리톨펜타(메타)아크릴레이트, 디펜타에리스리톨헥사 (메타)아크릴레이트, 트리(메타)아크릴로일옥시에톡시트리메티롤프로판, 글리세린폴리글리시딜에테르폴리(메타)아크릴레이트, 이소시아눌산에틸렌옥사이드 변성 트리(메타)아크릴레이트, 에틸렌옥사이드 변성 디펜타에리스리톨펜타(메타)아크릴레이트, 에틸렌옥사이드 변성 디펜타에리스리톨헥사 (메타)아크릴레이트, 에틸렌옥사이드 변성 펜타에리스리톨트리(메타)아크릴레이트, 에틸렌옥사이드 변성 펜타에리스리톨 테트라(메타)아크릴레이트, 호박산 변성 펜타에리스리톨트리(메타)아크릴레이트 등을 들 수 있다.As a trifunctional or more than (meth) acrylate type monomer, what is necessary is just a monomer containing three or more (meth) acryloyl groups, For example, a trimethol propane tri (meth) acrylate and a pentaerythritol tri (meth) acryl Late, pentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate , Tri (meth) acryloyloxyethoxytrimetholpropane, glycerin polyglycidyl ether poly (meth) acrylate, isocyanuric acid ethylene oxide modified tri (meth) acrylate, ethylene oxide modified dipentaerythritol penta ( Meta) acrylate, ethylene oxide modified dipentaerythritol hexa (meth) acrylate, ethylene oxide modified penta Erythritol tri (meth) acrylate, ethylene oxide modified pentaerythritol tetra (meth) acrylate, succinic acid modified pentaerythritol tri (meth) acrylate, and the like.

우레탄(메타)아크릴레이트계 화합물로서는, 분자 내에 우레탄 결합을 갖는 (메타)아크릴레이트계 화합물이며, 수산기를 함유하는 (메타)아크릴계 화합물과 다가 이소시아네이트계 화합물(필요에 따라서, 폴리올계 화합물)을, 공지 일반의 방법에 의해 반응시켜 얻을 수 있는 것을 이용하면 되고, 그 중량 평균 분자량으로서는, 통상 300∼4000의 것을 이용하면 된다.As a urethane (meth) acrylate type compound, it is a (meth) acrylate type compound which has a urethane bond in a molecule | numerator, The (meth) acrylic type compound containing a hydroxyl group, and polyhydric isocyanate type compound (polyol type compound as needed), What can be obtained by making it react by a well-known general method may be used, and as a weight average molecular weight, what is necessary is just to use 300-4000 normally.

다관능성 불포화 화합물(C)의 함유량으로서는, 아크릴계 수지(A)와 단관능성 불포화 화합물(B)의 합계 100 중량부에 대해서 0.005∼15 중량부인 것이 바람직하고, 특히 바람직하게는 0.01∼13 중량부, 더욱 바람직하게는 0.1∼10 중량부이다.As content of a polyfunctional unsaturated compound (C), it is preferable that it is 0.005-15 weight part with respect to a total of 100 weight part of acrylic resin (A) and a monofunctional unsaturated compound (B), Especially preferably, it is 0.01-13 weight part, More preferably, it is 0.1-10 weight part.

다관능성 불포화 화합물(C)의 함유량이 너무 많으면, 점착력이 저하하기 쉬워지는 경향이 있고, 너무 적으면 응집력이 저하하기 쉬워지는 경향이 있다.When there is too much content of a polyfunctional unsaturated compound (C), there exists a tendency for adhesive force to fall easily, and when too small, there exists a tendency for cohesion force to fall easily.

광중합 개시제 (D)로서는, 광 등의 활성 에너지선의 작용에 의해 라디칼을 발생하는 것이면 특별히 한정되지 않고, 분자 내 자기개렬 (self-cleavage)형의 광중합 개시제나 수소 인발형 광중합 개시제가 이용된다.The photopolymerization initiator (D) is not particularly limited as long as it generates radicals by the action of active energy rays such as light, and an intramolecular self-cleavage type photopolymerization initiator or a hydrogen extraction type photopolymerization initiator is used.

분자내 자기개렬형의 광중합 개시제로서는, 예를 들면, 4-페녹시디클로로아세트페논, 4-t-부틸디클로로아세트페논, 디에톡시아세트페논, 2-히드록시-2-메틸-1-페닐프로판-1-온, 1-(4-이소프로필렌페닐)-2-히드록시-2-메틸프로판-1-온, 1-(4-도데실페닐)-2-히드록시-2-메틸프로판-1-온, 4-(2-히드록시에톡시)-페닐 (2-히드록시-2-프로필)케톤, 1-히드록시시클로헥실페닐케톤, 2-메틸-1-〔4-(메틸티오)페닐〕-2-몰포리노프로판-1-온, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로피르에테르, 벤조인이소부틸에테르, 벤질디메틸케탈,α-아시록심에스테르, 아실포스핀 옥사이드, 메틸페닐글리옥시레이트, 4-(2-히드록시에톡시) 페닐-(2-히드록시-2-프로필)케톤, 4-벤조일-4'-메틸 디페닐설파이드 등을 들 수 있고, 그 중에서도 2-히드록시-2-메틸-1-페닐 프로판-1-온, 1-히드록시시클로헥실페닐케톤이 매우 적합하다.Examples of the intramolecular self-aligned photopolymerization initiators include 4-phenoxydichloroacetphenone, 4-t-butyldichloroacetphenone, diethoxyacetphenone, 2-hydroxy-2-methyl-1-phenylpropane- 1-one, 1- (4-isopropylenephenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl) -2-hydroxy-2-methylpropane-1- On, 4- (2-hydroxyethoxy) -phenyl (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2- morpholino propane-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, alpha -acyroxime ester, acyl phosphine Oxide, methylphenylglyoxylate, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 4-benzoyl-4'-methyl diphenylsulfide, and the like. 2-hydroxy-2-methyl-1-phenyl propane-1- , Is very suitable for the 1-hydroxycyclohexyl phenyl ketone.

또, 수소인발형의 광중합 개시제로서는, 예를 들면, 벤조페논, 4-페닐벤조페논, 히드록시벤조페논, 3,3'-디메틸-4-메톡시벤조페논, 2,4,6-트리메틸벤조페논, 4-메틸벤조페논, 티옥산손, 2-클로로티옥산손, 2-메틸티옥산손, 2,4-티메틸티옥산손, 이소프로피르티옥산손, 캠포퀴논 (Camphorquinone), 디벤조스베론, 2-에틸안스라퀴논, 3,3',4,4'-테트라(t-부틸퍼옥시카르보닐)벤조페논, 벤질, 9,10-페난스렌퀴논 등을 들 수 있고, 그 중에서도 벤조페논, 메틸벤조페논, 2,4,6-트리메틸벤조페논이 매우 적합하다. 이들 광중합 개시제 (D)는 1종 또는 2종 이상 병용해서 이용된다.Moreover, as a hydrogen draw type photoinitiator, benzophenone, 4-phenylbenzo phenone, hydroxy benzophenone, 3,3'- dimethyl- 4-methoxy benzophenone, 2,4, 6-trimethyl benzo, for example. Phenone, 4-methylbenzophenone, thioxanthone, 2-chlorothioxone, 2-methylthioxone, 2,4-thimethylthioxone, isopropyrthioxone, camphorquinone, di Benzosverone, 2-ethyl anthraquinone, 3,3 ', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone, benzyl, 9,10-phenansrenquinone, and the like. Among them, benzophenone, methyl benzophenone and 2,4,6-trimethylbenzophenone are very suitable. These photoinitiators (D) are used 1 type or in combination or 2 or more types.

또한 상술의 광중합 개시제 이외에, 트리아진계 광중합 개시제를 이용하는 것으로, 경화 후에 양호한 점착 물성을 얻기 위해서 필요한 적산 광량을 줄이는 것이 가능해진다.In addition to using the above-mentioned photopolymerization initiator, by using a triazine-based photopolymerization initiator, it becomes possible to reduce the amount of accumulated light required to obtain good adhesive physical properties after curing.

트리아진계 광중합 개시제로서는, 예를 들면, 하기 화학식 1로 표시되는 2, 4,6-3치환-s-트리아진을 들 수 있다.As a triazine type photoinitiator, 2, 4, 6-3 substituted-s-triazine represented by following General formula (1) is mentioned, for example.

Figure pct00002
Figure pct00002

〔상기 식 1에서, R1, R2, 및 R3는, 각각 알킬기, 치환 알킬기, 아릴기, 치환 아릴기, 알케닐기 또는 알콕시기이며, 서로 동일하거나 상이해도 되나, 적어도 하나는 모노 할로겐 치환 메틸기, 디할로겐환 치환 메틸기 또는 트리할로겐 치환 메틸기이다.〕[In Formula 1, R 1 , R 2 , and R 3 are each an alkyl group, a substituted alkyl group, an aryl group, a substituted aryl group, an alkenyl group, or an alkoxy group, and may be the same or different from each other, but at least one is mono halogen substituted. A methyl group, a dihalogen ring substituted methyl group, or a trihalogen substituted methyl group.]

상기 알킬기로서는, 예를 들면, 탄소수 1∼10의 알킬기, 구체적으로는, 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, n-헥실기 등을 들 수 있다. 또, 상기 치환 알킬기로서는, 할로겐 원자에 의해 치환된 탄소수 1∼10의 알킬기, 구체적으로는, 트리클로로메틸기, 트리브로모메틸기, α,α,β-트리클로로에틸기 등을 들 수 있다.As said alkyl group, a C1-C10 alkyl group, specifically, a methyl group, an ethyl group, n-propyl group, i-propyl group, n-butyl group, n-hexyl group etc. are mentioned, for example. Moreover, as said substituted alkyl group, a C1-C10 alkyl group substituted by the halogen atom, specifically, a trichloromethyl group, a tribromomethyl group, (alpha), (alpha), (beta)-trichloroethyl group etc. are mentioned.

그리고 상기 아릴기 및 치환 아릴기로서는, 예를 들면, 탄소수 6∼20의 것, 구체적으로는, 페닐기, p-메톡시 페닐기, p-메틸 티오 페닐기, p-클로로 페닐기, 4-비페니릴기, 나프틸기, 4-메톡시-1-나프틸기 등을 들 수 있다.As the aryl group and the substituted aryl group, for example, those having 6 to 20 carbon atoms, specifically, a phenyl group, p-methoxy phenyl group, p-methyl thiophenyl group, p-chlorophenyl group, 4-biphenyryl group, A naphthyl group, 4-methoxy-1- naphthyl group, etc. are mentioned.

또, 상기 알케닐기로서는, 예를 들면, 비닐기, 알릴기, 2-페닐에테닐기 등의 탄소수 2∼12의 것을 들 수 있다. 또한, 상기 알콕시기로서는, 예를 들면, 메톡시기, 에톡시기, 부톡시기 등의 탄소수 1∼10의 것을 들 수 있다.Moreover, as said alkenyl group, C2-C12 things, such as a vinyl group, an allyl group, and 2-phenylethenyl group, are mentioned, for example. Moreover, as said alkoxy group, C1-C10 things, such as a methoxy group, an ethoxy group, butoxy group, are mentioned, for example.

그리고 상기 모노 할로겐 치환 메틸기, 디할로겐 치환 메틸기 또는 트리할로겐 치환 메틸기로서는, 클로로메틸기, 브로모메틸기, 요오드메틸기, 디클로로메틸기, 디브로모메틸기, 디요오드메틸기, 트리클로로메틸기, 트리브로모메틸기, 트리요오드메틸기를 들 수 있다. 그 중에서도, 염소 원자가 치환한 트리클로로메틸기가 매우 적합하다.And as said mono halogen substituted methyl group, dihalogen substituted methyl group, or trihalogen substituted methyl group, a chloromethyl group, a bromomethyl group, an iodine methyl group, a dichloromethyl group, a dibromomethyl group, a diiodine methyl group, a trichloromethyl group, a tribromomethyl group, a tribromomethyl group An iodine methyl group is mentioned. Especially, the trichloromethyl group which the chlorine atom substituted is very suitable.

이와 같은 상기 화학식 1로 표시되는 2,4,6-3치환-s-트리아진은, 예를 들면, Journal of American Chemical Society 제72 각권 3257∼3528페이지 (1950년), Journal of American Chemical Society 제74 각권 5633∼5636페이지 (1952년), Juatus Lieblgs Annalen der Chemie 제577 각권 77∼95 페이지 (1952년)에 기재된 방법에 따라 합성할 수 있다.Such 2,4,6-3 substituted-s-triazine represented by Formula 1 is, for example, Journal of American Chemical Society Vol. 72, pp. 3257-3528 (1950), manufactured by Journal of American Chemical Society 74, 5633-5636 (1952), Juatus Lieblgs Annalen der Chemie, 77-95 (1952).

상기 화학식 1로 나타내는 2,4,6-3치환-s-트리아진으로서는, 구체적으로는, 2,4,6-트리스(트리클로로메틸)-s-트리아진, 2,4,6-트리스(트리브로모메틸)-s-트리아진, 2,4-비스(트리클로로메틸)-6-메틸-s-트리아진, 2,4-비스(트리브로모메틸)-6-메틸-s-트리아진, 2,4-비스(트리클로로메틸)-6-(p-톨릴)-s-트리아진, 2,4-비스(트리클로로메틸)-6-n-프로필-s-트리아진, 2-(α,α,β-트리클로로에틸)-4,6-비스(트리클로로메틸)-s-트리아진, 2,4,6-트리스(디클로로메틸)-s-트리아진, 2,4,6-트리스(디브로모메틸)-s-트리아진, 2,4,6-트리스(브로모메틸)-s-트리아진, 2,4,6-트리스(클로로메틸)-s-트리아진 등의 지방족계 치환기만을 갖는 2,4,6-3치환-s-트리아진계 광중합 개시제, 2,4-비스(트리클로로 메틸)-6-페닐-s-트리아진, 2,4-비스(트리클로로메틸)-6-(p-메톡시페닐)-s-트리아진, 2,4-비스(트리클로로메틸)-6-(p-메틸티오페닐)-s-트리아진, 2,4-비스(트리클로로메틸)-6-(p-클로로페닐)-s-트리아진, 2,4-비스(트리클로로메틸)-6-(2',4'-디클로로페닐)-s-트리아진, 2-(p-브로모페닐)-4, 6-비스(트리클로로메틸)-s-트리아진, 2, 4-비스(트리브로모메틸)-6-페닐-s-트리아진, 2,4-비스(트리클로로메틸)-6-스티릴-s-트리아진, 2,4-비스(트리클로로 메틸)-6-[2-(p-메톡시페닐)에테닐]-s-트리아진, 2,4-비스(트리클로로메틸)-6-[2-(o-메톡시페닐)에테닐]-s-트리아진, 2-[2-(p-부톡시페닐)에테닐]-비스(트리클로로메틸)-s-트리아진, 2-[2-(3,4-디메톡시페닐)에테닐]-2,4-비스(트리클로로메틸)-s-트리아진, 2-[2-(3,4,5-트리메톡시페닐)에테닐]-2,4-비스(트리클로로메틸)-s-트리아진,2-(1-나프틸)-2,4-비스(트리클로로메틸)-s-트리아진, 2-(4-비페니릴)-2,4-비스(트리클로로메틸)-s-트리아진, 2-(4´-메톡시-1´-나프틸)-2,4-비스(트리클로로메틸)-s-트리아진, 2,4-비스(트리클로로메틸)-6-(p-메톡시나프틸)-s-트리아진, 2,4-비스(트리클로로메틸)-6-(피페로닐)-s-트리아진, 2,4-비스(트리클로로메틸)-6-(p-메톡시스티릴)-s-트리아진 등의 방향족계 치환기를 갖는 2,4,6-3치환-s-트리아진계 광중합 개시제 등을 들 수 있다. 이들은 단독으로 또는 2종 이상을 함께 이용된다.Specifically as 2,4,6-3 substituted-s-triazine represented by the said Formula (1), 2,4,6-tris (trichloromethyl) -s-triazine, 2,4,6-tris ( Tribromomethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-methyl-s-triazine, 2,4-bis (tribromomethyl) -6-methyl-s-tri Azine, 2,4-bis (trichloromethyl) -6- (p-tolyl) -s-triazine, 2,4-bis (trichloromethyl) -6-n-propyl-s-triazine, 2- (α, α, β-trichloroethyl) -4,6-bis (trichloromethyl) -s-triazine, 2,4,6-tris (dichloromethyl) -s-triazine, 2,4,6 -Tris (dibromomethyl) -s-triazine, 2,4,6-tris (bromomethyl) -s-triazine, 2,4,6-tris (chloromethyl) -s-triazine 2,4,6-3 substituted-s-triazine-based photopolymerization initiator having only aliphatic substituents, 2,4-bis (trichloromethyl) -6-phenyl-s-triazine, 2,4-bis (trichloromethyl ) -6- (p-methoxyphenyl) -s-triazine, 2,4-bis (trichloromethyl)- 6- (p-methylthiophenyl) -s-triazine, 2,4-bis (trichloromethyl) -6- (p-chlorophenyl) -s-triazine, 2,4-bis (trichloromethyl) -6- (2 ', 4'-dichlorophenyl) -s-triazine, 2- (p-bromophenyl) -4, 6-bis (trichloromethyl) -s-triazine, 2, 4-bis (Tribromomethyl) -6-phenyl-s-triazine, 2,4-bis (trichloromethyl) -6-styryl-s-triazine, 2,4-bis (trichloromethyl) -6- [2- (p-methoxyphenyl) ethenyl] -s-triazine, 2,4-bis (trichloromethyl) -6- [2- (o-methoxyphenyl) ethenyl] -s-triazine , 2- [2- (p-butoxyphenyl) ethenyl] -bis (trichloromethyl) -s-triazine, 2- [2- (3,4-dimethoxyphenyl) ethenyl] -2,4 -Bis (trichloromethyl) -s-triazine, 2- [2- (3,4,5-trimethoxyphenyl) ethenyl] -2,4-bis (trichloromethyl) -s-triazine, 2- (1-naphthyl) -2,4-bis (trichloromethyl) -s-triazine, 2- (4-biphenyryl) -2,4-bis (trichloromethyl) -s-triazine , 2- (4'-methoxy-1'-naphthyl) -2,4- S (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6- (p-methoxynaphthyl) -s-triazine, 2,4-bis (trichloromethyl)- 2,4 having aromatic substituents such as 6- (piperonyl) -s-triazine and 2,4-bis (trichloromethyl) -6- (p-methoxystyryl) -s-triazine 6-3 substituted-s-triazine type photoinitiator etc. are mentioned. These are used individually or in combination of 2 or more types.

이들 중에서도, 상기 트리아진계 광중합 개시제로서 방향족계 치환기를 갖는 2,4,6-3치환-s-트리아진계 광중합 개시제를 이용하는 것이 바람직하고, 또한 도막의 황변이 적은, 상용성이 좋다는 점에서부터, 2,4-비스(트리클로로메틸)-6-(p-메톡시페닐)-s-트리아진을 이용하는 것이 특히 바람직하다.Among these, it is preferable to use the 2,4,6-3 substituted-s-triazine type photoinitiator which has an aromatic substituent as said triazine type photoinitiator, and since it is good in compatibility with little yellowing of a coating film, it is 2 Particular preference is given to using, 4-bis (trichloromethyl) -6- (p-methoxyphenyl) -s-triazine.

또한, 필요에 따라서, 광중합 개시제 (D)의 조제로서 예를 들면, 트리에탄올 아민, 트리이소프로판올아민, 4,4'-디메틸아미노벤조페논(미히라케톤), 4,4'-디에틸아미노벤조페논, 2-디메틸아미노에틸안식향산, 4-디메틸아미노안식향산 에틸, 4-디메틸아미노안식향산(n-부톡시)에틸, 4-디메틸아미노안식향산 이소아밀, 4-디메틸아미노안식향산 2-에틸헥실, 2,4-디에틸티옥산손, 2,4-디이소프로필티옥산손 등을 병용하는 것도 가능하다.Moreover, as needed, for example, as a preparation of a photoinitiator (D), a triethanol amine, a triisopropanolamine, 4,4'- dimethylamino benzophenone (mihiraketone), 4,4'- diethylamino benzophenone , 2-dimethylaminoethyl benzoic acid, 4-dimethylamino benzoic acid ethyl, 4-dimethylamino benzoic acid (n-butoxy) ethyl, 4-dimethylamino benzoic acid isoamyl, 4-dimethylamino benzoic acid 2-ethylhexyl, 2,4- It is also possible to use diethyl thioxane hands, 2,4-diisopropyl thioxane hands, etc. together.

광중합 개시제(D)의 함유량은, 단관능성 불포화 화합물(B)과 다관능성 불포화 화합물(C)과의 합계 100 중량부에 대해서, 0.1∼20 중량부인 것이 바람직하고, 특히 바람직하게는 0.5∼15 중량부, 더욱 바람직하게는 1∼10 중량부이다. 광중합 개시제(D)의 함유량이 너무 적으면, 자외선 등의 활성 에너지선 조사에 의한 중합에 격차가 생기기 쉬워지는 경향이 있고, 너무 많으면, 일정 이상의 첨가 효과를 얻지 못하여 경제적이지 못하는 경향이 있다.It is preferable that content of a photoinitiator (D) is 0.1-20 weight part with respect to a total of 100 weight part of a monofunctional unsaturated compound (B) and a polyfunctional unsaturated compound (C), Especially preferably, it is 0.5-15 weight part Parts, more preferably 1 to 10 parts by weight. When the content of the photopolymerization initiator (D) is too small, a gap tends to occur in polymerization by active energy ray irradiation such as ultraviolet rays, and when too large, a certain or more addition effect may not be obtained and it may not be economical.

또, 광중합 개시제(D)로서 상기 트리아진계 광중합 개시제를 단독으로 이용하는 경우는, 단관능성 불포화 화합물(B)과 다관능성 불포화 화합물(C)과의 합계 100중량부에 대해서, 트리아진계 광중합 개시제를 0.01∼0.5중량부 함유시키는 것이 바람직하고, 특히 바람직하게는 0.05∼0.45중량부, 더욱 바람직하게는 0.1∼0.4 중량부, 특히 바람직하게는 0.15∼0.35중량부이다.Moreover, when using the said triazine type photoinitiator alone as a photoinitiator (D), it is 0.01 triazine type photoinitiator with respect to a total of 100 weight part of a monofunctional unsaturated compound (B) and a polyfunctional unsaturated compound (C). It is preferable to make it contain -0.5 weight part, Especially preferably, it is 0.05-0.45 weight part, More preferably, it is 0.1-0.4 weight part, Especially preferably, it is 0.15-0.35 weight part.

이렇게 하여, 아크릴계 수지(A), 단관능성 불포화 화합물(B), 다관능성 불포화 화합물(C), 및 광중합 개시제(D)를 함유하여 이루어진 본 발명의 점착제 조성물을 얻을 수 있지만, 본 발명의 효과를 해치지 않는 범위에서, 이소시아네이트계, 에폭시계, 금속염, 금속 알콕시드, 알데히드계 화합물, 비아미노 수지계 아미노 화합물, 요소계, 금속 킬레이트계, 멜라민계, 아질리딘계 등, 일반적으로 사용되는 가교제, 다른 점착제, 우레탄 수지, 로진, 로진 에스테르, 수소 첨가 로진 에스테르, 페놀 수지, 방향족 변성 테르펜 수지, 지방족계 석유 수지, 지환족계 석유 수지, 스티렌계 수지, 자일렌계 수지 등의 점착 부여제, 공지의 첨가제나 자외선 또는 방사선 조사에 의해 정색 또는 변색을 일으키는 화합물을 배합할 수 있다.In this way, although the adhesive composition of this invention containing acrylic resin (A), a monofunctional unsaturated compound (B), a polyfunctional unsaturated compound (C), and a photoinitiator (D) can be obtained, the effect of this invention is acquired, In the range which does not harm, isocyanate type, epoxy type, metal salt, metal alkoxide, aldehyde type compound, non-amino resin type amino compound, urea type, metal chelate type, melamine type, aziridine type, crosslinking agent generally used, other adhesive Tackifiers such as urethane resins, rosin, rosin esters, hydrogenated rosin esters, phenolic resins, aromatic modified terpene resins, aliphatic petroleum resins, alicyclic petroleum resins, styrene resins, xylene resins, known additives and ultraviolet rays. Or the compound which causes coloring or discoloration by irradiation can be mix | blended.

또, 상기 배합제 외에도, 점착제 조성물의 구성 성분의 제조 원료 등에 포함되는 불순물 등이 소량 함유된 것이어도 된다. 이들 배합제의 배합량은 원하는 물성이 얻어지도록 적절히 설정하면 좋다.Moreover, in addition to the said compounding agent, what contained a small amount of impurities etc. which are contained in the manufacturing raw materials of the component of an adhesive composition, etc. may be sufficient. What is necessary is just to set the compounding quantity of these compounding agents suitably so that a desired physical property may be obtained.

상기 점착제 조성물은 실질적으로 산을 포함하지 않는 것이 내부식성이 뛰어난다는 점에서 바람직하고, 실질적으로 산을 포함하지 않고는 점착제 조성물의 산가가, 통상 1㎎ KOH/g이하, 바람직하게는 0.5㎎ KOH/g이하, 특히 바람직하게는 0인 것을 의미한다.The pressure-sensitive adhesive composition is preferable in that it is excellent in corrosion resistance substantially free of acid, and the acid value of the pressure-sensitive adhesive composition is substantially 1 mg KOH / g or less, preferably 0.5 mg KOH, without substantially including acid. / g or less, particularly preferably 0.

본 발명에서 얻어지는 점착제 조성물은, 물, 수성 용매 또는 유기용매 등의 용제를 실질적으로 함유하지 않는 것이 바람직하고, 아크릴계 수지(A), 다관능성 불포화 화합물(C), 광중합 개시제(D), 또한 필요에 의해 배합되는 다른 성분은, 단관능성 불포화 화합물(B) 중에 용해 또는 균일하게 분산한 상태가 된다. 이와 같은 점착제 조성물은, 아크릴계 수지(A), 단관능성 불포화 화합물(B), 다관능성 불포화 화합물(C), 광중합 개시제(D), 또한 필요에 따라서 배합되는 다른 성분을 상온 또는, 60℃ 정도까지 가온하고 나서 혼합함으로써 조제할 수 있다.It is preferable that the adhesive composition obtained by this invention does not contain solvents, such as water, an aqueous solvent, or an organic solvent substantially, and an acrylic resin (A), a polyfunctional unsaturated compound (C), and a photoinitiator (D) are further needed. The other component mix | blended with will be in the state melt | dissolved or uniformly disperse | distributed in a monofunctional unsaturated compound (B). Such an adhesive composition is an acrylic resin (A), a monofunctional unsaturated compound (B), a polyfunctional unsaturated compound (C), a photoinitiator (D), and the other component mix | blended as needed to normal temperature or about 60 degreeC It can prepare by mixing after heating.

이렇게 하여, 본 발명의 점착제 조성물이 얻어지지만, 이와 같은 점착제 조성물은 활성 에너지선 조사에 의해 경화되어 본 발명의 점착제를 얻을 수 있는 것이다.In this way, although the adhesive composition of this invention is obtained, such an adhesive composition can harden | cure by active energy ray irradiation and can obtain the adhesive of this invention.

활성 에너지선으로서는, 원자외선, 자외선, 근자외선, 적외선 등의 광선, X선, γ선 등의 전자파의 외, 전자선, 플로톤선, 중성자선 등을 이용할 수 있지만, 경화 속도, 조사 장치의 입수의 용이함, 가격 등에서 자외선 조사에 의한 경화가 유리하다.As the active energy ray, in addition to electromagnetic waves such as ultraviolet rays such as far ultraviolet rays, ultraviolet rays, near ultraviolet rays, infrared rays, X rays, and γ rays, electron rays, floton rays, neutron rays, and the like can be used. In view of ease, price and the like, curing by ultraviolet irradiation is advantageous.

자외선 조사에는, 150∼450㎚ 파장역의 광을 발하는 고압 수은 램프, 초고압 수은등, 카본아크 램프, 메탈할라이드 램프, 크세논 램프, 케미컬 램프, 무전극 방전 램프 등을 이용할 수 있다.High-pressure mercury lamps, ultra-high pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, electrodeless discharge lamps and the like that emit light in the wavelength range of 150 to 450 nm can be used for ultraviolet irradiation.

활성 에너지선의 조사량으로서는, 500mJ/㎠ 이상인 것이 바람직하고, 더욱은 1000 mJ/㎠ 이상, 특히는 1500 mJ/㎠ 이상인 것이 바람직하다. 이와 같은 조사량이 너무 적으면 활성 에너지선 조사에 의한 중합에 격차가 생기기 쉬워지는 경향이 있다. 또한, 조사량의 상한은 통상 10000mJ/㎠이며, 조사량이 너무 많으면 장치 및 비용면에서 경제적이지 못하는 경향이 있다.As an irradiation amount of an active energy ray, it is preferable that it is 500 mJ / cm <2> or more, Furthermore, it is preferable that it is 1000 mJ / cm <2> or more, Especially 1500 mJ / cm <2> or more. If the amount of such irradiation is too small, there is a tendency for a gap to easily occur in polymerization by active energy ray irradiation. In addition, the upper limit of irradiation amount is 10000mJ / cm <2> normally, and when there is too much irradiation amount, it exists in the tendency which is not economical in terms of apparatus and cost.

본 발명의 점착제는, 점착 시트로서 이용하는 것이 매우 적합하다. 점착 시트의 제조 방법으로서는,[I]점착제 조성물을 기재상에 도포해, 활성 에너지선을 조사하여 점착제층으로 한 후, 이형시트를 붙이는 방법,[II]점착제 조성물을 기재상에 도포하여 이형시트를 붙인 후, 활성 에너지선 조사를 실시하여 점착제층을 형성하는 방법,[III]점착제 조성물을 이형시트 상에 도포하고 활성 에너지선을 조사하여 점착제층으로 한 후, 기재 또는 이형시트를 붙이는 방법,[IV]점착제 조성물을 이형시트상에 도포하고, 기재 또는 이형시트를 붙인 후, 활성 에너지선 조사를 실시하여 점착제층을 형성하는 방법 등을 들 수 있다.It is very suitable to use the adhesive of this invention as an adhesive sheet. As a manufacturing method of an adhesive sheet, after apply | coating [I] adhesive composition on a base material, irradiating an active energy ray to make an adhesive layer, the method of sticking a release sheet, and apply | coating a [II] adhesive composition on a base material, and a release sheet After attaching, the method of performing an active energy ray irradiation to form an adhesive layer, the method of apply | coating a [III] adhesive composition on a release sheet and irradiating an active energy ray to make an adhesive layer, and then sticking a base material or a release sheet, [IV] A pressure-sensitive adhesive composition is applied onto a release sheet, and a base material or a release sheet is pasted, followed by active energy ray irradiation to form an adhesive layer.

또한, 활성 에너지선 조사 후에 기재 또는 이형시트를 붙이는 경우는, 활성 에너지선 조사시의 산소에 의한 중합 저해 요인을 배제하기 위해, 불활성 가스 분위기하에서 활성 에너지선을 조사하는 것이 보다 바람직하지만, 산소에 의한 중합 저해 요인을 고려하여 조사 조건을 조정하여 물성의 밸런스를 잡는 것도 가능하다.When the base material or the release sheet is applied after the active energy ray irradiation, it is more preferable to irradiate the active energy ray under an inert gas atmosphere in order to exclude the polymerization inhibitory factor due to oxygen at the time of active energy ray irradiation. It is also possible to balance the physical properties by adjusting the irradiation conditions in consideration of the polymerization inhibition factor.

기재로서는, 예를 들면, 알루미늄, 동, 철 등의 금속박; 폴리에틸렌나프타레이트, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에틸렌테레프탈레이트/이소프탈레이트 공중합체 등의 폴리에스테르계 수지; 폴리에틸렌, 폴리프로필렌, 폴리메틸펜텐 등의 폴리올레핀계 수지; 폴리불화비닐, 폴리불화비닐리덴, 폴리불화에틸렌 등의 폴리불화에틸렌 수지; 나일론 6, 나일론 66 등의 폴리아미드; 폴리염화비닐, 폴리염화비닐/초산비닐 공중합체, 에틸렌-초산비닐 공중합체, 에틸렌-비닐 알코올 공중합체, 폴리비닐 알코올, 비닐론 등의 비닐 집합체; 3초산셀룰로오스, 셀로판 등의 셀룰로오스계 수지; 폴리메타크릴산메틸, 폴리메타크릴산에틸, 폴리아크릴산에틸, 폴리아크릴산부틸 등의 아크릴계 수지; 폴리스티렌, 폴리카보네이트, 폴리아릴레이트, 폴리이미드 등의 합성 수지 필름 또는 시트, 상질지, 글라신지 등의 종이, 유리 섬유, 천연 섬유, 합성 섬유 등으로부터 선택되는 단층체 또는 복층체를 들 수 있다. 또, 기재 시트로서 부직포나 폼기재 등을 이용하고, 양면 테이프 등의 용도에 사용하는 것도 가능하다.Examples of the substrate include metal foils such as aluminum, copper, and iron; polyester resins such as polyethylene naphthalate, polyethylene terephthalate, polybutylene terephthalate and polyethylene terephthalate / isophthalate copolymer; polyethylene, polypropylene, Polyolefin resins such as polymethylpentene; polyfluorinated ethylene resins such as polyvinyl fluoride, polyvinylidene fluoride, and polyfluoride; polyamides such as nylon 6 and nylon 66; polyvinyl chloride, polyvinyl chloride / vinyl acetate copolymer , Vinyl aggregates such as ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyvinyl alcohol, vinylon; cellulose resins such as cellulose triacetate and cellophane; methyl polymethacrylate, polyethyl methacrylate, polyacrylic acid Acrylic resins such as ethyl and butyl polyacrylate; polystyrene and polycarbonate And monolayers or multilayers selected from synthetic resin films or sheets such as polyarylate and polyimide, paper such as high-quality paper and glassine paper, glass fibers, natural fibers, synthetic fibers and the like. Moreover, it is also possible to use it for uses, such as a double-sided tape, using a nonwoven fabric, a foam base material, etc. as a base material sheet.

상기 기재의 두께는, 특별히 한정되지 않지만, 통상 500㎛ 이하, 바람직하게는 5∼300㎛, 더욱 바람직하게는 10∼200㎛이면 된다.Although the thickness of the said base material is not specifically limited, Usually, it is 500 micrometers or less, Preferably it is 5-300 micrometers, More preferably, it is 10-200 micrometers.

이형시트로서는, 예를 들면, 상기 지지기재로 예시한 각종 합성 수지 시트, 지, 포, 부직포 등에 이형 처리한 것을 사용할 수 있다.As a release sheet, the thing which carried out the mold release process to the various synthetic resin sheets, paper, cloth, nonwoven fabric etc. which were illustrated by the said support base material can be used, for example.

점착제 조성물의 도공 방법으로서는, 일반적인 도공 방법이면 특별히 한정되지 않고, 예를 들면, 롤 코팅, 다이코팅, 그라비아 코팅, 콤마 코팅, 스크린 인쇄 등의 방법을 들 수 있다.As a coating method of an adhesive composition, if it is a general coating method, it will not specifically limit, For example, methods, such as roll coating, die coating, gravure coating, comma coating, screen printing, are mentioned.

또, 활성 에너지선 조사 후에 기재상에 형성되는 상기 점착제층의 두께는, 용도에 따라 적당 설정되는 것이지만, 통상 5∼300㎛이며, 바람직하게는 10∼250㎛이다. 점착제층의 두께가 너무 얇으면, 첩착 물성이 안정되기 어려운 경향이 있고, 너무 두꺼우면 풀 자국을 일으키기 쉬워지는 경향이 있다.Moreover, although the thickness of the said adhesive layer formed on a base material after active energy ray irradiation is suitably set according to a use, it is 5-300 micrometers normally, Preferably it is 10-250 micrometers. If the thickness of the pressure-sensitive adhesive layer is too thin, the sticking property tends to be difficult to stabilize, and if it is too thick, there is a tendency to easily cause pull marks.

본 발명에 있어서의 점착 시트의 이용시에, 피착체의 종류로서 예를 들면, 각종 금속면을 갖는 물품; 폴리에틸렌나프테이트, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에틸렌테레프탈레이트/이소프탈레이트 공중합체 등의 폴리에스테르계 수지; 폴리에틸렌, 폴리프로필렌, 폴리메틸펜텐 등의 폴리올레핀계 수지; 폴리불화비닐, 폴리불화비닐리덴, 폴리불화에틸렌 등의 폴리불화에틸렌 수지;나일론 6, 나일론 66 등의 폴리아미드;폴리염화비닐, 폴리염화비닐/초산비닐 공중합체, 에틸렌-초산비닐 공중합체, 에틸렌-비닐 알코올 공중합체, 폴리비닐 알코올, 비닐론 등의 비닐 집합체; 3초산셀룰로오스, 셀로판 등의 셀룰로오스계 수지; 폴리메타크릴산메틸, 폴리메타크릴산에틸, 폴리아크릴산에틸, 폴리아크릴산 부틸 등의 아크릴계 수지; 폴리스티렌, 폴리카보네이트, 폴리아릴레이트, 폴리이미드 등의 합성 수지 필름, 시트 또는 판 등을 들 수 있다.At the time of use of the adhesive sheet in this invention, as a kind of to-be-adhered body, For example, the article which has a various metal surface; Polyester resins such as polyethylene naphate, polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer; polyolefin resins such as polyethylene, polypropylene, polymethylpentene; polyvinyl fluoride, polyvinyl fluoride Polyfluorinated ethylene resins such as lithium and polyfluoride; polyamides such as nylon 6 and nylon 66; polyvinyl chloride, polyvinyl chloride / vinyl acetate copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, poly Vinyl aggregates such as vinyl alcohol and vinylon; cellulose resins such as cellulose triacetate and cellophane; acrylic resins such as polymethyl methacrylate, polyethyl methacrylate, ethyl polyacrylate, and butyl polyacrylate; polystyrene, polycarbonate, and polya Synthetic resin film, sheet such as related, polyimide It may include a plate or the like.

상기 금속면을 갖는 물품으로서는, 금속면을 가지고 있고, 이 금속면에, 직접, 상기 점착 시트가 적어도 부분적으로 또는 전면적으로 붙여지고 있는 것이 있다. 이들 금속면을 갖는 물품에서, 상기 점착 시트가 붙여인 피착체 (「금속면 함유 피착체」라고 칭하기도 함)로서는, 적어도 부분적으로 금속면을 가지고 있으면 특별히 제한되지 않는다. 이들 금속면 함유 피착체에서, 금속면이 형성되고 있는 부위는, 상기 점착 시트를 직접 붙이는 것이 가능한 부위라면 특별히 제한되지 않고, 외측의 면이라도 좋고, 또, 안쪽 면 등이라도 된다. 또한, 1개의 금속면 함유 피착체에 금속면이 복수 형성되고 있는 경우, 이러한 복수의 금속면은 동일한 금속재료에 의해 형성된 면이라도 되고, 다른 금속재료에 의해 형성된 면이라도 된다.The article which has the said metal surface has a metal surface, and the said adhesive sheet may be stuck at least partly or whole surface directly to this metal surface. In the article which has these metal surfaces, as an adherend to which the said adhesive sheet sticks (it may be called a "metal surface containing adherend"), if it has a metal surface at least partially, it will not specifically limit. In these metal surface containing to-be-adhered bodies, the site | part in which the metal surface is formed is not specifically limited if it is a site | part which can directly stick the said adhesive sheet, The outer side may be sufficient, and an inner side etc. may be sufficient as it. In the case where a plurality of metal surfaces are formed on one metal surface-containing adherend, the plurality of metal surfaces may be surfaces formed of the same metal material or may be surfaces formed of different metal materials.

상기 금속면 함유 피착체에 있어서의 금속면은, 금속재료에 의해 형성된 금속면 함유 피착체의 표면이라도 되고, 또 각종 재료에 의해 형성된 기재(또는 구조체)의 표면에 형성된 금속층 표면(특히, 금속 박막층 표면)이라도 된다. 상기 금속면은 어쨌든 금속재료에 의한 표면이면 된다.The metal surface in the said metal surface containing adherend may be the surface of the metal surface containing adherend formed of the metal material, and the metal layer surface (especially a metal thin film layer) formed in the surface of the base material (or the structure) formed of various materials. Surface). The metal surface may be any surface made of a metal material anyway.

상기 금속 박막층 등의 금속층은, 각종 재료에 의해 구성된 기재 (또는 구조체)의 표면의 소정의 부위에 형성할 수 있다. 이들 금속층에서, 금속 박막층의 두께로서는, 금속면함유 피착체의 종류에 따라 적당 선택할 수 있고, 예를 들면, 0.1㎛ 이상이라도 된다. 또한, 금속 박막층의 두께의 상한으로서는, 일반적으로 박막층으로 간주되는 두께라면 특별히 제한되지 않는다.Metal layers, such as the said metal thin film layer, can be formed in the predetermined | prescribed site | part of the surface of the base material (or structure) comprised with various materials. In these metal layers, as a thickness of a metal thin film layer, it can select suitably according to the kind of metal surface containing adherend, for example, 0.1 micrometer or more may be sufficient. The upper limit of the thickness of the metal thin film layer is not particularly limited as long as the thickness is generally regarded as a thin film layer.

상기 금속면을 형성하기 위한 금속재료로서는, 예를 들면, 알루미늄, 은, 금, 동, 철, 티탄, 백금, 니켈 등의 금속 단체에 의한 금속재료; 금 합금 (예를 들면, 금-구리합금 등), 구리합금〔예를 들면, 동-아연 합금 (놋쇠), 동-알루미늄 합금 등〕, 알루미늄 합금 (예를 들면, 알루미늄-몰리브덴 합금, 알루미늄-탄탈 합금, 알루미늄-코발트 합금, 알루미늄-크롬 합금, 알루미늄-티탄 합금, 알루미늄-백금 합금 등), 니켈 합금 (예를 들면, 니켈-크롬 합금, 동-니켈 합금, 아연-니켈 합금 등), 주석 합금, 스텐레스 등의 각종 합금에 의한 금속재료 등을 들 수 있다. 이들 금속재료는 단독으로 또는 2종 이상 조합하여 사용할 수 있다.Examples of the metal material for forming the metal surface include metal materials such as aluminum, silver, gold, copper, iron, titanium, platinum, nickel, and the like, metal materials; gold alloys (for example, gold-copper alloys). Copper alloys (eg, copper-zinc alloys (brass), copper-aluminum alloys, etc.), aluminum alloys (eg, aluminum-molybdenum alloys, aluminum-tantalum alloys, aluminum-cobalt alloys, aluminum-chromium) Metal materials by various alloys such as alloys, aluminum-titanium alloys, aluminum-platinum alloys), nickel alloys (for example, nickel-chromium alloys, copper-nickel alloys, zinc-nickel alloys, etc.), tin alloys, and stainless steels. Etc. can be mentioned. These metal materials can be used individually or in combination of 2 or more types.

또한, 금속재료는, 금속 원소만을 함유하는 금속재료라도 되고, 금속 원소와 함께 비금속 원소를 함유하는 금속재료〔예를 들면, 금속의 산화물, 수산화물, 할로겐 화물 (염화물 등), 옥소산염 (질산염, 유산염, 인산염, 탄산염 등) 등의 금속계 화합물〕이라도 된다.The metal material may be a metal material containing only a metal element, or a metal material containing a non-metal element together with the metal element (for example, an oxide, a hydroxide, a halide (chloride, etc.) of a metal, an oxate (nitrate, Metal compounds such as lactates, phosphates, carbonates, and the like].

구체적으로는, 상기 금속면 함유 피착체로서는, 예를 들면, 적어도 부분적으로 금속면 (금속 박막층면 등)을 갖고 있는 창재 또는 이 창재를 구성하기 위한 부재나, 금속 박막층에 의해 형성된 전자파 쉴드층을 갖는 광학적 제품 또는 이 광학적 제품을 구성하기 위한 부재 등을 들 수 있다. 상기 전자파 쉴드층을 갖는 광학적 제품으로서는, 예를 들면, 전자 디스플레이 (플라스마 디스플레이 등) 등의 광학 기기나, 디지털 만능 디스크 등의 광학적으로 기록 가능한 디스크 (광학적 기록 디스크) 등을 들 수 있다.Specifically, as the metal surface-containing adherend, for example, a window member having at least a metal surface (metal thin film layer surface, etc.), a member for constituting the window member, or an electromagnetic shield layer formed of the metal thin film layer may be used. The optical product which has, or the member for composing this optical product, etc. are mentioned. As an optical product which has the said electromagnetic shield layer, optical instruments, such as an electronic display (plasma display etc.), and optically recordable discs (optical recording disc), such as a digital universal disk, etc. are mentioned, for example.

이하, 실시예를 통하여 본 발명을 한층 더 구체적으로 설명하지만, 본 발명은 그 요지를 넘지 않는 한 이하의 실시예로 한정되는 것은 아니다. 또한, 실시예 중, 「부」, 「%」는 중량 기준을 의미한다.Hereinafter, although an Example demonstrates this invention still more concretely, this invention is not limited to a following example, unless the summary is exceeded. In addition, "part" and "%" mean a basis of weight in an Example.

〔아크릴계 수지(A)의 제조〕 [Production of Acrylic Resin (A)]

교반기를 구비한 유리제의 바닥이 둥근 입구가 4개인 플라스크에 물 300부를 넣고, 분산 안정제로서 폴리비닐 알코올 0.7부를 용해하여, 교반 날개에 의해 300 rpm로 교반하면서, n-부틸아크릴레이트(a1) 87.8부, 아크릴로니트릴(a3) 7.2부, 2-히드록시 에틸 메타크릴레이트(a2) 5부로 이루어진 단량체 혼합물과 중합 개시제로서 N,N´-아조비스이소부티로니트릴 0.9부를 일괄 투입하여 현탁액을 제작하였다.300 parts of water was put into the four round bottom flask with a stirrer, 0.7 parts of polyvinyl alcohols were melt | dissolved as a dispersion stabilizer, n-butylacrylate (a1) 87.8, stirring at 300 rpm with a stirring blade. Part, a monomer mixture consisting of 7.2 parts of acrylonitrile (a3) and 5 parts of 2-hydroxyethyl methacrylate (a2) and 0.9 part of N, N'-azobisisobutyronitrile as a polymerization initiator were added in a batch to prepare a suspension. It was.

이 현탁액을, 계속 교반하여 반응계내를 68℃까지 온도상승시켜, 4시간 일정하게 유지하여 반응시켰다. 그 후, 실온 (약 25℃)까지 냉각하였다. 이어서, 반응물을 고액분리하여, 물로 충분히 세정한 후, 건조기를 이용하여 70℃에서 12시간 건조하여 괴상의 아크릴계 수지(A-1)를 얻었다. 얻어진 아크릴계 수지(A-1)의 중량 평균 분자량(Mw)은 130만, 분산도 (Mw/Mn)는 4.6, 유리 전이 온도는 -47℃였다.The suspension was continuously stirred to raise the temperature in the reaction system to 68 ° C, and was kept constant for 4 hours to react. Thereafter, it was cooled to room temperature (about 25 ° C). Subsequently, the reaction product was solid-liquid separated, and it fully wash | cleaned with water, and it dried at 70 degreeC for 12 hours using the dryer, and obtained the bulk acryl-type resin (A-1). The weight average molecular weight (Mw) of obtained acrylic resin (A-1) was 4.6, and dispersion degree (Mw / Mn) was 4.6 and glass transition temperature was -47 degreeC.

〔아크릴계 수지 (A-2)의 제조〕 [Production of Acrylic Resin (A-2)]

교반기를 구비한 유리제의 바닥이 둥근 입구가 4개인 플라스크 물 300부를 넣고, 분산 안정제로서 폴리비닐 알코올 0.7부를 용해하여 교반 날개에 의해 300 rpm로 교반하면서, n-부틸아크릴레이트(a1) 51부, 이소보닐아크릴레이트(a1) 44부, 2-히드록시에틸 메타크릴레이트(a2) 5부로 이루어진 단량체 혼합물과 중합 개시제로서 N,N´-아조비스이소부티로니트릴 0.9부를 일괄 투입하여 현탁액을 제작하였다.51 parts of n-butyl acrylates (a1) were put into 300 parts of flasks with four round mouths of glass-equipped glass with a stirrer, dissolving 0.7 parts of polyvinyl alcohols as a dispersion stabilizer, and stirring at 300 rpm with a stirring blade. A suspension was prepared by adding a monomer mixture consisting of 44 parts of isobornyl acrylate (a1) and 5 parts of 2-hydroxyethyl methacrylate (a2) and 0.9 part of N, N'-azobisisobutyronitrile as a polymerization initiator. .

이 현탁액을, 계속 교반하여 반응계내를 68℃까지 온도상승시켜, 4시간 일정하게 유지하여 반응시켰다. 그 후, 실온 (약 25℃)까지 냉각하였다. 이어서, 반응물을 고액분리하고, 물로 충분히 세정한 후, 건조기를 이용하여 70℃에서 12시간 건조하여 괴상의 아크릴계 수지(A-2)를 얻었다. 얻어진 아크릴계 수지(A-2)의 중량 평균 분자량(Mw)은 95만, 분산도 (Mw/Mn)는 3.5, 유리 전이 온도는 -5℃였다.The suspension was continuously stirred to raise the temperature in the reaction system to 68 ° C, and was kept constant for 4 hours to react. Thereafter, it was cooled to room temperature (about 25 ° C). Subsequently, the reaction product was solid-liquid separated, and after wash | cleaning enough with water, it dried at 70 degreeC for 12 hours using the dryer, and obtained the bulk acryl-type resin (A-2). The weight average molecular weight (Mw) of obtained acrylic resin (A-2) was 950,000, dispersion degree (Mw / Mn) was 3.5, and the glass transition temperature was -5 degreeC.

〔실시예 1〕 [Example 1]

아크릴계 수지(A)로서 아크릴계 수지(A-1) 12부, 단관능성 불포화 화합물(B)로서 4-히드록시부틸아크릴레이트(HBA: (B2)) 18부, 시클로헥실아크릴레이트 (CHA: (B1)) 20부, 2-에틸헥실아크릴레이트(2 EHA:(B3)) 50부, 다관능성 불포화 화합물(C)로서 트리메티롤프로판트리아크릴레이트 (TMPTA) 0.3부를 교반기가 붙은 용기에 넣어 24시간 교반혼합하여 용해하였다. 이 용액에, 광중합 개시제 (D)로서 2-히드록시-2-메틸-1-페닐-프로판-1-온(상품명:「다로큐아 1173」;치바·스페셜티·케미컬즈 (주)사 제조) (HMPP) 1부를 혼합함으로써 점착제 조성물을 얻었다.12 parts of acrylic resin (A-1) as acrylic resin (A), 18 parts of 4-hydroxybutyl acrylate (HBA: (B2)) as a monofunctional unsaturated compound (B), cyclohexyl acrylate (CHA: (B1 )) 20 parts, 2-ethylhexyl acrylate (2 EHA: (B3)) 50 parts, 0.3 parts of trimetholpropane triacrylate (TMPTA) as a polyfunctional unsaturated compound (C) in a container with a stirrer for 24 hours The mixture was stirred and dissolved. To this solution, 2-hydroxy-2-methyl-1-phenyl-propane-1-one (brand name: "Darocure 1173"; product of Chiba Specialty Chemicals, Inc.) as a photoinitiator (D) ( The pressure-sensitive adhesive composition was obtained by mixing 1 part of HMPP).

상기에서 얻어진 점착제 조성물을, 두께가 100㎛의 폴리에틸렌테레프탈레이트 (PET) 기재상에 130㎛의 두께가 되도록 도공하였다. 다시 이형처리된 PET기재를 이용하여 이형처리면이 상기 도공면에 접하도록 하여 도공면을 피막하였다. 그 후, 하기에 나타내는 자외선 조사 장치를 이용하여 조사 강도가 200㎽/㎠가 되도록 조정한 고압 수은 램프로 적산 광량이 2400 mJ/㎠가 되도록 자외선을 조사함으로써, 점착제 조성물이 경화시켜 얻어지는 점착제층을 갖는 점착 시트를 얻었다.The adhesive composition obtained above was coated on the 100-micrometer-thick polyethylene terephthalate (PET) base material so that it might be 130 micrometers in thickness. The release surface was coated with the release surface so that the release surface was in contact with the coating surface. Then, the pressure-sensitive adhesive layer obtained by curing the pressure-sensitive adhesive composition by irradiating ultraviolet rays so that the amount of accumulated light becomes 2400 mJ / cm 2 with a high-pressure mercury lamp adjusted to an irradiation intensity of 200 mW / cm 2 using an ultraviolet irradiation device shown below. An adhesive sheet having was obtained.

<자외선 조사 장치> <Ultraviolet rays irradiation device>

아이글란데이지 ECS-301 G1형 (아이그래픽스사)Igland Daisy ECS-301 G1 Type (I Graphics)

<조사 조건><Irradiation conditions>

80W/㎝ (고압 수은 램프)×18㎝ H, 조사 강도 200 ㎽/㎠80 W / cm (high pressure mercury lamp) × 18 cm H, irradiation intensity 200 mW / cm 2

〔실시예 2∼8〕 [Examples 2 to 8]

실시예 1에서, 4-히드록시부틸아크릴레이트 (HBA), 시클로헥실아크릴레이트 (CHA) 및 2-에틸헥실아크릴레이트 (2 EHA)의 배합 비율을 하기 표 1과 같이 변경한 것 이외는, 실시예 1과 동일하게 하여 점착제 조성물 및 점착 시트를 얻었다.In Example 1, except that the compounding ratio of 4-hydroxybutyl acrylate (HBA), cyclohexyl acrylate (CHA) and 2-ethylhexyl acrylate (2 EHA) was changed as shown in Table 1 below In the same manner as in Example 1, an adhesive composition and an adhesive sheet were obtained.

〔실시예 9〕 EXAMPLE 9

실시예 1에서, 아크릴계 수지(A-1) 대신에 아크릴계 수지(A-2)를 이용하고, 그 외 성분의 배합 비율을 하기 표 2와 같이 변경한 것 이외는, 실시예 1과 동일하게 하여 점착제 조성물 및 점착 시트를 얻었다.In Example 1, except using acrylic resin (A-1) instead of acrylic resin (A-1), and changing the compounding ratio of the other components like Table 2 below, it carried out similarly to Example 1 An adhesive composition and an adhesive sheet were obtained.

〔비교예 1∼3〕 [Comparative Examples 1 to 3]

실시예 1에서, 4-히드록시 부틸 아크릴레이트 (HBA), 시클로헥실아크릴레이트 (CHA) 및 2-에틸 헥실 아크릴레이트 (2 EHA)의 배합 비율을 하기 표와 같이 변경한 것 이외는, 실시예 1과 동일하게 하여 점착제 조성물 및 점착 시트를 얻었다.In Example 1, except for changing the compounding ratio of 4-hydroxy butyl acrylate (HBA), cyclohexyl acrylate (CHA) and 2-ethyl hexyl acrylate (2 EHA) as shown in the following table In the same manner as in 1, an adhesive composition and an adhesive sheet were obtained.

실시예 1에서, 점착제 조성물의 조성을 아크릴계 수지 (A-1) 14.6부, 2-에틸 헥실아크릴레이트 (2 EHA) 39.4부, 부틸 아크릴레이트 (BA) 39.4부, 아크릴산 (AAc) 6.6부, 트리메티롤프로판트리아크릴레이트 (TMPTA) 0.3부, 2-히드록시-2-메틸-1-페닐-프로판-1-온 (상품명:「다로큐아 1173」;치바·스페셜티·케미컬즈 (주) 제조HMPP) 1부로 한 것 이외는, 실시예 1과 동일하게 하여 점착제 조성물 및 점착 시트를 얻었다.In Example 1, the composition of the pressure-sensitive adhesive composition was 14.6 parts of acrylic resin (A-1), 39.4 parts of 2-ethylhexyl acrylate (2 EHA), 39.4 parts of butyl acrylate (BA), 6.6 parts of acrylic acid (AAc), trimes 0.3 part of tyrol propane triacrylate (TMPTA), 2-hydroxy-2-methyl-1- phenyl- propane- 1-one (brand name: "Tarocure 1173", Chiba Specialty Chemicals Co., Ltd. product HMPP) Except having made it 1 part, it carried out similarly to Example 1, and obtained the adhesive composition and the adhesive sheet.

상기 실시예 및 비교예에서 이용한 점착제 조성물에 대해서, 상기 각 성분 재료의 배합 비율을 하기의 표 1에 나타낸다.About the adhesive composition used by the said Example and the comparative example, the compounding ratio of each said component material is shown in following Table 1.

상기 실시예 및 비교예에서 얻어진 점착 시트에 대해서, 하기 방법에 의해, 점착제층의 겔분율, 점착력, 유지력 (응집력), 내부식성을 측정·평가하고, 그 결과를 함께 하기의 표 2에 나타낸다.About the adhesive sheet obtained by the said Example and the comparative example, the gel fraction, adhesive force, holding force (cohesion force), and corrosion resistance of an adhesive layer were measured and evaluated by the following method, and the result is shown in following Table 2 together.

<겔분율> <Gel fraction>

얻어진 점착 시트를 50 ㎜×50 ㎜로 절단 한 후, 이 점착 시트의 점착제층측을, 60×100㎜의 SUS 메쉬 시트 (200 메쉬)의 긴 방향의 중앙부를 피해 메쉬 시트에 붙여 맞춘 후, 메쉬 시트를 중앙부에서 접어 점착 시트를 감싸 시험편을 제작하였다. 그 시험편을, 톨루엔 180g이 들어간 밀봉 용기중에, 23℃×24시간 침지하여, 메쉬 시트 중에 잔존한 불용해의 점착제 성분의 중량%를 겔분율로 한다. 이때, 기재의 중량은 빼둔다.After cutting the obtained adhesive sheet to 50 mm x 50 mm, after sticking the adhesive layer side of this adhesive sheet to the mesh sheet avoiding the center part of the longitudinal direction of the 60 * 100 mm SUS mesh sheet (200 mesh), a mesh sheet The test piece was produced by wrapping the adhesive sheet at the center part. The test piece is immersed in 23 degreeC x 24 hours in the sealed container which contained 180 g of toluene, and makes the gel fraction the weight% of the insoluble adhesive component which remained in the mesh sheet. At this time, the weight of the base material is omitted.

<점착력> <Adhesion>

JISZ-0273에 준하여 점착력을 측정하였다.Adhesive force was measured according to JISZ-0273.

즉, 얻어진 점착 시트를 25㎜×100㎜로 절단 한 후, 이것을, 피착체로서의 스텐레스판 (SUS304BA판)에, 23℃, 상대습도 50%의 분위기하에서 2㎏ 고무룰러를 이용하여 2회 왕복시키는 것으로 압착하여 시험편을 제작했다. 이 시험편을, 동분위기하에서, 30분 방치한 후, 박리 속도 0.3m/분에 의해, 180도 박리 시험을 실시하여 점착력 (N/25 ㎜)을 측정하였다.That is, after cutting the obtained adhesive sheet into 25 mm x 100 mm, it is made to reciprocate twice to the stainless plate (SUS304BA board) as a to-be-adhered body using 2 kg rubber ruler in the atmosphere of 23 degreeC, and 50% of relative humidity. The test piece was produced by crimping | bonding. After leaving this test piece for 30 minutes in the same atmosphere, 180 degree peeling test was done by the peeling rate 0.3m / min, and adhesive force (N / 25mm) was measured.

(평가 기준) (Evaluation standard)

○···10N/25㎜ 이상○ ... 10N / 25mm or more

×···10N/25㎜ 미만× 10 ... less than 10N / 25mm

<유지력 (응집력)> <Holding force (cohesion force)>

얻어진 점착 시트를 JIS Z-0273에 준하여 SUS 304를 피착체로 하여, 첨부 면적 25㎜×25㎜로 붙인 후, 80℃에서 20분간 방치한 것에 대해서 1kg의 하중을 걸어 측정하여 평가하였다.In accordance with JIS Z-0273, SUS 304 was used as the adherend, and the resultant was pasted with an attached area of 25 mm x 25 mm, and then subjected to a load of 1 kg and measured for evaluation after leaving at 80 ° C for 20 minutes.

(평가 기준) (Evaluation standard)

○···24시간 방치 후에도 낙하하지 않았다.It did not fall even after being left for 24 hours.

△···24시간 방치 후의 엇갈림이 1㎜ 이내△ · · gap after 24 hours left within 1 mm

×···24시간 방치 후의 엇갈림이 1㎜ 이상 또는 낙하The gap after leaving for 24 hours is 1 mm or more or falls

<내부식성> <Corrosion Resistance>

얻어진 점착 시트를 동박 (두께:130㎛)에 맞댄 후 60℃×90% RH의 분위기하에 250시간 보존하였다. 그 후, 육안으로, 폴리에틸렌테레프탈레이트제 필름측에서부터 동박의 표면을 관찰하고, 점착 시트가 붙일 수 있는 동박의 표면의 부식의 유무를 확인하였다.After obtaining the obtained adhesive sheet to copper foil (thickness: 130 micrometers), it preserve | saved for 250 hours in 60 degreeC x 90% RH atmosphere. Then, the surface of the copper foil was observed visually from the film side made of polyethylene terephthalate, and the presence or absence of the corrosion of the surface of the copper foil which an adhesive sheet can stick was confirmed.

(평가 기준) (Evaluation standard)

○···부식 없음○ ... no corrosion

×···부식 있음× ...

Figure pct00003
Figure pct00003

* ·CHA: 시클로헥실아크릴레이트* CHA: cyclohexyl acrylate

4HBA: 4-히드록시부틸아크릴레이트4HBA: 4-hydroxybutyl acrylate

2EHA: 2-에틸헥실아크릴레이트2EHA: 2-ethylhexyl acrylate

BA: 부틸아크릴레이트BA: butyl acrylate

AAc: 아크릴산AAc: Acrylic acid

TMPTA: 트리메티롤프로판트리아크릴레이트TMPTA: trimethylolpropane triacrylate

HMPP: 2-히드록시-2-메틸-1-페닐-프로판-1-온HMPP: 2-hydroxy-2-methyl-1-phenyl-propan-1-one

·표 중(A)∼ (D)의 숫자는 중량부를, 「-」는 배합하지 않는 것을 의미한다.-The number of (A)-(D) in a table means that a weight part does not mix | blend.

Figure pct00004
Figure pct00004

·표 중 N. C는 Non Creep를 나타낸다.In the table, N. C represents Non Creep.

지환식 구조 함유 에틸렌성 불포화 화합물과 수산기 함유 에틸렌성 불포화 화합물의 양쪽 모두를 함유하는 점착제 조성물로 이루어진 실시예 1∼9의 점착제는, 점착력과 응집력 (유지력)에 균형있게 뛰어난 것이며, 또, 산을 포함하지 않기 때문에 내부식성에도 뛰어난 것을 알 수 있다.The pressure-sensitive adhesives of Examples 1 to 9, which consist of pressure-sensitive adhesive compositions containing both an alicyclic structure-containing ethylenically unsaturated compound and a hydroxyl group-containing ethylenically unsaturated compound, are excellent in adhesion and cohesion (holding force) in balance. Since it does not contain, it turns out that it is excellent also in corrosion resistance.

한편, 지환식 구조 함유 에틸렌성 불포화 화합물과 수산기 함유 에틸렌성 불포화 화합물의 양쪽 모두를 함유하지 않는 비교예 1의 점착제는 점착력과 응집력 (유지력)의 양쪽 모두에 뒤떨어지는 것이며, 지환식 구조 함유 에틸렌성 불포화 화합물을 함유하지 않는 비교예 2의 점착제는 점착력이 떨어지고 수산기 함유 에틸렌성 불포화 화합물을 함유하지 않는 비교예 3의 점착제는 응집력 (유지력)에 뒤떨어지는 것이었다. 또, 산성기를 갖는 아크릴산이 배합된 점착제 조성물로 이루어진 비교예 4의 점착제는, 점착력과 응집력 (유지력)에는 뛰어나지만, 내부식성이 떨어지는 것이었다.On the other hand, the pressure-sensitive adhesive of Comparative Example 1 which does not contain both of the alicyclic structure-containing ethylenically unsaturated compound and the hydroxyl group-containing ethylenically unsaturated compound is inferior to both the adhesive force and the cohesive force (holding force), and the alicyclic structure-containing ethylenic compound. The pressure-sensitive adhesive of Comparative Example 2 which does not contain an unsaturated compound was inferior in adhesive force, and the pressure-sensitive adhesive of Comparative Example 3 which did not contain a hydroxyl group-containing ethylenically unsaturated compound was inferior to cohesive force (holding force). Moreover, although the adhesive of Comparative Example 4 which consists of an adhesive composition which mix | blended acrylic acid which has an acidic group was excellent in adhesive force and cohesion force (holding force), it was inferior to corrosion resistance.

또, 실시예 9의 점착 시트에 대해서, 아래와 같은 방법에 의해 투명성 (헤이즈)을 측정하였다. 그 결과를 표 3에 나타낸다.Moreover, about the adhesive sheet of Example 9, transparency (haze) was measured by the following method. The results are shown in Table 3.

<헤이즈><Hayes>

·헤이즈 측정용 샘플의 제조Preparation of sample for haze measurement

얻어진 점착 시트를 3㎝×4㎝에 잘라내어, 박리 이형시트를 박리하고, 점착제층측을 무알칼리 유리판 (코닝사 제조, 이글 XG)에 압압한 후, 오토클레이브 (autoclave) (50℃, 0.5MPa×20 min) 처리하여 헤이즈 측정용 샘플을 얻었다.The obtained pressure-sensitive adhesive sheet was cut out to 3 cm x 4 cm, the release mold release sheet was peeled off, and the pressure-sensitive adhesive layer side was pressed on an alkali-free glass plate (manufactured by Corning, Eagle XG), followed by an autoclave (50 ° C, 0.5 MPa x 20). min) was treated to obtain a sample for haze measurement.

·헤이즈치의 측정Haze value measurement

상기 헤이즈 측정용 샘플의 헤이즈를 하기 각 조건으로 측정하였다.·The haze of the said sample for haze measurement was measured on each of the following conditions.

초기 헤이즈:헤이즈 측정용 샘플 작성 후에 측정.Initial haze: We measure after sample making for haze measurement.

·습열 헤이즈 1:헤이즈 측정용 샘플 작성 후, 60℃×90% RH 조건하에서 100시간 정치 후에 측정.-Moist heat haze 1: After making sample for haze measurement, it measures after standing for 100 hours on 60 degreeC x 90% RH conditions.

·습열 헤이즈 2:헤이즈 측정용 샘플 작성 후, 60℃×90% RH 조건하에서 100시간 정치 후, 다시 실온에서 3시간 정치 후에 측정.-Moist heat haze 2: After making a sample for haze measurement, after standing still for 100 hours on 60 degreeC x 90% RH conditions, it measures after standing still for 3 hours at room temperature.

헤이즈는, 확산 투과율 및 전광선 투과율을, HAZE MATER NDH2000 (니혼덴쇼쿠고교사 제조)를 이용하여 측정하였다. 또한, 본 기기는 JIS K7361-1에 준거하고 있다. Haze measured the diffusivity and total light transmittance using HAZE MATER NDH2000 (made by Nihon Denshoku Kogyo Co., Ltd.). In addition, this apparatus is based on JISK7361-1.

얻어진 확산 투과율과 전광선 투과율의 값을 하기 식에 대입하여 헤이즈를 산출하였다. 헤이즈 값 (%)= (확산 투과율/전광선 투과율)×100 The haze was computed by substituting the obtained diffuse transmittance and the total light transmittance into the following formula. Haze value (%) = (diffusion transmittance / total light transmittance) x 100

Figure pct00005
Figure pct00005

* ( )의 값은 초기 헤이즈로부터의 변화율* The value of () is the rate of change from the initial haze

지환식 구조 함유 (메타)아크릴산 에스테르계 모노머를 공중합하여 얻어진 아크릴계 수지 (A-2)를 이용한 점착제 조성물로 이루어진 실시예 9의 점착제는, 습열 조건하에서도 헤이즈의 변화가 적고, 내습 열성에도 뛰어난 것을 알 수 있다.The adhesive of Example 9 which consists of an adhesive composition using the acrylic resin (A-2) obtained by copolymerizing an alicyclic structure containing (meth) acrylic acid ester monomer, has little change of a haze even in wet heat conditions, and is excellent also in moisture heat resistance. Able to know.

본 발명을 상세하게 또 특정의 실시형태를 참조해 설명했지만, 본 발명의 정신과 범위를 일탈하지 않고 여러 가지 변경이나 수정을 더할 수 있는 것은 당업자에게 있어서 분명하다. Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various changes and correction can be added without deviating from the mind and range of this invention.

본 출원은, 2010년 12월 6 일출원의 일본 특허 출원 (특원 2010­271653)에 근거하는 것이며, 그 내용은 여기에 참조로서 기재되었다.This application is based on the JP Patent application (Japanese Patent Application No. 2010 # 271653) of December 6, 2010, The content was described here as a reference.

(산업상의 이용 가능성) (Industrial availability)

본 발명의 점착제 조성물로 이루어진 점착제는, 강고한 접착력과 뛰어난 응집력을 갖기 위해서 고온 환경하에서도 기재로부터가 박리가 생기기 어렵고, 특히 광학 부재 붙임용 점착제, 점착 시트로서 유용하고, 또한 점착제 중에 산을 사용하지 않아도 점착 물성을 만족시킬 수 있기 때문에, 금속이나 금속 산화물 등에 대해서 내부식성이 요구되는 전자 디스플레이 등의 광학 기기나, 디지털 만능 디스크 등의 광학적 기록 디스크 (광학적 기록 매체)를 붙이기 위한 광학용 점착 시트로서 유용하다.In order to have a strong adhesive force and the outstanding cohesion force, the adhesive which consists of an adhesive composition of this invention is hard to produce peeling from a base material even in a high temperature environment, It is especially useful as an adhesive for adhesives and an adhesive sheet for an optical member, and an acid is used in an adhesive. The adhesive sheet for optics for attaching optical devices such as an electronic display requiring corrosion resistance to metals and metal oxides, or optical recording discs (optical recording media) such as digital universal discs, because adhesive properties can be satisfied without Useful as

Claims (8)

아크릴계 수지(A), 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B), 에틸렌성 불포화기를 2개 이상 갖는 에틸렌성 불포화 화합물(C), 및 광중합 개시제 (D)를 함유하는 점착제 조성물이며, 에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B)로서 지환식 구조 함유 에틸렌성 불포화 화합물(B1), 및 수산기 함유 에틸렌성 불포화 화합물(B2)을 함유하는 것을 특징으로 하는 점착제 조성물.It is an adhesive composition containing acrylic resin (A), the ethylenically unsaturated compound (B) which has one ethylenically unsaturated group, the ethylenically unsaturated compound (C) which has two or more ethylenically unsaturated groups, and a photoinitiator (D), The pressure-sensitive adhesive composition containing an alicyclic structure-containing ethylenically unsaturated compound (B1) and a hydroxyl group-containing ethylenically unsaturated compound (B2) as an ethylenically unsaturated compound (B) having one ethylenically unsaturated group. 청구항 1에 있어서,
아크릴계 수지(A)는 현탁중합에 의해 얻어진 드라이 레진인 것을 특징으로 하는 점착제 조성물.
The method according to claim 1,
Acrylic resin (A) is a dry resin obtained by suspension polymerization.
청구항 1 또는 2에 있어서,
아크릴계 수지(A)는 지환식 구조 함유 (메타)아크릴산 에스테르계 모노머를 함유하는 공중합 성분을 공중합시켜서 이루어진 아크릴계 수지인 것을 특징으로 하는 점착제 조성물.
The method according to claim 1 or 2,
Acrylic resin (A) is an adhesive resin characterized by copolymerizing the copolymerization component containing an alicyclic structure containing (meth) acrylic acid ester monomer.
청구항 1 내지 3 중 어느 한 항에 있어서
에틸렌성 불포화기를 1개 갖는 에틸렌성 불포화 화합물(B) 중에 있어서의 지환식 구조 함유 에틸렌성 불포화 화합물(B1) 및 수산기 함유 에틸렌성 불포화 화합물(B2)의 합계량의 함유 비율은 10∼70 중량%인 것을 특징으로 하는 점착체 조성물.
The method according to any one of claims 1 to 3
The content rate of the total amount of an alicyclic structure containing ethylenically unsaturated compound (B1) and hydroxyl-containing ethylenically unsaturated compound (B2) in the ethylenically unsaturated compound (B) which has one ethylenically unsaturated group is 10-70 weight% Adhesive composition, characterized in that.
청구항 1 내지 4 중 어느 한 항에 있어서,
실질적으로 산을 포함하지 않는 것을 특징으로 하는 점착제 조성물.
5. The method according to any one of claims 1 to 4,
Pressure-sensitive adhesive composition, characterized in that substantially no acid.
청구항 1 내지 5 중 어느 한 항에 있어서,
용제를 함유하지 않는 것을 특징으로 하는 점착제 조성물.
6. The method according to any one of claims 1 to 5,
It does not contain a solvent, The adhesive composition characterized by the above-mentioned.
청구항 1 내지 6 중 어느 한 항에 기재된 점착제 조성물이, 활성 에너지선 조사에 의해 경화되어 이루어진 것을 특징으로 하는 점착제.The pressure-sensitive adhesive composition according to any one of claims 1 to 6 is cured by active energy ray irradiation. 기재와 청구항 7에 기재된 점착제로 이루어진 점착제층을 함유하는 것을 특징으로 하는 점착 시트.Description and claim The adhesive sheet containing the adhesive layer which consists of adhesives.
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