KR20130117468A - Insole with shock reduction structure and method for manufacturing the same - Google Patents

Insole with shock reduction structure and method for manufacturing the same Download PDF

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Publication number
KR20130117468A
KR20130117468A KR1020120040079A KR20120040079A KR20130117468A KR 20130117468 A KR20130117468 A KR 20130117468A KR 1020120040079 A KR1020120040079 A KR 1020120040079A KR 20120040079 A KR20120040079 A KR 20120040079A KR 20130117468 A KR20130117468 A KR 20130117468A
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South Korea
Prior art keywords
insole
opening
thin film
shoe
cover
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KR1020120040079A
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Korean (ko)
Inventor
정현희
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정현희
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Priority to KR1020120040079A priority Critical patent/KR20130117468A/en
Publication of KR20130117468A publication Critical patent/KR20130117468A/en

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    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B17/00—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
    • A43B17/003—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined characterised by the material
    • A43B17/006—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined characterised by the material multilayered
    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B17/00—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
    • A43B17/02—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined wedge-like or resilient
    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B17/00—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
    • A43B17/14—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined made of sponge, rubber, or plastic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D35/00—Producing footwear
    • B29D35/12—Producing parts thereof, e.g. soles, heels, uppers, by a moulding technique

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)

Abstract

According to the present invention, the cushioning effect for absorbing the impact of walking or driving while being mounted in a shoe is remarkably shaped, and the structure is simplified, and the shoe insole of the cushioning structure has good adaptability to changes in various designs and dimensions of the shoe. And to a method of manufacturing the same.
According to a preferred embodiment, the shoe insole of the buffer structure is formed in the insole cover material forming the shoe insole in a predetermined position requiring a cushioning function, and the elastic and tensile thin film material to the cover to cover the opening at the joint portion Bonding, by obtaining a insole pad having a buffer portion corresponding to the area of the opening by foaming the resin liquid on one side of the insole cover material covered by the thin film film material.
Advantageously, the thin film material to be bonded to cover the opening of the insole cover material is a polyurethane resin, EVA (Ethylene-Vinyl Acetate), rubber material, for example, when the hot melt method is bonded by the foaming pressure of the resin liquid In order to prevent overflow, a taping process is performed to close the sewing gap.

Description

INSOLE WITH SHOCK REDUCTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a shoe insole of a buffer structure and a method of manufacturing the same, and more particularly, the shock absorbing effect for absorbing a shock received during walking or driving while being placed in a shoe is remarkably shaped and simplified in structure. The present invention relates to a shoe sole of a cushioning structure having good adaptability to a variety of design and dimensions changes and a method of manufacturing the same.

In general, a shoe insole is placed in the shoe to provide comfort when ignited, and such a shoe insole has a function to alleviate the impact repeatedly applied to the waist in case of severe ankle or knee joint during walking or driving. This is an additionally considered situation.

According to one example of such a shoe insole, an insole pad made of a resin (typically a polyurethane resin) is formed on one side (bottom) of an insole cover material such as leather, textile, or paper.

1 and 2 is a view referred to explain a shoe insole according to a conventional example, the shoe insole 10 is insole cover material (10A) and the insole cover material 10A by leather or fiber fabric or feeder It consists of a resin pad 10B which is formed in the bottom surface.

Typically, the shoe insole 100 is seated so that the bottom surface of the insole cover material (10A) in a well-known manufacturing shoe insole lower mold (not shown) and the resin liquid (typically polyurethane resin liquid) After supplying, the upper mold is tightly bonded to the lower mold and heated to a predetermined temperature (that is, the foaming temperature of the polyurethane resin), thereby forming the resin liquid by foam bonding to the bottom surface of the insole cover material 10A.

According to another method, the shoe insole is formed by adhering the insole pad formed of, for example, polyurethane resin to the bottom of the insole cover material such as leather or textiles with a conventional adhesive.

However, in the above case, when an adhesive is used to bond the insole pad 10B to the bottom of the insole cover material 10A, the adhesive is between the insole cover material 10A and the insole pad 10B. Since the hardening of the insole pad (10B) itself has some degree of cushioning function, as the adhesive is cured, the entire insole of the shoe becomes hard, so that the buffering function is poor.

3 is a view for explaining the structure of the shoe insole of the buffer function according to another conventional example.

According to the detached state shown in the drawing, the shoe insole according to another conventional example has a recess in the rear of the first insole member 20 (that is, the rear gingival portion of the foot) by hard EVA (Ethylene-Vinyl Acetate). (Or recessed portion) 22 is formed, the groove (or recess) 22, the shock absorbing member 30 is seated and the adhesion by the adhesive portion 32 defined on the outer peripheral end of the shock absorbing member 30 It is made, the sticker 34 is printed on a predetermined pattern (or logo, etc.) of various colors on the shock absorbing member 30, the hard first insole member to which the shock absorbing member 30 is bonded On the 20, the mounting groove 42 of the second insole member 40 made of transparent or translucent soft EVA material is bonded by an adhesive.

In the shoe insole of the above structure, the impact absorbing member 30 is attached to the groove (or recess) 22 of the first insole member 20 by a hard EVA material. The second insole member 40 by soft EVA must be adhered to the first insole member 20 after attaching the sticker 34 to the shock absorbing member 30. As the structural complexity increases, the overall workmanship is increased, and the first and second insole members 20 and 40 are bonded by an adhesive even if the second insole member 40 is formed of a soft EVA material. The effect is worse.

4 is a view showing a shoe insole according to another conventional example.

Referring to the drawings, the shoe insole 50 is made of a front portion 50a and a rear portion 50b having substantially the same thickness, the bonding is made at the junction 50c, the front portion 50a is shock absorbing It is formed of an EVA resin and the rear portion 50b is formed of a carbon material so that the bearing force is good and elastically flowable.

In addition, recesses 54a and 54b are formed on the rear surface (that is, the bottom surface) of the front portion 50a and the rear portion 50b of the shoe insole 50, and the recessed portion of the front portion 50a is formed. The cushion member 56 made of silicon material is bonded to the 54a) by an adhesive, and the cushion member 58 made of silicon is attached to the recessed part 54b of the rear part 50b by the adhesive.

A plurality of through holes 56a and 58a are formed in the cushion members 56 and 58, and a plurality of protrusions 56b and 58b are formed, and the corresponding protrusions 56b and 58b correspond to each other. Shoe insole 50 is held upright at regular intervals (ie, the height of the protrusions) from the sole (or outsole; not shown) to allow the flow of air between the shoe insole 50 and the sole (or sole). This possible space is provided.

In addition, the bottom of the front portion (50a) of the shoe insole 50 is formed with a plurality of vent holes 60 through which air enters, one side of the shoe insole 50, the shoe insole 50 And a plurality of guide protrusions 62 for air in and out between the sole and the sole (or the sole).

Therefore, in the case of the shoe insole 50, the shock received from the ground during walking or driving due to the flow of air can be mitigated, but the front part 50a and the rear part 50b of different materials. In addition, since the concave portions 54a and 54b are formed on the bottoms of the front portion 50a and the rear portion 50b and the cushion members 56 and 58 must be adhered to each other, the overall structure is not only complicated. Airborne is also increased and disadvantageous.

Moreover, in the case of the shoe insole shown in Figs. 1 to 3, although the shock absorbing structure is applied, the shoe insole has to be manufactured separately according to the size of the shoe, which is quite disadvantageous in terms of adaptability to the size of the shoe.

Accordingly, the present invention has been made in view of the above-described circumstances of the prior art, and has not only good adaptability to the dimensions of the shoes, but also various patterns can be marked and the shoe insole for ensuring a significantly improved cushioning effect by a simple structure and The purpose is to provide a method of manufacturing the same.

In order to achieve the above object, according to a preferred embodiment of the present invention, in the shoe insole having a cushioning function for mounting the inside of the shoe and absorbing the shock during walking and running, the opening in a predetermined position where the cushioning function is required The insole cover material is formed, and the elastic and tensile thin film material bonded to cover the opening at one side of the opening of the insole cover material, and formed on one side of the insole cover material covered with the thin film film There is provided a shoe insole of a cushioning structure consisting of an insole pad having a cushioning portion formed corresponding to an area of an opening.

According to the present invention, the thin film material includes a polyurethane resin, EVA (Ethylene-Vinyl Acetate), a rubber material.

The insole pad is formed integrally with the insole cover material by supplying and foaming a resin solution to one side of the insole cover material, and the buffer part is controlled by the elasticity and tensile property of the thin film film to be integrally formed with the insole pad. do.

According to another embodiment of the present invention for achieving the above object, in the method of manufacturing a shoe insole having a cushioning function for mounting the inside of the shoe and absorbs the shock during walking and running, forming the shoe insole Forming an opening at a predetermined position requiring a cushioning function in the insole cover material, and bonding an elastic and tensile thin film film material at a bonding portion to cover the opening, wherein the opening is covered by the thin film film material. Provided is a method for manufacturing a shoe insole having a buffer structure in which a resin solution is foamed on one side of an insole cover material to form an insole pad having a buffer portion corresponding to an area of the opening.

According to the present invention, the thin film material bonded to cover the opening of the insole cover material is selected from polyurethane resin, EVA (Ethylene-Vinyl Acetate), rubber material, the thin film material is any one of hot melt method and sewing method It is bonded to cover the opening, and when the thin film material is bonded to cover the opening by a sewing method, sewing is performed on the side on which the resin solution is foamed to prevent overflow due to the foaming pressure of the resin solution. A taping step is further included to prevent the gap.

The buffer part is integrally formed on the insole pad at a height controlled by the elasticity and tensile property of the thin film material in the region of the opening part.

According to the shoe insole and the manufacturing method of the buffer structure according to the present invention, by covering the opening of the insole cover material with a thin film material of high elasticity and high tension to foam the resin liquid to the buffer portion corresponding to the opening area Since the insole pads are integrally formed, they are structurally simpler than the conventional ones, thereby reducing workmanship and manufacturing costs, and the cushioning portion is not limited by the insole cover material, and the cushioning inherent cushioning function is maximized. It is guaranteed that the buffering effect is remarkably improved compared to the conventional one.

In addition, in the case of the shoe insole according to the present invention, it is only necessary to change the dimensions of the insole cover material and the shape of the opening formed in the insole cover material, so that the adaptability to various designs and dimensions of the shoe (or shoe insole) is good. Done.

In addition, the buffer portion formed in the opening region of the insole cover material by the resin foam for the formation of the insole pad, it is possible to control the height by adjusting the elasticity and tensile force of the thin film film material.

1 and 2 is a view referred to explain a shoe insole according to a conventional example.
3 is a view for explaining the structure of the shoe insole of the buffer function according to another conventional example.
4 is a view showing a shoe insole according to another conventional example.
5 is an exploded view referred to for explaining a shoe insole according to a preferred embodiment of the present invention.
6 is a view for explaining the manufacturing process of the shoe insole according to the preferred embodiment of the present invention shown in FIG.
7 is a view showing a modification of the shoe insole according to the invention shown in FIG.
8 is a view showing another modified example of the shoe insole shown in FIG.
9 is a view showing another modified example of the shoe insole shown in FIG.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail with reference to an accompanying drawing.

Figure 5 is an exploded view referred to explain the shoe insole according to a preferred embodiment of the present invention.

Referring to the drawings, the shoe insole 10 according to the present invention is an opening ((口 部) of a predetermined shape in the rear portion of the insole cover material 100 (for example, the squeegee portion of the foot) by the fiber fabric, leather or paper, etc. 102 is formed, and on one side (for example, the bottom side) of the opening 102, a high elastic and high tensile thin film material (ie, a complete layer cover thin film) 104 is bonded at the bonding portion 106. do.

Here, the thin film film 104 is preferably formed of a foamed polyurethane resin or latex or rubber material having high elasticity and high tension, in the present invention is not necessarily limited to the above examples as long as the material having high elasticity and high tensile property. Is applicable without

In addition, in the bonding portion 106, the thin film member 104 is covered by the hot melt adhesive method, the sewing method (sewing) method or other suitable method (for example, a general adhesive method, etc.) to cover the opening 102. It is bonded to one surface (for example, bottom surface) of the cover material 100.

According to the present invention, the insole pad 108 is formed on the bottom surface of the insole cover material 100 by, for example, a polyurethane resin or EVA (Ethylene-Vinyl Acetate) resin, and the insole pad 108 is the insole cover. In the case where the bottom surface of the ash 100 is integrally formed by foaming or adhered by an adhesive, the buffer 110 is integrally formed at a height controlled by the thin film film 104 at a portion corresponding to the opening 102. Is formed.

If necessary, the thin film member 104 may be formed to be transparent or translucent, and the thin film member 104 may be printed with a predetermined pattern or character including, for example, a specific design or a brand name.

Therefore, in the case of the shoe insole 10 of the present invention, the buffer unit 110 of the insole pad 108 corresponding to the portion of the opening 102 of the insole cover material 100 is only the thin film material. Since it is only covered by 104, the cushioning function of the insole pad 108 is not limited at all by the insole cover material 100, thereby improving the cushioning effect.

In particular, when the insole pad 108 is formed in the opening 102 region of the insole cover material 100 by foaming, the height of the buffer unit 110 is increased by adjusting the elasticity and the tensile force of the opening 102. Can be controlled appropriately.

6 is a view for explaining the manufacturing process of the shoe insole according to the preferred embodiment of the present invention shown in FIG.

First, the opening 102 is formed by opening a predetermined position (for example, a back squeegee portion of the foot) that requires a cushioning function in the insole cover material 100 such as a fiber material or a leather material (see FIG. 6A). .

Then, a thin film film 104 of high elasticity and high tensile strength is bonded to the bottom surface of the opening 102 of the insole cover material 100 so as to cover the opening 102. ) Is bonded by the hot melt method or sewing method in the coupling portion 106.

Here, when the thin film material 104 is bonded to the bottom of the opening 102 by a sewing method, a so-called 'overflow' phenomenon in which the resin is extruded to the outside during the resin foaming process described later through a sewing gap. In order to prevent this from happening, an adhesive tape (not shown) is attached onto the joint portion 106 (see (b) and (c) of FIG. 6).

Thereafter, the insole cover material 100 to which the thin film film 104 is adhered to the opening 102 is placed on a lower mold of a mold apparatus (not shown in FIG. The insole pad 108 is formed on one side of the insole cover material 100 when the liquid is supplied, for example, a polyurethane resin, and the bottom mold and the upper mold are locked and heated.

In this case, during the foam molding of the insole pad 108, the thin film material 104 is inflated within a range limited to its elasticity and tensile property by the foaming pressure of the resin liquid, and integrally with the insole pad 108. A buffer unit 110 is formed (see FIGS. 5 and 6 (D)).

Therefore, in the case of the shoe insole 10, the insole pad (in the state of bonding the high elastic and high tensile thin film film 104 to the portion of the opening 102 opened to the insole cover material 100 ( When the resin solution is foamed to form 108, the buffer part 110 controlled by the elasticity and tensile property of the thin film material 104 is integrally formed, thereby being limited by the insole cover material 100. Since the cushioning unit 110 has a unique cushioning function assured to the maximum, it provides a remarkably improved buffering effect compared to the prior art.

And, in the case of the conventional shoe insole with a shock absorbing function has a limitation in the adaptability to the design change of the shoe insole because it has to be manufactured separately according to the shoe size due to the complex structural characteristics, but of the shoe insole according to the present invention In the case of the shoe (or shoe insole) because it is only necessary to form the insole pad having the buffer by changing the dimensions of the insole cover member 100 and the shape of the opening 102 formed in the insole cover member 100 Adaptability to various design and dimensional changes is good.

In addition, the opening 102 is formed in the insole cover member 100, and the opening 102 is covered with the high elastic and high tensile thin film film 104 to form the insole pad 108. Since the part 110 is formed, it is structurally simpler than the conventional one, and thus the labor and manufacturing cost are reduced.

7 is a view showing a modified example of the shoe insole shown in FIG. 5, in the present modified example, an opening is formed at the rear of the insole cover material 100 and the opening is joined by the thin film film 104. In addition to bonding at the front and back (ie, the front of the foot of the foot), the openings are formed and bonded at the bonding portion 122 by the thin film material 120 to form a buffer at the front and rear of the shoe insole 10. .

In addition, Figure 8 is a view showing another modified example of the shoe insole shown in Figure 5, in the above embodiment the shape of the opening and the thin film film material for the formation of the buffer portion is elliptical, in this example the opening and the thin film The shape of the ash is formed into a polygon, and accordingly, the shape of the buffer portion formed in the opening is also determined to be a polygon.

FIG. 9 is a view showing another modified example of the shoe insole shown in FIG. 5. In the present modified example, the opening is divided into a plurality of regions, and the thin film film materials 104a, 104b, 104c corresponding to each opening are different. In the peripheral junction 106 is joined by hot melt, sewing, or other suitable method (such as bonding with a general adhesive).

That is, referring to FIGS. 8 and 9, in the case of the shoe insole according to the present invention, it becomes clear that the variety and shape of the shock absorbing part 110 formed in the insole cover material 100 are secured. .

Meanwhile, the present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the technical gist and gist of the invention.

For example, while the insole pad 108 formed on the bottom surface of the insole cover member 100 is formed by resin foaming, the buffer unit 110 is integrally formed, but the insole cover member 100 is formed on the insole cover member 100. The separate insole pads 108 formed with the buffer unit 110 may be bonded in an adhesive manner.

In addition, the insole pad 108 is not limited to the structure bonded to the bottom surface of the insole cover material 100, but may be bonded to the upper surface of the insole cover material 100.

In addition, the shape and height of the shock absorbing portion 110 can be controlled by changing the elasticity and tensile properties of the thin film film 104 covering the opening 102 of the insole cover material 100.

In addition, while the present invention has been described with respect to the case where the present invention is applied to the production of shoe insoles, the same or similar application is also possible when the manufacturing to give a cushioning function to the sole.

10: shoe insole, 100: insole cover material,
102: opening, 104: thin film material,
106: junction, 108: insole pad,
110: buffer part.

Claims (6)

In the shoe insole mounted on the inside of the shoe and having a cushioning function to absorb the shock during walking and running,
An insole cover member having an opening formed at a predetermined position requiring the cushioning function;
An elastic and tensile thin film material bonded to cover the opening at one side of the opening of the insole cover material, and
The insole of the buffer structure, characterized in that the insole pad formed on one side of the insole cover material and formed with a buffer pad corresponding to the area of the opening covered by the thin film material. The shoe insole of claim 1, wherein the thin film material includes a polyurethane resin, EVA (Ethylene-Vinyl Acetate), and a rubber material. According to claim 1, wherein the insole pad is formed integrally with the insole cover material by supplying and foaming the resin liquid on one side of the insole cover material, and the buffer portion is controlled by the elasticity and tensile properties of the thin film film Shoe insole of a buffer structure, characterized in that formed integrally with the insole pad. In the method of manufacturing a shoe insole mounted on the inside of the shoe and having a cushioning function for absorbing the shock during walking and running,
Forming an opening in a predetermined position requiring a cushioning function in the insole cover material forming the shoe insole;
Bonding the elastic and tensile thin film material at the bonding portion to cover the opening;
And a foam pad having a buffer part corresponding to a region of the opening by foaming a resin liquid on one side of the insole cover material covered by the thin film film. The method of claim 4, wherein the thin film material bonded to cover the opening of the insole cover material is selected from polyurethane resin, EVA (Ethylene-Vinyl Acetate), rubber material,
The thin film material is bonded to cover the opening in any one of a hot melt method and a sewing method,
When the thin film material is bonded to cover the opening by a sewing method, a taping step for preventing a sewing gap on the side on which the resin solution is foamed to prevent overflow due to the foaming pressure of the resin solution is further performed. Shoe insole manufacturing method of the buffer structure characterized in that it comprises. 5. The method of claim 4, wherein the buffer unit is integrally formed on the insole pad at a height controlled by the elasticity and tensile property of the thin film material in the opening portion.
KR1020120040079A 2012-04-18 2012-04-18 Insole with shock reduction structure and method for manufacturing the same KR20130117468A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102080639B1 (en) 2019-06-04 2020-02-24 박장원 Manufacturing method of shock absorbing device intergrated in product
WO2020246831A3 (en) * 2019-06-04 2021-01-28 박장원 Method for manufacturing shock-absorbing device embedded in product through integrated structure
KR102263902B1 (en) 2020-02-17 2021-06-10 박장원 Manufacturing method of shock absorbing device intergrated in product
KR102300542B1 (en) * 2020-06-15 2021-09-08 김동화 Silicon shoes pad
KR102400152B1 (en) 2021-02-25 2022-05-18 박장원 Manufacturing method of product with inner shock absorbing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102080639B1 (en) 2019-06-04 2020-02-24 박장원 Manufacturing method of shock absorbing device intergrated in product
WO2020246831A3 (en) * 2019-06-04 2021-01-28 박장원 Method for manufacturing shock-absorbing device embedded in product through integrated structure
KR102263902B1 (en) 2020-02-17 2021-06-10 박장원 Manufacturing method of shock absorbing device intergrated in product
KR102300542B1 (en) * 2020-06-15 2021-09-08 김동화 Silicon shoes pad
KR102400152B1 (en) 2021-02-25 2022-05-18 박장원 Manufacturing method of product with inner shock absorbing device

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