KR20130107703A - Electrode wire for solar cell module and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An electrode wire for a solar cell module and a method for manufacturing the same are provided to improve the efficiency of power production by increasing the amount of sunlight entering a cell. CONSTITUTION: A solder plating layer (136) is formed on at least one part of the surface of a conductor. The ratio of the width of the conductor to the thickness is 1:1 to 5:1. The thickness of the conductor is 0.2 mm or more. The width of the conductor is 1 mm or less. The thickness of the solder plating layer depends on the width.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electrode wire for a solar cell module,

The present invention relates to an electrode wire for a solar cell module and a manufacturing method thereof.

Recently, there has been a rapid increase in demand for electricity. In addition to the way electricity is produced by conventional fossil fuels such as coal and oil, electricity production methods utilizing renewable energy such as photovoltaic, bio, wind, geothermal, . Among these, the development of a solar cell module which converts solar energy into electric energy is actively developed. The photovoltaic power generation system using the solar cell module has no mechanical or chemical action in the process of converting solar energy into electric energy, so the structure of the system is simple and maintenance is almost not required. In addition, once installed, the photovoltaic system has a long life span, is safe, and is environmentally friendly.

The solar cell module has a cell in which sunlight is incident, and when receiving sunlight, it generates electricity using the characteristics of a cell that generates electricity by a photoelectric effect. However, in recent years, a lot of studies have been actively conducted to improve the efficiency of producing electricity of the solar cell module. For example, studies have been actively conducted to lower the reflectance of sunlight incident on a cell, or to increase the incidence of sunlight incident on the cell even when the cell has the same size.

An object of the present invention is to provide a solar cell module capable of increasing the incident rate of sunlight incident on the cell even when the same size cell is provided in the solar cell module.

Another object of the present invention is to provide a solar cell module capable of increasing the incidence rate of solar light and significantly reducing the defective ratio in assembling the solar cell module. In particular, it is an object of the present invention to provide a solar cell module capable of significantly reducing a defective junction when a cell and an electrode wire are bonded.

According to an aspect of the present invention, there is provided an electrode wire for a solar cell module, which comprises a conductor and a solder plating layer provided on at least a part of the surface of the conductor, wherein a ratio of a width and a thickness of the conductor is 1: 5: 1. ≪ / RTI >

Here, the conductor may have a thickness of 0.2 mm or more in cross section, and the width of the cross section may be 1 mm or less.

Meanwhile, the thickness (mu m) of the solder plating layer applied to the upper and lower surfaces of the conductor may be determined according to the length of the width. Specifically, the thickness (탆) of the solder plating layer plated on the upper and lower surfaces of the conductor may be determined according to ((-0.002 * width) + 25) to ((-0.002 * width) + 30).

Furthermore, the thickness of the solder plating layer applied to both sides of the conductor may be set to be thinner than the thickness of the solder plating layer applied to the top and bottom surfaces. For example, the thickness of the solder plated layer applied to both sides of the conductor may be between 1 μm and 15 μm. Preferably, the solder plating layer is not plated on both sides of the conductor.

According to another aspect of the present invention, there is provided a method of manufacturing an electrode wire for a solar cell module, comprising: applying a flux to at least a portion of a conductor; applying a solder plating layer to a region to which the solvent is applied; And removing the solder plated layer in the region where the solvent is not applied. [0013] The present invention also provides a method of manufacturing an electrode wire for a solar cell module.

Here, in the step of applying the solvent, the solvent is applied to the upper and lower surfaces of the conductor. In addition, the step of removing the solder plated layer may remove the solder plated layer applied to both sides of the conductor, and the step of removing the solder plated layer may be performed a plurality of times.

On the other hand, the thickness of the solder plating layer remaining on both sides of the conductor from which the solder plating layer is removed may be thinner than the thickness of the solder plating layer applied to the upper and lower surfaces. In this case, the thickness of the solder plating layer remaining on both side surfaces of the conductor may be 1 탆 to 15 탆. Furthermore, the solder plated layer may not remain on both sides of the conductor.

On the other hand, the conductor may have a ratio of the width to the thickness of the conductor of 1: 1 to 5: 1, and the conductor may have a thickness of 0.2 mm or more, or a width of 1 mm or less.

The thickness (占 퐉) of the solder plated layer applied to the upper and lower surfaces of the conductor may be determined according to the length of the width, ). ≪ / RTI >

The solar cell module having the above-described configuration can increase the incident rate of sunlight incident on the cell even when the cell has the same size, thereby improving the electric production efficiency compared with the conventional solar cell module. Further, when adjusting the ratio of the width and the thickness of the electrode wire included in the cell, the thickness of the solder plating layer provided on the upper and lower surfaces of the electrode wire is determined according to the width, have. Also, when the thickness of the solder plated layer provided on both side surfaces of the electrode wire is reduced to a predetermined thickness or less, or when the electrode wires are bonded by preventing the solder plating layer from being applied to both sides of the electrode wire, the defective connection ratio can be lowered.

1 is a schematic view showing an operation principle of a solar cell module,
2 is an exploded perspective view of a solar cell module according to an embodiment,
3 illustrates a cell according to one embodiment,
Figure 4 illustrates a cell according to another embodiment,
5 is a graph showing the defective junction ratio according to the width of the electrode wire,
6 is a flowchart showing a method of manufacturing an electrode wire according to an embodiment,
7 and 8 are schematic views showing a solvent application device,
9 is a schematic view showing a solder plating apparatus and
10 is a graph showing the incidence rate according to the width of the electrode wire.

Hereinafter, an electrode wire for a solar cell module according to various embodiments of the present invention and a manufacturing method thereof will be described with reference to the drawings. First, an electrode wire for a solar cell module will be described, followed by a manufacturing method thereof.

FIG. 1 is a schematic view schematically illustrating a process in which a solar cell module receives sunlight to generate electricity. 1 is a side sectional view of a solar cell.

Referring to FIG. 1, a solar cell is defined as a cell that generates electricity by photoelectric effect when it receives sunlight. As shown in FIG. 1, when the N layer 3 and the P layer 5 are joined to each other, and solar light is incident on the cell 32 formed by the PN junction, a pair of holes is formed. At this time, the electrons move to the N layer 3 and the holes move to the P layer 5 by the electric field generated at the PN junction. Therefore, an electromotive force is generated between the P layer 5 and the N layer 3, and a current flows when the load is connected to the electrodes at both ends. A reference numeral '1', which is not described in the drawings, corresponds to an antireflection film that prevents sunlight from being reflected. The electrode wire 34 for the solar cell module is provided at an upper portion of the cell 32 to serve as an electrode electrically connected to the N layer 3.

FIG. 2 is a perspective view of an embodiment of a solar cell module 100 operated in accordance with the above-described principle.

2, the solar cell module 100 includes a reinforcing glass 10, a filler material (EVA) 20, a cell unit 30, a filler material 20, A back sheet 50, and the components are enclosed by a frame 22. As shown in FIG. The above-described configuration of the solar cell module 100 may include additional components or omit other components with the cell unit 30 as a basic configuration.

The tempered glass 10 is provided with a surface treatment for lowering light reflection loss while having high light transmittance. In addition, it is preferable that it has a sufficient wind-resistance performance to withstand a wind speed of at least a predetermined speed so as to withstand a relatively strong wind, and it is manufactured according to safety glass standards so that it can be safely broken into several pieces even if breakage occurs. This tempered glass 10 may be made of, for example, low iron tempered glass.

On the other hand, the filler (EVA) 20 serves to protect the cell unit 30 which is relatively durable. For this purpose, it is provided on the front and back sides of the cell unit 30. Specifically, the front filler 20 is inserted between the tempered glass 10 and the cell unit 30, and the rear filler 20 is inserted between the cell unit 30 and the back sheet 50.

The back sheet 50 is provided on the rear surface of the solar cell module 100 to prevent contamination of moisture or the like penetrating from the back surface and to protect the solar cell module 100 from the external environment.

The solar cell unit 30 serves to generate electricity by receiving sunlight as described above. 3B is a cross-sectional view of the electrode wire 34 (hereinafter, referred to as 'electrode wire') for the solar cell module. FIG. 3A is a front view of the cell unit 30 according to the embodiment, to be.

3 (a) and 3 (b), the cell unit 30 includes a cell 32 made of a silicon wafer and an electrode wire 34 provided on one side of the cell 32.

The cell 32 is provided with a predetermined size, and serves to generate electricity by receiving sunlight as described above. The description of the structure of the cell 32 is the same as the above description, and a repetitive description thereof will be omitted.

On the other hand, an electrode wire 34 is provided on one side of the cell 32, specifically, on the side where sunlight is incident. The electrode wire 34 is provided across the cell 32 at predetermined intervals and functions as an electrode electrically connected to the cell 32 as described above. Therefore, the electrode wire 34 is made of a conductor such as copper which is relatively excellent in electric conductivity and low in price. This electrode wire 34 is attached to the cell 32 by soldering. Specifically, the electrode wire 34 is coated with a solder plating layer 36 on the surface of a conductor such as copper, and the electrode wire 34 and the cell 32 are joined together by the solder plating layer 36 by applying a predetermined heat. The solder plated layer may comprise, for example, tin (Sn) or a tin alloy as a main component.

The efficiency of the solar cell module 100 having the above-described structure can be determined by the incident rate of sunlight incident on the cell unit 30. [ That is, when the cells 32 having the same size are provided, the efficiency of producing electricity increases when a relatively large amount of sunlight is incident. For this purpose, it is important to increase the amount of sunlight incident on the cell 32. To this end, it is necessary to reduce the amount of sunlight reflected on the front surface of the cell 32, or to reduce the area of the electrode wire 34 covering the cell 32.

The electrode wire 34 shown in Fig. 3 (b) has a relatively larger width than the thickness, and the area of covering the cell 32 is relatively large as compared with the embodiment described later. For example, the standard (thickness: width, unit: mm) of the electrode wire 34 is 0.1: 1.0, 0.1: 1.5, 0.1: 2.0, 0.15: 1.3, 0.15: 1.5, 0.15: 2.0, And so on. Therefore, the ratio of the width and the thickness of the electrode wire 34 in the above standard has a ratio of 10: 1, 15: 1, 20: 1, 8.7: 1, 10: 1, 13: 1, 16.7: 1 . As a result, it can be seen that the electrode wire 34 according to FIG. 3 has a ratio of about 8.7: 1 or more when viewed from the ratio of the width to the thickness, and the width is relatively significantly larger than the thickness. If the width is significantly larger than the thickness, the length of the light shields the solar light incident on the cell 32, thereby decreasing the incidence of sunlight. Thereby reducing the efficiency of producing electricity in the solar cell module. Accordingly, the structure of the electrode wire capable of improving the incidence of sunlight incident on the cell 32 and the manufacturing method thereof will be described below.

4 is a view showing an electrode wire according to another embodiment. 4 (a) is a front view of a cell unit 130 having an electrode wire 134 according to the present embodiment, and Fig. 4 (b) is a sectional view of an electrode wire 134. Fig.

4A and 4B, the electrode wire 134 according to the present embodiment reduces the length of the conductor width in comparison with the above-described embodiment in order to reduce the area covering the cell 132, As shown in FIG. Therefore, when the cell unit 130 is viewed from the front, it can be seen that the area covering the cell 132 is reduced compared with the above-described embodiment.

Specifically, when examining the cross-sectional area of the conductor of the electrode wire 134, the ratio of the width to the thickness is set to be 5: 1 to 1: 1. That is, the length of the width is still longer than the length of the thickness, but it is understood that the thickness is relatively increased in comparison with the above-described embodiment. The electrode wire 134 may have a thickness of about 0.2 mm or more and the electrode wire 134 may have a width of about 1.0 mm or less.

On the other hand, when the width and the thickness ratio are set to be 5: 1 to 1: 1 as in this embodiment, the amount of the solder plating layer applied to the upper surface and the lower surface of the electrode wire is relatively reduced as compared with the electrode wire of the above- . The solder plated layer serves to bond the electrode wire 134 to the cell 132, so that it is preferable that an appropriate amount is applied.

For example, when the thickness of the solder plated layer is relatively small (when the amount of the solder plated layer is relatively small), when the electrode wires 134 are soldered, they are bonded in spot welding instead of surface welding, do. On the other hand, if the thickness of the solder plated layer is relatively too large (the amount of the solder plated layer is relatively large), a problem arises that the applied amount becomes too large. Therefore, in this embodiment, the thickness of the solder plated layer applied to the upper and lower surfaces of the electrode wire 134 is determined by calculating the following formula (1).

[Equation 1]

Thickness of solder plated layer (占 퐉) = ((-0.002 * width) + 25) - ((-0.002 * width) + 30)

As shown in Equation (1), the thickness of the solder plating layer applied to the upper and lower surfaces of the electrode wire 134 in this embodiment may be determined according to the width. For example, in the case where the width is 1 mm, the thickness of the solder plated layer applied to the upper and lower surfaces of the electrode wire 134 can be determined in a range of a minimum of 23 mu m to a maximum of 28 mu m. As a result, an appropriate amount of the solder plating layer can be formed by the above-mentioned formula (1).

On the other hand, the electrode wire 134 according to the present embodiment has a relatively large thickness as compared with the above-described embodiment. Therefore, the amount of the solder plated layer applied to both side surfaces of the electrode wire becomes relatively larger as compared with the above-described embodiment. When the amount of the solder plated layer applied to both sides of the electrode wire 134 increases, solder located on the top and bottom surfaces of the electrode wire is liquefied when the soldering process is performed, As shown in FIG. Therefore, when the electrode wire 134 is bonded to the cell 132, an appropriate amount of solder is reduced on the lower surface thereof, so that the bonding strength with the cell 132 can not be maintained and bonding failure can be caused. Table 1 below shows the defective connection ratio according to the amount of the solder plated layer applied to the side of the electrode wire 134, and FIG. 5 shows the following Table 1 as a graph.

Side Solder Plating Layer Thickness (㎛) Defect ratio of bonding (%) One 3.1 5 3.1 10 3.2 12 3.2 14 4.1 15 6.7 20 7.2 25 7.5

Referring to Table 1 and FIG. 5, when the thickness (탆) of the solder plated layer on both sides of the electrode wire 134 is 15 탆 or more, it is seen that the defective junction rate increases to 6.7% or more. That is, if the thickness (μm) of the solder plated layer on both side surfaces of the electrode wire 134 is reduced to 15 μm or less, the defective connection ratio can be lowered to 6.7% or less. Therefore, in this embodiment, the thickness of the solder plated layer applied to both side surfaces of the electrode wire 134 is determined to be 1 μm to 15 μm, preferably, the solder plated layer is not plated on both sides of the electrode wire 134. On the other hand, if the thickness (m) of the solder plated layer on both sides of the electrode wire 134 is reduced to 15 m or less, the thickness becomes smaller than the thickness of the solder plated layer applied on the upper and lower surfaces of the electrode wire 134.

Hereinafter, a method of manufacturing an electrode wire having the above-described structure will be described.

6 is a flowchart showing a method of manufacturing an electrode wire having the above-described configuration.

Referring to FIG. 6, a method of manufacturing an electrode wire according to an exemplary embodiment includes applying a flux to at least a portion of a conductor (S510), applying a solder plating layer to a region to which the solvent is applied (S530) And removing the solder plated layer of the region where the solvent is not applied (S550).

First, a flux is applied to at least a part of the surface of a conductor such as copper constituting the electrode wire. The solvent removes impurities and the like on the surface of the conductor, thereby allowing the solder plating layer to be more smoothly applied.

On the other hand, when the ratio of the width to the thickness of the electrode wire is determined to be 5: 1 or less as described above, the thickness of the solder plating layer applied to both side surfaces of the electrode wire is reduced to 15 탆 or less, It is preferable that the plating layer is not coated. To this end, when the above-mentioned solvent is applied, the solvent is applied only to the upper and lower surfaces of the conductor, and both sides thereof are not coated with the solvent. That is, when the solvent is applied, the solder plating layer is coated more smoothly in the subsequent process, so that no solvent is applied to both sides of the electrode wire. Hereinafter, an apparatus for applying a solvent to the upper and lower surfaces of the electrode wire will be described.

Fig. 7 shows a solvent application device 200 according to an embodiment capable of applying solvent to the upper and lower surfaces of the electrode wire. 7 (a) is a front view showing a schematic configuration of the solvent application device 200, and Fig. 7 (b) is a right side view of Fig. 7 (a).

7, the solvent application device 200 is configured to allow the electrode wire 134 to pass therethrough and has solvent application units 210 and 220 on its upper and lower portions along the path through which the electrode wire 134 moves . That is, the electrode wire 134 moves along the arrow A through the space between the upper application unit 210 and the lower application unit 220. In this case, the upper surface and the lower surface of the electrode wire 134 move while contacting the upper coating unit 210 and the lower coating unit 220. Therefore, the solvent is applied to the upper and lower surfaces of the electrode pole wire 134 by the upper coating unit 210 and the lower coating unit 220.

Fig. 8 shows a solvent application device 300 according to another embodiment in which solvent can be applied to the upper and lower surfaces of the electrode wire.

The solvent application device 300 according to the present embodiment is configured to allow the electrode wire 134 to pass therethrough and has solvent spray units 310 and 320 at upper and lower portions along the path of the electrode wire 134. That is, the electrode wire 134 passes through the space between the upper injection unit 310 and the lower injection unit 320 by a predetermined distance from the upper injection unit 310 and the lower injection unit 320, . In this case, the solvent sprayed from the upper spray unit 310 and the lower spray unit 220 is applied to the upper and lower surfaces of the electrode wire 134.

A solvent is applied to the upper and lower surfaces of the electrode wire 134, and then a solder plating layer is applied to the electrode wire 134. The solder plated layer is mainly applied to the region where the solvent of the electrode wire 134 is applied. That is, on the upper and lower surfaces of the electrode wire 134. However, a region where the solvent is not applied, that is, the side of the electrode wire 134, may also be coated with a solder plating layer. It is preferable to remove the solder plated layer applied to both sides of the electrode wire. Therefore, a solder plating layer is applied to the area where the solvent of the electrode wire 134 is applied (the top and bottom surfaces of the electrode wire), and then the solder plating layer of the area of the electrode wire 134 . Fig. 9 shows a solder plating apparatus 400 capable of applying the electrode wire 134 by a solder plated layer and removing the solder plated layer applied to a region where it is not necessary.

9 (a) is a front view showing a schematic configuration of the solder plating apparatus 400, FIG. 9 (b) is a side view seen from a direction C in FIG. 9 (a) Fig.

9A and 9B, the solder plating apparatus 400 includes a water tank 410 having a predetermined size, and a liquid solder 411 is disposed in the water tank 410. [ Respectively. Further, it is provided with a roller 420 for moving the electrode wire 134 along the arrow B. Therefore, the electrode wire 134 moves in the direction of the arrow by the driving of the roller 420, and the solder plating layer is applied while moving in the solder 411 inside the water tub 410. In this case, the apparatus further includes a plating removal device 430 for removing solder plating layers on predetermined areas, that is, both side surfaces of the electrode wire 134 drawn out from the solder 411 of the water tray 410.

Referring to FIG. 9 (c), the plating removal device 430 is disposed on both sides in a pair when the electrode wires 134 are drawn out from the water tank. That is, the electrode wire 134 moves along the space between the pair of plating removal devices 430, and both side surfaces of the electrode wire 134 move in contact with the plating removal device 430. 9 (c), the solder plating layer 136 is applied on the upper and lower surfaces of the electrode wire 134, and both side surfaces of the electrode wire 134 are connected to the plating removal device 430 The solder plated layer is removed.

The plating removal device 430 according to FIG. 9 removes the solder plated layer applied to both sides of the electrode wire 134 by a mechanical device. Therefore, when the solder plated layer is removed by a mechanical device, the solder plated layer may remain on both sides of the electrode wire 134 finely. However, the thickness of the remaining solder plating layer is in the range of about 1 占 퐉 to 15 占 퐉, which does not significantly increase the defective junction. Therefore, the electrode wires fabricated by the above method are provided so that the thickness of the solder plating layer remaining on both sides of the conductor is thinner than the thickness of the solder plating layer applied to the upper and lower surfaces. Further, if the plurality of plating removal devices 430 are provided, it is possible to remove all the solder plating layers applied to both side surfaces of the electrode wires. Therefore, the step of removing the solder plating layer remaining on both side surfaces of the electrode wire can be performed a plurality of times, thereby preventing the solder plating layer from remaining on both sides of the electrode wire.

Meanwhile, the electrode wire manufactured by the present manufacturing method may have a ratio of the width and the thickness of the cross section of the conductor, as described above, from 1: 1 to 5: 1. Further, the conductor of the electrode wire may have a thickness of 0.2 mm or more in cross section, and the width of the cross section may be 1 mm or less. In addition, the thickness (占 퐉) of the solder plated layer applied to the upper and lower surfaces of the electrode wire as described above can be determined according to the length of the width. In this case, the thickness of the solder plating layer can be adjusted by controlling the amounts of the solvent applied to the upper and lower surfaces of the electrode wire. As a result, the thickness of the solder plated layer applied to the upper and lower surfaces of the electrode wire is determined according to ((-0.002 * width) + 25) to ((-0.002 * width) + 30).

10 is a graph showing the incidence (%) of sunlight incident on a cell according to the width of an electrode wire provided in the cell in the solar cell module. In the graph of Fig. 10, the horizontal axis shows the width (mm) of the electrode wire, and the vertical axis shows the incidence (%) of sunlight incident on the cell.

Referring to FIG. 10, it can be seen that as the width of the electrode wire decreases, the incident rate of sunlight incident on the cell increases. Particularly, when the width of the electrode wire is reduced to 2 mm or less like the electrode wire according to the present embodiment, The incident rate of light is improved to about 100% or more. As a result, if the ratio of the width of the electrode wire to the thickness of the electrode wire is maintained at 5: 1 to 1: 1, or if the width of the electrode wire is kept at 2 mm or less, The incident rate of sunlight increases and the efficiency of producing electricity increases.

10 ... tempered glass 20 ... filler
30 ... cell units 32, 132 ... cell
34, 134 ... electrode wires 36, 136 ... solder plated layer
50 ... back sheet 100 ... solar cell module
200, 300 ... Solvent application device 400 ... Solder plating device

Claims (20)

An electrode wire for a solar cell module,
Conductor; And
And a solder plating layer provided on at least a part of the surface of the conductor,
Wherein a ratio of a width and a thickness of a cross section of the conductor is 1: 1 to 5: 1. The method according to claim 1,
Wherein the conductor has a cross-sectional thickness of 0.2 mm or more. The method according to claim 1,
Wherein the conductor has a width of 1 mm or less in cross section. The method according to claim 1,
Wherein the thickness (mu m) of the solder plating layer applied to the upper and lower surfaces of the conductor is determined according to the length of the width. 5. The method of claim 4,
The thickness (占 퐉) of the solder plated layer plated on the upper and lower surfaces of the conductor is determined according to ((-0.002 * width) + 25) to ((-0.002 * width) + 30) Electrode wire. The method according to claim 1,
Wherein a thickness of the solder plating layer applied to both sides of the conductor is thinner than a thickness of the solder plating layer applied to the upper surface and the lower surface. The method according to claim 6,
Wherein the thickness of the solder plating layer applied to both side surfaces of the conductor is 1 占 퐉 to 15 占 퐉. The method according to claim 1,
Wherein the solder plated layer is not plated on both sides of the conductor. A method of manufacturing an electrode wire for a solar cell module,
Applying a flux to at least a portion of the conductor;
Applying a solder plated layer to the region where the solvent is applied; And
And removing the solder plated layer of the region where the solvent is not applied. 10. The method of claim 9,
Wherein the step of applying the solvent comprises applying solvent to the upper and lower surfaces of the conductor. 11. The method of claim 10,
Wherein the step of removing the solder plated layer removes the solder plated layer applied to both sides of the conductor. 12. The method of claim 11,
Wherein the step of removing the solder plating layer is performed a plurality of times. 11. The method of claim 10,
Wherein a thickness of the solder plating layer remaining on both sides of the conductor from which the solder plating layer is removed is thinner than a thickness of the solder plating layer applied to the top and bottom surfaces. 11. The method of claim 10,
Wherein a thickness of the solder plating layer remaining on both side surfaces of the conductor is in the range of 1 占 퐉 to 15 占 퐉. 11. The method of claim 10,
Wherein the solder plated layer does not remain on both sides of the conductor. 10. The method of claim 9,
Wherein the conductor has a width and a thickness ratio of 1: 1 to 5: 1 in a cross section thereof. 17. The method of claim 16,
Wherein the conductor has a cross-sectional thickness of 0.2 mm or more. 17. The method of claim 16,
Wherein the conductor has a width of 1 mm or less in cross section. 17. The method of claim 16,
Wherein the thickness (占 퐉) of the solder plated layer applied to the upper and lower surfaces of the conductor is determined according to the length of the width. 17. The method of claim 16,
The thickness (占 퐉) of the solder plated layer plated on the upper and lower surfaces of the conductor is determined according to ((-0.002 * width) + 25) to ((-0.002 * width) + 30) A method of manufacturing an electrode wire.

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