KR20130084803A - Led package for lamp with lens - Google Patents

Led package for lamp with lens Download PDF

Info

Publication number
KR20130084803A
KR20130084803A KR1020120005655A KR20120005655A KR20130084803A KR 20130084803 A KR20130084803 A KR 20130084803A KR 1020120005655 A KR1020120005655 A KR 1020120005655A KR 20120005655 A KR20120005655 A KR 20120005655A KR 20130084803 A KR20130084803 A KR 20130084803A
Authority
KR
South Korea
Prior art keywords
led chip
led
led package
lens
optical lens
Prior art date
Application number
KR1020120005655A
Other languages
Korean (ko)
Other versions
KR101337502B1 (en
Inventor
주재영
김재필
김완호
송상빈
조보현
강영래
Original Assignee
한국광기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국광기술원 filed Critical 한국광기술원
Priority to KR1020120005655A priority Critical patent/KR101337502B1/en
Publication of KR20130084803A publication Critical patent/KR20130084803A/en
Application granted granted Critical
Publication of KR101337502B1 publication Critical patent/KR101337502B1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE: A light emitting diode (LED) package for a lens integrated type lamp is provided to form luminescence of even illumination by forming light with an arbitrary light distribution angle. CONSTITUTION: An LED chip (120) is connected to a printed circuit board (110). Light is emitted from the LED chip. An optical lens part (130) is molded to a spherical surface. The optical lens part is molded with an encapsulating material.

Description

렌즈 일체형 조명용 ＬＥＤ 패키지{LED PACKAGE FOR LAMP WITH LENS}LED package for integrated lens lighting {LED PACKAGE FOR LAMP WITH LENS}

본 발명은 렌즈 일체형 조명용 LED 패키지에 관한 발명으로서, 더욱 상세하게는 LED 칩을 보호하고, 상기 LED 칩으로부터 발광되는 빛이 임의의 배광각을 형성하며 균일한 조도로 발광될 수 있도록 광학 렌즈가 일체로 형성된 렌즈 일체형 조명용 LED 패키지에 관한 것이다.
The present invention relates to a lens-integrated illumination LED package, and more particularly, to protect the LED chip, the optical lens is integrated so that the light emitted from the LED chip forms an arbitrary light distribution angle and can be emitted at a uniform illuminance It relates to a lens-integrated illumination LED package formed by.

일반적으로 LED 패키지는 개개의 LED 소자가 제조된 후에 패키징 과정을 수행하여 제조된다.In general, LED packages are manufactured by performing a packaging process after individual LED devices are manufactured.

도 1은 종래 기술에 따른 조명용 LED 패키지의 구성을 나타낸 분해 사시도이고, 도 2는 도 1에 따른 조명용 LED 패키지의 결합 상태를 나타낸 단면도이다.1 is an exploded perspective view showing the configuration of a lighting LED package according to the prior art, Figure 2 is a cross-sectional view showing a coupling state of the lighting LED package according to FIG.

도 1 및 도 2에서 나타낸 바와 같이, LED 패키지(10)는 인쇄회로기판(11)에 LED 칩(12)가 접속된 상태에서, 상기 LED 칩(12)이 설치된 공간을 봉지재(encapsulation material, 13)로 채운 후에, 임의의 배광 패턴을 형성하기 위한 2차 렌즈(14)가 결합되어 이루어진다.As shown in FIGS. 1 and 2, the LED package 10 encapsulates a space in which the LED chip 12 is installed in a state in which the LED chip 12 is connected to the printed circuit board 11. After filling with 13), secondary lenses 14 for forming any light distribution pattern are combined.

이와 같은 조명용 LED 패키지(10)의 제조 공정은 인쇄회로기판(11)에 LED 칩(12)과 봉지재(13)로 이루어진 LED 모듈을 제조하는 과정과, 상기 LED 칩(12)으로부터 발광되는 빛이 임의의 배광각을 형성하기 위한 2차 렌즈(14)를 별도로 성형하는 공정과 상기 성형된 2차 렌즈(14)를 제조된 LED 패키지(10)에 부착하는 제조과정을 수행해야 하므로, 제조 공정이 복잡해지고 제조 비용이 증가하는 문제점이 있다.
The manufacturing process of the lighting LED package 10 is a process of manufacturing the LED module consisting of the LED chip 12 and the encapsulant 13 on the printed circuit board 11, and the light emitted from the LED chip 12 Since the process of separately molding the secondary lens 14 to form this arbitrary light distribution angle and attaching the molded secondary lens 14 to the manufactured LED package 10 must be performed, a manufacturing process There is a problem that this complexity and manufacturing cost increases.

이러한 문제점을 해결하기 위하여, 본 발명은 LED 칩을 보호하고, 상기 LED 칩으로부터 발광되는 빛이 임의의 배광각을 형성하며 균일한 조도로 발광될 수 있도록 광학 렌즈가 일체로 형성된 렌즈 일체형 조명용 LED 패키지를 제공하는 것을 목적으로 한다.
In order to solve this problem, the present invention is to protect the LED chip, LED light for lens integrated illumination package formed integrally with the optical lens so that the light emitted from the LED chip forms an arbitrary light distribution angle and can be emitted with uniform illuminance The purpose is to provide.

상기한 목적을 달성하기 위하여 본 발명은 렌즈 일체형 조명용 LED 패키지로서, In order to achieve the above object, the present invention provides a lens-integrated illumination LED package,

인쇄회로기판에 접속된 LED 칩; 및 상기 LED 칩으로부터 발광되는 빛이 임의의 배광 패턴을 형성하도록 배광각을 형성하고, 상기 인쇄회로기판의 상면에 상기 LED 칩을 포함하여 비구면으로 성형한 광학 렌즈부를 포함하는 것을 특징으로 한다.An LED chip connected to the printed circuit board; And an optical lens unit configured to form a light distribution angle so that light emitted from the LED chip forms an arbitrary light distribution pattern, and including the LED chip on an upper surface of the printed circuit board.

또한, 본 발명에 따른 상기 광학 렌즈부는 봉지재로 성형하는 것을 특징으로 한다.In addition, the optical lens unit according to the invention is characterized in that the molding with an encapsulant.

또한, 본 발명에 따른 상기 봉지재는 실리콘, 에폭시, 폴리카보네이트 및 PMMA 수지 중 적어도 하나인 것을 특징으로 한다.In addition, the encapsulation material according to the invention is characterized in that at least one of silicone, epoxy, polycarbonate and PMMA resin.

또한, 본 발명에 따른 상기 광학 렌즈부의 비구면은 중심부가 오목하고, 주변부를 볼록하게 형성한 것을 특징으로 한다.In addition, the aspherical surface of the optical lens unit according to the present invention is characterized in that the central portion is concave and the peripheral portion is formed convexly.

또한, 본 발명에 따른 상기 LED 칩은 단일 칩 또는 적어도 4개의 멀티 LED 칩인 것을 특징으로 한다.In addition, the LED chip according to the invention is characterized in that a single chip or at least four multi-LED chip.

또한, 본 발명에 따른 상기 LED 칩이 단일 칩인 경우 단일 칩의 크기는 광학 렌즈부 크기의 적어도 1/3 이상인 것을 특징으로 한다.
In addition, when the LED chip according to the present invention is a single chip, the size of the single chip is characterized in that at least 1/3 or more of the size of the optical lens unit.

본 발명은 LED 칩을 보호하고, 상기 LED 칩으로부터 발광되는 빛이 임의의 배광각을 형성하며 균일한 조도로 발광시킬 수 있는 장점이 있다.The present invention protects the LED chip, and the light emitted from the LED chip forms an arbitrary light distribution angle and has the advantage of being able to emit light with uniform illuminance.

또한, 본 발명은 봉지재의 형상을 렌즈 형상으로 구현함으로써 임의의 배광 패턴을 형성하기 위한 2차 렌즈의 구성을 제거할 수 있는 장점이 있다.In addition, the present invention has the advantage that the configuration of the secondary lens for forming an arbitrary light distribution pattern by implementing the shape of the encapsulant in the lens shape.

또한, 본 발명은 LED 패키지의 제조과정을 단순화시키고, 제조비용을 감소시킬 수 있는 장점이 있다.
In addition, the present invention has the advantage of simplifying the manufacturing process of the LED package, and can reduce the manufacturing cost.

도 1 은 종래 기술에 따른 조명용 LED 패키지의 구성을 나타낸 분해 사시도.
도 2 는 도 1에 따른 조명용 LED 패키지의 결합 상태를 나타낸 단면도.
도 3 은 본 발명에 따른 렌즈 일체형 조명용 LED 패키지를 나타낸 사시도.
도 4 는 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 구조를 나타낸 단면도.
도 5 는 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 광학 렌즈부로 입사된 빛과 방사되는 빛의 조사범위를 나타낸 단면도.
도 6 은 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 광학 렌즈부에서 조사되는 빛의 배광 패턴을 나타낸 예시도.
도 7 은 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 광 세기 분포를 촬영한 예시도.1 is an exploded perspective view showing the configuration of a lighting LED package according to the prior art.
2 is a cross-sectional view showing a coupling state of the LED package for illumination according to FIG.
Figure 3 is a perspective view of the LED package for integrated lens lighting according to the present invention.
4 is a cross-sectional view showing the structure of a lens-integrated illumination LED package according to FIG.
5 is a cross-sectional view showing the irradiation range of the light incident to the optical lens unit of the integrated lens LED package for illumination according to FIG.
6 is an exemplary view showing a light distribution pattern of light irradiated from the optical lens unit of the lens-integrated illumination LED package according to FIG.
7 is an exemplary view photographing the light intensity distribution of the lens-integrated illumination LED package according to FIG.

이하, 첨부된 도면을 참조하여 본 발명에 따른 렌즈 일체형 조명용 LED 패키지의 바람직한 실시예를 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of a lens-integrated illumination LED package according to the present invention.

도 3은 본 발명에 따른 렌즈 일체형 조명용 LED 패키지를 나타낸 사시도이고, 도 4는 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 구조를 나타낸 단면도이며, 도 5는 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 광학 렌즈부로 입사된 빛과 방사되는 빛의 조사범위를 나타낸 단면도이다.3 is a perspective view showing a lens-integrated illumination LED package according to the present invention, Figure 4 is a cross-sectional view showing the structure of the lens-integrated illumination LED package according to Figure 3, Figure 5 is an optical of the lens-integrated illumination LED package according to FIG. A cross-sectional view showing an irradiation range of light incident to the lens unit and emitted light.

도 3 내지 도 5에 나타낸 바와 같이, 본 발명에 따른 렌즈 일체형 조명용 LED 패키지(100)는 전극 및 임의의 회로 패턴이 형성된 인쇄회로기판(110)과, 상기 인쇄회로기판(110) 상에 접속된 적어도 하나의 LED 칩(120)과, 상기 인쇄회로기판(110) 상에 설치되는 광학 렌즈부(130)를 포함하여 구성된다.3 to 5, the lens-integrated illumination LED package 100 according to the present invention is connected to the printed circuit board 110, the electrode and an arbitrary circuit pattern formed on the printed circuit board 110 At least one LED chip 120 and the optical lens unit 130 is provided on the printed circuit board 110 is configured.

상기 LED 칩(120)은 인쇄회로기판(110)과 전기적으로 접속되어 빛을 발광하는 구성으로서, 상기 LED 칩(120)은 발광 면적이 일정크기 이상의 단일 칩으로 구성되거나 또는 적어도 4개의 제 1 내지 제 4 LED 칩(120a, 120b, 120c, 120d)이 배치된 멀티형 LED 칩으로 구성되며, 바람직하게는 4개 이상의 멀티형 LED 칩(120a, 120b, 120c, 120d)을 설치하여 광량이 충분히 증가할 수 있도록 한다.The LED chip 120 is electrically connected to the printed circuit board 110 to emit light. The LED chip 120 includes a single chip having a light emitting area of a predetermined size or more, or at least four first to It consists of a multi-type LED chip in which the fourth LED chip (120a, 120b, 120c, 120d) is disposed, preferably four or more multi-type LED chip (120a, 120b, 120c, 120d) can be installed to increase the amount of light sufficiently Make sure

또한, 상기 LED 칩(120)이 단일 칩으로 구성된 경우 상기 단일 LED 칩(120)의 크기는 광학 렌즈부(130)의 크기와 대비하여 적어도 1/3 이상의 크기를 갖는 대면적의 LED 칩을 설치하여 전체적으로 균일한 배광이 형성되도록 한다. In addition, when the LED chip 120 is composed of a single chip, the size of the single LED chip 120 is installed with a large area LED chip having a size of at least 1/3 or more compared to the size of the optical lens unit 130 To form a uniform light distribution as a whole.

상기 광학 렌즈부(130)는 상기 인쇄회로기판(110)의 상면에 상기 LED 칩(120)을 포함하여 비구면으로 성형된 봉지재로 구성되어 상기 LED 칩(120)이 보호될 수 있도록 한다.The optical lens unit 130 includes the LED chip 120 on the top surface of the printed circuit board 110 and is formed of an encapsulation material formed into an aspherical surface so that the LED chip 120 can be protected.

또한, 상기 광학 렌즈부(130)는 실리콘, 에폭시, 폴리카보네이트 및 PMMA 수지 중 적어도 하나의 봉지재를 이용하여 구성되고, 바람직하게는 실리콘을 이용하여 구성한다.The optical lens unit 130 is formed using at least one encapsulant of silicon, epoxy, polycarbonate, and PMMA resin, and is preferably made of silicon.

또한, 상기 광학 렌즈부(130)는 상기 LED 칩(120)으로부터 발광되는 빛이 임의의 배광각을 형성하도록 함으로써, 가로등 또는 보안등으로 기능하기 위한 배광 패턴을 형성되도록 한다.In addition, the optical lens unit 130 allows the light emitted from the LED chip 120 to form an arbitrary light distribution angle, thereby forming a light distribution pattern for functioning as a street light or a security lamp.

또한, 상기 광학 렌즈부(130)는 LED 칩(120)으로부터 발광되는 빛의 분포를 조절하여 균일한 광이 발산될 수 있도록 중심부가 함몰된 오목부(131)를 형성하고, 주변부를 볼록하게 형성하여 상기 광학 렌즈부(130)의 오목부(131)를 중심으로 4개의 LED 칩(120a, 120b, 120c, 120d)이 빛을 발광함으로써, 조명 대상영역에 균일한 조도를 형성시킬 수 있도록 한다.In addition, the optical lens unit 130 forms a concave portion 131 in which a central portion is recessed so that uniform light is emitted by adjusting the distribution of light emitted from the LED chip 120, and convex portions are formed. 4 LED chips 120a, 120b, 120c, and 120d emit light to the concave portion 131 of the optical lens unit 130 to form uniform illuminance in the illumination target area.

즉 오목부(131) 주변의 비구면은 LED 칩(120)으로부터 발광된 빛이 도달하면 상기 도달된 빛이 볼록한 비구면을 통과하면서 예를 들면, 광학 렌즈부(130)의 반경방향으로 굴절되도록 배광 각도를 형성하여 상기 오목부(131)를 중심으로 주변이 밝아지는 원형의 배광 패턴이 형성되도록 한다.That is, the aspherical surface around the concave portion 131 has a light distribution angle such that when the light emitted from the LED chip 120 reaches the light passing through the convex aspherical surface, for example, the optical lens 130 is refracted in the radial direction. To form a circular light distribution pattern to brighten the periphery around the recess 131.

도 6은 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 광학 렌즈부에서 조사되는 빛의 배광 패턴을 나타낸 예시도이고, 도 7은 도 3에 따른 렌즈 일체형 조명용 LED 패키지의 광 세기 분포를 촬영한 예시도로서, 도 6 및 도 7에 나타낸 바와 같이, 중심부를 기준으로 LED 칩(120)으로부터 발광된 빛이 방사방향으로 균일한 배광을 유지하며 광학 렌즈부(130)의 주변이 전체적으로 원형의 배광 패턴을 형성하는 것을 알 수 있다.6 is an exemplary view showing a light distribution pattern of light emitted from an optical lens unit of the lens-integrated illumination LED package according to FIG. 3, and FIG. 7 is an example of photographing light intensity distribution of the lens-integrated illumination LED package according to FIG. 3. 6 and 7, the light emitted from the LED chip 120 maintains uniform light distribution in the radial direction with respect to the center, and the periphery of the optical lens unit 130 has a circular light distribution pattern as a whole. It can be seen that it forms.

따라서 LED 패키지를 제조하는 과정에서 LED 칩(120)을 보호하기 위한 봉지재에 광학 렌즈부(130)를 형성함으로써, 2차 렌즈 없이 배광 패턴을 형성할 수 있는 렌즈 일체형 조명용 LED 패키지(100)를 제공할 수 있게 된다.Therefore, by forming the optical lens unit 130 in the encapsulant for protecting the LED chip 120 in the process of manufacturing the LED package, the lens-integrated illumination LED package 100 that can form a light distribution pattern without a secondary lens It can be provided.

또한, 다수의 LED 칩(120a, 120b, 120c, 120d)을 사용하여 광출력을 향상시킬 수 있고, 상기 LED 칩(120a, 120b, 120c, 120d)과 광학 렌즈부(130) 사이에 공간을 제거하여 발광되는 광분포를 조절하여 균일한 광이 발산될 수 있도록 한다.
In addition, light output may be improved by using a plurality of LED chips 120a, 120b, 120c, and 120d, and a space is removed between the LED chips 120a, 120b, 120c, and 120d and the optical lens unit 130. By adjusting the light distribution to be emitted so that a uniform light can be emitted.

상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that

또한, 본 발명의 실시예를 설명하는 과정에서 도면에 도시된 선들의 두께나 구성요소의 크기 등은 설명의 명료성과 편의상 과장되게 도시되어 있을 수 있으며, 상술된 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있으므로, 이러한 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.
In the course of the description of the embodiments of the present invention, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, , Which may vary depending on the intentions or customs of the user, the operator, and the definitions of these terms should be based on the contents throughout this specification.

100 : 조명용 LED 패키지 110 : 인쇄회로기판
120 : LED 칩 120a : 제 1 LED 칩
120b : 제 2 LED 칩 120c : 제 3 LED 칩
120d : 제 4 LED 칩 130 : 광학 렌즈부
131 : 오목부100: LED package for lighting 110: printed circuit board
120: LED chip 120a: the first LED chip
120b: second LED chip 120c: third LED chip
120d: fourth LED chip 130: optical lens unit
131: recess

Claims (6)

인쇄회로기판에 접속된 LED 칩; 및
상기 LED 칩으로부터 발광되는 빛이 임의의 배광 패턴을 형성하도록 배광각을 형성하고, 상기 인쇄회로기판의 상면에 상기 LED 칩을 포함하여 비구면으로 성형한 광학 렌즈부를 포함하는 렌즈 일체형 조명용 LED 패키지.An LED chip connected to the printed circuit board; And
An LED package for a lens-integrated illumination comprising an optical lens unit formed on the upper surface of the printed circuit board to form a light distribution angle so that the light emitted from the LED chip forms an arbitrary light distribution pattern, and including the LED chip. 제 1 항에 있어서,
상기 광학 렌즈부는 봉지재로 성형하는 것을 특징으로 하는 렌즈 일체형 조명용 LED 패키지.The method of claim 1,
The optical lens unit is a lens-integrated illumination LED package, characterized in that the molding with a sealing material. 제 2 항에 있어서,
상기 봉지재는 실리콘, 에폭시, 폴리카보네이트 및 PMMA 수지 중 적어도 하나인 것을 특징으로 하는 렌즈 일체형 조명용 LED 패키지.3. The method of claim 2,
The encapsulant is a lens-integrated illumination LED package, characterized in that at least one of silicon, epoxy, polycarbonate and PMMA resin. 제 1 항에 있어서,
상기 광학 렌즈부의 비구면은 중심부가 오목하고, 주변부를 볼록하게 형성한 것을 특징으로 하는 렌즈 일체형 조명용 LED 패키지.The method of claim 1,
An aspherical surface of the optical lens unit, the central portion is concave, the lens integrated illumination LED package, characterized in that formed in the convex portion. 제 1 항에 있어서,
상기 LED 칩은 단일 칩 또는 적어도 4개의 멀티 LED 칩인 것을 특징으로 하는 렌즈 일체형 조명용 LED 패키지.The method of claim 1,
The LED chip is a lens integrated illumination LED package, characterized in that a single chip or at least four multi-LED chip. 제 5 항에 있어서,
상기 LED 칩이 단일 칩인 경우 단일 칩의 크기는 광학 렌즈부 크기의 적어도 1/3 이상인 것을 특징으로 하는 렌즈 일체형 조명용 LED 패키지.The method of claim 5, wherein
If the LED chip is a single chip, the size of the single chip is at least one third of the size of the optical lens unit, characterized in that the LED package for integrated lens lighting.
KR1020120005655A 2012-01-18 2012-01-18 Led package for lamp with lens KR101337502B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120005655A KR101337502B1 (en) 2012-01-18 2012-01-18 Led package for lamp with lens

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120005655A KR101337502B1 (en) 2012-01-18 2012-01-18 Led package for lamp with lens

Publications (2)

Publication Number Publication Date
KR20130084803A true KR20130084803A (en) 2013-07-26
KR101337502B1 KR101337502B1 (en) 2013-12-06

Family

ID=48995261

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120005655A KR101337502B1 (en) 2012-01-18 2012-01-18 Led package for lamp with lens

Country Status (1)

Country Link
KR (1) KR101337502B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9831221B2 (en) 2014-02-05 2017-11-28 Lg Innotek Co., Ltd. Light emitting device package and lighting apparatus including the same
KR102123055B1 (en) * 2019-08-19 2020-06-15 주식회사 하이앤텍 CCTV camera including LED light source and laser source

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101571486B1 (en) 2014-02-28 2015-11-24 재단법인 한국조명연구원 Large optical lens with devided light distribution
KR102277127B1 (en) 2014-10-17 2021-07-15 삼성전자주식회사 Light emitting device package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789835B1 (en) * 2006-07-06 2008-01-02 엘지전자 주식회사 Led package and lens for the same and back-light unit using the led package
JP2009003104A (en) 2007-06-20 2009-01-08 Shiizu:Kk Illuminating lens and illuminating device
CN101971378A (en) * 2008-06-23 2011-02-09 松下电器产业株式会社 Light-emitting device, surface light-emitting apparatus, display system
KR101036348B1 (en) * 2008-10-30 2011-05-23 주식회사 이츠웰 Lens for luminous element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9831221B2 (en) 2014-02-05 2017-11-28 Lg Innotek Co., Ltd. Light emitting device package and lighting apparatus including the same
KR102123055B1 (en) * 2019-08-19 2020-06-15 주식회사 하이앤텍 CCTV camera including LED light source and laser source

Also Published As

Publication number Publication date
KR101337502B1 (en) 2013-12-06

Similar Documents

Publication Publication Date Title
KR101064090B1 (en) The light-
JP6386110B2 (en) Light emitting device having asymmetric radiation pattern and method of manufacturing the same
US20150049486A1 (en) Led illumination module
US20080224162A1 (en) Light emitting diode package
US8253154B2 (en) Lens for light emitting diode package
KR20060049072A (en) Light-emitting diode lamp
TWI619208B (en) Packaging method of optical module with light-concentrating structure
US8342703B2 (en) Light emitting apparatus
US9890930B2 (en) Light source module
US20110180832A1 (en) Light emitting device package
KR101337502B1 (en) Led package for lamp with lens
US8981407B2 (en) Light emitting diode package with lens and method for manufacturing the same
TW201505134A (en) Packaging structure of optical module
KR100947440B1 (en) Orientation angle changing lens and light emitting device comprising the same
TW201904016A (en) Light emitting device, light irradiation module, and light irradiation device
KR101708025B1 (en) Lens and light-emitting device having the same
US9335450B2 (en) Optical element and method for manufacturing the same
US20150048394A1 (en) Light emitting device package and method of manufacturing the same
KR101752405B1 (en) Lens and led package comprising the same
TW201503426A (en) Light emitting diode module
TW202115345A (en) This utility model relates to a led package structure and light-emitting device
KR101389347B1 (en) Light emitting diode package
US20130026515A1 (en) Led package with a fresnel lens
KR101370963B1 (en) Optical lens and light emitting device package comprising the same
KR20130070285A (en) Chip on board type light emtting device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20161026

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20171020

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20181029

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20191113

Year of fee payment: 7