KR20130079853A - Non-volatile memory device and memory system comprising the same - Google Patents
Non-volatile memory device and memory system comprising the same Download PDFInfo
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- KR20130079853A KR20130079853A KR1020120000592A KR20120000592A KR20130079853A KR 20130079853 A KR20130079853 A KR 20130079853A KR 1020120000592 A KR1020120000592 A KR 1020120000592A KR 20120000592 A KR20120000592 A KR 20120000592A KR 20130079853 A KR20130079853 A KR 20130079853A
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5642—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
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Abstract
In an embodiment, a nonvolatile memory device may include a memory cell array connected to a plurality of bit lines and a plurality of word lines, a page buffer circuit configured to sense memory cells connected to a selected word line through the plurality of bit lines; A voltage generator for providing a read voltage to the selected word line, and control logic to control the page buffer circuit and the voltage generator to sense memory cells connected to the selected word line in accordance with a first read mode or a second read mode. The number of memory cells sensed simultaneously in the first read mode and the second read mode is different, and the voltage generator provides a read voltage for the same data state differently according to the number of sensed memory cells.
Description
The present invention relates to a semiconductor memory device, and more particularly to a nonvolatile memory device and a memory system including the same.
The semiconductor memory device may be classified into a volatile semiconductor memory device and a non-volatile semiconductor memory device. The volatile semiconductor memory device has a drawback that the read and write speed is fast but the stored contents disappear when the power supply is interrupted. On the other hand, the nonvolatile semiconductor memory device preserves its contents even if the power supply is interrupted. Therefore, the nonvolatile semiconductor memory device is used to store contents to be stored regardless of whether power is supplied or not.
Nonvolatile semiconductor memory devices include, but are not limited to, a mask read-only memory (MROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM) Erasable programmable read-only memory (EEPROM), and the like.
A representative example of the nonvolatile memory device is a flash memory device. The flash memory device may be a computer, a mobile phone, a PDA, a digital camera, a camcorder, a voice recorder, an MP3 player, a personal digital assistant (PDA), a handheld PC, a game machine, a fax machine, a scanner, ) Are widely used as audio and video data storage media for information devices such as digital cameras.
In recent years, as the high integration demand for memory devices increases, multi-bit memory devices storing multiple bits in one memory cell have become popular.
Disclosure of Invention An object of the present invention is to provide a nonvolatile memory device implemented with an ABL (All Bit Line) and a read method thereof that can improve the performance of a read operation.
According to an embodiment of the present invention, a nonvolatile memory device may include a memory cell array connected to a plurality of bit lines and a plurality of word lines, and memory cells connected to a selected word line through the plurality of bit lines. A page buffer circuit for sensing, a voltage generator for providing a read voltage to the selected word line, and the page buffer circuit and the voltage to sense memory cells connected to the selected word line according to a first read mode or a second read mode. Control logic for controlling a generator, wherein the number of memory cells sensed simultaneously in the first read mode and the second read mode is different, wherein the voltage generator is configured to measure the read voltage for the same data state to the number of memory cells sensed. Provide differently according.
According to an aspect of the present invention, there is provided a nonvolatile memory device having an all-bit line structure, and applying a full page read command or a partial page read command for a selected page to the nonvolatile memory device. And a memory controller, wherein the nonvolatile memory device generates different read voltages for the same data state according to the read command.
According to an exemplary embodiment of the present invention, a high-speed read operation may be performed during a partial page read operation of an all-bit line nonvolatile memory device, and reliability of read data may be improved.
1 is a block diagram illustrating a configuration of a nonvolatile memory device according to the present invention.
FIG. 2 is a diagram illustrating the structure of the cell array and page buffer circuit shown in FIG. 1.
3 is a diagram illustrating a thermal addressing method according to an embodiment of the present invention.
4 is a diagram illustrating voltages in a full page read mode and a partial page read mode according to an exemplary embodiment of the present invention.
5 are waveform diagrams showing levels of read voltages applied in a full page read mode and a partial page read mode, respectively.
6 is a block diagram illustrating a memory cell array of FIG. 1.
FIG. 7 is a perspective view illustrating one of the memory blocks of FIG. 6.
8 is a block diagram illustrating a nonvolatile memory device according to another exemplary embodiment of the present invention.
FIG. 9 is a timing diagram illustrating input / output characteristics of the nonvolatile memory device of FIG. 8.
10 is a block diagram illustrating a nonvolatile memory device according to another embodiment of the present invention.
FIG. 11 is a flowchart illustrating an operation of a nonvolatile memory device of FIG. 10.
12 is a block diagram illustrating a solid state drive according to an exemplary embodiment of the present invention.
13 is a block diagram illustrating a data storage device in accordance with some embodiments of the inventive concept.
14 is a block diagram illustrating a memory card in accordance with an embodiment of the disclosure.
15 is a schematic block diagram of a flash memory device and a computing system including the same according to the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the technical idea of the present invention. The same elements will be referred to using the same reference numerals. Similar components will be referred to using similar reference numerals. The circuit configuration of the flash memory device according to the present invention to be described below and the read operation performed by the present invention are just examples, and various changes and modifications can be made without departing from the technical spirit of the present invention.
1 is a block diagram illustrating a
The
The
The
The
The input /
The
For example, the
Here, the coarse-fine sensing method refers to a method of sensing two consecutively selected memory cells with different read voltages in order to reduce sensing noise. That is, a coarse sensing operation of sensing selected memory cells at a level lower than a target level is performed first. Only off-cells are selected among the cells sensed by the coarse sensing. A fine sensing operation in which the selected off-cells are sensed at the target level is performed. The data sensed and latched by fine sensing is output as the final read data. In the all bit line structure, some on-cells are selected by coarse sensing. In fine sensing, since the on cells selected in the coarse sensing are excluded, the common source line noise CSL noise may be reduced.
The
The
In particular, the
In the partial page read mode, the number of selected memory cells is relatively smaller than in the full page read mode. Thus, in the partial page read mode, the common source line noise (CSL Noise) is less than in the full page read mode. Therefore, in the partial page read mode, the level of the read voltage provided may be higher than the read voltage during fine sensing for the same data state. This setting ensures high data reliability even in partial page read mode.
The
2 is a block diagram illustrating the
A plurality of bit lines BL0 to BLn-1 may be formed in the
The
Here, the ground transistors GTR0 to GTRn-1 are illustrated as being formed in the
The
Through the above structure, the non-selected bit lines of the
3 is a diagram illustrating an example of an addressing method for bit lines. Referring to FIG. 3, a column addressing scheme in an all bit line structure in which 8 KB size pages are programmed at a time will be described as an example.
The even-numbered bit lines BL0, BL2, BL4, ..., BL8186, BL8188, BL8190 are addressed to column addresses 0, 1, 2, ..., 4093, 4094, 4095, respectively. The odd bit lines BL1, BL3, BL5,..., BL8187, BL8189, and BL8191 are addressed to column addresses 4096, 4097, 4098,..., 8189, 8190, and 8191, respectively. In the partial page read mode in which even-numbered bit lines are selected, data sensed through the even-numbered bit lines may constitute a plurality of consecutive sectors. Therefore, data sensed by even-numbered bit lines may be output regardless of whether the odd-numbered bit lines are sensed.
Here, it has been described that such an addressing scheme is applied only to bit lines of the main region that can be selected from the outside through addressing, but the present invention is not limited thereto. That is, the read of the bit lines to the spare area may be controlled in the same manner as in the main area. The partial page read mode may be applied to the bit lines of the spare area, and the unselected bit lines may be controlled to be grounded. That is, the bit lines of the spare area may include a first spare bit line corresponding to even-numbered bit lines and a second spare bit line corresponding to odd-numbered bit lines. .
In the spare area, meta data, flag bits, and the like corresponding to control information of data of the main area are stored. Accordingly, the data sensed through the first spare bit line (Sparre 1st Half) may provide sufficient control information for the main data sensed through the even-numbered bit lines BL0, BL2, BL4, ..., BL8186, BL8188, and BL8190. It must be configured to provide. In addition, the data sensed through the second spare bit line (Sparre 2nd Half) is sufficient control information for the main data sensed through the odd bit lines BL1, BL3, BL5, ..., BL8187, BL8189, BL8191. It must be configured to provide.
In the program operation, control information about main data corresponding to even-numbered bit lines may be programmed in memory cells of the spare area corresponding to the first spare bit line. In addition, control information on main data corresponding to odd bit lines may be programmed in memory cells corresponding to the second spare bit line.
4 is a view for explaining the read voltage of the present invention. Referring to FIG. 4, in the full page read mode, the
(a) shows the read voltages provided during the first page (1st page, or MSB page) read operation. Read voltages Vrd2_C and Vrd2_F for coarse-fine sensing for reading the first page in the full page read mode will be provided. However, in the half page read mode, a read voltage Vrd2_H for reading the first page will be provided. The read voltage Vrd2_H provided in the half page read mode is relatively higher than the read voltages Vrd2_C and Vrd2_F provided in the full page read mode.
(b) shows the read voltages provided in the second page read operation. Read voltages Vrd1_C, Vrd1_F, Vrd3_C, and Vrd3_F for coarse-fine sensing for reading the second page in the full page read mode will be provided. In the half page read mode, read voltages Vrd1_H and Vrd3_H for reading the second page will be provided. The read voltage Vrd1_H provided in the half page read mode is relatively higher than the read voltages Vrd1_C and Vrd1_F provided in the full page read mode. The read voltage Vrd3_H provided in the half page read mode is relatively higher than the read voltages Vrd3_C and Vrd3_F provided in the full page read mode.
In the full page read mode and the half page read mode, the threshold voltage level measurement due to the difference of the common source line noise (CSL Noise) may vary. For example, the threshold voltage may be measured high for the same program state by common source line noise in the half page read mode. However, this error can be compensated for by the read voltages Vrd1_H, Vrd1_H, and Vrd3_H set in the half page read mode of the present invention. As a result, relatively high read voltages Vrd2_H, Vrd2_H, and Vrd3_H may be provided in the half page read mode, thereby providing an error rate that is similar or equivalent to that in the full page read mode.
5 is a waveform diagram schematically illustrating a word line voltage in a read mode according to the present invention. Referring to FIG. 5, the waveform of the word line voltage provided to read a second page (2nd page, or LSB page) in the full page read mode and the partial page read mode is different from each other.
First, in a full page read mode, a read voltage for coarse-fine sensing is applied to the selected word line. During the time period t0 to t1, a sensing operation for identifying the erase state E0 and the program state P1 is performed. Read voltages Vrd1_C and Vrd1_F for coarse sensing and fine sensing are sequentially applied to the selected word line (eg, WL <1>). The word line selected in the time periods t1 to t2 is discharged. During the time period t2 to t3, a sensing operation for identifying the program state P2 and the program state P3 is performed. Read voltages Vrd3_C and Vrd3_F for coarse sensing and fine sensing are sequentially applied to the selected word line (eg, WL <1>).
In the partial page read mode, a read voltage for fine sensing is applied to the selected word line. During the time period t0 to t1, a sensing operation for identifying the erase state E0 and the program state P1 is performed. A fine read voltage Vrd1_H for fine sensing is applied to the selected word line (eg, WL <1>). The word line selected in the time periods t1 to t2 is discharged. During the time period t2 to t3, a sensing operation for identifying the program state P2 and the program state P3 is performed. A fine read voltage Vrd3_H for fine sensing is applied to the selected word line (eg, WL <1>). The read voltage Vrd1_H provided in the partial page read mode is higher than the read voltage Vrd1_F provided in the full page read mode. The read voltage Vrd3_H provided in the partial page read mode is higher than the read voltage Vrd3_F provided in the full page read mode.
Here, although the waveform in the second page read operation is illustrated as an example, it will be appreciated that the waveform may be applied to the first page read mode. That is, the read voltage Vrd2_H provided in the partial page read mode in the first page read operation is higher than the read voltage Vrd2_F provided in the full page read mode. The waveform or pulse width in the partial page read mode may vary depending on the purpose.
6 is a block diagram illustrating the
Each of the NAND cell strings is connected to a bit line BL, a string select line SSL, a ground select line GSL, word lines WL, and a common source line CSL. That is, each memory block includes a plurality of bit lines BL, a plurality of string select lines SSL, a plurality of ground select lines GSL, a plurality of word lines WL, and a common source line CSL. Will be connected to). The memory blocks BLK1 to BLKz are described in more detail with reference to FIG. 7.
FIG. 7 is a perspective view illustrating one of the memory blocks BLK1 to BLKz of FIG. 6. Referring to FIG. 7, the memory block BLKi includes structures extending along the first to third directions x, y, and z.
In order to form the memory block BLKi, a substrate 111 is first provided. For example, the substrate 111 may be formed as a P-well formed by implanting a
On the substrate 111, a plurality of doped regions 311 ˜ 314 are formed along the first direction x. For example, the plurality of doped regions 311 to 314 may be formed of an n-type conductor different from the substrate 111. Hereinafter, it is assumed that the first to fourth doping regions 311 to 314 have n types. However, the first to fourth doped regions 311 to 314 are not limited to having an n-type.
On the region of the substrate 111 between the first and second
On the substrate 111 between the first and second
Illustratively, each
The
In an area between the first and second
Illustratively, the thickness of the insulating
In the region between the first and second
Between the insulating
In the region between the second and third
In the region between the third and fourth
Drains 321 are provided on the plurality of
On the drains 321, second
8 is a block diagram illustrating a memory system according to an example embodiment. Referring to FIG. 8, the
The
The
9 is a timing diagram illustrating an example of a read command of FIG. 8. 9, a command input sequence in a full page read mode and a command input sequence in a partial page read mode are shown, respectively.
In the full page read mode, the
On the other hand, in the partial page read mode, the
In the partial page read mode, the sensed partial page data may be output to the outside immediately after being latched. Therefore, partial page data on which sensing is completed may be output before sensing of one entire page is completed. Therefore, the output time of the partial page data may be output almost without difference from the output time of the full page data, or may be output faster. This is because in the partial page read mode, only one sensing of one data state is performed by the read voltage. That is, the output time of the partial page data may be advanced by reducing the sensing time.
10 is a block diagram illustrating a memory system according to another example embodiment of the disclosure. Referring to FIG. 10, the
The
The
FIG. 11 is a flowchart schematically illustrating an operation of the memory system of FIG. 10. Referring to FIG. 11, the nonvolatile memory device 320 (see FIG. 10) performs a read command from the
In operation S110, the
In operation S120, the
In operation S130, the
In operation S140, the
The data of the page selected according to the read operation of the
12 is a block diagram illustrating a user device including a solid state disk (SSD) according to an exemplary embodiment of the present invention. Referring to FIG. 12, a
The
The
In the
The
The
13 is a block diagram illustrating a
The
The
The
The
The
14 is a block diagram illustrating a
In addition, the configuration of the
The
The
FIG. 15 is a diagram illustrating a schematic configuration of a
The configuration of the
The
When the computing system according to the present invention is a mobile device, a
The nonvolatile memory device and / or memory controller according to the present invention may be mounted using various types of packages. For example, the flash memory device and / or the memory controller according to the present invention can be implemented as a package on package (PoP), ball grid arrays (BGAs), chip scale packages (CSPs), plastic leaded chip carriers (PLCC) Linear Package (PDIP), Die in Waffle Pack, Die in Wafer Form, Chip On Board (COB), Ceramic Dual In-Line Package (CERDIP), Plastic Metric Quad Flat Pack (MQFP), Thin Quad Flatpack Outline (SOIC), Shrink Small Outline Package (SSOP), Thin Small Outline (TSOP), System In Package (SIP), Multi Chip Package (MCP), Wafer-Level Fabricated Package (WFP) WSP), and the like.
The embodiments have been disclosed in the drawings and specification as described above. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.
110: cell array 120: row decoder
130: page buffer circuit 140: input and output buffer
150: control logic 160: voltage generator
210, 310:
1100: Host 1200: SSD
1210: SSD controller 1220: buffer memory
1230
2200: memory controller 2210: CPU
2220: host interface 2230: SRAM
2240: ECC 2260: Memory Interface
3100: flash memory 3200: flash interface
4100: flash memory 4200: memory controller
4300: modem 4400: system bus
4500: Microprocessor 4600: User Interface
4700: Battery
Claims (10)
A page buffer circuit configured to sense memory cells connected to a selected word line through the plurality of bit lines;
A voltage generator for providing a read voltage to the selected word line; And
Control logic to control the page buffer circuit and the voltage generator to sense memory cells connected to the selected word line in accordance with a first read mode or a second read mode,
The number of memory cells sensed simultaneously in the first read mode and the second read mode is different, and the voltage generator provides different read voltages for the same data state according to the number of sensed memory cells.
And in the first read mode, the voltage generator provides a first read voltage and a second read voltage higher than the first read voltage to the selected word line to identify any data state.
And when the second read voltage is provided, the page buffer circuit selects and senses memory cells identified as off-cells by the first read voltage.
And in the second read mode, the voltage generator generates a read voltage higher than the second read voltage to identify any one of the data states.
And the page buffer circuit grounds bit lines corresponding to an unselected column among memory cells connected to the selected word line in the second read mode.
The page buffer circuit,
And sensing memory cells corresponding to even and odd columns in the first read mode, and sensing memory cells corresponding to any one of even and odd columns in the second read mode.
The first read mode or the second read mode is selected by setting a read command or a set feature.
A memory controller configured to apply a full page read command or a partial page read command for the selected page to the nonvolatile memory device,
The nonvolatile memory device may generate different read voltages for the same data state according to the read command.
And a level of a read voltage generated by the nonvolatile memory device when the partial page read command is provided is higher than a level of a read voltage generated when the full page read command is provided for the same data state.
The nonvolatile memory device performs at least two sensing operations by different read voltages in order to identify a data state in response to the full page read command, and in response to the partial page read command. A memory system that performs one sensing operation with a single read voltage to identify a data state.
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KR1020120000592A KR20130079853A (en) | 2012-01-03 | 2012-01-03 | Non-volatile memory device and memory system comprising the same |
US13/527,641 US8861276B2 (en) | 2011-06-21 | 2012-06-20 | Nonvolatile memory device, memory system comprising same, and method of operating same |
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KR1020120000592A KR20130079853A (en) | 2012-01-03 | 2012-01-03 | Non-volatile memory device and memory system comprising the same |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9524781B2 (en) | 2013-12-11 | 2016-12-20 | Samsung Electronics Co., Ltd. | Nonvolatile memory device and operating method thereof |
KR20170102659A (en) * | 2016-03-02 | 2017-09-12 | 삼성전자주식회사 | Non-volatile Memory Device including page buffer and Operating Method thereof |
-
2012
- 2012-01-03 KR KR1020120000592A patent/KR20130079853A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9524781B2 (en) | 2013-12-11 | 2016-12-20 | Samsung Electronics Co., Ltd. | Nonvolatile memory device and operating method thereof |
KR20170102659A (en) * | 2016-03-02 | 2017-09-12 | 삼성전자주식회사 | Non-volatile Memory Device including page buffer and Operating Method thereof |
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