KR20130054218A - Haptic feedback device - Google Patents

Abstract

PURPOSE: A haptic feedback device is provided to easily change a vibration frequency into a predetermined frequency band when a vibration member or a mass member, which is deviated from an allowable error range, is used. CONSTITUTION: A piezoelectric device(20) is contracted or extended corresponding to the polarity of applied voltage. A vibration member(10) generates displacement by combination with the piezoelectric device. Mass members(40,50) combine with the vibration member. A case accommodates the vibration member and the mass members. A first buffer member is formed in the upper side of the case or a mass member and prevents collision between the mass member and the case. The vibration member includes a first board, which is extended in a first direction, and a pair of second boards which is bent in a second direction which is perpendicular to the first direction.

Description

Haptic feedback device

The present invention relates to a haptic feedback device, and more particularly to a haptic feedback device capable of adjusting the vibration frequency.

In order to increase user convenience, a touch input / output device (eg, a haptic feedback device) in which a selection button is displayed on a screen has been generalized.

The haptic feedback device may provide a very convenient function for manipulating all input signals while the user visually checks the output information by inputting an output signal directly to the screen using a finger or the like.

Such a haptic feedback device has the advantage of saving space, improving operability and simplicity, and facilitating user recognition. In addition, the haptic feedback device has an advantage of good interoperability with IT devices. Therefore, the haptic feedback device is widely used as an input / output means of a guide device for guiding a corresponding place in a public place (for example, a subway station, a hospital, a school, etc.).

Meanwhile, the haptic feedback device includes a haptic feedback device as a means for indicating whether an input signal is received or whether an output signal is output. Such a haptic feedback device includes a vibration element (for example, a piezoelectric element) and a vibration member that vibrates by the vibration element.

Here, since the vibrating member is manufactured in a thin plate shape, a deviation may occur in its length and thickness according to the manufacturing process. In addition, since the deviation of the length and thickness changes the vibration frequency, the haptic feedback device may vibrate in a range outside of the preset band, and such vibration may cause annoyance to the user.

However, since the conventional haptic feedback device does not have any structure for correcting the failure of the vibration frequency, the haptic feedback device outside the preset band has to be discarded.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a haptic feedback device capable of easily correcting or adjusting a vibration frequency of a haptic feedback device having a vibration frequency band different from a design due to manufacturing tolerances.

A haptic feedback device according to an embodiment of the present invention for achieving the above object is a piezoelectric element that is stretched and contracted in accordance with the polarity of the applied voltage; A vibration member coupled to the piezoelectric element to generate a displacement; A mass member engaged with the vibration member; A case accommodating the vibration member and the mass member; And a first buffer member formed on the inner side of the mass member or the case to prevent a collision between the mass member and the case.

In the haptic feedback device according to an embodiment of the present invention, the vibration member includes: a first plate extending in a first direction; And a pair of second plate members extending from both sides of the first plate member and bent in a second direction perpendicular to the first direction so as to be coupled to the mass member.

The haptic feedback device according to an embodiment of the present disclosure may further include a second buffer member formed on the vibration member or the mass member to prevent collision between the vibration member and the mass member.

The haptic feedback device according to an embodiment of the present invention may further include a third buffer member formed on the inner lower portion of the vibrating member or the case to prevent a collision between the vibrating member and the case.

According to another aspect of the present invention, a haptic feedback device includes a piezoelectric element that stretches and contracts according to a polarity of an applied voltage; A vibration member coupled to the piezoelectric element to generate a displacement; A mass member engaged with the vibration member; A case accommodating the vibration member and the mass member; And a first buffer member formed on the vibration member or the mass member to prevent a collision between the vibration member and the mass member.

The haptic feedback device according to another embodiment of the present invention may further include a second buffer member formed at the inner lower portion of the vibration member or the case to prevent the vibration member from colliding with the case.

A haptic feedback device according to another embodiment of the present invention for achieving the above object is a piezoelectric element that is stretched and contracted in accordance with the polarity of the applied voltage; A vibration member coupled to the piezoelectric element to generate a displacement; A mass member engaged with the vibration member; A case accommodating the vibration member and the mass member; And a first buffer member formed at an inner lower portion of the vibration member or the case to prevent a collision between the vibration member and the case.

The present invention can calibrate or adjust the vibration frequency of the haptic feedback device by adjusting the length of the vibrating member (actually vibrating length) and the mass of the mass member.

Therefore, according to the present invention, even when the vibration member or the mass member outside the tolerance range is used, the vibration frequency of the haptic feedback device can be easily changed to a preset frequency band.

1 is a cross-sectional view of a haptic feedback device according to a first embodiment of the present invention,
FIG. 2 is a plan view illustrating a vibration member of the haptic feedback device illustrated in FIG. 1;
3 and 4 are cross-sectional views of the haptic feedback device for explaining the vibration width of the vibration member according to the change of the fixed point,
5 and 6 are a plan view showing a modification of the vibration member in the first embodiment of the present invention,
7 is a cross-sectional view illustrating a haptic feedback device according to a second embodiment of the present invention;
8 and 9 are perspective views showing a modified form of the mass member according to the second embodiment of the present invention,
10 is a plan view illustrating a vibration member of a haptic feedback device according to a third embodiment of the present invention;
11 is a plan view showing a modified form of the vibration member according to the third embodiment of the present invention,
12 is an exploded perspective view of a haptic feedback device according to a fourth embodiment of the present invention;
FIG. 13 is a combined perspective view of the haptic feedback device shown in FIG. 12;
FIG. 14 is a bottom view of the haptic feedback device shown in FIG. 13.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, terms that refer to the components of the present invention are named in consideration of the function of each component, it should not be understood as a meaning limiting the technical components of the present invention.

Among the elements constituting the haptic feedback device, the vibration member may be manufactured in a thin plate shape. Since the vibration member of such a shape is easily elastically deformed by an external force, the vibration effect by the vibration element is good.

However, since the plate-shaped vibration member is easily deformed by heat deformation and external impact caused by heat, it is easy to change the vibration frequency of the haptic feedback device.

In addition, such deformation of the vibrating member may result in a failure of the haptic feedback device, which may lower the manufacturing yield of the haptic feedback device and cause a vibration frequency at which the user feels uncomfortable.

The present invention is to recognize and solve the above problems, can provide a haptic feedback device that can easily adjust or correct the vibration frequency of the modified haptic feedback device according to the deformation of the vibration member.

For example, the present invention can correct the vibration frequency of the haptic feedback device by changing the spring constant of the vibration member or the mass of the vibration object (body including the vibration member and the vibration element), the spring constant and vibration object of the vibration member It is possible to provide a haptic feedback device capable of changing the mass of.

1 is a cross-sectional view of a haptic feedback device according to a first embodiment of the present invention, Figure 2 is a plan view showing a vibration member of the haptic feedback device shown in Figure 1, Figures 3 and 4 is a vibration according to the fixed point change 5 and 6 are a plan view showing a modified form of the vibration member in the first embodiment of the present invention, Figure 7 is a second embodiment of the present invention for explaining the vibration width of the member 8 and 9 are perspective views illustrating a modified form of a mass member according to a second embodiment of the present invention, and FIG. 10 is a haptic feedback device according to a third embodiment of the present invention. 11 is a plan view showing a vibration member, Figure 11 is a plan view showing a deformation of the vibration member according to a third embodiment of the present invention, Figure 12 is a haptic feedback D according to a fourth embodiment of the present invention A separate perspective view of the device, Figure 13 is a perspective view of a combined tactile feedback device shown in Figure 12, Figure 14 is a bottom view of the haptic feedback device shown in Fig.

A haptic feedback device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 6.

The haptic feedback device 100 according to the first embodiment of the present invention may include cases 102 and 104, a vibrating member 10, and a vibrating element 20. The haptic feedback device 100 configured as described above may be mounted on a portable telephone, other portable electronic devices including a portable electronic dictionary.

In addition, the haptic feedback device 100 may be connected to an input / output device of a corresponding electronic device to transmit a vibration signal to a user. However, the haptic feedback device 100 of the present invention is not limited to the above-described portable electronic device, and may be installed in an ATM, a subway station route guide device having a touch screen, or the like. In addition, the haptic feedback device 100 may be mounted and used in other electronic devices that require the output of the vibration signal.

The cases 102 and 104 may be formed of the upper case 102 and the lower case 104. Cases 102 and 104 may protect haptic feedback device 100 from external impact. To this end, the cases 102 and 104 may be made of a metal material resistant to impact. However, in order to reduce the weight of the haptic feedback device 100 may be made of a plastic material. In this case, the plastic material may include an impact resistant component.

The cases 102 and 104 may be detachably mounted to the electronic device to which the haptic feedback device 100 is to be mounted. Alternatively, at least a portion of the cases 102 and 104 (eg, upper case 102 or lower case 104) may be a portable electronic device (eg, a portable telephone) on which the haptic feedback device 100 is mounted. It can be formed integrally with. Alternatively, the upper case 102 or lower case 104 or the upper case 102 and the lower case 104 may be part of a portable electronic device.

In addition, the cases 102 and 104 may include electrodes for receiving an electrical signal from the portable electronic device. These electrodes may be formed outside the cases 102 and 104, and may supply current to the vibrating element 20 mounted therein.

The upper case 102 and the lower case 104 may be coupled to and separated from each other. For example, the upper case 102 and the lower case 104 may be coupled to each other by bolts and nuts. Alternatively, the upper case 102 and the lower case 104 may be coupled by separate fitting structures (for example, protrusions and grooves).

The lower case 104 may include a protrusion 106. The protrusion 106 may be a structure for supporting the vibrating member 10, and may include a plurality of coupling holes for coupling with the vibrating member 10.

Meanwhile, in the accompanying drawings, the haptic feedback device 100 is shown to include the cases 102 and 104. However, depending on the device on which the haptic feedback device 100 is mounted, the cases 102 and 104 may be omitted, and in this case, the body of the device may replace the cases 102 and 104.

The vibrating member 10 may be manufactured in a thin plate shape having a generally rectangular cross section. However, if the shape can be vibrated up and down may be manufactured in a shape other than a rectangle.

The vibrating member 10 may be made of a material having a predetermined elasticity. For example, the vibrating member 10 may be made of a metal material, plastic, or the like. In addition, the vibration member 10 may be a spring constant K is determined so that the haptic feedback device 100 has a vibration frequency (100 ~ 300 Hz) of a predetermined range. For example, the vibration member 10 may be adjusted in length and thickness so that the haptic feedback device 100 has a vibration frequency of 100 to 300 Hz.

The vibrating member 10 may be fixed to the cases 102 and 104. Specifically, both ends of the vibrating member 10 may be coupled to the cases 102 and 104. For reference, in the present embodiment, the vibration member 10 may be coupled to the lower case 104. However, if necessary, the vibration member 10 may be coupled to the upper case 102 and may be coupled to both the upper case 102 and the lower case 104.

On the other hand, in the present embodiment, the coupling position of the vibration member 10 and the cases 102 and 104 (hereinafter referred to as the fixing point 30) may be changed.

To this end, the vibrating member 10 may have a plurality of fixing points 30 (32, 34, 36) with respect to the case (102, 104). The fixing point may be in the form of a plurality of fastening holes 12 (12a, 12b, 12c). Alternatively, the fixing point may be a welding point at which the vibration member 10 and the cases 102 and 104 are joined.

The holes 12 may be formed in symmetrical shapes at both ends of the vibrating member 10. In addition, the holes 12 (12a, 12b, 12c) may be formed at intervals along the longitudinal direction of the vibration member 10 (X-axis direction relative to Figure 2), may be formed in a plurality of rows along the Y-axis direction. have.

For reference, the distance between the first holes 12a may be L1, the distance between the second holes 12b may be L2, and the distance between the third holes 12c may be L3. In addition, the distance L3 may be larger than the distance L2, and the distance L2 may be larger than the distance L1.

Bolts or pins may be fastened to the holes 12 (12a, 12b, 12c) as described above to fix the vibrating member 10 to the cases (102, 104). Alternatively, the holes 12 (12a, 12b, 12c) may be utilized as a space for welding the vibration member 10 and the case (102, 104). However, the method of coupling the vibrating member 10 and the cases 102 and 104 is not limited to the aforementioned method, and may be changed within a range that a person skilled in the art can recognize and recognize.

As such, the vibration member 10 having the plurality of holes 12; 12a, 12b, and 12c may change the fixing points 30; 32, 34, and 36 through the holes 12; 12a, 12b, and 12c. have.

For example, the vibrating member 10 may be fixed to the lower case 104 with the first hole 12a as the fixing point 32 as shown in FIG. 3, and as shown in FIG. 4. The three holes 12c can be fixed to the lower case 104 using the fixing point 36.

On the other hand, the vibrating member 10 may be modified in the form shown in FIGS. 5 and 6. That is, the vibrating member 10 may be manufactured in a form in which a plurality of grooves 14 are formed on the side, and may be manufactured in a shape in which the grooves 16 are formed long along the longitudinal direction therein.

As described above, the vibrating member 10 of the form can be easily manufactured by press working, and the fixing point for the cases 102 and 104 can be easily changed.

The vibration element 20 may be fixed to the vibration member 10. For example, the vibrating element 20 may be attached to the vibrating member 10 by an adhesive. Here, the adhesive may be an epoxy resin material or a resin material cured by UV. In addition, the vibration element 20 may be fixed to the vibration member 10 in a mechanical structure. To this end, a receiving groove into which the vibrating element 20 may be fitted may be formed in the vibrating member 10. In addition, a protrusion for fixing the position of the vibration element 20 may be formed in the vibration member 10.

The vibrating element 20 may be a piezoelectric element that is free to contract and extend in accordance with an electrical signal. For example, the vibrating element 20 may be made of lead zirconium titanite ceramic (PZT). The vibrating element 20 configured as described above may contract and expand according to an electric signal and generate vibration in the vibrating member 10.

The vibrating element 20 may be formed long in the longitudinal direction of the vibrating member 10. In other words, the vibration element 20 may be disposed in the center of the vibration member 10 so as not to interfere with the vertical vibration of the vibration member 10. In addition, the vibrating element 20 may be shorter than the length of the vibrating member 10.

The present embodiment configured as described above may change the fixed point of the vibrating member 10 as described above. Here, since the change of the fixed point means a change in the length of the vibrating member 10 that can be substantially vibrated, it may mean that the substantial spring constant of the vibrating member 10 is changed.

(Where K is the spring constant of the vibration object (or vibration member), E is the elastic modulus of the vibration object, A is the cross section of the vibration object, and L is the length of the vibration object)

(Where K is the spring constant of the vibration object and M is the mass of the vibration object)

That is, the spring constant K of the vibrating member 10 is inversely proportional to the length of the vibrating member 10 (actually vibrating length-distance between fixed points) as shown in Equation (1).

Therefore, if the distance between the fixed points of the vibrating member 10 is increased (in the case of FIG. 4), the length of the portion vibrating substantially in the vibrating member 10 becomes long, so that the substantial spring constant of the vibrating member 10 ( K) (meaning the spring constant of the portion vibrating with respect to the fixed point in the vibration member 10) can be reduced, as well as the vibration frequency of the haptic feedback device 100 can be reduced (see Equation 2).

On the contrary, when the distance between the fixed points of the vibrating member 10 is reduced (in the case of FIG. 3), the length of the part vibrating substantially in the vibrating member 10 is shortened, so that the spring constant ( In addition to increasing K), the vibration frequency of the haptic feedback device 100 may be large.

Therefore, according to the present embodiment, when the vibration frequency of the manufactured haptic feedback device 100 is smaller or larger than the preset vibration frequency band, the fixed point of the vibration member 10 may be changed to determine the haptic feedback device 100. The vibration frequency may be changed to a preset vibration frequency band.

Next, a haptic feedback device according to a second embodiment of the present invention will be described with reference to FIGS. 7 to 9.

The haptic feedback device 100 according to the present embodiment may further include a plurality of mass members 40 and 50.

The vibration frequency of the haptic feedback device 100 may be lowered by increasing the mass of the vibration target as shown in Equation 2. Therefore, the vibration of the haptic feedback device 100 is added by adding the first mass member 40 to the vibrating member 10 or by adding the second mass member 50 to the first mass member 40. You can lower the frequency.

The present embodiment is to achieve this effect, it can provide a mass member capable of mass control.

The first mass member 40 according to the present embodiment may have a plurality of insertion holes 42. The insertion hole 42 may be formed along the longitudinal direction of the first mass member 40 (in the X-axis direction based on FIG. 7), and may have a size to which another mass may be fitted. That is, a plurality of second mass members 50 having a predetermined mass may be selectively inserted into the insertion hole 42.

Here, some of the second mass members 50 may be fitted from the beginning in the manufacturing process of the haptic feedback device 100, and others may be selectively fitted in the process of adjusting the vibration frequency of the haptic feedback device 100. Can be. In addition, the second mass member 50 fitted to the first mass member 40 may be selectively removed in the adjusting process of the vibration frequency of the haptic feedback device 100.

For example, when the vibration frequency of the haptic feedback device 100 is lower than the preset vibration frequency band, the second mass member 50 fitted to the first mass member 40 may be removed.

On the contrary, when the vibration frequency of the haptic feedback device 100 is higher than the preset vibration frequency band, the second mass member 50 of the insertion hole 42 of the first mass member 40 may be additionally inserted. .

Since the present embodiment configured as described above adjusts the vibration frequency of the haptic feedback device 100 by increasing or decreasing the mass of the mass member, it may be relatively easy to change the vibration frequency.

On the other hand, the coupling structure of the first mass member 40 and the second mass member 50 is the second mass member 50 in the vertical direction (Z-axis direction in Fig. 8) as shown in Figs. May be laminated or the second mass member 50 may be coupled in the longitudinal direction of the first mass member 40 (in the X-axis direction based on FIG. 9).

In the modified example of FIG. 8, the protrusion 44 may be formed on the first mass member 40, and the groove 52 may be formed on the second mass member 50. In the present modified example, the second mass member 50 may be laminated in the thickness direction of the first mass member 40 (the Z-axis direction in FIG. 8) by the coupling of the protrusions 44 and the grooves 52. Here, the protrusion 44 of the first mass member 40 may extend to a predetermined length so that a plurality of second mass members 50 may be stacked.

9, the grooves 46 may be formed in the first mass member 40, and the protrusions 54 and the grooves 56 may be formed in the second mass member 50. In the present modified example, the second mass member 50 may be connected in the longitudinal direction of the first mass member 40 (the X-axis direction based on FIG. 9) by the coupling of the groove 46 and the protrusion 54. Here, the second mass member 50 may be continuously connected as necessary.

Meanwhile, in the above-described embodiment, the second mass member 50 has been described as a solid shape having a considerable volume and mass, but may be a liquid material having a predetermined mass.

For example, the second mass member may be a curable resin or an adhesive that can be cured at room temperature. The second mass member of this type can be easily utilized to finely adjust the vibration frequency of the haptic feedback device.

Next, a haptic feedback device according to a third embodiment of the present invention will be described with reference to FIGS. 10 and 11.

The vibrating member 10 according to the present exemplary embodiment may include a first body 17 and a plurality of second bodies 18. In detail, the vibration member 10 may have a structure in which a plurality of second bodies 18 are formed at both ends of one first body 17.

The first body 17 may form a central portion of the vibrating member 10, and the second body 18 may form both end portions of the vibrating member 10.

Here, the second body 18 may be connected to the cases 102 and 104, and may have a plurality of holes 12 for this purpose (see FIG. 11). In addition, the plurality of second bodies 18 may be selectively connected to the cases 102 and 104. For example, one second body 18 of the three second bodies 18 is connected to the cases 102 and 104 or two second bodies 18 of the three second bodies 18 are connected. It may be connected to the cases 102 and 104. Alternatively, all three second bodies 18 may be connected to the cases 102 and 104.

Therefore, in the present embodiment, the spring constant of the vibrating member 10 may be adjusted by adjusting the number of the second bodies 18 connected to the cases 102 and 104.

For example, if the spring constant of the first body 17 is K1 and the spring constant of the second body 18 is K2, the spring constant K of the vibration member 10 may be expressed as Equation 3 below. Can be.

That is, the vibrating member 10 has a structure in which two first portions 10a consisting of one first body 17 and two second portions 10b having three second bodies 18 connected in parallel are connected in series. The spring constant K of the vibrating member 10 may be expressed as a force of K1 and K2.

Here, the spring constant of the second portion 10b increases and decreases according to the number of the second bodies 18 that are substantially connected to the cases 102 and 104, thereby reducing the spring constant K of the vibrating member 10. Can be increased or decreased. That is, in the present embodiment, the vibration frequency of the haptic feedback device 100 may be adjusted by changing the number of the second bodies 18 connected to the cases 102 and 104.

For example, when connecting the case (102, 104) and the left and right two second body 18, the spring constant (K) of the vibration member 10 can be expressed as shown in Equation 4. In this case, since the spring constant K of the vibration member 10 is smaller than the spring constant according to Equation 3, the vibration frequency of the haptic feedback device 100 can be lowered than in the case described above.

As another example, when connecting the case (102, 104) and the left and right one second body 18, the spring constant (K) of the vibration member 10 can be expressed as shown in Equation 5. In this case, since the spring constant K of the vibration member 10 is smaller than the spring constant according to Equation 4, the vibration frequency of the haptic feedback device 100 may be lower than that described above.

Therefore, according to the present exemplary embodiment, the vibration frequency of the haptic feedback device 100 may be easily adjusted by adjusting the number of the second bodies 18 connected to the cases 102 and 104.

10 and 11, three second bodies 18 are illustrated, but the number of second bodies 18 may be increased or decreased according to the size of the vibrating member 10. For reference, when the number of the second bodies 18 is large, the spring constant K of the vibrating member 10 can be adjusted more precisely.

A haptic feedback device according to a fourth embodiment of the present invention will be described with reference to FIGS. 12 and 13.

The haptic feedback device 100 according to the fourth embodiment may include a vibration member 10, a vibration element 20, a first mass member 40, an upper case 102 and a lower case 104. Additionally, the second mass member 50, the flexible substrate 70, and the plurality of buffer members 82, 84, and 86 may be further included.

The vibrating member 10 may include a first plate member 10a and a second plate member 10b.

The first plate 10a and the second plate 10b may extend in the first direction (X-axis direction based on FIG. 12). Here, the second plate (10b) may be formed on both sides with respect to the first plate (10a), bent in a second direction (Z-axis direction relative to Figure 12) with respect to the first plate (10a). Can be deployed. That is, the plane of the first plate 10a and the plane of the second plate 10b may be disposed vertically.

The vibrating member 10 formed as described above may be manufactured by pressing a single plate, and then bending the second plate 10b around the first plate 10a.

The first mass member 40 may be fixed to the vibrating member 10. In detail, the first mass member 40 may be mounted to the vibration member 10 via the second plate member 10b. In more detail, the first mass member 40 may be fixed to the vibrating member 10 via the second plate 10b.

The upper case 102 and the lower case 104 may have an accommodating space for accommodating the first mass member 40, and may be coupled to the first plate 10a. The coupling of the upper case 102 or the lower case 104 and the first plate 10a may be a fitting coupling by protrusions and grooves or a coupling by welding or adhesive.

Meanwhile, the upper case 102 may include a receiving groove 106 on one surface (the upper surface of FIG. 12). The receiving groove 106 may be formed in a shape that completely passes through the upper case 102. Accordingly, one surface (upper surface) of the first mass member 40 may communicate with the outside through the receiving groove 106, and the other member (eg, the second mass member 50) through the receiving groove 106. ) Can be combined.

The flexible substrate 70 may be connected to the vibration element 20, and may transmit an electrical signal to the vibration element 20. The coupling of the flexible substrate 70 and the vibrating element 20 may be made by a conductive adhesive. For example, the flexible substrate 70 may be coupled to the vibrating element 20 by an anisotropic conductive film (ACF).

The shock absorbing members 82, 84, and 86 may be formed on the vibration member 10, the first mass member 40, or the cases 102 and 104, and may absorb external shocks. Such buffer members 82, 84, 86 may be omitted or function as second mass members as necessary.

As shown in FIG. 13, the second mass member 50 may be formed in the first mass member 40 through the receiving groove 106. The second mass member 50 may be a liquid substance. In detail, the second mass member 50 may be a resin material cured at room temperature or an adhesive having an adhesive property. Since the second mass member 50 of the material may adjust the amount of adhesion in a relatively small mass unit, it may be easy to finely adjust the vibration frequency of the haptic feedback device 100.

Therefore, the present embodiment can be usefully used when precise adjustment of the vibration frequency is required or when the width of the desired vibration frequency band is very narrow.

The vibrating member 10 may have multiple welding points 90 as shown in FIG. 14. The plurality of welding points 90 can reduce or increase the substantial length of the vibrating member 10 to vibrate, thereby changing the vibration frequency of the haptic feedback device 100. Therefore, the haptic feedback device 100 according to the present exemplary embodiment may adjust the vibration frequency by changing the welding point 90 of the vibration member 10.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions And various modifications may be made.

100 haptic feedback device
102 Upper Case 104 Lower Case
10 vibrating members 12 holes
14 grooves 16 split grooves
20 vibration elements 30 fixed points
40 First mass member 42 Insertion hole
44 splice projections 46 splice grooves
50 Second Mass Member 70 Flexible Substrate
82, 84, 86 buffer member

Claims (7)

A piezoelectric element that is stretched and contracted according to the polarity of the applied voltage;
A vibration member coupled to the piezoelectric element to generate a displacement;
A mass member engaged with the vibration member;
A case accommodating the vibration member and the mass member; And
A first buffer member formed on the inner side of the mass member or the case to prevent collision between the mass member and the case;
Haptic feedback device comprising a. The method of claim 1,
The vibration member
A first plate member extending in the first direction; And
A pair of second plate members extending from both sides of the first plate member and bent in a second direction perpendicular to the first direction so as to be coupled to the mass member;
Haptic feedback device comprising a. The method of claim 1,
A second buffer member formed on the vibration member or the mass member to prevent collision between the vibration member and the mass member;
The haptic feedback device further comprising. The method according to claim 1 or 3,
A third buffer member formed at an inner lower portion of the vibration member or the case to prevent a collision between the vibration member and the case;
The haptic feedback device further comprising. A piezoelectric element that is stretched and contracted according to the polarity of the applied voltage;
A vibration member coupled to the piezoelectric element to generate a displacement;
A mass member engaged with the vibration member;
A case accommodating the vibration member and the mass member; And
A first buffer member formed on the vibration member or the mass member to prevent a collision between the vibration member and the mass member;
Haptic feedback device comprising a. The method of claim 5,
A second buffer member formed at an inner lower portion of the vibration member or the case to prevent a collision between the vibration member and the case;
The haptic feedback device further comprising. A piezoelectric element that is stretched and contracted according to the polarity of the applied voltage;
A vibration member coupled to the piezoelectric element to generate a displacement;
A mass member engaged with the vibration member;
A case accommodating the vibration member and the mass member; And
A first buffer member formed at an inner lower portion of the vibration member or the case to prevent a collision between the vibration member and the case;
Haptic feedback device comprising a.

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