KR20130052976A - Pcb assembly and mobile terminal having the same - Google Patents

Abstract

PURPOSE: A PCB assembly and a mobile terminal including the same are provided to improve reliability of an operation by making an electronic device overlap with a semiconductor package. CONSTITUTION: A semiconductor package(284,285) includes a solder ball. The solder ball is electrically connected to a semiconductor device. A PCB(283) mounts the semiconductor package. An electronic device(286) is mounted on the PCB. A part of the electronic device is covered with the semiconductor package.

Description

Printed circuit board assembly and mobile terminal having same {PCB ASSEMBLY AND MOBILE TERMINAL HAVING THE SAME}

The present invention relates to a mobile terminal on which a printed circuit board assembly is mounted.

The terminal can move And can be divided into a mobile / portable terminal and a stationary terminal depending on whether the mobile terminal is a mobile terminal or a mobile terminal. The mobile terminal can be divided into a handheld terminal and a vehicle mount terminal according to whether the user can directly carry the mobile terminal.

Such a terminal has various functions, for example, in the form of a multimedia device having multiple functions such as photographing and photographing of a moving picture, reproduction of a music or video file, reception of a game and broadcasting, etc. .

In order to support and increase the function of the terminal, the structural part and / or software part of the terminal may be improved. In particular, as an improvement of the structural part of the terminal, a method of increasing the mounting area in the printed circuit board assembly for controlling the functions of various terminals may be considered.

The present invention is to provide a new type of printed circuit board assembly that can be arranged adjacent to each other in a limited space.

In addition, the present invention is to provide a printed circuit board assembly and a mobile terminal having the same that can increase the mounting area of the printed circuit board more.

In order to solve the above problems, a mobile terminal according to an embodiment of the present invention, a printed circuit board assembly, the printed circuit board assembly, a semiconductor device and a solder ball electrically connected to the semiconductor device is provided. A semiconductor package, a printed circuit board on which the semiconductor package is mounted, and an electronic device mounted on the printed circuit board so as to be adjacent to the solder ball, and disposed to cover at least a portion of the semiconductor package.

As an example related to the present invention, the electronic device performs a function related to the semiconductor package.

The semiconductor package may be a Power Management Integrated Circuit (PMIC) chip, and the electronic device may be a decoupling device that reduces noise. The electronic device may be a debugging device used when debugging a function related to the semiconductor package.

As another example of the present invention, a signal processing element for processing a radio signal to be transmitted and received is mounted on the printed circuit board at a position spaced apart from the semiconductor package. The electronic device may be disposed in a gap formed between the semiconductor package and the printed circuit board.

As another example of the present disclosure, the printed circuit board may include a first region to which the solder ball is attached, and a portion of the printed circuit board to be covered by the semiconductor package together with the first region, wherein the electronic device is mounted. And a second region to be formed.

The second region may be formed in a loop shape to surround the first region. One surface of the semiconductor package may have a portion in which the solder ball is not disposed along an edge of the semiconductor package to correspond to a loop shape.

The second region may be formed adjacent to one edge of the first region.

The electronic device is attached to one surface of the printed circuit board through solder paste. The electronic device may have a height lower than that of the solder ball. The semiconductor package and the electronic device may be formed to be spaced apart from each other in the thickness direction of the printed circuit board.

As another example of the present invention, one surface of the printed circuit board is formed with a recess recessed toward the other surface, and the electronic device is accommodated in the groove. The electronic device may be mounted on the bottom of the groove, and at least a portion thereof may protrude out of the groove.

As another example of the present invention, the semiconductor package includes a first semiconductor package mounted on one surface of the printed circuit board and a second semiconductor package mounted on the other surface.

The electronic device may be disposed to be covered by any one of the first and second semiconductor packages, and may be electrically connected to the other to perform a function related to the other of the first and second semiconductor packages.

The present invention also provides a printed circuit board in which a plurality of semiconductor packages are spaced apart from each other, and mounted to the printed circuit board so as to perform a function related to at least one of the semiconductor packages, and in the thickness direction of the printed circuit board. Disclosed is a printed circuit board assembly comprising an electronic device disposed to overlap at least one.

The mobile terminal according to at least one embodiment of the present invention configured as described above may be disposed adjacent to the semiconductor package even in an integrated area as the electronic device overlaps the semiconductor package. Through this, while increasing the component mounting area of the printed circuit board, it is possible to ensure a higher reliability for the operation.

In addition, the present invention makes it possible to design various arrangements of various components by using the gap between the semiconductor package and the printed circuit board. Through this, the stacking of the electronic device and the semiconductor package proposed in the present invention can be applied to a production process of a finished product such as a mobile phone without significant change in equipment.

1 is a block diagram of a mobile terminal according to an embodiment of the present invention.
FIG. 2A is a perspective view of an example of a mobile terminal according to the present invention. FIG.
FIG. 2B is a rear perspective view of the mobile terminal shown in FIG. 2A. FIG.
3 is an exploded view of the mobile terminal of FIG. 2A viewed from the front;
4 is an exploded view of the printed circuit board assembly of FIG. 3.
5A is a plan view of the printed circuit board of FIG. 4.
FIG. 5B is a cross sectional view taken along the line VV of FIG. 3;
6 is a flowchart illustrating a manufacturing process of the printed circuit board assembly of FIG. 3.
7A and 7B illustrate variations of the printed circuit board assembly of FIG. 3.
8A and 8B are exploded views and cross-sectional views showing another embodiment of a printed circuit board assembly related to the present invention.
Figure 9 is a cross-sectional view showing another embodiment of a printed circuit board assembly related to the present invention.

Hereinafter, a mobile terminal related to the present invention will be described in detail with reference to the drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations. As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.

The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role.

The mobile terminal described in this specification may include a mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), and navigation. However, it will be understood by those skilled in the art that the configuration according to the embodiments described herein may be applied to a fixed terminal such as a digital TV, a desktop computer, and the like, unless the configuration is applicable only to a mobile terminal.

1 is a block diagram of a mobile terminal according to an embodiment of the present invention.

The mobile terminal 100 includes a wireless communication unit 110, an audio / video input unit 120, a user input unit 130, a sensing unit 140, an output unit 150, a memory 160, A controller 170, a controller 180, a power supply 190, and the like. The components shown in FIG. 1 are not essential, and a mobile terminal having more or fewer components may be implemented.

Hereinafter, the components will be described in order.

The wireless communication unit 110 may include one or more modules for enabling wireless communication between the mobile terminal 100 and the wireless communication system or between the mobile terminal 100 and the network in which the mobile terminal 100 is located. For example, the wireless communication unit 110 may include a broadcast receiving module 111, a mobile communication module 112, a wireless Internet module 113, a short range communication module 114, and a location information module 115 .

The broadcast receiving module 111 receives a broadcast signal and / or broadcast related information from an external broadcast management server through a broadcast channel.

The broadcast channel may include a satellite channel and a terrestrial channel. The broadcast management server may refer to a server for generating and transmitting broadcast signals and / or broadcast related information, or a server for receiving broadcast signals and / or broadcast related information generated by the broadcast management server and transmitting the generated broadcast signals and / or broadcast related information. The broadcast signal may include a TV broadcast signal, a radio broadcast signal, a data broadcast signal, and a broadcast signal in which a data broadcast signal is combined with a TV broadcast signal or a radio broadcast signal.

The broadcast-related information may refer to a broadcast channel, a broadcast program, or information related to a broadcast service provider. The broadcast related information may also be provided through a mobile communication network. In this case, it may be received by the mobile communication module 112.

The broadcast related information may exist in various forms. For example, it may exist in the form of Electronic Program Guide (EPG) of Digital Multimedia Broadcasting (DMB) or Electronic Service Guide (ESG) of Digital Video Broadcast-Handheld (DVB-H).

For example, the broadcast receiving module 111 may be a Digital Multimedia Broadcasting-Terrestrial (DMB-T), a Digital Multimedia Broadcasting-Satellite (DMB-S), a Media Forward Link Only And a Digital Broadcasting System (ISDB-T) (Integrated Services Digital Broadcast-Terrestrial). Of course, the broadcast receiving module 111 may be adapted to other broadcasting systems as well as the digital broadcasting system described above.

The broadcast signal and / or broadcast related information received through the broadcast receiving module 111 may be stored in the memory 160.

The mobile communication module 112 transmits and receives radio signals to at least one of a base station, an external terminal, and a server on a mobile communication network. The wireless signal may include various types of data depending on a voice call signal, a video call signal or a text / multimedia message transmission / reception.

The wireless Internet module 113 is a module for wireless Internet access, and may be built in or externally attached to the mobile terminal 100. Wireless Internet technologies may include Wireless LAN (Wi-Fi), Wireless Broadband (Wibro), World Interoperability for Microwave Access (Wimax), High Speed Downlink Packet Access (HSDPA), and the like.

The short range communication module 114 refers to a module for short range communication. Bluetooth, Radio Frequency Identification (RFID), infrared data association (IrDA), Ultra Wideband (UWB), ZigBee, and the like can be used as a short range communication technology.

The position information module 115 is a module for obtaining the position of the mobile terminal, and a representative example thereof is a Global Position System (GPS) module.

Referring to FIG. 1, an A / V (Audio / Video) input unit 120 is for inputting an audio signal or a video signal, and may include a camera 121 and a microphone 122. The camera 121 processes image frames such as still images or moving images obtained by the image sensor in the video call mode or the photographing mode. The processed image frame can be displayed on the display unit 151. [

The image frame processed by the camera 121 may be stored in the memory 160 or transmitted to the outside through the wireless communication unit 110. [ Two or more cameras 121 may be provided depending on the use environment.

The microphone 122 receives an external sound signal through a microphone in a communication mode, a recording mode, a voice recognition mode, or the like, and processes it as electrical voice data. The processed voice data can be converted into a form that can be transmitted to the mobile communication base station through the mobile communication module 112 when the voice data is in the call mode, and output. Various noise reduction algorithms may be implemented in the microphone 122 to remove noise generated in receiving an external sound signal.

The user input unit 130 generates input data for a user to control the operation of the terminal. The user input unit 130 may include a key pad dome switch, a touch pad (static pressure / capacitance), a jog wheel, a jog switch, and the like.

The sensing unit 140 senses the current state of the mobile terminal 100 such as the open / close state of the mobile terminal 100, the position of the mobile terminal 100, the presence or absence of user contact, the orientation of the mobile terminal, And generates a sensing signal for controlling the operation of the mobile terminal 100. For example, when the mobile terminal 100 is in the form of a slide phone, it may sense whether the slide phone is opened or closed. In addition, whether the power supply unit 190 is supplied with power, whether the interface unit 170 is coupled to the external device may be sensed. Meanwhile, the sensing unit 140 may include a proximity sensor 141.

The output unit 150 is for generating output related to the visual, auditory or tactile sense and includes a display unit 151, an audio output module 152, an alarm unit 153, and a haptic module 154 .

The display unit 151 displays (outputs) information processed by the mobile terminal 100. For example, when the mobile terminal is in the call mode, a UI (User Interface) or a GUI (Graphic User Interface) associated with a call is displayed. When the mobile terminal 100 is in the video communication mode or the photographing mode, the photographed and / or received video or UI and GUI are displayed.

The display unit 151 is a liquid crystal display (LCD), a thin film transistor-liquid crystal display (TFT LCD), an organic light-emitting diode (OLED), a flexible display (flexible) and at least one of a 3D display.

Some of these displays may be transparent or light transmissive so that they can be seen through. This can be referred to as a transparent display, and a typical example of the transparent display is TOLED (Transparent OLED) and the like. The rear structure of the display unit 151 may also be of a light transmission type. With this structure, the user can see an object located behind the terminal body through the area occupied by the display unit 151 of the terminal body.

There may be two or more display units 151 according to the embodiment of the mobile terminal 100. For example, in the mobile terminal 100, a plurality of display portions may be spaced apart from one another, or may be disposed integrally with one another, and may be disposed on different surfaces, respectively.

When the display unit 151 and a sensor for detecting a touch operation (hereinafter, referred to as a touch sensor) form a mutual layer structure (hereinafter referred to as a touch screen), the display unit 151 may be configured in addition to an output device. Can also be used as an input device. The touch sensor may have the form of, for example, a touch film, a touch sheet, a touch pad, or the like.

The touch sensor may be configured to convert a change in a pressure applied to a specific portion of the display unit 151 or a capacitance generated in a specific portion of the display unit 151 into an electrical input signal. The touch sensor can be configured to detect not only the position and area to be touched but also the pressure at the time of touch.

If there is a touch input to the touch sensor, the corresponding signal (s) is sent to the touch controller. The touch controller processes the signal (s) and transmits the corresponding data to the controller 180. As a result, the controller 180 can know which area of the display unit 151 is touched.

Referring to FIG. 1, a proximity sensor 141 may be disposed in an inner region of the mobile terminal or in the vicinity of the touch screen, which is surrounded by the touch screen. The proximity sensor refers to a sensor that detects the presence or absence of an object approaching a predetermined detection surface or a nearby object without mechanical contact using the force of an electromagnetic field or infrared rays. The proximity sensor has a longer life span than the contact sensor and its utilization is also high.

Examples of the proximity sensor include a transmission photoelectric sensor, a direct reflection photoelectric sensor, a mirror reflection photoelectric sensor, a high frequency oscillation proximity sensor, a capacitive proximity sensor, a magnetic proximity sensor, and an infrared proximity sensor. And to detect the proximity of the pointer by the change of the electric field along the proximity of the pointer when the touch screen is electrostatic. In this case, the touch screen (touch sensor) may be classified as a proximity sensor.

Hereinafter, for convenience of explanation, the act of allowing the pointer to be recognized without being in contact with the touch screen so that the pointer is located on the touch screen is referred to as a "proximity touch", and the touch The act of actually touching the pointer on the screen is called "contact touch." The position where the pointer is proximately touched on the touch screen means a position where the pointer is vertically corresponding to the touch screen when the pointer is touched.

The proximity sensor detects a proximity touch and a proximity touch pattern (e.g., a proximity touch distance, a proximity touch direction, a proximity touch speed, a proximity touch time, a proximity touch position, a proximity touch movement state, and the like). Information corresponding to the detected proximity touch operation and the proximity touch pattern may be output on the touch screen.

The sound output module 152 may output audio data received from the wireless communication unit 110 or stored in the memory 160 in a call signal reception, a call mode or a recording mode, a voice recognition mode, a broadcast reception mode, and the like. The sound output module 152 also outputs sound signals related to functions (e.g., call signal reception sound, message reception sound, etc.) performed in the mobile terminal 100. [ The audio output module 152 may include a receiver, a speaker, a buzzer, and the like.

The alarm unit 153 outputs a signal for notifying the occurrence of an event of the mobile terminal 100. Examples of events that occur in the mobile terminal include call signal reception, message reception, key signal input, touch input, and the like. The alarm unit 153 may output a signal for notifying the occurrence of an event in a form other than the video signal or the audio signal, for example, vibration. The video signal or the audio signal may be output through the display unit 151 or the audio output module 152 so that they may be classified as a part of the alarm unit 153.

The haptic module 154 generates various tactile effects that the user can feel. A typical example of the haptic effect generated by the haptic module 154 is vibration. The intensity and pattern of vibration generated by the haptic module 154 can be controlled. For example, different vibrations may be synthesized and output or sequentially output.

In addition to vibration, the haptic module 154 may be configured to provide a pin array that vertically moves with respect to the contact skin surface, a jetting force or suction force of air through an injection or inlet port, grazing to the skin surface, contact of an electrode, electrostatic force, and the like. Various tactile effects can be generated, such as effects by the endothermic and the reproduction of a sense of cold using the elements capable of endotherm or heat generation.

The haptic module 154 can be implemented not only to transmit the tactile effect through the direct contact but also to allow the user to feel the tactile effect through the muscular sensation of the finger or arm. The haptic module 154 may include two or more haptic modules 154 according to the configuration of the portable terminal 100.

The memory 160 may store a program for the operation of the controller 180 and temporarily store input / output data (e.g., a phone book, a message, a still image, a moving picture, etc.). The memory 160 may store data on vibration and sound of various patterns outputted when a touch is input on the touch screen.

The memory 160 may be a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (for example, SD or XD memory), a RAM (Random Access Memory), SRAM (Static Random Access Memory), ROM (Read Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), PROM A disk, and / or an optical disk. The mobile terminal 100 may operate in association with a web storage that performs a storage function of the memory 160 on the Internet.

The interface unit 170 serves as a path for communication with all external devices connected to the mobile terminal 100. The interface unit 170 receives data from an external device or supplies power to each component in the mobile terminal 100 or transmits data to the external device. For example, a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device having an identification module, an audio I / O port, A video input / output (I / O) port, an earphone port, and the like may be included in the interface unit 170.

The identification module is a chip for storing various information for authenticating the use right of the mobile terminal 100 and includes a user identification module (UIM), a subscriber identity module (SIM), a general user authentication module A Universal Subscriber Identity Module (USIM), and the like. Devices with identification modules (hereinafter referred to as "identification devices") can be manufactured in a smart card format. Accordingly, the identification device can be connected to the terminal 100 through the port.

The interface unit may be a passage through which power from the cradle is supplied to the mobile terminal 100 when the mobile terminal 100 is connected to an external cradle, or various command signals input from the cradle by a user may be transferred. It may be a passage that is delivered to the terminal. The various command signals or the power source input from the cradle may be operated as a signal for recognizing that the mobile terminal is correctly mounted on the cradle.

The controller 180 typically controls the overall operation of the mobile terminal. For example, voice communication, data communication, video communication, and the like. The control unit 180 may include a multimedia module 181 for multimedia playback. The multimedia module 181 may be implemented in the control unit 180 or may be implemented separately from the control unit 180. [

The controller 180 may perform a pattern recognition process for recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 190 receives an external power source and an internal power source under the control of the controller 180 to supply power for operation of each component.

The various embodiments described herein may be embodied in a recording medium readable by a computer or similar device using, for example, software, hardware, or a combination thereof.

According to a hardware implementation, the embodiments described herein include application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), and the like. It may be implemented using at least one of processors, controllers, micro-controllers, microprocessors, and electrical units for performing other functions. The described embodiments may be implemented by the controller 180 itself.

According to the software implementation, embodiments such as the procedures and functions described herein may be implemented as separate software modules. Each of the software modules may perform one or more of the functions and operations described herein. Software code can be implemented in a software application written in a suitable programming language. The software code is stored in the memory 160 and can be executed by the control unit 180. [

2A is a front perspective view of an example of a mobile terminal according to the present invention, and FIG. 2B is a rear perspective view of the mobile terminal shown in FIG. 2A.

The disclosed mobile terminal 200 has a terminal body in the form of a bar. However, the present invention is not limited thereto, and can be applied to various structures such as a slide type, a folder type, a swing type, and a swivel type in which two or more bodies are relatively movably coupled.

The body includes a case (a casing, a housing, a cover, and the like) which forms an appearance. In this embodiment, the case may be divided into a front case 201 and a rear case 202. [ Various electronic components are embedded in the space formed between the front case 201 and the rear case 202. At least one intermediate case may be additionally disposed between the front case 201 and the rear case 202. [

The cases may be formed by injecting synthetic resin or may be formed of a metal material, for example, a metal material such as stainless steel (STS) or titanium (Ti).

The display unit 251, the audio output module 260, the camera 221, and the user input units 231 and 232 may be disposed in the terminal body, mainly the front case 201.

The display unit 251 occupies most of the main surface of the front case 201. The sound output module 260 and the camera 221 are disposed in an area adjacent to one end of both ends of the display unit 251.

The display unit 251 may display various types of visual information. These pieces of information can be displayed in the form of letters, numbers, symbols, graphics, or icons.

At least one of the letters, numbers, symbols, graphics, or icons may be displayed in a predetermined arrangement for inputting such information, thereby being implemented as a keypad. Such a keypad may be called a so-called " soft key ".

The display unit 251 may operate in an entire area or may be divided into a plurality of areas. In the latter case, the plurality of areas can be configured to operate in association with each other.

The user input unit 230 is manipulated to receive a command for controlling the operation of the mobile terminal 200, and may include a plurality of manipulation units 231 and 232. The operation units 231 and 232 may be collectively referred to as a manipulating portion and may be employed in any manner as long as the user operates in a tactile manner.

The content input by the first and second manipulation units 231 and 232 may be variously set. For example, the first operation unit 231 receives a command such as start, end, scroll, and the like, and is disposed in an area adjacent to an end of the display unit 251 that is different from an end at which the sound output module 260 is disposed. do.

The second operation unit 232 is configured to receive a command such as adjusting the volume of the sound output from the sound output module 260 or switching to the touch recognition mode of the display unit 251.

Referring to FIG. 2B, a camera 221 ′ may be additionally mounted on the rear of the terminal body, that is, the rear case 202. The camera 221 ′ has a photographing direction substantially opposite to the camera 221 (see FIG. 2A), and may be a camera having different pixels from the camera 221.

For example, the camera 221 has a low pixel so that it is easy to capture a face of a user in the case of a video call or the like and transmits the face to the other party, and the camera 221 ' It is preferable to have a large number of pixels. The cameras 221 and 221 'may be installed in the terminal body to be rotatable or pop-up.

A flash 223 and a mirror 224 may be further disposed adjacent to the camera 221 ′. The flash 223 illuminates the subject when the subject is photographed by the camera 221 '. The mirror 224 allows the user to see his / her face or the like when the user wishes to photograph (self-photograph) the user using the camera 221 '.

The sound output module may be additionally disposed at the rear of the terminal body. The sound output module may implement a stereo function together with the sound output module 260 of the front case (see FIG. 2A), and may be used to implement a speakerphone mode during a call.

The antenna for receiving a broadcast signal may be additionally disposed on the side of the terminal body. An antenna constituting a part of the broadcast receiving module 111 (see FIG. 1) can be installed to be able to be drawn out from the terminal body.

Referring to this figure, the terminal body may be provided with a microphone 222, an interface 270, and the like. The microphone 222 is disposed in an area adjacent to one end and the other end where the sound output module 260 is disposed in the display unit.

Side surfaces of the front case 201 and the rear case 202 may include a user input unit 232 and a connection port 270.

The connection port 270 receives data from an external device, receives power, transfers the power to each component inside the mobile terminal 200, or transmits data inside the mobile terminal 200 to an external device. The connection port 270 may be configured as an example of the interface 170 (refer to FIG. 1). The connection port may be, for example, a wired / wireless headset port and a wired / wireless data port.

The terminal body is equipped with a power supply unit 290 for supplying power to the mobile terminal 200. The power supply unit 290 may be built in the terminal body or may be detachable from the outside of the terminal body.

Each component of the terminal described above is controlled by a printed circuit board assembly. Hereinafter, a structure of a printed circuit board assembly capable of maintaining a high reliability for the control even in a limited area will be described in more detail.

3 is an exploded view of the mobile terminal of FIG. 2A viewed from the front;

Referring to FIG. 3, a window 251b is coupled to one surface of the front case 201. The window 251b is made of a material through which light can pass, for example, a transparent synthetic resin, tempered glass, and the like. However, the window 251 b may include a portion through which light cannot pass. As shown in the drawing, a portion of the light that cannot transmit may be implemented by separately covering the window with the pattern film. The pattern film may be made so that the center is transparent and the edge is opaque.

The display 251a may be mounted on the rear of the window 251b. A portion of the window 251b through which light is transmitted may have an area corresponding to the display 251a. Through this, the user can externally recognize visual information output from the display 251a.

The rear case 202 may be equipped with first and second printed circuit board assemblies 281 and 282. The first and second printed circuit board assemblies 281 and 282 may be configured as an example of the controller 180 (see FIG. 1) for operating various functions of the mobile terminal. In this embodiment, the printed circuit board assembly is provided with a plurality, but the present invention is not limited thereto. That is, the printed circuit board assembly may be provided as one.

As illustrated, the display 251a, the audio output device 262, the camera 221, and the like may be mounted on the first printed circuit board assembly 281. The sound output element 262 may be, for example, a speaker or a receiver.

The second printed circuit board assembly 282 is electrically connected to the first printed circuit board assembly 281 together with the first printed circuit board assembly 281 to operate various functions of the mobile terminal.

At least one of the first and second printed circuit board assemblies 281 and 282 may be provided with a mechanism capable of arranging adjacent components in a confined space.

Hereinafter, the second printed circuit board assembly 282 (hereinafter referred to as a "printed circuit board assembly") will be described in more detail with respect to the above mechanism.

4 is an exploded view of the printed circuit board assembly of FIG. 3, FIG. 5A is a plan view of the printed circuit board of FIG. 4, FIG. 5B is a cross-sectional view taken along the line VV of FIG. 3, and FIG. 6 is the printing of FIG. 3. It is a flowchart which shows the manufacturing process of a circuit board assembly.

4 and 5B, the printed circuit board assembly 282 includes a printed circuit board 283, semiconductor packages 284 and 285, and an electronic device 286.

The printed circuit board 283 means an insulating member on which a circuit pattern is formed, and may be formed of a plurality of layers. On each side of the printed circuit board 283, semiconductor packages 284 and 285 and electronic elements 286 are mounted.

More specifically, a plurality of semiconductor packages 284 and 285 are mounted on one surface of the printed circuit board 283 and spaced apart from each other, and the electronic device 286 is associated with at least one of the semiconductor packages 284 and 285. It can be a device that performs a function. For example, the first and second semiconductor packages 284 and 285 may be mounted on the printed circuit board 283, and the electronic device 286 may be a device that performs a function related to the first semiconductor package 284. have.

As an example of such a configuration, the first semiconductor package 284 may be a power management integrated circuit (PMIC) chip, and the electronic device 286 may be a decoupling device that reduces noise. However, the present invention is not limited thereto, and the semiconductor package 284 may be a memory, an application processor (AP), or the like, and the electronic device 286 may be a resistor, a capacitor, an inductor, or the like.

In this case, the second semiconductor package 285 may be a signal processing element for processing a radio signal to be transmitted and received. To this end, the printed circuit board assembly may be electrically connected to an antenna unit (not shown) for transmitting and receiving the wireless signal.

As illustrated, the electronic device 286 is disposed to overlap the first semiconductor package 284 in the thickness direction of the printed circuit board 283. For example, the electronic device 286 is disposed in a gap formed between the first semiconductor package 284 and the printed circuit board 283. That is, the electronic device 286 is shadow mounted by the first semiconductor package 284.

More specifically, the first semiconductor package 284 includes a semiconductor device 284a, an insulating member 284b, and a solder ball 284c.

The semiconductor element 284a is mounted on one surface of the insulating member 284b, the solder ball 284c is mounted on the other surface of the insulating member 284b, and the semiconductor element 284a and the solder ball 284c are electrically connected to each other by wire bonding. Is connected. However, the present invention is not limited to the structure of the disclosed semiconductor package, and various semiconductor packages, such as a form in which semiconductor elements are embedded in an insulating member, may be applied.

4, 5A, and 5B, the printed circuit board 283 includes first and second regions 283a and 283b.

The first region 283a is a region to which the solder balls 284c are attached and may be a portion defined by the second region 283b. The second region 283b, together with the first region 283a, partitions a portion of the printed circuit board 283 covered by the first semiconductor package 284.

The electronic device 286 is mounted on the printed circuit board 283 to be adjacent to the solder ball 284c. More specifically, the electronic device 286 is disposed in the second region 283b. For this purpose, the solder balls 284c may be concentrated on the center portion of the semiconductor package. That is, a portion in which the solder ball 284c is not disposed along the edge of the semiconductor package is formed. In addition, the electronic device 286 may be disposed adjacent to other adjacent electronic devices. For example, electronic devices may be disposed within 0.5 to 1.2 mm of each other, thereby effectively exhibiting noise reduction.

That is, despite the high density circuit, the noise attenuation passive element may be disposed in close proximity to the semiconductor package, and further, the path for generating the noise may be shortened.

Referring to FIG. 4, the second region 283b is formed in a loop shape to surround the first region 283a, and a portion 284d in which the solder ball 284c is not disposed corresponds to the loop shape. Is done.

Referring to FIG. 5B, the electronic device 286 has a height lower than that of the solder ball 284c. As a result, the first semiconductor package 284 and the electronic device 286 are formed to be spaced apart from each other in the thickness direction of the printed circuit board 283. That is, the surfaces of the insulating member 284b and the electronic element 286 facing each other (the lower surface of the insulating member and the upper surface of the electronic element) are spaced apart from each other.

According to the figure, the electronic device 286 is attached to one surface of the printed circuit board 283 through the solder paste 287a. More specifically, the conductive pad 287b is formed in the second region 283b, and the electronic device 286 and the conductive pad 287b are coupled to each other by the solder paste 287a. The conductive pad 287b may be formed of a material such as copper, gold, and silver.

The viscosity of the solder paste 287a may be higher than in the case where there is no contact, in case the electronic device 286 and the first semiconductor package 284 are in contact with each other. For example, the viscosity may be about 200 to 215 pa.s, whereby the reliability of adhesion may be secured even when the height of the electronic device 286 is higher than the solder ball 284c.

Referring to FIG. 6, the printed circuit board assembly may be implemented according to the following manufacturing process.

First, a portion of the printed circuit board on which the semiconductor package is to be mounted is divided into first and second regions, and conductive pads to be coupled with solder balls of the semiconductor package are disposed in the first region, and conductive parts to be coupled to the electronic device are formed in the second region. Place the pad (S100).

The first region corresponds to a portion where solder balls are disposed in the semiconductor package, and the second region corresponds to a portion where the solder balls are not disposed.

Next, the electronic device and the conductive pad of the second area are coupled to attach the electronic device to the second area (S200). Thereafter, after the operation of the electronic device is inspected (S300), the solder balls of the semiconductor package are coupled to the conductive pads of the first region such that the semiconductor package covers the electronic device (S400). Finally, the operation of the semiconductor package and the electronic device is inspected (S500).

According to the manufacturing process, the addition of only one inspection process can be detected before the product completion failure, no separate equipment is required.

In addition, the electronic device may be a debugging device used when debugging a function related to a semiconductor package. After a printed circuit board assembly is completed without mounting an electronic device in the manufacturing process, debugging may be necessary. At this time, the second area becomes a space for mounting the debugging element later.

In addition, the compartments of the first and second regions can be modified in various forms. 7A and 7B are modifications of the printed circuit board assembly of FIG. 3.

In the following modifications or embodiments, the same or similar reference numerals are assigned to the same or similar components as the foregoing examples, and the description is replaced with the first description.

Referring to FIG. 7A, the second region 383b may be formed adjacent to one edge of the first region 383a. That is, the first and second regions 383a and 383b are formed to partition portions occupied by the semiconductor package on both sides, and the second region 383b is formed to have a smaller area than the first region 383a.

In this case, the solder balls of the semiconductor package are disposed to be oriented to one side from the bottom surface of the semiconductor package, and the electronic device may be mounted only near one edge of the semiconductor package. If the second area 383b is larger, the ball size and pitch of the solder ball should be smaller, but the design freedom of the semiconductor package may be improved by minimizing the second area 383b.

Referring to FIG. 7B, the first region 383a has a loop shape, and the second region 483b is disposed inside the loop. That is, the first region 383a is formed along the edge of the semiconductor package to surround the second region 383b.

In this case, since the electronic device is surrounded by the solder ball, the inflow of foreign matters toward the electronic device is more advantageous.

8A and 8B are exploded views and cross-sectional views showing another embodiment of a printed circuit board assembly related to the present invention.

Referring to the drawings, a groove 588 recessed toward the other surface is formed in one surface of the printed circuit board 583, and the electronic device 586 is accommodated in the groove 588. For example, the semiconductor package 584 may cover at least a portion of the groove 588, and the electronic device 586 may be in a portion of the groove 588 covered by the semiconductor package 584. Is placed.

More specifically, the printed circuit board 583 is formed so that a plurality of layers 583a, 583b, 583c, 583d, and 583e are stacked, and the grooves 588 are formed of the plurality of layers 583a, 583b, 583c, 583d, and 583e. It is formed to penetrate some of the). More specifically, the plurality of layers 583a, 583b, 583c, 583d, and 583e include insulating layers 583a, 583c, and 583e and printed layers 583b and 583d, which are sequentially stacked, and the grooves 588. One of the printed layers 583b and 583d is disposed at the bottom of the substrate.

The grooves 588 may be formed by laser cutting or the like, but may be formed by leaving portions corresponding to the grooves 588 in the manufacture of the printed circuit board 583. According to this method, the manufacturing of the printed circuit board may be easier and the unit cost may be lowered.

A conductive pad 587b is formed in the groove 588, and an electronic device 586 is mounted on the pad. At least a portion of the electronic device 586 may protrude to the outside of the groove 588. Accordingly, even when the height of the electronic device 586 is higher than the solder ball 584c, the electronic device 586 and the semiconductor package 584 may overlap. In this example, the electronic device 586 may be a semiconductor package.

According to the figure, a shield member 589 may be mounted on the printed circuit board 583. The shield member 589 includes a fastening protrusion 589a protruding from the outer circumferential surface, and the fastening protrusion 589a may be inserted into the groove 588. Movement of the shield member 589 may be restricted by the mutual relationship between the fastening protrusion 589a and the groove 588.

9 is a cross-sectional view showing still another embodiment of a printed circuit board assembly according to the present invention.

According to an embodiment, the semiconductor package includes a first semiconductor package 684 mounted on one surface of the printed circuit board 683 and a second semiconductor package 685a mounted on the other surface.

The electronic device 686 is disposed to be covered by one of the first and second semiconductor packages 684 and 685a and performs a function related to the other of the first and second semiconductor packages 684 and 685a. Is electrically connected to the other one in order to.

More specifically, in the case where the electronic device cannot be inserted between the second semiconductor package 685a and the printed circuit board 683, electrons are formed between the first semiconductor package 684 and the printed circuit board 683. The device 586 may be disposed to be electrically connected to the second semiconductor package 685a. A via hole may be formed in the printed circuit board 683 to connect the electronic device 586 and the second semiconductor package 685a.

Alternatively, the connection between the electronic device 586 and the second semiconductor package 685a may be implemented by a circuit pattern in the printed circuit board. In this example, the first and second semiconductor packages 684 and 685a are mounted on both sides of the printed circuit board 683, respectively. Applicable even when placed together.

According to the above configuration, the degree of freedom of design for mounting components on a printed circuit board can be further improved.

The mobile terminal described above can be applied to not only the configuration and method of the embodiments described above but also all or some of the embodiments may be selectively combined so that various modifications may be made to the embodiments It is possible.

Claims (20)

A semiconductor package having a semiconductor device and solder balls electrically connected to the semiconductor device;
A printed circuit board on which the semiconductor package is mounted; And
And an electronic device mounted on the printed circuit board so as to be adjacent to the solder balls, and disposed to cover at least a portion of the solder ball by the semiconductor package. The method of claim 1,
The printed circuit board,
A first region to which the solder ball is attached; And
A printed circuit board assembly comprising a second region in which a portion of the semiconductor package is covered by the semiconductor package together with the first region. The method of claim 2,
The second region is a printed circuit board assembly, characterized in that formed in a loop shape to surround the first region. The method of claim 3,
Printed circuit board assembly, characterized in that the one side of the semiconductor package is formed with the solder ball is not disposed along the edge of the semiconductor package to correspond to the loop shape. The method of claim 2,
The second region is a printed circuit board assembly, characterized in that formed adjacent to one corner of the first region. The method of claim 1,
The electronic device is a printed circuit board assembly, characterized in that attached to one surface of the printed circuit board through a solder paste. The method of claim 1,
The electronic device is a printed circuit board assembly, characterized in that the height is lower than the solder ball. The method of claim 1,
The semiconductor package and the electronic device is a printed circuit board assembly, characterized in that formed to be spaced apart from each other in the thickness direction of the printed circuit board. The method of claim 1,
Printed circuit board assembly, characterized in that a groove is formed in one surface of the printed circuit board is recessed toward the other surface, the electronic element is accommodated in the groove. 10. The method of claim 9,
The electronic device is mounted on the bottom of the groove, at least a portion of the printed circuit board assembly characterized in that protruding to the outside of the groove. The method of claim 1,
The semiconductor package includes a first semiconductor package mounted on one side of the printed circuit board and a second semiconductor package mounted on the other side. The method of claim 11,
The electronic device is disposed to be covered by any one of the first and second semiconductor packages, and is electrically connected to the other one to perform a function related to the other one of the first and second semiconductor packages. Printed circuit board assembly. A printed circuit board on which a plurality of semiconductor packages are mounted to be spaced apart from each other; And
And an electronic device mounted on the printed circuit board to perform a function related to at least one of the semiconductor packages, and disposed to overlap the at least one in the thickness direction of the printed circuit board. The method of claim 11,
Each of the semiconductor packages may include a semiconductor device; A solder ball electrically connected to the semiconductor device;
The printed circuit board,
A first region to which the solder ball is attached; And
A printed circuit board assembly comprising a second area in which a portion covered by the at least one is defined together with the first area and on which the electronic device is mounted. In a mobile terminal having a printed circuit board assembly,
The printed circuit board assembly,
A semiconductor element; A semiconductor package having solder balls electrically connected to the semiconductor devices;
A printed circuit board on which the semiconductor package is mounted; And
And an electronic device mounted on the printed circuit board so as to be adjacent to the solder ball, and disposed to cover at least a portion of the solder ball by the semiconductor package. 16. The method of claim 15,
The electronic device performs a function related to the semiconductor package. 17. The method of claim 16,
The semiconductor package is a Power Management Integrated Circuit (PMIC) chip, and the electronic device is a mobile terminal, characterized in that the decoupling device to attenuate noise. 17. The method of claim 16,
The electronic device is a mobile terminal, characterized in that the debugging device used when debugging a function associated with the semiconductor package. 16. The method of claim 15,
And a signal processing element for processing a radio signal to be transmitted and received on the printed circuit board at a position spaced apart from the semiconductor package. 16. The method of claim 15,
The electronic device is a mobile terminal, characterized in that disposed in the gap formed between the semiconductor package and the printed circuit board.

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