KR20130034127A - A wafer notch wheel and an apparatus for grinding a wafer notch - Google Patents

A wafer notch wheel and an apparatus for grinding a wafer notch Download PDF

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Publication number
KR20130034127A
KR20130034127A KR1020110097987A KR20110097987A KR20130034127A KR 20130034127 A KR20130034127 A KR 20130034127A KR 1020110097987 A KR1020110097987 A KR 1020110097987A KR 20110097987 A KR20110097987 A KR 20110097987A KR 20130034127 A KR20130034127 A KR 20130034127A
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KR
South Korea
Prior art keywords
wheel
notch
grinding
unit
coupling protrusion
Prior art date
Application number
KR1020110097987A
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Korean (ko)
Inventor
안진우
배재현
Original Assignee
주식회사 엘지실트론
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Publication date
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Priority to KR1020110097987A priority Critical patent/KR20130034127A/en
Publication of KR20130034127A publication Critical patent/KR20130034127A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The embodiment includes a plurality of unit wheels having a body, a coupling protrusion provided at one end of the body, and a coupling to be inserted into the coupling protrusion and processing a notch of a wafer, and coupled to one end of the coupling protrusion. And a coupling fixing portion for fixing unit wheels to the coupling protrusion.

Description

A wafer notch wheel and an apparatus for grinding a wafer notch}

Embodiments relate to a grinding apparatus and a wafer notch wheel.

Notches are processed to indicate crystal orientation and dopant type on the silicon wafer. Generally, the notch of the silicon wafer is processed by the notch wheel included in the grinding apparatus. The notch wheel may include a notch wheel body capable of rotating the notch wheel in combination with the driving unit and a notch processing unit for processing the notch of the wafer.

12 shows the notch 1 and the round part 2 of the wafer. With reference to FIG. 12, the notch wheel can grind or rough the notch 1 and round portion 2 of the wafer.

Wafer notching may be performed through a roughing process using a notch processing part of 800 mesh and a grinding process using a notch processing part of 2000 mesh. In general, the notch wheel includes a notch processing part having different meshes, and the roughing process and the grinding process are performed in two steps. Typical notch wheels should be replaced when the notch wheels for grinding or part of the grinding notches are worn or deformed and can no longer be used.

The embodiment provides a notch wheel and grinding device that can replace only a worn, deformed or damaged unit wheel, various types of wafer notch processing, and implement various product specifications in a single device.

The notch wheel according to the embodiment has a body, a coupling protrusion provided at one end of the body, a plurality of unit wheels having a groove (groove) inserted into the coupling protrusion and processing the notch of the wafer, and one end of the coupling protrusion and And a coupling fixing portion for coupling the plurality of unit wheels to the coupling protrusion.

Each of the plurality of unit wheels may be detachable from the coupling protrusion. The coupling protrusion may have a polyhedron shape having a polygonal cross section. The coupling protrusion may be a polyhedron having a cross section.

Each of the plurality of unit wheels may be provided with a through groove into which the engaging protrusion is inserted. The coupling protrusions may be spaced apart from each other, and may include curved outer circumferential surfaces and first inner and second inner surfaces positioned between the outer circumferential surfaces, and the first inner surface and the second inner surface may be perpendicular to each other. have. The coupling fixing part may be provided with an insertion groove into which one end of the coupling protrusion is inserted and engaged. One end of the coupling protrusion may be provided with a first thread, and an inner surface of the insertion groove may be provided with a second thread that is fastened to the first thread.

The plurality of unit wheels may include a roughing unit wheel and a grinding unit wheel, and grooves of the roughing unit wheel and the grinding unit wheel may be different materials, or may have different roughness or hardness.

The grinding apparatus according to the embodiment includes a notch wheel for processing a wafer notch, a notch grinding spindle connected to the notch wheel, and a spindle drive for rotating the notch grinding spindle, wherein the notch wheel may be an embodiment.

The embodiment can replace only the worn, deformed or damaged unit wheel, various types of wafer notch processing, and the specification of various products can be implemented in a single equipment.

1 is a perspective view of a grinding apparatus according to an embodiment.
2 shows a side view of the grinding apparatus shown in FIG. 1.
3 is an exploded perspective view of the notch wheel according to the embodiment.
4 shows a perspective view of the body with the engaging projection shown in FIG. 3.
FIG. 5 shows a side view in the A direction of the body with the engaging projection shown in FIG. 4. FIG.
FIG. 6 shows a side view in B direction of one end of the engaging projection shown in FIG. 4. FIG.
7 is an enlarged perspective view of one end of the engaging protrusion illustrated in FIG. 3.
8 is a perspective view of the unit wheel for grinding shown in FIG.
FIG. 9 shows a front view of the unit wheel for grinding shown in FIG. 8.
10 is a perspective view of the roughing unit wheel shown in FIG. 3.
FIG. 11 shows a perspective view of the coupling fixture shown in FIG. 3.
12 shows notches and round portions of a wafer.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on" or "under" a substrate, each layer It is to be understood that the terms " on "and " under" include both " directly "or" indirectly " do. In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

In the drawings, dimensions are exaggerated, omitted, or schematically illustrated for convenience and clarity of illustration. In addition, the size of each component does not necessarily reflect the actual size. The same reference numerals denote the same elements throughout the description of the drawings.

1 illustrates a perspective view of a grinding apparatus 100 according to an embodiment, and FIG. 2 illustrates a side view of the grinding apparatus 100 illustrated in FIG. 1.

1 and 2, the grinding device 100 includes a control cabinet 10, a device bed 12, a platform 14, a base 16, a first support 18, and a second. Workhead 24 including support 19, first spindle drive 28 and vacuum chuck 30, grinding wheel 32, bearing assembly 38, electric motor 40, reinforcement plate ( 44, a second spindle drive 52, a notch wheel 210, and a notch spindle 57.

As shown in FIG. 1, the device bed 12, platform 14, base 16, first support 18, and second support 19, reinforcement plate 44 are referred to as support 101. do. The work head 24, the first spindle drive 28, and the vacuum chuck 30 are referred to as a wafer supply 102. As shown in FIG. 2, the grinding wheel 32, the bearing assembly 38, and the electric motor 40 are referred to as a wafer edge machining 103. The second spindle driver 52, the notch wheel 210, and the notch spindle 57 are referred to as a wafer notch processing part 104.

The control cabinet 10 controls each component included in the grinding device 100. The device bed 12 extends from the control cabinet 10 and supports the platform 14. Base 16 is disposed on platform 14 and supports work head 24.

The work head 24 may slide in the axial direction along the first runway 26 provided on the upper surface of the base 16. The work head 24 may include a first spindle drive 28 and a vacuum chuck 30. The vacuum chuck 30 supports the wafer 36, which is a grinding target. The work head 24 serves to supply the wafer to be processed to the grinding wheel 32.

The grinding wheel 32 includes a plurality of slots for joining the edges of the wafer 36, with diamond particles attached to the slots to grind the edges of the wafer 36. The grinding wheel 32 is rotated by the electric motor 40. In other words, the grinding wheel 32 is connected with the grinding wheel spindle (not shown), the grinding wheel spindle is supported by the bearing assembly 38, and the grinding wheel 32 is rotated as the grinding wheel spindle is rotated by the electric motor 40. ) Can rotate.

The first support 18 is the reinforcing plate 44 is located on one side, and supports the bearing assembly 38 and the electric motor 40. The reinforcement plate 44 is coupled to the platform 14 and the base 16 and reinforces the rigidity of the reinforcement plate 44 with respect to the base 16. The second support 19 is located on the other side of the plate 44 and supports the second runway 50.

The second spindle drive 52 is installed on the second runway 50, and a notch grinding spindle 57 is mounted at one end of the second spindle drive 52. The second spindle drive 52 moves and / or rotates the notch grinding spindle 57. Notched grinding spindle 57 may typically rotate up to 70,000 per minute.

The notch wheel 210 is mounted to the notch grinding spindle 57 and processes the notch of the wafer. Notch wheel 210 may be formed of a resin bonded diamond, a resin bonded grinding grit, or a glass bonded metal.

3 is an exploded perspective view of the notch wheel 210 according to the embodiment. Referring to FIG. 3, the notch wheel 210 includes a body 310 in which a coupling protrusion 320 is provided, and a plurality of unit wheels 330-1 through 330-n where n is provided with a groove. A natural number of 1), and a coupling fixing part 340.

The body 310 may have a coupling protrusion 320 having a predetermined shape at one end.

FIG. 4 shows a perspective view of the body 310 with the engaging protrusion 320 shown in FIG. 3, and FIG. 5 shows a side view in the A direction of the body 310 with the engaging protrusion 320 shown in FIG. 4. 6 shows a side view in the direction B of one end 420 of the engagement protrusion 320 shown in FIG. 4.

4 to 6, one end 301 of the body 310 is provided with a coupling protrusion 320, and the other end 302 of the body 310 is connected to the notch grinding spindle 57.

Coupling protrusion 320 is a shape protruding from one end 301 of the body 310, it may be a polygonal cross-section of the cross-section. Coupling protrusion 320 shown in Figure 4 is a cross-section polyhedron, but the embodiment is not limited thereto. For example, the coupling protrusion 320 may be a triangular triangular cross section, or a tetrahedron triangular cross section.

FIG. 7 is an enlarged perspective view of one end of the coupling protrusion 320 shown in FIG. 3.

Referring to FIG. 7, the engaging protrusion 320 is a cross-section polyhedron and includes inner peripheral surfaces 402, 403, 404 and spaced apart from each other and inner surfaces 401, 402, 403, 404 located between the outer peripheral surfaces 401, 402, 403, 404. can do.

Each of the outer circumferential surfaces 401, 402, 403, 404 may be a curved surface, and the first inner surface and the second inner surface (eg, 411 and 412) connecting adjacent outer circumferential surfaces (eg, 401 and 404) may be perpendicular to each other. First outer thread surfaces 401, 402, 403, 404 of one end of the coupling protrusion 320 may be provided with a first screw groove 410 that engages with the coupling fixing portion 340, which will be described later.

Each of the plurality of unit wheels 330-1 to 330-n, a natural number of n> 1, may be fitted to the coupling protrusion 320. Each of the plurality of unit wheels 330-1 to 330-n, a natural number of n> 1, is provided with a through groove into which the coupling protrusion 320 is inserted.

The plurality of unit wheels 330-1 to 330-n, and a natural number of n> 1, includes a roughing unit wheel 330-2 to 320-(2n) and n≥1 of natural number) and a grinding unit wheel 330-1. To 310- (2n-1), n≥1 natural numbers).

FIG. 8 is a perspective view of the grinding unit wheel (eg, 330-1) shown in FIG. 3, and FIG. 9 is a front view of the grinding unit wheel (eg, 330-1) shown in FIG. 8.

7 and 8, the grinding unit wheel (eg, 330-1) may include a first portion 710, a second portion 720, a first groove portion 730, and a through groove 510. Include.

The first portion 710 may be a cylindrical portion having a first length L1 in the direction of the first diameter D1 and the axis 701, and the second portion 720 may have a second diameter D2 and the axis ( It may be a cylindrical portion having a second length L2 in the direction 701. The axial direction 701 may be a direction in which the coupling protrusion 320 protrudes or a direction in which the through groove 510 is inserted into the coupling protrusion 320.

The first groove portion 730 may be a groove structure positioned between the first portion 710 and the second portion 720, and connects the first portion 710 and the second portion 720. The first groove portion 730 may include a bottom surface 732 and an inclined side surface 732. The bottom surface 732 of the first groove portion 730 may have the smallest diameters D3 <D1 and D3 <D2 compared to other portions, and the first diameter D1 may be the same as the second diameter D2.

The through groove 510 penetrates the grinding unit wheel (eg, 330-1) in the axial direction 701. For example, the through groove 510 penetrates the first portion 710, the second portion 720, and the first groove portion 730 of the grinding unit wheel (eg, 330-1) in the axial direction 701. can do.

In this case, the shape of the through groove 510 may be a shape coinciding with the coupling protrusion 320 so that the coupling protrusion 320 may be inserted, for example, a cross shape. However, the shape of the through groove 510 is not limited thereto, and may have a polygonal shape having a triangle or a quadrangle in cross section.

Since the cross-sections of the coupling protrusion 320 and the through groove 510 are polygonal, fixability of the coupling protrusion 320 and the unit wheel inserted into the through groove 510 may be improved. That is, when the notch wheel 210 rotates, the fixing property between each of the unit wheels 330-1 to 330-n and a natural number of n> 1 and the coupling protrusion 320 may be improved.

10 is a perspective view of the roughing unit wheel (eg, 330-2) shown in FIG. 3. Referring to FIG. 10, the roughing unit wheel (eg, 330-2) includes a first portion 810, a second portion 820, a second groove portion 830, and a through groove 510-1. can do. The first portion 810 and the second portion 820 of the roughing unit wheel (eg, 330-2) are the same as the structure of the grinding unit wheel (e.g., 330-2) as described above with reference to FIG. It may be, but is not limited thereto.

The through groove 510-1 penetrates the roughing unit wheel (eg, 330-2) in the axial direction 701. In this case, the shape of the through groove 510-1 may be a shape coinciding with the coupling protrusion 320 so that the coupling protrusion 320 may be inserted into, for example, a cross shape.

For example, the through groove 510-1 axially 701 the first portion 810, the second portion 820, and the second groove portion 830 of the roughing unit wheel (eg, 330-2). Can penetrate through.

The second groove portion 830 may have the same shape as the first groove portion 730, It is not limited to this, but may be other shapes. The second groove portion 830 may be another material having roughness and hardness different from that of the first groove portion 730. Alternatively, the second groove portion 830 may be made of the same material as the first groove portion 730 but may have a different roughness.

11 is a perspective view of the coupling fixing part 340 shown in FIG. Referring to FIG. 11, the coupling fixing part 340 is fastened to the last end of the coupling protrusion 320, and combines the plurality of unit wheels 330-1 to 330-n, a natural number of n> 1 to the coupling protrusion 320. Fix it to That is, a plurality of unit wheels 330-1 to 330-n, a natural number of n> 1 inserted into the coupling protrusion 320 may be disposed between the body 310 and the coupling fixing portion 340.

The coupling fixing part 340 is provided with an insertion groove 910 to which at least one end of the coupling protrusion 320 is inserted and coupled, and an inner surface of the insertion groove 910 is provided on an outer circumferential surface of one end of the coupling protrusion 320. A second thread 920 may be provided to be fastened to the thread 410. For example, the insertion groove 910 may be a through groove through which one end of the coupling fixing part 340 passes in the axial direction 701, but is not limited thereto. The insertion groove 910 may not be a through groove.

A plurality of unit wheels 330-1 to 330-n, where n> 1 by being coupled to each other by the first thread 410 of the coupling protrusion 320 and the second thread 920 of the coupling fixing portion 340). It may be fixed to the coupling protrusion 320. Therefore, even when the coupling protrusion 320 is rotated, the plurality of unit wheels 330-1 to 330-n, n> 1 of the natural wheels inserted therein can be easily separated or missed.

Since the embodiment has a structure in which the plurality of unit wheels 330-1 to 330-n, a natural number of n> 1, is individually coupled to the coupling protrusion 320, the plurality of unit wheels 330-1 to 330-n If any one of the natural numbers, n> 1) is worn, deformed or damaged, only the worn, deformed or damaged unit wheel can be replaced.

In addition, the embodiment may vary the groove shape and the roughness of each of the plurality of unit wheels 330-1 to 330-n, and n> 1, so that grooves having different shapes and roughness can be selectively configured according to a user's request. Various notch wafers can be processed by one notch wheel, and specifications of various products can be realized on a single device.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

10: control cabinet, 12: device bed
14: platform 16: base
18: first support 19: second support
24: work head 28: first spindle drive
30: vacuum chuck 32: grinding wheel
38: bearing assembly 40: electric motor
44: reinforcing plate 52: second spindle drive
57: notch spindle 210: notch wheel
310: body 320: coupling protrusion
330-1 to 330-n: unit wheels 340: coupling fixing portion

Claims (10)

Body;
A coupling protrusion provided at one end of the body;
A plurality of unit wheels inserted into the joining protrusions and having grooves for processing the notches of the wafer; And
A notch wheel that engages with one end of the engagement protrusion and engages the plurality of unit wheels to secure the engagement protrusion. The method of claim 1,
The notch wheel of each of the plurality of unit wheels is removable from the engaging projection. The method of claim 1, wherein the engaging projection,
Notch wheel in the shape of a polyhedron with polygonal cross section. The method of claim 1,
The coupling protrusion is a polyhedron cross-sectional cross-sectional notch wheel. The method of claim 1,
The notch wheel of each of the plurality of unit wheels is provided with a through groove into which the engaging projection is inserted. The method of claim 1, wherein the coupling fixing portion,
The notch wheel is provided with an insertion groove to which one end of the coupling protrusion is inserted and coupled. The method of claim 4, wherein the engaging projection,
Outer peripheral surfaces spaced apart from each other and curved; And
A first inner side and a second inner side positioned between the outer circumferential surfaces,
The notch wheel is perpendicular to the first inner side and the second inner side. The method according to claim 6,
One end of the coupling protrusion is provided with a first thread,
The notch wheel is provided on the inner surface of the insertion groove is provided with a second screw thread that is fastened to the first screw thread. The method of claim 1, wherein the plurality of unit wheels,
Including roughing unit wheels and grinding unit wheels,
The grooves of each of the roughing unit wheel and the grinding unit wheel may be different materials, or may have different roughness or hardness. A notch wheel for processing wafer notches;
A notch grinding spindle coupled to the notch wheel; And
A spindle drive for rotating the notch grinding spindle,
The notch wheel,
The grinding device which is the notch wheel in any one of Claims 1-9.
KR1020110097987A 2011-09-28 2011-09-28 A wafer notch wheel and an apparatus for grinding a wafer notch KR20130034127A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110097987A KR20130034127A (en) 2011-09-28 2011-09-28 A wafer notch wheel and an apparatus for grinding a wafer notch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110097987A KR20130034127A (en) 2011-09-28 2011-09-28 A wafer notch wheel and an apparatus for grinding a wafer notch

Publications (1)

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KR20130034127A true KR20130034127A (en) 2013-04-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108067975A (en) * 2016-11-17 2018-05-25 扬明光学股份有限公司 Combined type emery wheel
CN110281105A (en) * 2019-07-24 2019-09-27 蓝思科技股份有限公司 A kind of mill skin polissoir and mill skin polishing rod

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108067975A (en) * 2016-11-17 2018-05-25 扬明光学股份有限公司 Combined type emery wheel
CN110281105A (en) * 2019-07-24 2019-09-27 蓝思科技股份有限公司 A kind of mill skin polissoir and mill skin polishing rod

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