KR20130025192A - An arrayed pressure sensor unit for pulse diagnosis with independent pressure-response of fdb type - Google Patents

Abstract

PURPOSE: An array pressure sensor unit for an individual reaction type pulse using an FEB method is provided to remove crosstalk by mounting a plurality of sensor parts in a housing to be individually driven. CONSTITUTION: A sensor housing(110) forms an outer appearance. A PCB(120) is mounted on the sensor housing. The PCB includes a plurality of connection members(121) facing the inner side of the sensor housing. A plurality of sensor parts(130) transmit pulse information to the PCB. The plurality of sensor parts are individually driven according to pressure.

Description

An arrayed pressure sensor unit for pulse diagnosis with independent pressure-response of FDB type}

Disclosed is an array pressure sensor unit for an individual reactive pulse using the FDB method. More specifically, since a plurality of sensor units are mounted to be individually driven in the sensor housing, it is possible to improve sensing capability, completely eliminate crosstalk, and use an FDB method that can improve pulse accuracy. Disclosed is a discrete reactive pulse pressure array pressure sensor unit.

In general, in oriental medicine, a picture (4) of the gate sentence, ie, seeing, touching, hearing, smelling, and asking, is used to determine the condition of the patient. Pulsation is the most important method of palpation by directly touching the patient and is performed by touching the doctor's finger to a specific part of the patient's wrist and feeling the pulsation of the patient. However, these pulsation methods are subjective and metaphysical, and the development of pulsation requires objectification and quantification.

Recently, various types of pulsators have been developed for this reason. The pulsator largely includes a pulsation sensor for directly detecting pulsation information, a driver for manipulating the pulsation information, and a processing unit for analyzing the obtained pulsation information. Here, the sensor part is the most important part of the pulsator because it directly detects the pulsation information of the patient.

1 is a view showing a pulse sensor according to a conventional embodiment.

As shown in the drawing, the sensor chip 30 is mounted on one surface of the substrate 20. In this case, the sensor chip 30 is mounted and fixed to the substrate 20 by using the adhesive member 31, and the sensor chip 30 and the substrate 20 are electrically connected by a bonding wire 21. do. The bonding wire 21 may be made of a conductive material such as gold or aluminum. In addition, in order to protect the sensor chip 30 and the bonding wire 21, the sensor chip 30 and the bonding wire 21 are wrapped with the soft material 40.

However, in the pulse sensor according to the related art, since the soft material 40 is wrapped around the sensor chip 30 and the bonding wire 21 connected by the wire bonding process, as the frequency of use increases, Alternatively, as the shock and vibration are transmitted, the bonding wire 21 may be broken, thereby causing a defect.

To solve this problem, a pulse sensor having an integrated pressure sensor having no connection structure by a bonding wire has been developed. In this case, it has the advantage of improving durability and minimizing crosstalk, but in the event of a failure, the total cost of the integrated pressure sensor must be separated and repaired or replaced. There is a problem.

Therefore, there is an urgent need to develop a pulsation sensor that can reliably perform pulsation and is robust and easy to maintain.

The object according to an embodiment of the present invention is that the plurality of sensor units are mounted to be individually driven in the sensor housing to improve the sensing capability and to completely eliminate crosstalk and to improve the accuracy of the pulse. It is to provide an array pressure sensor unit for an individual reactive pulse using the FDB method.

In addition, the object according to the embodiment of the present invention, because the electrical connection between the sensor unit and the PCB substrate is not applied to the conventional method such as soldering simply made by the contact structure can be easily assembled and separated can be made It is to provide an array pressure sensor unit for an individual reactive pulse using the FDB method.

In addition, an object according to an embodiment of the present invention, by having a structure in which a plurality of sensor units are driven separately, even if a failure occurs in some of the plurality of sensor units can be repaired or replaced individually is required for maintenance It is to provide an array pressure sensor unit for an individual reactive pulse using FDB method which can reduce cost.

An individual reactive pulse array array pressure sensor unit using an FDB method according to an embodiment of the present invention includes a sensor housing forming an appearance; A PCB substrate mounted on the sensor housing and having a plurality of connection members mounted on one surface of the sensor housing facing inwardly; And a plurality of sensor units mounted on the sensor housing to be electrically connected to the PCB substrate through the plurality of connection members, and transferring pulse information sensed by a pulsation to the PCB substrate. Each part can be driven individually according to the degree of pressure generated during pulsation. With this configuration, it is possible to improve the sensing capability, to completely eliminate crosstalk, and to improve the accuracy of pulsation. For the electrical connection between the sensor unit and the PCB substrate, since the same method as the conventional soldering is not applied and is simply made by the contact structure, assembly and separation can be easily performed.

Each of the plurality of sensor units may include: a pressure sensor electrically connected to the PCB substrate by a corresponding one of the plurality of connection members to press the connection member when pressure is applied thereto; And a pressure pad that is partially penetrated through the through hole so that a portion thereof is exposed through the through hole formed in the sensor housing, and the other end is in contact with the pressure sensor.

The pressure sensor is a semiconductor pressure sensor manufactured by a chip scale package method, and the pressure sensor includes: a mounting member having a plurality of solder bumps for electrical connection with the connection member; And a transfer member coupled to an upper surface of the mounting member and transferring the pressure transmitted from the pressure pad to the solder bumps of the mounting member.

The transfer member may be manufactured by molding a silicon material which can cushion a shock while improving a transfer efficiency of pressure delivered to the pressure pad.

One end of the pressure pad in contact with the pressure sensor may be manufactured to have a larger size than the through hole in order to prevent the pressure pad from being separated from the through hole.

At the tip of the pressure pad has a larger area than the tip of the pressure pad may be detachably coupled to the gap reducing cap to reduce the gap between the pressure pads when combined.

The plurality of connection members of the PCB substrate may be a plurality of pogo pins for transferring pulse information from the sensor unit to the PCB substrate by moving in the pressure direction according to the pressure applied to the sensor unit.

The respective reactive pulse array pressure sensor unit is mounted to the sensor housing to support the plurality of sensor portions between the plurality of sensor portions and the PCB substrate, and a plurality of connections to allow the plurality of connecting members to pass therethrough. The hole may further include a spacer formed through.

The plurality of sensor units may be arranged in a regular arrangement structure in the housing so that the mutual distance between the sensor units is constant.

The sensor housing includes a first housing and a second housing that can be assembled and separated from each other by a screw, and one end of the first housing penetrates a number of through holes corresponding to the plurality of sensor units. The second housing may have an open shape to connect the connector of the PCB board to an external connection device.

According to the embodiment of the present invention, since the plurality of sensor units are mounted to be individually driven in the sensor housing, the sensing capability can be improved, crosstalk can be completely eliminated, and the accuracy of the pulse can be improved.

In addition, according to an embodiment of the present invention, since the conventional method such as soldering is not applied for the electrical connection between the sensor unit and the PCB substrate, it may be easily assembled and separated because it is simply made by a contact structure.

In addition, according to an embodiment of the present invention, by having a structure in which a plurality of sensor units are individually driven, even if a failure occurs in some of the plurality of sensor units, it is possible to repair or replace individually to reduce the cost of maintenance Can be saved.

1 is a view showing a pulse sensor according to a conventional embodiment.
Figure 2 is a perspective view of the array pressure sensor unit for an individual reactive pulse using the FDB method according to an embodiment of the present invention.
3 is a cross-sectional view illustrating the internal configuration of an individual reactive pulse array array pressure sensor unit using the FDB method shown in FIG. 2.
4 is a cross-sectional view taken along line IV-IV of FIG. 3.
FIG. 5 is a perspective view of the PCB substrate shown in FIG. 3.
FIG. 6 is a schematic exploded perspective view of the pressure sensor shown in FIG. 3.
FIG. 7 is a diagram sequentially illustrating a coupling process of an individual reactive pulse array array pressure sensor unit using the FDB method illustrated in FIG. 2.

Hereinafter, configurations and applications according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following description is one of several aspects of the patentable invention and the following description forms part of the detailed description of the invention.

FIG. 2 is a perspective view of an individual reactive pulsation array pressure sensor unit using an FDB method according to an embodiment of the present invention, and FIG. 3 is an array pressure sensor unit for an individual reactive pulsation using the FDB method shown in FIG. 2. 4 is a sectional view taken along line IV-IV of FIG. 3, FIG. 5 is a perspective view of the PCB substrate shown in FIG. 3, and FIG. 6 is a schematic exploded view of the pressure sensor shown in FIG. FIG. 7 is a perspective view sequentially illustrating a coupling process of an individual reactive pulse array array pressure sensor unit using the FDB method illustrated in FIG. 2.

As shown in these drawings, the individual reactive pulse array pressure sensor unit 100 using the FDB method according to an embodiment of the present invention, the sensor housing 110 and the sensor housing 110 to form an appearance It is embedded in the PCB substrate 120 is mounted on a surface facing the inner direction of the sensor housing 110, 120 and electrically connected to the PCB substrate 120 through a plurality of connecting members 121. A plurality of sensor units 130 mounted on the sensor housing 110 to transmit the detected pulse information to the PCB substrate 120, and disposed between the plurality of sensor units 130 and the PCB substrate 120, The sensor unit 130 may include a spacer 150 on which the sensor unit 130 is seated and a plurality of connection members 121 are disposed.

This configuration allows each sensor unit 130 to be driven individually to deliver pulsation information generated as a result of pulsation to the PCB substrate 120 while also improving durability and requiring maintenance. In this case, only the sensor unit 130 in which a failure occurs among the plurality of sensor units 130 may be replaced or maintained, thereby reducing maintenance costs as compared with the related art.

Referring to each configuration, first, the sensor housing 110 of the present embodiment, as shown in Figure 2, the overall shape is made to have a cylindrical shape, and rigid so that no damage occurs even if an impact or the like is applied from the outside It may be provided with a plastic material having a.

The sensor housing 110 may be provided with a first housing 111 and a second housing 115 so that a plurality of configurations described above may be embedded therein, which may be screwed together by a screw 116. have.

As shown in FIG. 3, a plurality of through-holes 112 corresponding to the number of the plurality of sensor units 130 to be described later penetrate through the front end of the first housing 111 so that each of the sensor units 130 may be formed. Some configurations may be exposed outside the first housing 111. Therefore, the pulsation may be performed through the sensor unit 130 exposed to the outside through the through hole 112.

The second housing 115 is provided in a shape corresponding to the first housing 111 and coupled to the first housing 111, and the connector 125 portion of the substrate 120 is connected to an external connection device (not shown). The lower part has an open shape to enable it.

On the other hand, the PCB substrate 120 of the present embodiment, as shown in Figure 5, has an overall cylindrical shape roughly corresponding to the internal space of the sensor housing 110, the pulsation transmitted from the sensor unit 130 It is provided with a plurality of connecting members 121 for receiving information. Pulse information transmitted through the plurality of connection members 121 is transmitted to the external device connected to the connector 125, through which the pulse information detected by the sensor unit 130 can be grasped.

Here, the connection member 121 of the present embodiment may be provided as a pogo pin (121) having elasticity. That is, the sensor unit 130 to be described later is arranged to be in contact with the tip of the pogo pin 121, the pogo pin 121 is moved in the longitudinal direction by the operation of the sensor unit 130 (that is, pressed and pressed pressure) When restored, the pulse information transmitted from the sensor unit 130 may be transmitted to the PCB substrate 120 through the pogo pin 121.

As described above, in the present embodiment, since the plurality of connection members 121 and the sensor unit 130 are connected by using a face down bonding (FDB) method by electric connection only, the soldering and The same electrical connection method does not have to be applied, and therefore not only is it easy to manufacture, but also can be easily maintained.

On the other hand, between the plurality of sensor unit 130 and the PCB substrate 120 to guide the plurality of connection members 121 provided with the pogo pin 121, and also to maintain the position of the plurality of sensor unit 130. The spacer 150 is mounted.

As shown in FIG. 3, the spacer 150 of the present exemplary embodiment may be provided in a disc shape corresponding to the shape of the inner space of the sensor housing 110 and may be made of an insulating material.

In the spacer 150, a plurality of connection holes 151 corresponding to the plurality of connection members 121 provided in the PCB substrate 120 are formed therethrough so that the connection member 121 is a connection hole of the spacer 150. It may be disposed through the 151. A plurality of sensor units 130 may be disposed, for example, in the shape of FIG. 4 on one surface of the spacer 150 corresponding to the opposite side of the PCB substrate 120 with the spacer 150 therebetween.

In other words, the plurality of connection members 121 penetrating the spacers 150 may be connected to the respective sensor units 130. Therefore, according to the pressure applied to the sensor unit 130, the connection member 121 may move to some extent through a path provided through the connection hole 151 of the spacer 150, and thus the PCB substrate 120 may be moved from the sensor unit 130. Pulse information can be delivered.

On the other hand, since the sensor unit 130 of the present embodiment is provided in plural as the portion directly detecting the pulsation information of the subject, each sensor unit 130 may obtain the pulsation information separately. Therefore, if some of the sensor unit 130 of the plurality of sensor unit 130 is broken, it is necessary to replace or repair only the sensor unit 130 without having to replace or repair the entire sensor unit 130 Not only is it a great advantage, it also reduces the time required for maintenance.

Referring to FIG. 4, a plurality of sensor units 130 may be provided in total and disposed in a hexagonal shape, and one sensor unit 130 may be provided inside. As described above, each of the plurality of sensor units 130 having a regular arrangement structure may reliably acquire pulse information because each of the plurality of sensor units 130 operates independently, and between the sensor units 130. It is possible to completely eliminate possible crosstalk. However, the arrangement structure of the plurality of sensor units 130 is not limited thereto.

The configuration of the sensor unit 130 of the present embodiment will be described in detail with reference to FIG. 3. Each of the plurality of sensor units 130 of the present embodiment is in electrical contact with the connection member 121 of the PCB substrate 120. A pressure sensor 131 disposed on the spacer 150, and a portion of the pressure sensor 131 disposed through the through hole 112 of the sensor housing 110 and the other end of the pressure sensor 131 disposed to contact the pressure sensor 131. The pad 140 may be provided.

With this configuration, the pressure pad 140 is moved to the inside of the sensor housing 110 according to the pressure applied as a result of the pulsation, through which the pressure pad 140 presses the pressure sensor 131 and the pressure sensor 131. The connection member 121 is in electrical contact. Then, the pulsation information sensed from the sensor unit 130 to the PCB substrate 120 is transmitted through the connection member 121, so that the pulsation information can be grasped through the aforementioned external device.

In more detail with respect to each configuration, first, the pressure sensor 131 of the present embodiment is a semiconductor pressure sensor 131, for example, a MEMS type semiconductor pressure sensor (manufactured by a chip scale package method) 131). The pressure sensor 131 is coupled to one surface of the mounting member 132 having a plurality of solder bumps 133 (solder bumps) for electrical connection with the connection member 121 and the mounting member 132 and a pressure pad ( It may include a transfer member 135 for transmitting the pressure transmitted from the 140 to the solder bump 133 of the mounting member 132.

6, a plurality of solder bumps 133 may be mounted on the mounting member 132. Each of the solder bumps 133 may be electrically contacted with the above-described connection member 121 to transmit pulse information to the connection member 121 through the solder bump 133.

The transfer member 135 is a portion in which the pressure pad 140 to be described later is in direct contact, and when the pressure pad 140 is pressurized, the transfer member 135 contracts inwardly to pressurize the solder bump 133 of the mounting member 132. Add. The transfer member 135 may be manufactured by molding a silicon material to maximize the pressure transfer effect. However, the material and the manufacturing method of the transmission member 135 is not limited thereto, and it is natural that other materials or manufacturing methods may be applied.

Meanwhile, as illustrated in FIG. 3, the pressure pad 140 has a shape in which a part of the pressure pad 140 is exposed to the outside of the sensor housing 110 and the other end 141 is supported on one surface of the pressure sensor 131. . The other end of the pressure pad 140, that is, the portion 141 supported by the pressure sensor 131 has a larger diameter than the exposed portion so that the pressure pad 140 does not leave the sensor housing 110 and thus has a large area. Since the portion having the pressure sensor 131 can be evenly pressed, not only the pressure transmission is accurately performed, but also the departure can be prevented.

On the other hand, the interval reduction cap 155 may be detachably coupled to the front end of each pressure pad 140. As shown in FIG. 2, the gap reduction cap 155 has a larger area than the tip of the pressure pad 140 so that the body has a larger area than the tip of the pressure pad 140 directly contacts the body. It can cause the effect of being in contact with, thereby improving the accuracy of the pulse.

In addition, the gap reduction cap 155 is provided with a rubber (rubber) material not only to protect the tip of the pressure pad 140, but also to the subject for the purpose of obtaining pulse information, the individual reactive pulse array array pressure sensor unit of the present embodiment When the contact with the rubber gap reducing cap 155 is in contact with the body part may improve the contact feeling.

Hereinafter, a method of assembling the individual reactive pulse array array pressure sensor unit 100 using the FDB method having such a configuration will be described with reference to FIG. 7.

First, as illustrated in FIG. 7A, a plurality of pressure pads 140 are disposed through through holes 112 of the first housing 111 of the sensor housing 110.

Thereafter, as illustrated in FIG. 7B, a plurality of pressure sensors 131 are introduced into the first housing 111 to be in contact with each of the pressure pads 140. Subsequently, as shown in FIG. 7C, the spacer 150 is introduced into the first housing 111 to fix the positions of the plurality of sensor units 130 in the first housing 111. Be sure to

Subsequently, as shown in FIG. 7D, the PCB substrate 120 is introduced into the first housing 111, where a plurality of connection members 121 provided on the PCB substrate 120, that is, the present embodiment. For example, the pogo pins 121 pass through the connection holes 151 of the spacer 150 so that one end of the connection member 121 and the pressure sensor 131 of the sensor unit 130 may be electrically contacted.

Thereafter, as shown in FIG. 7E, the assembly of the individual reactive pulse array array pressure sensor unit 100 is performed by coupling the first housing 111 and the second housing 115 by screws 116. To complete.

On the other hand, due to the frequent use of the individual reactive pulse array array pressure sensor unit 100 assembled in this process, some of the sensor unit 130 of the sensor unit 130 is broken down and must be maintained If it is necessary to replace, after disconnecting the first housing 111 and the second housing 115, the PCB substrate 120 and the spacer 150 are separated from the first housing 111, and then the corresponding sensor has failed. By separating the unit 130, maintenance of the individual reactive pulse array array pressure sensor unit 100 using the FDB method can be efficiently performed.

As such, according to the exemplary embodiment of the present invention, since the plurality of sensor units 130 are mounted to the sensor housing 110 so as to be individually driven, the sensing capability may be improved and the sensor unit 130 may be improved. Since the existing method such as soldering between the substrates 120 is not applied, the assembly is easy, and in the case of failure of the sensor unit 130, an individual repair or replacement is possible, thereby reducing the cost of maintenance.

In addition, by individually driving the sensor unit 130, there is an advantage in that the accuracy of the pulse can be improved while completely eliminating crosstalk.

In the following description, well-known functions or constructions are not described in detail for the sake of clarity and conciseness.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: array pressure sensor unit for individual reaction pulse using FDB method 110: sensor housing
120: PCB substrate 121: connecting member (pogo pin)
130: sensor unit 131: pressure sensor
132: mounting member 133: solder bump
135: transfer member 140: pressure pad
150: spacer 155: gap reduction cap

Claims (10)

A sensor housing forming an appearance;
A PCB substrate mounted on the sensor housing and having a plurality of connection members mounted on one surface of the sensor housing facing inwardly; And
A plurality of sensor units mounted to the sensor housing so as to be electrically connected to the PCB substrate through the plurality of connection members and transferring pulse information sensed by the pulse to the PCB substrate;
Including;
Each of the plurality of sensor units is an individual reactive pulse array pressure sensor unit using an FDB method that is individually driven according to the pressure generated during the pulse.
The method of claim 1,
Each of the plurality of sensor units,
A pressure sensor that is electrically connected to the PCB substrate by a corresponding one of the plurality of connection members and pressurizes the connection member when a pressure is applied thereto; And
And a pressure pad which is partially penetrated through the through hole so that a portion thereof is exposed through the through hole formed in the sensor housing, and the other end is in contact with the pressure sensor.
The method of claim 2,
The pressure sensor is a semiconductor pressure sensor manufactured by a chip scale package method,
The pressure sensor,
A mounting member having a plurality of solder bumps for electrical connection with the connection member; And
An array pressure sensor unit for an individual reaction type pulse generator using an FDB method, the transfer member coupled to an upper surface of the mounting member and transmitting a pressure transferred from the pressure pad to the solder bumps of the mounting member.
The method of claim 3,
The transfer member is an array pressure sensor unit for an individual reactive pulse using an FDB method, which is manufactured by molding a silicon material capable of cushioning shock while improving the transfer efficiency of the pressure delivered to the pressure pad. .
The method of claim 2,
One end of the pressure pad in contact with the pressure sensor in order to prevent the pressure pad is separated from the through-hole array pressure sensor unit for an individual reactive pulse using the FDB method is manufactured in a larger size than the through-hole.
The method of claim 2,
Individual pressure response array pressure sensor unit using an FDB method in which the end of the pressure pad has a larger area than the front end of the pressure pad so that a gap reducing cap that reduces the gap between the pressure pads is detachably coupled. .
The method of claim 1,
The plurality of connection members of the PCB substrate uses a FDB method, which is a plurality of pogo pins that transfer pulse information from the sensor unit to the PCB substrate by moving in a pressure direction according to the pressure applied to the sensor unit. Array pressure sensor unit for discrete reactive pulses.
The method of claim 1,
The FDB method further includes a spacer mounted to the sensor housing to support the plurality of sensor units between the plurality of sensor units and the PCB substrate, the spacer having a plurality of connection holes penetrating therethrough so that the plurality of connection members can pass therethrough. Array pressure sensor unit for individual reactive pulses.
The method of claim 1,
And the plurality of sensor units are arranged in a regular array structure in the housing such that the mutual distance between the sensor units is arranged in a discrete reactive pulse array pressure sensor unit using the FDB method.
The method of claim 2,
The sensor housing includes a first housing and a second housing which can be assembled and separated from each other by screws,
One end of the first housing has a through hole corresponding to the plurality of sensor parts, and the second housing has an open shape to connect the connector of the PCB to an external connection device. Array pressure sensor unit for individual reactive pulses using FDB method.

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