KR20130012650A

KR20130012650A - Cooling system for junction box

Info

Publication number: KR20130012650A
Application number: KR1020110073913A
Authority: KR
Inventors: 정희재; 이상현; 윤영준; 박철민
Original assignee: 현대자동차주식회사; (주)티에이치엔; 타이코에이엠피(유); 기아자동차주식회사
Priority date: 2011-07-26
Filing date: 2011-07-26
Publication date: 2013-02-05

Abstract

The present invention relates to an apparatus for effectively cooling IC chips and active devices such as IC devices, FET devices, and the like, which are integrated in a PCB in a junction box.
The present invention combines a sub-PCB and a main PCB in which IC chips and active electronic devices are integrated, and implements a simple new PCB combination type and heat dissipation structure having a heat sink on the sub-PCB, thereby providing a cooling rate for the active electronic device. By improving the heat dissipation performance can be improved faster, and provides a junction box cooling device that can increase the reliability of the operation as well as the protection of active electronics.

Description

Junction box cooling system {Cooling system for junction box}

The present invention relates to an apparatus for cooling a junction box installed in an engine room of an automobile, and more particularly, to an apparatus for effectively cooling an active element and an IC chip, such as an IC element, an FET element, and the like, which are integrated in a PCB.

In general, the junction box installed in the engine room of a car is a device that distributes power by using relays and fuses. It supplies power to the parts of the car and protects the parts by shutting off the power in case of abnormalities. .

Such a junction box is a kind of distribution box having a distribution function of a wire harness in which various components such as fuses and relays are integrated between circuits and embedded in a box. The junction box is usually a main cover and a bus-bar layer having multiple layers. Layer), the bottom cover, and the bottom cover.

For example, as shown in FIG. 1, a junction box for supplying power to a vehicle may be powered on / off using a main fuse 100, a sub fuse 110, a relay 120, an EMS 130, and the like. OFF.

Here, reference numeral 140 denotes the main body.

Existing junction box has an abnormality in the parts and wires of the vehicle, and if an overcurrent occurs, the fuse is short-circuited, the relay is broken, and if the relay and the fuse is damaged, there is a need to replace the corresponding parts.

In addition, the main body is made of an injection molding, and thus is vulnerable to heat generation.

Recently, smart junction boxes using active electronic devices such as IC devices or FET devices have been installed in the lamp load.

Since the smart junction box uses an active electronic device such as an IC device or an FET device instead of an existing relay and a fuse for indoor use, there is no hassle due to component replacement and is semi-permanent due to the characteristics of the active electronic device. Can be used as

However, the active electronic device raises the internal temperature of the junction box while generating high heat at high power, and eventually, the function of the smart junction box stops when the electronic device is damaged by such heat.

For this reason, it is necessary to design a junction box that prevents heat damage and effectively dissipates heat when manufacturing a junction box. to be.

In particular, high performance is required to be mounted in high temperature conditions such as engine room.

Accordingly, the present invention has been made in view of the above-mentioned problem, and is a simple combination of a main PCB and a sub-PCB in which an IC chip and active electronic devices (including an engine room) are integrated in the vehicle, and a heat sink is provided on the sub-PCB. In addition, by implementing a new PCB combination form and heat dissipation structure, it is possible to improve the heat dissipation performance by increasing the cooling speed for active electronic devices, and to protect the active electronic devices and to increase the reliability of operation. The purpose is to provide.

Junction box cooling apparatus provided by the present invention to achieve the above object has the following features.

The junction box cooling device has a structure including a main PCB, an upper case and a lower case, an IC chip and a sub PCB in which an active element is integrated. In particular, a molding part for sealing an IC chip and an active element is formed on one surface of the sub PCB. At the same time, the heat sink is attached to the other surface, and both ends of the PCB are electrically connected to the main PCB by penetrating the tabs, and the entire PCB including the molding part is mounted on the main PCB in a fastening structure, so that the heat sink is in the assembled state. And the inner case of the IC chip and the active element can be dissipated to the outside through the surface contact between the lower case made of a metal material and the active material.

Here, a plurality of sub-PCBs in which the IC chip and the active elements are integrated may be provided in a plurality, and may be mounted in a structure in which the IC PCB and the active PCB are arranged at the bottom of the main PCB.

In addition, a plurality of heat dissipation fins protrude from the outer surface of the lower case to secure a contact area with air, and an inner surface of the lower case has a protruding contact portion in direct contact with the heat sink of the sub-PCB, thereby transferring heat between the heat sink and the heat dissipation fins. It is desirable to improve the efficiency.

The junction box cooling device provided by the present invention has the following effects.

First, even if an error occurs in the parts and wires of the vehicle, active electronic devices sense it, cut off the power of the vehicle, and if the cause is solved, it is possible to perform the function of the junction box without a separate part replacement. have.

Second, since it is possible to easily discharge the internal heat in the basic configuration without adding a separate heat dissipation member, there is an effect that can prevent the total volume of the active junction box is increased.

1 is a schematic diagram showing a conventional junction box
2A and 2B are combined perspective views showing an active junction box according to an embodiment of the present invention.
3A and 3B are exploded perspective views illustrating an active junction box according to an embodiment of the present invention.
4 is a cross-sectional view showing a heat dissipation process in an active junction box according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2A and 2B are combined perspective views illustrating an active junction box according to an embodiment of the present invention, and FIGS. 3A and 3B are exploded perspective views illustrating an active junction box according to an embodiment of the present invention.

As shown in Figures 2a and 2b and 3a and 3b, the junction box is the upper case 11 and the lower case 12 and the like coupled to the top and bottom while receiving the main PCB 10 and the main PCB 10, etc. It includes.

The main PCB 10 is a general PCB form in which various electrical components constitute a circuit electrically, and a plurality of connectors 22 are provided on the top and bottom thereof, and in particular, the bottom surface of the main PCB 10 and the sub-PCB 13 described later. A plurality of tabs 16 for electrical connection are formed, for example a plurality of tabs 16 arranged side by side on both sides.

The main PCB 10 is assembled in a shape that is accommodated inside the upper and lower cases, and in the assembled state, each connector 22 in the main PCB 10 may be exposed to the outside through approximately square holes in the case. Will be.

The upper case 11 and the lower case 12 are made of a metal material manufactured by a die casting method in consideration of heat dissipation performance, and in particular, a plurality of heat dissipation fins 17 protruding integrally on the outer surface of the lower case 12. ), It is possible to have a sufficient thermal contact area with air.

In addition, a plurality of protruding contact portions 23 are provided on the inner surface of the lower case 12, wherein each of the protruding contact portions 23 protrudes in a square at a position corresponding to the position where the sub PCB 13 is mounted. The structure can be made.

Accordingly, when the upper case 11 and the lower case 12 are assembled up and down with the main PCB 10 inside, the lower case 13 mounted on the lower side of the main PCB 10 is located in the lower case ( 12) is in close contact with the protruding contact 23, so that the heat generated from the sub-PCB 13 side can be transferred directly to the protruding contact 23, so that it can be released to the outside, thereby improving heat dissipation efficiency. It can be improved.

In addition, when the upper case 11 and the lower case 12 are coupled, the seal member 21 is interposed along the coupling surface thereof, so that the airtightness inside the case may be maintained.

Particularly, in the present invention, various active electronic devices that enter the active junction box, for example, active devices such as IC devices, FET devices, etc. are mounted on a separate PCB, and each PCB on which the active devices are mounted is individually cooled. In this way, it is possible to more efficiently cool an active device that is driven by a high power source and generates high heat.

To this end, a sub-PCB 13 having an IC chip and active elements (not shown) mounted thereon is provided on one side, and the IC chip and the active elements at this time are sealed by a molding part (14 in FIG. 4). .

Of course, the IC chips and active devices at this time constitute an electrical circuit with the sub-PCB side.

On the other side of the sub-PCB 13, that is, on the opposite side of the molding part 14, a heat sink 15 made of a thin metal plate is attached, and the heat sink 15 at this time is attached to the sub-PCB. Heat generated from the active element inside (13) serves as a kind of passage to the outside.

The sub-PCB 13 is mounted on the bottom of the main PCB 10 while being fastened by bolts 20. For example, the main PCB 10 has a bolt 20 protruding from the bottom of the insert. Fastening grooves 19 are formed at both ends of the front and rear longitudinal directions of the sub-PCB 13, and both fastening grooves 19 of the sub-PCB 13 are formed on both bolts 20 of the main PCB 20. Then, when the nut (not shown) is fastened to the bolt 20 on the bottom of the sub-PCB 13, the sub-PCB 13 can be mounted on the bottom of the main PCB 10.

Here, the active elements of the junction box may be provided in such a manner that they are distributed in several places without being concentrated in one place. For this purpose, a plurality of sub-PCBs 13 on which IC chips and active elements are mounted are provided, respectively. The sub-PCBs 13 may be mounted in a structure in which the sub-PCBs 13 are aligned with the bottom of the main PCB 10.

In addition, as a means for electrical connection between the main PCB 10 and the sub-PCB 13, a plurality of tabs 16 extending from the main PCB 10 side, for example, are fixed on the bottom surface of the main PCB 10. It is provided with two rows of side by side tab tabs that protrude longitudinally.

In this regard, tab holes 18 are formed at both ends in the left and right width directions of the sub-PCB 13, and the tab holes 18 are inserted into the tabs 16 of the main PCB 10 through the tab holes 18. Electrical connection of the sub-PCB 13 can be made.

That is, the sub-PCB 13 can be mounted on the main PCB 10 side through the fastening structure of both sides simultaneously with the connection with the tab 16 through the tab hole 18.

Therefore, the cooling process of the active device mounted on the sub-PCB 13 in the junction box configured as described above is as follows.

4 is a cross-sectional view illustrating a heat dissipation process in an active junction box according to an embodiment of the present invention.

As shown in FIG. 4, a main PCB 10 is disposed inside the junction box, and a sub PCB having a molding part 14 containing an IC chip and active elements is disposed at a bottom of the main PCB 10. 13 is mounted, and the sub-PCB 13 at this time is electrically connected to the main PCB 10 side by the plurality of tabs 16.

In addition, the heat sink 15 of the metal material is attached to the substrate bottom surface of the sub-PCB 13 by an adhesive method, and the like, and the heat sink 15 attached thereto is also made of a metal material, for example, aluminum. It comes in close contact with the protruding contact 23 of the lower case 12.

That is, each sub-PCB 13 mounted in a plurality in the junction box is arranged in close contact with one-to-one correspondence with each protruding contact portion 23 in the lower case 12.

Therefore, heat generated in the active element in the sub-PCB 13 is transferred along the path of the heat sink 15 → the protruding contact 23 → the heat radiating fin 17, and the heat is transferred to the outside air. It can be discharged to the outside by the heat radiation fin 17 for performing heat exchange.

That is, in the present invention, the sub-PCB 13 having the IC chip and the active element is divided and disposed, and each sub-PCB 13 is provided with an independent heat dissipation structure to perform cooling, thereby generating internal heat generated from the active element. It can be efficiently diverted to the outside.

10: main PCB 11: upper case
12: Lower Case 13: Sub PCB
14: molding 15: heat sink
16: Tap 17: Heat dissipation fin
18: tap hole 19: fastening groove
20: bolt 21: seal member
22 connector 23 projecting contact

Claims

A main PCB 10, an upper case 11 and a lower case 12, a sub-PCB 13 in which IC chips and active elements are integrated;
On one side of the sub-PCB 13, a molding part 14 for sealing an IC chip and an active element is formed, and at the same time, a heat sink 15 is attached to the other side of the sub-PCB 13, and tabs 16 are penetrated through both ends of the main PCB. Electrically connected to the (10) side, the entire PCB including the molding portion 14 is mounted on the main PCB 10 side in a fastening structure, the lower case made of the heat sink 15 and the metal material in the assembled state ( 12) Junction box cooling device, characterized in that through the surface contact between the IC chip and the active element to dissipate the internal heat to the outside.

The junction box cooling apparatus according to claim 1, wherein a plurality of sub-PCBs 13, in which the IC chip and the active elements are integrated, are provided in a plural number and are arranged in an arrangement arranged at the bottom of the main PCB 10. .

The junction box cooling apparatus according to claim 1 or 2, wherein a plurality of heat dissipation fins (17) protrude from the outer surface of the lower case (12) to secure a contact area with air.

The inner surface of the lower case 12 is provided with a protruding contact portion 23 in direct contact with the heat sink 15 of the sub-PCB 13 so as to increase heat transfer efficiency with the heat sink. Junction box cooling apparatus, characterized in that.