KR20130008472A - Method of manufacturing resin film joined body - Google Patents

Abstract

PURPOSE: A method for producing a resin film laminate is provided to thermally fuse resin film members by easily delivering thermal energy from a light absorbing member to the resin film members. CONSTITUTION: A method for producing a resin film laminate comprises following steps. The light absorptivity of a light absorbing member(50a) is higher than resin film members(10,20) about the wavelength of a laser beam. The angle of contact to water on the surface of the light absorbing member is more than 60 degrees. The contact portions of end faces of the resin film members are in contact with the surface of the light absorbing member. Laser light is emitted to the light absorbing member, and the end faces of the resin film members are thermally fused. The contact portions of the end faces of the resin film members are separated from the light absorbing member, and the resin film laminate is formed. [Reference numerals] (AA) During laser irradiation; (BB) After joint

Description

Manufacturing Method of Resin Film Assembly {METHOD OF MANUFACTURING RESIN FILM JOINED BODY}

This invention relates to the manufacturing method of a resin film bonding body, For example, it is related with the manufacturing method of the resin film bonding body which bonds strip | belt-shaped resin film members, and produces a resin film bonding body.

Conventionally, in the case where the strip-shaped resin film member is continuously supplied to the processing machine and processed, the end portion of the preceding resin film member is supplied to the processing machine to supply a new resin film member subsequent to the preceding resin film member. Joining the front-end | tip part of a new resin film member (what is called splice) is performed. Moreover, it is not limited to such a case, The manufacturing method of the resin film bonding body which joins resin film members by the edge part and produces a resin film bonding body is widely performed.

As a manufacturing method of this kind of resin film bonding body, as shown to Fig.4 (a), the resin film members 101 and 102 which show permeability | transmittance with respect to the laser beam 100R are made into the light absorbing agent 104. A method of overlapping through each other, irradiating the laser beam 100R to the overlapped portions, and thermally welding the resin film members 101 and 102 to each other has been proposed (see Patent Document 1).

Moreover, as another method, as shown to FIG. 4 (b), the edge parts of the resin film members 101 and 102 which show permeability with respect to the laser beam 100R are faced, and this butted part is a light absorbing agent. The bonding member 105 to which the 104 is applied is coated so that the light absorbing agent 104 is positioned at the interface between the resin film members 101 and 102 and the bonding member, and is covered with the bonding member 105. The method of irradiating the laser beam 100R to heat welding the resin film members 101 and 102 and the bonding member 105, and joining are also known.

Japanese Patent No. 3682620

However, in these methods, a step may generate | occur | produce in the junction part of the resin film bonding body produced in order to superimpose resin film members, or to heat-melt a resin film member and an adhesion member. In this case, when conveying the said resin film bonding body by what is called roll-to-roll which takes out what wound up the resin film bonding body in roll shape from the outside, and winds it to another roll, a bonding part (seam, a bonding member, etc.) When the step difference (edge) passes through a conveyance roller, the said roller may be damaged. Moreover, when the said resin film bonding body is wound up in roll shape, there exists a possibility that the damage | wound damage resulting from this step may arise in the peripheral part of this step, and the taking-out efficiency of a product worsens.

Therefore, as shown in FIG. 5, the light absorbing agent 104 is applied to the heat generating medium 106, and the resin film members 101 and 102 face each other to form the resin film members 101 and 102 and the heat generating medium 106. The abutted portion is covered with a heat generating medium 106 so that the light absorbing agent 104 is located at an interface, and the laser film 100R is irradiated to a portion covered with the heat generating medium 106 to provide a resin film member 101, The method of manufacturing the resin film bonding body 107 can be considered by heat-bonding only 102 and bonding together, and peeling the said butt | matched part from the heat generating medium 106.

However, in this method, since the light absorbing agent 104 applied to the heat generating medium 106 is attached to the resin film bonding body 107 after heat welding, it is lost from the heat generating medium 106. The process of apply | coating the light absorbing agent 104 to 106 is required, and there exists a problem that lead time becomes long. Moreover, since the coating apparatus which apply | coats the light absorbing agent 104 is needed, there exists also a problem that an initial cost is high and the apparatus itself which manufactures the resin film bonding body by that much scales up. In addition to the portion to which the light absorbing agent should be applied, there is also a concern that the yield of the product may decrease when the light absorbing agent 104 is unintentionally attached as a foreign matter.

Therefore, in order to solve these problems, for example, a method of using a light absorbing member in which a material having light absorptivity is molded, for example, in a film shape or the like, instead of the heat generating medium coated with the light absorbing agent can be considered. . In this method, for example, the light absorbing member is brought into contact with a portion where the two resin film members are in contact with each other, the laser beam is irradiated to the light absorbing member, and only the resin film members are thermally welded and joined. It is a method of manufacturing a resin film bonding body by peeling the said butt | matched part from the said light absorption member.

However, in such a method, the heat-melted resin film member may adhere to the surface of the light absorbing member. When such adhesion occurs, it becomes difficult to peel off the thermally welded resin film member from the surface, or the attached resin film member adheres to the surface, making it difficult to reuse the light absorbing member. Falls out.

In view of the above problems, the present invention efficiently joins resin film members while reducing the step difference of the bonding portion and eliminating the step of applying the light absorber and preventing the light absorber from adhering as foreign matter. Let it be a subject to provide the manufacturing method of the resin film bonding body which can manufacture a resin film bonding body.

The manufacturing method of the resin film bonding body which concerns on this invention is

Butt end faces of resin film member,

With respect to the wavelength of the laser beam to be used, a light absorption member having a surface having a light absorption higher than that of the resin film member and having a contact angle to water of 60 ° or more is used,

The part which the said end surface joined butt contacted the said surface,

By irradiating laser light to the light absorbing member to generate heat, end faces of the resin film member are thermally welded,

The said joined part is peeled from the said light absorption member, and it is set as the resin film bonding body.

In the said manufacturing method, it is preferable that the said light absorption member has the light absorption rate 10% or more with respect to the wavelength of the said laser beam.

In the said manufacturing method, it is preferable that the said light absorption member contains diamond like carbon, glass carbon, or carbon graphite.

In the said manufacturing method, it is preferable that the said laser beam has a wavelength of 800 nm or more and 11000 nm or less.

In the said manufacturing method, it is preferable that the said resin film member has thickness of 150 micrometers or less.

In the said manufacturing method, it is preferable that the said resin film member contains the thermoplastic resin which has melting | fusing point or glass transition point of 300 degrees C or less.

In the said manufacturing method, the said resin film member is a triacetyl cellulose resin, polyethylene terephthalate resin, polycarbonate resin, polymethyl methacrylate resin, cycloolefin polymer, norbornene resin, or polyvinyl alcohol resin. It is preferable to contain.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic process drawing which showed the end surface formation process and the butt | matching process in the manufacturing method of the resin film bonding body which concerns on one Embodiment.
The figure which shows the bonding process in the manufacturing method of the resin film bonding body which concerns on one Embodiment.
The figure which shows the process of winding up the resin film bonding body which concerns on this embodiment in roll shape.
4 is a view showing a method for producing a resin film joined body using a laser beam, which is a conventional technology.
FIG. 5 is a view showing a method for producing a resin film joined body using a laser beam, which may be considered. FIG.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described, referring drawings.

The manufacturing method of the resin film bonding body of this embodiment is a manufacturing method of the resin film bonding body which abuts the end faces of a resin film member together, and makes it a resin film bonding body, and is lighter than the said resin film member with respect to the wavelength of the laser beam to be used. By using a light absorbing member having a surface having a high absorption rate and having a contact angle with respect to water of 60 ° or more, contacting portions of the end surfaces with each other on the surface, and irradiating the light absorbing member with laser light to generate heat, It is a method of heat-welding the end faces of the said resin film member, peeling the said butt | matched part from the said light absorbing member, and making it a resin film bonding body.

Specifically, in the manufacturing method of the resin film bonding body of this embodiment, the edge part of a 1st resin film member and the end part of a 2nd resin film member are overlapped, and it cuts together at both ends of the said overlapped end at the same time, mutually matching these ends. An end surface forming step of forming a cutout portion that is an end surface to be formed; a butt step of bringing one end surface and the other end surface formed in the end surface forming step into contact with each other, and abutting portions thereof on the surface of the light absorbing member; Fixing the abutted portion together with the light absorbing member, and irradiating laser light to the light absorbing member to generate heat, thereby thermally welding the end faces of the resin film member to remove the abutted portion from the light absorbing member. It peels and performs the bonding process made into a resin film bonding body.

Although it is common to contain the same kind of thermoplastic resin as said 1st resin film member and 2nd resin film member, it is not limited to the same kind, If it is a material which can be heat-welded with each other, it may be a different kind, for example Compatible heterogeneous thermoplastic resins can also be used.

Moreover, it is preferable that such a thermoplastic resin has melting | fusing point which is 300 degrees C or less, and it is more preferable to have melting | fusing point which is 250 degrees C or less. When the said thermoplastic resin has melting | fusing point which is 300 degrees C or less, it becomes easy to heat-melt a resin film member.

In addition, when the thermoplastic resin as described above is an amorphous thermoplastic resin having no melting point, the thermoplastic resin preferably has a glass transition point of 300 ° C. or less, and more preferably has a glass transition point of 250 ° C. or less. Do. When the said thermoplastic resin has a glass transition point of 300 degrees C or less, it becomes easy to heat-melt a resin film member.

Thus, since the said thermoplastic resin has melting | fusing point or glass transition point which is 300 degrees C or less, it becomes easy to heat-melt a resin film member.

Examples of such thermoplastic resins include polycarbonate resins, polyvinyl alcohol resins, polyethylene resins, polypropylene resins, polyethylene terephthalate resins, polyvinyl chloride resins, thermoplastic polyimide resins, triacetylcellulose resins, and polymethylmethacryl. Latex resin, cycloolefin polymer, norbornene resin, polyoxymethylene resin, polyetheretherketone resin, polyetherimide resin, polyamideimide resin, polybutadiene resin, polyurethane resin, polystyrene resin, polymethylpentene resin, poly Amide resin, polyacetal resin, polybutylene terephthalate resin, ethylene vinyl acetate resin, etc. are mentioned. In addition, any of these may be used as said thermoplastic resin, and 2 or more may be mixed and used for it.

The thermoplastic resin is at least one of triacetyl cellulose resin, polyethylene terephthalate resin, polycarbonate resin, polymethyl methacrylate resin, cycloolefin polymer, norbornene resin or polyvinyl alcohol resin among these resins. It is preferable that it is above. Since all these resins have melting | fusing point or glass transition point which is 300 degrees C or less, it becomes easy to heat-melt a resin film member as mentioned above.

In addition, the said resin film member may be a single layer, what laminated | stacked multiple layers may be sufficient, and if at least one layer is comprised from a thermoplastic resin, it will not specifically limit.

As a resin film member in which multiple layers were laminated | stacked, the thing in which the base material layer and the protective film layer with an adhesive were laminated, for example is mentioned.

In addition, when heat-sealing the resin film member in which these multiple layers were laminated | stacked, each layer may be temporarily peeled off and heat-welded for each layer, or thermal welding may be carried out with multiple layers laminated | stacked. For example, when the compatibility of a base material layer and a protective film layer is bad, and a mixed layer is not formed even if both layers are heat-melted, even if the resin film members which laminated | stacked both layers were thermally welded, the base material layer and a protective film layer after heat welding. It is possible to peel off.

Moreover, as thickness of the said resin film member, it is preferable that it is 150 micrometers or less, and it is more preferable that it is 100 micrometers or less. Since the said thickness is 150 micrometers or less, since the heat energy generate | occur | produced from the light absorption member by irradiation of a laser beam is easier to be transmitted over the whole thickness direction (depth direction) of a resin film member, heat-welding resin resin members more fully Easier

On the other hand, it is preferable that the thickness of a resin film member is 5 micrometers or more, and it is more preferable that it is 20 micrometers or more. When the said thickness is 5 micrometers or more, the bonding strength of a resin film bonding body can be raised more fully by thickness.

Moreover, it is preferable that the light transmittance with respect to the said laser beam is 30% or more, and, as for the said resin film member, it is more preferable that it is 50% or more.

In addition, "light transmittance" is a value represented by "100%-" light absorption rate (%) ", and is a value calculated | required by following formula (1).

Transmitted light intensity ÷ incident light intensity x 100% ... (1)

(However, "incident light intensity" is determined by "irradiation light intensity-surface reflected light intensity.")

In the said end surface formation process, as shown to Fig.1 (a), in the state which overlapped the edge part of the 1st resin film member 10 and the edge part of the 2nd resin film member 20, the resin film member 10 20) Both ends are fixedly arranged, and by cutting the general resin film members 10 and 20 using a knife 40 or the like, the both ends of the overlapped ends are cut at once, which are end faces coinciding with each other. Form cutouts. As a fixing method of the resin film members 10 and 20, general fixing methods, such as the method of fixing using the adsorption apparatus 30 etc. which fix the resin film members 10 and 20 by adsorption | suction, Can be used.

And in the said end surface formation process, as shown in FIG.1 (b), the cut end 10a of one resin film member and the cut end 20a of the other resin film member are cut-out end collection part ( (Not shown).

The manufacturing method of the resin film bonding body of this embodiment implements the said end surface formation process, and in the said butt process, the one end surface and the other end surface were made into the state where the butted end surfaces were substantially parallel. You can meet.

In the butt step, as shown in FIG. 1C, the stage 50 on which the resin film members 10 and 20 are mounted while fixing each of the resin film members 10 and 20 with the adsorption device 30. (The stage 50 is described in FIG. 2), and finely adjusts the adsorption device 30 as necessary to achieve a desired gap, and an end face on the other side of the end face formed in the end face forming step. Back to

In addition, in the above butt step, the length of the gap between the resin film members 10 and 20 (the largest of the lengths in the direction perpendicular to the end face in the gap cut between the resin film members 10 and 20). It is preferable to make it less than the thickness of a resin film member, It is more preferable to make it less than half the thickness of the resin film member, It is especially preferable to make it less than 1/3 of the thickness of a resin film member. In the manufacturing method of the resin film bonding body of this embodiment, when the length of the said gap is less than the thickness of a resin film member, the resin of a resin film member is heat-melted and fluidized by the heat energy which generate | occur | produced from the light absorption member by irradiation of a laser beam. Thereby, a gap can be filled and favorable joining state and strength can be obtained.

In addition, in the butt step, the length of the gap is measured using a gap monitor (not shown) provided with a camera (not shown) or the like, and the gap of the gap is caused by an irregular factor (for example, an earthquake or the like). When the length becomes more than the prescribed value, the length of the gap may be made smaller than the prescribed value by moving and finely adjusting at least one of the adsorption devices 30 that fix the resin film members 10 and 20.

In the bonding step, as shown in FIG. 2, on the stage 50 where the light absorbing member 50a is in contact with the butted portion, the butted portion is pressed with a pressurizing member 60 which is transparent glass. While the pressure is fixed, the butted portion is brought into contact with the light absorbing member 50a. Then, in the pressure-fixed state, the light absorbing member 50a is irradiated with laser light R to generate heat, and the end faces of the resin film members 10 and 20 are thermally welded and bonded to each other to form a light absorbing member ( The butt | bonded part is peeled from 50a), and the resin film bonding body 80 is produced.

In addition, as the method of contacting the butted portion to the light absorbing member 50a, the butted portion is absorbed in addition to the method of placing the contacted portion on the upper surface of the light absorbing member 50a and contacting it (Fig. 2). The method (not shown) etc. which press and contact the lower surface of the member 50a are mentioned.

It is preferable that it is 0.5-100 kgf / cm <2>, and it is more preferable that it is 10-100 kgf / cm <2> in the facing part which is the part to which the laser beam R is irradiated at the time of the said pressurization fixation.

The shape of the pressing member 60 is not particularly limited as long as a load is applied to the butted portion, but as the shape, for example, a flat plate, a cylinder, or a spherical shape can be used.

3 mm or more and less than 30 mm are preferable, and, as for the thickness of the press member 60, 5 mm or more and less than 20 mm are more preferable. In the joining process, by using the pressing member 60 having a thickness of 3 mm or more, the pressing member 60 itself is less likely to be distorted at the time of pressing and fixing, and thus, good pressing and fixing can be performed. Moreover, in the said bonding process, when using the press member 60 whose thickness is less than 30 mm, when the laser beam R permeate | transmits the press member 60, it becomes difficult to lose the laser beam R, and the resin film member It becomes easy to heat weld each other (10, 20) efficiently.

Illustrating the transparent glass which comprises the pressurizing member 60, the hard borosilicate glass marketed by the brand name "tempax", the borosilicate glass marketed by the brand name "pyrex", and the brand name "Bicore" are marketed Molten quartz, alkali-free glass, including 96% silica glass, barium borosilicate glass sold under "D263", alkali free glass sold under "OA10", aluminoborosilicate glass sold under the trade name "AF45", Lead alkali glass, soda-lime glass, quartz glass, etc. are mentioned.

When the laser beam R transmits the pressurizing member 60, the pressurizing member 60 hardly loses the laser beam R, and it becomes easy to heat-weld the said resin film members 10 and 20 efficiently. In view of the above, it is preferable to have a light transmittance higher than 50% with respect to the wavelength of the laser light R, and more preferably to have a light transmittance higher than 70%.

In the bonding step, the laser beam R is provided between the butted portion and the pressing member 60 from the viewpoint of uniformly pressing the large area of the butted portion with the pressing member 60 to perform good bonding over the entire area. The interphase member 70 which has permeability to and which is superior in cushioning property to the pressing member 60 may be interposed.

As a material of the interphase member 70, a rubber material (for example, silicone rubber, urethane rubber, etc.), a resin material (for example, polyethylene, etc.) etc. are mentioned.

In addition, the interphase member 70 may be a single layer or may be laminated.

Moreover, it is preferable that the interphase member 70 has the light transmittance higher than 50% with respect to the wavelength of the laser beam R to be used, and it is more preferable to have the light transmittance higher than 70%.

Moreover, 50 micrometers or more and less than 5 mm are preferable, and, as for the thickness of the interphase member 70, 1 mm or more and less than 3 mm are more preferable. In the said joining process, by using the interphase member 70 whose thickness is 50 micrometers or more, it becomes possible to disperse | distribute the force generated by pressurization more fully. Thereby, the large area of the butt | matched part can be pressurized more uniformly with the press member 60, and a more favorable joining can be performed over the whole area. In addition, by using the interphase member 70 having a thickness of less than 5 mm, the laser light R is less likely to be lost when the laser beam R passes through the interphase member 70, and thus the resin film members 10 and 20. It becomes easy to heat-weld each other efficiently.

The laser beam R used in the said bonding process plays a role which heat | generates the light absorption member 50a, and if the range which does not impair the effect of this invention, the kind of laser will not be specifically limited. The laser is preferably a solid laser such as a semiconductor laser, a fiber laser, a femtosecond laser, a YAG laser, a CO ₂ laser, or the like, from the viewpoint of having light in a visible light region or an infrared region, which is a wavelength having good conversion efficiency of energy into heat. Is a gas laser. Among these, a semiconductor laser and a fiber laser are more preferable from a viewpoint that the laser beam of low cost and spatially uniform intensity can be obtained easily. In a process via a multiphoton absorption process such as a process by a femtosecond laser or a picosecond laser, by optimizing the focal position and the input energy of the laser regardless of the transparency of the resin film members 10 and 20 with respect to the laser wavelength. , Joining can be achieved. In addition, from the viewpoint of urging heat melting while avoiding disassembly of the resin film members 10 and 20, the CW laser of the continuous wave is preferable to the pulse laser to which high energy is instantaneously input.

With respect to the laser, the output (power), power density, beam shape, irradiation count, scanning speed, irradiation time, integrated irradiation amount, and the like are the same as the light absorption rates of the resin film members 10 and 20 and the light absorbing member 50a. What is necessary is just to set suitably according to the difference of an optical characteristic, melting | fusing point, thermal characteristics, such as glass transition point (Tg).

Moreover, as a power density of the laser to irradiate, it is 50 W from the viewpoint of heat-melting and fluidizing the part which the resin film members 10 and 20 butted by the laser beam R through the light absorption member, and obtaining a firm bond. / Cm 2 to 3,000 W / cm 2 are preferred, 200 W / cm 2 to 1,500 W / cm 2 are more preferred, and 250 W / cm 2 to 1,000 W / cm 2 are particularly preferred.

Moreover, as an integrated irradiation amount, 10 J / cm <2> -300 J / cm <2> is preferable from a similar viewpoint, 20 J / cm <2> -150 J / cm <2> is more preferable, 30 J / cm <2> -100 J / cm <2> is especially preferable. .

In the said bonding process, the laser beam R which permeate | transmitted the resin film members 10 and 20 is irradiated by the laser beam R along the part which the resin film members 10 and 20 butted together, the light absorption member 50a. Is investigated.

Moreover, in the said bonding process, it is possible to irradiate the spot beam which condensed by the condensing lens to the desired beam size, scanning to the butt | matched part. Moreover, it is also possible to generate a line-shaped laser beam by optical members, such as a cylindrical lens and a diffraction optical element, and to irradiate to the butted part. Moreover, it is also possible to arrange | position a plurality of laser light sources along the butted part, and to irradiate collectively by no scanning.

In addition, the wavelength of the laser light is preferably 800 nm to 11000 nm, whereby the laser light is more easily absorbed by the light absorbing member 50a. Moreover, it is more preferable that the wavelength of a laser beam is 800 nm-2000 nm. As such, when the wavelength of the laser beam is a near infrared region, the energy conversion efficiency to heat is good and a stable laser beam can be easily obtained.

The light absorption member 50a has a surface whose light absorption is higher than that of the resin film member with respect to the wavelength of the laser light to be used, and whose contact angle with water is 60 ° or more.

The light absorbing member 50a has a higher light absorption than the resin film member with respect to the wavelength of the laser beam to be used, thereby absorbing and generating the irradiated laser light R, thereby producing the resin film members 10 and 20. It transfers heat to the resin film member (10, 20) plays a role in thermal welding.

In addition, it is preferable that the light absorption member 50a has a light absorption of 10% or more with respect to the laser beam to be used, more preferably 20% or more of light absorption, and particularly preferably has a light absorption of 30% or more.

When the light absorption member 50a has the light absorption rate of 10% or more, the resin film member can be thermally melted more reliably. Moreover, even if the laser power of a laser beam is comparatively low, it becomes possible to fully melt | dissolve a resin film member, and energy efficiency becomes higher.

Such light absorption can be measured with a spectrophotometer (made by JASCO, V-670, integrating sphere).

In addition, the said light absorption rate can be adjusted with thickness, the component ratio, etc. of the light absorption member 50a.

Moreover, since the said light absorption member 50a has the surface whose said contact angle is 60% or more, it becomes excellent in water repellency, and it becomes difficult for the heat melted resin film members 10 and 20 to adhere to the light absorption member 50a. Thereby, the heat-welded resin film member can be easily peeled from the light absorbing member 50a. In addition, the thermally welded resin film member can be prevented from adhering to the light absorbing member 50a and fixed to it, and the light absorbing member 50a can be used repeatedly. Therefore, joining of a resin film member becomes efficient.

From the viewpoint of excellent water repellency as described above, the contact angle is preferably 70 ° or more, more preferably 80 ° or more.

The contact angle is an automatic contact angle meter (manufactured by Kyowa Chemical Co., Ltd., DM500) as a measuring device, a droplet method as a measuring method, and a θ / 2 method as an analysis method, and water droplets are applied to the light absorbing member 50a. The waiting time from the dropwise addition to the measurement can be measured at 1000 msec.

In addition, the said contact angle can be adjusted with a structural element, surface state (roughness), etc. of the light absorption member 50a.

Moreover, it is preferable that the light absorption member 50a is superior in heat resistance than the resin film members 10 and 20 so that it may not melt together when the resin film members 10 and 20 melt | dissolve by laser light irradiation. Specifically, the melting point of the light absorbing member 50a is preferably higher than the melting point of the resin film members 10 and 20, and the melting point of the light absorbing member 50a is preferably 300 ° C or more. Moreover, it is preferable that the oxidation temperature of the light absorption member 50a is 300 degreeC or more, and it is more preferable that it is 350 degreeC or more. When the oxidation temperature is 300 ° C. or higher, it is easy to prevent the light absorbing member 50a from oxidizing due to heat generated in order to heat-melt the resin film members 10 and 20. It is possible to prevent and to repeat the use more reliably. Moreover, as a change of such a characteristic, for example, when it contains the diamond like carbon mentioned later as the light absorption member 50a, the structure of the said surface is graphitized by the surface oxidation reaction, and this graphite is made The light absorbency changes, the electrical conductivity changes, etc. are mentioned.

Further, the light absorbing member 50a preferably has a low thermal conductivity from the viewpoint of efficiently transferring heat generated by laser light irradiation to the resin film members 10 and 20, and specifically, the thermal conductivity is 100 W. It is preferable that it is lower than / m / K, it is more preferable that the thermal conductivity is lower than 50 W / m / K, and it is still more preferable that the thermal conductivity is lower than 20 W / m / K.

It is preferable that such light absorption member 50a contains diamond-like carbon (DLC), glass carbon, or carbon graphite. Thereby, the laser beam R can be efficiently absorbed and generate heat. Moreover, it becomes easy to make the contact angle of the said surface into the said range.

In addition, diamond-like carbon means an amorphous carbon in which a graphite structure and a diamond structure are mixed.

The shape of the light absorbing member 50a is not particularly limited as long as it has a surface in contact with the bottom surface or the top surface of the butted portion. In addition, in this embodiment, the light absorption member 50a is formed in the film form, is arrange | positioned on the surface of the base part 50b, and is provided in the stage 50 with the said base part 50b.

Specifically, PVD methods (e.g., vacuum deposition, ion plating, sputtering, laser ablation, ion beam deposition, and ion implantation, etc.) and CVD methods (e.g., thermal CVD, plasma CVD) By a method such as), a film-like light absorbing member 50a is provided on the base portion 50b. In this manner, the light absorbing member 50a is in the form of a film, whereby heat generated by the irradiation of the laser light R is likely to be left on the surface layer of the light absorbing member 50a, that is, diverges toward the base 50b. Since it is hard to make, it becomes possible to transfer heat to a resin film member efficiently, and to join resin film members together.

The surface of the light absorbing member 50a preferably has a Vickers hardness of 1000 Hv or more, more preferably 2000 Hv or more, and particularly preferably 3000 Hv or more. If the Vickers hardness of the surface is less than 1000 Hv, the surface may not be able to withstand the stress caused by the heat generated by the absorption of the laser light, and may deform and deteriorate the quality of the produced resin film joined body. On the other hand, when Vickers hardness is 1000 Hv or more, the said surface can fully bear the stress by the said heat, and the fall of the quality of the produced resin film bonding body can be suppressed.

The arithmetic mean roughness Ra of the surface of the light absorbing member 50a is preferably less than 100 nm, more preferably less than 70 nm, still more preferably less than 50 nm. When the arithmetic mean roughness of the surface is 100 nm or more, the hot-melt resin film member easily adheres to the surface of the light absorbing member 50a by the anchor effect, so that the attached resin film member is fixed and the light absorbing member 50a is fixed. ) Is difficult to reuse, or the thermally welded resin film member may be difficult to peel off from the light absorbing member 50a. On the other hand, since the arithmetic mean roughness of the said surface is less than 100 nm, generation | occurrence | production of the said anchor effect is suppressed and it becomes difficult for the heat-melted resin film member to adhere by the light absorption member 50a, so that resin film members may After heat welding, the releasability at the time of peeling from the light absorbing member 50a can be improved.

The surface of the light absorbing member 50a may be surface treated from the viewpoint of preventing contamination transfer or from the viewpoint of excellent water repellency. As such a surface treatment, a fluorine treatment etc. are mentioned, for example.

0.1 micrometer-5.0 micrometers are preferable, as for the thickness of the light absorption member 50a, 0.3 micrometer-2.0 micrometers are more preferable, 0.5 micrometer-1.5 micrometers are especially preferable. When the said thickness is 0.1 micrometer or more, the light absorption member 50a becomes easy to absorb the laser beam R, and it becomes easy to heat-weld the resin film members 10 and 20 efficiently. Moreover, when the said light absorption member 50a is arrange | positioned on the surface of the base part 50b like this embodiment because the said thickness is 5.0 micrometers or less, at the time of temperature change of the light absorption member 50a, the base part The peeling of the light absorbing member 50a from the base part 50b can be suppressed by the difference of the linear expansion coefficient of 50b and the light absorbing member 50a.

Moreover, the said light absorption member 50a may contain the fluorine element for the purpose of improving water repellency, and may also contain an element suitable suitably according to a required specification. Moreover, as one form when the light absorbing member 50a contains fluorine, the above-mentioned fluorine treatment of the surface of the light absorbing member 50a is mentioned.

As described above, the stage 50 of the present embodiment includes a base 50b and a light absorbing member 50a disposed on the surface of the base 50b.

The material of the base 50b is not particularly limited as long as the material does not impair the effects of the present invention. Examples of the material of the base 50b include metal, glass, resin, rubber, ceramics, and the like. Among these, glass is particularly preferable. Since the material of the base portion 50b is glass, the thermal conductivity of the glass is relatively low, so that heat generated from the light absorbing member 50a due to the irradiation of the laser beam R is difficult to move toward the base portion 50b side. The heat can be efficiently transferred to the resin film members 10 and 20. Moreover, since the heat resistance of glass is high, the durability of the base part 50b becomes high.

In addition, the stage 50 may be provided with the primer layer (not shown) between the light absorption member 50a and the base part 50b. As a material of a primer layer, a silicone type material etc. are mentioned, for example. Thus, by providing a primer layer, the adhesiveness of the light absorption member 50a with respect to the base part 50b improves, and it becomes difficult for the light absorption member 50a to peel from the base part 50b.

As mentioned above, according to the manufacturing method of the resin film bonding body of this embodiment, the step | step of the bonding part 80a is made small, the process which does not require the process of apply | coating a light absorber, and also suppresses that a light absorber adheres as a foreign material. While bonding, the resin film members 10 and 20 can be bonded together, and the resin film bonding body 80 can be manufactured.

In addition, in the manufacturing method of the resin film bonding body of this embodiment, although the light absorber does not need to be apply | coated, you may use a light absorber of a quantity smaller than before.

Moreover, the manufacturing method of the resin film bonding body of this embodiment is especially a manufacturing method of the raw material film containing the so-called roll-to-roll conveyance process which unwinds the raw material film wound up in roll shape, and winds up the unwound raw material film. It is a method suitable for what is called a splice which makes a strip-shaped elongate film continuously in order by joining the front end side of the next raw material film to the terminal end side of the preceding raw material film in this order.

In addition, the thickness of the bonding part (that is, the part affected by the heat generate | occur | produced by laser irradiation) in the resin film bonding body produced by the manufacturing method of the resin film bonding body of this embodiment, and the part which is not bonded (that is, The difference with the thickness of the part which is not affected by the heat generated by the laser irradiation is preferably 20 µm or less, and more preferably 10 µm or less. When the difference in thickness is 20 µm or less, when the resin film bonding body is wound in a roll shape, occurrence of impact scratches due to the difference in thickness can be further suppressed. Moreover, it is preferable that the ratio (ratio = said joining part / said unjoined part) with respect to the said non-joined part is 1.5 or less, and it is more preferable that it is 1.2 or less from a viewpoint of further suppressing a hit | damage | wound scratch. Do.

In addition, such a difference of thickness can be adjusted by setting a laser irradiation condition, a pressurization condition, the hardness of a press member, etc. suitably.

In addition, the resin film bonding body produced by the manufacturing method of the resin film bonding body of this embodiment can also be set as the roll body 90 obtained by winding the resin film bonding body 80 in roll shape, as shown in FIG. .

In addition, said resin film bonding body and a roll body can be applied to the optical film provided with these, for example. As such an optical film, the manufacturing method of the resin film bonding body of this embodiment is two or more ends of the protective film for polarizing plates (for example, triacetyl cellulose, a cycloolefin polymer etc.) used for a liquid crystal display device etc., for example. The long raw material obtained by using and bonding as a resin film member of the said is mentioned. In addition, such an optical film can also be applied to the polarizing film provided with this, for example. As such a polarizing film, the polarizing plate obtained by bonding the said elongate raw material and a polyvinyl alcohol film by dyeing and extending | stretching the polarizer obtained through an adhesive agent is mentioned, for example.

<The manufacturing method of the resin film bonding body of another embodiment>

The manufacturing method of the resin film bonding body of this invention is not limited to the manufacturing method of the resin film bonding body of the said embodiment, It can design change suitably.

For example, the manufacturing method of the resin film bonding body of the said embodiment abuts the end surface of the 2nd resin film member 20 to the end surface of the 1st resin film member 10, but of the resin film bonding body of this invention In addition, the manufacturing method may face the other end surface of the said resin film member 10 to the one end surface of the one resin film member 10. Specifically, the manufacturing method of the resin film bonding body of this invention overlaps one end part of one resin film member 10, and the other end part of the said resin film member 10, and cuts both the said overlapping edge parts at once. Thereby, you may perform the end surface formation process which forms the cutout which is the end surface which mutually coincides at these ends, the butt process which abuts the one end surface and the other end surface formed in the said end surface formation process, and the said joining process.

Moreover, in the manufacturing method of the resin film bonding body of this invention, you may collect | recover 2 or more terminal parts of a raw material, what is called an end part, for example, and may use these as a resin film member.

Although the end part has the problem which was discarded conventionally without being fully recycled, but manufactures the resin film assembly which hardly produces a damage | wound damage, even if it winds up, reusing an end part as a resin film member like the manufacturing method of this resin film joined body. It is preferable also from a viewpoint of suppressing material loss and reducing industrial waste.

The manufacturing method of the resin film bonding body which concerns on this invention is not limited to the structure of the said embodiment. In addition, the effect of the manufacturing method of the resin film bonding body which concerns on this invention is not limited to said effect. The manufacturing method of the resin film bonding body which concerns on this invention can be variously changed in the range which does not deviate from the summary of this invention.

Example

Next, an Example and a comparative example are given and this invention is demonstrated further more concretely.

(Example 1)

The following resin film member, a laser, a pressing member, and a stage were used.

The laser beam is scanned into one line of the DLC member while the end face of the resin film member 1 is brought into contact with the end face of the resin film member 2 on the DLC member, and the abutted portion is pressed against the surface of the DLC member of the stage by the pressing member. By irradiating and generating heat, the end faces of the resin film member were heat-welded, the DLC member was peeled off from the butted part, and the resin film bonding body was produced.

As a result, the resin film bonding body without a level | step difference was able to be produced, without using a light absorbing agent. Moreover, the obtained resin film bonding body showed favorable bonding property by the tensile strength of 110N / 30mm width. Moreover, adhesion of the resin film member to the surface of the DLC member was not confirmed, and the DLC member could be easily peeled from the heat-welded resin film member.

(Example 2)

A resin film joined body was produced in the same manner as in Example 1, except that a polyvinyl alcohol film (manufactured by Gureray, 75 μm thick, 30 mm wide, melting point 230 ° C., light absorptivity 1% or less) was used as the resin film member. .

As a result, the resin film bonding body without a level | step difference was able to be produced, without using a light absorbing agent. Moreover, the obtained bonded body showed favorable joining property with 90 N / 30mm of tensile strength. Moreover, adhesion of the resin film member to the surface of the DLC member was not confirmed, and the DLC member could be easily peeled from the heat-welded resin film member.

(Example 3)

As the light absorbing member of the stage, a glass carbon member (made by Ividene, thickness: 1 mm, light absorption: 82%, contact angle with respect to 1 μL of water: 66.8 °) was used, and sheet-shaped glass carbon was not formed. The resin film bonding body was produced like Example 1 except having used the member as a stage.

As a result, the resin film bonding body without a level | step difference was able to be produced, without using a light absorbing agent. Moreover, the obtained bonded body showed favorable joining property with the tensile strength of 100 N / 30 mm. Moreover, adhesion of the resin film member to the surface of the glass carbon member was not confirmed, and the glass carbon member could be easily peeled from the heat-welded resin film member.

(Example 4)

The following resin film member, a laser, a pressing member, and a stage were used.

The resin film member 1 and the resin film member 2 were bonded like Example 1 except using these conditions.

As a result, the resin film bonding body without a level | step difference was able to be produced, without using a light absorbing agent. Moreover, the obtained bonded body showed favorable joining property with the tensile strength of 120N / 30mm. Moreover, adhesion of the resin film member to the surface of the carbon graphite member was not confirmed, and the carbon graphite member could be easily peeled from the heat welded resin film member.

(Comparative Example 1)

A light absorbing agent (Clearweld (registered trademark) LD 120 C, 10 nL / mm 2 manufactured by Zentex) was coated on the upper surface of the polyimide film (manufactured by DuPont, Kapton V, thickness: 75 µm), and the polyimide film layer The light absorption rate at the wavelength of 940 nm of the said light absorber was set to 30% by producing the laminated body which consists of the said light absorber layer. In addition, as a stage, only the base part which is not provided with a light absorbing member is used, and the said laminated body is mounted on the upper surface of the base part so that the said light absorber layer may be arrange | positioned on the upper side, and then the end surface of the resin film member 1 on the light absorber layer. And the end face of the resin film member 2 were matched. The laser power was 50 W and the scanning speed was 40 mm / sec. Other than that was performed similarly to Example 1, and obtained the resin film bonding body.

As a result, the obtained bonded body showed favorable bondability with the tensile strength of 90 N / 30 mm. However, when the periphery of the bonding part of the obtained resin film bonding body was simply wiped off with a rag (cloth), the contamination by the light absorbing agent was confirmed. Therefore, when this light absorber conveys a resin film bonding body by what is called a roll-to-roll, it turned out that the light absorber may produce a problem, such as a cause of contamination adhesion to a nip roller or the like.

(Reference example)

A resin film bonding body was produced in the same manner as in Example 1 except that the light absorbing member had a thickness of 0.2 μm and a light absorption at a wavelength of 940 nm of 8%.

As a result, since the heat energy generated by irradiating the laser beam to the light absorbing member was insufficient, the shear rate of the resin film bonding body was low at 10 N / 30 mm, and the bonding was insufficient.

(Example 5)

A resin film assembly was produced in the same manner as in Example 1 except that the light absorption member had a thickness of 0.2 μm, a light absorption rate of 940 nm at 8%, and a laser power of 80 W.

As a result, the obtained bonded body showed good joining property with a shear rate of 90 N / 30 mm. However, the energy required for joining was so great that it was impossible to save energy.

(Comparative Example 2)

A resin film bonding body was produced in the same manner as in Example 1 except that only the base portion where the light absorbing member was not provided as a stage was used. At this time, the light absorption in wavelength 940nm in the quartz glass plate which is a base part was 1% or less, and the contact angle with respect to 1 microliter of water was 67 degrees.

As a result, since the quartz glass plate was insufficient in light absorption, since sufficient heat energy could not be generated even when heat-melting the resin film members 1 and 2, the resin film members 1 and 2 could not be bonded.

(Comparative Example 3)

As the light absorbing member, a carbon-containing polyimide sheet (manufactured by Nitto Denko Co., Ltd., polyimide seamless belt, thickness 25 mm, light absorption at a wavelength of 940 nm: 40%, contact angle with respect to 1 μL of water: 58 °) was used. The end face of the resin film member 1 and the end face of the resin film member 2 were thermally welded in the same manner as in Example 1 except that the carbon-containing polyimide sheet was placed on the upper surface to prepare a stage.

And when the resin film member 1 and the resin film member 2 which were heat-welded in this way were peeled from the light absorption member, TAC originating in at least one of the resin film member 1 and the resin film member 2 was affixed.

For this reason, this light absorbing member could not be reused.

(Example 6)

 By depositing DLC on one surface of the molten quartz glass as the base part, a DLC member (thickness: 1 μm, light absorption at a wavelength of 940 nm: 10%, contact angle with respect to 1 μL of water on the surface: 72 °) was produced. The resin film bonding body was produced like Example 1 except having used DLC member as a light absorption member, and making laser power 35W.

As a result, the resin film bonding body without a level | step difference was able to be produced, without using a light absorbing agent. Moreover, the obtained bonded body showed favorable joining property with the tensile strength of 160 N / 30 mm. Moreover, adhesion of the resin film member to the surface of the DLC member was not confirmed, and the DLC member could be easily peeled from the heat-welded resin film member.

10: first resin film member
10a: cut-out end
20: second resin film member
20a: cut-out end
30: adsorption device
40: sword
50: stage
50a: light absorption member
50b: Foundation
60: pressing member
70: interphase member
80: resin film bonding
80a: junction
90: roll
R: laser light
101: resin film member
102: resin film member
104: light absorbing agent
105: joint member
106: heating medium
107: resin film bonding
100R: laser light

Claims (7)

It is a manufacturing method of the resin film bonding body which joins the edge faces of a resin film member together, and makes it a resin film bonding body,
With respect to the wavelength of the laser beam to be used, a light absorption member having a surface having a light absorption higher than that of the resin film member and having a contact angle to water of 60 ° or more is used,
By heat-welding the end faces of the resin film member by contacting the surface where the end faces are in contact with the surface and irradiating a laser beam to the light absorbing member to generate heat,
The said butted part is peeled from the said light absorption member, and it is set as the resin film bonding body, The manufacturing method of the resin film bonding body characterized by the above-mentioned. The said light absorption member has a light absorption rate 10% or more with respect to the wavelength of the said laser beam, The manufacturing method of the resin film bonding body of Claim 1 characterized by the above-mentioned. The method for producing a resin film joined body according to claim 1 or 2, wherein the light absorbing member contains diamond-like carbon, glass carbon or carbon graphite. The said laser beam has a wavelength of 800 nm or more and 11000 nm or less, The manufacturing method of the resin film bonding body of Claim 1 or 2 characterized by the above-mentioned. The said resin film member has a thickness of 150 micrometers or less, The manufacturing method of the resin film bonding body of Claim 1 or 2 characterized by the above-mentioned. The said resin film member contains the thermoplastic resin which has melting | fusing point or glass transition point of 300 degrees C or less, The manufacturing method of the resin film bonding body of Claim 1 or 2 characterized by the above-mentioned. The said resin film member is a triacetyl cellulose resin, a polyethylene terephthalate resin, a polycarbonate resin, a polymethyl methacrylate resin, a cycloolefin polymer, norbornene resin, or polyvinyl. It contains one or more of alcohol resin, The manufacturing method of the resin film bonding body characterized by the above-mentioned.

Images