KR20120140487A - Heating substrate and method for manufacturing the same - Google Patents

Heating substrate and method for manufacturing the same Download PDF

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Publication number
KR20120140487A
KR20120140487A KR1020110060246A KR20110060246A KR20120140487A KR 20120140487 A KR20120140487 A KR 20120140487A KR 1020110060246 A KR1020110060246 A KR 1020110060246A KR 20110060246 A KR20110060246 A KR 20110060246A KR 20120140487 A KR20120140487 A KR 20120140487A
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KR
South Korea
Prior art keywords
electrode
slot opening
substrate
thin film
branch
Prior art date
Application number
KR1020110060246A
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Korean (ko)
Inventor
김덕종
곽호상
강용필
김경진
한창수
Original Assignee
한국기계연구원
금오공과대학교 산학협력단
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Application filed by 한국기계연구원, 금오공과대학교 산학협력단 filed Critical 한국기계연구원
Priority to KR1020110060246A priority Critical patent/KR20120140487A/en
Publication of KR20120140487A publication Critical patent/KR20120140487A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/03Electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/68Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/688Fabrication of the plates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/68Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)

Abstract

A heating substrate according to an embodiment of the present invention is a substrate having at least one first slot opening formed side by side with a distance from one edge and at least one second slot opening formed side by side with a distance from the other edge parallel to the one edge. And a conductive thin film formed on one surface of the substrate except for the first slot opening and the second slot opening, a first electrode formed on the conductive thin film, a first branch electrode branched from the first electrode, and the conductive thin film. A second electrode formed above and spaced apart from the second electrode with the first branch electrode and the second slot opening therebetween and spaced apart from the second electrode with the first electrode and the first slot opening interposed therebetween An electrode and the first electrode, the second electrode, the first branch electrode, and the second branch electrode on the conductive thin film; It includes an insulating layer.

Description

Heat-generating substrate and its manufacturing method {HEATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME}

Embodiments of the present invention relate to a heat generating substrate having a conductive thin film and an electrode, and a method of manufacturing the same. More specifically, heat is generated when a conductive thin film and an electrode are formed on a substrate and current flows through the electrode and the conductive thin film. A substrate and a method of manufacturing the same.

In general, the heating substrate has a structure in which a conductive thin film and an electrode are formed on an insulating substrate. When a direct current or alternating voltage is applied to both ends of the electrode, heat is generated as current flows through the conductive thin film.

The amount of heat generated per unit area of the conductive thin film is proportional to the square of the current density flowing in the thin film. When the direct current voltage V is applied between two electrodes having a distance d from each other, the calorific value per unit area of the conductive thin film is proportional to the square of (V / d) and inversely proportional to the sheet resistance of the thin film.

When the same conductive thin film is used as the heating element and the area of the heating substrate is enlarged, the spacing between the electrodes increases, and the amount of heat generated per unit area decreases in inverse proportion to the square of the increased spacing, thereby making it difficult to secure the required heat generating performance.

In order to suppress such a decrease in calorific value, a structure is known in which a distance between electrodes having polarities opposite to each other through a plurality of branch electrodes extending branched from two electrodes separated from each other is known.

However, as the end of the branch electrode is closer to the electrode of the opposite polarity, a strong current flow occurs between them, there is a problem that the local heat generation efficiency is lowered with local overheating.

In order to overcome this problem, an insulating region may be provided between the branch electrode and the electrode of the opposite polarity so that the conductive thin film may have a relatively constant current density as a whole.

However, since heat generation does not occur in the insulation region, the larger the insulation region, the lower the uniformity of the heat generation temperature and the heat generation efficiency. Therefore, it is required to form a fine pattern by minimizing the insulating region.

As a general method of forming the insulating region, a screen mask is formed in which only the portion where the conductive thin film is to be formed is perforated, the mask is placed on the substrate, and the conductive thin film is formed by deposition, spray spraying, or roll printing. have.

However, deposition or chemical etching, which can accurately realize fine patterns, is complicated, expensive, and difficult to make a large area. Using methods such as spray spraying or roll printing, it is difficult to precisely form an insulating region of a fine pattern. In particular, when the conductive thin film is formed using a material having a small mass ratio such as a conductive material contained in a liquid such as a carbon nanotube dispersion, the conductive material may penetrate into an insulating region of a fine pattern by smearing.

In addition, all of the above-described methods have a problem in that they are used as a method of producing a heater corresponding to a relatively low-cost product in that an expensive mask is manufactured and used.

Embodiments of the present invention provides a heat generating substrate having a structure that can be easily manufactured and capable of surface heating of a large area.

Also provided is a method of manufacturing the above-described heating substrate.

According to an embodiment of the present invention, the heating substrate has at least one first slot opening formed in parallel with a distance from one edge and at least one second slot opening formed in parallel with a distance from the other edge parallel to the one edge. A substrate, a conductive thin film formed on one surface of the substrate except for the first slot opening and the second slot opening, a first electrode formed on the conductive thin film and a first branch electrode branched from the first electrode, and the conductive A second electrode formed on the thin film and spaced apart from the second electrode having the first branch electrode and the second slot opening interposed therebetween and spaced apart from the second electrode with the first electrode and the first slot opening interposed therebetween The first electrode, the second electrode, the first branch electrode, and the second branch electrode are formed on a branch electrode and the conductive thin film. It includes an insulating layer.

The first electrode may be formed parallel to the first slot opening between the one side edge of the substrate and the first slot opening. The second electrode may be formed in parallel with the second slot opening between the other edge of the substrate and the second slot opening.

The first branch electrode may extend from the first electrode toward the second electrode, and the second branch electrode may extend from the second electrode toward the first electrode.

The first branch electrode and the second branch electrode may be alternately arranged side by side.

The insulating layer may fill an interior of the first slot opening and the second slot opening.

In the above heat generating substrate, the substrate may be made of a material that can be punched or sheared.

The substrate may be a thin film made of a resin-based material or a material such as paper.

The conductive thin film may be formed in the same pattern as the substrate.

In addition, according to an embodiment of the present invention, the method of manufacturing a heating substrate comprises the steps of preparing a substrate, the first slot opening in parallel to the one side edge at a distance to the substrate and the other edge in parallel with the one side edge Forming a second slot opening in parallel with each other, forming a conductive thin film on one surface of the substrate except for the first slot opening and the second slot opening, and forming a first electrode and the first thin film on the conductive thin film. A first branch electrode branched from a first electrode and a second electrode spaced apart from each other with the first branch electrode and the second slot opening interposed therebetween and separated from the second electrode and between the first electrode and the first slot opening Forming a second branch electrode spaced apart from each other, and the first electrode, the second electrode, the first branch electrode, and the second electrode on the conductive phase thin film And a step of forming an insulating layer covering the electrode.

The first electrode may be formed parallel to the first slot opening between the one side edge of the substrate and the first slot opening.

The second electrode may be formed in parallel with the second slot opening between the other edge of the substrate and the second slot opening.

The first branch electrode may extend from the first electrode toward the second electrode, and the second branch electrode may extend from the second electrode toward the first electrode.

The first branch electrode and the second branch electrode may be alternately arranged side by side.

The insulating layer may fill an interior of the first slot opening and the second slot opening.

In the above heating substrate manufacturing method, the first slot opening and the second slot opening may be formed through a drilling operation or a shearing operation.

The substrate may be a thin film made of a resin-based material or a material such as paper.

The conductive thin film may be formed in the same pattern as the substrate.

According to the embodiment of the present invention, the heat generating substrate has a structure that can be easily manufactured and is capable of efficiently generating large-area surface heat.

1 is a plan view of a heating substrate according to an embodiment of the present invention.
2 is a cross-sectional view taken along a line II-II in Fig.
3 to 6 are cross-sectional views sequentially illustrating a process of manufacturing the heating substrate of FIG. 1.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

The drawings are schematic and illustrate that they are not drawn to scale. The relative dimensions and ratios of the parts in the figures have been exaggerated or reduced in size for clarity and convenience in the figures and any dimensions are merely exemplary and not limiting. And to the same structure, element or component appearing in more than one drawing, the same reference numerals are used to denote similar features. When referring to a part as "above" another part, it may be directly above another part or may be accompanied by another part in between.

The embodiments of the present invention specifically illustrate ideal embodiments of the present invention. As a result, various modifications of the drawings are expected. Thus, the embodiment is not limited to any particular form of the depicted area, but includes modifications of the form, for example, by manufacture.

Hereinafter, the heat generating substrate 101 according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

1 and 2, the heating substrate 101 may include a substrate 100, a conductive thin film 150, a first electrode 110, a second electrode 120, a first branch electrode 115, The second branch electrode 125 and the insulating layer 200 are included.

In one embodiment of the invention, the substrate 100 is made of a material that can be punched or sheared. For example, the substrate 100 may be made of a material such as a thin film or paper made of a resin-based material. 1 and 2 exemplarily show a case where a cutable PET film having an area of 20 cm × 20 cm is used as a substrate.

The substrate 100 includes one or more first slot openings 141 formed side by side with a distance from one edge, and one or more second slot openings 142 formed side by side with a distance from the other edge parallel to one edge. do. The first slot opening 141 and the second slot opening 142 are formed through the above-described drilling operation or shearing operation.

The conductive thin film 150 is formed on one surface of the substrate 100. In this case, even if the conductive thin film 150 is formed on one surface of the substrate 100, the conductive thin film 150 is not formed in the first slot opening 141 and the second slot opening 142. That is, the conductive thin film 150 is formed in the same pattern as the substrate 100. The first slot opening 141 and the second slot opening 142 become an insulating region.

The conductive thin film 150 is made of a material having excellent conductivity even if it is made of a thin film such as carbon black or metal. By using a very conductive material such as carbon nanotubes, an excellent conductive thin film 150 having a small sheet resistance can be made even with a thickness of tens to hundreds of micrometers. In FIGS. 1 and 2, an aqueous solution in which single-wall carbon nanotubes are dispersed in water is sprayed on one surface of the substrate 100 by a spray spraying method, and then heated and dried to form a conductive thin film 150 having a sheet resistance of about 200 W / sq. It is shown by way of example.

The first electrode 110 is formed on the conductive thin film 150 in parallel with the first slot opening 141 between one side edge of the substrate 100 and the first slot opening 141. The second electrode 120 is formed on the conductive thin film 150 in parallel with the second slot opening 142 between the other edge of the substrate 100 and the second slot opening 142. That is, the first electrode 110 and the second electrode 120 are formed adjacent to edges opposite to each other of the substrate 100, respectively.

The first branch electrode 115 branches from the first electrode 110 and extends in the direction of the second electrode 120. The first branch electrode 115 is spaced apart from the second electrode 120 with the second slot opening 142 therebetween. The second branch electrode 125 branches from the second electrode 120 and extends in the direction of the first electrode 110. The second branch electrode 125 is spaced apart from the first electrode 110 with the first slot opening 141 therebetween. The first branch electrode 115 and the second branch electrode 125 are alternately arranged side by side.

In addition, the electrical resistance of the first branch electrode 115 and the second branch electrode 125 should be smaller than the conductive thin film 150 that is a heating element. The electrical resistance of the first branch electrode 115 and the second branch electrode 125 may be small to effectively reduce the resistance between the first electrode 110 and the second electrode 120.

In addition, since the first branch electrode 115 and the second branch electrode 125 generate a slight level of heat generation as compared with the conductive thin film 150, the first branch electrode 115 and the second branch electrode 125 occupy. It is effective to minimize the area.

1 and 2 exemplarily illustrate electrodes 110, 115, 120, and 125 formed of silver paste using a screen printing technique. The width of the first electrode 110 and the second electrode 120 is 1cm, the width of the first branch electrode 115 and the second branch electrode 12, 5 was formed in the range of 2mm to 4mm.

As described above, when a direct current voltage of 10 V is applied to the first electrode 110 and the second electrode 120 formed as an example, the low-temperature heating substrate 101 having a calorific value of about 0.03 W / cm 2 may be used. When the voltage of 100V is applied, the heat generating substrate 101 can be used as a high-temperature heating substrate 101 having a heating value of about 3 W / cm 2 .

The insulating layer 200 covers the first electrode 110, the second electrode 120, the first branch electrode 115, and the second branch electrode 125 on the conductive thin film 150.

In addition, the insulating layer 200 may fill the interior of the first slot opening 141 and the second slot opening 142. When the heat insulation layer 200 fills the interior of the first slot opening 141 and the second slot opening 142, the insulating region by the first slot opening 141 and the second slot opening 142 is more stably. Can be formed.

In FIG. 2, the interior of the first slit opening 141 and the second slit opening 142 is shown as being filled with the insulating layer 200, but one embodiment of the present invention is not limited thereto. Accordingly, the interior of the first slit opening 141 and the second slit opening 142 may be an empty space.

By such a configuration, the heat generating substrate 101 according to the embodiment of the present invention has a structure that can be easily manufactured, and can efficiently generate a large area surface heat.

In one embodiment of the present invention, current flows from the first electrode 110 to the second electrode 120 through the first branch electrode 115 and the second branch electrode 125. In this case, the first slit opening 141 and the second slit opening 142 form an insulating region so that current flows from the first branch electrode 115 to the second electrode 120 without passing through the second branch electrode 125. While strongly flowing, it prevents local overheating or deterioration of heat generation efficiency. That is, the first slit opening 141 and the second slit opening 142 induce a current to flow from the first branch electrode 115 to the second branch electrode 125 via the conductive thin film 150.

In addition, the first slot opening 141 and the second slot opening 142 forming the insulating region in the heating substrate 101 according to an embodiment of the present invention may be formed simply and precisely.

In particular, the first slot opening 141 and the second slot opening 142 may be formed as insulating regions without using a relatively expensive mask.

In addition, since a separate patterning process is not required after the conductive thin film 150 is formed on the entire surface of the substrate 100, the overall process can be greatly simplified. This may be a great advantage as the heat generating substrate 101 becomes larger in area.

Hereinafter, a method of manufacturing the heating substrate 101 according to an embodiment of the present invention will be described with reference to FIGS. 3 to 6.

First, as shown in FIG. 3, after preparing the substrate 100 using a material that can be punched or sheared, a first drill as shown in FIG. 4 using a puncher or shearer 900 is provided. Slot openings 141 and second slot openings 142 are formed. The substrate 100 may be made of a thin film made of a resin-based material or a material such as paper.

Next, as shown in FIG. 5, the conductive thin film 150 is formed on one surface of the substrate 100. The conductive thin film 150 is made of a material having excellent conductivity even if it is made of a thin film such as carbon black or metal.

Even if the conductive thin film 150 is formed on one surface of the substrate 100, the conductive thin film 150 is not formed in the first slot opening 141 and the second slot opening 142. Thus, the first slot opening 141 and the second slot opening 142 become an insulating region. In one embodiment of the present invention, the conductive thin film 150 is formed in the same pattern as the substrate 100.

However, one embodiment of the present invention is not limited to the above. Accordingly, the first slot opening 141 and the second slot opening 142 form the conductive thin film 150 on one surface of the substrate 100, and then drill or cut the substrate 100 and the conductive thin film 150 together. Can be formed. When the first slot openings 141 and the second slot openings 142 are formed first, and then the conductive thin film 150 is formed on one surface of the substrate 100, a portion of the conductive thin film 150 is formed in the first slot opening 141. And partially filling the second slot opening 142 may not stably form an insulation region. However, when the conductive thin film 150 is formed first, and then the conductive thin film 150 and the substrate 100 are punched or cut together to form the first slot opening 141 and the second slot opening 142, the insulating region is stably formed. Can be formed.

As described above, according to the exemplary embodiment of the present invention, the first slot opening 141 and the second slot opening 142 may be formed as insulating regions without using a relatively expensive mask. In addition, since the conductive thin film 150 is formed on the entire surface of the substrate 100 without patterning, the process can be simplified. This may be a great advantage as the heat generating substrate 101 becomes larger in area.

Next, as shown in FIG. 6, the first electrode 110, the second electrode 120, the first branch electrode 115, and the second branch electrode 125 are formed. These electrodes 110, 115, 120, and 125 may be formed of silver paste using screen printing techniques.

Meanwhile, in the process of forming the first slot opening 141 and the second slot opening 142 in the substrate 100 through a drilling operation or a shearing operation, the first electrode 110 and the second electrode 120 are formed. ), The first branch electrode 115, and the second branch electrode 125 may be formed.

Next, as shown in FIG. 2, the insulation covering the first electrode 110, the second electrode 120, the first branch electrode 115, and the second branch electrode 125 on the conductive thin film 150. Form layer 200. In this case, the insulating layer 200 may fill the insides of the first slit opening 141 and the second slit opening 142.

By such a manufacturing method, it is possible to easily manufacture the heat generating substrate 101 according to an embodiment of the present invention.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the following claims. Those who are engaged in the technology field will understand easily.

100: substrate 101: heating substrate
110: first electrode 115: first branch electrode
120: second electrode 125: second branch electrode
141: first slit opening 142: second slit opening
150: conductive thin film 200: insulating layer

Claims (16)

A substrate having at least one first slot opening formed at a distance from one edge and at least one second slot opening formed at a distance from the other edge parallel to the one edge;
A conductive thin film formed on one surface of the substrate except for the first slot opening and the second slot opening.
A first electrode formed on the conductive thin film and a first branch electrode branched from the first electrode
A second electrode formed on the conductive thin film and branched from the second electrode and the second electrode spaced apart from the first branch electrode and the second slot opening, and spaced apart from the first electrode and the first slot opening. Second branch electrode and
An insulating layer covering the first electrode, the second electrode, the first branch electrode, and the second branch electrode on the conductive phase thin film
Heating substrate comprising a.
In claim 1,
The first electrode is formed parallel to the first slot opening between the one side edge of the substrate and the first slot opening,
And the second electrode is formed in parallel with the second slot opening between the other edge of the substrate and the second slot opening.
In claim 2,
The first branch electrode extends from the first electrode toward the second electrode,
The second branch electrode extends from the second electrode toward the first electrode.
4. The method of claim 3,
And the first branch electrode and the second branch electrode are alternately arranged in parallel with each other.
In claim 1,
The insulating layer fills the inside of the first slot opening and the second slot opening.
In claim 1,
The substrate is a heating substrate made of a material that can be punched or sheared.
The method of claim 6,
The substrate is a thin film made of a resin-based material, or a heat generating substrate made of a material such as paper.
8. The method according to any one of claims 1 to 7,
The conductive thin film is a heating substrate formed in the same pattern as the substrate.
Provision of substrate
Forming a first slot opening in the substrate in parallel with a distance from one edge, and forming a second slot opening in parallel with the other edge in parallel with the one edge;
Forming a conductive thin film on one surface of the substrate except for the first slot opening and the second slot opening
A first branch electrode branched from the first electrode and the first electrode on the conductive thin film, and branched from the second electrode and the second electrode spaced apart from each other with the first branch electrode and the second slot opening interposed therebetween; Forming a second branch electrode spaced apart with a first electrode interposed between the first slot opening and
Forming an insulating layer covering the first electrode, the second electrode, the first branch electrode, and the second branch electrode on the conductive phase thin film
Heating substrate manufacturing method comprising a.
The method of claim 9,
The first electrode is formed parallel to the first slot opening between the one side edge of the substrate and the first slot opening,
And the second electrode is formed in parallel with the second slot opening between the other edge of the substrate and the second slot opening.
11. The method of claim 10,
The first branch electrode extends from the first electrode toward the second electrode,
The second branch electrode extends from the second electrode toward the first electrode.
12. The method of claim 11,
And the first branch electrode and the second branch electrode are alternately arranged in parallel with each other.
The method of claim 9,
And the insulating layer fills the insides of the first slot openings and the second slot openings.
The method of claim 9,
And the first slot opening and the second slot opening are formed by a drilling operation or a shearing operation.
The method of claim 14,
The substrate is a thin film made of a resin-based material, or a heating substrate manufacturing method made of a material such as paper.
The method according to any one of claims 9 to 15,
The conductive thin film is a method of manufacturing a heating substrate is formed in the same pattern as the substrate.
KR1020110060246A 2011-06-21 2011-06-21 Heating substrate and method for manufacturing the same KR20120140487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110060246A KR20120140487A (en) 2011-06-21 2011-06-21 Heating substrate and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110060246A KR20120140487A (en) 2011-06-21 2011-06-21 Heating substrate and method for manufacturing the same

Publications (1)

Publication Number Publication Date
KR20120140487A true KR20120140487A (en) 2012-12-31

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