KR20120138369A - Backlight unit and display apparatus using the same - Google Patents

Abstract

PURPOSE: A backlight unit and a display device using the same are provided to cover a first substrate and a light source of a light source module with a second substrate, to prevent hot spots in the light source module and to minimize a bezel area. CONSTITUTION: A light guide plate(20) is arranged on a reflector(30). A light source module(50) is arranged in one side of the light guide plate. A first substrate(54a) of the light source module faces a side of the light guide plate. The first substrate is arranged in a first direction. The second substrate(54b) is extended from one side of the first substrate to a second direction perpendicular to the first direction. The second substrate faces the upper surface of the reflector. At least one light source(52) is arranged on the first substrate. [Reference numerals] (AA) Bezel region; (BB) Gap; (CC) Light

Description

Backlight unit and display apparatus using the same

An embodiment relates to a backlight unit and a display device using the same.

Typically, typical large-sized display devices include a liquid crystal display (LCD), a plasma display panel (PDP), and the like.

Unlike the self-luminous PDP, an LCD requires a separate backlight unit due to the absence of its own light emitting device.

The backlight unit used in LCD is classified into an edge type backlight unit and a direct type backlight unit according to the position of the light source. In the edge type, the light source is disposed on the left and right sides or the top and bottom sides of the LCD panel and the light guide plate is used. Since the light is evenly distributed on the front surface, the light is uniform and the panel thickness can be made ultra thin.

The direct-type method is generally used for a display of 20 inches or more, and since the light source is arranged at a lower portion of the panel, the light efficiency is higher than that of the edge method. Thus, it is mainly used for a large display requiring high brightness.

CCFL (Cold Cathode Fluorescent Lamp) was used as the light source of the existing edge type or direct type backlight unit.

However, since the CCFL-based backlight unit is always powered by the CCFL, a considerable amount of power is consumed, and the problems of environmental pollution due to the addition of about 70% color reproduction rate and mercury are pointed out as disadvantages.

As a substitute for solving the above problems, research on a backlight unit using an LED (Light Emitting Diode) has been actively conducted.

When the LED is used as a backlight unit, the LED array can be partially turned on and off, which can drastically reduce the power consumption. For the RGB LED, it exceeds 100% of the NTSC (National Television System Committee) color reproduction range specification. To provide consumers with more vivid picture quality.

Embodiments provide a backlight unit capable of minimizing the width of a bezel and a display device using the same.

An embodiment includes a reflector, a light guide plate disposed on the reflector, and a light source module disposed on one side of the light guide plate, the light source module comprising: a first substrate disposed in a first direction so as to face a side surface of the light guide plate; The first substrate may include a second substrate extending in a second direction perpendicular to the first direction from one side of the first substrate and disposed to face the upper surface of the reflector, and at least one light source disposed on the first substrate.

The second substrate may include a dummy area in contact with the light guide plate and a circuit area in contact with the light guide plate.

Here, the circuit region of the second substrate may be adjacent to the light source and may be located in a space between the first substrate and the light guide plate.

The dummy region of the second substrate may then be 30-70% of the total area of the second substrate.

In addition, the dummy region of the second substrate may gradually decrease as the thickness of the light guide plate becomes thinner.

Next, the thickness of the second substrate may be thinner than the thickness of the first substrate, and the thickness of the second substrate may be 1-2 mm.

The embodiment may further include an optical member disposed on the light guide plate to have a first distance from the light guide plate, and the optical member may contact the second substrate.

Here, the first interval may be equal to the thickness of the second substrate.

Alternatively, the embodiment may further include an optical member disposed on the light guide plate, wherein the optical member may be in contact with the second substrate and the light guide plate at the same time.

Here, the edge region of the light guide plate may be formed with a groove, the edge region of the second substrate may be seated in the groove, and the optical member may contact the edge region of the second substrate.

In this case, the depth of the groove may be equal to the thickness of the second substrate.

In addition, the optical member may include a first member in contact with the light guide plate and a second member disposed on the first member and in contact with the second substrate.

Here, the first member has a first face facing the second member, the second member has a second face facing the first member, and the first face of the first member is more than the second face of the second member. It can have a small area.

At this time, the thickness of the first member may be the same as the thickness of the second substrate.

In addition, the optical member includes a central region in contact with the light guide plate and a peripheral region in contact with the second substrate and surrounding the central region, wherein the central region of the optical member protrudes in the direction of the light guide plate and has a thickness greater than that of the peripheral region of the optical member. It can be thicker.

Here, the protruding height of the central region of the optical member may be equal to the thickness of the second substrate.

Embodiments may minimize the width of the bezel by modifying the substrate shape of the light source module, and may reduce the overall thickness of the display device including the backlight unit.

1 is a cross-sectional view illustrating a backlight unit according to an embodiment.
2 is a view showing the position of the light source module.
3 is a view showing in detail the light source module of FIG.
4 is a view illustrating a movement path of light according to the embodiment of FIG. 1.
5A through 5D are views illustrating thicknesses of the first substrate and the second substrate of FIG. 2.
6 to 10 are diagrams illustrating a backlight unit according to the first to fifth embodiments.
11A and 11B illustrate a contact area of a second substrate that varies with the thickness of the light guide plate.
12 illustrates a display module having a backlight unit according to an embodiment.
13 and 14 illustrate a display device according to an embodiment.

Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.

In the description of the present embodiment, when described as being formed on the "on or under" of each element, the (top) or (bottom) ( on or under includes both that two elements are in direct contact with one another or one or more other elements are formed indirectly between the two elements.

In addition, when expressed as "on" or "under", it may include the meaning of the downward direction as well as the upward direction based on one element.

1 is a cross-sectional view illustrating a backlight unit according to an embodiment.

As shown in FIG. 1, the backlight unit includes a light guide plate 20, a reflector 30, an optical member 40, and a light source module 50. It may include.

The backlight unit may further include a top chassis 60, a bottom chassis 70, and a panel guide module 80.

Here, the panel guide module 80 may support the display panel 90, and the top chassis 60 may be connected to the panel guide module 80 and the bottom chassis 70.

Subsequently, the light source module 50 may be disposed on one side of the light guide plate, and may include first and second substrates 54a and 54b and at least one light source 52 disposed on the first substrate 54a. have.

Here, the first substrate 54a may be disposed in the first direction to face the side surface of the light guide plate 20.

The second substrate 54b may extend from a side surface of the first substrate 54a in a second direction perpendicular to the first direction and may face the upper surface of the reflector 30.

2 is a view showing the position of the light source module, Figure 3 is a view showing in detail the light source module of FIG.

As illustrated in FIGS. 2 and 3, the light source module 50 may include a first substrate 54a, a second substrate 54b, and a light source 52.

Here, the first substrate 54a may be disposed at a predetermined distance from the side surface of the light guide plate 20, and may be disposed in the first direction while facing the side surface of the light guide plate 20.

The second substrate 54b may extend from one side surface of the first substrate 54a and be disposed in a second direction perpendicular to the first direction.

In addition, the second substrate 54b may be disposed to face the upper surface of the reflector 30, and a portion of the second substrate 54b may be disposed on the light guide plate 20.

Here, the second substrate 54b may be divided into an area in contact with the light guide plate 20 and an area not in contact with the light guide plate 20.

That is, the second substrate 54b may include a dummy area 54b2 in contact with the light guide plate 20 and a circuit area 54b1 not in contact with the light guide plate.

In this case, the circuit region 54b1 of the second substrate 54b may be adjacent to the light source 52 and positioned in a space between the first substrate 54a and the light guide plate 20.

In addition, the dummy region 54b2 of the second substrate 54b may be disposed farther from the light source 52 than the circuit region 54b1 of the second substrate 54b, and may be disposed in contact with the light guide plate 20. .

Here, the dummy region 54b2 of the second substrate 54b may be about 30-70% of the total area of the second substrate 54b.

This is because the dummy region 54b2 of the second substrate 54b may vary depending on the thickness of the light guide plate 20.

That is, the dummy region 54b2 of the second substrate 54b may gradually decrease as the thickness of the light guide plate 20 becomes thinner.

Detailed reasons for this will be described later.

In addition, the circuit region 54b1 of the second substrate 54b may include an adapter for supplying power to the light source 52 and an electrode pattern for connecting the light source 52.

For example, a carbon nanotube electrode pattern for connecting an adapter may be formed in the circuit region 54b1 of the second substrate 54b.

The second substrate 54b may be a printed circuit board (PCB) substrate made of any one material selected from polyethylene terephthalate (PET), glass, polycarbonate (PC), and silicon (Si), and may be formed in a film form. It may be.

In addition, the second substrate 54b may selectively use a single layer PCB, a multilayer PCB, a ceramic substrate, a metal core PCB, or the like.

In addition, since the dummy region 54b2 of the second substrate 54b is an area in contact with the light guide plate 20, an electrode pattern may not be formed.

In the circuit region 54b1 and the dummy region 54b2 of the second substrate 54b, a reflective material that reflects light without an additional reflective sheet may be formed.

In some cases, a reflective sheet may be additionally formed on the circuit region 54b1 and the dummy region 54b2 of the second substrate 54b.

Next, at least one light source 52 may be mounted on the first substrate 54a, and an adapter for supplying power and an electrode pattern for connecting the light source 52 may be formed.

For example, a carbon nanotube electrode pattern for connecting the light source 52 and the adapter may be formed on the upper surface of the first substrate 54a.

The first substrate 54a may be a printed circuit board (PCB) substrate made of any one material selected from polyethylene terephthalate (PET), glass, polycarbonate (PC), and silicon (Si), and may be formed in a film form. It may be.

In addition, the first substrate 54a may selectively use a single layer PCB, a multilayer PCB, a ceramic substrate, a metal core PCB, or the like.

As such, the first substrate 54a and the second substrate 54b may be the same in thickness or may be different from each other.

For example, the thickness of the second substrate 54b may be about 1-2 mm, and the second substrate 54b may be thinner than the thickness of the first substrate 54a.

This is because the overall thickness of the backlight unit can be reduced.

Subsequently, at least one light source 52 may be disposed on the first substrate 54a. The light source 52 may be a top view type light emitting diode.

In some cases, the light source 52 may be a side view type light emitting diode.

The light source 52 may be a light emitting diode chip, and the light emitting diode chip may include a blue LED chip or an ultraviolet LED chip, or a red LED chip, a green LED chip, a blue LED chip, and yellow green. ) It may be configured in a package form combining at least one or more of the LED chip, the white LED chip.

Here, the white LED may be implemented by combining yellow phosphor on the blue LED, or simultaneously using red phosphor and green phosphor on the blue LED, and yellow phosphor on the blue LED. Yellow phosphor, red phosphor, and green phosphor may be simultaneously used.

As described above, the present embodiment has a hot spot reduction effect by manufacturing the substrate of the light source module 50 as a "-" shaped substrate including the first and second substrates 54a and 54b. In this case, it is possible to reduce the bezel area.

4 is a view illustrating a movement path of light according to the embodiment of FIG. 1.

As shown in FIG. 4, the second substrate 54b partially contacted on the light guide plate 20 reflects the light emitted from the light source 52 toward the center region of the light guide plate 20, thereby uniformly dispersing the light. As a result, it is possible to reduce a hot spot phenomenon in which light is concentrated in a predetermined area.

 In addition, since the second substrate 54b partially contacted on the light guide plate 20 covers the light source 52 and the first substrate 54a of the light source module, the light source module 50 is positioned when viewed from the outside of the display panel. Since the hot spot does not appear in the area, the bezel area can be minimized, and the active area of the display panel can be maximized.

5A through 5D are views illustrating thicknesses of the first substrate and the second substrate of FIG. 2.

As shown in FIG. 5A, the light source module 50 includes a first substrate 54a on which the light sources 52 are arranged, and a second substrate 54b having a circuit region 54b1 and a dummy region 54b2. can do.

Here, the thickness T1 of the first substrate 54a may have the same thickness as the second substrate 54b.

That is, the thickness T1 of the first substrate 54a may be the same as the thickness T2 of the circuit region 54b1 of the second substrate 54b and the thickness T3 of the dummy region 54b2 of the second substrate 54b.

Subsequently, as illustrated in FIG. 5B, the thickness T1 of the first substrate 54a may have a thickness different from that of the second substrate 54b.

That is, the thickness T1 of the first substrate 54a may be greater than the thickness T2 of the circuit region 54b1 of the second substrate 54b and the thickness T3 of the dummy region 54b2 of the second substrate 54b.

Here, the thickness T2 of the circuit region 54b1 of the second substrate 54b may be the same as the thickness T3 of the dummy region 54b2 of the second substrate 54b.

Next, as shown in FIG. 5C, the thickness T1 of the first substrate 54a may be equal to the thickness T2 of the circuit region 54b1 of the second substrate 54b, and the dummy region of the second substrate 54b. It may differ from the thickness T3 of 54b2.

Here, the thickness T1 of the first substrate 54a and the thickness T2 of the circuit region 54b1 of the second substrate 54b may be greater than the thickness T3 of the dummy region 54b2 of the second substrate 54b.

As shown in FIG. 5D, the thickness T1 of the first substrate 54a is the thickness T2 of the circuit region 54b1 of the second substrate 54b and the thickness of the dummy region 54b2 of the second substrate 54b. May be different from T3.

Here, the thickness T1 of the first substrate 54a may be greater than the thickness T2 of the circuit region 54b1 of the second substrate 54b and the thickness T3 of the dummy region 54b2 of the second substrate 54b.

In addition, the thickness T2 of the circuit region 54b1 of the second substrate 54b may be different from the thickness T3 of the dummy region 54b2 of the second substrate 54b.

That is, the thickness T2 of the circuit region 54b1 of the second substrate 54b may be greater than the thickness T3 of the dummy region 54b2 of the second substrate 54b.

As such, the substrate of the light source module 50 may be manufactured in various forms according to structural changes of the light guide plate 20 and the optical member 40.

The light guide plate 20 may be formed of an acrylic resin such as polymethylmethacrylate (PMMA), polyethylene terephthlate (PET), cyclic olefin copolymers (COC), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), and MS (Mathacylate). styrene) resin can be any one.

6 to 10 are diagrams illustrating a backlight unit according to the first to fifth embodiments.

6 is a structure in which a gap is formed between the light guide plate and the optical member, and FIGS. 7 to 10 are structures in which the light guide plate and the optical member are in contact with each other.

First, as shown in FIG. 6, the first substrate 54a of the light source module 50 is spaced apart from the side surface of the light guide plate 20 by a predetermined distance, and the circuit region 54b1 of the second substrate 54b may be formed. 1 may extend from one side of the substrate 54a and be disposed to face the upper surface of the reflector 30.

The dummy region 54b2 of the second substrate 54b may be in contact with the light guide plate 20.

Subsequently, the optical member 40 may be disposed on the light guide plate 20 so as to have a first distance d1 from the light guide plate 20.

Here, the first interval d1 may be equal to the thickness t1 of the dummy region 54b2 of the second substrate 54b.

In addition, as shown in FIG. 7, the optical member 40 is disposed on the light guide plate 20, and may be in contact with the second substrate 54b and the light guide plate 20 simultaneously.

Here, the light guide plate 20 may have a groove formed in the edge region 20b, and the dummy region 54b2 of the second substrate 54b may be seated in the groove.

In addition, the optical member 40 may be in contact with the dummy region 54b2 of the second substrate 54b.

That is, the light guide plate 20 has a structure in which a groove is formed in the edge region 20b and the center region 20a protrudes, and the dummy region 54b2 of the second substrate 54b has a groove formed in the light guide plate 20. It may be seated in the edge area (20b) of.

Here, the depth d2 of the groove formed in the edge region 20b of the light guide plate 20 may be equal to the thickness t1 of the dummy region 54b2 of the second substrate 54b.

Next, as shown in FIG. 8, the optical member 40 and the second substrate 54b may be disposed side by side on the light guide plate 20.

That is, the optical member 40 and the second substrate 54b may be in contact with the light guide plate 20 and positioned on the same plane.

Here, the thickness t2 of the optical member 40 may be the same as the thickness t1 of the dummy region 54b2 of the second substrate 54b.

9, the optical member 40 may have a structure in which the first member 42 and the second member 44 are stacked.

Here, the first member 42 may be in contact with the light guide plate 20, and the second member 44 may be disposed on the first member 42.

Here, the second member 44 may be in contact with the second substrate 54b and the first member 42 at the same time.

The first member 42 and the second member 44 may be any one selected from a diffusion sheet, a prism sheet, a brightness enhancement sheet, and the like, and may be different sheets.

Here, the diffusion sheet diffuses the light emitted from the light source, and the prism sheet guides the diffused light to the light emitting area, and the brightness diffusion sheet strengthens the brightness.

In addition, the first member 42 has a first face facing the second member 44, the second member 44 has a second face facing the first member 42, and the first member ( The first face of 42 may have a smaller area than the second face of the second member 44.

Here, the thickness t3 of the first member 42 may be the same as the thickness t1 of the dummy region 54b2 of the second substrate 54b.

The thickness t3 of the first member 42 and the thickness t4 of the second member 44 may be the same as or different from each other.

Subsequently, the dummy region 54b2 of the first member 42 and the second substrate 54b may contact the light guide plate 20 and be positioned on the same plane.

Next, as shown in FIG. 10, in the optical member 40, the first member 42 and the second member 44 of FIG. 9 may be integrated.

For example, the optical member 40 may include a central region 40a and a peripheral region 40b surrounding the central region 40a.

Here, the central region 40a of the optical member 40 may contact the light guide plate 20, and the peripheral region 40b of the optical member 40 may contact the dummy region 54b2 of the second substrate 54b. have.

In addition, the central region 40a of the optical member 40 may protrude in the direction of the light guide plate 20, and may be thicker than the peripheral region of the optical member 40.

The height h1 of the central region 40a of the optical member 40 may be equal to the thickness of the dummy region 54b2 of the second substrate 54b.

As described above, according to various exemplary embodiments, as the dummy region 54b2 of the second substrate 54b contacts the light guide plate 20, the hot spot reduction effect may be reduced, and the bezel region may be reduced. It can have an effect.

In addition, the area of the dummy region 54b2 of the second substrate 54b may vary according to the thickness of the light guide plate 20.

For example, the dummy region 54b2 of the second substrate 54b may gradually decrease as the thickness of the light guide plate 20 becomes thinner.

11A and 11B illustrate a contact area of a second substrate that varies with the thickness of the light guide plate.

As shown in FIG. 11A, when the light guide plate 20 has a thickness T1, the dummy region 54b2 of the second substrate 54b may have a width W1.

The reason is that the light source 52 is extended by extending the dummy region 54b2 of the second substrate 54b to the width W1 so that the light source 52 is not visible at a position where the viewer is separated by the distance D1 from the light guide plate 20. Not only does this cover, but also reduces the hot spot.

In contrast, as shown in FIGS. 11A and 11B, if the thickness of the light guide plate 20 decreases from T1 to T2, the width of the dummy region 54b2 of the second substrate 54b will decrease from W1 to W2.

As such, the area of the dummy region 54b2 of the second substrate 54b may vary according to the thickness of the light guide plate 20.

Meanwhile, the reflector 30 may be disposed on the bottom chassis 70, as shown in FIG. 1.

Here, the reflector 30 may include at least one of a metal and a metal oxide. For example, the reflector 30 may have a high reflectance such as aluminum (Al), silver (Ag), gold (Au), or titanium dioxide (TiO ₂ ). The branch may comprise a metal or metal oxide.

In addition, as illustrated in FIG. 1, the optical member 40 may be disposed on the light guide plate 20 and have an uneven pattern on the upper surface thereof.

Here, the optical member 40 is to diffuse the light emitted through the second light guide plate 20, and may form an uneven pattern on the upper surface in order to increase the diffusion effect.

That is, the optical member 40 may be formed of several layers, and the uneven pattern may be on the top layer or the surface of any one layer.

In addition, the uneven pattern may have a stripe shape disposed along the light source module 50.

At this time, the uneven pattern has a protrusion on the surface of the optical member 40, the protrusion is composed of a first surface and a second surface facing each other, the angle between the first surface and the second surface may be an obtuse angle or acute angle.

In some cases, the optical member 40 includes at least one sheet, and may include a diffusion sheet, a prism sheet, a brightness enhancement sheet, and the like.

Here, the diffusion sheet diffuses the light emitted from the light source, and the prism sheet guides the diffused light to the light emitting area, and the brightness diffusion sheet strengthens the brightness.

Next, the panel guide module 80 may support the display panel 90 as shown in FIG. 1.

The top chassis 60 may cover a portion of the bottom chassis 70 and the panel guide module 80.

12 illustrates a display module having a backlight unit according to an embodiment.

As shown in FIG. 12, the display module 200 may include a display panel 90 and a backlight unit 100.

The display panel 90 includes a color filter substrate 91 and a TFT (Thin Film Transistor) substrate 92 bonded to face each other to maintain a uniform cell gap, and a liquid crystal between the two substrates 91 and 92. A layer (not shown) may be interposed.

The color filter substrate 91 includes a plurality of pixels including red (R), green (G), and blue (B) sub-pixels, and generates an image corresponding to the color of red, green, or blue when light is applied. You can.

The pixels may be composed of red, green, and blue subpixels, but the red, green, blue, and white (W) subpixels constitute one pixel, but are not necessarily limited thereto.

The TFT substrate 92 may switch a pixel electrode (not shown) as an element on which switching elements are formed.

For example, the common electrode (not shown) and the pixel electrode may change the arrangement of molecules of the liquid crystal layer according to a predetermined voltage applied from the outside.

The liquid crystal layer is composed of a plurality of liquid crystal molecules, and the liquid crystal molecules change their arrangement corresponding to the voltage difference generated between the pixel electrode and the common electrode.

As a result, the light provided from the backlight unit 100 may be incident on the color filter substrate 91 in response to the change in the molecular arrangement of the liquid crystal layer.

In addition, an upper polarizer 93 and a lower polarizer 94 may be disposed above and below the display panel 90, and more specifically, an upper polarizer 93 may be disposed on an upper surface of the color filter substrate 91. The lower polarizer 94 may be disposed on the bottom surface of the TFT substrate 92.

Although not shown, a gate and a data driver for generating a driving signal for driving the display panel 90 may be provided on the side of the display panel 90.

As shown in FIG. 12, the display module 200 may be configured by closely placing the backlight unit 100 on the display panel 90.

For example, the backlight unit 100 may be adhered to and fixed to the lower side of the display panel 90, more specifically, the lower polarizer 94, and for this purpose, between the lower polarizer 94 and the backlight unit 100. An adhesive layer (not shown) may be formed on the substrate.

As such, by forming the backlight unit 100 in close contact with the display panel 90, the overall thickness of the display device may be reduced to improve appearance, and an additional structure for fixing the backlight unit 100 may be removed. The structure and manufacturing process of the display device can be simplified.

In addition, by removing the space between the backlight unit 100 and the display panel 90, it is possible to prevent the malfunction of the display device or the deterioration of the display image quality due to the infiltration of foreign matter into the space.

13 and 14 illustrate a display device according to an embodiment.

First, as shown in FIG. 13, the display apparatus 1 is provided in the display module 200, the front cover 300, the back cover 350, and the back cover 350 surrounding the display module 200. It may be composed of a driving unit 550 and a driving unit cover 400 surrounding the driving unit 550.

The front cover 300 may include a front panel (not shown) of a transparent material that transmits light, and the front panel protects the display module 200 at regular intervals, and the light emitted from the display module 200. The light is transmitted through the display module 200 so that the image displayed on the display module 200 is viewed from the outside.

In addition, the front cover 300 may be made of a flat plate without the window 300a.

In this case, the front cover 300 may be made of a transparent material that transmits light, for example, injection molded plastic.

As such, when the front cover 300 is formed of a flat plate, the frame can be removed from the front cover 300.

The back cover 350 may be combined with the front cover 300 to protect the display module 200.

The driving unit 550 may be disposed on one surface of the back cover 350.

The driver 550 may include a drive controller 550a, a main board 550b, and a power supply unit 550c.

The driving control unit 550a may be a timing controller. The driving control unit 550a may be a driving unit for adjusting an operation timing of each driver IC of the display module 200. And a driving unit for transmitting G and B resolution signals, and the power supply unit 550c may be a driving unit for applying power to the display module 200.

The driver 550 may be provided in the back cover 350 and may be wrapped by the driver cover 400.

A plurality of holes may be provided in the back cover 350 to connect the display module 200 and the driver 550, and a stand 600 supporting the display apparatus 1 may be provided.

Subsequently, as shown in FIG. 14, the driving controller 550a of the driving unit 550 may be provided in the back cover 350, and the main board 550b and the power board 550c may be provided in the stand 600. have.

In addition, the driver cover 400 may wrap only the driver 550 provided in the back cover 350.

In an embodiment, the main board 550b and the power board 550c are separately configured, but may be formed as one integrated board, but the present invention is not limited thereto.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (20)

Reflector;
A light guide plate disposed on the reflector; And
A light source module disposed on one side of the light guide plate;
The light source module,
A first substrate disposed in a first direction so as to face a side surface of the light guide plate;
A second substrate extending from a side of the first substrate in a second direction perpendicular to the first direction and disposed to face an upper surface of the reflector;
And at least one light source disposed on the first substrate. The method of claim 1, wherein the second substrate,
A dummy area in contact with the light guide plate;
And a circuit area not in contact with the light guide plate. The backlight unit of claim 2, wherein a circuit area of the second substrate is adjacent to the light source and is located in a space between the first substrate and the light guide plate. The backlight unit of claim 2, wherein the dummy region of the second substrate is 30-70% of the total area of the second substrate. The backlight unit of claim 2, wherein the dummy region of the second substrate gradually decreases as the thickness of the light guide plate becomes thinner. The backlight unit of claim 1, wherein a thickness of the second substrate is thinner than a thickness of the first substrate. The backlight unit of claim 6, wherein the second substrate has a thickness of about 1 mm to about 2 mm. The method of claim 1,
An optical member disposed on the light guide plate to have a first distance from the light guide plate;
The optical member is in contact with the second substrate. The backlight unit of claim 8, wherein the first gap is equal to a thickness of the second substrate. The method of claim 1,
Further comprising an optical member disposed on the light guide plate,
The optical member is in contact with the second substrate and the light guide plate at the same time. The backlight unit of claim 10, wherein the edge region of the light guide plate is formed with a groove, the edge region of the second substrate is seated in the groove, and the optical member is in contact with the edge region of the second substrate. The backlight unit of claim 11, wherein a depth of the groove is equal to a thickness of the second substrate. The backlight unit of claim 10, wherein the optical member and the second substrate are in contact with the light guide plate and positioned on the same plane. 11. The method of claim 10,
Wherein the optical member comprises:
A first member in contact with the light guide plate;
And a second member disposed on the first member and in contact with the second substrate. 15. The first surface of claim 14, wherein the first member has a first face facing the second member, the second member has a second face facing the first member, and a first face of the first member. Has a smaller area than the second face of the second member. The backlight unit of claim 14, wherein a thickness of the first member is equal to a thickness of the second substrate. The backlight unit of claim 14, wherein the first member and the second substrate are in contact with the light guide plate and positioned on the same plane. 11. The method of claim 10,
Wherein the optical member comprises:
A central area in contact with the light guide plate;
A peripheral region in contact with the second substrate and surrounding the central region,
The central area of the optical member protrudes in the direction of the light guide plate, and is thicker than the peripheral area of the optical member. The backlight unit of claim 18, wherein a protruding height of the central region of the optical member is equal to a thickness of the second substrate. Display panel;
It includes a backlight unit for irradiating light to the display panel,
20. The display apparatus using the backlight unit of claim 1, wherein the backlight unit is any one of the backlight units of claim 1.

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