KR20120121128A - Non-contact type apparatus of dectecting temperature using infrared ray - Google Patents

Abstract

PURPOSE: A non-contact type device for measuring the temperature of infrared rays is provided to reduce distorted infrared rays from being transmitted to an infrared sensor unit by minimizing an intake of the infrared rays because the infrared rays crashing to an inner wall of a light receiving body is reflected by a concavo-convex portion by forming into a surface of the inner wall of the light receiving body into the concavo-convex portion. CONSTITUTION: A non-contact type device for measuring the temperature of infrared rays comprises a casing(10), a light receiving body(20), an infrared sensor(30), and a PCB substrate(40). The light receiving body is installed in the inside of the casing and comprises a light receiving unit(21) and concavo-convex unit(21a). The light receiving unit receives infrared rays being radiated from a measurement object. The concavo-convex unit is formed in an inner periphery of the light receiving unit into a screw-thread form. The infrared sensor is installed in a hole(22) formed in a bottom surface of the light receiving unit, thereby sensing the infrared ray wavelength received by the light receiving unit. The infrared ray sensor converts the sensed infrared ray wavelength into voltage. The PCB substrate is electrically connected to the infrared sensor. The controlling unit is mounted on the PCB substrate. The controlling unit calculates the temperature of the measurement object by comparing the converted voltage and reference voltage.

Description

Non-contact type apparatus of dectecting temperature using infrared ray}

The present invention relates to a device for measuring the temperature of an object, and more particularly to a non-contact infrared temperature measuring device for measuring the temperature range of the measurement object by detecting the wavelength range of the infrared radiation emitted from the measurement object.

In general, devices for measuring temperature are largely divided into contact and contactless.

The contact temperature measuring device is a method in which the temperature reduction point of the sensor for measuring the temperature is in direct contact with the measurement object. In order to accurately detect the temperature of the measurement object, a sufficient contact area must be secured.

However, in this method of measuring the contact method, the temperature of the measurement object may change as the temperature sensor contacts the measurement object. That is, the thermal energy of the measurement object is conducted through the temperature sensor in contact with the measurement object, resulting in a loss of the thermal energy of the measurement object. The impact on the energy loss is small when the size of the measurement object is small and the thermal energy is low. In general, when the temperature is to be measured by contact method, the thermal energy is large enough and is widely used when the measurement object is large.

In addition, it has a transmission path that has to conduct heat structurally, it is difficult to obtain fast response characteristics, has a relatively long delay time, and because the measurement temperature range is somewhat limited, it is impossible to measure high temperature and easy to measure the temperature of a moving object. Not.

In contrast, the non-contact temperature measuring device measures the temperature from the heat energy radiated from the measuring object, so that the non-contact temperature measuring device is not in direct contact with the measuring object. Therefore, it is possible to measure the temperature of a moving object.

As the non-contact temperature measuring device, a non-contact infrared temperature measuring device for measuring the temperature of the measuring object by measuring the amount of infrared radiation emitted from the measuring object is widely used.

The non-contact infrared temperature measuring device is an infrared sensor unit that detects the infrared wavelength emitted from the object and converts the voltage into a voltage, and is electrically connected to the infrared sensor unit to compare the voltage measured by the infrared sensor unit with a reference voltage. A PCB substrate including a control unit for detecting a sensor, a case in which an infrared sensor unit and a PCB substrate are formed while forming the overall appearance of the device, a filter unit for collecting infrared wavelengths emitted from an object in front of the case, and a filter unit And a light receiver for guiding the collected light to an infrared sensor.

In the conventional non-contact infrared temperature measuring device configured as described above, since the inner wall of the light receiving part receiving the infrared light is smooth, a part of the infrared light traveling to the infrared sensor part is reflected at the same angle as the incident angle while hitting the smooth surface of the light receiving part, and is then directed to the infrared sensor part. Although the infrared rays reflected by the light receiving unit inner wall and entering the infrared sensor unit are distorted in the wavelength due to reflection in the light receiving unit inner wall, accurate temperature cannot be measured.

   In addition, the non-contact temperature measuring device has a lot of complex peripheral circuits and electronic components built-in, so that the temperature inside the device increases due to heat generation, so that the external temperature and temperature deviation occurs, so that accurate temperature can be measured. There is no problem.

Lastly, the infrared light collected by the filter unit may collect not only the infrared light emitted from the measurement object but also the infrared light emitted from the surrounding water and other gases, thereby preventing accurate temperature measurement.

The present invention has been made in view of the above-mentioned problems, and the infrared light received by the light receiving unit is reflected on the inner wall surface of the light receiving unit to minimize the inflow into the infrared sensor and at the same time minimizes the temperature deviation between the inside and outside of the device, and further It is an object of the present invention to provide a non-contact infrared temperature measuring apparatus capable of measuring a more accurate temperature by collecting only the infrared radiation emitted from the measurement target except the infrared radiation emitted from the surrounding environment.

In order to achieve the above object, the non-contact infrared temperature measuring apparatus provided in the present invention has a sealed height inside the casing, and installed inside the casing, and having a predetermined height and diameter to receive infrared radiation emitted from a measurement object. A light receiving part formed of a groove is formed, and around the inner surface of the light receiving part, a light receiving body having a continuous thread-shaped uneven portion is formed in the longitudinal direction, and installed at a hole formed in the bottom surface of the light receiving part to sense the infrared wavelength received by the light receiving part. A pcb substrate mounted inside the casing, the pcb board being installed inside the casing and having a controller electrically connected to the infrared sensor and comparing a voltage converted from the infrared sensor with a reference voltage to calculate a temperature of a measurement object. Including, by the uneven portion formed on the inner wall surface of the light receiving portion So as to minimize the reflection of the infrared light receiving portion which is characterized in that to minimize the distortion the image of the infrared wavelength range of the reflection.

In addition, the pcb substrate further includes a heat dissipation portion in contact with the inner surface of the casing to discharge heat generated from the pcb substrate side to the outside of the casing, the heat dissipation portion and the casing is made of a metal material having excellent thermal conductivity, It is characterized in that the temperature deviation of the inside and outside of the non-contact infrared temperature measuring apparatus can be minimized.

The heat dissipation unit may include a shield casing that seals electronic components, which generate relatively high heat, from the electronic components mounted on the pcb substrate to be completely sealed to quickly remove heat generated from the pcb substrate to the outside, and one end of the shield casing. And a heat conduction plate consisting of a fixed end fixedly coupled to an upper portion of the upper end and a free end inclined upwardly from the fixed end and a free end inclined downward from the contact, thereby rapidly discharging heat inside the casing to the outside of the casing. At the same time, it is characterized in that the assembly of the pcb substrate with heat dissipation is improved in the casing.

On the other hand, the number of the pair of bottom plate which is in contact with the ground and horizontally bent to both sides of the bottom plate and the through hole through which the casing is installed so that the casing is horizontally installed in a state separated from the bottom surface by a horizontal distance Further comprising a pedestal made of a direct plate, it is characterized in that the infrared temperature measuring apparatus can be easily aligned in a line with the measurement object in a state in which the infrared temperature measuring device is kept horizontal with the measurement object at the time of measuring the temperature of the measurement object.

Here, a stopper is provided around the outer circumferential surface of the casing to limit the installation position of the casing to the pedestal so that the center of the casing can be easily fitted to the pedestal.

In addition, the light receiving body is formed with a laser hole that is formed long in the longitudinal direction of the light receiving body, the laser beam irradiated from the laser light emitting unit installed below the laser hole is irradiated to the measurement object through the laser hole to the user A target measuring object for measuring temperature can be easily identified. On the other hand, the infrared sensor is integrally installed on the pcb substrate is fitted and coupled to the sensor mounting groove formed on the lower surface of the light receiving body, characterized in that to facilitate the assembly and disassembly of the parts inside the casing.

Finally, the front of the light receiving unit is provided with a filter unit for collecting infrared radiation emitted from the measurement target in the measurement target, the filter unit is coated to pass only a wavelength range band of 8 ~ 14 ㎛ to the germanium lens, the measurement target It is characterized in that the measurement accuracy can be improved by blocking infrared rays emitted from moisture and other gases present in the vicinity of the substrate.

Non-contact infrared temperature measuring apparatus provided by the present invention has the following advantages.

First, since the surface of the inner wall of the light receiving unit for receiving the infrared light of the measurement object is made of the uneven portion, the infrared rays hitting the inner wall of the light receiving unit are reflected by the uneven portion to minimize the inflow into the infrared sensor. Since the distorted infrared rays are reduced to be transmitted to the infrared sensor unit, there is an effect of measuring a more accurate temperature.

Second, since the heat dissipation part made of a metal material having excellent thermal conductivity emits heat generated from the PCB substrate to the outside through the casing having excellent thermal conductivity, the temperature deviation of the device is reduced, thereby making it possible to measure the temperature more accurately.

Third, since the infrared sensor unit senses only the infrared radiation emitted from the object to be measured and excludes the surrounding environment elements of the measuring device, it is possible to measure the temperature more accurately.

Fourth, the assembly and disassembly of the various components installed inside the casing is simplified, and the assembly and disassembly are easy, and the manufacturing and maintenance costs of the apparatus can be reduced.

1 is an overall perspective view of a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention
Figure 2 is an exploded perspective view of a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention
3 is an overall cross-sectional view of a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention;
4 is a conceptual diagram illustrating a state in which infrared light is received by a light collecting unit in a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention.
5 is a perspective view illustrating an infrared sensor, a pcb substrate, and a heat dissipation unit in a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

In the following description, "front, back", "front", "front", "rear", "horizontal", "length direction" and corresponding terms are based on the direction shown in the drawings.

1 is an overall perspective view of a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view of a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention The whole sectional drawing of the non-contact infrared temperature measuring apparatus which concerns on an example.

As shown in Figure 1 and 2, the non-contact infrared temperature measuring apparatus according to the present invention is largely the casing 10 to form the overall appearance of the device, and the infrared rays installed inside the casing 10 to radiate from the measurement object A light receiving body 20 for receiving light, an infrared sensor 30 for detecting infrared wavelengths received by the light receiving body 20, and a control unit for calculating a temperature of a measurement object based on data detected by the infrared sensor 30. And a pcb substrate 40 on which electronic components are mounted.

In more detail, the casing 10 is a cylindrical structure having a predetermined length and is a closed structure in which the front and rear surfaces are open and the interior is empty. Inside the casing 10, the light receiving body 20, the infrared sensor 30, the pcb substrate 40, and the like are installed so as to be sequentially arranged from the front side of the casing 10 to the rear side.

In addition, the rear cover 11 is detachably coupled to the rear of the casing 10 to open and close the rear opening, and the coupling force and airtightness of the light receiving body 20 installed therein is improved around the inner surface of the front side of the casing 10. Rubber ring 13 is installed to make.

Here, the casing 10 is made of a metal material having excellent thermal conductivity such as copper so as to discharge the heat conducted from the heat dissipation part 70 to be described later to the outside of the casing 10.

On the other hand, the present invention is composed of a structure that can be fixed to face each other in a horizontal posture while spaced apart from the ground to a certain height of the casing 10, the infrared sensor 30 is installed, the distance to the measurement object And infrared rays irradiated from the object to be measured can be effectively received while actively coping with the position.

To this end, in the present invention, the pedestal 50 is provided so that the casing 10 can be horizontally installed while being spaced apart from the ground by a certain height.

The pedestal 50 is composed of a flat plate bottom plate 51 in contact with the ground, and a pair of vertical plates 52 that are bent vertically from both sides of the bottom plate 51 and have a predetermined height. As a whole, it has a structure of standing 'c' shape sideways.

Here, a through hole having a diameter corresponding to the outer diameter of the casing 10 so that the casing 10 can be penetrated horizontally to each vertical plate 52 on the upper portion of the pair of vertical plates 52 facing each other. 52a is formed, respectively.

At this time, the outer peripheral surface of the casing 10 is provided with a stopper 12 protruding outwardly so as to have a diameter larger than the diameter of the through hole 52a of each vertical plate 52. In this case, the stopper 12 prevents the casing 10 installed on the pedestal 50 from being biased to one side so that the stopper 12 can be stably installed in the centered state, that is, the casing 10. It serves to regulate the penetration length of (10).

As shown in FIG. 3, a light receiving body 20 for receiving infrared rays emitted from a measurement object is provided inside the front side of the casing 10.

The light receiver 20 is a cylindrical part made of a synthetic resin material, and a light receiver 21 is provided on the front surface of the light receiver 20 disposed on the front surface of the casing 10 to provide a space for receiving infrared radiation emitted from a measurement object. do. The light receiving portion 21 is made of a groove having a predetermined diameter is formed long in the longitudinal direction of the light receiving body.

On the bottom surface of the light receiver 20 at the position where the light receiver 21 is formed, a sensor installation groove 23 in which the infrared sensor 30 is installed is provided. At this time, a hole 22 is drilled in the bottom surface of the sensor installation groove 23 and the light receiver 21 so that the infrared light received by the light receiver 21 is installed in the sensor installation groove 23 through the hole 22. May be guided to.

In addition, fitting grooves 24 to which fitting protrusions 43 of the pcb substrate 40 to be described later are fitted are formed at both sides of the sensor installation groove 23 on the bottom of the light receiving body 20, respectively.

In addition, a groove 27 into which the rubber ring 13 provided on the inner surface of the casing 10 is fitted is formed around the front outer surface of the light receiving body 20.

In particular, in the present invention, a plurality of uneven parts 21a are formed on the inner wall surface of the light receiving part 21 so that the infrared light received by the light receiving part 21 and reflected from the inner wall surface of the light receiving part can be minimized from reaching the infrared sensor 30. . More specifically, a thread-shaped uneven portion 21a is formed around the inner wall of the light receiving portion 21 so as to be continuously arranged in the longitudinal direction of the light receiving portion 21.

For this reason, as shown in FIG. 4, a part of the infrared rays that enter the inner wall surface of the light receiving portion among the infrared light received into the light receiving portion 21 is incident on the inclined surface of the uneven portion 21a and is reflected back to the outside of the light receiving portion 21 again. Since the infrared sensor 30 does not proceed to the infrared sensor 30, the infrared rays reflected from the smooth surface and distorted in the wavelength range can be minimized to the infrared sensor, so that the temperature of the target object can be measured more accurately. Will be.

In the light receiving body 20, a laser hole 25 is formed in the longitudinal direction of the light receiving body 20 on one side of the light receiving portion 21. A light emitting part 26 for generating a laser beam is provided below the laser hole 25. The laser beam emitted from the light emitter 26 is guided along the laser hole 25 and irradiated to the measurement target to measure the temperature.

At this time, the laser hole 25 is designed to increase in diameter as it goes down from the top of the laser hole 25 to secure the installation area of the light emitting unit 26 while improving the straightness of the irradiated laser beam.

As such, since the laser beam is irradiated to the measurement object, the user can easily adjust the infrared sensor and the measurement object to be aligned in a straight state while easily checking the measurement object to be measured even when measuring a long distance object. The accuracy of the measurement can be improved.

5 is a perspective view illustrating an infrared sensor, a pcb substrate, and a heat dissipation unit in a non-contact infrared temperature measuring apparatus according to an embodiment of the present invention.

As shown in FIG. 5, the infrared sensor 30 is manufactured integrally with the pcb substrate 40 and fixedly installed in the sensor installation groove 23 formed on the bottom surface of the light receiving body 20.

The infrared sensor 30 is a known sensor that detects an infrared wavelength emitted from an object and converts it into an electric quantity (voltage) capable of signal processing. Since its operation principle is well known in the art, a detailed description thereof will be omitted. do.

The pcb substrate 40 is electrically connected to the infrared sensor 30 to mount various electrical components such as a controller that calculates the temperature of the measurement target by comparing the voltage converted by the infrared sensor 30 with a preset reference voltage.

The pcb board 40 is coupled to one end of the square plate-shaped board plate 41 on which various electronic components are mounted, and a disk-shaped sensor on which an infrared sensor 30 is installed at the central side thereof. The plate 42 is made integral.

Here, the sensor mounting plate 42 is formed with fitting projections 43 fitted to each fitting groove 24 formed on the bottom surface of the light receiving body 20 on both sides of the infrared sensor 30.

 As such, since the infrared sensor 30 is integrally provided with the pcb substrate 40, the entire assembly is simplified because the infrared sensor 30 and the pcb substrate 40 do not need to be individually connected to the light receiving body 20. In particular, when the infrared sensor 30 is fitted into the sensor installation groove 23 provided on the bottom surface of the light receiving body 20, the pcb substrate 40 is connected to the light receiving body 20 without a separate fastening means, so that the assembly process and Significantly fewer parts have the advantage of reduced manufacturing time and cost.

In addition, it is important that the infrared temperature measuring device such as the present invention equalize the inside and the outside of the casing in order to measure the accurate temperature. To this end, the present invention is provided with a heat dissipation unit 70 for dissipating heat generated from the pcb substrate 40 installed in the casing 10 to the outside of the casing 10.

More specifically, the heat dissipation unit 70 is an electronic component that generates a relatively high heat among electronic components mounted on the pcb substrate 40 so as to quickly remove heat generated from the pcb substrate 40 to the outside of the casing 10. A shield casing 71 which encloses the entirety of the shield casing 71 and a heat conduction plate which is coupled to the upper portion of the shield casing 71 and contacts the inner wall of the casing 10 to conduct heat inside the shield casing 71 to the casing 10. It consists of 72.

The shield casing 71 is a rectangular parallelepiped casing with one side open, and the opening is coupled to the pcb substrate 40 side to completely cover the electronic components mounted on the pcb substrate 40 to be completely generated in the pcb substrate 40. It serves to quickly take out the casing 10 while preventing the heat from spreading to other places.

The heat conduction plate 72 has a fixed end 71a having one end tightly coupled to the shield casing 710, an elastic portion 72b inclined upwardly from the fixed end 71a, and an end portion of the elastic portion 72b. And a contact portion 72c contacting the inner wall of the casing 10 while forming the apex of the heat conduction plate 72, and a free end 72d extending downward from the contact portion 72c. For this reason, the contact part 72c is always in close contact with the inner wall of the casing 10 by the elastic force of the elastic part 72b. In other words, when the contact portion 72c is pressed down by the contact with the inner wall of the casing 10, the contact portion 72c is always held by the force that is to be opened outward by the elastic force of the elastic portion 72b. The force added to the inner wall side is exerted so that the contact portion 72c always maintains close contact with the inner wall of the casing 10.

And since the heat conduction plate 72 is composed of the inclined portion on both sides around the contact portion 72c can be easily entered and retracted into the casing 10 can be assembled and disassembled without damaging the components.

Here, the shield casing 71 and the heat conduction plate 72 are made of a metal material having excellent thermal conductivity such as copper to quickly transfer heat generated from the pcb substrate 40 to the casing 10.

On the other hand, the present invention is installed on the front of the light collecting body 20 in the filter unit 60 for collecting infrared rays to exclude the infrared wavelength range emitted from the water or other gas present in the surrounding environment of the object to be measured purely in the measurement object By concentrating only the emitted ultraviolet wavelength range, measurement accuracy is improved by eliminating measurement error elements such as moisture or gas present in the surrounding environment of the conventional measurement object.

To this end, the filter unit 60 blocks the range of 2.5 ~ 2.9 ㎛ range of the infrared wavelength range of moisture and 4.0 ~ 4.54 ㎛ range of the gas (especially nitrogen) when the AR coating (reflective coating) to the lens And coated with an 8-14 μm bandpass filter that only passes through a wavelength range of 8-14 μm.

In this case, the lens used for the filter unit 60 uses a lens made of germanium to improve the absorption of the infrared wavelength.

Here, the bad pass filter coating technique for allowing the lens to pass only a specific range of wavelength ranges in the filter unit may be adopted without particular limitation as long as it is a method commonly known in the art.

Referring to the assembly state and the operating state of the non-contact infrared temperature measuring apparatus according to an embodiment of the present invention configured as described above are as follows.

Looking at the assembly state, first the infrared sensor 30 integrally installed on the sensor mounting plate 42 constituting the pcb substrate 40 and the fitting protrusions 43 provided on both sides of the infrared sensor 30 are the bottom of the light receiving body. The sensor installation groove 23 and the fitting groove 24 installed in each of the fixed coupling method.

Next, the infrared sensor 30 and the pcb substrate 40 connected to the light receiving body 20 are inserted into the rear opening of the casing 10 so that the front surface of the light receiving body 20 is positioned in front of the casing 10. Push it in. At this time, the rubber ring 13 provided on the front inner circumferential surface of the casing 10 is fitted into the groove 27 formed around the outer circumferential surface of the light receiving body 20, and the coupling force and airtightness of the light receiving body 20 installed inside the casing 10 are maintained. Is improved.

Then, when the rear opening of the casing 10 is sealed with the rear cover 11, the entire assembly work is completed.

Looking at the operation state, after the casing 10 is assembled through the through hole of the pedestal 50, the front of the light receiving unit 21, that is, the infrared sensor 30 and the measurement object at a distance away from the measurement object. Place the infrared temperature measuring device in a straight line.

Next, when power is applied to the infrared temperature measuring device, the light emitting unit 26 emits light, and the laser beam is irradiated onto the target object to be measured, so that the user can accurately recognize the measuring object. In this case, the infrared rays emitted from the measurement object are introduced into the light receiving portion 21 of the light receiving body 20.

The infrared rays introduced into the light receiving unit 21 pass only the infrared wavelength band having a range of 8 to 14 μm by the filter unit 60 provided in front of the light receiving unit 21.

The infrared rays passing through the filter part 60 toward the inner wall surface of the light receiving part 21 are Part of the infrared sensor 30 is a part of the inclined surface of the uneven portion 21a is reflected to the outside of the light-receiving portion 21 and does not proceed to the infrared sensor 30, so that infrared rays whose wavelength range is distorted due to reflection are not infrared rays. Can be minimized.

The infrared sensor 30 detects the incoming infrared wavelength and converts it into a voltage and sends it to the controller, and the controller compares the voltage converted by the infrared sensor 30 with the reference voltage to calculate the temperature of the measurement object and displays it externally. This completes the measurement work.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

10 casing 12 stopper
20: light receiver 21: light receiver
22: hole 23: sensor mounting groove
24: fitting groove 25: laser hole
26: light emitting unit 30: infrared sensor
40: pcb board 41: board board
42: sensor mounting plate 43: fitting protrusion
50: pedestal 60: filter portion
70: heat dissipation unit 71: shield casing
72: heat conduction plate

Claims (9)

A sealed casing 10 with an empty interior;
The light receiving unit 21 is installed inside the casing 10, and has a groove having a predetermined height and diameter to receive infrared rays emitted from a measurement object, and has a thread shape around the inner surface of the light receiving unit 21. The light receiving body 20 in which the uneven portion 21a is formed continuously in the longitudinal direction;
An infrared sensor (30) installed at a hole (22) side of the bottom of the light receiving unit (21) to detect an infrared wavelength received by the light receiving unit (21) and convert it into a voltage; And
The PCB board is installed in the casing 10, the PCB is electrically connected to the infrared sensor 30, the control board for calculating the temperature of the measurement target by comparing the voltage converted by the infrared sensor 30 with the reference voltage 40;
Non-contact infrared temperature measuring apparatus comprising a.
The method of claim 1, wherein the pcb substrate 40 further includes a heat dissipation unit 70 in contact with the inner surface of the casing 10 in order to discharge the heat generated from the pcb substrate 40 side to the outside of the casing 10. And the heat dissipation part 70 and the casing 10 are made of a metal material having excellent thermal conductivity.
The electronic device of claim 2, wherein the heat dissipation part 70 includes electronic components that generate relatively high heat among electronic components mounted on the pcb substrate 40 to quickly remove heat generated from the pcb substrate 40 to the outside. A shield casing 71 which is hermetically sealed, a fixed end 72a having one end fixedly coupled to an upper portion of the shield casing 71, and an elastic portion 72b inclined upwardly from the fixed end 72a and the elastic portion. Non-contact infrared temperature, characterized in that it consists of a contact portion 72c which forms an end of the 72b and contacts the inner wall of the casing 10 and a free end portion 72d inclined downward from the contact portion 72c. Measuring device.
The method of claim 1, wherein the front of the light receiving portion 21 is provided with a filter unit 60 for collecting the infrared radiation emitted from the measurement object in the measurement object, the filter unit 60 is 8 ~ 14 ㎛ of the germanium lens Non-contact infrared temperature measuring device characterized in that the coating treatment to pass only the wavelength range band.
The casing 10 of claim 2, wherein the casing 10 is vertically bent to both sides of the bottom plate 51 so as to be horizontally installed in a state where the casing 10 is spaced apart from the ground by a predetermined distance. Non-contact infrared temperature measuring apparatus, characterized in that it further comprises a pedestal (50) consisting of a pair of vertical plates (52) each having a through hole (52a) is installed through.
The non-contact infrared temperature measuring apparatus according to claim 5, wherein a stopper (12) is provided around the outer circumferential surface of the casing (10) to limit the installation position of the casing (10) on the pedestal (50).
2. The laser light emitting unit 26 of claim 1, wherein the light receiving body 20 is formed with a laser hole 25 that extends long in the entire length direction of the light receiving body 20. Non-contact infrared temperature measuring apparatus, characterized in that the laser beam irradiated from the irradiated to the measurement object through the laser hole (25).
The method according to claim 1, wherein the pcb board 40 is coupled to one end of the square plate-shaped board plate 41, the board plate 41, the electronic component is mounted and the infrared sensor 30 is installed on the central side thereof Non-contact infrared temperature measuring device, characterized in that the disk-shaped sensor mounting plate 42 is made integral.
The fitting groove of claim 8, wherein the sensor mounting plate 42 is formed at both sides of the infrared sensor 30, respectively, and is formed at both sides of the sensor mounting groove 23 on the bottom surface of the light receiver 20. Non-contact infrared temperature measuring apparatus, characterized in that the fitting protrusions 43 are fitted to each of the fittings (24).

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