KR20120110783A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR20120110783A
KR20120110783A KR1020110028886A KR20110028886A KR20120110783A KR 20120110783 A KR20120110783 A KR 20120110783A KR 1020110028886 A KR1020110028886 A KR 1020110028886A KR 20110028886 A KR20110028886 A KR 20110028886A KR 20120110783 A KR20120110783 A KR 20120110783A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
device package
groove
reflective sheet
Prior art date
Application number
KR1020110028886A
Other languages
Korean (ko)
Inventor
김준형
윤형선
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110028886A priority Critical patent/KR20120110783A/en
Publication of KR20120110783A publication Critical patent/KR20120110783A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting device package is provided to manufacture a compact lighting product by reducing the number of LED chips for the lighting product. CONSTITUTION: A cover(100) has a groove and includes a reflecting sheet(110) arranged on the upper part of the groove. The reflecting sheet is formed by coating the groove with reflecting materials. A bottom unit(200) includes a light emitting element(210) arranged on one side and a metal pad(240) electrically connected to the light emitting element. The bottom unit is combined with the cover.

Description

Light emitting device package {LIGHT EMITTING DEVICE PACKAGE}

An embodiment of the present invention relates to a light emitting device package.

The light emitting device package may be classified into a top view package and a side view package. Among these, the side view light emitting device package is widely used as a light source of the backlight unit. At this time, the side view light emitting device package is disposed on the side of the light guide plate to supply light into the light guide plate. The side view light emitting device package includes a package body having a long cavity, in which an LED chip is mounted. The LED chip receives light from lead terminals provided in the package body and emits light.

Recently, side view light emitting device packages including a structure in which blue, green, and red LED chips are arranged in a single long cavity are mounted. The side view light emitting device package includes a package body in which a long cavity is formed in a lateral direction, and three LED chips, that is, blue, green, and red LED chips are arranged in a line in the cavity.

Such a conventional side view light emitting device package has a limit in the amount of light generated, and LED chips that can be used for heat dissipation problems are limited.

In addition, unlike a lead frame, it is difficult to produce a side view light emitting device package using a material such as silicon, silicon carbide, or ceramic.

An embodiment of the present invention is to provide a side view light emitting device package.

One embodiment of the present invention, the cover portion having a groove, the reflective sheet disposed on the upper portion; And a light emitting device disposed on one surface thereof, and a bottom part coupled to the cover part.

Another embodiment of the present invention, the cover portion having a groove, the reflective sheet disposed on the groove; And a bottom portion which reflects light to the reflective sheet by irradiating light from one surface thereof.

According to the exemplary embodiment of the present invention, the limitation of the amount of light generated by using the side view light emitting device package can be overcome, and the heat dissipation problem can be solved.

In addition, according to an embodiment of the present invention, since the number of LED chips used in lighting products such as TV arrays using side view light emitting device packages can be reduced, the lighting products can be made compact, and in the related art In comparison, even a small number of LED chips can generate the same amount of light.

1 is a perspective view showing the appearance of a light emitting device package according to an embodiment of the present invention.
FIG. 2A is a perspective view illustrating the cover of FIG. 1. FIG.
FIG. 2B is a perspective view illustrating a state where the cover part of FIG. 2A is turned upside down. FIG.
3 is a perspective view illustrating the bottom part of FIG. 1.
4 is a cross-sectional view taken along the ab direction of FIG. 3.
5A is a cross-sectional view illustrating an internal structure of a light emitting device package according to a first embodiment of the present invention.
5B is a cross-sectional view illustrating an internal structure of a light emitting device package according to a second exemplary embodiment of the present invention.
5C is a cross-sectional view illustrating an internal structure of a light emitting device package according to a third embodiment of the present invention.
6A is a cross-sectional view illustrating a first embodiment in which a phosphor and a resin are filled in the light emitting device package of FIG. 5A.
6B is a cross-sectional view illustrating a second embodiment in which a phosphor and a resin are filled in the light emitting device package of FIG. 5A.
6C is a cross-sectional view illustrating a third embodiment in which a phosphor and a resin are filled in the light emitting device package of FIG. 5A.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not entirely reflect the actual size.

In the description of the embodiment according to the present invention, when described as being formed on the "on or under" of each element, the above (on) or below (on) or under) includes two elements in which the two elements are in direct contact with each other or one or more other elements are formed indirectly between the two elements. In addition, when expressed as "on" or "under", it may include not only an upward direction but also a downward direction based on one element.

Hereinafter, a light emitting device package according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view showing the appearance of a light emitting device package according to an embodiment of the present invention, Figure 2a is a perspective view showing the cover of Figure 1, Figure 2b is a perspective view showing a state inverted the cover of Figure 2a, Figure 3 1 is a perspective view illustrating the bottom portion of FIG. 1, and FIG. 4 is a cross-sectional view taken along the ab direction of FIG. 3. 1 to 4, the light emitting device package includes a cover part 100 and a bottom part 200.

The cover part 100 has a groove and has a reflective sheet 110 disposed above the groove. The reflective sheet 110 is formed by coating a reflective material on the groove. In addition, the cross section of the groove may have a trapezoidal shape in which an upper portion is opened and the side is inclined, or a rectangular shape in which the upper portion is opened and the side is inclined in the vertical direction. In addition, the cross section of the groove may be polygonal or circular. The grooves are etched in anisotropic form.

The bottom part 200 includes a light emitting device 210 disposed on one surface, a metal pad 240 electrically connected to the light emitting device 210, a wire 230 connecting the light emitting device 210 to the metal pad 240, Via holes 220a, 220b, 220c, and 220d penetrating the upper and lower surfaces of the bottom part 200 are included. The metal pad 240 is electrically connected to the light emitting device 210 through the via holes 220a, 220b, 220c, and 220d.

The bottom part 200 is coupled to the cover part 100, and irradiates light from one surface to reflect the light to the reflective sheet 110. As the reflective sheet 110, a material having excellent heat dissipation, such as silicon, silicon carbide, and ceramic, is used. In the case of using such a material, even if a large amount of current flows through the light emitting device package, the heat may be sufficiently radiated. When the lead frame is used in the light emitting device package, only a few tens of mA may be applied to the light emitting device package. However, when using such a material, a current of up to about 1A may be supplied. The cover part 100 and the bottom part 200 may be formed of any one of silicon, silicon carbide, and ceramic, and may enable anisotropic etching.

In addition, after the anisotropic etching is completed, the cover part 100 and the bottom part 200 may be bonded by bonding. Conventionally, it was difficult to produce a side view light emitting device package using a material such as silicon, silicon carbide, ceramic, etc., but the present invention solved such a problem. That is, in the present invention, by making the cover part 100 and the bottom part 200 and bonding after completing the anisotropic etching, the side view light emitting device package can be manufactured using a material such as silicon, silicon carbide, ceramic, and the like.

5A is a cross-sectional view illustrating an internal structure of a light emitting device package according to a first embodiment of the present invention, and FIG. 5B is a cross-sectional view showing an internal structure of a light emitting device package according to a second embodiment of the present invention. 5 is a cross-sectional view illustrating an internal structure of a light emitting device package according to a third embodiment of the present invention, and FIG. 5D is a cross-sectional view showing an internal structure of a light emitting device package according to a fourth embodiment of the present invention. 5A through 5D illustrate various internal structures of the light emitting device package, which is a cross-sectional view taken along the c-d direction of FIG. 3, and may have a different structure from the light emitting device package of FIGS. 1 to 4.

Referring to FIG. 5A, it can be seen that the cover part 100 is anisotropically etched. The light emitting device 210 is disposed on an upper surface of the bottom part 200, and the light emitted from the light emitting device 210 is covered with a cover part ( Reflected on the reflective sheet 110 of 100. The groove in which the reflective sheet 110 is formed has an inclined trapezoidal shape, and the light emitting device 210 is connected to the electrode. Via holes 220e and 220f are formed between the metal pads 240. In the anisotropic etching, a crystalline material such as silicon or silicon carbide is used.

Referring to FIG. 5B, it can be seen that both the cover part 100 and the bottom part 200 are anisotropically etched. The light emitting device 210 is disposed on the top surface of the bottom part 200, and the light emitting device 210 is disposed in the light emitting device 210. The irradiated light is reflected by the reflective sheet 110 of the cover part 100. The groove in which the reflective sheet 110 is formed has an inclined trapezoidal shape, and the light emitting device 210 is connected to the metal pad 240. In FIG. 5B, unlike FIG. 5A, a groove is formed in the bottom part 200, and the groove of the bottom part 200 is symmetrically formed with the groove of the cover part 100.

Referring to FIG. 5C, it can be seen that both the cover part 100 and the bottom part 200 are anisotropically etched. In particular, the bottom part 200 is vertically anisotropically etched. The light emitting device 210 is disposed on an upper surface of the bottom part 200, and the light emitted from the light emitting device 210 is reflected by the reflective sheet 110 of the cover part 100. The groove in which the reflective sheet 110 is formed has an inclined trapezoidal shape, and the light emitting device is connected to the metal pad 240. In FIG. 5C, unlike FIG. 5A, a groove is formed in the bottom part 200, and unlike in FIG. 5B, the groove of the bottom part 200 is not symmetrically formed with the groove of the cover part 100. In particular, in the case of FIG. 5C, the slope efficiency of the cover part 100 is used to maximize reflection efficiency.

Referring to FIG. 5D, it can be seen that both the cover part 100 and the bottom part 200 are vertically anisotropically etched. Unlike the case of FIGS. 5A to 5C, the light emitting device 210 is vertically disposed on the side surfaces of the cover part 100 and the bottom part 200, and the light irradiated from the light emitting device 210 is oriented in a horizontal direction. Only a part is reflected by the reflective sheet 110 of the cover part 100 and the reflective sheet 250 of the bottom part 200. The grooves in which the reflective sheets 110 and 250 are formed have a rectangular shape, and the light emitting device is connected to the metal pad 240. At this time, unlike FIG. 5A to FIG. 5C, no slope is formed in the cover part 100 in FIG. 5D. In particular, in FIG. 5D, the light emitted from the light emitting device 210 is directed in the horizontal direction to minimize the loss of light.

6A is a cross-sectional view illustrating a first embodiment in which the phosphor and resin are filled in the light emitting device package of FIG. 5A, and FIG. 6B is a cross-sectional view illustrating a second embodiment in the phosphor and resin filled in the light emitting device package of FIG. 5A. 6C is a cross-sectional view illustrating a third embodiment in which a phosphor and a resin are filled in the light emitting device package of FIG. 5A.

Referring to FIG. 6A, the phosphor 300 is coated on the light emitting device 210, and the resin 400 is filled in the space between the cover part 100 and the bottom part 200.

Referring to FIG. 6B, a portion surrounding the light emitting device 210 in the space between the cover part 100 and the bottom part 100 is filled with a resin 400 and contacted with the reflective sheet 110. The site is filled with the phosphor 300.

Referring to FIG. 6C, a space between the cover part 100 and the bottom part 200 is filled with the phosphor 300 and the resin 400, and a portion surrounding the light emitting device 210 is resin 400. It is filled with).

6A and 6C, in the case of FIGS. 6B and 6C, the phosphor 300 is not damaged by the heat generated by the light emitting device 210, and heat generated by the phosphor 300 is compared with that of FIG. 6A. It can be seen that the structure can be released.

Although the above has been described with reference to the embodiments, these are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains are not exemplified above without departing from the essential characteristics of the present embodiments. It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. And differences related to such modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

100: cover part
110, 250: Reflective sheet
200: bottom part
210: light emitting device
220a, 220b, 220c, 220d, 220e, 220f: via hole
230: wire
240: metal pad
300 phosphor
400: Resin

Claims (9)

A cover part having a groove and having a reflective sheet disposed on the groove; And
A bottom portion including a light emitting element disposed on one surface and coupled to the cover portion;
Light emitting device package comprising a. The method of claim 1,
The reflective sheet is a light emitting device package is formed by coating a reflective material on the groove. The method of claim 1,
The cross-section of the groove is a light-emitting device package having a trapezoidal shape of which the top is opened and the side is inclined, or a rectangular shape of the top is opened and the side is inclined in the vertical direction. The method of claim 1,
The groove is a light emitting device package etched in an anisotropic form. The method of claim 1,
A phosphor is coated on the light emitting device, and the light emitting device package filled with a resin in the space between the cover and the bottom. The method of claim 1,
A light emitting device package filled with a resin in a portion surrounding the light emitting device in a space between the cover portion and the bottom portion, and coated with a phosphor on a portion in contact with the reflective sheet. The method of claim 1,
The space between the cover portion and the bottom portion is filled with a phosphor and a resin, the area surrounding the light emitting element is filled with a resin light emitting device package. A cover part having a groove and having a reflective sheet disposed on the groove; And
A bottom portion which reflects light to the reflective sheet by irradiating light from one surface;
Light emitting device package comprising a. The method according to claim 1 or 8,
The cover part and the bottom part is a light emitting device package formed of any one of silicon, silicon carbide, ceramic.
KR1020110028886A 2011-03-30 2011-03-30 Light emitting device package KR20120110783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110028886A KR20120110783A (en) 2011-03-30 2011-03-30 Light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110028886A KR20120110783A (en) 2011-03-30 2011-03-30 Light emitting device package

Publications (1)

Publication Number Publication Date
KR20120110783A true KR20120110783A (en) 2012-10-10

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Application Number Title Priority Date Filing Date
KR1020110028886A KR20120110783A (en) 2011-03-30 2011-03-30 Light emitting device package

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Country Link
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