KR20120109073A - Building environment monitoring apparatus - Google Patents

Abstract

PURPOSE: A building environment monitoring device is provided to monitor temperature, humidity, fire occurrence, trespassers, and power failure by connecting each building unit to a client PC. CONSTITUTION: A sensor module(S2) senses a building environment signal. An interface unit(S3) communicates with a client PC. A DC power supply(S4) supplies DC power to each module and an MCU(S1). A microcontroller unit includes the MCU. The microcontroller unit collects signals of the sensor module. [Reference numerals] (AA) Main power; (BB) Photocoupler module; (CC) PIR motion sensor module; (DD) Smoke sensor module; (EE) Signal processor; (FF) Client PC; (S2) Temperature and humidity sensor module; (S3) Interface unit; (S4) DC power supply; (S5) Flash memory

Description

Building environment monitoring apparatus

The present invention relates to a building environment monitoring device, and more specifically, to the environment of a building unit provided with a sensor module unit for detecting temperature, humidity, fire, visitors, and power failure of each building unit subject to environmental monitoring centering on a microcontroller MCU. The present invention relates to a building environment monitoring device capable of transmitting a monitoring signal to a client PC connected to an integrated building environment monitoring system.

An intrusion monitoring device is installed in a general company or a building for the purpose of protecting a facility from intruders. The intrusion detection market detects an intruder in contact with the human body detection sensor by installing it at a specific location, but the monitoring range is limited only by the human body detection sensor.

Most buildings, such as schools and apartment complexes, consist of a number of buildings, each of which is normally equipped with a fire detector, which is equipped with a fire sensor, a warning device and a fire extinguishing device.

As described above, a general monitoring system has a problem that is limited to a system for preventing theft or a fire only for each purpose to be monitored. Therefore, an integrated environmental monitoring system for comprehensive monitoring of a building environment is required.

 The present invention relates to a configuration of a building environment monitoring apparatus for transmitting building environment information to a client PC and a client PC of a building unit that is a monitoring target constituting each sensor node, which is a substructure of an integrated building environment monitoring system.

The monitoring target of the building environment monitoring device is to monitor the temperature and humidity of each building unit, to monitor the entrance and theft of outsiders using the human body sensor, the fire monitoring by the smoke sensor, and the power monitoring signal to determine the presence of power failure. Collected through each sensor module, processed by the MCU, transmitted to the client PC, and monitored by the environmental monitoring software in real time.

To solve this problem, it is necessary to provide a building environmental monitoring device that can monitor the temperature and humidity of the building environment information such as temperature, humidity, fire, access control, and power outage by connecting to client PCs in each building unit that is a major facility in the building that needs to be monitored. It is a task.

The microcontroller unit is equipped with an MCU to collect the signal of the sensor module unit, the sensor module unit is a temperature and humidity sensor module for measuring the temperature and humidity, a human body sensor module for access monitoring, smoke sensor module for fire monitoring and power sensor for power monitoring Each module is equipped with a module that senses temperature and humidity of the building unit, and detects visitors, fire and power outages. The signal from the temperature and humidity sensor module is connected to the GPIO pin of the MCU. The human body sensor module and the power sensor module are ext. Connected to the interrupt and the smoke sensor module is connected to the ADC pin, the interface unit has an RS-232 communication module to communicate with the client PC, the DC power supply unit is provided with a DC power supply and a voltage regulator 2 (20) to each module Supplying DC power, the operating system firmware is recorded and operated in the flash memory of the MCU, the MCU collects the signal of the sensor module unit and transmits it to the client PC through the RS-232 communication module of the interface unit,

In case of power failure, the 7812, the voltage regulator 3 (30), receives 12V and 9V power, and the 7805, the voltage regulator 1 (10), receives 12V and supplies 5V power. Replacing is the solution to the problem.

The building environment monitoring market uses a microcontroller for signal processing and control, and monitors the sensor module unit through the temperature / humidity sensor, PIR motion sensor, the fire monitoring by the ionization smoke sensor, and the power failure of the main power supply by the photocoupler. Generates a signal, connected to the client PC as a component of the sensor node of the integrated building environment monitoring system has the effect of monitoring the building environment of each building unit.

1 is a block diagram of a building environment monitoring device.
Figure 2 is a block diagram of the control server and sensor node of the integrated building environment monitoring system.
3 is a wiring diagram of a micro controller unit (MCU).
Figure 4 is a (a) temperature and humidity sensor module circuit diagram, (b) PIR motion sensor module circuit diagram and (c) smoke sensor module circuit diagram.
Figure 5 (a) is a power monitoring sensor module circuit diagram, (b) RS-232 serial communication module circuit diagram.
Figure 6 (a) power supply module circuit diagram. (b) a direct current (12 V) to direct current (5 V) conversion circuit diagram, (c) a direct current (9 V) to direct current (5 V) conversion circuit diagram, (d) a direct current (14.8 V) to direct current (12 V, 5 V) conversion circuit diagram .
7 is a connection diagram of a compiler, an ISP, and an MCU.
8 is a flowchart of a firmware of a building environment monitoring apparatus.
9 is a flow chart of the environmental monitoring software of the client PC.

The present invention is to monitor the environmental information of the main facilities in real time, such as server rooms for storing and storing data of companies, government agencies, as well as general buildings, and through the acquired information to not only fire and theft, but also data loss and damage, etc. It is installed in each building unit to be monitored so as to detect and respond to the situation that can be brought in advance. It is a building environment monitoring device that collects, processes and transmits the environmental information of the building unit to the client PC. It is a client of the integrated building environment monitoring system. Configure a sensor node with a PC.

2 is a configuration diagram of a control server and a sensor node of an integrated building environment monitoring system, wherein a client PC and a building environment monitoring device are provided in a building unit that is a room in a building selected for monitoring, and each client PC is provided with a LAN. The information is transmitted to the server PC through the network of the communication line, and the entire building unit monitored by the central authority or the building management headquarters is integrated and monitored.

Each client PC is equipped with environmental monitoring software to receive environmental monitoring data from the building environment monitoring device through the RS-232 serial communication line, and the server PC is equipped with an integrated building environment monitoring program. Receives environmental monitoring data of each sensor node through LAN network and comprehensively monitors it.

The monitoring target of the building environment monitoring system is to monitor the temperature and humidity of each building unit, the entrance and theft of outsiders through human body detection using motion sensors, the fire monitoring by the smoke detection, and the power supply to determine the abnormality of power supply. Signals for monitoring are collected from the MCU through each sensor module, processed and transmitted to the client PC for real-time monitoring by environmental monitoring software.

Each sensor module is a basic module of a circuit made by logically constructing passive or active electronic components that process the signals sensed by the mounted sensor into a signal size that can be supplied to a microcontroller unit (MCU). In other words, the building environment monitoring device is composed of a microcontroller unit (MCU), a sensor module unit (Sensor Module), an interface unit (interface) and a DC power supply.

FIG. 1 is a block diagram of a building environment monitoring apparatus, and includes four main parts in hardware and firmware, which is an operating system of the building environment monitoring apparatus, as shown in Table 1.

In Table 1, the building environmental monitoring system consists of a microcontroller unit (S1), a sensor module unit (S2), an interface unit (S3), a DC power supply unit (S4), and an operating system (S5). Together, it serves as a sensor node of the overall integrated building environment monitoring system.

The microcontroller unit (S1) of the building environment monitoring device uses a microcontroller (MCU), which is a computer on a chip. In addition to a microprocessor (CPU) for general signal processing purposes, a flash for storing data as well as general arithmetic and logic elements. read / write memory such as flash, read-only memory such as ROM for code storage, EEPROM that can be electrically written and erased for continuous data logging, peripheral and input / output interfaces Integrates additional elements such as interface (GPIO) and interrupt controller to enable low-power operation and simple circuit implementation, which is widely used for operation control of engine control, robots, office equipment, electronic devices and electrical products. Environment monitoring device collects, calculates and processes building environment signals collected from each sensor module and interfaces It transmits data to the client PC by using RS-232 communication module of S3.

The sensor module unit S2 is composed of five sensor modules.

  In the temperature sensor module,

Temperature is the magnitude of atomic or molecular vibrational kinetic energy, and the resistance value of metal wires or semiconductors varies with temperature.The temperature sensor used in traditional temperature measurement consists of alloys such as platinum, nickel, and copper. RTD (resistance temperature detector) using a property that changes the value, consisting of a semiconductor, the resistance value changes rapidly depending on the temperature, thermistor (thermistor) and a heterogeneous metal that is a sensor that can measure temperature more precisely (couple) There are thermocouples that measure the temperature with the electromotive force generated by the change of temperature, but they are basically non-linear temperature signals and if you want to measure the actual temperature, you can supply bias current, analog digital signal conversion and signal processing in addition to the sensor. In the present invention, because it requires an element, etc. It uses a band gap temperature sensor shown a type attribute.

The bandgap temperature sensor is called silicon temperature sensor, and it can be easily implemented in general integrated circuits by using the property that current and voltage passing through energy band gap of junction of P-type N-type semiconductor change linearly with temperature. .

The silicon temperature sensor is used to generate clocks and data in software on the GPIO (General Purpose Input / Output) pins of the MCU, send them to the silicon temperature sensor, receive the signal from the MCU, process it, and convert it to the commonly used temperature notation. It transmits to environmental monitoring software of client PC by using RS-232 serial communication.

  In the humidity sensor module,

Humidity detects the ratio of relative humidity in the air, and the principle of the humidity sensor that is generally used is an electrical resistance that uses the property of changing the electrical resistance between polymer polymers when the moisture in the air adsorbs onto the polymer polymer. It uses either a food humidity sensor or a polymer film humidity sensor. Like the temperature measurement, the clock and data are generated in software on the GPIO (General Purpose Input / Output) pin of the MCU and sent to the thermistor. After compensation according to the value, it is converted into general notation and delivered to the environment monitoring software of the client PC.

  In the human body sensor module,

The method of detecting the human body may be manufactured using an active module using ultrasonic waves or microwaves, but as a means of simply detecting the presence or absence of a person, a passive infrared (PIR) motion sensor that detects infrared rays emitted by the human body is generally used. To detect and compare the temperature difference between the human body temperature and the surrounding background.

A typical PIR motion sensor uses a pyroelectric material. Pyroelectricity is a property in which voltage fluctuations occur temporarily when heated or cooled. By using infrared material, it is made of infrared sensor to amplify the voltage fluctuation caused by infrared rays generated in human body with an amplifier and compare it with a comparator like the infrared value of the surrounding environment. Judge.

The signal generated from the PIR motion sensor is collected through the MCU's external interrupt. The MCU's external interrupt is generated when an event occurs outside the MCU during the program execution. It's one of the MCU's features that allows you to take action and continue to program.

  In the smoke sensor module,

An ionization smoke chamber, an ionization smoke sensor, is used as a sensor for detecting smoke, and an electrode pair is installed in the chamber inside the smoke sensor, and an alpha particle is provided by a radioactive material ²⁴¹ Am (Americium-241). ) When ionizing air as a radiation source and generating a potential difference between electrodes, a weak current flow is generated by ionized air ions, but when smoke enters the chamber of the smoke sensor, the smoke particles are ionized to increase the amount of ions. In addition, the amount of current flowing also increases and a voltage drop is generated between the electrodes, so smoke is detected. As the amount of smoke is generated and the amount of smoke flowing into the chamber of the sensor increases, the voltage between both electrodes gradually decreases. It flows into ADC (Analogue-digital converter) which is analog-to-digital signal converter of this MCU and then converts into digital signal to generate smoke After it is determined by addition MCU are transmitted as a fire signal to the environmental monitoring software of the client PC.

   In the power sensor module,

A photocoupler is used to detect the abnormality of the power supply from the power generated by the module of the DC power supply unit S4 used in the building environment monitoring device. The photocoupler generally detects the electrical noise mixed with the power supply. It is an optoelectronic device integrating the light generating unit and the light receiving unit integrally to cut off and electrically insulating and connecting the signal with the optical signal, that is, converting and combining the electrical signal into light. The signal which is converted into digital signal by eliminating electrical noise by photo coupler is supplied to MCU through external interrupt, and it is monitored through the environment monitoring software of client PC after determining whether there is an abnormal power supply.

The interface unit (S3) is for transmitting the signal collected and processed by the MCU to the client PC. It uses serial communication standards such as RS-232 or RS-422 and USB (Universal serial bus). It can be used within a distance, RS-422 can be used within a distance of 1km, and USB can be used within a distance of 5m.

RS-232 is to send the signal collected and processed by MCU to client PC. If most TTL or CMOS signal level voltage is different from RS-232 signal level, communication is not available. A 232 level converter is required. RS-232 receives the external signal of ± 1.8 ~ 30V and decides it as a digital signal of logic level 1 or 0 and transmits it.If the signal level is negative voltage -1.8 ~ -30V, it determines it as logic level 1 and transmits the signal. If the level is +1.8 to + 30V, which is a positive voltage, it is determined as logical level 0 and transmitted.

DC power supply (S4) is a DC power supply and DC voltage rise for converting the main power incoming from the outside, UPS (Uninterruptable Power Supply) and AC power available in the event of power failure into DC power required by the building environment monitoring device Or voltage regulator 2 (20) for voltage drop and current supply.

The rectifier circuit of the DC power supply of the DC power supply unit S4 includes a half-wave rectifier circuit and a full-wave rectifier circuit for converting alternating current into direct current. A commonly used full-wave rectifier circuit is a bridgediode rectifier. ) And a 9V constant voltage circuit using a large-capacity capacitor and zener diode to suppress the ripple voltage of the rectified DC power supply.The voltage regulator 2 (20) receives a 9V voltage and receives a 5V DC power supply. To be supplied.

Uninterruptable power supply (UPS) is an uninterruptible power supply device for stable power supply to a communication room or a control room in preparation for voltage fluctuations, transient voltages, frequency fluctuations and power outages of an incoming main power supply. If not, it operates only when there is an abnormality in the main power supply such as a power failure without operating the UPS, so that the building environment monitoring device can continuously operate even in the event of a power failure. In case of power failure, the voltage regulator 3 (30) receives 12V and 9V power, and the voltage regulator 1 (10) receives 12V and supplies 5V power to replace the main power supply. Keep the monitoring device operational.

The operating system (S5) is a basic program for operating the MCU of the building environment monitoring device. It is a firmware (compileware) that compiles an assembler or a high-level language such as a C-language into a compiler (translating program), that is, a storage device. Record the data on the MCU to operate.

The MCU develops and uses a compiler for each manufacturer, implements the algorithm with a general purpose compiler, compiles it, and writes the firmware, the target program converted into machine language, into the flash memory of the MCU to drive the building environment monitoring value.

The hardware configuration used in the building environment monitoring apparatus of the present invention is shown in Table 2.

3 is a connection diagram of a micro controller unit (MCU) used in the present invention.

The MCU used is ATmel's ATmega128 microprocessor, an 8-bit reduced instruction set computer (RISC) architecture that provides simple instructions, low power operation, very fast operation at 1 million instructions per second (MIPS), electrically erasable programmable ROM (EEPROM) and SRAM ( Static RAM), as well as 128-byte flash memory, enables in-system programming (ISP).

Peripherals for external signal input and output include 53 programmable IN / OUT (GPIO), 8 external interrupts, 2 8-bit Timer / Counters, 8-channel 10-bit analog digital converter (ADC) ), Two programmable USART (RS-232) serial communication ports, a master / slave SPI serial interface, and an analog comparator.

Pin numbers 7, 8 and 29 of FIG. 3 connect an Xtal oscillator as an input / output pin of the crystal oscillator.

Pin number 12 is connected to the jumper number 1 of the temperature and humidity sensor module of Figure 4 (a) to apply a clock signal, pin number 13 is connected to the jumper number 4 to transmit and receive the temperature and humidity data in both directions.

Pin No. 32 An external interrupt pin is connected to jumper No. 3 of the PIR motion sensor module of FIG.

Pin number 23 is an analog digital converter (ADC) pin and is processed by receiving an analog smoke signal of FIG. 4 (c) and converting the digital signal into an analog digital converter (ADC) inside a microprocessor.

Pin number 1 is an external interrupt pin and receives a signal generated from the power sensor module of FIG. 5 (a) through pin number 3 of jumper J4.

Pin number 2 may generate a relay driving signal capable of operating an external alarm, a motor or an actuator according to the signal processing result of the MCU.

The communication between the building environment monitoring device and the client PC is performed through RS-232 serial communication. In FIG. 5 (b), the 9-pin RS-232 terminal and the size of the transmit / receive signal of the MCU are matched with the RS-232 terminal of the client PC. A level converter is needed to make this possible, and pin numbers 30 and 31 of the MCU are connected to pin numbers 11 and 12 of TXD and RXD of MAX232, which are RS-232 level converters, respectively.

The power supply of ATmega128 used in the present invention is made in two places, and pins 4 and 6 are common VCC pins, and 5V voltage is applied. AVCCs and pins 18 and AREF, which are ADCs, are used as power sources of analog digital converters (ADCs). Connect the power even when not using.

Characteristics of each sensor module constituting the sensor module unit S2 are as follows.

In Table 2 and Figure 4 (a), the temperature and humidity sensor module SHT75 is a product of Sensirion headquartered in Switzerland as a temperature and humidity sensing chip manufactured by including a silicon temperature sensor and a humidity sensor in the form of a band gap temperature sensor. The sensor is manufactured in CMOS and is a chip integrated with temperature and humidity and data processing to generate digital signal by integrating semiconductor band gap temperature sensor, film type relative humidity sensor and signal processor.

Since relative humidity is closely related to temperature, it is desirable to use a sensor that integrates temperature and humidity measurement with integrated chips.

The driving voltage is 2.4 ~ 5.5V, the temperature measurement range is -40 ~ 123 ℃, and the relative humidity measurement range is 0 ~ 100% RH.

PIR motion sensor module is a motion sensor that compares the infrared of the human body and the infrared of the background using a pyroelectric material as described above, the PIR motion sensor module shown in Figure 4 (b) is a PIR motion sensor sensor, ball lens It consists of a signal amplifier and a comparator.

The PIR motion sensor sensor is RE200B, a general purpose dual thermal sensor device of Nippon Ceramic Co., Ltd. of Japan, and the PIR motion sensor module is a KC7783, which is integrally modularized by GLOLAB of USA with a ball lens, signal amplifier, and comparator.

The ball lens acts as a light collecting part to further increase the sensitivity to infrared rays generated in the human body.The KC7783 has a driving voltage of 4 to 12V, an operating current of 400 시 when applied to a 5V voltage, and an operating temperature of -20 to + 50 ℃. The effective sensing distance is 5m.

The ionization smoke sensor module is composed of an ionization smoke chamber, which is an ionization smoke sensor, and a driver circuit for driving the ionization smoke chamber.

The ionization smoke chamber of FIG. 4 (c) is NIS-05A manufactured by Nemoto & Co., Ltd. of Japan, and the driver for driving the same is an A5348 ionization smoke chamber driver manufactured by Allegro Microsystems Inc. in the United States.

The NIS-05A consists of two chambers, the upper and lower, and applies a 9V voltage between the upper chamber and the base when the air is clear without smoke. As the flow occurs, it can be used as a battery for many years. At this time, the voltage difference between the lower chamber and the base Vout generates a potential difference of 5.5V, and the current is caused by the smoke particles ionized in the upper chamber when smoke occurs due to fire or other causes. As the flow increases and the potential difference of Vout gradually decreases, smoke detection is performed using this Vout signal.

The A5348 driver is a dedicated driver for driving the 16-pin BiCMOS type ionization smoke chamber. The Vout terminal of the NIS-5A is connected to pin number 15 to detect a smoke signal.

The drive voltage is 6 ~ 12V and can be connected to 125 ionized smoke detection chambers. A horn driver is built in to drive the relay and emit a warning sound with a warning piezo effect horn.

A photocoupler is an optoelectronic device that converts and combines an electrical signal into light, as described above, and the SG-215 incorporates a GaAs IRED infrared generator and an infrared phototransistor in pairs. SG-215 is a photo interrupter manufactured by Kodenshi, Japan, and can be used as an optocoupler.

The optocoupler shown on the left side of FIG. 5 (a) is connected to an external interrupt pin, pin 1 of the MCU, by applying a voltage of 5V from the direct current (9V) -direct current (5V) voltage regulator of FIG. Determine whether or not.

The RS-232 level converter employed in the present invention is a MAX232 manufactured by Maxim Integrated Products, Inc. of FIG. 5 (b), and is connected to RXD (receive), TXD (transmit) and GND (common ground) terminals for connection with an MCU. Is required and the driving voltage is 5V.

Figure 6 (a) is a power supply circuit for power supply is a DC conversion circuit for rectifying the voltage of 220V, the main power of the building to a direct current rectifier using a bridge diode rectifier of the United States General Semiconductor Inc. KBL02 and a large capacity electrolytic capacitor, Zener Zener diodes are provided in parallel to form a constant voltage circuit with an output voltage of 9V.

(B), (c), and (d) of FIG. 6 are voltage regulators, respectively, LM7805, LM7805, and LM7812, respectively, of US Fairchild.

The voltage regulator is supplied with DC power and converts into DC voltage of the required potential.The LM7805 has an input voltage of 5 to 18V, an output voltage of 5V, an output current of up to 1A, and the LM7812 is an input voltage of 5 to 18V and an output voltage of 12V. The maximum output current is 1A.

The DC 9V output from the DC conversion circuit of FIG. 6 (a) is supplied to the ionization smoke detection module and the LM7805 module of FIG. 6 (c) and converted to DC 5V and supplied to the DC power supply of the circuit except the ionization smoke detection module. The LM7812 module is supplied with a 14.8V DC voltage of the storage battery provided in the UPS in case of power failure and outputs DC 12V and 9V, 9V is supplied to the ionization smoke detection module and 12V is supplied to the LM7805 of Figure 6 (b) The 5V output is supplied to other circuits.

In order to operate the hardware of the building environment monitoring apparatus, firmware (Firmware), which is an operating system, is recorded in the internal memory of the MCU.

ATmel28 is an assembler as well as a high-level language based on the C language after implementing the algorithm (compile) and record (compile) In the present invention is a software that includes editing (editing) and a compiler (compiler) in the program creation of ATmel28 Use CODEVISION. A compiler is a program that translates native programs written in C into machine language that can operate the MCU.

After coding and compiling the operating system for operating the building environmental monitoring device, USB-ISP (in system programming) is connected between the MCU and the computer where the code vision is installed to write to the memory of the MCU. Connector pin numbers connected to MCU side are 1. PDI, 2. PDO, 3. SCK, 4. Reset, 5. GND, 6. Vcc, and UART (Universal Asynchronous Receiver Transmitter) terminal side connected to ISP board side is 1. Connect the connector with Vcc, 2. Rxd, 3. Txd, 4. GND and connect the USB terminal to the PC side where the code vision is installed.

8 is a flowchart of an operating system firmware, which continuously measures a temperature and humidity measurement signal and a smoke detection signal, and transmits a signal to a GPIO pin and an ADC pin of the MCU, respectively, when a PIR motion detection signal or a power detection signal is generated. . Signal is sent to interrupt pin and MCU sends environmental monitoring signal to client PC through RS-232 communication module.

9 is a flow chart of environmental monitoring software of a client PC, which receives an environmental monitoring signal transmitted from a building environment monitoring device and outputs it on a monitor to enable real-time monitoring. If the threshold is exceeded, an alarm will sound.

S1: microcontroller section S2: sensor module section S3: interface section S4: DC power supply section S5: operating system
10: voltage regulator 1 20: voltage regulator 2 30: voltage regulator 3

Claims (3)

In the building environment monitoring device constituting the sensor node with the client PC,

Microcontroller unit (S1), sensor module unit (S2) for detecting the building environment signal, interface unit (S3) for communication with the client PC, DC power unit (S4) and building for supplying DC power to each module and MCU A firmware that is an operating system S5 of the environmental monitoring apparatus;

The microcontroller unit has a MCU to collect signals from the sensor module unit,
The sensor module unit is equipped with a temperature and humidity sensor module for measuring temperature and humidity, a human body sensor module for monitoring a person's entrance, a smoke sensor module for monitoring a fire, and a power sensor module for power monitoring to detect temperature and humidity of a building unit. Detect fire and power outage,

Signal of temperature and humidity sensor module is connected to GPIO pin of MCU. Human body sensor module and power sensor module are ext. connected to interrupt, smoke sensor module connected to ADC pin,
The interface unit has an RS-232 communication module to communicate with the client PC,
DC power supply unit is provided with a DC power supply and voltage regulator 2 (20) to supply DC power to each module,
Operating system firmware is recorded and operated in the flash memory of the MCU, the building environment monitoring device, characterized in that the MCU collects the signal of the sensor module unit and transmits to the client PC through the RS-232 communication module of the interface unit.
The method of claim 1,

In case of power failure, the 7812, the voltage regulator 3 (30), receives 12V and 9V power, and the 7805, the voltage regulator 1 (10), receives 12V and supplies 5V power. Building environment monitoring device, characterized in that to replace.
The method of claim 1,

Building environment monitoring device comprising MCU as ATmega128, temperature and humidity sensor module as SHT75, human body sensor module as KC7783, smoke sensor module as NIS-05A smoke chamber and A5348 driver, and power sensor module as SG-215. .

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