KR20120084549A - Adhesive sheet for semiconductor plating and plating method - Google Patents

Abstract

PURPOSE: An adhesive sheet for electroplating semiconductor elements and a plating method of the semiconductor using the same are provided to obtain high chemical resistance, reliability, and workability. CONSTITUTION: An adhesive sheet for electroplating semiconductor elements comprises a substrate and an adhesive layer(2) which is formed on one or more sides of the substrate(1). The adhesive layer comprises a thermosetting acrylic adhesive resin and a thermosetting material including a thermosetting agent. A plating method of the semiconductor device lead frame comprises the following steps: compressing the adhesive sheet for the semiconductor device to a lead frame; plating the other side of the lead frame; and exfoliating the adhesive sheet for plating the semiconductor device from the lead frame.

Description

Adhesive Sheet for Semiconductor Device Plating and Semiconductor Plating Method Using The Same {ADHESIVE SHEET FOR SEMICONDUCTOR PLATING AND PLATING METHOD}

The present invention relates to an adhesive sheet for semiconductor device plating and a semiconductor plating method using the same.

A quad flat no lead package (QFN) semiconductor is a type of semiconductor package in which a lead terminal is mounted in a package, and is typically manufactured through a process such as die attach, wire bonding, and epoxy molding.

In the epoxy molding process, the lead frame and the epoxy are bonded, but they have a low bonding force, thereby causing a reliability problem of the semiconductor device.

The present invention has the excellent chemical resistance and dimensional stability during the plating process of the semiconductor device lead frame and semiconductor device plating process to improve the reliability of the semiconductor device to solve the problems of the prior art, residues on the adhered surface during peeling An object of the present invention is to provide a pressure-sensitive adhesive sheet for semiconductor element plating that can be peeled off without remaining.

The present invention provides a pressure sensitive adhesive sheet for semiconductor element plating, comprising a pressure sensitive adhesive layer formed on at least one surface of the base material and the base material.

In addition, the present invention includes the step of pressing the adhesive sheet for semiconductor device plating on the lead frame, the step of plating the other side of the lead frame, characterized in that it comprises the step of peeling the adhesive sheet for semiconductor device plating from the lead frame A plating method of a semiconductor element lead frame is provided.

The adhesive sheet and plating method for plating a semiconductor device according to the present invention can secure high chemical resistance, obtain high dimensional stability of components, and can leave no residue on the adhered surface during peeling, and have excellent reliability and It shows workability.

1 is a cross-sectional view of an adhesive sheet for semiconductor device plating according to an embodiment of the present invention.

The present invention relates to an adhesive sheet for semiconductor element plating comprising a substrate, and an adhesive layer formed on at least one side of the substrate.

In addition, the present invention comprises the step of pressing the pressure-sensitive adhesive sheet for plating the semiconductor element on the lead frame, plating the other side of the lead frame, the step of peeling the pressure-sensitive adhesive sheet for semiconductor element plating from the lead frame The present invention relates to a plating method for a semiconductor device lead frame.

The pressure-sensitive adhesive layer is a pressure-sensitive adhesive sheet for semiconductor device plating, characterized in that the pressure-sensitive adhesive composition comprising a thermosetting acrylic adhesive resin and a thermosetting agent.

The pressure-sensitive adhesive composition may further include an energy ray-curable acrylic oligomer resin and an energy ray initiator.

The substrate is made of polyester, polyimide, polyamide, polyether sulfone, polyphenylene sulfide, polyether ketone, polyether ether ketone, triacetyl cellulose, polyether imide, polyethylene naphthalate, polypropylene and polycarbonate It may be one or more films selected from the group consisting of, a resin having heat resistance is preferred.

The thermosetting acrylic adhesive resin is a resin having a function of imparting adhesiveness. Examples of thermosetting acrylic adhesive resins include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl ( Alkyl (meth) acrylates, such as a meth) acrylate, an iso octyl (meth) acrylate, anononyl (meth) acrylate, a decyl (meth) acrylate, and a dodecyl (meth) acrylate, etc. are mentioned. The weight average molecular weight of the thermosetting acrylic adhesive resin is preferably 40,000 to 3,000,000, more preferably 700,000 to 1,200,000. If the weight average molecular weight of the thermosetting acrylic adhesive resin is less than 40,000, the chemical resistance may be lowered, and if the weight-average molecular weight exceeds 3,000,000, the molecular weight may increase, which may affect the curing reaction.

The thermosetting agent causes a curing reaction of the thermosetting acrylic adhesive resin. The weight average molecular weight of the thermosetting agent is preferably 300 to 8,000. Examples of the thermosetting agent include single or two kinds of mixtures selected from the group consisting of melamine and isocyanate. The thermosetting agent preferably contains 1 to 20 parts by weight based on 100 parts by weight of the thermosetting acrylic adhesive resin.

The energy ray-curable acrylic oligomer resin may form a cross-penetrating crosslinked structure (mixed crosslinked structure) with the thermosetting acrylic adhesive resin. The interpenetrating crosslinked structure (mixed crosslinked structure) is a crosslinked structure in which two or more different curable resins are entangled by interpenetration while independently crosslinking by different chemical reaction mechanisms. This crosslinked structure can improve the cohesion and chemical resistance characteristics of the resin, and the practical use of the crosslinked structure by cross-penetration is also used in the epoxy adhesive resin manufacturing method (Epoxy Adhesive Formulation; Edward M. Petrie ; 151-152p). Examples of the energy ray-curable acrylic oligomer resin include a single or a mixture of two or more selected from the group consisting of urethane acrylates, polyethers and polyester acrylates, epoxy acrylates, and acrylic acrylates. The energy ray-curable acrylic oligomer resin preferably contains 1 to 20 parts by weight based on 100 parts by weight of the thermosetting acrylic adhesive resin.

The energy ray initiator may be selected according to the coating and drying temperature of the pressure-sensitive adhesive layer, the energy ray irradiation conditions to be used. Examples of energy ray initiators include benzyldimethyl ketal, hydroxycyclohexyl phenyl ketone, hydroxy dimethyl acetophenone, methyl- [4methylthiophenyl] -2-morpholine propanone, 4-benzyl-4'-methyldi Phenyl sulfide, isopropyl thioxanthone, 2-chlorothioxanthone, ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, benzophenone, 4-methylbenzophenone, methyl- Ortho-benzo-benzoate, methylbenzoylformate, 4-phenylbenzophenone, 2,4,6-trimethylbenzoyl-diphenyl phosphine and 2-hydroxy-1,2-diphenyl ethanone Or a mixture of two or more selected from. The energy ray initiator preferably contains 1 to 20 parts by weight based on 100 parts by weight of the thermosetting acrylic adhesive resin.

The construction method of an example of the pressure sensitive adhesive sheet for semiconductor device plating according to the present invention is as follows. A pressure-sensitive adhesive composition comprising a thermosetting acrylic pressure-sensitive adhesive resin, a thermosetting agent, an energy ray-curable acrylic oligomer resin, and an energy ray initiator component is prepared. The pressure-sensitive adhesive composition may be prepared at an appropriate viscosity depending on the amount of the solvent. As a method of manufacturing the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive composition is directly coated on a substrate and dried to form a pressure-sensitive adhesive layer by coating and drying the pressure-sensitive adhesive composition on a release film. And the transfer method. 5-25 micrometers is preferable and, as for the coating thickness of an adhesive layer, 6 micrometers-10 micrometers are more preferable.

The pressure-sensitive adhesive layer may be cured by energy rays such as visible rays, ultraviolet rays, and electron beams. Although the kind of energy ray is not specifically limited, It is preferable to harden | cure using an ultraviolet-ray. Controlling the amount of light is important when curing using ultraviolet rays. When the amount of light is low, unreacted substances may be included in the curing reaction. When the amount of light is high, decomposition of the substrate or adhesive resin may occur, and side effects may occur due to the accompanying heat of infrared rays. Therefore, the light amount is preferably 10 to 2000 mJ / cm 2, more preferably 400 to 1000 mJ / cm 2 based on the ultraviolet ray A region. UV lamps that can be used for UV curing are largely divided into mercury lamps containing short wavelength (ultraviolet rays B and C) regions and metal halide lamps containing long wavelength (ultraviolet rays A) regions as main regions. It may be used alone or in combination. The amount of light of the ultraviolet lamp can be adjusted by the lamp height or the irradiation time of ultraviolet rays. In addition, the pressure-sensitive adhesive layer may be thermally cured in a aging room or oven. It is preferable that a thermosetting temperature consists of 25-80 degreeC, and 40-60 degreeC is more preferable. The maturation period is preferably 5 to 7 days.

In the epoxy molding process, which is a part of the semiconductor device manufacturing process, there is a problem of reliability of the semiconductor device due to a low bonding force between the lead frame and the epoxy. The lead frame plating process is a step before the epoxy molding process, and can increase the bonding strength between the lead frame and the epoxy. The adhesive sheet for semiconductor element plating serves to protect the lead frame on the other side from the penetration of the plating liquid when plating one side of the lead frame. An example method of the plating process is as follows. Crimping the pressure-sensitive adhesive sheet for semiconductor device plating on the lead frame, plating the other side of the lead frame, peeling the pressure-sensitive adhesive sheet for semiconductor device plating from the lead frame.

The structure of an example of the pressure sensitive adhesive sheet for semiconductor element plating of the present invention is shown in FIG. 1. The adhesive layer 2 is apply | coated on the base film 1, and in order to protect an adhesive layer, the release film 3 is laminated | stacked.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. However, the present invention is not limited thereto.

[Example]

≪ Example 1 >

59.81 weight of the thermosetting acrylic adhesive resin (AT-5910; three-way), melamine curing agent (SM-20; three-way) was prepared using the pressure-sensitive adhesive composition using 1.37 weight and 38.82 weight of ethyl acetate solvent. The pressure-sensitive adhesive composition was coated and dried to a thickness of 6 μm on a polyimide film (LN100; Kolon; 25 μm) which is a heat resistant substrate. Thereafter, by aging at 50 ℃ to cure the pressure-sensitive adhesive layer to prepare an adhesive sheet.

<Example 2>

47.1 weight of thermosetting acrylic adhesive resin (AT-311; Samwon), 1.7 weight of melamine curing agent (SM20; Samwon), 3 weight of urethane acrylate (EB280; Cytec), an energy ray curable acrylic oligomer resin, and energy ray ( UV) initiator 2,4,6-trimethylbenzoyl-diphenyl phosphine (Darocur TPO; Ciba) 0.05 weight, hydroxycyclohexyl phenyl ketone (Irgacure184 (Ciba) 0.05 weight and ethyl acetate 48.1 weight using To prepare an adhesive composition. The pressure-sensitive adhesive composition was coated and dried to a thickness of 8 μm on a polyimide film (25 NPI; Kaneka; 25 μm) which is a heat resistant substrate. Thereafter, the pressure sensitive adhesive layer was cured by ultraviolet irradiation (ultraviolet radiation dose about 800 mJ / ㎠) and 50 ℃ to prepare an adhesive sheet.

<Example 3>

48.5 weight of thermosetting acrylic adhesive resin (AT-5910; three-way), isocyanate-based curing agent (CAT45; three-way) is 1.00 weight, melamine-based curing agent (SM20; three-way) 0.62 weight, urethane acrylate which is energy ray-curable acrylic oligomer resin ( EB280; Cytec) 2.88 weights, phenyl novolac acrylate (EB9656; Cytec), an energy ray-curable oligomer resin, 3.7 weights, 2,4,6-trimethylbenzoyl-diphenyl as an ultraviolet initiator An adhesive composition was prepared using 0.10 weight of phosphine (Darocur TPO; Ciba), 0.09 weight of hydroxycyclohexyl phenyl ketone (Irgacure184; Ciba), and 43.03 weight of ethyl acetate solvent. The pressure-sensitive adhesive composition was coated and dried to a thickness of 6 μm on a polyimide film (LN100; Kolon; 25 μm) which is a heat resistant substrate. Subsequently, the pressure sensitive adhesive layer was cured by ultraviolet irradiation (ultraviolet radiation dose about 800 mJ / cm 2) and aged at 50 ° C. to prepare an adhesive sheet.

The components of the pressure-sensitive adhesive composition used in each of the above examples and their contents are shown in Table 1 below.

division Weight ratio Example 1 Example 2 Example 3 Thermosetting Acrylic Adhesive AT-5910 59.81 - 48.58 AT-311 - 47.1 - Thermosetting agent CAT45 - - 1.00 SM20 1.37 1.7 0.62 Energy-ray cured acrylic oligomer resin EB280 - 3 2.88 EB9656 - - 3.7 Energy ray initiator Darocur TPO - 0.05 0.10 Irgacure 184 - 0.05 0.09 menstruum Ethyl acetate 38.82 48.1 43.03 UV dose (mJ / cm ² ) - About 800

Experimental Example

Experimental Example 1: 180 ° Peeling Force Measurement Method I

After preparing the pressure-sensitive adhesive sheet of Examples 1 to 3 in the width 2.54cm, length 15cm, after washing the surface of the copper foil (Mitsui; 3EC-HTE-AT) to be used as an adhesive with methyl ethyl ketone or acetone, the copper foil and adhesive The sheets were rubbed twice using a rubber roller (about 2 kg) to be laminated. The sample was then placed on a 130 [deg.] C. plate, placed on top of silicone rubber and heated for 10 minutes. After storing for 30 minutes at room temperature, the sample was measured 180 ° peel force at a rate of 300 mm / min.

Experimental Example 2: 180 ° Peeling Force Measurement Method II

The adhesive sheets of Examples 1 to 3 were prepared in a width of 2.54 cm and a length of 15 cm, and the surface of copper foil (Mitsui; 3EC-HTE-AT), stainless steel plate, and glass plate to be used as an adhesive was coated with methyl ethyl ketone or acetone. After washing, the adherends and the pressure sensitive adhesive sheet were rubbed and laminated once by reciprocating using a rubber roller (about 2 kg) to prepare samples for each adherend. After storage for 30 minutes at room temperature, the samples were measured for 180 ° peel force at a rate of 300 mm / min.

The peeling force measurement results of Experimental Examples 1 and 2 are shown in Table 2 below.

Adhesive Peel force
Measure 180 ° Peel Strength (g. F / 2.54cm) Example 1 Example 2 Example 3 Remarks Copper foil I 478.21 373.56 159.43 130 ℃ × 10min Glass plate Ⅱ 86.42 56.98 39.34 25 ℃ Stainless steel plate Ⅱ 92.47 67.44 40.56 25 ℃ Copper foil Ⅱ 101.10 86.42 52.32 25 ℃

As can be seen in Table 2, the samples treated at room temperature (samples of Experimental Example 2 using the peel force measuring method II) were about 30 to 110 g? F / 2.54 cm for each adherend, but the temperature was about 130 ° C. for 10 minutes. In the case of the sample (the sample of Experimental Example 1 which used the peeling force measuring method I) which imposed, the adhesive force rose about 150-480 g * f / 2.54 cm. In Table 2, Example 1 is not using the energy ray-curable acrylic oligomer resin, Examples 2 and 3 are about 6.4 parts by weight of the energy ray-curable acrylic oligomer resin based on 100 parts by weight of the thermosetting acrylic adhesive resin (Example 2), about 13.5 parts by weight (Example 3). It can be seen that the higher the energy ray-curable acrylic oligomer resin content ratio, the higher the internal cohesion of the pressure-sensitive adhesive layer and the lower the peeling force.

Experimental Example 3: Peelability Measurement Method

The presence or absence of adhesive residue on the surface of the copper foil, the stainless steel plate and the glass plate, which are the adherends of the samples (180 ° peeling force measuring methods I and II), measured according to the measuring methods of Experimental Examples 1 and 2, were visually inspected. At the time of peeling, it was judged as 'normal' if there was no residue generated on the surface except for the adhesive residue generated along the edge of the pressure sensitive adhesive sheet and 'abnormal' sample if there was a residue.

The results of Experimental Example 3 are shown in Table 3 below. In the following Table 3, "o" indicates a "normal" sample in which no adhesive residue is present on the surface of the adherend.

Adhesive Peel force
Measure Adhesive residue (Normal: ○ / Abnormal: X) Example 1 Example 2 Example 3 Remarks Copper foil I ○ ○ ○ 130 ℃ × 10min Glass plate Ⅱ ○ ○ ○ 25 ℃ Stainless steel plate Ⅱ ○ ○ ○ 25 ℃ Copper foil Ⅱ ○ ○ ○ 25 ℃

As can be seen in Table 3, there was no adhesive residue on the adherend surface of all the samples. As a result, the peelability of the above embodiments was excellent, and in particular, in the case of a sample (peel force measuring method I sample) added with a temperature at 130 ° C. for 10 minutes, internal cohesion was confirmed.

Experimental Example 4: Chemical Resistance Measurement Method

In this experiment, the composition of Examples 1 to 3 was dried to a thickness of 20 μm on a steel panel by a MEK rubbing test according to ASTM D4213. Subsequently, it was prepared by curing the pressure-sensitive adhesive layer by aging at ultraviolet irradiation (ultraviolet radiation dose about 800 mJ / ㎠) and 50 ℃. After storing the cured specimens prepared as described above at 45 ° C. for 3 days, the number of times the cured coating film was dissolved in the MEK and the finish plate began to be seen by burying MEK in gauze and reciprocating once.

The results of Experimental Example 4 are shown in Table 4 below.

Chemical resistance measuring method Example 1 Example 2 Example 3 100 times or more More than 150 times 200 or more times

As can be seen in Table 4, as a result of rubbing the hardened specimen with a uniform force, the number of times increased from Example 1 (100 times or more) to Example 3 (250 times or more). As a result, it can be seen that the higher the energy ray-curable acrylic oligomer resin content, the higher the internal cohesion of the adhesive layer and the higher the chemical resistance.

As described above, the adhesive sheet for semiconductor device plating according to the present invention can ensure high chemical resistance during the plating process when 1 to 20 parts by weight of the energy ray-curable acrylic oligomer resin based on 100 parts by weight of the thermosetting acrylic adhesive resin. When peeling, it can be confirmed that the residue can be peeled off without sticking to the adhered surface, and the reliability and workability are particularly excellent. In particular, when strong chemical resistance is required according to the situation, the energy ray-curable acrylic oligomer resin content may be increased to further strengthen the crosslinked structure by interpenetration, thereby improving cohesion and chemical resistance.

Although the present invention has been described in detail with reference to only a few embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the present invention, and such changes and modifications are within the scope of the appended claims.

1: base film
2: adhesive layer
3: release film

Claims (11)

An adhesive sheet for semiconductor element plating comprising a substrate, and an adhesive layer formed on at least one side of the substrate. The adhesive sheet for semiconductor device plating according to claim 1, wherein the pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive composition comprising a thermosetting acrylic adhesive resin and a thermosetting agent. The pressure-sensitive adhesive sheet of claim 2, wherein the pressure-sensitive adhesive composition further comprises an energy ray-curable acrylic oligomer resin and an energy ray initiator. The method of claim 1, wherein the substrate is polyester, polyimide, polyamide, polyether sulfone, polyphenylene sulfide, polyether ketone, polyether ether ketone, triacetyl cellulose, polyether Adhesive sheet for semiconductor element plating, characterized in that at least one film selected from the group consisting of imide, polyethylene naphthalate, polypropylene and polycarbonate. The pressure-sensitive adhesive sheet for semiconductor device plating according to claim 2 or 3, wherein the weight average molecular weight of the thermosetting acrylic pressure-sensitive adhesive resin is 40,000 to 3,000,000. The pressure sensitive adhesive sheet for semiconductor device plating according to claim 2 or 3, wherein the thermosetting agent is a single or a mixture of two selected from the group consisting of melamine and isocyanate. The method of claim 3, wherein the energy radiation curable acrylic oligomer resin is a urethane-based acrylate, polyether and polyester acrylate, epoxy acrylate, acrylic acrylate selected from the group consisting of a single or two or more kinds, characterized in that Adhesive sheet for semiconductor device plating. 4. The method of claim 3, wherein the energy ray initiator is benzyl dimethyl ketal, hydroxycyclohexyl phenyl ketone, hydroxy dimethyl acetophenone, methyl- [4 methylthiophenyl] -2- morpholine propanone, 4-benzyl- 4'-methyldiphenyl sulfide, isopropyl thioxanthone, 2-chlorothioxanthone, ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, benzophenone, 4-methyl Benzophenone, methyl-ortho-benzo-benzoate, methylbenzoylformate, 4-phenylbenzophenone, 2,4,6-trimethylbenzoyl-diphenyl phosphine and 2-hydroxy-1,2-diphenyl Adhesive sheet for semiconductor element plating, characterized in that the single or a mixture of two or more selected from the group consisting of ethanone. According to claim 3, 1 to 20 parts by weight of the thermosetting agent, 1 to 20 parts by weight of the energy ray-curable acrylic oligomer resin, 1 to 20 parts by weight of the energy ray initiator based on 100 weight of the thermosetting acrylic adhesive resin Adhesive sheet for semiconductor element plating. The pressure-sensitive adhesive sheet for semiconductor device plating according to claim 2 or 3, wherein the pressure-sensitive adhesive composition has a glass transition temperature of 10 to 40 ° C. Comprising the step of pressing the adhesive sheet for semiconductor element plating on the lead frame, plating the other side of the lead frame, the step of peeling the adhesive sheet for semiconductor element plating from the lead frame Plating method of semiconductor device lead frame.

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