KR20120084063A - Load lock chamber having buffer chamber and apparatus for treating substrate including the same - Google Patents

Abstract

PURPOSE: A loadlock chamber having buffer chamber and apparatus for treating substrate including the same are provided to prevent the deformation of an in/out chamber by not causing a pressure difference between an in/out and buffer chambers in a process of venting and ventilation. CONSTITUTION: A plurality of in/out chambers circulate between vacuum and air pressure status. A buffer chamber keeping the identical pressure with one of the plurality of adjacent chambers is installed among the plurality of in/out chambers. A ventilation device(170) is included to make the plurality of in/out and buffer chambers vacuumed. A venting device(172) is included to make the plurality of in/out and buffer chambers air pressured.

Description

Load lock chamber having buffer chamber and Apparatus for treating substrate including the same}

The present invention relates to a load lock chamber having a buffer chamber provided with a plurality of buffer chambers between a plurality of access chambers and a substrate processing apparatus including the same.

In general, in order to manufacture a semiconductor device, a display device, and a thin film solar cell, a thin film deposition process of depositing a thin film of a specific material on a substrate, a photo process of exposing or hiding selected areas of the thin films using a photosensitive material, The thin film is removed and patterned through an etching process. Among these processes, a thin film deposition process and an etching process are performed in a substrate processing apparatus optimized in a vacuum state.

The substrate processing apparatus connects a plurality of process chambers for processing a substrate, a load lock chamber that repeats vacuum and atmospheric pressure to supply substrates to a plurality of process chambers from outside of atmospheric pressure, and a load lock chamber and a plurality of process chambers. It comprises a transfer chamber for transferring the substrate between them.

Hereinafter, with reference to the drawings will be described in detail the prior art.

1 is a schematic cross-sectional view of a load lock chamber according to the prior art.

The load lock chamber 10 is connected to a transfer chamber (not shown) to supply or process the substrate 12 to a plurality of process chambers (not shown) that perform thin film deposition or thin film etching through the transfer chamber. In order to carry out the completed board | substrate 12 from many process chambers, the state of a vacuum and atmospheric pressure is repeated.

The load lock chamber 10 includes first and second entrance chambers 14a and 14b in which the substrate 12 is transferred between the outside and the transfer chamber and vertically stacked. The load lock chamber 10 generally installs two or more entrance chambers 14 in consideration of productivity. The load lock chamber 10 is composed of an upper plate 30 and a body 32. The main body 32 includes a first main body 32a and a second main body 32b, and each of the first and second main bodies 32a and 32b integrally constitutes the side wall 34 and the lower plate 36. . The side wall 34 and the lower plate 36 are joined by welding.

The first entrance chamber 14a is composed of an upper plate 30 and a first main body 32a, and the second entrance chamber 14b is a lower plate 36 and a second main body 32b of the first main body 32a. It is composed of Although not shown in the drawing, the side walls 34 of the first and second inlet chambers 14a and 14b are formed with first and second slot valves. The first slot valve functions to communicate the first and second inlet and outlet chambers 14a and 14b with the transfer chamber in a vacuum state, and the second slot valve is the first and second outlet chambers 14a and 14b in an atmospheric pressure state. Performs a function of communicating with the outside. In addition, the first and second access chambers 14a and 14b have a placing means 18 in which the substrate 12 is temporarily placed, a vacuum exhaust means 20 for evacuating to vacuum, and a venting means for pressurizing to atmospheric pressure. (22).

The first and second access chambers 14a and 14b are spaces separated from each other and operate independently of each other to transfer the substrate 12 to the outside or the transfer chamber. When the first access chamber 14a communicates with the transfer chamber in a vacuum state, the second access chamber 14b may be in an atmospheric pressure state in which the substrate 12 is exchanged with the outside. On the contrary, when the first access chamber 14a is in the atmospheric pressure state in which the substrate 12 is exchanged with the outside in the atmospheric pressure state, the second access chamber 14b may be in communication with the transfer chamber in the vacuum state. Therefore, the first and second entry chambers 14a and 14b are exchanged with the substrate 12 at different pressures, and therefore, the first body due to the pressure difference between the first and second entry chambers 14a and 14b. Deformation of the lower plate 36 of 32a may occur.

Figure 2 is a schematic cross-sectional view showing a modification of the load lock chamber according to the prior art.

When the first access chamber 14a is in a vacuum state and the second access chamber 14b is in an atmospheric pressure state, the lower plate 36 of the first body 32a is deformed to be bent upward. On the contrary, although not shown in the drawing, when the first access chamber 14a is in the atmospheric pressure state and the second access chamber 14b is in the vacuum state, the lower plate 36 of the first body 32a is bent downward. Deformation occurs.

The first main body 32a constituting the first access chamber 14a is integrally formed by welding the side wall 34 and the lower plate 36 by welding. When the lower plate 36 isolating the space between the first and second access chambers 14a and 14b is repeatedly deformed in the upper and lower directions according to the pressure change, the placing means 18 on which the substrate 12 is placed. Deformation of, of course, breakage occurs in the connection portion of the lower plate 36 and the side wall 34 concentrated on the deformation load.

In order to solve the problems of the prior art as described above, the present invention provides a plurality of buffer chambers operating at the same pressure as the plurality of inlet chambers between the plurality of inlet chambers repeating the atmospheric pressure and vacuum, An object of the present invention is to provide a load lock chamber having a buffer chamber for preventing deformation and a substrate processing apparatus including the same.

The present invention for achieving the above object, a plurality of chambers for repeating the atmospheric pressure and vacuum state to accommodate the substrate; A buffer chamber installed between the plurality of access chambers and maintaining the same pressure as one of the plurality of adjacent access chambers; Exhaust means for vacuuming the plurality of access chambers and the buffer chambers; And venting means for venting the plurality of access chambers and the buffer chamber to atmospheric pressure.

The present invention provides a load lock chamber comprising a control means installed in the exhaust line or venting line of the buffer chamber for adjusting the exhaust or venting speed of the buffer chamber.

The present invention provides a load lock chamber having a buffer chamber, wherein the adjusting means is an orifice.

The present invention provides a load lock chamber having a buffer chamber, wherein the diameter of the orifice and the volume difference between one of the plurality of entrance chambers and the buffer chamber are inversely proportional.

According to the present invention, when the volume difference between the plurality of access chambers and the plurality of buffer chambers is large, the diameter of the orifice decreases, and when the volume difference between the plurality of access chambers and the plurality of buffer chambers is small, It provides a load lock chamber having a buffer chamber characterized in that the diameter is large.

The present invention provides a load lock chamber having a buffer chamber, wherein the interior of the buffer chamber is vacuum and atmospheric pressure is shorter than the interior of one of the plurality of access chambers is vacuum and atmospheric pressure.

The present invention includes a diaphragm plate that separates one of the plurality of access chambers from the buffer chamber, wherein the diaphragm plate is supported by a support part installed on one of the plurality of access chambers and a side wall constituting the buffer chamber. A load lock chamber having a buffer chamber is provided.

The present invention provides a load lock chamber having a buffer chamber, wherein the diaphragm plate includes a plurality of cooling plates.

The present invention provides a load lock chamber having a buffer chamber, wherein a plurality of through parts are formed in the partition plate, and each of the plurality of cooling plates is inserted into the plurality of through parts.

According to the present invention, the plurality of access chambers may include first to third access chambers, and the plurality of buffer chambers may include a first buffer chamber located between the first and second access chambers, and the second and third access chambers. And a second buffer chamber located therebetween, wherein the first access chamber maintains the same pressure as the first buffer chamber, and the second access chamber maintains the same pressure as the second buffer chamber. Provided is a load lock chamber having a buffer chamber.

According to the present invention, the plurality of access chambers may include first to third access chambers, and the plurality of buffer chambers may include first upper and lower buffer chambers positioned between the first and second access chambers, and the second and second chambers. And a second upper and lower buffer chamber located between the three access chambers, wherein the first access chamber maintains the same pressure as the first upper buffer chamber, and the second access chamber is formed of the first lower buffer chamber and the first buffer chamber. The second upper buffer chamber is maintained at the same pressure, and the third access chamber provides a load lock chamber having a buffer chamber, characterized in that to maintain the same pressure as the second lower buffer chamber.

The present invention provides a load lock chamber having a buffer chamber, wherein the first upper and lower buffer chambers maintain different pressures, and the second upper and lower buffer chambers maintain different pressures.

In order to achieve the above object, the present invention provides a transfer chamber for transferring a substrate in a vacuum state; A process chamber connected to the transfer chamber; And a load lock chamber connected to the transfer chamber, wherein the load lock chamber comprises: a plurality of entrance chambers for repeating the atmospheric pressure and the vacuum state and accommodating the substrate; A plurality of buffer chambers installed between the plurality of access chambers and maintaining the same pressure as the plurality of access chambers; Exhaust means for evacuating the plurality of access chambers and the plurality of buffer chambers in a vacuum; Venting means for pressurizing the plurality of access chambers and the plurality of buffer chambers to atmospheric pressure; And adjusting means installed in the exhaust line or the venting line of the plurality of buffer chambers to adjust the exhaust or venting speed of the plurality of buffer chambers.

In the load lock chamber of the present invention, a plurality of buffer chambers operating at the same pressure as the plurality of access chambers may be installed between the plurality of access chambers that repeat atmospheric pressure and vacuum, thereby preventing deformation of the plurality of access chambers. In addition, each of the plurality of entry chambers and the plurality of buffer chambers each maintains the same or approximate time to reach the final pressure, so as not to generate a pressure difference between the plurality of entrance chambers and the plurality of buffer chambers during the exhaust and venting process. In addition, it is possible to prevent deformation of a plurality of access chambers.

1 is a schematic cross-sectional view of a load lock chamber according to the prior art
Figure 2 is a schematic cross-sectional view showing a modification of the load lock chamber according to the prior art.
3 is a schematic view of a substrate processing apparatus in a first embodiment of the present invention;
4 is a schematic cross-sectional view of a load lock chamber according to a first embodiment of the present invention.
Figure 5 is a cross-sectional view of the adjusting means according to an embodiment of the present invention
6a and 6b are graphs of the exhaust velocity according to an embodiment of the present invention
7 is a schematic cross-sectional view of a load lock chamber according to a second embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic diagram of a substrate processing apparatus in a first embodiment of the present invention.

The substrate processing apparatus 100 according to the first embodiment of the present invention includes a plurality of process chambers 102, a transfer chamber 104, and a load lock chamber 110. The plurality of process chambers 102 are supplied with the substrate 112 in a vacuum state to perform processes such as thin film deposition, thin film etching, and heat treatment, and the transfer chamber 104 moves the substrate 112 in a vacuum state to the load lock chamber. It performs a function of transferring between the 110 and the plurality of process chambers 102, and includes a transfer chamber robot 106. The load lock chamber 110 is supplied with vacuum and atmospheric pressure to supply the substrates 112 to the plurality of process chambers 102 through the transfer chamber 104 or to eject the substrates 112 from the plurality of process chambers 102. Repeat the state.

In FIG. 3, although two load lock chambers 110 are installed, the load lock chamber 110 is not limited thereto and may be increased or decreased as necessary. On the side of the load lock chamber 110, the substrate 112 is withdrawn from the cassette (not shown) and supplied to the load lock chamber 110, or the substrate 112 is taken out from the load lock chamber 110 and loaded into the cassette. Transfer unit 108 is installed to make. The transfer unit 108 includes a transfer unit robot 108a for transferring the substrate 112 and a guide rail 108b for guiding the transfer unit robot 108a.

4 is a schematic cross-sectional view of the load lock chamber according to the first embodiment of the present invention.

The load lock chamber 110 according to the first embodiment of the present invention includes an upper plate 120, a body 122, and a diaphragm plate 124.

The main body 122 includes first to third main bodies 122a, 122b and 122c. Each of the first to third bodies 122a, 122b, and 122c has an integrated side wall 126 and a lower plate 128. Side wall 126 and bottom plate 128 are connected in a manner such as welding. The side wall 126 is formed with a support 130 for supporting the upper plate 120 or the diaphragm plate 124 along the inner circumference.

The upper plate 120 is supported by the support 130 of the first body 122a and seals the first body 122a through a sealing means, for example, an O-ring. The upper plate 120 is provided with a plurality of first flow paths (not shown) through which the refrigerant flows. The coolant may use cooling water.

A plurality of cooling plates 132 for cooling the substrate 112 are formed on an upper portion of the lower plate 128 of each of the first and third bodies 122a, 122b, and 122c, and on the plurality of cooling plates 132. A plurality of support pins 134 supporting 112 are formed. Between the plurality of cooling plates 132, an arm of the transfer unit robot 108a of FIG. 3 or an arm of the transfer chamber robot 106 installed in the transfer chamber 104 of FIG. 3 may move in and out to transfer the substrate 112. The space that can be set is set. The plurality of first cooling plates 132 are spaced apart from each other and installed in parallel to each other, and a plurality of second flow paths (not shown) through which refrigerant for cooling the substrate 112 flows are formed.

The diaphragm plate 124 is supported by the support 130 of each of the first and second bodies 122b and 122c and connects the second and third bodies 122b and 122c via a sealing means, for example, an O-ring. Seal. The diaphragm plate 124 includes first and second diaphragm plates 124a and 124b. Each of the first and second diaphragm plates 124a and 124b includes a plurality of through portions 136 and a plurality of second cooling plates 138 inserted into the plurality of through portions 136.

The diaphragm plate 124 is made of stainless steel, and the plurality of through portions 136 are formed by digging the diaphragm plate 124. The plurality of through parts 136 are spaced apart from each other and formed in parallel with each other, and a locking step 140 on which a plurality of cooling plates 138 are mounted is formed at an inner circumference of each of the plurality of through parts 136. The plurality of cooling plates 138 seal the plurality of through portions 136 through the sealing means 140, for example, via a sealing means, for example, an O-ring. The plurality of cooling plates 138 are formed of aluminum. The plurality of second cooling plates 138 are provided with a plurality of third flow paths (not shown) through which refrigerant for cooling the substrate 112 flows.

The load lock chamber 110 transfers the substrate 112 between the transfer part 108 and the transfer chamber 104 of FIG. 3 by assembling the upper plate 120, the main body 122, and the diaphragm plate 124. First and third access chambers 150a, 150b and 150c and first and second buffer chambers 160a and 160b for preventing deformation of the first and second access chambers 150a and 150b are formed.

The first access chamber 150a provides a first accommodation space in which the substrate 112 is accommodated by the upper plate 120 and the first body 122a, and the second access chamber 150b includes a first diaphragm plate ( 124a and the second body 122b provide a second accommodation space in which the substrate 112 is accommodated, and the third access chamber 150c is formed by the second diaphragm plate 124b and the third body 122c. A third accommodating space in which the substrate 112 is accommodated is provided.

The first buffer chamber 160a provides a first buffer space that maintains the same pressure as the inside of the first access chamber 150a by the first body 122a and the first diaphragm plate 124a, and the second buffer chamber. The 160b provides a second buffer space that maintains the same pressure as the inside of the second access chamber 150b by the second body 122b and the second partition plate 124b.

In FIG. 4, the load lock chamber 110 includes the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b. Four or more access chambers and three or more buffer chambers may be used by using the access chamber and one buffer chamber, or by increasing the number of main bodies and the diaphragm plates.

First and second slot valves (not shown) are provided in each of the first to third access chambers 150a, 150b, and 150c. The first slot valve is an entrance for introducing the substrate 112 in the transfer unit 108 of FIG. 3, and the second slot valve is an entrance for transferring the substrate 112 to the transfer chamber 104 of FIG. 2. The first and second slot valves are provided on the side walls 126 of the first to third bodies 122a, 122b, and 122c, respectively.

The first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b include exhaust means 170 for evacuating to vacuum and venting means 172 for pressurizing to atmospheric pressure. This is installed. Although separate exhaust means 170 and venting means 172 may be independently installed in the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b, respectively, In order to reduce costs, it is preferable to install one exhaust means 170 and one venting means 172. When one exhaust means 170 and the venting means 172 are installed, the exhaust line of each of the first to third access chambers 150a, 150b, 150c and the first and second buffer chambers 160a, 160b, and The first switching valve 174 and the second switching valve 176 are installed in the venting line.

Among the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b, the chamber in which the first switching valve 174 remains ON is evacuated to a vacuum. Among the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b, the chamber in which the first switching valve 174 maintains the OFF state is a vacuum exhaust. Is blocked. Among the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b, the chamber in which the second switching valve 174 remains ON is vented to atmospheric pressure. Among the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b, the chamber in which the second switching valve 174 maintains the OFF state is vented at atmospheric pressure. Is blocked.

The operation states of the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b which are spaces separated from each other and operate independently are as follows.

The first entry chamber 150a is in a vacuum state to communicate with the transfer chamber 104 of FIG. 3, and the second entry chamber 150b is at atmospheric pressure to communicate with the transfer unit 108 of FIG. When the chamber 150c is in a vacuum state in order to communicate with the transfer chamber 104 of FIG. 3, the first buffer chamber 160a positioned below the first access chamber 150a maintains a vacuum state, and the second entrance and exit state. The second buffer chamber 160b located below the chamber 150b maintains an atmospheric pressure state.

In other cases, the first entry chamber 150a is at atmospheric pressure to communicate with the transfer unit 108 of FIG. 3, and the second entry chamber 150b is vacuumed to communicate with the transfer chamber 104 of FIG. 3. In addition, when the third access chamber 150c is at atmospheric pressure to communicate with the transfer unit 108 of FIG. 3, the first buffer chamber 160a positioned below the first access chamber 150a maintains the atmospheric pressure state. In addition, the second buffer chamber 160b positioned below the second access chamber 150b maintains a vacuum state.

In other words, each of the first and second buffer chambers 160a and 160b maintains the same pressure as the first and second access chambers 150a and 150b located above. Thus, even though the first and second access chambers 150a and 150b repeat vacuum and atmospheric pressure, the first and second buffer chambers 160a and 160b may be used to control the first and second body 122a and 122b, respectively. Deformation of the bottom plate 128 is prevented.

The upper plate 120 constituting the first access chamber 150a located at the top and the lower plate 128 of the third main body 122c constituting the third access chamber 150c located at the bottom are first and third. When the access chambers 150a and 150c are in a vacuum state, the upper plate 120 and the lower plate 128 of the third body 122c may be deformed. Therefore, although not shown in the drawings, the same pressure as the first and third access chambers 150a and 150c is maintained at the upper side of the upper plate 120 and the lower side of the lower plate 128 of the third body 122c, respectively. A separate buffer chamber can be installed.

However, since the upper plate 120 and the lower plate 128 of the third body 122c are exposed to the outside, a reinforcing member (not shown) may be installed to prevent deformation without installing a separate buffer chamber. have. Even if the first and third access chambers 150a and 150c are in a vacuum state by installing the reinforcing material, the lower plate 128 of the upper plate 120 and the third body 122c can be prevented from being deformed.

In the load lock chamber 110, each of the first and second buffer chambers 160a and 160b may maintain the same pressure as the first and second access chambers 150a and 150b. However, the volume of each of the first to third access chambers 122a, 122b and 122c is larger than the volume of each of the first and second buffer chambers 160a and 160b. Accordingly, when the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b are evacuated by the evacuation means 170 due to the volume difference, the first and third The time that each of the second buffer chambers 160a and 160b reaches the final vacuum pressure is shorter than the time that each of the first to third access chambers 150a, 150b and 150c reaches the final vacuum pressure. In addition, when the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b are respectively pressurized to the atmospheric pressure by the venting means 172 due to the volume difference, the first and third The time when each of the second buffer chambers 160a and 160b finally reaches atmospheric pressure is shorter than the time when each of the first to third access chambers 150a, 150b and 150c finally reaches atmospheric pressure.

In other words, the time difference between reaching the final vacuum pressure and the atmospheric pressure is different from each other in the exhaust and venting processes, the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b, respectively. This means that a pressure difference occurs. When the pressure difference occurs during the exhaust and venting process, in the first and the second body (122a, 122b), the connection between the side plate 126 and the lower plate 128 connected by welding due to the deformation of the lower plate 128 Cracking may occur.

Accordingly, when the same exhaust means 170 and the venting means 172 are used, the first to third access chambers each have a time at which each of the first and second buffer chambers 160a and 160b reaches the final vacuum pressure or atmospheric pressure. Control means (150) in each of the exhaust line and the venting line of each of the first and second buffer chambers (160a, 160b) in order to maintain the same or close to the time each reaches the final vacuum pressure and the atmospheric pressure. 178).

5 is a cross-sectional view of the adjusting means according to an embodiment of the present invention.

The adjusting means 178 is installed in the exhaust line and the putting line 186 of the first and second buffer chambers 160a and 160b of FIG. 4. The adjusting means 178 cuts the exhaust line and the venting line 186, and connects two expansion nuts 182 in which the adjusting means 178 is accommodated through the sealing means, for example, an O-ring. The adjusting means 178 comprises an orifice 180 which dramatically reduces the flow of the fluid. The diameter and length of the orifice 180 are determined in consideration of the volume difference between each of the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b of FIG. 4.

The diameter of the orifice 180 is inversely proportional to the volume difference between each of the first to third access chambers 150a, 150b and 150c and each of the first and second buffer chambers 160a and 160b of FIG. 4. In other words, when the volume difference between each of the first to third access chambers 150a, 150b and 150c and each of the first and second buffer chambers 160a and 160b of FIG. 4 increases, the diameter of the orifice 180 becomes smaller. When the volume difference between each of the first to third access chambers 150a, 150b and 150c of FIG. 4 and each of the first and second buffer chambers 160a and 160b decreases, the diameter of the orifice 180 increases.

According to the experiment, despite the difference in volume between each of the first to third access chambers 150a, 150b, and 150c and each of the first and second buffer chambers 160a and 160b of FIG. The time difference between each of the three entrance chambers 150a, 150b and 150c and each of the first and second buffer chambers 160a and 160b reaching the final atmospheric pressure is not large. Therefore, if necessary, the adjusting means 178 may not be installed in the venting lines of the first and second buffer chambers 160a and 160b of FIG. 4.

6a and 6b are graphs of the exhaust velocity according to the embodiment of the present invention.

In FIGS. 6A and 6B, the solid line represents the exhaust velocity of the first and second buffer chambers 160a and 160b of FIG. 4, and the dotted line represents the first to third access chambers 150a, 150b and 150c of FIG. 4. Exhaust speed is indicated.

FIG. 6A illustrates the first to third access chambers 150a, 150b, and 150c and the first and second buffer chambers 160a by driving the exhaust means 170 without using the adjusting means 178 in FIG. 4. , When exhausting 160b, the exhaust velocity of each of the first to third access chambers 150a, 150b and 150c and each of the first and second buffer chambers 160a and 160b is shown.

As shown in FIG. 4, the volume of each of the first to third access chambers 122a, 122b and 122c is larger than that of each of the first and second buffer chambers 160a and 160b. Therefore, if the first and second buffer chambers 160a and 160b are evacuated without using the adjusting means 178 due to the volume difference, each of the first and second buffer chambers 160a and 160b becomes the final vacuum. The time for reaching the pressure is shorter than the time for each of the first to third access chambers 150a, 150b and 150c to reach the final vacuum pressure. Therefore, due to the pressure difference occurring in the exhaust process, in FIG. 4, the side plate 126 and the lower plate 128 connected by welding due to the deformation of the lower plate 128 of each of the first and second bodies 122a and 122b. Cracks may occur at the joints of

6B shows the first to third access chambers 150a, 150b and 150c and the first and second buffer chambers 160a and 160b by using the adjusting means 178 and by driving the exhausting means 170 in FIG. 4. ), The exhaust velocity of each of the first to third access chambers 150a, 150b, 150c and each of the first and second buffer chambers 160a, 160b is shown.

As shown in FIG. 4, the volume of each of the first to third access chambers 122a, 122b and 122c is larger than that of each of the first and second buffer chambers 160a and 160b. Accordingly, when the first and second buffer chambers 160a and 160b are evacuated to a vacuum using the adjusting means 178 to overcome the exhaust velocity for the volume difference, the first and second buffer chambers 160a and 160b are evacuated. The time that each reaches the final vacuum pressure is such that each of the first to third access chambers 150a, 150b, and 150c reaches the final vacuum pressure is equal to or close to each other. Therefore, no pressure difference occurs in the exhaust process, and in FIG. 4, deformation of the lower plate 128 of each of the first and second bodies 122a and 122b is prevented.

Second Example

In the second embodiment of the present invention, by providing two buffer chambers between the plurality of access chambers, it provides a load lock chamber that can maintain the same pressure of each of the access chambers adjacent to the upper and lower. Therefore, deformation of the lower plate and the diaphragm plate of the main body can be prevented. In the second embodiment of the present invention, the same reference numerals are used for the same components as those of the first embodiment.

7 is a schematic cross-sectional view of a load lock chamber according to a second embodiment of the present invention.

The load lock chamber 110 according to the second embodiment of the present invention includes an upper plate 120, a body 122, a diaphragm plate 124, and an intermediate plate 142.

The main body 122 includes first to third main bodies 122a, 122b and 122c. Each of the first to third bodies 122a, 122b, and 122c has an integrated side wall 126 and a lower plate 128. Side wall 126 and bottom plate 128 are connected in a manner such as welding. The side wall 126 is formed with a support 130 for supporting the upper plate 120, the diaphragm plate 124 and the intermediate plate 142 along the inner circumference. The support unit 130 seals the upper plate 120 or the diaphragm plate 124 through the sealing means, for example, the first supporting means 130a and the intermediate plate 142 through the O-ring. It includes a second support means 130b for supporting through.

The upper plate 120 is supported by the first support portion 130a of the first body 122a and seals the first body 122a through a sealing means. The upper plate 120 is provided with a plurality of first flow paths (not shown) through which the refrigerant flows. The coolant may use cooling water.

The upper portion of the lower plate 128 of each of the first and third bodies 122a, 122b, and 122c is positioned on the plurality of cooling plates 132 and the plurality of cooling plates 132 to cool the substrate 112. A plurality of support pins 134 supporting 112 are formed. Between the plurality of cooling plates 132, an arm of the transfer unit robot 108a of FIG. 3 or an arm of the transfer chamber robot 106 installed in the transfer chamber 104 of FIG. 3 may move in and out to transfer the substrate 112. The space that can be set is set. The plurality of first cooling plates 132 are spaced apart from each other and installed in parallel to each other, and a plurality of second flow paths (not shown) through which refrigerant for cooling the substrate 112 flows are formed.

The diaphragm plate 124 is supported by the first support portion 130a of each of the second and third bodies 122b and 122c, and the second and third bodies 122b and 122c via a sealing means, for example, an O-ring. Seal. The diaphragm plate 124 includes first and second diaphragm plates 124a and 124b. Each of the first and second diaphragm plates 124a and 124b includes a plurality of through portions 136 and a plurality of second cooling plates 138 inserted into the plurality of through portions 136.

The diaphragm plate 124 is made of stainless steel, and the plurality of through portions 136 are formed by digging the diaphragm plate 124. The plurality of through parts 136 are spaced apart from each other and formed in parallel with each other, and a locking step 140 on which a plurality of cooling plates 138 are mounted is formed at an inner circumference of each of the plurality of through parts 136. The plurality of cooling plates 138 seal the plurality of through portions 136 through the sealing means 140, for example, via a sealing means, for example, an O-ring. The plurality of cooling plates 138 are formed of aluminum. The plurality of second cooling plates 138 are provided with a plurality of third flow paths (not shown) through which refrigerant for cooling the substrate 112 flows.

The intermediate plate 142 is connected to the first intermediate plate 142a and the second support part 130b of the third body 122c supported by the second support part 130b of the second body 122b via the sealing means. It includes a second intermediate plate 142b which is supported via the sealing means.

The load lock chamber 110 is a substrate between the transfer part 108 and the transfer chamber 104 of FIG. 3 by assembling the upper plate 120, the main body 122, the diaphragm plate 124, and the intermediate plate 142. First to third access chambers 150a, 150b and 150c for conveying 112 and first and second buffer chambers 160a and 160b for preventing deformation of the diaphragm plate 124 are formed.

The first access chamber 150a provides a first accommodation space in which the substrate 112 is accommodated by the upper plate 120 and the first body 122a, and the second access chamber 150b includes a first partition plate ( 124a and the second body 122b provide a second accommodation space in which the substrate 112 is accommodated, and the third access chamber 150c is formed by the second diaphragm plate 124b and the third body 122c. A third accommodating space in which the substrate 112 is accommodated is provided.

The first buffer chamber 160a includes a first upper buffer chamber 162a and a second lower buffer chamber 162b. The first upper buffer chamber 162a provides a first upper buffer space for maintaining the same pressure as the inside of the first access chamber 150a by the first body 122a and the first intermediate plate 142a. The lower buffer chamber 162b provides a first lower buffer space that maintains the same pressure as the inside of the second access chamber 150b by the first intermediate plate 142a and the first diaphragm plate 124a. The first upper and lower buffer chambers 162a and 162b may maintain different pressures.

The second buffer chamber 160b includes a second upper buffer chamber 164a and a second lower buffer chamber 164b. The second upper buffer chamber 164a provides a second upper buffer space for maintaining the same pressure as the inside of the second access chamber 150b by the second body 122b and the second intermediate plate 142b. The lower buffer chamber 164b provides a second lower buffer space that maintains the same pressure as the inside of the third access chamber 150c by the second intermediate plate 142b and the second diaphragm plate 124b. The second upper and lower buffer chambers 164a and 164b may maintain different pressures.

In FIG. 7, the load lock chamber 110 includes the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers 164a and 164b. Although illustrated as including, but using two buffer chambers between the two entrance chambers as needed, or by increasing the number of the body 122, the intermediate plate 142 and the diaphragm plate 124 or more Access chambers and six or more buffer chambers may be used.

First and second slot valves (not shown) are provided in each of the first to third access chambers 150a, 150b, and 150c. The first slot valve is an entrance for introducing the substrate 112 in the transfer unit 108 of FIG. 3, and the second slot valve is an entrance for transferring the substrate 112 of FIG. 2 to the transfer chamber 104 of FIG. 2. to be. The first and second slot valves are provided on the side walls 126 of the first to third bodies 122a, 122b, and 122c, respectively.

The load lock chamber 110 vacuums the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers 164a and 164b to a vacuum. Exhaust means 170 for exhausting and venting means 172 for pressurizing to atmospheric pressure. Separate venting means 170 and venting in each of the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers 164a and 164b. The means 172 may be installed independently, but in order to reduce manufacturing costs, one exhaust means 170 and one venting means 172 may be installed. When one exhaust means 170 and the venting means 172 are installed, the first to the third access chamber (150a, 150b, 150c), the first upper and lower buffer chamber (162a, 162b), the second upper and A first switching valve 174 and a second switching valve 176 are installed in the exhaust line and the venting line of each of the lower buffer chambers 164a and 164b.

The first switching valve 174 is turned on among the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers 164a and 164b. The chamber maintaining the (ON) state is evacuated to a vacuum, and the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers ( Among the 164a and 164b, the chamber in which the first switching valve 174 maintains the OFF state is blocked from vacuum exhaust. The second switching valve 174 is turned on among the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers 164a and 164b. The chamber maintaining the (ON) state is vented to atmospheric pressure, and the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers ( Among the chambers 164a and 164b in which the second switching valve 174 maintains the OFF state, venting of atmospheric pressure is blocked.

Of the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b, and the second upper and lower buffer chambers 164a and 164b that are spaced from each other and operate independently. The operation states are as follows.

The first entry chamber 150a is in a vacuum state to communicate with the transfer chamber 104 of FIG. 3, and the second entry chamber 150b is at atmospheric pressure to communicate with the transfer unit 108 of FIG. When the chamber 150c is in a vacuum state to communicate with the transfer chamber 104 of FIG. 3, the first upper buffer chamber 162a positioned below the first access chamber 150a maintains a vacuum state. The first lower buffer chamber 162b located above the second access chamber 150b maintains an atmospheric pressure state, and the second upper buffer chamber 164a located below the second access chamber 150b maintains an atmospheric pressure state. The second lower buffer chamber 164b positioned above the third access chamber 150c maintains a vacuum state.

In other cases, the first entry chamber 150a is at atmospheric pressure to communicate with the transfer unit 108 of FIG. 3, and the second entry chamber 150b is vacuumed to communicate with the transfer chamber 104 of FIG. 3. In addition, when the third access chamber 150c is in an atmospheric pressure state to communicate with the transfer part 108 of FIG. 3, the first upper buffer chamber 162a positioned below the first access chamber 150a may maintain an atmospheric pressure state. The first lower buffer chamber 162b positioned above the second access chamber 150b maintains a vacuum state, and the second upper buffer chamber 164a positioned below the second access chamber 150b maintains a vacuum state. The state is maintained, and the second lower buffer chamber 164b positioned above the third access chamber 150c maintains the atmospheric pressure state.

In other words, each of the first and second upper buffer chambers 162a and 164b maintains the same pressure as the first and second access chambers 150a and 150b, and the first and second lower buffer chambers 162b and 164b respectively. Each maintains the same pressure as the second and third access chambers 150b and 150c. In addition, the upper plate 120 constituting the first access chamber 150a positioned at the uppermost portion and the lower plate 128 of the third body 122c constituting the third access chamber 150c disposed at the lowermost portion are formed of the first and the first and second access chambers 150a. When the third access chambers 150a and 150c are in a vacuum state, the upper plate 120 and the lower plate 128 of the third body 122c may be deformed. Therefore, although not shown in the drawings, the same pressure as the first and third access chambers 150a and 150c is maintained at the upper side of the upper plate 120 and the lower side of the lower plate 128 of the third body 122c, respectively. A separate buffer chamber can be installed.

However, the upper plate 120 and the lower plate 128 of the third body 122c are exposed to the outside of the load lock chamber 110, so that a reinforcing material for preventing deformation without installing a separate buffer chamber ( Not shown) can be installed. Even if the first and third access chambers 150a and 150c are in a vacuum state by installing the reinforcing material, the lower plate 128 of the upper plate 120 and the third body 122c can be prevented from being deformed.

In the load lock chamber 110 of FIG. 4, the volume of each of the first to third access chambers 122a, 122b, and 122c is defined by the first upper and lower buffer chambers 162a and 162b and the second upper and lower buffer chambers ( 164a, 164b) larger than each volume. Accordingly, the first to third access chambers 150a, 150b and 150c, the first upper and lower buffer chambers 162a and 162b and the second upper and lower buffer chambers 164a and 164b are exhausted due to the volume difference. When evacuated to vacuum by 170, the time for each of the first upper and lower buffer chambers 162a and 162b and the second upper and lower buffer chambers 164a and 164b to reach the final vacuum pressure is first to third. Each of the entrance chambers 150a, 150b, 150c is shorter than the time for reaching the final vacuum pressure. In addition, exhaust lines and venting of the first upper and lower buffer chambers 162a and 162b and the second upper and lower buffer chambers 164a and 164b, respectively, in order to overcome the time difference of reaching the final pressure due to the volume difference. Install the adjusting means 178 in the line.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

Claims (13)

A plurality of entrance chambers which repeat the atmospheric pressure and the vacuum state and receive the substrate;
A buffer chamber installed between the plurality of access chambers and maintaining the same pressure as one of the plurality of adjacent access chambers;
Exhaust means for vacuuming the plurality of access chambers and the buffer chambers; And
Venting means for atmospheric pressure of the plurality of access chambers and the buffer chamber;
A load lock chamber having a buffer chamber, characterized in that it comprises a.
The method of claim 1,
And a control means installed in the exhaust line or the venting line of the buffer chamber to adjust the exhaust or venting speed of the buffer chamber.
The method of claim 2,
And the adjustment means is an orifice.
The method of claim 3, wherein
And a volume difference between the diameter of the orifice and one of the plurality of entrance chambers and the buffer chamber is inversely proportional.
The method of claim 4, wherein
If the volume difference between the plurality of access chambers and the plurality of buffer chambers is large, the diameter of the orifice is small. If the volume difference between the plurality of access chambers and the plurality of buffer chambers is small, the diameter of the orifice is large. A load lock chamber having a buffer chamber, characterized in that.
The method of claim 1,
And a time period during which the interior of the buffer chamber becomes a vacuum and atmospheric pressure is shorter than a time when the interior of one of the plurality of entrance chambers becomes a vacuum and atmospheric pressure.
The method of claim 1,
A diaphragm plate separating one of the plurality of access chambers and the buffer chamber, wherein the diaphragm plate is supported by a support part installed on one of the plurality of access chambers and a side wall constituting the buffer chamber. A load lock chamber having a buffer chamber.
The method of claim 7, wherein
And the diaphragm plate includes a plurality of cooling plates.
The method of claim 8,
A plurality of through parts are formed in the barrier plate, and each of the plurality of cooling plates is inserted into the plurality of through parts.
The method of claim 1,
The plurality of access chambers include first to third access chambers, and the plurality of buffer chambers are located between the first buffer chamber located between the first and second access chambers and the second and third access chambers. And a second buffer chamber, wherein the first access chamber maintains the same pressure as the first buffer chamber, and the second access chamber maintains the same pressure as the second buffer chamber. Branch loadlock chamber.
The method of claim 1,
The plurality of access chambers may include first to third access chambers, and the plurality of buffer chambers may include first upper and lower buffer chambers and second and third access chambers positioned between the first and second access chambers. And a second upper and lower buffer chamber disposed between the first access chamber, the first access chamber maintaining the same pressure as the first upper buffer chamber, and the second access chamber being the first lower buffer chamber and the second upper buffer chamber. A load lock chamber having a buffer chamber, wherein the pressure is maintained at the same pressure as the chamber, and the third access chamber maintains the same pressure as the second lower buffer chamber.
The method of claim 11,
And the first upper and lower buffer chambers maintain different pressures, and the second upper and lower buffer chambers maintain different pressures.
A transfer chamber through which the substrate is transferred in a vacuum state;
A process chamber connected to the transfer chamber; And
A load lock chamber connected to the transfer chamber;
The load lock chamber,
A plurality of entrance chambers which repeat the atmospheric pressure and the vacuum state and receive the substrate;
A plurality of buffer chambers installed between the plurality of access chambers and maintaining the same pressure as the plurality of access chambers;
Exhaust means for evacuating the plurality of access chambers and the plurality of buffer chambers in a vacuum;
Venting means for pressurizing the plurality of access chambers and the plurality of buffer chambers to atmospheric pressure; And
Adjusting means installed in an exhaust line or a venting line of the plurality of buffer chambers to adjust the exhaust or venting speed of the plurality of buffer chambers;
Substrate processing apparatus comprising a.

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