KR20120077253A - Light-emitting package and lighting device - Google Patents

Abstract

PURPOSE: A light emitting package and a lighting device are provided to omit a separate secondary optical system for controlling a directional angle by including a plurality of molding units having different curvature. CONSTITUTION: A plurality of LED chips(100, 200, 300) is mounted on a lower substrate(500). A plurality of molding units(110, 210, 310) solders the plurality of LED chips. The plurality of molding units has different curvature. The curvature of a molding unit of an LED chip arranged on a center portion is lower than the curvature of a molding unit of an LED chip arranged on a peripheral portion. The plurality of LED chips comprises a blue LED chip in which a fluorescent substance layer of yellow series is formed.

Description

Lighting package and lighting device {LIGHT-EMITTING PACKAGE AND LIGHTING DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting package and a lighting device, and more particularly, to a chip on board (COB) type LED package encapsulating each of a plurality of light emitting diode chips and having a plurality of moldings having different curvatures. And it relates to a lighting device employing the same.

Light Emitting Diode (LED) is a semiconductor light emitting device that emits light due to potential difference when electrons and holes recombine in a PN junction structure by applying electric current. It is eco-friendly, low voltage, long life and low price. Although it has been applied to many simple information displays such as display lamps and numbers in the past, in recent years, due to the development of industrial technology, especially information display technology and semiconductor technology, display field, lighting device, automobile head lamp, projector, etc. It has been used in various fields.

Recently, the technical problem of the products that apply the light emitting diode is to prevent the degradation of the performance due to the high heat generation of the LED products, or to reduce the life of the product, active research on the technology to have a smooth heat dissipation structure while reducing the size of the LED package One such technology is COB (Chip on Board) technology that directly mounts an LED chip on a PCB substrate. COB technology has the advantage of miniaturization by increasing the heat dissipation effect by reducing the escape path of heat generated from the chip, and by reducing the height of the package itself.

1A and 1B show an example of a COB type LED package. Referring to FIG. 1, a COB type LED package includes a base metal 10, an insulating layer 11, a wiring layer 12, a lower substrate including a photo imageable soler resist (PSR) 13, and a die adhesive 14. The lens serves to integrally seal the LED chip 1 and the LED chip 1 and the wiring 15 adhered to the upper portion of the lower substrate, and to adjust the directivity angle of the light emitted from the LED chip 1. It may include a molding unit 20 to. Here, although not shown for the sake of simplicity, the phosphor layer (not shown) formed by, for example, a conformal phosphor coating method is formed in the region surrounding the upper side and the side surface of the LED chip 1. Can be deployed.

The COB type LED package may emit white light as a whole by, for example, mixing blue light by a blue light emitting diode chip (hereinafter referred to as a blue LED chip) 1 and light passing through the phosphor layer (not shown). . In the figure, a single LED chip 1 is shown mounted inside the COB type LED package, but according to the embodiment, a plurality of LED chips form an array and is mounted inside the molding part 20. You can also take

On the other hand, in the case of Figure 1 (a), there is a problem that the heat dissipation is limited because the insulating layer 11 having a large thermal conductivity is disposed between the LED chip 1 and the base metal 10 of the lower substrate, As in the case of (b) of 1, a structure in which the insulating layer 12 between the LED chip 1 and the base metal 10 is partially removed is also attempted.

However, in the case of the LED package having a structure as shown in (a) or (b) of FIG. 1, a dome-shaped molding part 20 is formed on the LED chip 1 to improve light extraction efficiency. While the light extraction efficiency of the package is improved by the formation of the molding part 20, there is a problem in that the spatial color unevenness, that is, the color deviation is severe.

FIG. 2 is a graph illustrating the color deviation phenomenon. As described above, a color deviation phenomenon occurs in a COB type LED package including a blue LED chip 1 having a yellow phosphor (YAG) conformal phosphor layer formed thereon. Indicates. However, the experiment was not performed when a plurality of blue LED chips form an array in the package, but a case where one blue LED chip is included in the package.

Referring to the drawings, FIG. 2 (a) is a graph measuring uniformity of CIE (Commission Internationale de I'Eclairage) x and y color coordinates according to the light direction when the molding part 20 is not present. At the angle 0), the difference (x) of the x color coordinate and the difference (y) of the y color coordinate, i.e., color deviation, up to 90 ° in both the left and right directions were small. On the other hand, (b) of FIG. 2 is a graph in which the molding part 20 is present, and it can be seen that a large color coordinate difference occurs in both directions from the center (angle 0) as compared with FIG. That is, when the COB type LED package includes the molding part 20, it can be seen that the color deviation is intensified.

Meanwhile, unlike FIG. 2, FIG. 3 is a graph for explaining a color deviation phenomenon when a plurality of LED chips are included in a single COB package. Referring to FIG. 3, similar to the case of FIG. 2, it is understood that the color deviation is increased when there is a molding part (see FIG. 3B) as compared with the case where there is no molding part (see FIG. 3A). Can be.

The present invention is to solve the above problems, an object of the present invention is to provide a package having a molding that can reduce the color deviation while increasing the light extraction efficiency in a COB type LED package including a plurality of chips. will be.

In addition, an object of the present invention is to adopt a molding part having a different curvature to improve the color deviation phenomenon, as well as to adjust the direction angle, thereby eliminating the need for a separate secondary optical system for adjusting the direction angle It is to provide an LED package and a lighting device employing the same.

A chip-on-board LED package according to an aspect of the present invention includes a substrate, a plurality of light emitting diode chips mounted on the substrate, and a plurality of moldings encapsulating each of the plurality of light emitting diode chips and having different curvatures. It is characterized by including a wealth.

Here, the curvature of the molding part of the light emitting diode chip disposed in the center of the plurality of light emitting diode chips may be smaller than the curvature of the molding part of the light emitting diode chip disposed in the peripheral part.

Also, the curvature of the molding part of the LED chip disposed in the peripheral portion may be about 15 to 45% greater than the curvature of the molding part of the LED chip disposed in the central portion.

On the other hand, preferably, the plurality of light emitting diode chips may include a blue LED chip having a yellow phosphor layer.

In addition, preferably, the light emitting package may further include a plurality of light emitting diode chips emitting red light.

In addition, preferably, the plurality of light emitting diode chips emitting red light may include a red LED chip or a blue LED chip having a red phosphor layer.

Further, preferably, some of the red light emitting diode chips may be disposed between the arrangements of the blue light emitting diode chips emitting white light.

Also, the molding part of the red light emitting diode chip may simultaneously encapsulate at least one or more red light emitting diode chips.

Lighting device according to another aspect of the invention, the light source module; And a heat sink thermally coupled with the light source module,

The light source module includes a plurality of light emitting diode chips mounted on a substrate; And a plurality of molding parts encapsulating each of the plurality of LED chips and having different curvatures.

Here, preferably, the plurality of light emitting diode chips may include a blue LED chip having a yellow phosphor layer.

In addition, preferably, the lighting apparatus may further include a plurality of light emitting diode chips emitting red light.

Also, among the plurality of light emitting diode chips, the curvature of the molding part of the light emitting diode chip disposed in the center may be smaller than the curvature of the molding part of the light emitting diode chip disposed in the peripheral part.

Also, the curvature of the molding part of the LED chip disposed in the peripheral portion may be about 15 to 45% greater than the curvature of the molding part of the LED chip disposed in the central portion.

According to the present invention, in a COB type LED package that emits white light, including a plurality of LED chips formed with a phosphor layer, by applying a plurality of molding parts having different curvature to improve the light extraction efficiency, the package according to the curvature of the molding part It is possible to adjust the directivity angle of, and at the same time, it is possible to considerably improve the color deviation phenomenon which has been pointed out as a problem of the conventional package. In addition, since the directing angle of the light emitted from the COB type LED package can be adjusted by the curvature of the plurality of molding parts, there is no need to use a second optical system for adjusting the directing angle, thereby reducing the manufacturing cost of the package and simplifying the manufacturing process. Can be.

1A and 1B are cross-sectional views illustrating an example of a COB type LED package.
2 (a) and 2 (b) are graphs for explaining a color deviation phenomenon occurring in a conventional COB type LED package including a single chip.
3 is a graph illustrating a color deviation phenomenon occurring in a conventional COB type LED package including a plurality of chips.
Figure 4 is a perspective view for explaining a COB type LED package according to an embodiment of the present invention.
5 is a view showing a COB type LED chip and a phosphor layer according to an embodiment of the present invention.
6A, 6B, and 6C are diagrams for explaining a direction angle of a COB type LED package according to an embodiment of the present invention.
7 is a top plan view illustrating a COB type LED package according to another embodiment of the present invention.
8 is a schematic exploded perspective view illustrating a lighting apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments introduced below are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms.

In addition, within the present specification, when a part such as a layer, a film, an area, a plate, or the like is expressed as "above" or "on" another part, when each part is "just above" or "directly above" another part As well as the case where there is another part between each part and the other part.

And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience, the same reference numerals throughout the specification represent the same components and similar reference numerals refer to corresponding similar components. Indicates.

Figure 4 is a perspective view for explaining a COB type LED package according to an embodiment of the present invention. According to the present embodiment, the COB type LED package may include a plurality of LED chips 100, 200, and 300, molding parts 110, 210, and 310 having a plurality of different curvatures, and a lower substrate 500. have. However, it should be understood that the present invention is not limited to a specific number or arrangement of LED chips shown in the drawings.

Here, the plurality of LED chips 100, 200, and 300 are mounted on the lower substrate 500 in a COB type LED package, and the lower substrate 500 may be a general printed circuit board or an MCPCB. That is, although not limited, for example, as shown in (a) and (b) of FIG. 1, for the lower substrate 500, an MCPCB including a metal core base metal, an insulating layer, and a wiring layer may be formed on the lower substrate 500. ) Can be employed. In addition, preferably, in consideration of heat dissipation efficiency between the LED chips 100, 200, 300 and the lower substrate 500, a part of the wiring layer and the insulating layer (not shown) disposed on the upper surface of the MCPCB is partially removed. The upper LED chips 100, 200, and 300 may be in direct contact with the base metal (not shown) (see FIG. 1B).

Meanwhile, the plurality of LED chips 100 and 200 may be arranged in circles, that is, concentric circles, each having a different radius. In detail, the LED chips 100 may be arranged in a circle, and the LED chips 200 may be arranged in a circle at the outermost side of the LED chips 100. In addition, the LED chips 300 may be additionally disposed in the inner space of the LED chips 100, that is, in the center of the LED chip array, and together with the space between the LED chips 100 and the LED chips 200. The LED chips 300 may be arranged in a circle to surround the LED chips 100.

However, according to the exemplary embodiment, the arrangement of the LED chips 300 may be omitted, and only the LED chips 100 and the LED chips 200 may be arranged concentrically. In addition, the LED chips 100 and 200 may be arranged. For example, a blue LED chip that emits white light as a whole including a phosphor layer of a yellow series (YAG). Referring to FIG. 5A, the phosphor layer 600 is, for example, a conformal coating method. According to the upper and / or the side of the blue LED chip.

On the other hand, the LED chip 300 may emit red-based light as a red light emitting diode chip (hereinafter referred to as a red LED chip). Alternatively, a blue LED chip in which a red phosphor layer is formed as the LED chip 300 may be used. You can also use

According to the present embodiment, the color rendering index of the light generated from the entire COB type LED package may be improved by mixing the white light emitted from the LED chips 100 and 200 and the red light emitted from the LED chip 300. .

Of course, as described above, the COB type LED package according to another embodiment of the present invention does not include the LED chip 300, and uses only the blue LED chips 100 and 200 in which the yellow phosphor layer is formed, and uses white light. You can also let them exit. Alternatively, according to the embodiment, the LED chip for emitting light of a wavelength other than the red series is additionally included in the package instead of the LED chip 300, so that the color temperature of the light emitted from the entire package is adjusted to the user's request. It can also be adjusted accordingly.

In addition, the LED chips 100, 200, and 300 may be encapsulated by the dome-shaped moldings 110, 210, and 310, respectively, to be protected from external shock and moisture, and the molding parts 110, 210, and 310. The amount of light and the directivity of the lights generated from each of the LED chips 100, 200, and 300 may be changed by the curvature of. That is, the molding parts 110, 210, and 310 may serve as a lens for controlling the amount of light emitted from the LED chips 100, 200, and 300, as well as a direction angle, in addition to the encapsulation material. It may be adjusted by changing the curvature of the molding unit (110, 210, 310). However, the shape of the molding part 110, 210, 310 may be variously modified according to an embodiment such as a semi-elliptic shape, an aspherical surface, etc. in order to have a desired lens characteristic in addition to the hemispherical cross section as shown. Should be understood.

Specifically, the molding unit 110 of the plurality of LED chips mounted on the lower substrate 500, that is, the LED chips 100 positioned close to the center of the array, and the molding unit 210 of the LED chips 200 located at the periphery. ) Curvature (or curvature radius) is different from each other, and by adjusting the curvature of the molding parts (110, 210) differently, the amount of light, the direction angle and the color deviation of the entire package can be changed. Preferably, the curvature of the molding unit 210 located at the periphery may be greater than the curvature of the molding unit 110 located at the center (that is, the radius of curvature R2 <the radius of curvature of the molding unit 110). R1) In this case, it is possible to reduce the color deviation phenomenon unlike the conventional one, while increasing the amount of light in the whole package and widening the directivity angle.

Preferably, the difference between the radius of curvature of the molding part 110 and the molding part 210 may be about 15 to 45%. Specifically, when the size of the radius of curvature of the molding part 210 is 100%, the size of the radius of curvature of the molding part 110 may be about 115 to 145%. Therefore, if the difference in the radius of curvature between the molding parts (110, 210) is too small, it is not possible to obtain the effect of improving color deviation, light directivity and light extraction efficiency at the same time.

On the other hand, if the radius of curvature of the molding parts 110 and 210 is large, the color deviation is small, but has a wide orientation angle, light extraction efficiency may be somewhat low, while the radius of curvature of the molding parts 110 and 210 is small In this case, the angle of view may be narrow and the light extraction efficiency may be high, but color deviation may occur.

Further, preferably, the ratio of the chip having the molding part 110 having a large radius of curvature may be formed to occupy about 20 to 50% of the molding parts 110, 210, and 310.

In addition, the radius of curvature of the molding part 310 of the LED chips 300 may be formed to have a value greater than or between the radius of curvature of the molding parts 110 and 210.

Hereinafter, a change in curvature of the molding parts 110 and 210 and a change in light quantity, azimuth angle, and color deviation of the COB type LED package will be described with reference to FIGS. 6A to 6C. 6 is a graph illustrating a change in the orientation angle according to the curvature of the molding parts 110 and 210.

That is, FIGS. 6A to 6C illustrate a case in which the curvatures of the molding parts 110 and 210 are the same in the state in which the LED chips 100 and 200 are arranged concentrically as shown in FIG. 4 (that is, when R1 = R2). 6A and 6B) and the curvature of the molding parts 110 and 210 are different from each other (ie, when R1 ≠ R2, see FIG. 6C).

Specifically, when the curvature radii of the molding parts 110 and 210 corresponding to the LED chips 100 and 200 are all the same in order to reduce the color deviation, the value is large (for example, R1 = R2 = about 2.3 mm), the light amount was about 1302 (lumens), and the light directing angle was about 166 ° (see FIG. 6A), Δx = 0.038, Δy = 0.040, that is, the color Although the deviation value is relatively small, the light extraction efficiency is low and a large direction angle is shown.

On the contrary, in order to increase the amount of light from the package and to improve the light extraction efficiency, the radius of curvature of the molding parts 110 and 210 corresponding to the LED chips 100 and 200 are equalized, and the value is smaller. (E.g., R1 = R2 = about 1.8 mm), the light amount was about 1334 (lumens), and the light directing angle was about 144 ° (see FIG. 6B), Δx = 0.05, Δ As y = 0.042, that is, the light extraction efficiency was better than that of the type (a) and the direction angle was narrow, but the color deviation value was large.

On the other hand, according to one embodiment of the present invention, the curvature of the molding unit 110, 210 corresponding to the LED chip (100, 200) to increase the amount of light, increase the light extraction efficiency, as well as reduce the color deviation phenomenon The radii are different from each other, ie, the radius of curvature of the molding part 110 is greater (e.g., R1 = about 2.3 mm), and the radius of curvature of the molding part 210 is smaller (e.g. , R2 = about 1.8 mm), the amount of light is about 1331 (lumens), and the light directing angle is about 150 ° (see FIG. 6C), Δx = 0.033, Δy = 0.032, that is, Although the light extraction efficiency is better than that of the (a) type and smaller than the orientation angle (a) type, the color deviation value is smaller than that of the (a) type. That is, according to the present invention, it becomes possible to implement a package utilizing only the advantages of the types (a) and (b).

Meanwhile, the molding parts 110, 210, and 310 may be formed of a material such as epoxy or silicon, and may be formed by dispensing and curing the LED chips 100, 200, and 300, or may be formed of a dome. It can also be formed using a mold. However, the present invention is not limited to the type of the specific molding resin and its formation method.

In addition, the molding unit 110, 210, 310 may include a diffusing agent and the like as an additive for controlling the optical properties, without limitation, for example, the LED chip (100, 200) is a blue LED In the case of a chip, a yellow phosphor layer 600a such as YAG may be formed on the surfaces of the molding parts 110 and 210 (see FIG. 5B).

In addition, as shown (see FIG. 4), each molding unit 110 and 210 is configured to encapsulate only one LED chip 100 and 200, and the molding unit 310 may include a plurality of LED chips 300. May be encapsulated at once, but the present invention is not limited thereto, and the number of LED chips disposed in the molding parts 110, 210, and 310 may be variously adjusted according to embodiments.

7 is a top plan view illustrating a COB type LED package according to another embodiment of the present invention. Unlike the embodiment of FIG. 4 in which the array of LED chips is concentrically arranged, in the COB type LED package according to the present embodiment, the array of LED chips has a rectangular symmetric array. For simplicity, the description of overlapping parts will be omitted.

The COB type LED package according to the present embodiment may include a plurality of LED chips 100 and 200, molding parts 120 and 220 having a plurality of different curvatures, and a lower substrate 500. However, it should be understood that the present invention is not limited to a specific number or arrangement of LED chips shown in the drawings.

The plurality of LED chips 100 and 200 may be mounted on the lower substrate 500 in a COB type LED package, and the lower substrate 500 may be a general printed circuit board or an MCPCB.

Meanwhile, the plurality of LED chips 100 and 200 may form a symmetrical array of squares on the lower substrate 500. In detail, the LED chips 100 form a rectangular array in the center (chips arranged inside the dotted line in FIG. 7), and the LED chips 200 surround the LED chips 100 in the outermost shape in a rectangular band shape. Can be arranged. That is, the shape of the entire LED array by the LED chips (100, 200) may take the shape of a square symmetrical to each other based on the diagonal. In the drawing, although the entire LED array is shown to have a square arrangement, it is also possible to take a rectangular arrangement having different lengths of the long side and the short side. In addition, according to the embodiment, if the array of LED chips in the COB-type LED package has a symmetrical arrangement, in addition to the rectangular arrangement as shown in the figure can be variously changed to a polygonal shape including hexagons, octagons, etc., the outermost It is within the scope of the present invention if the LED chips located at the periphery including the portion have a molding portion having a different radius of curvature from the LED chips arranged therein.

In addition, although not shown, in a manner similar to that of FIG. 4, the LED chips 300 may be arranged in a rectangle while surrounding the LED chips 100 in a space between the LED chips 100 and the LED chips 200. It may be. In the case of including the arrangement of the LED chip 300, the spacing between the LED chip 100 and the LED chip 200 is increased.

In addition, the LED chips 100 and 200 are blue LED chips that emit white light as a whole, including, for example, a phosphor layer of a yellow series (YAG) formed by a conformal coating method, wherein the phosphor layer is the blue LED chip. It can be formed on the top and / or the side of the.

On the other hand, the additional LED chip 300 may use a red LED chip that emits red-based light, or alternatively, a blue LED chip having a red phosphor layer formed on the top and side of the chip.

According to the present embodiment, the color rendering index of the light generated from the entire COB type LED package may be improved by mixing the white light emitted from the LED chips 100 and 200 and the red light emitted from the LED chip 300. . On the other hand, according to the embodiment, the LED chip for emitting light of a wavelength other than the red series may be further included in the package instead of the LED chip 300, by doing so, the color temperature of the light emitted from the entire package by the user You can also adjust it to your needs.

In addition, the LED chips 100 and 200 may be encapsulated by the dome-shaped molding parts 120 and 220, respectively, to be protected from external shock and moisture, and the curvature of the molding parts 120 and 220 may be prevented. The optical properties of the lights generated from the LED chips 100 and 200 may be changed.

Specifically, the molding unit 120 of the plurality of LED chips mounted on the lower substrate 500, that is, the LED chips 100 located close to the center of the array, and the molding unit 220 of the LED chips 200 located at the periphery. ) Curvature (or radius of curvature) is different from each other, and by adjusting the curvature of the molding parts (120, 220) differently, the amount of light, the direction angle and the color deviation of the entire package can be changed. Preferably, the curvature of the molding part 220 located at the periphery may be greater than the curvature of the molding part 120 located at the center (that is, the radius of curvature R2 <the radius of curvature of the molding part 120). R1) In this case, it is possible to reduce the color deviation phenomenon unlike the conventional one, while increasing the amount of light in the whole package and widening the directivity angle.

However, if the difference between the radius of curvature of the molding part 120 and the molding part 220 is too small, the color deviation improvement effect may be reduced, and if the difference of the radius of curvature between the molding parts 120 and 220 is too large, as a whole Since it is difficult to expect an even amount of light output, the difference in the radius of curvature between the molding parts 120 and 220 is determined in consideration of various optical properties.

In addition, when the LED chips 300 are added in addition to the arrangement as shown in FIG. 7, the radius of curvature of the molding part (not shown) of the LED chip 300 is greater than or between the radius of curvature of the molding parts 120 and 220. It may be formed to have a value of.

As described above, the embodiments described in the present specification have described a COB type LED package having a specific LED array shape such as a concentric array, a square array, and the like, but the plurality of LED chips 100, 200, and 300 included in the package have a specific shape. It is also possible to arrange at random without forming an array of. For example, a zigzag array or an array without regularity is possible. However, even in such a case, it is possible to improve the color deviation phenomenon by arranging molding parts having a large curvature in the outermost part of the LED array so that the light generated from the LED chips converge toward the package center part. Therefore, a plurality of light emitting diode chips having a phosphor layer formed inside the COB type LED package are mounted, and the curvature of the molding part encapsulating the mounted light emitting diode chips is differentiated, so that light emitted from the outermost light emitting diode chips in the package can be obtained. If the convergence to the central portion of the package to improve the color deviation, the arrangement of the LED chip and the molding portion encapsulating the same may be variously changed within the scope of the present invention.

8 is a schematic exploded perspective view illustrating a lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 8, the lighting apparatus according to an embodiment of the present invention includes a light source module 2000 employing a COB type LED package, an optical unit 1100, a heat sink 1300, and a socket base 1400. can do.

The heat sink 1300 may have a concave-convex pattern 1310 to increase the surface area, and may also have a concave-convex pattern 1320 for coupling the optical unit 1100. In addition, the heat sink 1300 may have a cavity 1330 for mounting the light source module 2000 and may be provided as a heat dissipation housing. The uneven pattern 1310 may be formed on the surface of the heat sink 1300 as shown, but is not limited thereto and may be formed under the heat sink 1300 in a plurality of fins. The heat sink 1300 may be formed of a metal having excellent heat dissipation, such as aluminum or an aluminum alloy.

The heat sink 1300 may have through holes (not shown) through which a covered wire (not shown) passes to electrically connect the socket base 1400 and the light source module 2000.

The light source module 2000 is a driving integrated circuit device 2200 for driving the COB type LED package 2100 and the plurality of light emitting diode chips 100, 200, 300 in the COB type LED package 2100 according to the present invention. ) Is formed on the substrate 2300, and is thermally coupled on the heat sink 1300. That is, on the substrate 2300 of the light source module 2000 according to the present exemplary embodiment, peripheral circuit parts for driving the plurality of light emitting diode chips 100, 200, and 300 are IC chips to be mounted as the integrated circuit device 2200. Can be. In addition, the curvature of the molding part of the plurality of light emitting diode chips 100, 200, and 300 in the COB type LED package 2100 may be adjusted differently, and the curvature of the molding part located at the center may be made smaller. In addition, the light source module 2000 may be directly mounted on the heat sink 1300, and for this purpose, the heat sink 1300 may have a mounting groove for accommodating the light source module 2000. For example, the light source module 2000 may be placed on the bottom surface of the cavity 1330 of the heat sink 1300, and a mounting groove may be formed on the bottom surface to fix the position of the light source module 2000.

Meanwhile, the optical unit 1100 is fixed to the heat sink 1300 on the light source module 2000. The optical unit 1100 may include a reflector 1110 and a coupling unit 1120 for coupling the reflector 1110 to the heat sink 1300. The coupling part 1120 may have grooves 1125 corresponding to the uneven pattern 1320 of the heat sink 1300.

The reflector 1110 is disposed above the light source module 2000, and reflects the light emitted from the COB type LED package 2210 to the outside of the lighting device and narrows the direction angle of the light emitted from the light source module 2000. have. According to an embodiment, an optical lens may be combined instead of or in addition to the reflector 1110.

However, according to the present invention, the curvature of the molding portion of the LED chip (100, 200, 300) of the COB type LED package 2210 constituting the light source module 2000 is adjusted differently, thereby directing the light generated from the light source module 2000 The reflector 1110 may be omitted because the angle can be adjusted. In this case, it is not necessary to use a separate secondary optical system for adjusting the directivity angle, so that the manufacturing cost of the lighting apparatus can be reduced and the manufacturing process can be simplified.

Meanwhile, the socket base 1400 is coupled to the bottom of the heat sink 1300. The socket base 1400 may have a cylinder-shaped body 1410, a coupling part 1430 and a socket terminals 1420 to fit to the heat sink 1300. The socket base 1400 may be variously selected, such as a GU10 base and a GZ10 base, depending on the intended use. For example, the socket base may include two socket terminals 1420, and the socket terminals 1420 may be electrically connected to the light source module 2000 by a shielded wire (not shown).

As described above, the lighting apparatus according to the present embodiment is a light source module 2000, and by differentiating the curvature of the molding of the plurality of light emitting diode chips, it is possible to increase the light extraction efficiency and to reduce the color deviation phenomenon, and to adjust the orientation angle. There is no need to provide a separate secondary optical system.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

Therefore, it is to be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the above description, and it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention. do.

1, 100, 200, 300: LED chip 20, 110, 210, 310: molding part
500: lower substrate

Claims (13)

Board;
A plurality of light emitting diode chips mounted on the substrate; And
And a plurality of molding parts encapsulating each of the plurality of light emitting diode chips and having different curvatures. The method according to claim 1,
The curvature of the molding portion of the light emitting diode chip disposed in the center of the plurality of light emitting diode chips is smaller than the curvature of the molding portion of the light emitting diode chip disposed in the peripheral portion. The light emitting package of claim 2, wherein a curvature of the molding part of the LED chip disposed in the peripheral part is about 15 to 45% greater than the curvature of the molding part of the LED chip disposed in the center part. The light emitting package of claim 2, wherein the plurality of light emitting diode chips include a blue LED chip having a yellow phosphor layer. The light emitting package of claim 4, wherein the light emitting package further comprises a plurality of light emitting diode chips emitting red light. The light emitting diode of claim 5, wherein the plurality of light emitting diode chips emitting red light include a red light emitting diode chip or a blue light emitting diode chip having a red phosphor layer. package. The light emitting package of claim 6, wherein some of the red light emitting diode chips are disposed between arrays of blue light emitting diode chips emitting white light. The light emitting package of claim 7, wherein the molding part of the red light emitting diode chip simultaneously seals at least one red light emitting diode chip. A light source module; And
A heat sink thermally coupled with the light source module,
The light source module,
A plurality of light emitting diode chips mounted on a substrate; And
And a plurality of molding parts encapsulating each of the plurality of light emitting diode chips and having different curvatures. The lighting device as set forth in claim 9, wherein the plurality of light emitting diode chips include a blue LED chip having a yellow phosphor layer. The illuminating apparatus according to claim 10, wherein the illuminating apparatus further comprises a plurality of light emitting diode chips emitting red light. The method according to claim 9,
The curvature of the molding part of the light emitting diode chip disposed in the center of the plurality of light emitting diode chips is smaller than the curvature of the molding part of the light emitting diode chip disposed in the peripheral portion. The method of claim 12, wherein the curvature of the molding portion of the LED chip disposed in the peripheral portion is about 15 to 45% greater than the curvature of the molding portion of the LED chip disposed in the central portion.

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