KR20120067542A - Light emitting module and backlight unit using the same - Google Patents

Light emitting module and backlight unit using the same Download PDF

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Publication number
KR20120067542A
KR20120067542A KR1020100128993A KR20100128993A KR20120067542A KR 20120067542 A KR20120067542 A KR 20120067542A KR 1020100128993 A KR1020100128993 A KR 1020100128993A KR 20100128993 A KR20100128993 A KR 20100128993A KR 20120067542 A KR20120067542 A KR 20120067542A
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KR
South Korea
Prior art keywords
circuit board
bonding pad
light emitting
light source
emitting module
Prior art date
Application number
KR1020100128993A
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Korean (ko)
Inventor
장규호
Original Assignee
삼성엘이디 주식회사
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Priority to KR1020100128993A priority Critical patent/KR20120067542A/en
Publication of KR20120067542A publication Critical patent/KR20120067542A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: A light emitting module and a backlight unit using the same are provided to improve product reliability at the high temperatures by rapidly releasing heat of a light emitting diode through a heat radiation pattern unit. CONSTITUTION: An optical source unit is installed on circuit board(100). The optical source unit comprises an LED chip(40), a first bonding pad(20), and a second bonding pad(30). The second bonding pad protects a part of the first bonding pad. A anode patterned unit(70) is formed on the circuit board to be touched with the optical source unit. A cathode pattern unit(80) is electrically connected with optical source unit through wires(61-63). A heat radiation pattern(90) is formed to be touched with the optical source unit. A lens is installed on the circuit board.

Description

LIGHT EMITTING MODULE AND BACKLIGHT UNIT USING THE SAME}

The present invention relates to a light emitting module, and more particularly, to a light emitting module having a high heat dissipation effect and an improved brightness and a backlight unit using the same.

A light emitting diode (LED), which is a kind of semiconductor light emitting device, is a semiconductor device capable of generating light of various colors based on recombination of electrons and holes at a junction portion of a p and n type semiconductor when current is applied thereto.

Such light emitting diodes have a number of advantages, such as long life, low power, excellent initial driving characteristics, and high vibration resistance, compared to filament based light emitting devices.

In particular, group III nitride semiconductors capable of emitting light in a blue short wavelength region have recently been in the spotlight.

However, such light emitting diodes have increased luminance in comparison with currents. In particular, the light emitting diodes are weak in heat and have a limit in heat dissipation capability of the light emitting diodes. Therefore, the LEDs may be damaged when the current is too high.

Meanwhile, in the case of the light emitting module used in the LCD backlight unit, a cold cathode fluorescent lamp (CCFL) is conventionally used, but since CCFL uses mercury gas, it may cause environmental pollution and has a slow response speed. Not only is the color reproducibility low, it also has the disadvantage of being inadequate for thinning and shortening the LCD panel.

On the other hand, the light emitting diodes are environmentally friendly and can respond at high speeds of several nanoseconds, which is effective for video signal streams, and impulsive driving is possible.

In addition, the color reproducibility is 100% or more, and the brightness, color temperature, and the like can be arbitrarily changed by adjusting the amount of light of the red, green, and blue light emitting diodes. The situation is actively employed as a light emitting module.

One object of the present invention is to provide a light emitting module and a backlight unit using the same that have excellent heat dissipation and can improve product reliability at high temperature.

Another object of the present invention is to provide a light emitting module and a backlight unit using the same, by applying an additional current by the difference in temperature obtained through the heat dissipation effect to obtain high brightness light.

One aspect of the invention, the circuit board; A light source unit installed on the circuit board; An anode pattern portion formed in contact with the light source portion on the circuit board; A cathode pattern part formed on the circuit board to be spaced apart from the light source part and electrically connected to the light source part through a wire; A heat dissipation pattern part spaced apart from the cathode pattern part on the circuit board and in contact with the light source part; It provides a light emitting module comprising a.

In one embodiment of the present invention, the light source unit, the LED chip; A first bonding pad provided with the LED chip and having the anode pattern portion contacted with a bottom surface thereof; A second bonding pad contacting a bottom surface of the cathode pattern part and surrounding a portion of a circumference of the first bonding pad; It may include.

In one embodiment of the present invention, the circuit board may have a bar shape.

In one embodiment of the present invention, the light source unit is a plurality of, may be arranged along the longitudinal direction of the circuit board.

In one embodiment of the present invention, the anode pattern portion and the cathode pattern portion may be arranged along the longitudinal direction of the circuit board.

In one embodiment of the present invention, the heat dissipation pattern portion may be embedded along the longitudinal direction of the circuit board and protrude upward to contact the bottom surface of the first bonding pad at the position of the LED chip.

In one embodiment of the present invention, the heat radiation pattern portion may be made of any one of aluminum, copper, stainless, aluminum alloy, copper alloy, stainless alloy.

In one embodiment of the present invention, a lens may be further installed on the circuit board.

In this case, an auxiliary pad is disposed on an upper surface of the circuit board so as to be spaced apart from the first bonding pad so as to surround the other part, and a lens is disposed on the first bonding pad, the second bonding pad, and the auxiliary pad. Can be installed.

In one embodiment of the present invention, a zener diode electrically connected to the LED chip may be further installed.

In an embodiment of the present disclosure, the zener diode may be installed on the first bonding pad or spaced apart from the first bonding pad to face the other portion of the circuit board to face the first bonding pad to face the first bonding pad. Is installed, it may be installed to be electrically connected to the first bonding pad and the wire on the auxiliary pad.

Another aspect of the invention, the chassis having a storage space therein; A circuit board installed in the storage space of the chassis and having a plurality of light source unit mounting areas; An anode pattern portion formed in contact with the light source portion on the circuit board; A cathode pattern part formed on the circuit board to be spaced apart from the light source part and electrically connected to the light source part through a wire; A heat radiation pattern portion spaced apart from the cathode pattern portion on the circuit board and in contact with the light source portion; At least one light guide plate on the light emitting path of the light source unit; It provides a backlight unit comprising a.

In the case of the light emitting module according to an embodiment of the present invention, the heat of the light emitting diode can be quickly released through the heat dissipation pattern portion in contact with the bottom surface of the first bonding pad, thereby improving product reliability.

In addition, since the current can be additionally applied by the difference in temperature obtained through the heat dissipation effect, it is possible to obtain relatively high luminance light.

1 is a perspective view of a light emitting module according to an embodiment of the present invention.
2 is a plan view of a light emitting module according to an embodiment of the present invention.
3 is a sectional view taken along the line AA in Fig.
4 is a plan view schematically illustrating a light emitting diode package of a light emitting module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below.

Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

In this embodiment, for convenience of description, the direction in which the circuit board is extended is set to the left and right, the part in which the auxiliary pad is formed on the circuit board is set to the upper side, and the part in which the second bonding pad is formed on the circuit board is lowered. It will be set and explained.

1 to 4, the light emitting module according to the present embodiment includes a circuit board 100, at least one light source unit disposed on the circuit board 100, and a circuit board 100 to emit heat from the light source unit. It includes a heat radiation pattern portion 90 provided in).

In the present embodiment, a light emitting diode package is used as a light source unit, and the light emitting diode package, as shown in FIG. 4, is provided with a first bonding pad 20 and a second bonding pad installed on the circuit board 100 to be spaced apart from each other. 30) and, in some cases, may further include an auxiliary pad 10 around an upper portion of the first bonding pad 20.

In the drawings, only a pad, a light emitting diode, and a wire installed in the housing are selectively illustrated without a specific housing structure of the light emitting diode package.

This is to more easily explain the coupling relationship of the corresponding components, it will be general that each of the components shown in the drawings are packaged combined in a certain shape of the housing structure.

The first bonding pad 20 has a generally rectangular shape and the LED chip 40 is disposed on an upper surface thereof, and the second bonding pad 30 surrounds the lower half of the circumference of the first bonding pad 20. "It is made in a shape, the auxiliary pad 10 is made of a" ∩ "shape surrounding the upper half of the circumference of the first bonding pad (20).

The LED chip 40 emits light by receiving an electrical signal through a pattern part described later on the circuit board, and the first bonding pad 20 and the second bonding pad 30 through the conductive wires 62 and 63. Electrically connected.

In the present embodiment, a pair of electrodes connected to the LED chip is positioned on the upper portion, and the LED chip is connected to the anode pattern portion described later through the pair of conductive wires, but the connection method may vary depending on the embodiment. have.

For example, the LED chip may be directly electrically connected to the first bonding pad provided to the mounting area without using a wire, and only the second bonding pad may be connected to the wire.

As another example, the LED chip may be disposed on the first bonding pad in a so-called flip-chip bonding manner without a conductive wire.

In the present embodiment, only one LED chip is provided on the first bonding pad, but two or more LED chips may be provided.

Furthermore, although the conductive wire is shown as an example of the wiring structure, it may be appropriately replaced by another type of wiring structure, for example, a metal line, if it can perform the function of transmitting an electrical signal.

The circuit board 100 may be a printed circuit board (PCB), formed of an organic resin material containing epoxy, triazine, silicon, polyimide, or the like and other organic resin materials, or a ceramic material such as AlN, Al2O3, Or it may be formed of a metal and a metal compound as a material, may be MCPCB which is a kind of metal PCB.

That is, any substrate may be formed as long as the wiring structure for driving the light emitting diode 40 is formed on the surface where the light emitting diode package is mounted, and the wiring formed on the surface where the light emitting diode 40 of the circuit board 100 is mounted is through. It may be connected to the wiring formed on the opposite side through a hole or a bump (not shown).

The circuit board 100 is preferably formed in a bar shape, and the plurality of light emitting diode packages are arranged in a line along the length direction of the circuit board 100 on the bar-shaped circuit board 100. The manufacturing and assembly process of the BLU can be simplified.

In the circuit board 100, an anode pattern portion 70 is formed to be in contact with a bottom surface of the first bonding pad in a central portion of the upper surface of the circuit board 100, and a second bonding pad is disposed at a position spaced apart from the anode pattern portion 70 at a lower side thereof. The cathode pattern portion 80 is formed along the longitudinal direction to be in contact with the bottom of the 30.

The anode pattern portion 70 and the cathode pattern portion 80 are used as electrode terminals for applying an external electrical signal to the LED chip 40 electrically connected to the circuit board 100.

On this side of the circuit board 100, a wiring structure for supplying power to the LED chip is formed, and in order to supply power to the LED chip, the circuit board 100 has an anode pattern portion 70 and a cathode pattern portion 80. A power supply unit (not shown) electrically connected through) may be installed.

In the circuit board 100, a heat radiation pattern part 90, which absorbs heat generated from the LED chip 40 and emits heat to the outside along the length direction, is spaced apart from the cathode pattern part and is spaced apart from the top surface of the circuit board 100. It is embedded in a state spaced in a predetermined depth.

The heat dissipation pattern part 90 is formed in a convexly curved shape to the upper side at a predetermined interval corresponding to the interval where the first bonding pads 20 of the light emitting diode package are installed, and the convexly protruding portion 91 is It is configured to be in close contact with the bottom surface of the anode pattern portion 70 at the position of the first bonding pad 20.

Therefore, the heat generated from the LED chip 40 in the portion where heat is directly generated in the circuit board 100, that is, the portion where the first bonding pad 20 on which the LED chip 40 is located is installed, radiates heat by conduction phenomenon. After being rapidly absorbed into the pattern portion 90, the heat radiation pattern portion 90 flows through the longitudinal direction and is discharged to the outside.

The heat dissipation pattern unit 90 absorbs heat generated from the circuit board 100 and effectively releases the heat to the outside, such as aluminum, copper, stainless, aluminum alloys, copper alloys, stainless alloys, etc., which have excellent thermal conductivity. It may be made of a material, it is preferable to maximize the surface area in close contact with the first bonding pad 20 can increase the heat dissipation function.

In addition, the circuit board 100 and the heat dissipation pattern unit 90 use a thermal interface material (not shown) such as a heat dissipation pad, a phase change material, or a heat dissipation tape to minimize thermal resistance therebetween. Can be attached.

Then, the zener diode 50 may be further installed. This zener diode is mounted on the first bonding pad 20 and connected to the first bonding pad 20 through a wire 61, but the installation position is installed on the auxiliary pad 10 and the first bonding pad (wire) 20) can be changed in various ways. When the zener diode is installed outside the light emitting diode package, only a zener diode can be selectively replaced when a failure occurs in the zener diode.

On the other hand, conventionally, a pad equipped with an LED chip has an integrated structure in which the first bonding pad and the second bonding pad of the present embodiment are connected to each other. And the cathode pattern portion are connected to each other, so a short may occur because the anode and cathode flow directly without passing through the light emitting diode.

However, in the structure designed as in the present embodiment, since the heat dissipation pattern part 90 is in close contact with only the first bonding pad 20 where the LED chip 40 is located, that is, the anode pattern part 70 is connected, the short is prevented. It does not occur and can be connected in series and with zener diodes.

The hemispherical lens 110 may be installed on the first bonding pad 20, the second bonding pad 30, and the auxiliary pad 10 to cover the LED chip 40.

In addition, the light emitting module configured as described above may be installed in a chassis (not shown) having a storage space, and one or more light guide plates (not shown) may be disposed on the light emitting surface side of the light emitting module to manufacture a backlight unit.

The heat radiation effect of the heat radiation pattern portion 90 is shown in Tables 1 to 5.

N 1 and N 2 are conventional circuit boards, and T 1 and T 2 are circuit boards according to embodiments of the present invention, where N 1 and T 1, N 2 and T 2 represent different types of light emitting diode packages. .

Table 1 measures the temperature of the circuit board in units of 30 minutes, and Table 2 records and measures the temperature of the circuit board in units of 1 hour after 13 hours.

Table 3 is a graph showing the temperature change of Table 1, Table 4 is a graph showing the temperature change of Table 2, Table 5 is a graph showing the average value of Table 4.

Figure pat00001

Figure pat00002

Figure pat00003

Figure pat00004

Figure pat00005

Referring to this, it can be seen that the circuit board of the present embodiment has an excellent heat dissipation effect of about 5 to 7 ° C. compared with the conventional circuit board.

Therefore, a relatively high luminance of light can be obtained by additionally applying a current by the difference in temperature obtained through the heat radiation effect.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims.

It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10; Auxiliary pad 20; First bonding pad
30; Second bonding pad 40; LED chip
50; Zener diodes 61, 62, 63; wire
70; Anode pattern portion 80; Cathode pattern part
90; Heat dissipation pattern part 100; Circuit board
110; lens

Claims (18)

Circuit board;
A light source unit installed on the circuit board;
An anode pattern portion formed in contact with the light source portion on the circuit board;
A cathode pattern part formed on the circuit board to be spaced apart from the light source part and electrically connected to the light source part through a wire; And
A heat radiation pattern portion spaced apart from the cathode pattern portion on the circuit board and in contact with the light source portion; Light emitting module comprising a. The method of claim 1,
The light source unit includes:
LED chip;
A first bonding pad provided with the LED chip and having the anode pattern portion contacted with a bottom surface thereof;
A second bonding pad contacting a bottom surface of the cathode pattern part and surrounding a portion of a circumference of the first bonding pad; Light emitting module comprising a. The method according to claim 1 or 2,
The circuit board has a light emitting module, characterized in that the bar shape. The method of claim 3,
The light source module is a plurality of light emitting module, characterized in that arranged along the longitudinal direction of the circuit board. The method of claim 4, wherein
The anode pattern portion and the cathode pattern portion, characterized in that arranged in the longitudinal direction of the circuit board. The method of claim 5,
The heat dissipation pattern part is embedded along the longitudinal direction of the circuit board, and the light emitting module, characterized in that protruding upwardly in contact with the bottom surface of the first bonding pad at the position of the LED chip. The method of claim 6,
The heat dissipation pattern portion of the light emitting module, characterized in that made of any one of aluminum, copper, stainless, aluminum alloy, copper alloy, stainless alloy. The method according to claim 1 or 2,
The light emitting module, characterized in that the lens is further installed on the circuit board. The method of claim 2,
An auxiliary pad is provided on an upper surface of the circuit board so as to be spaced apart from the first bonding pad so as to face the other part of the circuit board.
The light emitting module, characterized in that the lens is further installed on the first bonding pad, the second bonding pad and the auxiliary pad. The method according to claim 1 or 2,
A light emitting module, characterized in that a zener diode electrically connected to the LED chip is further installed. The method of claim 10,
The zener diode is light emitting module, characterized in that installed on the first bonding pad. The method of claim 2,
An auxiliary pad is disposed on an upper surface of the circuit board to be spaced apart from the first bonding pad to face the first bonding pad so as to surround the other part.
And a zener diode electrically connected to the first bonding pad through a wire on the auxiliary pad. A chassis having a storage space therein;
A circuit board installed in the storage space of the chassis and having a plurality of light source unit mounting areas;
An anode pattern portion formed in contact with the light source portion on the circuit board;
A cathode pattern part formed on the circuit board to be spaced apart from the light source part and electrically connected to the light source part through a wire;
A heat radiation pattern portion spaced apart from the cathode pattern portion on the circuit board and in contact with the light source portion; And
At least one light guide plate on the light emitting path of the light source unit; Backlight unit comprising a. The method of claim 13,
The light source unit includes:
LED chip;
A first bonding pad provided with the LED chip and having the anode pattern portion contacted with a bottom surface thereof;
A second bonding pad contacting a bottom surface of the cathode pattern part and surrounding a portion of a circumference of the first bonding pad; Backlight unit comprising a. The method according to claim 13 or 14,
And the circuit board has a bar shape. 16. The method of claim 15,
The light source unit is a plurality of backlight unit, characterized in that arranged along the longitudinal direction of the circuit board. The method of claim 16,
And the anode pattern portion and the cathode pattern portion are arranged along a length direction of the circuit board. 18. The method of claim 17,
The heat dissipation pattern part is built in the longitudinal direction of the circuit board, the backlight unit, characterized in that protruding upward to contact the bottom surface of the first bonding pad at the position of the LED chip.
KR1020100128993A 2010-12-16 2010-12-16 Light emitting module and backlight unit using the same KR20120067542A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150077569A (en) * 2013-12-27 2015-07-08 삼성전자주식회사 Flip-chip Light Emitting Device package substrate and Light Emitting Device package structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150077569A (en) * 2013-12-27 2015-07-08 삼성전자주식회사 Flip-chip Light Emitting Device package substrate and Light Emitting Device package structure

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