KR20120063124A - Mother substrate device of electrophoretic display and method for manufacturing electrophoretic display using the same - Google Patents

Abstract

The present invention is a unit cell having an electrophoretic film; A base substrate on which the unit cells form an (m X n) matrix [m, n is an integer greater than 1]; A plurality of test pad units including a plurality of test pads for testing the unit cells and formed on one side of sides of the base substrate; And a plurality of connection lines formed on the base substrate and electrically connecting unit cells arranged in the same row among the unit cells to each other, and manufacturing a mother substrate for an electrophoretic display device and an electrophoretic display device using the same. It is about a method,
According to the present invention, by reducing the area occupied by the test pads on the mother substrate, it is possible to reduce the size of the mother substrate to reduce the material cost of manufacturing the mother substrate, and to implement a compact electrophoretic display device.

Description

Mother substrate for electrophoretic display device and method for manufacturing electrophoretic display device using the same

The present invention relates to an electrophoretic display device for displaying an image using an electrophoretic phenomenon.

An electrophoretic display device (EPD) refers to a device for displaying an image using an electrophoretic phenomenon in which colored charged particles move by an electric field applied from the outside. Here, the electrophoretic phenomenon refers to a phenomenon in which charged particles move in a liquid by a Coulomb force when an electric field is applied to an electrophoretic dispersion liquid in which charged particles are dispersed in a liquid.

Such an electrophoretic display device has a bisability, so that the original image can be preserved for a long time even if the applied voltage is removed. That is, the electrophoretic display device can maintain a constant screen for a long time without applying a voltage continuously, and thus is particularly suitable for the field of the e-book which does not require rapid replacement of the screen. In addition, unlike the liquid crystal display, the electrophoretic display device does not have a dependency on a viewing angle and has an advantage of providing an image that is comfortable to the eye to the extent that it is similar to paper.

The electrophoretic display device includes an electrophoretic display panel having an electrophoretic film, a substrate, and a protective sheet (PS). The electrophoretic film is formed between the substrate and the protective sheet. A thin film transistor (TFT) is formed on one surface of the substrate toward the electrophoretic film. The protective sheet is formed on the opposite side of the substrate based on the electrophoretic film. That is, the electrophoretic film is formed on the substrate, and the protective sheet is formed on the electrophoretic film. The electrophoretic display device is manufactured by the following process.

First, a mother substrate having a plurality of unit cells forming an electrophoretic display panel is manufactured. Next, the mother substrate is cut to separate the unit cells into a plurality of electrophoretic display panels. Next, each of the separated electrophoretic display panels is tested. Next, the driving chip or the like is connected to the electrophoretic display panel which is determined to be good according to the test result. The electrophoretic display device and its manufacturing method according to the prior art have the following problems.

First, according to the prior art, after cutting the mother substrate to separate the unit cells into a plurality of electrophoretic display panels, all of the separated electrophoretic display panels are tested. Accordingly, each of the unit cells should be provided with test pads for testing. These test pads occupy a significant area on the mother substrate. Therefore, according to the related art, since the test pads are provided for each of the unit cells, the material cost is increased and there is a problem in manufacturing a compact electrophoretic display device.

Second, the test of the separated electrophoretic display panels is performed by connecting probes of an auto probe device to the test pads. According to the related art, since the process of connecting the autoprobe equipment and the test pads is performed in order to test all of the separated electrophoretic display panels, it is necessary to test the separated electrophoretic display panels. There is a problem that takes considerable time.

The present invention has been made to solve the above problems, an object of the present invention by reducing the area occupied by the test pads on the mother substrate, it is possible to reduce the material cost, it is possible to manufacture a compact electrophoretic display device The present invention provides a method of manufacturing a mother substrate for an electrophoretic display and an electrophoretic display.

Another object of the present invention is to provide a method of manufacturing a mother substrate for an electrophoretic display device and an electrophoretic display device which can shorten the time required for the test process by reducing the number of times of connecting the test equipment and the test pads.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

A mother substrate for an electrophoretic display device according to the present invention comprises a unit cell having an electrophoretic film; A base substrate on which the unit cells form an (m X n) matrix [m, n is an integer greater than 1]; A plurality of test pad units including a plurality of test pads for testing the unit cells and formed on one side of sides of the base substrate; And a plurality of connection lines formed on the base substrate and electrically connecting unit cells arranged in the same row among the unit cells to each other. The test pad units may be electrically connected to the unit cells arranged in the same row of the unit cells, respectively, through the connection lines.

A mother substrate for an electrophoretic display device according to the present invention comprises a unit cell having an electrophoretic film; A base substrate on which the unit cells form an (m X n) matrix [m, n is an integer greater than 1]; A plurality of test pad units including a plurality of test pads for testing the unit cells and formed on one side of the sides of the base substrate; And a plurality of connection lines formed on the base substrate and electrically connecting the unit cells arranged in the same row among the unit cells. The test pad parts may be electrically connected to the unit cells arranged in the same row of the unit cells, respectively, through the connection lines.

Electrophoretic display device manufacturing method according to the present invention comprises the steps of manufacturing a mother substrate formed so that the unit cells having an electrophoretic film (m X n) matrix [m, n is an integer greater than 1]; Forming a plurality of connection lines for electrically connecting the unit cells arranged in the same row among the unit cells; Forming a plurality of test pad units having test pads electrically connected to the connection lines on any one of sides of the mother substrate; Connecting the probes to the test pads to test the mother substrate; And cutting the mother substrate to separate the unit cells. The testing of the mother substrate may include connecting a probe to the test pads electrically connected through the unit cells arranged in the same row and the connection lines.

Electrophoretic display device manufacturing method according to the present invention comprises the steps of manufacturing a mother substrate formed so that the unit cells having an electrophoretic film (m X n) matrix [m, n is an integer greater than 1]; Forming a plurality of connection lines for electrically connecting the unit cells arranged in the same row among the unit cells; Forming a plurality of test pad units having test pads electrically connected to the connection lines on any one of sides of the mother substrate; Connecting the probes to the test pads to test the mother substrate; And cutting the mother substrate to separate the unit cells. The testing of the mother substrate may include connecting a probe to the test pads electrically connected through the unit cells and the connection lines arranged in the same row of the unit cells.

According to the present invention, the following effects can be achieved.

According to the present invention, by reducing the area occupied by the test pads on the mother substrate, the size of the mother substrate can be reduced to reduce the material cost required to manufacture the mother substrate, and a compact electrophoretic display device can be realized.

The present invention can shorten the time required for the test process by reducing the number of times the test equipment and the test pads are connected to test the unit cells, thereby improving the productivity for manufacturing the electrophoretic display device. .

1 is a schematic perspective view of a mother substrate for an electrophoretic display device according to the present invention;
FIG. 2 is an enlarged cross-sectional view of the line II for the portion A of FIG. 1. FIG.
3 is a conceptual diagram of a mother substrate for an electrophoretic display device according to the present invention;
4 is an enlarged view of a portion B of FIG.
5 is a conceptual diagram of a mother substrate for an electrophoretic display according to a modified embodiment of the present invention.
6 is a flowchart of a method of manufacturing an electrophoretic display device according to the present invention.
7 is a flowchart illustrating a method of manufacturing an electrophoretic display device according to a modified embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a mother substrate for an electrophoretic display device according to the present invention will be described in detail.

The technical idea of the present invention may be applied to all electrophoretic display devices regardless of color implementation. Hereinafter, the present invention will be described by taking a mono type electrophoretic display device that implements only black and white for convenience of description. . That is, the technical idea of the present invention disclosed below, as well as an electrophoretic display device further including a color filter, of the electrophoretic display device in which the charged particles in the electrophoretic dispersion are colored red, blue, green or white. The same may be applied to the case.

In describing embodiments of the present invention, when a structure is described as being formed "on" or "below" another structure, such a description may include a third between these structures as well as the structures in contact with each other. It is to be interpreted as including if the structure of is included. However, where the term "immediately above" or "immediately below" is used, it is to be construed that these structures are limited to being in contact with each other.

1 is a schematic perspective view of a mother substrate for an electrophoretic display according to the present invention, FIG. 2 is an enlarged cross-sectional view of the line II for the portion A of FIG. 1, FIG. 4 is an enlarged view of a portion B of FIG. 3.

1 to 3, a mother substrate 1 for an electrophoretic display device according to the present invention includes a plurality of unit cells 3 formed on the base substrate 2 and the same column among the unit cells 3. Or a plurality of connection lines 4 for electrically connecting the unit cells 3 arranged in the same row to each other, and a plurality of test pad units 5 electrically connected to the connection lines 4. . The unit cells 3 each include an electrophoretic film 31.

In the mother substrate 1 for the electrophoretic display device according to the present invention, when a test equipment (not shown) is connected to the test pad unit 5, the test equipment is connected to the test pad unit 5 and the connection line 4. The plurality of unit cells 3 may be electrically connected to the unit cells 3 arranged in the same column or the same row. Therefore, the mother substrate 1 for the electrophoretic display device according to the present invention can achieve the following effects.

First, the mother substrate 1 for the electrophoretic display device according to the present invention is connected to the test pad unit 5 by the test equipment, so that the unit is connected through the test pad unit 5 and the connection lines 4. The unit cells 3 arranged in the same column or the same row among the cells 3 may be implemented to be simultaneously tested. Therefore, the mother substrate 1 for the electrophoretic display device according to the present invention can reduce the number of times the test equipment and the test pad unit 5 are connected to test the unit cells 3, and thus, the unit cell. (3) can reduce the time it takes to test. The test device may be an auto probe device, and probes included in the auto probe device may be connected to the test pad part 5.

Second, the mother substrate 1 for the electrophoretic display device according to the present invention allows the unit cells 3 arranged in the same column or the same row of the unit cells 3 to share the test pad unit 5. do. Accordingly, the mother substrate 1 for the electrophoretic display device according to the present invention has an area occupied by the test pad unit 5 when compared to the test pads provided in each of the unit cells 3 as in the prior art. Can be reduced. Therefore, the mother substrate 1 for the electrophoretic display device according to the present invention can reduce the material cost by reducing the area occupied by the test pad unit 5, and it is possible to manufacture a compact electrophoretic display device.

Hereinafter, the base substrate 2, the unit cell 3, the connection line 4, and the test pad unit 5 will be described in detail with reference to the accompanying drawings.

1 to 3, a plurality of unit cells 3 are formed on the base substrate 2. The unit cells 3 may be formed in the base substrate 2 in a (m X n) matrix [m, n is an integer greater than 1]. For example, as shown in FIG. 1, nine unit cells 3 may be formed in a matrix (3 × 3) in the base substrate 2. The base substrate 2 may be formed in a rectangular plate shape as a whole. The base substrate 2 may be a metal substrate. For example, the base substrate 2 may be formed of stainless steel.

1 and 2, the unit cell 3 includes an electrophoretic film 31. A plurality of unit cells 3 are formed on the base substrate 2, and each of the unit cells 3 has the electrophoretic film 31. The electrophoretic film 31 is bonded on the base substrate 2. The electrophoretic film 31 may be attached to and coupled to the base substrate 2.

The electrophoretic film 31 includes a microcapsule 311. The microcapsules 311 have an electrophoretic dispersion therein. The electrophoretic dispersion includes a dielectric solvent and positive and negatively charged particles 3111 and 3112 respectively dispersed in the dielectric solvent. The dielectric solvent is preferably transparent to ensure reflection brightness. 2 illustrates an electrophoretic dispersion in which positively charged black particles 3111 and negatively charged white particles 3112 are dispersed in a colorless dielectric solvent, but the electrophoretic dispersion of the present invention is not limited thereto. Electrophoretic dispersions in which charged white particles are dispersed in a dielectric solvent comprising a black dye may be used. The electrophoretic film 31 may be front-plane laminate (FPL). Although not shown, the mother substrate 1 for the electrophoretic display device according to the present invention may use a microcup type electrophoretic film 31.

The electrophoretic film 31 may include a base film 312, a common electrode 313, and an adhesive layer 314. The electrophoretic film 31 may have a structure in which the base film 312, the common electrode 313, the microcapsules 311, and the adhesive layer 314 are sequentially stacked. The microcapsules 311 are positioned between the common electrode 313 and the adhesive layer 314. The base film 312 is formed on the common electrode 313 and may be formed of glass or plastic. The common electrode 313 may be formed of indium tin oxide (ITO) or indium zinc oxide (IZO). The base film 312 and the common electrode 313 may be transparently formed to display an image. The adhesive layer 314 may be attached to the base substrate 2. The electrophoretic film 31 is stored and transported in a state where a release film (not shown) is attached to the adhesive layer 314, and then the base film is removed immediately before being laminated to the base substrate 2, and then the base substrate. (2) can be attached and bonded on.

1 and 2, the unit cells 3 may each include a protective sheet 32 attached to the electrophoretic film 31. The protective sheet 32 may be formed in a square plate shape as a whole. Sealing patterns (not shown) may be formed on the outer circumferential surfaces of the electrophoretic films 31 to block the electrophoretic films 31 positioned between the protective sheet 32 and the base substrate 2 from the outside. have. In the mother substrate 1 for the electrophoretic display device according to the present invention, one protective sheet 32 may be attached to all of the electrophoretic films 31, and a plurality of protective sheets 32 may be used for the electrophoretic film. 31 may be attached to each.

1 and 2, each of the unit cells 3 includes a thin film transistor T formed on a base substrate 2, and a pixel electrode 380 electrically connected to the thin film transistor T. . When the base substrate 2 is a metal substrate, the thin film transistor T cannot be formed directly on the base substrate 2 because the base substrate 2 is a conductor. Thus, for insulation and planarization, the unit cells 3 may each include an organic layer 331 formed on the base substrate 2. The reason why the organic film layer 331 is formed instead of the inorganic film is that it is difficult to form a film having a predetermined thickness or more, and the surface roughness of the film is weak. In consideration of the weak adhesion between the organic layer 331 and the metal, the outgas generated from the organic layer 331 may damage the metal, etc. It may include a barrier layer 332 formed on the film layer 331. The organic layer 331 may be formed of, for example, photoacryl, and the barrier layer 332 may be formed of silicon nitride (SiNx).

Hereinafter, an embodiment of the configuration of each of the unit cells 3 will be described in detail with reference to FIG. 2.

A gate electrode 341 is formed on the barrier layer 332. The gate electrode 341 is a single film made of silver (Ag), aluminum (Al), or an alloy thereof having low resistivity, or chromium (Cr) having excellent electrical properties in addition to the single film. It may be a multilayer film further comprising a film made of titanium (Ti) or tantalum (Ta).

A gate insulating film 342 is formed on the entire surface of the barrier layer 332 including the gate electrode 341. The gate insulating film 342 may be a silicon nitride (SiNx) film (hereinafter referred to as a 'nitride film').

The semiconductor layer 343, the source electrode 344, and the drain electrode 345 are formed on the gate insulating layer 342. The semiconductor layer 343 is formed on an area of the gate insulating film 342 corresponding to the gate electrode 341. The source electrode 344 and the drain electrode 345 are formed to be spaced apart from each other, and partially overlap the semiconductor layer 343. The source electrode 344 and the drain electrode 345 are a single layer made of silver (Ag), aluminum (Al), or an alloy thereof, or in addition to such a single layer, chromium (Cr) and titanium ( Ti), or may be a multilayer film further comprising a film made of tantalum (Ta). Although not shown, an ohmic contact layer may be further formed between the source electrode 344 and the semiconductor layer 343 and between the drain electrode 345 and the semiconductor layer 343. The gate electrode 341, the gate insulating layer 342, the semiconductor layer 343, the source electrode 344, and the drain electrode 345 form a thin film transistor (T).

A first passivation layer 350, a dielectric layer 360, a second passivation layer 370, and the pixel electrode 380 may be sequentially formed on the gate insulating layer 342 including the thin film transistor T. . The pixel electrode 380 is connected to the drain electrode 345 through a through hole passing through the first passivation layer 350, the dielectric layer 360, and the second passivation layer 370. The pixel electrode 380 may be formed of copper, aluminum, ITO, or the like. The pixel electrode 380 may be formed to cover all of the gate lines G1 to Gn (shown in FIG. 4), the data lines D1 to Dm, shown in FIG. 4, and the thin film transistor T. . By such a structure, the area of the pixel electrode 380 can be maximized, and as a result, an electrophoretic display device having improved reflectance can be realized.

The dielectric layer 360 is disposed between the pixel electrode 380 and the gate line G1 to Gn (shown in FIG. 4) and between the pixel electrode 380 and the data line D1 to Dm (shown in FIG. 4). Can be formed. The dielectric layer 360 may be formed of a material having a low dielectric constant. For example, the dielectric layer 360 may be formed of an organic material having a low dielectric constant such as photoacryl or polyimide.

The first passivation layer 350 and the second passivation layer 370 may be nitride layers. Since the electrode material has a weak adhesion to organic material, between the dielectric film 360 and the source electrode 344 and the drain electrode 345 and between the dielectric film 360 and the pixel electrode 380. The first protective film 350 and the second protective film 370 formed of silicon nitride need to be interposed therebetween. In addition, the first passivation layer 350 and the second passivation layer 370 may protect the source electrode 344, the drain electrode 345, and the pixel electrode 380 from outgassing generated from the dielectric layer 360. It can have a function to.

2 to 4, each of the unit cells 3 may include a data pad unit 301 and a gate pad unit 302 for driving an active area AA (shown in FIG. 4). ), And the common voltage pad unit 303.

The active area 3a is an area where an image is displayed and is composed of a plurality of pixels 31a. The pixels 31a are arranged in a matrix form by crossing a plurality of data lines D1 to Dm and a plurality of gate lines G1 to Gn. Switching elements SW are formed in regions where the data lines D1 to Dm and the gate lines G1 to Gn cross each other. The switching device SW may be the thin film transistor T (shown in FIG. 2). The gate electrode 341 of each of the thin film transistors T is connected to any one of the gate lines G1 to Gn, and the source electrode 344 is one of the data lines D1 to Dm. The drain electrode 345 is connected to any one of the pixel electrodes 380 formed in the pixel 31a.

The data pad part 301 is supplied with a data voltage corresponding to the gray scale to be displayed. The data voltage is supplied to the data lines D1 to Dm through the data pad part 301. The gate pad part 302 is supplied with a scan pulse for controlling a switching operation of the switching elements SW. The scan pulse is supplied to the gate lines G1 to Gn through the gate pad part 302. The common voltage Vcom is supplied to the common voltage pad unit 303. The common voltage Vcom is supplied to the common electrodes 313 through the common voltage pad unit 303.

When the scan pulse supplied from the test equipment connected to the test pad unit 5 is supplied to the switching elements SW connected to the gate lines G1 to Gn through the gate pad unit 302, The switching elements SW are turned on in response to the scan pulse, so that the data voltages supplied to the data lines D1 to Dm through the data pad unit 302 correspond to the pixels ( Are applied to the pixel electrodes 380 of 31a. The pixel electrode 380 forms an electrophoretic capacitor Cep together with the common electrode 313, and simultaneously forms a storage capacitor Cst together with a storage electrode. The microcapsules 311 are positioned between the pixel electrode 380 and the common electrode 313. Therefore, when the data voltage and the common voltage Vcom are respectively applied to the pixel electrode 380 and the common electrode 313 from the test equipment connected to the test pad unit 5, the microcapsules 311 may be provided. The colored charged particles 3111 and 3112 are respectively moved to the electrodes of opposite polarities by the electrophoretic phenomenon so that an image is displayed on the pixel 31a.

2 to 4, each of the unit cells 3 may include a border pad unit 304 for driving a border area (BA) 3b (shown in FIG. 4).

The border area 3b is an area formed to prevent the active area 3a from being covered by the cover frame when the electrophoretic display device is coupled with a cover frame (not shown). The border area 3b may be formed in a frame shape outside the active area 3a. A border signal is supplied to the border pad unit 304 so that the border area 3b is driven in a color that can be harmonized with the cover frame. For example, when the color of the cover frame is black, a border signal for driving the border area 3b to black may be supplied to the border pad unit 304. When the color of the cover frame is white, a border signal for driving the border area 3b to white may be supplied to the border pad unit 304. When a border signal is supplied from the test equipment connected to the test pad part 5, the border signal is supplied to the border area 3b through the border pad part 304 and thus the border area 3b. Is driven in a color corresponding to the border signal.

3 and 4, the connection line 4 is formed on the base substrate 2. A plurality of connection lines 4 are formed on the base substrate 2. The connection lines 4 electrically connect the unit cells 3 arranged in the same row (Y-axis direction) among the unit cells 3. As shown in FIG. 4, based on the unit cells 3 forming one column, the mother substrate 1 for the electrophoretic display device according to the present invention has a data connection connected to the data pad unit 301. A line 41, a gate connection line 42 connected to the gate pad part 302, a common voltage connection line 43 connected to the common voltage pad part 303, and a border connected to the border pad part 304. It may include a connection line (44). The data connection line 41 includes a data odd connection line 411 connected to odd-numbered data lines among the data lines D1 to Dm, and one of the data lines D1 to Dm. A data even connection line 412 connected to even-numbered data lines may be included. The gate connection line 42 may include a gate odd connection line 421 connected to odd-numbered gate lines among the gate lines G1 to Gn, and one of the gate lines G1 to Gn. It may include a gate even connection line 422 connected to even-numbered gate lines. That is, the mother substrate 1 for the electrophoretic display device according to the present invention may include six connection lines 4 for each unit cell 3 forming one row. The connection lines 4 are formed to extend in the column direction (Y-axis direction), respectively, and branched in the row direction (X-axis direction) at the portion where each of the unit cells 3 are located, respectively, and the data pad part 301. ) May be electrically connected to the gate pad part 302, the common voltage pad part 303, and the border pad part 304. The connection lines 4 may be formed together in the process of forming the unit cells 3 on the base substrate 2 or may be formed through a separate process. In FIG. 3, the connection lines 4 connected to the unit cells 3 forming the same column are formed on the right side of the unit cells 3, but the present disclosure is not limited thereto and is formed on the left side of the unit cells 3. May be

3 and 4, the test pad part 5 is formed on the base substrate 2. A plurality of test pad portions 5 are formed on the base substrate 2. The test pad units 5 are electrically connected to the unit cells 3 arranged in the same row (Y-axis direction) of the unit cells 3 through the connection lines 4. Accordingly, in the mother substrate 1 for the electrophoretic display device according to the present invention, when test equipment (not shown) is connected to the test pad unit 5, the test equipment is connected to the test pad unit 5 and the test pad unit 5. The lines 4 may be electrically connected to the unit cells 3 arranged in the same row of the unit cells 3 at the same time. Accordingly, in the mother substrate 1 for the electrophoretic display device according to the present invention, the test equipment is connected to the test pad unit 5, thereby forming unit cells 3 arranged in the same row among the unit cells 3. ) Can be implemented to be tested simultaneously.

The test pad portions 5 may be formed on any one side of the sides of the base substrate 2. The base substrate 2 is formed to have four sides 2a, 2b, 2c, and 2d, and the test pad portions 5 are formed on one side of the sides 2a, 2b, 2c, and 2d. Can be. The test pads 5 may be formed on one side 2a of two sides 2a and 2c formed to face each other in the column direction (Y-axis direction) among the sides of the base substrate 2. have. As shown in FIG. 3, the test pad parts 5 may be formed on the side of the side 2a positioned above the portion where the unit cells 3 are formed on the base substrate 2. Accordingly, in the mother substrate 1 for the electrophoretic display device according to the present invention, the unit cells 3 arranged in the same row among the unit cells 3 share one test pad unit 5. do. Accordingly, the mother substrate 1 for the electrophoretic display device according to the present invention has an area occupied by the test pad parts 5 when compared to the test pads provided in each of the unit cells 3 as in the prior art. By reducing the material cost can be reduced, it is possible to manufacture a compact electrophoretic display device.

The mother substrate 1 for the electrophoretic display device according to the present invention may include the test pad units 5 in the same number as the number of columns formed by the unit cells 3. As shown in FIG. 3, when the unit cells 3 are formed in three rows, the mother substrate 1 for the electrophoretic display device according to the present invention may include three test pad parts 5. have. The test pad units 5 may be formed together in the process of forming the unit cells 3 on the base substrate 2 or may be formed through a separate process.

The test pad units 5 each include a plurality of test pads 51 (shown in FIG. 3) for testing the unit cells 3. The test pads 51 may be electrically connected to the connection lines 4, respectively, and thus may be electrically connected to the unit cells 3 arranged in the same row among the unit cells 3. . The test pad units 5 may include an active area test pad 511, a border area test pad 512, and a common voltage test pad 513, respectively.

The active area test pad 511 is connected to the data pad portions 301 and the gate pad portions 302 of the unit cells 3 arranged in the same row among the unit cells 3. The active area test pad 511 may be connected to the data connection line 41 and the gate connection line 42 to be connected to the data pad parts 301 and the gate pad parts 302. Accordingly, when a test signal is supplied from the test equipment connected to the active area test pad 511, the test signal is transmitted to the unit cell 3 through the data connection line 41 and the gate connection line 42. The data pads 301 and the gate pads 302 of the unit cells 3 arranged in the same column may be supplied. The active area test pad 511 may include a dataod test pad 5111 connected to the dataod connection line 411, a dataeven test pad 5112 connected to the dataeven connection line 412, and the gateod connection line. A gate odd test pad 5113 connected to 421 and a gate even test pad 5114 connected to the gate even connection line 422 may be included. Although not shown, an amplifier may be connected between the dataod test pad 5111 and the dataod connection line 411 and between the dataeven test pad 5112 and the dataeven connection line 412, respectively. .

The border area test pad 512 is connected to the border pad portions 304 of the unit cells 3 arranged in the same row among the unit cells 3. The border area test pad 512 may be connected to the border pad portions 304 by being connected to the border connection line 44. Accordingly, when a test signal is supplied from the test equipment connected to the border area test pad 512, the test signal is arranged in the same row among the unit cells 3 through the border connection line 44. The pads 304 may be supplied to the border pad portions 304 of the unit cells 3.

The common voltage test pad 513 is connected to the common voltage pad units 303 of the unit cells 3 arranged in the same row among the unit cells 3. The common voltage test pad 513 may be connected to the common voltage connection line 43 to be connected to the common voltage pad units 303. Accordingly, when a test signal is supplied from the test equipment connected to the common voltage test pad 513, the test signal is arranged in the same row among the unit cells 3 through the common voltage connection line 43. The common voltage pad units 303 of the unit cells 3 may be supplied.

Hereinafter, a mother substrate for an electrophoretic display device according to a modified embodiment of the present invention will be described in detail with reference to the accompanying drawings. Since the mother substrate for the electrophoretic display device according to the modified embodiment of the present invention may be configured to be substantially identical to the mother substrate for the electrophoretic display device according to the present invention described above, only the differences will be described. .

5 is a conceptual diagram of a mother substrate for an electrophoretic display according to a modified embodiment of the present invention.

Referring to FIG. 5, in the mother substrate 1 for the electrophoretic display device according to the modified embodiment of the present invention, the connection lines 4 form the same row (X-axis direction) among the unit cells 3. The unit cells 3 arranged may be electrically connected to each other. In this case, the test pad units 5 may be electrically connected to the unit cells 3 arranged in the same row (X-axis direction) of the unit cells 3 through the connection lines 4. . Accordingly, in the mother substrate 1 for the electrophoretic display device according to the modified embodiment of the present invention, when a test equipment (not shown) is connected to the test pad unit 5, the test equipment is connected to the test pad unit ( 5) and the connection lines 4 may be electrically connected to the unit cells 3 arranged in the same row of the unit cells 3 at the same time. Accordingly, in the mother substrate 1 for the electrophoretic display device according to the modified embodiment of the present invention, the test equipment is connected to the test pad unit 5, whereby the test pad unit 5 and the connection line 4 are provided. The unit cells 3 arranged in the same row among the unit cells 3 may be simultaneously tested.

In FIG. 5, one connection line 4 is connected to each of the unit cells 3 arranged in the same row (X-axis direction) of the unit cells 3, but the connection line 4 is connected thereto. As shown in FIG. 4, each of the data-out connection line 411, the data-even connection line 412, the gate-out connection line 421, the gate-even connection line 422, and the common voltage connection line, respectively. 43, and the border connection line 44. The connection lines 4 are formed to extend in a row direction (X-axis direction), respectively, and branched in a column direction (Y-axis direction) at each of the unit cells 3, respectively, to be positioned in the data pad part 301. ) May be electrically connected to the gate pad part 302, the common voltage pad part 303, and the border pad part 304. In FIG. 5, connection lines 4 connected to the unit cells 3 forming the same row (the X-axis direction) are formed below the unit cells 3, but the present invention is not limited thereto. ) May be formed above.

Referring to FIG. 5, the test pad units 5 may have two sides 2b facing each other in the row direction (X-axis direction) among the sides 2a, 2b, 2c and 2d of the base substrate 2. , 2d) may be formed on one side 2b side. As shown in FIG. 5, the test pad units 5 may be formed on the side of the side 2b positioned on the right side of the portion where the unit cells 3 are formed on the base substrate 2. Accordingly, in the mother substrate 1 for the electrophoretic display device according to the modified embodiment of the present invention, each of the unit cells 3 arranged in the same row among the unit cells 3 has one test pad unit ( 5) will be shared. Accordingly, the mother substrate 1 for the electrophoretic display device according to the modified embodiment of the present invention has the test pad part 5 as compared to the test pads provided in each of the unit cells 3 as in the prior art. By reducing the area occupied), the material cost can be reduced, and it is possible to manufacture a compact electrophoretic display device.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a method for manufacturing an electrophoretic display device according to the present invention will be described in detail.

6 is a flowchart of a method of manufacturing an electrophoretic display device according to the present invention.

1 to 4 and 6, the electrophoretic display device manufacturing method according to the present invention may use the mother substrate for the electrophoretic display device as described above, and includes the following configuration.

First, a mother substrate 1 is formed in which the unit cells 3 form an (m X n) matrix [m, n is an integer greater than 1] (S1). The process S1 may be performed by forming a plurality of unit cells 3 on the base substrate 2 through a thickening process and an etching process. For example, nine unit cells 3 forming a (3 × 3) matrix may be formed on the base substrate 2. In detail, it is as follows.

First, when the base substrate 2 is a metal substrate, the organic layer 331 and the barrier layer 332 are sequentially formed through the deposition process on the base substrate 2 (S11 and S12).

Next, the gate lines G1 to Gn and the gate electrode 341 are formed on the barrier layer 332, and an entire surface of the barrier layer 332 including the gate electrode 341 is formed. The gate insulating film 342 is deposited on the substrate.

Next, the semiconductor layer 343 is formed on the region of the gate insulating film 342 corresponding to the gate electrode 341.

Next, the data lines D1 to Dm, the source electrode 344 branched from the data lines D1 to Dm, and the drain electrode 345 are formed on the gate insulating layer 342. The drain electrode 345 is spaced apart from the source electrode 344, and partially overlaps the semiconductor layer 343. The gate electrode 341, the gate insulating layer 342, the semiconductor layer 343, the source electrode 344, and the drain electrode 345 constitute a thin film transistor T.

Next, the first protective layer 350 and the dielectric layer 360 are sequentially formed on the entire surface of the gate insulating layer 342 including the thin film transistor T, and then the contact hole (not shown). A portion of the dielectric layer 360 corresponding to the top surface of the dielectric layer 360 and a portion of the dielectric layer 360 corresponding to the periphery of the electrophoretic display device are selectively removed through an exposure and development process.

Next, the second passivation layer 370 is formed on the entire surface of the first passivation layer 350 including the dielectric layer 360. Next, the contact hole is formed by selectively removing portions of the first passivation layer 350 and the second passivation layer 170 corresponding to the contact hole through an anisotropic dry etching process.

Next, the pixel electrode 380 connected to the drain electrode 345 of the thin film transistor T is formed on the second passivation layer 170 through the contact hole.

Next, the electrophoretic film 31 having the base film 312, the common electrode 313, the microcapsules 311, and the adhesive layer 314 is attached to an upper surface of the base substrate 2. Let's do it. The electrophoretic film 31 may be attached to a surface on which the pixel electrode 380 is formed on the base substrate 2.

Next, attach the protective sheet 32 on the electrophoretic film (31). Subsequently, a sealing pattern is applied by applying a sealant to an outer circumferential surface of the electrophoretic film 31 to block the electrophoretic film 31 positioned between the protective sheet 32 and the base substrate 2 from the outside. To form. Through these processes, a plurality of unit cells 3 may be formed on the base substrate 2 (S1).

Next, a plurality of connection lines 4 are formed to electrically connect the unit cells 3 arranged in the same row (Y-axis direction) among the unit cells 3 (S2). The process S2 may be performed by forming the connection lines 4 on the base substrate 2 through a deposition process and an etching process. By such a process (S2), the connection lines 4 may be formed to electrically connect the unit cells 3 arranged in the same row (Y-axis direction) among the unit cells 3. As shown in FIG. 4, the connection lines 4 are respectively the data-order connection line 411, the data-even connection line 412, the gate-out connection line 421, and the gate-even connection line 422. ), The common voltage connection line 43, and the border connection line 44. The connection lines 4 are formed to extend in the column direction (Y-axis direction), respectively, and branched in the row direction (X-axis direction) at the portion where each of the unit cells 3 are located, respectively, and the data pad part 301. ), The gate pad parts 302, the common voltage pad parts 303, and the border pad parts 304 may be electrically connected to each other. The process S2 may be performed together with the process of forming the unit cells 3 on the base substrate 2, or may be performed through a separate process.

Next, a plurality of test pad units 5 having test pads 51 electrically connected to the connection lines 4 are formed on one side of the sides of the mother substrate 1 (S3). In the process S3, the test pads 5 are formed on one side 2a of the sides 2a, 2b, 2c, and 2d of the base substrate 2 through a deposition process and an etching process. This can be done by. By the process S3, the test pad units 5 are connected to the unit cells 3 arranged in the same row (Y-axis direction) among the unit cells 3 through the connection lines 4. It is formed to be electrically connected. In the process (S3), the test pad units 5 may be formed in the same number as the number of columns formed by the unit cells 3. As shown in FIG. 3, when the unit cells 3 are formed in three rows, three test pad units 5 may be formed in the method of manufacturing an electrophoretic display according to the present invention.

In the step S3, the test pad units 5 are formed to include a plurality of test pads 51 for testing the unit cells 3, respectively. The test pads 51 may be electrically connected to the connection lines 4, respectively, and thus may be electrically connected to the unit cells 3 arranged in the same row among the unit cells 3. . Each of the test pad units 5 includes the data odd test pad 5111 connected to the data odd connection line 411, the data even test pad 5112 and the gate odd connected to the data even connection line 412. The gate-out test pad 5113 connected to a connection line 421, the gate-even test pad 5114 connected to the gate-even connection line 422, and the border area test pad connected to the border connection line 44 ( 512, and the common voltage test pad 513 connected to the common voltage connection line 43. The process S3 may be performed together while the process of forming the unit cells 3 on the base substrate 2 is performed, or may be performed through a separate process.

Next, a probe (not shown) is connected to the test pads 51 to test the mother substrate 1 (S4). This process (S4) is a probe having a test equipment (not shown) is connected to the test pads (51) (S41), the test equipment by supplying a test signal to the test pad 51 (S42) Can be done. The unit cells 3 formed on the mother substrate 1 display a predetermined image according to the test signal, and can be tested through visual inspection from the state in which the image is displayed.

In the process (S41) in which the probe is connected to the test pads 51, the unit cells 3 and the connection line 4 arranged in the same row (Y-axis direction) among the unit cells 3 are provided. The probes may be connected to the test pads 51 electrically connected to each other through the pads. By the step S41, the active region test pad 511, the border region test pad 512, and the common unit for testing the unit cells 3 electrically connected to each other through the connection lines 4. The probe may be connected to the voltage test pad 513.

In the step (S41), the probe is the data order test pad 5111 connected to the data order connection line 411, the data even test pad 5112 connected to the dataeven connection line 412, the The gate area test pad 5113 connected to the gate-order connection line 421, the gate-even test pad 5114 connected to the gate-even connection line 422, and the border area test connected to the border connection line 44. The pad 512 may be connected to the common voltage test pad 513 connected to the common voltage connection line 43. The data-order connection line 411, the data-even connection line 412, the gate-out connection line 421, the gate-even connection line 422, the border connection line 44, and the common voltage connection line. Since 43 is electrically connected to the unit cells 3 arranged in the same row (Y-axis direction) of the unit cells 3, the test equipment is the same as the unit cells 3. The unit cells 3 arranged in a row (Y-axis direction) may be electrically connected at the same time, and the unit cells 3 may be simultaneously tested.

Here, the test pad units 5 electrically connected to the unit cells 3 arranged in the same column (Y-axis direction) of the unit cells 3 are arranged in the row direction (X-axis direction). For example, as shown in FIG. 3, when the unit cells 3 are formed in a (3 X 3) matrix, three test pad units 5 are formed in a row direction (X axis direction). The test pad units 5 are electrically connected to the three unit cells 3 arranged in the column direction (Y-axis direction), respectively, through the connection lines 4. The process S41 may be performed by sequentially connecting the test equipment to the test pad units 51 arranged in the row direction (X-axis direction). In this case, after the test of the unit cells 3 forming one row is completed, the unit cells 3 forming another row by moving at least one of the probe and the mother substrate 1 included in the test equipment. A test may be made for. The process S41 may be performed by simultaneously connecting the test equipment to the test pad units 5 arranged in the row direction (X-axis direction) and simultaneously testing all of the unit cells 3. In this case, the test equipment may include the same number of probes as the number of columns formed by the unit cells 3.

Next, the mother substrate 1 is cut to separate the unit cells 3 (S5). The process S5 may be performed by cutting the mother substrate 1 along the boundary lines formed by the unit cells 3 using a scribing device or the like. By the process S5, an electrophoretic display panel including the unit cells 3 and the base substrate 2 may be manufactured. In the step (S5), the portion in which the test pad portion 5 is formed in the mother substrate 1 may be cut and separated.

1 to 4 and 6, the electrophoretic display device manufacturing method according to the present invention is to attach a carrier film equipped with a driving chip to each of the unit cells (3) determined to be good according to the test results The process may further include (S6). In this step (S6), after cutting the mother substrate (1) to separate the unit cells (3) (S5), performing the process of testing the mother substrate (1) according to the test result derived After classifying only the unit cells 3 which are determined to be good among the separated unit cells 3, the carrier film equipped with the driving chip may be attached to each of the unit cells 3 which are determined to be good. . In the process S6, the gate lines G1 to Gn and the data lines D1 to Dm of each of the unit cells 3 are transferred to the driving chip and the chip on film through the carrier film. Can be electrically connected). The carrier film may be attached using an anisotropic conductive film (ACF) (not shown). The carrier film may be connected to an external printed circuit board (PCB) (not shown) through a flexible printed circuit (FPC) (not shown).

Hereinafter, a method of manufacturing an electrophoretic display device according to a modified embodiment of the present invention will be described in detail with reference to the accompanying drawings. Since the electrophoretic display device manufacturing method according to the modified embodiment of the present invention may be configured to be substantially the same as the electrophoretic display device manufacturing method according to the present invention described above, only the differences will be described.

7 is a flowchart illustrating a method of manufacturing an electrophoretic display device according to a modified embodiment of the present invention.

4, 5, and 7, in the step S2 of forming the connection lines 4, the connection lines 4 are arranged in the same row (X-axis direction) of the unit cells 3. It can be made by being formed to electrically connect the unit cells (3) arranged to form each other. As shown in FIG. 5, the connection lines 4 are formed to extend in a row direction (X-axis direction), respectively, and in a column direction (Y-axis direction) at a portion where each of the unit cells 3 is located. Branching may be formed to be electrically connected to the data pad parts 301, the gate pad parts 302, the common voltage pad parts 303, and the border pad parts 304.

4, 5, and 7, in the step S3 of forming the test pad unit 5, the test pad units 5 are arranged in the same row (X-axis direction) of the unit cells 3. It may be made by being electrically connected to the unit cells (3) arranged in a form through the connecting line (4). The test pads 51 may be electrically connected to the unit cells 3 arranged in the same row of the unit cells 3 through the connection lines 4, respectively.

4, 5, and 7, in the step S41 of connecting the probes to the test pads 51, the units arranged in the same row (X-axis direction) of the unit cells 3 are arranged. The probe may be connected to the test pads 51 electrically connected to the cells 3 and the connection lines 4. Since the connection lines 4 are electrically connected to the unit cells 3 arranged in the same row (X-axis direction) of the unit cells 3, the test equipment is connected to the unit cell 3. Among the unit cells 3 arranged in the same row (X-axis direction) can be electrically connected at the same time, these unit cells 3 can be tested at the same time (S4).

Here, the test pad units 5 electrically connected to the unit cells 3 arranged in the same row (X-axis direction) of the unit cells 3 are arranged in the column direction (Y-axis direction). For example, as illustrated in FIG. 5, when the unit cells 3 are formed in a (3 × 3) matrix, three test pad units 5 are formed in a column direction (Y-axis direction). The test pad units 5 are electrically connected to three unit cells 3 arranged in a row direction (X-axis direction), respectively. The process S41 may be performed by sequentially connecting the test equipment to the test pad units 5 arranged in the column direction (Y-axis direction). In this case, after the test of the unit cells 3 forming one row is completed, the unit cells 3 forming another row by moving at least one of the probe and the mother substrate 1 included in the test equipment. A test may be made for. The process S41 may be performed by simultaneously connecting the test equipment to the test pad units 5 arranged in the column direction (Y-axis direction) and simultaneously testing all of the unit cells 3. In this case, the test equipment may include the same number of probes as the number of rows formed by the unit cells 3.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It will be clear to those who have knowledge.

DESCRIPTION OF SYMBOLS 1 Mother board for electrophoretic display 2 Base board 3 Unit cell
4 connection line 5 test pad 31 electrophoretic film 32 protective sheet
311: microcapsules 312: base film 313: common electrode 314: adhesive layer
41: data connection line 42: gate connection line 43: common voltage connection line
44: border connection line 411: data order connection line
412: Dataeven connection line 421: Gate-odd connection line
422: gate even connection line 51: test pad
5111: Data Order Test Pad 5112: Data Even Test Pad
5113: Gate-odd test pad 5114: Gate-even test pad
512: border area test pad 513: common voltage test pad

Claims (10)

A unit cell having an electrophoretic film;
A base substrate on which the unit cells form an (m X n) matrix [m, n is an integer greater than 1];
A plurality of test pad units including a plurality of test pads for testing the unit cells and formed on one side of sides of the base substrate; And
A plurality of connection lines formed on the base substrate and electrically connecting unit cells arranged in the same row among the unit cells to each other;
And the test pad parts are electrically connected to the unit cells arranged in the same row among the unit cells, respectively, through the connection lines. A unit cell having an electrophoretic film;
A base substrate on which the unit cells form an (m X n) matrix [m, n is an integer greater than 1];
A plurality of test pad units including a plurality of test pads for testing the unit cells and formed on one side of the sides of the base substrate; And
A plurality of connection lines formed on the base substrate and electrically connecting the unit cells arranged in the same row among the unit cells to each other;
And the test pad units are electrically connected to the unit cells arranged in the same row of the unit cells, respectively, through the connection lines. According to claim 1 or 2, wherein the test pad unit
An active area test pad connected to a data pad part and a gate pad part of the unit cells;
A border area test pad connected to a border pad part of the unit cells; And
And a common voltage test pad connected to the common voltage pad part of the unit cells. The mother substrate for an electrophoretic display device according to claim 1 or 2, wherein the base substrate is a metal substrate. The mother substrate of claim 4, wherein each of the unit cells comprises an organic layer formed on the metal substrate, and a barrier layer formed on the organic layer. Preparing a mother substrate in which unit cells having an electrophoretic film form an (m X n) matrix [m, n is an integer greater than 1];
Forming a plurality of connection lines for electrically connecting the unit cells arranged in the same row among the unit cells;
Forming a plurality of test pad units having test pads electrically connected to the connection lines on any one of sides of the mother substrate;
Connecting the probes to the test pads to test the mother substrate; And
Cutting the mother substrate to separate the unit cells;
The testing of the mother substrate includes connecting a probe to the test pads electrically connected through the unit cells and the connection lines arranged in the same row among the unit cells. . Preparing a mother substrate in which unit cells having an electrophoretic film form an (m X n) matrix [m, n is an integer greater than 1];
Forming a plurality of connection lines for electrically connecting the unit cells arranged in the same row among the unit cells;
Forming a plurality of test pad units having test pads electrically connected to the connection lines on any one of sides of the mother substrate;
Connecting the probes to the test pads to test the mother substrate; And
Cutting the mother substrate to separate the unit cells;
The testing of the mother substrate includes connecting a probe to the test pads electrically connected through the unit cells and the connection lines arranged in the same row of the unit cells. . The method according to claim 6 or 7,
And attaching a carrier film equipped with a driving chip to each of the unit cells, which are determined to be good, according to the test result. The method according to claim 6 or 7,
The manufacturing of the mother substrate includes forming an organic layer on a base substrate formed of a metal, and forming a barrier layer on the organic layer. The method according to claim 6 or 7,
The connecting of the probes to the test pads may include connecting the probes to an active area test pad, a border area test pad, and a common voltage test pad for testing unit cells electrically connected to each other through the connection lines. Method of manufacturing an electrophoretic display device.

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