KR20120060774A - Polyamine flux Composition and Method of Soldering - Google Patents

Abstract

PURPOSE: A polyamine flux composition is provided to have non-curing property, to connect reliable soldering connection, and to be customizable in order to be compatible with normal epoxy-based under fill material. CONSTITUTION: A polyamine flux composition comprises polyamine fluxing agent in chemical formula 1 as an initial component. In chemical formula 1, R^1, R^2, R^3 and R^4 is respectively and independently selected from hydrogen, a substituted or unsubstituted C1-80 alkyl group, and a substituted or unsubstituted C7-80 arylalkyl group, and R^7 is selected from a substituted or unsubstituted C5-80 alkyl group having at least two tertiary carbon elements, and a substituted or unsubstituted C12-80 arylalkyl group selected from the group consisting of at least two tertiary carbon.

Description

Polyamine flux Composition and Method of Soldering

The present invention relates to a polyamine flux composition comprising, as an initial component, a polyamine fluxing agent represented by the formula (I). In formula (I), R ¹ , R ² , R ³ and R ⁴ are hydrogen, substituted C _{1 -80} alkyl group, unsubstituted C _{1 -80} alkyl group, substituted C _{7 -80} arylalkyl group and non- Independently selected from cyclic C _{7 -80} arylalkyl groups; R ⁷ is an unsubstituted C _{5 -80} alkyl group having at least two tertiary carbons, a substituted C _{5 -80} alkyl group having at least two tertiary carbons, an unsubstituted C having at least two tertiary carbons _{12 -80} An arylalkyl group and a substituted C _{12 -80} arylalkyl group having at least two tertiary carbons; Wherein two nitrogens of formula (I) are independently bonded to one of at least two tertiary carbons of R ⁷ ; Provided that when the polyamine fluxing agent of formula (I) is represented by formula (Ia), 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen. The invention also relates to a method of soldering electrical contacts.

Soldering processes range from manual soldering to automated soldering. The use of flux materials in both manual and automated soldering processes is also well known. In fact, using only solder will not generally result in acceptable electrical interconnects. Flux materials have several functions in the soldering process. For example, the flux material functions to remove oxides that may be formed on metallic contacts (e.g., solder regions, contact pads, contact pins, copper plated through holes), and thus on the metallic contacts. Improves wetting of the solder.

Various methods have been adopted to apply the flux material to the surface of metallic contacts during the soldering process. In some methods, a flux material containing solder is used. For example, such combined materials have been provided in the form of annular shaped wires which incorporate a core of flux material. As the solder melts by heating, the flux material in the core is activated and fluxes the surface to be interconnected by the molten solder. Solder pastes are also known, in which flux materials and solder powders are compounded to form a suspension of solder particles in a generally homogeneous and stable paste.

Fabrication of semiconductor devices is one commercial and significant application of automated soldering methods. That is, a reflow soldering process is commonly used for automated production of semiconductor devices, in which a semiconductor chip is mounted on a printed circuit board (PCB). In some of these automated production methods, solder paste is applied to a printed circuit board, such as using screen printing or stencil printing. The semiconductor chip then comes into contact with the PCB and the solder paste is heated to reflow the solder in the paste, forming an electrical interconnect between the semiconductor chip and the PCB. Heating may be performed, for example, by exposing the solder paste to infrared light or heating in an oven. In some applications, the semiconductor chip / PCB assembly is further treated with an under fill material, which encapsulates the interconnect by substantially filling the interstitial area between the semiconductor chip and the PCB. .

BACKGROUND The demand for mass production of electronic devices with increased complexity and miniaturization circuits has led to the emergence of fast and automated soldering processes, such as those that incorporate pick and dip processes. In this process, flux can be applied to a plurality of electrical contacts on the semiconductor chip by dipping the electrical contact portion of the semiconductor chip into a flux bath. The flux coated electrical contacts on the semiconductor chip may then be brought into contact with the PCB including the corresponding electrical contacts and solder ball. The solder balls may then be heated to reflux the semiconductor chip and PCB. Alternatively, a pick and dip process may be employed with device components having electrical contacts pre-applied with solder. In this process, the pre-applied solder is dip coated with the flux material and then brought into contact with the corresponding electrical contact (s) and then heated to reflow to form the electrical interconnect. Many electronic components are tailored to this latter process category, where they are manufactured with a sufficient amount of solder on the substrate to enable interconnection of these components with other electrical components (eg, PCBs).

In most instances, the use of commercially useful fluxes leaves ionic residue on the soldered areas, which can undesirably lead to corrosion of the circuitry and short circuits. Thus, additional processing steps are required to remove such residue after formation of the soldered interconnect. In a semiconductor device manufacturing process, the resulting solder connection between the semiconductor chip and the PCB results in a relatively small gap between the semiconductor chip and the PCB (eg, less than 4 mils). Thus, it is very difficult to remove (or clean) the ionic residue remaining on the soldered area following the soldering process. Even in processes where the soldered area is accessible (and therefore clean operable), the clean operation creates environmental concerns related to the disposal of waste that occurs during the clean operation.

Some of the low residual, no-clean fluxes with low solids content are commercially available. One of the flux compositions claimed to substantially minimize or substantially remove flux residues when soldering electronic components is disclosed in US Patent Publication 20100175790 (Duchesne et al.). The matter composition disclosed herein comprises flux, wherein the flux consists essentially of a combination of (a) fluxing agent and (b) solvent, wherein the fluxing agent comprises keto acid or comprises ester acid or , A mixture of keto acid and ester acid, wherein the solvent comprises a mixture of a tacky solvent selected from polyhydric alcohols or mixtures thereof and a non-tacky solvent selected from monohydric alcohols or mixtures thereof.

Nevertheless, there remains a need for a fluxing agent that is non-curing and that can be customized to enable reliable soldering connections and to be compatible with conventional epoxy based underfill materials. .

The present invention provides, as an initial component, a polyamine flux composition comprising a polyamine fluxing agent represented by formula (I):

Wherein R ¹ , R ² , R ³ and R ⁴ are hydrogen, a substituted C _{1 -80} alkyl group, an unsubstituted C _{1 -80} alkyl group, a substituted C _{7 -80} arylalkyl group and an unsubstituted C _7-80 are independently selected from an aryl alkyl group; Wherein R ⁷ is an unsubstituted C _{5 -80} alkyl group having at least two tertiary carbons, a substituted C _{5 -80} alkyl group having at least two tertiary carbons, a non-substituted at least two tertiary carbons Ringed C _{12 -80} An arylalkyl group and a substituted C _{12 -80} arylalkyl group having at least two tertiary carbons; Wherein two nitrogens of formula (I) are individually bonded to one of at least two tertiary carbons of R ⁷ ; Provided that when the polyamine fluxing agent of formula (I) is represented by formula (Ia), 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen.

The present invention provides, as an initial component, a polyamine flux composition comprising a polyamine fluxing agent represented by the above formula (I); Wherein R ¹ , R ² , R ³ and R ⁴ are hydrogen, a substituted C _{1 -80} alkyl group, an unsubstituted C _{1 -80} alkyl group, a substituted C _{7 -80} arylalkyl group and an unsubstituted C _7-80 are independently selected from an aryl alkyl group; Wherein R ⁷ is an unsubstituted C _{5 -80} alkyl group having at least two tertiary carbons, a substituted C _{5 -80} alkyl group having at least two tertiary carbons, a non-substituted at least two tertiary carbons Ringed C _{12 -80} An arylalkyl group and a substituted C _{12 -80} arylalkyl group having at least two tertiary carbons; Wherein two nitrogens of formula (I) are individually bonded to one of at least two tertiary carbons of R ⁷ ; 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen.

The invention provides an electrical contact; Providing a polyamine flux composition of the invention; Applying the polyamine flux composition to the electrical contacts; Providing a solder; Melting the solder; Provided is a method of applying solder to an electrical contact, the method comprising replacing the polyamine flux composition applied to the electrical contact with molten solder, wherein the molten solder makes physical contacts with the electrical contact and couples to the electrical contact. .

The polyamine flux compositions of the present invention are readily designed for compatibility with various underfill compositions such that the soldered surface preferably does not require cleaning prior to applying the underfill composition to form the final electrical joint.

As used herein in the description and in the claims, the term "clean-free flux composition" refers to a polyamine flux composition with low or no polyamine flux residues having a halide content of less than 0.5% by weight (ie, IPC J). Polyamine fluxes classified as ORL1 or ORL0 under -STD-004B).

As used herein in the specification and in the claims, the term “flow free underfill composition” refers to a curable underfill formulation that exhibits both solder fluxing activity and latent curing to facilitate encapsulation of the soldered interconnect. Say.

The term "storage stability" as used in the description and claims herein with respect to curable underfill formulations (in one pack systems) refers to an increase in viscosity of the curable underfill formulations to less than 5% after storage at 55 ° C. for one week. Where viscosity is measured using a Brookfield DV-I + viscometer at 20 ° C. with the Brookfield # S00 spindle set at 100 rpm.

The term "storage stable" as used in the description and claims herein with respect to curable underfill formulations means that the curable underfill formulations represent storage stability.

The polyamine flux composition of the present invention comprises (essentially comprises) a polyamine fluxing agent represented by the formula (I) as an initial component. Preferably, the polyamine fluxing agent is a non-curable composition (i.e., the polyamine fluxing agent is free of compounds having two or more reactive functional groups per molecule capable of forming intermolecular covalent bonds under soldering conditions, and may form intermolecular covalent bonds under soldering conditions). May contain no more than two reactive functional groups per molecule).

The polyamine fluxing agent used in the polyamine flux composition of the present invention is a compound of formula (I), wherein R ¹ , R ² , R ³ and R ⁴ are hydrogen, substituted C _{1 -80} alkyl groups, unsubstituted Independently selected from C _{1 -80} alkyl groups, substituted C _{7 -80} arylalkyl groups and unsubstituted C _{7 -80} arylalkyl groups (preferably, R ¹ , R ² , R ³ and R ⁴ are hydrogen, substituted C _{1 -20} alkyl group, an unsubstituted C _{1 -20} alkyl group, a substituted C _{7 -30} Exchange Aryl group when the alkyl group and are independently selected from a C _{7 -30} arylalkyl group unsubstituted), with the proviso that the polyamine fluxing of formula (I) i represented by the formula ^{(Ia), R 1, R} 2, R 3 , and 0 to 3 of R ⁴ are hydrogen. Preferably, 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen. More preferably, one to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Even more preferably, two to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Even more preferably, two of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Most preferably, one of R ¹ and R ² is hydrogen and one of R ³ and R ⁴ is hydrogen. The R ¹ , R ² , R ³ and R ⁴ groups of the polyamine fluxing agent of formula (I) are preferably selected to provide a polyamine flux composition having the desired rheological properties for a given use; Optionally, make the given solvent package and polyamine fluxing agent compatible for delivery to the surface to be soldered; Optionally, polyamine fluxing with a given encapsulation composition (eg, epoxy resin) to be used after soldering to form an encapsulated solder joint (eg, for use in conventional flip chip under fill applications). Make me compatible Preferably, the R ¹ , R ² , R ³ and R ⁴ groups of the polyamine fluxing agent of formula (I) are selected such that the given encapsulating resin and the polyamine fluxing agent are compatible such that the polyamine flux composition is a no-clean flux composition or is curable. Make it an ingredient in the underfill formulation. In addition, the R ¹ , R ² , R ³ and R ⁴ groups of the polyamine fluxing agent of formula (I) are preferably selected so that the boiling point temperature determined by differential scanning calorimetry (DSC) is 125 ° C. or higher (preferably 250 ° C. or higher). Per cent weight loss upon heating to 250 ° C., determined by thermogravimetric analysis (TGA) using a temperature ramp of 10 ° C./min starting at 25 ° C.). It provides a polyamine fluxing agent that is 10% by weight or less.

More preferably, the polyamine fluxing agent used in the polyamine fluxing composition of the present invention is a compound of formula (I), wherein R ¹ , R ² , R ³ and R ⁴ are hydrogen, substituted C _{1 -80} alkyl Independently from the group, an unsubstituted C _{1 -80} alkyl group, a substituted C _{7 -80} arylalkyl group and an unsubstituted C _{7 -80} arylalkyl group; _{Wherein the} substituents of the substituted C _{1 -80} alkyl group and the substituted C _{7 -80} arylalkyl group are -OH group, -OR ⁵ group, -COR ⁵ -group, -COR ⁵ group, -C (O) R ⁵ groups, -CHO group, -COOR ⁵ group, -OC (O) OR ⁵ group, -S (O) (O) R ⁵ group, -S (O) R ⁵ group, -S (O) (O) NR ⁵ ₂ group, -OC (O) NR ⁶ ₂ group, -C (O) NR ⁶ ₂ group, -CN group, -N (R ⁶ )-group and -NO ₂ group; Here, R ⁵ is C _{1 -28} alkyl group, C _{3 -28} cycloalkyl group, C _{6 -15} aryl groups, C _{7 -28} are selected server to an arylalkyl group and C _{7 -28} alkyl aryl group; R ⁶ is selected from hydrogen, a C _{1 -28} alkyl group, a C _{3 -28} cycloalkyl group, a C _6-15 aryl group, a C _{7 -28} arylalkyl group and a C _{7 -28} alkylaryl group; 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Substituted C _{1 -80} alkyl groups and substituted C _{7 -80} arylalkyl groups can include a combination of substituents. For example, substituted C _{1 -80} alkyl groups and substituted C _{7 -80} arylalkyl groups can include one or more of the same type of substituents (eg, two —OH groups); May include one or more types of substituents (eg, -OH groups and -COR ⁵ -groups); It may include one or more types of substituents (eg, two -OH groups and two -COR ⁵ -groups) with one or more identical types of substituents. Preferably, one to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. More preferably, two to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Even more preferably, two of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Most preferably, one of R ¹ and R ² is hydrogen and one of R ³ and R ⁴ is hydrogen.

Even more preferably, the polyamine fluxing agent used in the polyamine fluxing composition of the present invention is a compound of formula (I), wherein R ¹ , R ² , R ³ and R ⁴ are hydrogen, substituted C _1-20 It is selected from an alkyl group, an unsubstituted C _{1 -20} alkyl group, a substituted C _{7 -30} aryl groups and unsubstituted C _7-30 arylalkyl group; Substituted C _{1 -20} alkyl groups, and substituted C _{7 -30} substituent of the arylalkyl group is a group -OH, -OR ⁸ groups, -COR ⁸ - group, -COR ⁸ group, -C (O) R ⁸ group, -CHO group, -COOR ⁸ group, -OC (O) OR ⁸ group, -S (O) (O) R ⁸ group, -S (O) R ⁸ group, -S (O) (O) NR ⁸ ₂ Group, -OC (O) NR ⁹ ₂ group, -C (O) NR ⁹ ₂ group, -CN group, -N (R ⁹ )-group and -NO ₂ group; Here, R ⁸ is selected from C _{1 -19} alkyl group, C _{3 -19} cycloalkyl group, C _{6 -15} aryl groups, C _{7 -19} aryl groups, and C _{7 -19} alkyl aryl group; R ⁹ is hydrogen, C _{1 -19} alkyl group, C _{3 -19} cycloalkyl group, C _{6 -15} aryl groups, C _{7 -19} are selected from aryl groups and C _{7 -19} alkyl aryl group; 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Substituted C _{1 -20} alkyl group and a substituted C _{7 -30} substituent of the aryl group may comprise a combination of substituent groups. For example, substituted C _{1 -80} alkyl groups and substituted C _{7 -80} arylalkyl groups can include one or more of the same type of substituents (eg, two —OH groups); May contain one or more types of substituents (eg, -OH groups and -COR ⁸ -groups); It may include one or more types of substituents (eg, two -OH groups and two -COR ⁸ -groups) with one or more identical types of substituents. Preferably, one to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. More preferably, two to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Even more preferably, two of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Most preferably, one of R ¹ and R ² is hydrogen and one of R ³ and R ⁴ is hydrogen.

Even more preferably, the polyamine fluxing agent used in the polyamine fluxing composition of the present invention is a compound of formula (I), wherein R ¹ , R ² , R ³ and R ⁴ are hydrogen, —CH ₂ CH (OH) ) R ¹⁰ and -CH ₂ CH (OH) CH ₂ -OR ¹⁰ group; Here, R ¹⁰ is selected from hydrogen, C _1-28 alkyl group, C _{3 -28} cycloalkyl group, C _{6 -16} aryl groups, C _{7 -28} arylalkyl group and C _7-28 alkylaryl group (preferably it, R ¹⁰ is C _{5 -10} alkyl groups, C _{6 -16} aryl groups, and C _{7 -16} alkylaryl groups thereof; most preferably, R ¹⁰ is C ₈ alkyl groups, C ₇ alkyl aryl groups and naphthyl Selected from the group); And 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Preferably, one to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. More preferably, two to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Even more preferably, two of R ¹ , R ² , R ³ and R ⁴ are hydrogen. Most preferably, one of R ¹ and R ² is hydrogen and one of R ³ and R ⁴ is hydrogen.

Preferably, the polyamine fluxing agent used in the polyamine fluxing composition of the present invention is a compound of formula (I), wherein R ⁷ is an unsubstituted C _{5 -80} alkyl group having at least two tertiary carbons, at least Substituted C _{5 -80} alkyl group having two tertiary carbons, unsubstituted C _{12 -80} having at least two tertiary carbons Arylalkyl group, and at least two selected from the C _{12 -80} substituted aryl group having one tertiary carbon (more preferably, R ⁷ is at least 2, the ring C, Beach having one tertiary carbon _5-20 alkyl group, the substituted C _{5 -20} C _{12 -50} substituted with the alkyl group, at least two tertiary unsubstituted C _{12 -50} aryl group having carbon and at least two tertiary carbon having at least two tertiary carbon aryl alkyl group thereof; even more preferably, R ⁷ is at least 2, the ring C, Beach having two tertiary carbon _5-15 alkyl group, a substituted C _{12 -50-alkyl} group having at least two tertiary carbon, selected from the C _{12 -50} substituted aryl group having at least two tertiary unsubstituted having a carbon C _{12 -50} aryl group and at least two tertiary carbon); _{Wherein the} substituents of the substituted C _{5 -80} alkyl group and the substituted C _{12 -80} arylalkyl group are -OH group, -OR ¹¹ group, -COR ¹¹ -group, -COR ¹¹ group, -C (O) R ¹¹ groups, -CHO group, -COOR ¹¹ group, -OC (O) OR ¹¹ group, -S (O) (O) R ¹¹ group, -S (O) R ¹¹ group, -S (O) (O) NR ¹¹ ₂ group, -OC (O) NR ¹² ₂ group, -C (O) NR ¹² ₂ group, -CN group, -N (R ¹² )-group and -NO ₂ group; _Wherein R ¹¹ is selected from a C _{1 -75} alkyl group, a C _{3 -75} cycloalkyl group, a C _{6 -75} aryl group, a C _{7 -75} arylalkyl group and a C _{7 -75} alkylaryl group; R ¹² is selected from hydrogen, a C _{1 -75} alkyl group, a C _{3 -75} cycloalkyl group, a C _{6 -75} aryl group, a C _{7 -75} arylalkyl group and a C _{7 -75} alkylaryl group. Preferably, the two nitrogens represented by formula (I) are separated into 4 to 8 carbon bridges (more preferably 4 to 6 carbon bridges; most preferably 5 carbon bridges); Here, the bridge is the chain between nitrogen with the fewest carbons.

The polyamine flux composition of the invention optionally further comprises a solvent. The solvent is optionally included in the polyamine flux composition of the present invention to facilitate the delivery of the polyamine fluxing agent to the surface or surfaces to be soldered. Preferably, the polyamine flux composition contains 8 to 95 weight percent solvent. The solvent used in the polyamine flux composition of the present invention is preferably a hydrocarbon (eg dodecane, tetradecane); Aromatic hydrocarbons such as benzene, toluene, xylene, trimethylbenzene, butyl benzoate, dodecylbenzene; Ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone; Ethers such as tetrahydrofuran, 1,4-dioxane, 1,3-dioxalan, dipropylene glycol dimethyl ether; Alcohols such as 2-methoxy-ethanol, 2-butoxyethanol, methanol, ethanol, isopropanol, α-terpineol, benzyl alcohol, 2-hexyldecanol); Esters such as ethyl acetate, ethyl lactate, butyl acetate, diethyl adipate, diethyl phthalate, diethylene glycol monobutyl acetate, d, l-ethyl lactate, methyl 2-hydroxyisobutyrate, propylene glycol monomethyl Ether acetate); And amides such as N-methylpyrrolidone, N, N-dimethylformamide and N, N-dimethylacetamide; Glycol derivatives such as cellosolve, butyl cellosolve; Glycols such as ethylene glycol; diethylene glycol; dipropylene glycol; triethylene glycol; hexylene glycol; 1,5-pentanediol); Glycol ethers such as propylene glycol monomethyl ether, methyl carbitol, butyl carbitol, triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl Ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, diethylene glycol-2-ethylhexyl ether); And petroleum solvents (eg petroleum ether, naphtha). More preferably, the solvent used in the polyamine flux composition of the present invention is methyl ethyl ketone; 2-propanol; Propylene glycol monomethyl ether; Propylene glycol monomethyl ether acetate; d, l-ethyl lactate and methyl 2-hydroxy isobutyrate. Most preferably, the solvent used in the polyamine flux composition of the present invention is propylene glycol monomethyl ether.

The polyamine flux composition of the present invention optionally further comprises a thickening agent. Preferably, the polyamine flux composition contains 0 to 30 weight percent thickener. Thickeners used in the polyamine flux compositions of the invention may be selected from non-curing resin materials (ie, less than two reactive functional groups per molecule), such as non-curable novolac resins.

The polyamine flux composition of the present invention optionally further comprises a thixotropic agent. Preferably, the polyamine flux composition contains 1 to 30% by weight of thixotropes. Thixotropes for use in the polyamine flux compositions of the invention include fatty acid amides such as stearamide, hydroxystearic acid bisamide; Fatty acid esters such as castor wax, beeswax, carnauba wax; Organic thixotropes (e.g. polyethylene glycol, polyethylene oxide, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, diglycerin monooleate, diglycerin laurate, decaglycerol oleate, diglycerine monolaurate Sorbitan laurate); Inorganic thixotropes (eg, silica powder, kaolin powder). Preferably, the thixotropes used are selected from polyethylene glycols and fatty acid amides.

The polyamine flux composition of the invention optionally further comprises an inorganic filler. Inorganic fillers include alumina, aluminum hydroxide, aluminosilicate, cordierite, lithium aluminum silicate, magnesium aluminate, magnesium hydroxide, clay, talc, antimony trioxide, antimony pentoxide ), Zinc oxide, colloidal silica, fused silica, glass powder, quartz powder and glass microspheres.

The polyamine flux composition of the invention optionally further comprises an antioxidant. Preferably, the polyamine flux composition of the present invention contains 0.01 to 30% by weight of antioxidant.

The polyamine flux compositions of the present invention may optionally contain matting agents, colorants, antifoams, dispersion stabilizers, chelating agents, thermoplastic particles, UV impermeable agents, flame retardants, leveling agents, adhesion promoters. It further comprises an additive selected from (adhesion promoters) and a reducing agent.

The polyamine flux composition of the present invention preferably comprises, as an initial component, from 3.99 to 100% by weight of a polyamine fluxing agent represented by the formula (I) (which consists essentially of). Preferably, the polyamine flux composition of the present invention comprises, as initial components, from 3.99 to 100% by weight of a polyamine fluxing agent represented by the formula (I), 0 to 95% by weight (preferably 8 to 95% by weight) of a solvent, 0 to 30 weight percent thickener, 0 to 30 weight percent (preferably 1 to 30 weight percent) thixotropes, and 0 to 30 weight percent (preferably 0.01 to 30 weight percent) antioxidants Include (mandatory).

The polyamine flux composition of the present invention can be used, for example, in the production of electronic components, electronic modules and printed circuit boards. The polyamine flux composition may be, for example, conventional techniques, including, for example, liquid spray techniques, liquid foaming techniques, pick and dip techniques, and wave techniques, or liquids or semisolids on silicon dies or substrates ( may be applied to the surface (s) to be soldered by other conventional techniques which may provide a semisolid.

The polyamine flux composition of the invention optionally further comprises a solder powder, wherein the polyamine flux composition is a solder paste. The solder powder is preferably selected from Sn / Pb, Sn / Ag, Sn / Ag / Cu, Sn / Cu, Sn / Zn, Sn / Zn / Bi, Sn / Zn / Bi / In, Sn / Bi and Sn / In (Preferably, the solder powder is 63 wt% Sn / 37 wt% Pb; 96.5 wt% Sn / 3.5 wt% Ag; 96 wt% Sn / 3.5 wt% Ag / 0.5 wt% Cu; 96.4 wt% % Sn / 2.9 wt% Ag / 0.5 wt% Cu; 96.5 wt% Sn / 3 wt% Ag / 0.5 wt% Cu; 42 wt% Sn / 58 wt% Bi; 99.3 wt% Sn / 0.7 wt% Cu; 91 wt % Sn / 9 wt% Zn and 89 wt% Sn / 8 wt% Zn / 3 wt% Bi).

The solder paste preferably comprises 1 to 50 wt% (more preferably 5 to 30 wt%, most preferably 5 to 15 wt%) of the polyamine fluxing agent of the present invention and 50 to 99 wt% solder powder. The solder paste may be compounded by conventional techniques, such as kneading and mixing the solder powder with the polyamine fluxing agent and using conventional equipment for such manipulations.

Solder pastes can be used, for example, in the production of electronic components, electronic modules and printed circuit boards. The solder paste may be applied to the surface (s) to be soldered by conventional techniques, including, for example, printing the solder paste through a conventional solder mask using a solder printer or screen printer.

The polyamine flux composition of the invention may optionally further comprise a resin component, wherein the polyamine flux composition is a curable underfill formulation. The resin component used in the curable underfill formulation of the present invention includes a substance having at least two oxirane groups per molecule. Preferably, the resin component used is an epoxy resin having at least two epoxide groups per molecule, for example substituted or unsubstituted aliphatic, cycloaliphatic, aromatic and heterocyclic polyepoxides. More preferably, the resin component is a bisphenol type epoxy resin (eg, bisphenol type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin); Aromatic diglycidyl ethers; Aromatic multifunctional glycidyl ethers; Epoxy resins selected from aliphatic diglycidyl ethers and aliphatic polyfunctional glycidyl ethers. Even more preferably, the resin component is a bisphenol type epoxy resin. Most preferably, the resin component is a bisphenol type epoxy resin. The curable underfill formulation preferably comprises 10 to 99% by weight (more preferably 20 to 90% by weight; even more preferably 30 to 75% by weight, most preferably 30 to 50% by weight) resin component. The resin component used in the curable underfill formulation of the present invention optionally further comprises a material having at least three oxirane groups per molecule. Materials having at least three oxirane groups per molecule are optionally included in the resin component to increase the glass transition temperature of the cured resin product and reduce the gelation time of the curable underfill composition.

The curable underfill composition optionally further includes a curing agent. If the curing agent is one capable of curing the resin component, conventional curing agents can be used together with the resin component and the polyamine fluxing agent. Typical hardeners include, for example, polyfunctional phenols, polyfunctional alcohols, amines, imidazole compounds, acid anhydrides, organophosphorus compounds and halides thereof. Preferably, any curing agent used initiates gelation of the resin component at a temperature of 225 ° C. or less (ie at temperatures below 225 ° C.), which allows solder reflow without interference and easy storage stability for curable underfill formulations in one pack systems. Hardening agent that does not act).

Curable underfill formulations optionally further include a reactive diluent. Preferably, any reactive diluent should exhibit a viscosity lower than the viscosity exhibited by the resin component (in its uncured form). The reactive diluent is preferably a monofunctional epoxy (e.g., C _{6 -28} alkyl glycidyl ether; C _{6 -28} fatty acid glycidyl ester; C _{6 -28} alkylphenol glycidyl ether) and any multifunctional epoxy (Eg, trimethylolpropane triglycidyl ether; diglycidyl aniline). If a reactive diluent is present, it may be used in an amount of less than 50% by weight (based on the weight of the resin component).

Curable underfill formulations optionally further include conventional air vents. Air vents are expected to increase the wetting of the surface to be soldered during solder reflow. If present, an air releasing agent may be used in an amount of less than 1 weight percent based on the total weight of the curable underfill formulation.

Curable underfill formulations optionally include conventional antifoaming agents. Defoamers are expected to increase the wetting of the surface to be soldered during solder reflow and to reduce the defects of gas inclusions in curing the curable amine flux composition. If present, antifoams may be used in amounts less than 1% by weight of the curable underfill formulation.

Curable underfill formulations optionally further include conventional adhesion promoters. Typical adhesion promoters include silanes such as glycidoxypropyl trimethoxysilane; γ-amino propyl tritosilane; Trimethoxysilylpropylated isocyanurate; β- (3,4-epoxycyclohexyl) ethyltriethoxysilane; Glycidopropyl diethoxymethylsilane; β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; γ-glycidoxypropyltriethoxysilane; γ-mercaptopropyltrimethoxysilane; N-β- (aminoethyl) -gamma-aminopropyltrimethoxysilane; Bis (trimethoxysilylpropyl) amine; And γ-ureidopropyltriethoxysilane. If an adhesion promoter is present, it may be used in an amount of less than 2% by weight of the curable underfill formulation.

Curable underfill formulations optionally further include conventional flame retardants. Typical flame retardants include bromo compounds (eg decabromodiphenyl ether, tetrabromobisphenol A, tetrabromophthalic anhydride, tribromophenol); Phosphorus compounds such as triphenyl phosphate, tricresyl phosphate, trixylyl phosphate, gresyl diphenyl phosphate); Metal hydroxides such as magnesium hydroxide, aluminum hydroxide; Red phosphorus and its modified products; Annimon compounds such as antimony trioxide, antimony pentoxide; And triazine compounds such as melamine, cyanuric acid, melamine cyanurate. If a flame retardant is present, it may be used in an amount of 0.01 to 35% by weight (preferably 0.01 to 10% by weight) of the curable underfill formulation.

Polyamine fluxing agents used in the polyamine flux compositions of the present invention can be prepared using conventional synthetic techniques well known to those skilled in the art.

The method of applying the solder to electrical contact comprises the steps of providing an electrical contact; Providing a polyamine flux composition of the invention; Applying the polyamine flux composition to the electrical contact; Providing a solder; Melting the solder; And displacing the polyamine flux composition applied to the electrical contact with molten solder, wherein the molten solder makes physical contact with the electrical contact and couples to the electrical contact. In this method, the molten solder is preferably in intimate contact with the electrical contact to enable the formation of a metallic bond between the solder material and the electrical contact, thus providing good mechanical and electrical contact between the solder and the electrical contact. Provide a bond. Any conventional soldering technique can be used in the method of the present invention. For example, a soldering bit or iron may be used to heat the electrical contact and solder to a temperature above the melting point temperature of the solder. Soldering baths may also be used, in which liquid solder can be transferred to electrical contacts by immersing the electrical contacts in the molten solder. Conventional wave soldering techniques may also be implemented. Reflow soldering techniques may also be used, wherein the solder pre-deposited on the second electrical contact is brought into proximity to the first electrical contact and heated to a temperature above the melting temperature of the solder to melt and reflow the solder. The electrical contact is brought into contact with both the first electrical contact and the second electrical contact to form an electrical contact between the first electrical contact and the second electrical contact.

The method of the present invention for applying solder to electrical contacts can optionally be part of a flip chip soldering process, where a semiconductor chip comprising a plurality of first electrical contacts comprises a plurality of second electrical contacts. Mounted on the substrate. In such a flip chip method, the polyamine flux composition of the present invention is applied to either or both of a plurality of first electrical contacts and a plurality of second electrical contacts, thereby providing a plurality of second electrical contacts of the plurality of first electrical contacts. This allows for soldered coupling to form an electrical interconnect. Preferably, the flip chip soldering process further includes an underfill step, where a thermosetting resin is provided to encapsulate the electrical interconnect. Most preferably, the thermosetting resin is an epoxy resin.

Some embodiments of the invention are described in more detail in the following examples.

Example  One: Polyamine Fluxing agent  synthesis

A 2,6-diamino-2,5,6-trimethylheptan-3-ol polyamine fluxing agent was prepared using the following procedure. First, 2,5,6-trimethyl-2,6-dinitroheptan-3-ol intermediate was prepared using the following synthesis method.

Specifically, the three necked round bottom flask was equipped with a stir bar, thermocouple, dropping funnel capped with a nitrogen inlet and condenser. Next, 2-nitropropane (50 g, 0.56 mols, 5.0 equivalents) and a catalytic amount of 1,8-diazabicyclo [5.4.0] undec-7-ene were added to the flask. The flask contents were then stirred under nitrogen for 30 minutes. Next, crotonaldehyde (7.9 g, 9.2 mL, 0.112 moles, 1.0 equivalent) was added dropwise to the flask over 20 minutes. The flask contents were then stirred for 5-6 hours under nitrogen during which a white solid was observed to precipitate out of solution. At this point, GC analysis showed no crotonaldehyde present in the reaction mixture. The flask contents were allowed to stir overnight under nitrogen. The precipitate was then vacuum filtered from the solution and washed thoroughly with water to yield a white solid. The intermediate solids were air dried and then vacuum dried at 45 ° C. The overall yield of the desired intermediate dinitro alcohol was 72% (27.8 g). Nuclear magnetic resonance test (NMR) and liquid chromatography (LC) showed intermediate purity of at least 99%.

Next, a 2,6-diamino-2,5,6-trimethylheptan-3-ol polyamine fluxing agent, which is a product from intermediate dinitro alcohol, was prepared using the following synthesis method.

Specifically, 25 g of intermediate dinitro alcohol were dissolved in 200 mL methanol with 14.2 g of RaNi 3111 as catalyst. The mixture was then hydrogenated in an autoclave at 60 ° C. under a hydrogen pressure of 4137 kPa (600 psi). After workup involving catalyst filtration and methanol removal, 11 g (59% yield) of low viscosity liquid product were obtained. NMR and gas chromatograph-mass spectrometry (GC-MS) confirmed the presence of the desired product, 2,6-diamino-2,5,6-trimethylheptan-3-ol polyamine fluxing agent. Chemical ionization mass spectrometry (CI-MS) showed [M + H] = 189, and GC analysis showed that the purity of the product was 94%. The boiling point of this material was 125 ° C to 135 ° C at 0.68 kPa (5.1 torr). ¹³ C NMR (CDCl ₃ ): δ 16.8, 25.2, 27.9, 30.8, 34.7, 42.2, 51.8, 52.8 and 77.3 ppm.

Example  2: Polyamine Fluxing agent  synthesis

A 2,6-diamino-2,6-dimethyl-5-phenylheptan-3-ol polyamine fluxing agent was prepared using the following procedure. First, 2,6-dimethyl-2,6-dinitro-5-phenylheptan-3-ol intermediate was prepared using the following synthesis method.

Specifically, the three necked round bottom flask was equipped with a stir bar, thermocouple, dropping funnel capped with a nitrogen inlet and condenser. Next, 2-nitropropane (101.1 g, 1.14 mol, 6.0 equivalents) and a catalytic amount of 1,8-diazabicyclo [5.4.0] undec-7-ene (DBU) were added to the flask. The flask contents were then stirred for 20 minutes under nitrogen. Next, trans-cinnaaldehyde (25.0 g, 0.19 mol, 1.0 equivalent) was added dropwise to the flask over 20 minutes. During the addition of trans-cinnamaldehyde, an exotherm of about 22 ° C. was observed. After the addition of trans-cinnaaldehyde was complete, the flask contents were then heated to 50 ° C. and held at this temperature for 4 hours. The mixture was then allowed to cool to room temperature. When the flask contents reached 36.8 ° C., a pale yellow solid emerged from the solution. The flask contents were then filtered with a Buchner funnel and the recovered intermediate diamino alcohol powder was washed thoroughly with pentane and ether. The recovered intermediate diamino alcohol powder was then left to dry for 1 hour under vacuum. The overall yield of the desired diamino alcohol intermediate was 62% (36 g). NMR analysis showed that the purity of the diamino alcohol intermediate was greater than 99%. ¹ H NMR (CDCl ₃ ): δ 1.45-2.27 (m, 15H), 3.52-3.54 (m, 1H), 3.67-3.74 (m, 1H), 7.17-7.34 (m, 5H). ¹³ C NMR (CDCl ₃ ): δ 20.8, 22.4, 23.2, 25.8, 31.3, 50.3, 72.9, 91.5, 91.6, 128.1, 128.7, 129.4, 136.6 ppm.

Next, a 2,6-diamino-2,6-dimethyl-5-phenylheptan-3-ol polyamine fluxing agent, which is a product from dinitro alcohol intermediate, was prepared using the following synthesis method.

Specifically, 50 g of dinitro alcohol intermediate was dissolved in 300 mL methanol with 24.3 g of RaNi 3111 as catalyst. The mixture was then hydrogenated in an autoclave at 60 ° C. under a hydrogen pressure of 4137 kPa (600 psi). After workup involving catalyst filtration and methanol removal, 40 g (68% yield) of high viscosity liquid product were obtained. NMR and gas chromatograph-mass spectrometry (GC-MS) confirmed the presence of the desired product, 2,6-diamino-2,6-dimethyl-5-phenylheptan-3-ol polyamine fluxing agent. Chemical ionization mass spectrometry (CI-MS) showed [M + H] = 251 and GC analysis showed that the purity of the product was 78% directly from the autoclave. The remainder of the material present was seen as a mono adduct obtained from the reverse of the Henry reaction. The product was then purified by vacuum distillation to yield a purity of 96.2%. The boiling point of the purified product was measured from 150 ° C. to 160 ° C. at 0.67 kPa (5.0 torr). ¹ H NMR (CDCl ₃ ): δ 0.91-0.99 (m, 12H), 1.67-1.81 (m, 3H), 2.71-2.76 (m, 2H), 7.08-7.23 (m, 5H). ¹³ C NMR (CDCl ₃ ): δ 24.6, 27.9, 28.3, 29.8, 31.6, 51.8, 52.6, 54.2, 75.9, 126.3, 127.8, 129.4, 142.0 ppm.

Example  3: Polyamine Fluxing agent  synthesis

A polyamine fluxing agent having the following formula was prepared using the following procedure.

Specifically, the product of Example 1 (0.05 mol) was added to the reaction vessel with a stir bar. The reaction vessel was then placed on a magnetic stirable hotplate. The reaction vessel was then inert with nitrogen and 0.1 mol of 2-ethylhexyl glycidyl ether (available from Momentive Performance Materials) was added to the reaction vessel with stirring at ambient temperature. The setting temperature of the hotplate was then raised to 75 ° C. and the contents of the reaction vessel were kept stirring for 2 hours. The setting temperature of the hotplate was then raised to 140 ° C. and the contents of the reaction vessel were allowed to continue stirring for an additional 2 hours. The setting temperature of the hotplate was then lowered to 80 ° C. and the reaction vessel was vacuumed to reduce the pressure in the vessel to 30 mm Hg. Under this condition, the contents of the reaction vessel were allowed to continue stirring for an additional 2 hours to obtain a product fluxing agent. The percent weight loss of the product fluxing agent upon heating to 250 ° C. was measured with a thermogravimetric analyzer (TGA) using a temperature ramp of 10 ° C./min starting at 25 ° C. The weight loss (WL) measured for the product fluxing agent was 9% by weight.

Example  4: Polyamine Fluxing agent  synthesis

A polyamine fluxing agent having the following formula was prepared using the following procedure.

Specifically, the product of Example 2 (0.05 mol) was added to the reaction vessel with a stir bar. The reaction vessel was then placed on a magnetic stirable hotplate. The reaction vessel was then inactivated with nitrogen and 0.1 mole of 2-ethylhexyl glycidyl ether (available from Momentive Performance Materials) was added to the reaction vessel with stirring at ambient temperature. The setting temperature of the hotplate was then raised to 75 ° C. and the contents of the reaction vessel were kept stirring for 2 hours. The setting temperature of the hotplate was then raised to 140 ° C. and the contents of the reaction vessel were allowed to continue stirring for an additional 2 hours. The setting temperature of the hotplate was then lowered to 80 ° C. and the reaction vessel was vacuumed to reduce the pressure in the vessel to 30 mm Hg. Under this condition, the contents of the reaction vessel were allowed to continue stirring for an additional 2 hours to obtain a product fluxing agent. The percent weight loss of the product fluxing agent upon heating to 250 ° C. was measured with a thermogravimetric analyzer (TGA) using a temperature ramp of 10 ° C./min starting at 25 ° C. The weight loss (WL) measured for the product fluxing agent was 5% by weight.

Example  5-9: Polyamine Fluxing agent  synthesis

The polyamine fluxing agents shown in Table 1 were prepared from the materials shown in Table 1 using the following method. Specifically, mentane diamine (commercially available as Primene ™ MD from The Dow Chemical Company) (0.1 mol) was added to the reaction vessel with a stir bar. The reaction vessel was then placed on a magnetic stirable hotplate. The reaction vessel was then inactivated with nitrogen and reagent A (0.2 moles) shown in Table 1 was added to the reaction vessel with stirring at ambient temperature. The setting temperature of the hotplate was then raised to 75 ° C. and the contents of the reaction vessel were kept stirring for 2 hours. The setting temperature of the hotplate was then raised to 140 ° C. and the contents of the reaction vessel were allowed to continue stirring for an additional 2 hours. The setting temperature of the hotplate was then lowered to 80 ° C. and the reaction vessel was vacuumed to reduce the pressure in the vessel to 30 mm Hg. Under this condition the contents of the reaction vessel were allowed to continue stirring for an additional 2 hours to obtain the product fluxing agents shown in Table 1. Thereafter, the boiling point temperature of the product fluxing agent for Example 5-7 was measured with a differential scanning calorimeter (DSC) using a ramp of 10 ° C./min at 25 ° C. to 500 ° C. The boiling point temperature (BPT) of the product fluxing agents measured for Examples 5-7 is shown in Table 1. In addition, the percent weight loss of the product fluxing agent upon heating to 250 ° C. was measured with a thermogravimetric analyzer (TGA) using a temperature ramp of 10 ° C./min starting at 25 ° C. The weight loss (WL) of the product fluxing agent measured for Examples 5-7 is shown in Table 1.

TABLE 1

Example  10: Polyamine Fluxing agent  synthesis

Polyamine fluxing agents were prepared using the following method. 34 g of mentan diamine (commercially available as Primene ™ MD from The Dow Chemical Company) and 37.4 g of epichlorohydrin and bisphenol A (commercially available as DER ™ 331 ™ from The Dow Chemical Company) in a reaction vessel with a stir bar The liquid reaction product of was added. The reaction vessel was then placed on a magnetic stirable hotplate. The contents of the reaction vessel were changed to a solid by stirring at room temperature overnight. Thereafter, 37.2 g of 2-ethylhexyl glycidyl ether (available from Momentive Performance Materials) was charged to the reaction vessel. The reaction vessel was then heated to 150 ° C. at room temperature with a 1 hour ramp and then held at 150 ° C. for 3 hours. The contents of the reaction vessel were then cooled to room temperature to give the dimeric fluxing agent product.

Example  11: Polyamine Fluxing agent  synthesis

Polyamine fluxing agents were prepared using the following method. 34 g of mentan diamine (commercially available as Primene ™ MD from The Dow Chemical Company) and 37.4 g of epichlorohydrin and bisphenol A (commercially available as DER ™ 331 ™ from The Dow Chemical Company) in a reaction vessel with a stir bar The liquid reaction product of was added. The reaction vessel was then placed on a magnetic stirable hotplate. The contents of the reaction vessel were changed to a solid by stirring at room temperature overnight. Thereafter, 40.0 g of 1-naphthyl glycidyl ether (available from Momentive Performance Materials) was charged to the reaction vessel. The reaction vessel was then heated to 75 ° C. and held for 1 hour. The contents of the reaction vessel were then cooled to room temperature to give the dimeric fluxing agent product. The reaction vessel was then heated from 75 ° C. to 150 ° C. with a 1 hour ramp and then held at 150 ° C. for 3 hours. The contents of the reaction vessel were then cooled to room temperature to give the dimeric fluxing agent product.

Example  12-18: Flux  Preparation of the composition

Each of the polyamine fluxing agents prepared in Examples 5-11 was individually formulated with propylene glycol methyl ether acetate (available as an electronic grade solvent from The Dow Chemical Company) in a weight ratio of 1: 1. The polyamine flux composition of Example 12-18 was produced.

Example  19-20: Curable Underfill  Manufacture of pharmaceutical preparations

The polyamine fluxing agents prepared in Examples 3-4, respectively, were individually formulated in a weight ratio of 1: 3 with the liquid epoxy resin reaction product of epichlorohydrin and bisphenol A (available as DER ™ 331 ™ from The Dow Chemical Company). This produced the curable underfill formulations of Examples 19 and 20, respectively.

Example  21-23: curable Underfill  Manufacture of pharmaceutical preparations

The polyamine fluxing agents prepared in Examples 5-7, respectively, were separately prepared with liquid epoxy resin reaction products of propylene glycol methyl ether acetate and epichlorohydrin and bisphenol A (commercially available as DER ™ 331 ™ from The Dow Chemical Company). And a weight ratio of 1.68: 20: 8), which are available as electronic grade solvents from Dow Chemical Company, to produce the curable underfill formulations of Examples 21-23, respectively.

Example  24-25: curable Underfill  Manufacture of pharmaceutical preparations

Each of the polyamine fluxing agents prepared in Examples 8-9 were individually formulated in a weight ratio of 1: 4 with liquid epoxy resin reaction products of epichlorohydrin and bisphenol A (available as DER ™ 331 ™ from The Dow Chemical Company). This produced the curable underfill formulations of Examples 24-25, respectively.

Example  26: Fluxing  Assessment of ability

Using the following procedure, the fluxing capability of each polyamine flux composition prepared in Examples 3-4 and 12-25 was evaluated and compared to hydroxystearic acid standard. In each evaluation, a copper coupon was used as the electrical contact to be soldered. The surface to be soldered on each copper coupon was pretreated as follows: (1) first polishing with fine sandpaper (600 grit), (2) then washed with 5% ammonium persulfate solution, (3) next, Wash with deionized water, (4) then dipped in 1% benzotriazole solution for 30 seconds, and (5) then blow dry with nitrogen. Following pretreatment of the copper coupon, a small drop of each polyamine flux composition was individually placed on the surface to be soldered in one of the copper coupons. Four 0.381 mm diameter balls of lead-free solder (95.5 wt% Sn / 4.0 wt Ag / 0.5 wt% Cu) were placed in a drop of polyamine flux composition on each copper coupon. The melting range of the lead-free solder used was 217-221 ° C. The copper coupon was then placed on a hotplate preheated to 145 ° C. and placed there for 2 minutes. The copper coupon was then placed on another hotplate preheated to 260 ° C. and placed there until the solder reached reflow conditions (45 seconds to 3 minutes, depending on the polyamine flux composition present). Next, the copper coupons were removed from the heat and evaluated by: (a) the degree of fusion and coalescence of the four initially placed solder balls, (b) the flow and spread. ), The size of the resulting solder, and (c) bonding the solder to the surface of the copper coupon. The following scales of 0 to 4 were used to describe the fluxing capabilities of the polyamine flux composition and the hydroxystearic acid standard.

0 = no fusion between solder droplets, no solder bonding to copper coupons;

1,2 = partial to complete fusion between solder droplets, but no solder bonding to copper coupons;

3 = complete fusion between solder droplets, but solder spread and flow are minimized;

4 = complete fusion between solder droplets, good solder spread and flow across the copper coupon surface, and solder bonding to the copper coupon.

The evaluation results of each polyamine flux composition are shown in Table 2 below.

Table 2

Claims (10)

A polyamine flux composition comprising, as an initial component, a polyamine fluxing agent represented by the following formula (I):

Where
R ¹ , R ² , R ³ and R ⁴ are hydrogen, a substituted C _{1 -80} alkyl group, an unsubstituted C _{1 -80} alkyl group, a substituted C _{7 -80} arylalkyl group and an unsubstituted C _{7 -80} Independently selected from arylalkyl groups;
R ⁷ is an unsubstituted C _{5 -80} alkyl group having at least two tertiary carbons, a substituted C _{5 -80} alkyl group having at least two tertiary carbons, an unsubstituted C having at least two tertiary carbons _12-80 An arylalkyl group and a substituted C _{12 -80} arylalkyl group having at least two tertiary carbons;
The two nitrogens of formula (I) are independently bonded to one of at least two tertiary carbons of R ⁷ ;
Provided that the polyamine fluxing agent of formula (I) is

When represented by 0 to 3 of R ¹ , R ² , R ³ and R ⁴ are hydrogen. The polyamine flux composition of claim 1 wherein the two nitrogens of formula (I) are separated into four to eight carbon bridges. The method of claim 1,
R ¹ , R ² , R ³ and R ⁴ are hydrogen, a substituted C _{1 -80} alkyl group, an unsubstituted C _{1 -80} alkyl group, a substituted C _{7 -80} arylalkyl group and an unsubstituted Independently selected from C _{7 -80} arylalkyl groups;
_{Wherein the} substituents of the substituted C _{1 -80} alkyl group and the substituted C _{7 -80} arylalkyl group are -OH group, -OR ⁵ group, -COR ⁵ -group, -C (O) R ⁵ group, -COR Group ⁵ , -CHO, -COOR Group ⁵ , -OC (O) OR Group ⁵ , -S (O) (O) R Group ⁵ , -S (O) R Group ⁵ , -S (O) (O) NR ⁵ ₂ group, —OC (O) NR ⁶ ₂ group, —C (O) NR ⁶ ₂ group, —CN group, —N (R ⁶ ) — group and —NO ₂ group;
Here, R ⁵ is selected from C _{1 -28} alkyl group, C _{3 -28} cycloalkyl group, C _{6 -15} aryl group, C _7-28 arylalkyl group and C _{7 -28} alkyl aryl group; R ⁶ is hydrogen, C _{1 -28} alkyl group, C _{3 -28} cycloalkyl group, C _{6 -15} aryl groups, C _{7 -28} are selected from aryl groups and C _{7 -28} alkyl aryl group,
Polyamine flux composition. The polyamine flux composition of claim 1 wherein one to three of R ¹ , R ² , R ³ and R ⁴ are hydrogen. The polyamine flux of claim 1 further comprising a solvent that is an organic solvent selected from hydrocarbons, aromatic hydrocarbons, ketones, ethers, alcohols, esters, amides, glycols, glycol ethers, glycol derivatives, and petroleum solvents. Composition. The polyamine flux composition of claim 1 further comprising at least one of an inorganic filler, a thixotropic agent, and an antioxidant. The method of claim 1, wherein the matting agent, colorant, antifoaming agent, dispersion stabilizer, chelating agent, thermoplastic particles, UV impermeable agent, flame retardant, leveling agent, adhesion promoters And an additive selected from a reducing agent. The polyamine flux composition of claim 1 further comprising, as an initial component, a resin component having at least two oxirane groups per molecule and optionally a curing agent. The polyamine flux composition of claim 1 further comprising a solder powder. Providing an electrical contact;
Providing the polyamine flux composition of claim 1;
Applying the polyamine flux composition to the electrical contacts;
Providing a solder;
Melting the solder; And
Replacing the polyamine flux composition applied to the electrical contact with the molten solder, wherein the molten solder creates a physical contact with the electrical contact and couples to the electrical contact.