KR20120058276A - Ultrashort pulse laser and water cutting device and method using coagulation - Google Patents

Ultrashort pulse laser and water cutting device and method using coagulation Download PDF

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KR20120058276A
KR20120058276A KR1020100119980A KR20100119980A KR20120058276A KR 20120058276 A KR20120058276 A KR 20120058276A KR 1020100119980 A KR1020100119980 A KR 1020100119980A KR 20100119980 A KR20100119980 A KR 20100119980A KR 20120058276 A KR20120058276 A KR 20120058276A
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South Korea
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object
laser
cutting
ultra
cooling gas
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KR1020100119980A
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Korean (ko)
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KR101202256B1 (en
Inventor
김승만
김승우
김영진
김윤석
박상욱
유준호
한승회
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한국과학기술원
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Abstract

The present invention relates to a cutting device and method using an ultra-short pulse laser and moisture coagulation, in the cutting device, the ultra-short pulse laser is output by condensing with a condensing lens to form a cavity on the object to be processed A laser source for irradiating a laser to an object, forming a predetermined space portion in contact with a bottom surface of the object to be processed, a base plate having a steam supply part and a cooling gas supply part on both sides, and steam supply means for supplying steam to the vapor supply part; And cooling gas supply means for supplying cooling gas to the cooling gas supply unit, irradiating the object to be processed through the laser, causing cracks, supplying steam, and then supplying the cooling gas to expand due to steam coagulation. It is characterized by cutting the substrate. It is possible to prevent the generation of debris particles on the surface of the object to be configured as described above, and finally cut by using water expansion, thereby simplifying the process and ensuring cleanliness of the process.

Description

Ultrashort pulse laser and water cutting device and method using coagulation}

The present invention relates to a cutting device and method using an ultra-short pulse laser and moisture coagulation, and to a cutting device and method for effectively cutting a substrate by applying a physical method with laser processing for cutting transparent materials, wafers and substrates. will be.

Conventional methods for cutting and separating brittle substrates are used to cut and separate brittle substrates such as glass, silicon, and ceramics, and include scribing, blade dicing, laser cutting, and stealth dies. Cutting methods such as sealing (Dicing) and Thermal Laser Seperation (TLS) are used.

Among them, the scribing and blade dicing methods are mechanical cutting methods, and the stealth dicing and TLS methods are non-contact cutting methods using lasers. Existing mechanical cutting method forms a large amount of chips during processing and leaves residual stress on the workpiece, which causes severe breakage and tearing in the thin film of less than 100 um. Conventional laser-based processing is a heat transfer-based processing process, which results in a large thermal load resulting in a heat affected zone (HAZ), which has limitations such as cracking or dropping strength of the workpiece. In addition, the degree of processing changes depending on the absorbency of the workpiece, there is a difficulty in cutting a multi-layer structure made of a variety of materials.

The stealth dicing method and the TLS method cut the substrate by forming a strained layer or generating tensile residual stress in the substrate without directly removing the substrate from the surface, thereby reducing the occurrence of debris or particles during the cutting process. However, this is also based on the thermal process, the heat affected zone is formed, the residual stress is left as it is, it changes the characteristics of the substrate. In addition, in the case of TLS, there is a limitation in that separate cleaning of the coolant to cool the heat is required.

Conventional pulsed lasers thermally excite the workpiece, thereby changing the phase of the material to perform the processing. In contrast, ultrashort pulse lasers (pulse widths of 10 ps or less) are based on the high peak power of the ultrashort pulses to directly remove or remove the workpiece into the plasma state or change the state of the material. In addition, due to the narrow pulse width, all processing is performed before heat is conducted to the surrounding material, thereby enabling clean and precise processing without affecting the processing peripheral portion.

The advantages of the ultra short pulse laser The process starts and proceeds by nonlinear light absorption without relying on the non-defective defect electrons of the workpiece required for conventional laser processing. Therefore, the control of the machining is very easy with a deterministic process that does not depend on the workpiece.

Seed electron groups are sufficiently generated through nonlinear ionization for tens of femtoseconds in front of the ultra-short pulse, so processing starts and progresses. Therefore, the selectivity of the processing site and the repeatability of the process can be greatly increased, which is very advantageous in application to practical applications.

The advantage of ultra-short pulse lasers in the processing of transparent materials is that due to the non-linear light absorption phenomenon, processing and changes can be concentrated only on the volume near the focus. The processing precision can be increased and the stress change in the surrounding area can be minimized. . Since the nonlinear light absorption phenomenon does not depend on the physical properties of the workpiece, various workpieces can be processed, and in particular, a workpiece composed of a combination of various different materials and layers can be easily processed with a single laser.

The femtosecond laser micromachining principle is based on ultra-short laser-based optical breakdown. Light energy propagates through the material, which causes many electrons to ionize. As a result, energy is transferred to the material's lattice, causing a phase change or structural change in the material. It also produces voids and changes in refractive index concentrated in the laser focusing zone. With a pulse width of 10 fs or more, nonlinearly excited electrons generate sufficient energy through a linear absorption mechanism through the photons, resulting in an Avalanche ionization process that further excites other bond electrons, resulting in additional processing speed. It brings an improvement.

Conventional laser processing, however, generates processing residues on the upper surface of the workpiece during processing, fragments or particles are generated during cutting, and transfers to various stages of equipment to create and cut modified surfaces of the workpiece. It has a complicated drawback.

The present invention for solving the above problems by using the ultra-short pulse laser to create a cavity on the bottom of the object to be processed does not form the processing residue generated on the specimen during laser processing, occurs during the solidification of the water supplied to the cavity Substrate cutting device and method that can improve the processing speed by reducing the generation of debris or particles generated during cutting, thereby making clean processing, and co-creating and cutting in one device without transferring the object. Its purpose is to provide it.

The present invention for achieving the above object, in the cutting device, a laser source for outputting an ultra-short pulse laser to condense with a condenser lens to form a cavity in the object to be irradiated the laser to the object A base plate provided with a water vapor supply part and a cooling gas supply part on both sides thereof, the vapor supply means supplying water vapor to the water vapor supply part; And a cooling gas supply means for supplying a cooling gas to the cooling gas supply part, and irradiates the object to be processed through the laser element tm to generate a crack, and after supplying water vapor, supplying the cooling gas to expand the water according to the water vapor coagulation. It is characterized by cutting the substrate.

In addition, the laser source is characterized in that for controlling the pulse laser energy to form a cavity on the opposite surface of the object to be irradiated laser.

The cutting device may further include a vacuum chuck for fixing the object to be processed in the process of cooling and cutting the water vapor supplied to the base plate.

In addition, the vacuum chuck is characterized in that a plurality of suction passages are formed so as to enable vacuum suction for each area in which the object to be processed is separated.

In addition, the ultra-short pulse laser is characterized by corresponding to a laser having a pulse width of less than 10 picoseconds (ps).

The object to be processed may be a transparent material or a wafer.

Further, in the cutting method, irradiating an ultra-short pulsed laser to the object to be formed to form a cavity according to the cutting area, supplying water vapor to the water vapor supply portion of the base plate which is in contact with the surface on which the cavity of the object is formed. And supplying a cooling gas to the cooling gas supply unit after the steam supply, and cutting along the cavity formed in the object to be processed using steam expansion.

In addition, the cutting step, characterized in that the cutting after fixing the workpiece to be separated by a vacuum chuck, respectively.

The present invention constituted as described above can achieve a clean processing process by reducing processing residues generated during laser processing, and can achieve simple and clean processing by performing cutting after cavity formation using expansion of moisture coagulation, The process of transporting the workpiece is small, so there is an advantage in that rapid machining can be performed.

1 is a schematic configuration diagram of a cutting device and method using an ultra-short pulse laser and moisture coagulation according to the present invention,
2 is a detailed view showing a process of generating a crack by pulsed laser irradiation in the cutting device and method according to the invention,
3 is a view illustrating a state in which water vapor is supplied into a base plate in the cutting device and method according to the present invention;
4 is a view showing a cutting state through moisture solidification in the cutting device and method according to the present invention,
5 is a flow chart of a cutting method according to the present invention.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a cutting device and method using an ultra-short pulse laser and moisture coagulation according to the present invention will be described in detail.

In the cutting device and method using the ultra-short pulse laser and moisture coagulation according to the present invention, in the cutting device, the ultra-short pulse laser is output by condensing with a condensing lens to form a cavity in the object to be processed A laser source for irradiating a laser to a laser source, forming a predetermined space inwardly in contact with a bottom surface of the object to be processed, a base plate having a steam supply part and a cooling gas supply part on both sides thereof, and steam supply means for supplying steam to the vapor supply part; And cooling gas supply means for supplying cooling gas to the cooling gas supply unit, irradiating the object to be processed through the laser, causing cracks, supplying steam, and then supplying the cooling gas to expand due to steam coagulation. It is characterized by cutting the substrate.

The cutting device and method using the ultra-short pulse laser and moisture coagulation according to the present invention, by forming a cavity to the object to be processed using the ultra-short pulse laser, and supplying a predetermined amount of moisture to the cavity to the water The main technical point is to cut the object to be processed by expansion by cooling by supplying a cooling gas for cutting the object to be processed by expansion by cooling.

1 is a schematic configuration diagram of a cutting device and method using an ultra-short pulse laser and moisture coagulation according to the present invention.

The object to be processed according to the present invention is preferably for cutting a transparent material or a wafer substrate, and the laser source 100 irradiates the object to be processed using a source having a pulse width of picosecond or less. At this time, the energy of the laser is irradiated by adjusting the energy so that the cavity is formed on the surface opposite the irradiation direction of the object. In addition, in order to irradiate the laser on the object to be processed, the optical mirror 111 and the condenser lens 110 may be optically configured. As it can, it is not limited to this. For example, the condenser lens 120 irradiates a workpiece (substrate or transparent material) by condensing a laser using a condenser lens having a numerical aperture (NA) of about 0.5. In addition, the condensing lens preferably has a magnification of 20 × or more.

The pulse energy control is described in more detail. When a transparent material is ionized through multiphoton absorption by a laser irradiated through a condenser lens and changed into a plasma state, the laser beam causes spatially spread plasma defocusing. . Therefore, when the light is focused at a shallow depth of about 3 to 30 μm inside the transparent material, a modified region is generated by the high energy per pulse in the process of reaching the focal point, and as the propagation continues, the pulse energy sets the threshold value. The plasma defocusing phenomenon occurs. Such modified region and plasma defocusing cause an effect that disturbs the focusing of the laser. As the reformed region is formed in the first focal region and the plasma defocusing phenomenon occurs, as the energy per pulse increases, the nonlinear focal shift phenomenon in which the focal length becomes deeper due to the disturbance of the spatial focusing of the laser by the reformed region and plasma defocusing occurs. Get up. Also, as the energy per pulse increases, the region where the reforming region and the plasma defocusing phenomenon starts becomes shallower. Therefore, as the energy per pulse increases, the reformed region and the plasma generating region become longer, and the nonlinear focus movement (deep direction) and the modification and plasma generation (shallow direction) in the transparent material extend to the length region of about tens to hundred um. Will be. Using this principle it is possible to control the cavity forming area by adjusting the pulse energy.

On the other hand, the main component according to the present invention is provided with a base plate (base plate; 104) in contact with the substrate for cutting the object to be processed. The base plate corresponds to a steam supply applied to cutting the substrate and a receptor for receiving a cooling gas for cooling the steam. Figure 2 is a detailed view showing a process for generating a crack by pulsed laser irradiation in the cutting device and method according to the present invention. Referring to FIG. 2, a base portion 103 is formed on a surface in contact with an object to be processed, and a water vapor supply portion 106 and a cooling gas supply portion 107 penetrating the space portion are formed, respectively. .

The base plate injects water into the cavity formed on the bottom of the object to be stagnated, and supplies the cooling gas to cool the steam to induce volume expansion of water vapor introduced into the cavity, thereby inducing object cutting. The base play may be made of a metal material or a synthetic resin series, and preferably prepared from a low temperature stabilizing material according to a supply of cooling gas.

The base plate thus constructed is placed in contact with the bottom of the object to be processed and irradiated with a pulsed laser to form a cavity inside the space.

3 is a view illustrating a state in which water vapor is supplied into a base plate in the cutting device and method according to the present invention. After irradiating the pulsed laser to form a cavity in the bottom of the object to be processed, water vapor is injected into the water vapor supply unit 106 through the water vapor supply means 108. The steam supply means corresponds to a means for heating water H 2 0 or generating steam using ultrasonic waves or the like. At this time, the water vapor is supplied sufficiently so that the water vapor is tightly filled into the cavity.

4 is a view illustrating a cutting state through moisture coagulation in the cutting device and method according to the present invention. When water vapor is sufficiently supplied into the base plate space through the steam supply means and filled into the object to be processed, the cooling gas is injected into the cooling gas supply through the cooling gas supply means 109 to solidify the water vapor. Nitrogen, helium, oxygen may be considered as such cooling gas, which may be generated by adjusting the pressure in the liquefied state, and surface vaporization in the liquefied form may also be considered.

At this time, before injecting the cooling gas to solidify the water vapor, the object to be cut is fixed by adsorbing the vacuum chuck 300 on the substrate. Here, the vacuum chuck is formed with a fine suction path to be fixed to each of the objects to be separated according to the cutting to fix the object to be separated. The vacuum chuck is used to adsorb the upper surface of the object to be fixed to inject cooling gas. When the cooling gas is injected, the water vapor present in the cavity solidifies, causing volume expansion, which causes the material crack to be stressed to cut the workpiece perpendicular to the cavity formed through laser irradiation.

5 is a flowchart of a cutting method according to the present invention. Referring to the flowchart of FIG. 5, a pulse laser of picoseconds (ps) or less is irradiated to a processing target to form a cavity in the bottom of the processing target. After the cavity is formed, the base plate is placed on the bottom of the object to be processed and steam is supplied through the steam supply. In this case, the base plate may be positioned before or before the laser irradiation.

After supplying a certain amount of water vapor through the water vapor supply unit, the substrate is fixed by using a vacuum chuck prior to cutting the object. This is for fixing the substrates to be separated after cutting. Here, the vacuum chuck uses a vacuum chuck provided with a suction path capable of individually sucking the processing object to be separated.

When fixing the object to be processed using the vacuum chuck, the cooling gas is supplied to the cooling gas supply unit provided in the base plate. When the cooling gas is supplied, the steam existing inside coagulates. At this time, the water vapor introduced into the cavity formed in the object to be solidified to achieve a volume expansion to generate a stress horizontally in the cavity direction, thereby cutting the substrate as the crack progresses in the cavity direction.

The present invention configured as described above can prevent the generation of debris particles on the surface by forming a cavity using a pulse laser on the bottom of the object to be processed, and clean the process by supplying with the formed cavity with water and cutting it using expansion due to solidification. There is also an advantage that can be achieved and simplified.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. On the contrary, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims. And all such modifications and changes as fall within the scope of the present invention are therefore to be regarded as being within the scope of the present invention.

100: laser 101: laser light
102: object 103: void
104: base plate 105: space part
106: steam supply 107: cooling gas supply
108: steam supply means 109: cooling gas supply means
110: condenser lens 111: mirror
200: water vapor 201: cooling gas
300: vacuum chuck

Claims (9)

  1. In the cutting device,
    A laser source for outputting an ultra-short pulse laser and condensing with a condenser lens to irradiate a laser beam to the object to be formed to form a cavity in the object;
    A base plate having a predetermined space portion inwardly in contact with a bottom surface of the object to be processed, and having a water vapor supply portion and a cooling gas supply portion at both sides thereof;
    Steam supply means for supplying steam to the steam supply part; And
    And cooling gas supply means for supplying cooling gas to the cooling gas supply unit.
    The substrate is cut using an ultra-short pulse laser and moisture coagulation, characterized by irradiating an object to be processed through the laser element to generate cracks, and supplying steam and then supplying a cooling gas to cut the substrate by expansion due to water vapor coagulation. Device.
  2. The method of claim 1, wherein the laser source,
    A substrate cutting device using an ultra-short pulse laser and moisture coagulation, wherein pulse laser energy is controlled to form a cavity on the opposite side of the object to which the laser is irradiated.
  3. According to claim 1, The cutting device,
    And a vacuum chuck for fixing the object to be processed in the process of cooling and cutting the water vapor supplied to the base plate.
  4. The method of claim 3, wherein the vacuum chuck,
    A substrate cutting apparatus using ultra-short pulse laser and moisture coagulation, characterized in that a plurality of suction paths are formed to enable vacuum suction for each area where the object is separated.
  5. The method of claim 1, wherein the ultra-short pulse laser,
    Substrate cutting device using ultra-short pulse laser and moisture coagulation, characterized by corresponding to a laser having a pulse width of less than 10 picoseconds (ps).
  6. The method of claim 2, wherein the processing object,
    Substrate cutting device using ultra-short pulse laser and moisture coagulation, characterized in that the transparent material or wafer.
  7. In the cutting method,
    Irradiating the ultra-short pulse laser to the object to form a cavity along the cutting region;
    Supplying steam to a steam supply unit of a base plate in contact with a surface where a cavity of the object is formed;
    Cutting the substrate by supplying a cooling gas to the cooling gas supply unit after supplying the steam and cutting along the cavity formed in the object by using steam expansion; cutting the substrate using an ultra-short pulse laser and moisture coagulation. Way.
  8. The method of claim 7, wherein the cutting step,
    A substrate cutting method using an ultra-short pulse laser and moisture coagulation, characterized in that each of the separated object to be processed by fixing with a vacuum chuck and then cut.
  9. The method according to claim 7, wherein the processing object,
    Substrate cutting method using ultra-short pulse laser and moisture coagulation, characterized in that the transparent material or wafer.
KR1020100119980A 2010-11-29 2010-11-29 Ultrashort pulse laser and water cutting device and method using coagulation KR101202256B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014075995A2 (en) * 2012-11-14 2014-05-22 Schott Ag Method for separating transparent workpieces

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103962727B (en) * 2013-01-28 2018-03-02 深圳市裕展精密科技有限公司 Sapphire cutter device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014075995A2 (en) * 2012-11-14 2014-05-22 Schott Ag Method for separating transparent workpieces
WO2014075995A3 (en) * 2012-11-14 2014-07-24 Schott Ag Method for producing aligned linear breaking points by ultra-short focussed, pulsed laser radiation; method and device for separating a workpiece by means of ultra-short focussed laser radiation using a protective gas atmosphere
CN104768698A (en) * 2012-11-14 2015-07-08 肖特公开股份有限公司 Method for producing aligned linear breaking points by ultra-short focussed, pulsed laser radiation, and method and device for separating a workpiece by means of ultra-short focussed laser radiation using a protective gas atmosphere
US10626039B2 (en) 2012-11-14 2020-04-21 Schott Ag Separation of transparent workpieces

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