KR20120045925A - Non-carrier type adhesive film - Google Patents

Abstract

PURPOSE: Non-carrier adhesive film without adhesion excitation phenomenon is provided to be cut quickly without separation of an adhesive layer when removing lightly peelable release sheet, thereby improving productivity and yield. CONSTITUTION: Non-carrier adhesive film comprises a lightly peelable release sheet(1), a pressure-sensitive adhesive layer(2), and a heavily peelable release sheet(3). The difference of peering force between the lightly peelable release sheet and the heavily peelable release sheet satisfies formula: 5 gf/25mm <= B-A <= 50 gf/25mm, and the gel fraction of the pressure-sensitive adhesive layer calculated by the formula 2: gel fraction(%) = m/M × 100 satisfies 50-90 %. In formulas, A is peeling force of the light peelable release sheet, B is peeling force of the heavily peelable release sheet, M is total weight of the adhesive film, and m is weight of gelated part of the adhesive film.

Description

Inorganic Adhesive Film {NON-CARRIER TYPE ADHESIVE FILM}

The present invention relates to an inorganic material adhesive film, and more specifically, made of a light peeling release sheet, a pressure-sensitive adhesive layer and a heavy peeling release sheet, the peeling force difference between the light peeling release sheet and a heavy peeling release sheet and the pressure reduction By optimizing the gel fraction of the pressure-sensitive adhesive layer, the adhesive layer does not detach when removing the light-peelable release sheet, and the adhesive pressure-sensitive adhesive material that eliminates the sticking-up defects caused by burrs and debris generated when cutting the adhesive film is eliminated. It is about.

Inorganic adhesive films are used in display, electrical and electronics, and civil engineering. It is a type of adhesive film that is used throughout various industries such as the automobile field, and it can be thinner, reduce the manufacturing process, and can be applied to a wide range in one production, compared to conventional adhesive films with carriers. There is an advantage that it can.

When the inorganic adhesive film is produced, the sheet is cut in the form of a wide or long sheet or a narrow roll. In the case of a substrate adhesive film using a substrate such as a conventional nonwoven fabric, a polyester film, or an imide film, the adhesive is coated on both sides with the substrate interposed therebetween, so that a lot of facilities and manufacturing processes are required in the process. Therefore, the substrate adhesive film is rarely used except in special cases for giving a difference in peel force between both sides of the substrate. In addition, if the physical properties of the adhesive is properly controlled, since the peeling force difference between both sides can be set without using the base material, the development of the pressure-sensitive adhesive film is progressing in the direction of not using the base material.

In the case of the internal cohesive force of the weakest adhesive among the physical properties of the inorganic adhesive film, by adjusting the thickness and curing degree of the inorganic material or the adhesive in the adhesive, it is possible to produce an inorganic adhesive film having a tensile strength and cohesion that is inferior to the base adhesive film. have. In addition, when the substrate adhesive film is used in heat resistance properties, the thermal properties of the substrate itself, that is, thermal expansion coefficient, thermal decomposition rate, and thermal stress, affect the adhered substrate, which often causes product defects. In the case of using a viscoelastic property of the pressure-sensitive adhesive rather has the advantage of absorbing the stress of the product due to the difference in the coefficient of thermal expansion.

In the case of the inorganic adhesive film, a matured adhesive is prepared in advance, and the adhesive is directly coated onto a polarizing plate attached to a panel of a liquid crystal display to allow for 3 to 7 days before the product can be shipped. As a result, the production efficiency can be improved and the product delivery period can be shortened. And since the base material to which the pressure sensitive adhesive is attached is often an expensive functional film, the problem of the pressure sensitive adhesive can be grasped in advance when the inorganic pressure sensitive adhesive film is used, thereby reducing the defective rate caused by the direct coating of the pressure sensitive adhesive. In addition, since various adhesives can be applied to a substrate such as an expensive functional film without directly applying the adhesive, there is an advantage in terms of a user.

However, the conventional inorganic adhesive film has a problem that burrs and debris easily occur at the cutting surface when cutting. When burrs and debris are generated, adhesive lifting occurs at the burrs and debris in the process of removing the light-peel release sheet, causing defects and not recovering to the original state. In addition, when the adhesive, such as film, glass or stainless steel (SUS) bonded to the inorganic pressure-sensitive adhesive film is raised, the defect is confirmed as it is causing problems. Furthermore, scratches caused by burrs and debris cause defects on the cross-section and the surface of the inorganic adhesive film, thereby lowering productivity and yield, thereby requiring an alternative approach.

It is an object of the present invention to provide an inorganic adhesive film in which the adhesive lifting phenomenon due to a burr generated during cutting of the adhesive film is eliminated.

The present invention to achieve the above object is a light-peel release sheet; Pressure-sensitive adhesive layer; And a heavy peeling release sheet; wherein the difference in peel force between the light peeling sheet and the heavy peeling sheet satisfies Equation 1 below, and the gel fraction of the pressure-sensitive adhesive layer calculated by Equation 2 is 50 to 90. It provides an inorganic adhesive film that satisfies%.

(A is the peel force of the light peeling release sheet, B is the peel force of the heavy peeling release sheet, M is the total mass of the adhesive film, m is the mass of the gelled portion of the adhesive film.)

The pressure-sensitive adhesive layer is preferably made of an acrylic copolymer in which 90 to 99% by weight of the acrylic monomer containing no crosslinkable functional group and 1 to 10% by weight of the acrylic monomer including the crosslinkable functional group are copolymerized.

At this time, the acrylic monomer containing no crosslinkable functional group is methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth ) Acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl 1- (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, myristyl ( Meta) acrylate, palmityl (meth) acrylate and stearyl (meth) acrylate.

In addition, the acrylic monomer including the crosslinkable functional group is an acrylic monomer having any one functional group in the group consisting of hydroxyl group, carboxyl group, amino group and amide group, and the acrylic monomer may be used alone or in a mixed form.

At this time, the pressure-sensitive adhesive layer may contain 0.1 to 10 parts by weight of a single or mixed form thereof selected from an epoxy curing agent or a polyfunctional isocyanate curing agent based on 100 parts by weight of the acrylic copolymer, and may be crosslinked.

Furthermore, the present invention may be further provided with a protective sheet on the outer surface of the light peeling release sheet and heavy release sheet.

The present invention is a light peeling release sheet; Pressure-sensitive adhesive layer; And an inorganic adhesive film having a structure consisting of a heavy peeling release sheet, the pressure-sensitive adhesive layer when removing the light peeling release sheet by optimizing the difference in the peel force between the light peeling release sheet and the heavy release sheet and the gel fraction of the pressure-sensitive adhesive layer. Without departing, it is possible to provide an inorganic adhesive film that has solved the poor adhesion caused by burrs and debris generated during cutting of the adhesive film.

In addition, the nickname can enable high-speed cutting of the inorganic adhesive film can provide an improvement in productivity and yield.

1 is a light peeling release sheet (1) of the present invention; Pressure-sensitive adhesive layer 2; And heavy peeling release sheet (3); It is an inorganic adhesive film consisting of.

Hereinafter, the present invention will be described in more detail.

The present invention, as shown in Figure 1 , a light peeling release sheet (1); Pressure-sensitive adhesive layer 2; And a heavy peeling release sheet (3); wherein the difference in peeling force between the light peeling release sheet and the heavy peeling release sheet satisfies Equation 1 below, and the gel of the pressure-sensitive adhesive layer calculated by Equation 2 below. It provides an inorganic adhesive film having a fraction satisfying 50 to 90%.

Equation 1

5gf / 25mm ≤ B-A ≤ 50gf / 25mm

Equation 2

(A is the peel force of the light peeling release sheet, B is the peel force of the heavy peeling release sheet, M is the total mass of the adhesive film, m is the mass of the gelled portion of the adhesive film.)

The light peeling release sheet 1 and the heavy peeling release sheet 3 is a sheet for protecting both sides of the inorganic adhesive film, respectively, is provided so that the peel force is different from each other. This is because the inorganic adhesive film of the present invention has a double-sided adhesive performance, if the peeling force of the sheet to protect the inorganic adhesive film is the same, the problem that the other sheet is also peeled and separated when one sheet is peeled off Because. Therefore, the lower the peeling force difference is better in the case of the light peeling release sheet (1), and the higher the middle peeling release sheet (3) is excellent.

Thus, the peeling force of the peeling release sheet is preferably 5gf / 25mm or more than the peeling force of the peeling release sheet, more preferably in the case of the embodiment of the present invention shows a maximum 8.3gf / 25mm, 50gf / 25mm maximum The figures can be applied. At this time, if the difference in the peel force between the release sheet is less than 5gf / 25㎜ pressure-sensitive cohesive failure occurs when removing the light peeling release sheet is not preferable, if the release exceeds 50gf / 25㎜ release force is high when the peeling release sheet is removed In the sheet removal process, workability is degraded, and the release coating layer of the release sheet is finely transferred to the pressure-sensitive adhesive layer, which causes defects in the durability test.

At this time, the light peeling release sheet (1) and heavy release sheet (3) is polyethylene (polyethylene), polypropylene (poly propylene), ethylene-vinyl acetate copolymer (ethylene-vinyl acetate), ethylene-vinyl alcohol air Synthetic resin films such as ethylene-vinyl alcohol and polyethylene terephthalate, rubber sheets, paper, cloth, nonwovens, nets, foam sheets, metal foils or The product which becomes an adherend etc. can be used, It does not specifically limit.

The surface of the light peeling release sheet 1 and the heavy peeling release sheet 3 has a peeling treatment such as a silicone treatment, a long cyclic alkyl treatment, a fluorine treatment, or the like, in order to increase the peelability from the pressure-sensitive adhesive layer 2. It is preferable to add and the said peelability can be controlled by adjusting the kind, coating amount, etc. of the surface treating agent used for a peeling process.

The pressure-sensitive adhesive layer (2) is preferably made of an acrylic copolymer in which 90 to 99% by weight of the acrylic monomer containing no crosslinkable functional group and 1 to 10% by weight of the acrylic monomer including the crosslinkable functional group are copolymerized.

The acrylic monomer that does not include the crosslinkable functional group is to provide flexibility and adhesion to the pressure-sensitive adhesive layer, and may be methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth). Acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl 1- (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylic It is characterized in that it is a single or mixed form of two or more selected from the group consisting of late, dodecyl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate and stearyl (meth) acrylate do.

In addition, the acrylic monomer including the crosslinkable functional group is an acrylic monomer having any functional group selected from the group consisting of hydroxyl group, carboxyl group, amino group and amide group, and the acrylic monomer may be used alone or in a mixed form. The acrylic monomer containing the crosslinkable functional group combines with the curing agent to impart cohesion.

The acrylic monomer which has the said hydroxyl group is (meth) acrylic acid 2-hydroxyethyl, (meth) acrylic acid 2-hydroxypropyl, (meth) acrylic acid 3-hydroxypropyl, (meth) acrylic acid 2-hydroxybutyl, (meth) (Meth) acrylic acid hydroxy alkyl esters such as 3-hydroxybutyl acrylate and 4-hydroxybutyl (meth) acrylate.

Acrylic monomers having the carboxyl group include ethylenic unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid and citraconic acid.

Acrylic monomers having the amino group include (meth) acrylic acid monomethyl amino ethyl and (meth) acrylic acid monoalkyl amino esters.

The acryl monomer which has the said amide group is acrylamide, such as (meth) acrylamide, N-methyl (meth) acrylamide, and N-methylol (meth) acrylamide.

In addition, the pressure-sensitive adhesive layer (2) is copolymerized between the acrylic copolymer and the curing agent, and since the crosslinked portion is gelled and is not dissolved by a solvent, the degree of curing, that is, the degree of crosslinking reaction, is determined through a gel fraction. I can figure it out. At this time, the gel fraction of the pressure-sensitive adhesive layer (2) is calculated by the formula (2) is preferably 50 to 90%.

Specifically, when the gel fraction of the pressure-sensitive adhesive layer 2 is less than 50%, cohesive force and hardness of the pressure-sensitive adhesive are poor, and burrs and debris are easily generated when the film is cut. In addition, if it exceeds 90%, the cohesive force of the adhesive is so high that the cutting property is improved, but the peel force difference between the light peeling release sheet and the heavy peeling release sheet is lowered, so that the occurrence of adhesive lifting occurs easily.

According to the present invention, the pressure-sensitive adhesive layer 2 contains 0.1 to 10 parts by weight, more preferably 0.5 to 2.0 parts by weight, alone or in a mixed form, selected from an epoxy curing agent or a polyfunctional isocyanate curing agent, based on 100 parts by weight of the acrylic copolymer. To crosslink. In this case, when the content of the curing agent is less than 0.1 parts by weight, the content is small, so that the crosslinking reaction hardly occurs. When the content of the curing agent exceeds 10 parts by weight, the crosslinking reaction proceeds in excess, resulting in a lifting phenomenon in durability.

Examples of the epoxy curing agent include an epoxy resin of bisphenol A-epichlorohydrin type, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, and 1,6. -Hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl aniline, N, N, N ', N'- tetraglycidyl-m-xylenediamine or mixtures thereof can be used. have.

As the polyfunctional isocyanate-based curing agent, toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, trimethylolpropane adduct of tolylene diisocyanate, a mixture thereof, and the like can be used.

In addition to the crosslinking agent, the composition of the pressure-sensitive adhesive layer 2 may further include additives such as a silane coupling agent and a tackifier resin.

The inorganic release film provided with the pressure-sensitive adhesive layer (2) has an adhesive performance on both sides, and the pressure-sensitive adhesive layer may be a Mayer bar coating method, a comma coating method, a lip coating method, a slot die coating method, or the like. The coating selected from among may be provided on the inorganic release film and there is no particular limitation on the method of coating.

A protective sheet may be further provided on the outer surface of the light peeling release sheet and the heavy peeling release sheet, and the protective sheet may be a polymer film or a release paper.

In addition, the inorganic adhesive film of the present invention may be used in a variety of ways depending on the type of adherend used, the adherend is a flexible substrate or glass, such as a functional film in the display, the exterior film of home appliances or building exterior materials And a hard base material such as plastics such as stainless steel (SUS) and acrylic or polycarbonate. Examples include polarizing plates for liquid crystal displays, anti-reflection (AR) films and plasma correction films for plasma displays, electromagnetic interference (EMI) blocking films, and other optical functional films. (PVC) can be used.

Hereinafter, the embodiment of the present invention will be described in detail.

The following examples are merely illustrative of the present invention, but the scope of the present invention is not limited to the following examples.

< Example >

1. Acrylic Copolymer Preparation

500 ml chemical reactor with stirrer, reflux cooler, thermometer and nitrogen injector, containing 90 g of monomer n-butylacrylate (BA), 5 g of methacrylate (MA) and crosslinkable functional groups without crosslinkable functional groups 5 g of monomeric acrylic acid (AA) was added in this order, 100 g of ethyl acetate as a solvent and 0.02 g of azobisisonitrile (AIBN) as a reaction initiator were added, followed by polymerization for 15 hours at 55 ° C. under a nitrogen stream. After completion of the reaction, the polymer was diluted with 200 g of ethyl acetate to obtain the desired acrylic copolymer.

2. Inorganic materials  Adhesive film manufacturing

To 100 g of the acrylic copolymer obtained above, an epoxy curing agent was added to the composition shown in Table 1 below as a curing agent, diluted to an appropriate concentration, and mixed uniformly. Then, a biaxially stretched polyethylene terephthalate film (Toray After coating on the silicone release coating surface of RPC-101 Co., Ltd. to form a uniform pressure-sensitive adhesive layer. After laminating the polyethylene terephthalate film (RPK 201, RPS 101, XP3BR, RPK 101) as a light peeling release sheet on the pressure-sensitive adhesive layer, and stored at 50 ℃ for 3 days to fully mature the present invention An inorganic adhesive film was prepared.

division Hardener content
(Epoxy curing agent) Hard release sheet Heavy peeling release sheet Example 1 0.2 g RPK 201 RPC 101 Example 2 RPS 101 RPC 101 Example 3 XP-3BR RPC 101 Example 4 1 g RPK 201 RPC 101 Example 5 RPS 101 RPC 101 Example 6 XP-3BR RPC 101 Example 7 2 g RPK 201 RPC 101 Example 8 RPS 101 RPC 101 Example 9 XP-3BR RPC 101 Comparative Example 1 0.05g RPK 201 RPC 101 Comparative Example 2 RPS 101 RPC 101 Comparative Example 3 XP-3BR RPC 101 Comparative Example 4 1 g RPS 101 RPK 201 Comparative Example 5 RPS 101 XP-3BR Comparative Example 6 RPK101 RPC 101

3. Property evaluation

1) Gel fraction measurement

The gel fraction is measured according to Equation 2 below, and the mass (m) of the resin that is not dissolved in the adhesive is dissolved in the prepared adhesive, and then filtered through a filter, and the mass of the gelled adhesive and the mass of the filter (m ' ) Was indirectly calculated by subtracting the mass (F) of the filter used.

About 0.2 g of the inorganic adhesive film prepared in Examples and Comparative Examples was taken and stored in a 200 mesh stainless steel net, and then 50 g of ethyl acetate (EtAc) was added and left for 3 days. Thereafter, the components which were not dissolved and remained in the gel state were filtered out. After drying for 1 hour in an oven at 100 ° C., the remaining mass was measured as in Equation 2 below, and the gel fraction was calculated as a percentage by comparing with the initial mass.

Equation 2

(Wherein, M is the mass of the entire pressure-sensitive adhesive, m is the mass of the pressure-sensitive adhesive that is gelled in the adhesive and not dissolved in ethyl acetate, where m = m'-F, where m 'is the mesh stainless used as a filter). The mass of the mesh and the gelled pressure sensitive adhesive, and F represents the mass of the mesh stainless steel.)

2) Peel force evaluation

The peeling force of the light peeling release sheet and the heavy peeling release sheet in the prepared inorganic adhesive film was measured by using Chem Instruments AR-1000 at 180 ° peel and 0.3 m / min peel rate.

3) Cutting property evaluation

Aged inorganic adhesive film was cut using a shear knife at intervals of 25 mm in width. Then, the phenomenon which the adhesive peeled off along the light peeling release sheet was observed visually in both cross sections, removing a light peeling release sheet.

○: No phenomenon that the adhesive detached when removing the light peeling release sheet

△: Some of the phenomenon that the adhesive is released when removing the light peeling release sheet

X: The phenomenon which an adhesive peels off at the time of removing a light peeling release sheet obviously arises

division Gel fraction
(%) Light Peeling Release Sheet Peeling Force (A) Heavy peeling sheet release force (B) Peel force difference
(BA) Machinability Sticking Acceptance range 50-90 5gf / 25mm ≤ B-A ≤ 50gf / 25mm ○ ○ Example 1 55 4.1 11.4 7.3 ○ ○ Example 2 55 3.5 11.8 8.3 ○ ○ Example 3 55 4.9 11.6 6.7 ○ ○ Example 4 70 3.9 10.2 6.3 ○ ○ Example 5 70 3.4 10.7 7.3 ○ ○ Example 6 70 4.3 10.5 6.2 ○ ○ Example 7 87 3.6 10.6 7 ○ ○ Example 8 87 3.3 10.5 7.2 ○ ○ Example 9 87 3 10.2 7.2 ○ ○ Comparative Example 1 40 3.9 10.9 7 × × Comparative Example 2 40 3.8 10.8 7 × × Comparative Example 3 40 3.5 11.7 8.2 × × Comparative Example 4 70 3.4 3.9 0.5 × × Comparative Example 5 70 3.4 4.3 0.9 × × Comparative Example 6 70 7.4 10.4 3 × × Gel fraction: Gel fraction of the pressure-sensitive adhesive layer (%)
A: Peel force of light peeling release sheet (gf / 25mm)
B: Peel force of heavy peeling release sheet (gf / 25mm)
BA: Difference between the peeling force of the heavy peeling release sheet and the peeling force of the light peeling release sheet (gf / 25㎜)
Peel force measurement condition: Measured at 180 ° peel and 0.3m / min

As can be seen in Table 2 , the peeling force difference between the light peeling release sheet and the heavy peeling release sheet is 5gf / 25mm or more 50gf / 50mm or less, the inorganic material of the gel fraction of the pressure-sensitive adhesive layer meets 50 to 90% In the case of the adhesive film, there is no phenomenon that the adhesive layer is detached when removing the light peeling release sheet, and the occurrence of burrs and debris generated during cutting of the adhesive film is significantly reduced, so that the adhesive lifting does not occur.

In Comparative Examples 1 to 3, the difference in peeling force between the light peeling release sheet and the heavy peeling release sheet was 5gf / 25mm or more, but the gel fraction of the pressure-sensitive adhesive layer was less than 50%. There is, it can be seen that the burrs and debris is generated when cutting the adhesive film. In addition, in Comparative Examples 4 to 6, even if the gel fraction satisfies the range of 50 to 90%, since the difference in peel force between the light peeling release sheet and the heavy peeling release sheet is less than 5 gf / 25 mm, the adhesive is released when removing the light peeling release sheet. It can be confirmed that there is a phenomenon and burrs and debris are generated during cutting, causing adhesive sticking.

As described above, the present invention provides a light peeling release sheet; Pressure-sensitive adhesive layer; And it provided an inorganic adhesive film of a structure consisting of a heavy peeling release sheet.

By optimizing the peel force difference between the light peeling release sheet and the heavy peeling release sheet and the gel fraction of the pressure-sensitive adhesive layer, the adhesive is not released when removing the light peeling release sheet, and the burr generated when cutting the adhesive film The poor adhesion caused by debris was eliminated.

In addition, the nickname enables high-speed cutting of the inorganic adhesive film can contribute to the improvement of productivity and yield.

Although the present invention has been described in detail only with respect to the embodiments described, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims.

1: light peeling release sheet
2: pressure-sensitive adhesive layer
3: heavy peeling release sheet

Claims (6)

Hard Peeling Release Sheet,
Pressure-sensitive adhesive layer and
Made of a heavy peeling release sheet, the peel force difference between the light peeling release sheet and the heavy peeling release sheet satisfies the following equation 1,
Inorganic adhesive film wherein the gel fraction of the pressure-sensitive adhesive layer calculated by Equation 2 satisfies 50 to 90%:
Equation 1
5gf / 25mm ≤ BA ≤ 50gf / 25mm
Equation 2

In the above, A is the peel force of the light peeling release sheet, B is the peel force of the heavy peeling release sheet, M is the total mass of the adhesive film, m is the mass of the gelled portion of the adhesive film. According to claim 1, wherein the pressure-sensitive adhesive layer is characterized in that the acrylic copolymer copolymerized with 90 to 99% by weight of the acrylic monomer containing no crosslinkable functional group and 1 to 10% by weight of the acrylic monomer containing the crosslinkable functional group. Said inorganic material adhesive film. The method of claim 1, wherein the acrylic monomer containing no crosslinkable functional groups is methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylic. Latex, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl 1- (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylic The inorganic pressure-sensitive adhesive film, characterized in that the form of a single or a mixture of two or more selected from the group consisting of late, myristyl (meth) acrylate, palmityl (meth) acrylate and stearyl (meth) acrylate. According to claim 1, wherein the acrylic monomer containing a crosslinkable functional group is an acrylic monomer having any one functional group in the group consisting of hydroxyl group, carboxyl group, amino group and amide group, the acrylic monomer is characterized in that the single or mixed form Inorganic adhesive film. According to claim 2, wherein the pressure-sensitive adhesive layer is crosslinked containing 0.1 to 10 parts by weight of a single or mixed form thereof selected from an epoxy curing agent or a polyfunctional isocyanate curing agent based on 100 parts by weight of the acrylic copolymer. Inorganic adhesive film. The inorganic adhesive film according to claim 1, wherein a protective sheet is further provided on the outer surfaces of the light peeling release sheet and the heavy peeling release sheet.

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