KR20120045323A - Cooling substrate of electronic component for radiating heat and producing method thereof - Google Patents

Abstract

PURPOSE: A cooling board for emitting heat from electronic components and a method for manufacturing the same are provided to increase bonding force and conductivity by forming a first coating part and a second coating part based on a low temperature spraying technique. CONSTITUTION: A first coating part(10) is formed at one side of a heat emitting part(20) based on a low temperature-based spraying unit. The heat emitting part emits heat from electronic components. The electronic components are directly installed on the first coating part. The first coating part functions as a conducting part. The first coating part is based on copper powder, copper alloy powder, or copper complex powder. Heat absorbed from the first coating part is discharged through the heat emitting part. The heat emitting part emits heat which is conducted from the substrate to the first coating part. A second coating part is stacked on another side of the heat emitting part.

Description

Cooling board for heat dissipation of electronic parts and its manufacturing method {COOLING SUBSTRATE OF ELECTRONIC COMPONENT FOR RADIATING HEAT AND PRODUCING METHOD THEREOF}

The present invention relates to an electronic component heat dissipation cooling substrate and a method of manufacturing the same, in which a material having excellent thermal conductivity is laminated on one surface and the other surface of the heat dissipation unit so that heat generated from the electronic components on the substrate is easily released.

In general, in the case of a PCB board on which an electronic component is mounted, heat generation generated when the electronic component is operated causes damage or deformation of the electronic component or the PCB board, and a problem such as shortening of life due to heat of the electronic component may occur.

In order to solve this problem, the heat dissipation board made of a metal material is installed on the opposite side of the PCB board to which the electronic parts are bonded to dissipate heat generated from the electronic parts.

When installing the heat dissipation board, in order to increase the thermal conductivity between the PCB and the heat dissipation board, soldering is performed using solder, or thermal grease is applied to dissipate heat generated from electronic components of the PCB to the heat dissipation board.

An object of the present invention for solving the above problems is to form the first and second coatings on one surface and the other surface of the heat dissipation portion by low temperature spraying so that the coupling surface between the heat dissipation portion and the substrate is formed densely, and thus the electronic component is mounted. The present invention provides a cooling substrate for heat dissipation of an electronic component and a method of manufacturing the same, which improves a cooling efficiency of cooling heat of an electronic component conducted from a substrate.

The present invention for achieving the above object is formed by spraying the first coating portion on one surface of the heat dissipating part at a low temperature, and further formed a second coating portion on the other surface of the heat dissipation part to be mounted on a substrate laminated on one surface of the first coating part. It is characterized by discharging the heat of the electronic component.

It further includes a second coating to absorb the heat conducted through the heat radiating portion, the coating material formed of powder is sprayed at a low temperature to be laminated on the other surface of the heat radiating portion.

In the manufacturing method of the present invention, a preparing step of preparing a heat dissipation unit laminated on the other side of the substrate on which the electronic product is mounted on one side, and a first coating to form a first coating unit by spraying powder of coating material on one side of the heat dissipation unit at low temperature It characterized in that it comprises a secondary forming step.

The second coating portion forming step of forming a second coating by spraying the powder of the coating material on the other surface of the heat dissipating portion further.

According to the present invention, the first and second coating parts are formed on one surface and the other surface of the heat dissipating part by a low temperature spray coating method, and the heat conducted from the substrate laminated on one surface of the first coating part is transferred to the first coating part. Through the efficient conduction to the heat dissipation unit is easily discharged through the second coating unit has the advantage that the heat dissipation is effectively made to greatly improve the life of the electronic component.

In addition, since the first and second coatings are formed using low temperature spraying, the weight is reduced while increasing the bonding force and conductivity.

1 is a cross-sectional view showing a cooling substrate for dissipating an electronic component of the present invention.
2 is a view schematically showing a low-temperature injection device for manufacturing a cooling substrate for dissipating the electronic component of the present invention.
3 is a flowchart illustrating a method of manufacturing a cooling substrate for dissipating an electronic component of the present invention.
4 is a flowchart illustrating a process of forming first and second coating parts in the manufacturing method of the present invention.
5 is a flowchart in which a second coating part is formed in a method of manufacturing a cooling substrate for dissipating an electronic component according to the present invention.
6 is a cross-sectional view illustrating a second coating part formed on a cooling substrate for dissipating an electronic component of the present invention.
FIG. 7 is a view showing a state in which a coating material is sprayed onto the heat dissipation part and the heat dissipation fin in the manufacturing method of the present invention to form a second coating part.
8 is a view showing the manufacturing process of the present invention in order.
9 is a view showing a cross-sectional structure of the first coating portion coated on the heat dissipation portion in the present invention.
10 is a view showing a state of the cross-sectional structure of the coating by etching the first coating to the heat dissipation unit in the present invention.

Hereinafter, a cooling substrate for dissipating an electronic component and a method of manufacturing the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, different embodiments are given the same or similar reference numerals for the same or similar configurations, and the description is replaced with the first description.

The low temperature spraying technology used here is a technology that is coated by the energy generated when a powder collides with a coating object by using a supersonic gas stream generated by compression and expansion. Unlike conventional spray coating method, it can be coated at room temperature to prevent deformation and deterioration of materials, and greatly improve wear resistance, fatigue resistance, heat resistance, corrosion resistance, etc. to improve the life and performance of automobile, aviation, ship, and semiconductor parts. It can be greatly improved. In particular, it can be used for materials that are difficult to apply to conventional high temperature coatings such as heat-sensitive materials such as plastics, aluminum, aluminum alloys, copper, aluminum composite materials, copper alloys, copper composite materials, titanium and titanium alloys, which are easily oxidized.

The reason for using the low-temperature spraying is to spray the coating material powder at a low temperature to prevent deformation and deterioration of the material, and to improve wear resistance, fatigue resistance, heat resistance, and corrosion resistance, and without etching and deposition in a short time. It is used to form a structure of a desired shape at a desired position.

1 is a cross-sectional view showing a cooling substrate for dissipating an electronic component of the present invention.

Referring to FIG. 1, the present invention includes a first coating part 10 and a heat dissipation part 20.

The first coating part 10 is formed by low temperature spraying through the low temperature spraying device 40 on one surface of the heat dissipating part 20 for dissipating heat of the electronic component.

In this case, the electronic component may be directly mounted on the first coating part 10 without the substrate being stacked. To this end, the first coating part 10 serves as a conductive part and is formed through low temperature spraying in an arbitrary shape.

In addition, the first coating part 10 may have a structure in which a substrate on which an electronic component is mounted is stacked.

The first coating part 10 is made of copper powder or copper alloy powder or copper composite powder.

As a result, the heat absorbed from the first coating part 10 in which the electronic component is mounted on the substrate manufactured by the post-process to the substrate manufactured by the low temperature spray coating is easily discharged through the heat dissipating part 20. do.

The heat dissipation unit 20 dissipates heat on the substrate conducted through the first coating unit 10 and allows the heat conducting from the first coating unit 10 to be quickly released.

The heat dissipation unit 20 is made of any one material of magnesium (Mg), magnesium alloy, iron (Fe), iron alloy, aluminum (Al), aluminum alloy, copper (Cu) or copper alloy. The heat conducted from the coating 10 is to be radiated to the outside.

The second coating part 30 may be additionally formed on the other surface of the heat dissipation part 20.

The second coating part 30 is formed by low temperature spraying through the low temperature injector 40, and is made of copper powder, copper alloy powder, or copper composite powder, and quickly radiates heat conducted from the heat radiating part 20. Let's do it.

In addition, a separate heat dissipation fin 35 may be additionally stacked on the other surface of the second coating part.

The heat dissipation fin 35 is made of any one material of magnesium (Mg), magnesium alloy, iron (Fe), iron alloy, aluminum (Al), aluminum alloy, copper (Cu) or copper alloy to the second coating portion ( The heat conducted in 30) is radiated to the outside.

2 is a view schematically showing a low-temperature injection device for manufacturing a cooling substrate for dissipating the electronic component of the present invention.

Referring to FIG. 2, the low temperature spray device 40 includes a gas control part 41, a main gas heater 42, a powder supply device 43, a powder gas heater 44, a mixing chamber 45, and a temperature control part ( 46), an injection nozzle 47 and a gas reservoir 48.

Here, the gas control unit 41 serves to control the supply amount of gas, while moving the gas stored in the gas storage unit 48 to the main gas heater 42, a part of the gas moves to the powder supply device 43. Let's do it.

The gas stored in the gas storage unit 48 is a mixed gas in which at least one of compressed air, nitrogen, helium, and argon is mixed.

The main gas heater 42 connected to the gas control unit 41 serves to preheat the supplied main gas to a predetermined temperature. The main gas preheated by the main gas heater 42 is supplied to the mixing chamber 45 along the connecting pipe, as shown by the arrows in the figure.

The powder supply device 43 connected to the gas control part 41 supplies powder of the coating material, and connects the coating material powder to the powder gas heater 44 by using the gas partially moved from the gas control part 41. Move through the tube.

Here, the powder gas heater 44 includes a screw-shaped transfer pipe (not shown) and a resistance wire (not shown) for heating it.

In addition, the powder gas heater 44 may include a transfer tube of a direct heating method for directly heating the transfer tube.

The powder gas heater 44 and the main gas heater 42 may adjust the temperature through the temperature control unit 46.

The injection nozzle 47 is disposed to face the heat dissipation unit 20. Here, the injection nozzle 47 has a predetermined angle α with respect to the surface of the heat dissipation unit 20, and preferably disposed at an angle of 90 degrees.

Next, the main gas supplied to the main gas heater 42 of the low temperature injector 40 is heated. Specifically, the gas stored in the gas storage unit 48 is moved to the main gas heater 42, and the main gas heater 42 heats the moved main gas to a temperature of 200 ° C. to 800 ° C.

Here, the main gas is a mixed gas in which at least one of compressed air, nitrogen, helium, and argon is mixed. In this case, when the main gas is heated to a temperature of less than 200 ℃, the gas injection rate is lowered, there is a problem that the production efficiency is lowered.

In addition, when heated to a temperature of more than 800 ℃ there is a problem that the fitting connection portion of the low-temperature spraying device 40 is deformed by heat and not sealed and durability is reduced. Accordingly, the main gas is heated to a temperature of 200 ℃ to 800 ℃.

Next, the powder of the coating material which consists of copper, a copper alloy, or a copper composite material is inject | poured into the heated main gas. To this end, first, the coating material is formed into a powder and supplied from the powder supply device 43.

In this case, the copper composite material powder may be mixed by adding a material powder, such as tungsten, silicon carbide, Al ₂ O ₃ to the copper powder.

Next, the coating material powder is moved to the powder gas heater 44 through the connecting pipe by using the powder gas partially moved by the gas control unit 41.

The powder coating material with the powder gas heater 44 passes through a screw-shaped feed tube (not shown) of the powder gas heater 44. The coating material powder is preheated to a predetermined temperature, for example, 50 ° C. to 800 ° C. while passing through a transfer tube heated by a resistance wire (not shown).

The preheated coating material powder is moved to the mixing chamber 45 along the connecting tube as shown by the arrow in FIG. The coating material powder may be moved to the mixing chamber 45 without preheating.

Then, the coating material is heated to a temperature of 50 to 800 ℃ or supplied to the low temperature injector 40 and sprayed on one surface of the heat dissipation unit 20 through the injection nozzle 47 of the low temperature injector 40 Can be formed.

The coating material maintains the distance between the spray nozzle 47 and the heat dissipation unit 20 is 5-80mm, the supply pressure is sprayed at 15-40kg / cm ² to the one side and the other surface of the heat dissipation unit 20 First and second coating parts 10 and 30 will be formed.

On the other hand, the particle size of the coating material powder may have a 5㎛ to 100㎛. When the particle size of the coating material powder is smaller than 5 μm, problems occur in that coating is not normally performed due to bow shock, and when the particle size exceeds 100 μm, the critical speed at which the particle size is too large is laminated ( critical velocity) becomes difficult to reach. Thereby, it can confirm that a lamination rate falls.

Bow shock refers to a shock wave generated when a collision between the coating material powder and the substrate.

The critical speed may be changed by the particle size of the coating material powder and the temperature and supply pressure of the coating material powder.

Accordingly, the particle size of the coating material powder may be coated with a particle size of 1 to 200㎛, but from the viewpoint of economics of the coating, it is preferable to have 5㎛ to 100㎛. In addition, the particles of the coating material powder has a spherical shape or mass.

Coating material powder having spherical particles has superior coating efficiency than other shaped particles and has an advantageous property in supplying powder.

In addition, the distance between the injection nozzle 47 and the heat dissipation unit 20 may be sprayed while maintaining a distance of 1-100 mm.

However, when the coating material powder is sprayed with the interval between the spray nozzle 47 and the second coating part less than 1 mm, the coating material powder is not coated by the bowing effect or coating efficiency This is not preferable because it requires a further process, such as post-processing in the future because it is low, and the surface roughness of the coating portion is high.

In addition, when the coating material powder is sprayed by spacing the gap between the spray nozzle 47 and the heat dissipating part 35 to 100 mm or more, the coating material powder is lowered below a critical speed to the heat dissipating part 35. There is low bonding force or voids between coating layers because they do not stack or do not result in sufficient plastic deformation.

Due to such voids, the heat dissipation part 20 and the first and second coating parts 10 and 30 are not in close contact with each other, and heat is not properly conducted. Can cause problems.

In order to further improve the cooling performance of the substrate by spraying the coating material powder, the first coating part 10 is formed on one surface of the heat dissipation part 20 and the second coating on the other surface of the heat dissipation part 20. The portion 30 is further formed.

3 is a flowchart illustrating a manufacturing method of a cooling substrate for dissipating an electronic component of the present invention, and FIG. 4 is a flowchart illustrating a coating part forming process in the manufacturing method of the present invention.

Referring to Figure 3 in more detail the manufacturing method as follows.

The present invention is to heat the heat generated from the electronic component on the first coating portion 10 through the preparatory step (S10) and the first coating portion forming step (S20) of the heat dissipation unit 20 to prepare a heat dissipation unit. Cooling substrates can be produced.

The preparation step (S10) is laminated on the other surface of the substrate to dissipate heat of the electronic product, the heat dissipation unit 20 made of any one of magnesium, magnesium alloy, iron, iron alloy, aluminum, aluminum alloy, copper or copper alloy material ) To prepare.

The first coating unit forming step (S20) is a heat dissipation unit in a low-temperature spraying method through the injection nozzle 47 of the low-temperature injector 40 by powdering the coating material made of any one of copper, copper alloy or copper composite material It is a step of forming the first coating part 10 on one surface of the (20).

Here, the process of coating the first coating portion 10 on the heat dissipation portion 20 by spraying the first coating portion 10 in a desired shape on one surface of the heat dissipation portion 20 through a low temperature spray coating To form.

As a result, the first coating part 10 may be directly mounted with an electronic component or a substrate on which the electronic component is mounted.

The second coating part 30 may be further formed on the other surface of the heat dissipating part 20 through the second coating part forming step S30.

The second coating part forming step (S30) is a heat dissipation unit in a low-temperature spraying method through the injection nozzle 47 of the low-temperature injector 40 by powdering the coating material made of any one of copper, copper alloy or copper composite material It is a step of forming the second coating part 30 on the other surface of the (20).

After the second coating part forming step (S30), the heat dissipation fins 35 may be further bonded and stacked on the other surface of the second coating part 30 through any one of pressing, heating, soldering, and brazing bonding. Can be.

Referring to Figure 4 describes the manufacturing process of the coating portion forming step in detail as follows.

The forming of the first and second coating parts 10 and 30 may include a first heating step S100, a second heating step S200, a preheating step S300, and a forming step S400.

In the first heating step S100, the main gas supplied into the main gas heater 42 is heated. The main gas may be a mixed gas of at least one of compressed air, nitrogen, helium, and argon.

At this time, the main gas is supplied by heating to 200-800 ℃.

Next, in the second heating step S200, the powder gas supplied into the powder gas heater 44 is heated. The powder gas may be a mixed gas in which one or more kinds of compressed air, nitrogen, helium, and argon are mixed.

At this time, the powder gas is supplied by heating to 50-800 ℃.

Then, in the preheating step (S300) is mixed with the coating material consisting of any one of copper powder, copper alloy powder or copper composite powder in the air stream of the heated powder gas to preheat.

At this time, the copper composite material powder is mixed with the copper powder, the material powder such as tungsten, silicon carbide, Al ₂ O ₃ is added.

The copper alloy is obtained by powdering an alloy in which copper and tungsten, silicon carbide, and Al ₂ O ₃ are mixed and melted.

In the next step, the forming step (S400) to form a coating layer by mixing the preheated coating material powder with the main gas and sprayed through a low temperature injector (40).

That is, while maintaining the distance between the injection nozzle 47 of the low temperature injector 40 and the first and second coating parts 10 and 30 5 to 50 mm, the supply pressure is 15 to 40 kg / cm ² the coating The first and second coating parts 10 and 30 may be formed on one surface and the other surface of the heat dissipating part 20 by spraying a material powder.

At this time, the coating material powder of the first and second coating parts 10 and 30 is formed in a spherical shape, the particle size is 5 to 100㎛ made through the injection nozzle 47 of the low temperature injector 40 On one side and the other side of the heat dissipation unit 20 is formed to have a thickness of 20 to 200㎛.

This, the coating material is heated to a temperature of 50 or 800 ℃ ℃ room temperature or 50 to 800 ℃ supplied to the low temperature injector 40 and then one surface and the other surface of the heat dissipation unit 20 through the injection nozzle 47 of the low temperature injector 40 Can be sprayed on and formed.

The heat dissipation fin 35 may be coupled to the other surface of the second coating part 30 to further dissipate heat of the heat dissipation part 20.

At this time, the second coating part 30 sprays the coating material on the other surface of the heat dissipating part 20 and one surface of the heat dissipation fin 35 through the low temperature spraying device 40, respectively, and heats the two coating materials. It can be formed by joining by any one of the method of pressing, soldering or brazing bonding.

The heat dissipation unit 20 is made of any one of aluminum (Al), aluminum alloy, copper (Cu) or copper alloy material so that heat can be easily released.

The cooling substrate for dissipating the electronic component manufactured through the above process radiates heat to the first coating part 10 through any one of heating, pressing, soldering or brazing bonding to the first and second coating parts 10 and 30. The coupling force between the parts 20 and the heat dissipation part 20 and the second coating part 30 may be improved.

Meanwhile, an aluminum composite layer may be further formed by spraying the aluminum composite powder at a low temperature between the heat dissipation unit 20 and the first and second coating units 30.

As such, the first and second coating parts are formed on one surface and the other surface of the heat dissipating part by a low temperature spray coating method, and heat conducted from the substrate laminated on one surface of the first coating part is transferred to the heat dissipating part through the first coating part. Efficiently conducted and easily discharged through the second coating, thereby effectively dissipating heat, thereby greatly improving the life of the electronic component.

In addition, since the first and second coatings are formed using low temperature spraying, the weight is reduced while increasing the bonding force and conductivity.

The above embodiments may be configured such that various modifications may be made by selectively combining all or part of the embodiments.

10: first coating part 20: heat dissipation part
30: second coating portion 35: heat dissipation fin
40: low temperature injection device 41: gas control unit
42: main gas heater 43: powder feed device
44: powder gas heater 45: mixing chamber
46: temperature control unit 47: injection nozzle
48 gas storage unit

Claims (28)

A heat dissipation unit for dissipating heat of the electronic component; And
And a first coating part on which one surface of the heat dissipating part is formed by spraying the coating material formed of powder at a low temperature, and the electronic component is mounted thereon.
The method of claim 1,
And a second coating part which absorbs heat conducted through the heat dissipation part and is formed by powder coating at a low temperature to be laminated on the other surface of the heat dissipation part.
The method of claim 1,
And a heat dissipation fin stacked on the other surface of the second coating part.
The method of claim 1,
The first coating part is made of a coating material of any one of copper powder, copper alloy powder or copper composite powder, the electronic component heat dissipation cooling substrate.
The method of claim 1,
The first coating part is formed of a thickness of 20 to 200㎛, Cooling substrate for electronic component heat dissipation.
The method of claim 2,
The second coating part is made of a coating material of any one of copper powder, copper alloy powder or copper composite powder, the electronic component heat dissipation cooling substrate.
The method of claim 2,
The second coating part is formed of a thickness of 20 to 200㎛, Cooling substrate for electronic component heat dissipation.
3. The method according to claim 1 or 2,
The coating material is heated to room temperature or a temperature of 50-800 ℃ is supplied to a low temperature spray device, the electronic component heat dissipation cooling substrate.
The method of claim 1,
The heat dissipation unit is made of any one of magnesium, magnesium alloy, iron, iron alloy, aluminum, aluminum alloy, copper or copper alloy material, a cooling substrate for electronic component heat dissipation.
Preparing a heat dissipation unit for dissipating heat of electronics; And
And a first coating part forming step of forming a first coating part by spraying the powder of the coating material on one surface of the heat dissipation part at a low temperature.
The method of claim 10,
And a second coating part forming step of forming a second coating part by spraying powder of the coating material on the other surface of the heat dissipating part at a low temperature.
The method of claim 10,
The first coating portion forming step,
A first heating step of heating the main gas supplied into the main gas heater of the low temperature injector;
A second heating step of heating the powder gas supplied into the powder gas heater of the low temperature injector;
A preheating step of preforming and mixing the coating material forming the first coating part in a stream of the heated powder gas to form a powder; And
And forming the first coating part on one surface of the heat dissipation part through a spray nozzle by mixing the preheated coating material with the main gas.
12. The method of claim 11,
The second coating portion forming step,
A first heating step of heating the main gas supplied into the main gas heater of the low temperature injector;
A second heating step of heating the powder gas supplied into the powder gas heater of the low temperature injector;
A preheating step of forming and mixing a coating material for forming the second coating part in the air stream of the heated powder gas and mixing the powder; And
And forming the second coating part on the other surface of the heat dissipation part through the injection nozzle by mixing the preheated coating material with the main gas.
The method according to claim 12 or 13,
The main gas and the powder gas is a mixed gas in which at least one of compressed air, nitrogen, helium and argon is mixed.
The method according to claim 12 or 13,
In the first heating step, the main gas is heated to 200-800 ℃, the electronic component heat dissipation cooling substrate manufacturing method.
The method according to claim 12 or 13,
In the second heating step, the powder gas is heated to 50-800 ℃, the electronic component heat dissipation cooling substrate manufacturing method.
12. The method of claim 11,
In the forming of the first coating part, the distance between the spray nozzle and the heat dissipation part is maintained at 1-100 mm, and the supply pressure is 15-40 kg / cm ² .
12. The method of claim 11,
The coating material powder used in the first coating part forming step is formed in a spherical shape, the particle size of 5 to 100㎛, the manufacturing method of the electronic component heat dissipation cooling substrate.
12. The method of claim 11,
The first coating part is made of a coating material of any one of copper powder, copper alloy powder or copper composite powder which is sprayed at a low temperature through a low temperature spraying device, the electronic component heat dissipation cooling substrate manufacturing method.
12. The method of claim 11,
The first coating part is a low-temperature spraying to have a thickness of 20 to 200㎛, electronic component heat dissipation cooling substrate manufacturing method.
The method of claim 12,
In the forming of the second coating part, the distance between the spray nozzle and the heat dissipation part is maintained at 5 to 50 mm, and the supply pressure is 15 to 40 kg / cm ² .
The method of claim 12,
The coating material powder used in the second coating part forming step is formed in a spherical shape, the particle size of 5 to 100㎛, the manufacturing method of the electronic component heat dissipation cooling substrate.
The method of claim 12,
The second coating part is made of a coating material of any one of copper powder, copper alloy powder or copper composite powder which is sprayed at a low temperature through a low temperature spraying device, the electronic component heat dissipation cooling substrate manufacturing method.
The method of claim 12,
The second coating part is a low-temperature spraying to have a thickness of 20 to 200㎛, electronic component heat dissipation cooling substrate manufacturing method.
The method of claim 12,
The heat dissipation fin is laminated on the other surface of the second coating, electronic component heat dissipation cooling substrate manufacturing method.
The method of claim 12,
The second coating unit, the coating material is sprayed between the heat dissipation unit and the heat dissipation fin through a low temperature spray device, respectively, and formed by bonding the two coating materials, electronic component heat dissipation cooling substrate manufacturing method.
The method according to claim 10 or 11,
The coating material is heated to room temperature or a temperature of 50-800 ℃ is supplied to a low temperature spray device, the electronic component heat dissipation cooling substrate manufacturing method.
The method of claim 10,
The heat dissipation unit is made of any one of magnesium, magnesium alloy, iron, iron alloy, aluminum, aluminum alloy, copper or copper alloy material, the electronic component heat dissipation cooling substrate manufacturing method.

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