KR20120030489A - The stucture of recessed led downlight housing - Google Patents

Abstract

PURPOSE: A ceiling buried downlight device is provided to increase a light emission area by mounting a cover lens made of glass, polycarbonate, or acryl as a diffusion plate in a preset thickness range. CONSTITUTION: An LED(5) is mounted on a printed circuit board(4). A heat sink(1) discharges heat from the LED. A lighting cylinder(7) has a plurality of guide grooves on the outer surface thereof. A leaf spring is inserted into a guide groove which is opened in a step direction. A transparent or semitransparent lens cover is mounted in a cap(9).

Description

The stucture of recessed LED downlight housing

The present invention relates to a ceiling-mounted downlight luminaire, and to a ceiling-mounted downlight luminaire to be embedded in the ceiling.

The technology related to a general lighting fixture is described in detail in patent application No. 10-2010-0027840, utility model application No. 20-2010-0003260 and the like, and redundant description is omitted.

Since the conventional LED downlight luminaires are coiled springs, leaf springs, fixed brackets, etc. are attached to the outer surface of the lighting cylinder, the spatial volume of these LEDs requires a relatively small diameter of the lighting cylinder. As a result, there is a disadvantage that the light emitting area is reduced.

As a result, the area of the cover lens is also narrowed, which limits the light distribution efficiency of light emitted from the LED.

Therefore, there is a need for research and development of lighting fixtures to improve the light emitting area of LED downlights.

As described above, the present invention,

Regarding the ceiling mounted LED downlight luminaire which consists of a heat sink, an LED module, a heat sink, a light cylinder, a cover lens, a cap, and a leaf spring, and which can insert a leaf spring,

The heat generated from the LED module is conducted and radiated through the heat sink through the heat sink, heat sink, lighting cylinder, cap, and leaf spring to the entire luminaire, thereby dramatically improving the illumination and life of the LED lighting. The assembly consisting of an LED module and a heat sink has a structure that can be easily assembled and assembled with the lighting cylinder.

In addition, in order to ensure that the assembly is in close contact with the lighting cylinder, the side surface portion of the heat sink is a male screw shape and the inner surface of the lighting cylinder is designed into a female screw shape. If necessary, the inner surface of the lighting cylinder has a stepped shape so that the heat sink can be fastened with a screw.

And to mount the downlight on the ceiling to form a spring guide groove structure for inserting the leaf spring on the inner surface of the illumination cylinder, and has a screw shape so that the cover lens can be easily assembled between the illumination cylinder and the cap.

The leaf springs are assembled in close contact with the light cylinder without the use of screws or rivets.

The present invention for performing the above object is a printed circuit board mounted with an LED; A heat sink for dissipating heat emitted from the LED and having a plurality of 'C'-shaped screw grooves formed on a heat dissipation fin to be coupled to a rear surface of the printed circuit board; An illumination cylinder having a step formed on an upper inner circumferential surface thereof so as to be mounted in a state in which the printed circuit board and the heat sink are coupled to each other in a vertical shape, and having a plurality of guide grooves formed on an outer circumferential surface thereof; Is inserted into the guide groove which is opened in the step direction on the illumination cylinder, coupled to the plate spring and the lower end of the illumination cylinder coupled to the heat sink or the printed circuit board is tightly fixed on the step, transparent or inside Provides a ceiling-mounted downlight luminaire comprising a cap on which a translucent cover lens is mounted.

The cap may include a support protruding into the lower end of the cap to support the outer circumferential surface of the cover lens such that the cover lens is interposed between the illumination cylinder and the cap.

The leaf spring may be bent into a 'U' shape so that one side is inserted into the guide groove to be in close contact, and the other side is elastically deformed to fix the lighting cylinder inside the ceiling.

The leaf spring is provided with a concave-convex projecting toward the inner side of the guide groove so that one side is inserted into the guide groove in close contact, and the other side is elastically deformed to fix the lighting cylinder inside the ceiling.

According to the ceiling-mounted downlight luminaire according to the present invention, the entire luminaire can efficiently dissipate heat generated from the LED, and the cover lens is a diffuser plate made of glass, polycarbonate or acrylic, depending on the application. The thickness within a certain range can be mounted to increase the emission area and to improve the glare caused by the LED and the dot not visible when the LED is lit.

1 is a cross-sectional exploded view showing a ceiling-mounted downlight luminaire according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the heat sink shown in FIG. 1. FIG.
3 is an enlarged partial view of the upper end of the illumination cylinder shown in FIG.
FIG. 4 is a perspective view showing the illumination cylinder shown in FIG. 1. FIG.
FIG. 5 is a partially enlarged view showing a step formed to mount the guide groove and the printed circuit board shown in FIG. 4.
FIG. 6 is a partially enlarged view of the guide groove shown in FIG. 4 as viewed from the outside. FIG.
7 is a partially enlarged view showing a step formed to mount the C-type screw groove and the printed circuit board inside the illumination cylinder shown in FIG.
FIG. 8 is a bottom perspective view showing the cap shown in FIG. 4. FIG.
FIG. 9 is a top perspective view showing the cap shown in FIG. 4. FIG.
10 is a cross-sectional view illustrating the cap shown in FIG. 4.
FIG. 11 is a partial cross-sectional view showing the cap shown in FIG. 4. FIG.
12 is a side view of the leaf spring fastened to the guide groove shown in FIG.
13 is a plan view of a leaf spring fastened to the guide groove shown in FIG.
14 is a plan view showing a leaf spring according to another embodiment of the present invention.
FIG. 15 is a plan view illustrating a state in which a leaf spring is fastened to the guide groove illustrated in FIG. 4.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the ordinary or dictionary meanings, and the inventors properly define the concept of terms in order to explain their invention in the best way. Based on the principle that it can be, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

In general, the luminaire of the ceiling-mounted downlight has a diameter of the luminaire cylinder according to the diameter of the recess formed in the ceiling such as 2 inches, 3 inches, 4 inches, 4,5 inches, 5 inches, 6 inches, 8 inches, 10 inches, etc. Vary in size.

For example, a 6-inch downlight must be able to be mounted on the 6-inch diameter of the ceiling recess, so in practice, the diameter of the 6-inch downlight must be smaller than this to secure it to the ceiling. Therefore, increasing the diameter of the LED downlight illumination cylinder as large as possible can increase the light distribution efficiency of the light emitted from the LED.

With reference to the accompanying drawings will be described in detail the implementation of the present invention.

1 is a cross-sectional exploded view showing a ceiling-mounted downlight luminaire according to an embodiment of the present invention.

Referring to FIG. 1, the ceiling-mounted downlight luminaire radiates heat from a printed circuit board 4 on which an LED 5 is mounted and heat emitted from the LED 5, and the printed circuit board 4. A heat sink 1 having a plurality of 'C'-shaped screw grooves 13 formed on a heat dissipation fin so as to be coupled to the rear surface of the heat sink 1, and the printed circuit board 4 and the heat sink 1 are coupled to each other in a cylindrical shape having a vertical opening. Step (2) is formed on the upper inner circumferential surface to be mounted in a state in which the state, and coupled to the lower end of the illumination cylinder (7) and the illumination cylinder (7), the plurality of guide grooves (see Fig. 4, 18) formed on the outer circumferential surface, It includes a cap (9) on which a transparent or translucent cover lens (11) is mounted.

Heat generated from the LED module composed of the printed circuit board 4 and the LED 5 is radiated from the heat sink 1, and between the printed circuit board 4 and the heat sink 1 A heat sink 3 may be additionally provided to more efficiently transfer heat emitted from the printed circuit board 4 to the heat sink 1.

Of course, in order to improve heat dissipation performance, a heat dissipation plate may be replaced when a printed circuit board such as metal or ceramic material having excellent heat dissipation or heat conductivity is used. Hereinafter, the ceiling-mounted downlight luminaire having the heat sink 3 will be described as an example.

As shown in FIG. 2, the heat sink 1 may be manufactured in a circular radial shape with a plurality of heat sinks, and may be implemented in various shapes according to heat dissipation characteristics. Therefore, the shape of the heat sink 1 is not limited thereto, and may be changed into various shapes and structures.

3 is an enlarged partial view of the upper end of the illumination cylinder 7 shown in FIG. 1, FIG. 4 is a perspective view showing the illumination cylinder 7 shown in FIG. 1, and FIG. 5 is a guide groove (shown in FIG. 18 is a partially enlarged view showing the step 16 formed to mount the printed circuit board 4, and FIG. 6 is a partially enlarged view of the guide groove 18 shown in FIG. 7 is a partially enlarged view showing the step 16 formed to mount the C-shaped screw groove 13 and the printed circuit board 4 inside the illumination cylinder 7 shown in FIG.

Referring to FIGS. 3 to 7, the structure of the illumination cylinder 7 is described in detail. The heat generated from the LED module including the printed circuit board 4 and the LED 5 is transferred to the heat sink 3 and the heat sink. 1) and the step on the inner surface of the lighting cylinder (7) to conduct heat by conducting heat to the entire downlight luminaire composed of the lighting cylinder (7), cap (9), leaf spring (see Figure 12) 16 and screws 14 are fastened.

The purpose of forming the step 16 is to provide the step of the illumination cylinder of FIG. 3 with the heat sink 3, the printed circuit board 4, or a printed circuit board such as a metal or a ceramic material having excellent heat dissipation or thermal conductivity, if necessary. 16) to be assembled on the top, or to allow the heat sink 15 processed in the form of the screw (14) in close contact with the inner surface of the illumination cylinder (7).

In addition, the spring guide groove 18 shown in FIG. 4 is formed on the inner surface of the illumination cylinder 7 to allow the leaf spring to be inserted into the light distribution area. This makes the thickness of the guide groove 18 as thin as possible and at the same time enables the coupling of the plate spring to reduce the overall thickness of the illumination cylinder 7 to secure the light distribution area.

The role of the leaf spring is used to fix the ceiling and in the present invention, the leaf spring is also combined with the illumination cylinder (7) has a heat dissipation function.

The C-type screw groove 17 shown in FIG. 4 is formed to assemble the heat sink 3, and instead of the C-type screw groove 17, male threads are formed in the heat sink 3 as shown in FIG. In addition, a female screw may be formed on the step side of the illumination cylinder to be assembled by screwing.

The step of the illumination cylinder is formed inside the upper end of the illumination cylinder so as to place the heat sink (3).

The reason why the C-type screw groove is formed as shown in FIG. 7 is to reduce machining cost and improve assembly by eliminating the need for a separate thread machining.

FIG. 8 is a bottom perspective view showing the cap shown in FIG. 4, FIG. 9 is a top perspective view showing the cap shown in FIG. 4, FIG. 10 is a sectional view showing the cap shown in FIG. 4, and FIG. 11 is shown in FIG. 4. It is a partial cross section which shows the cap shown.

8 to 11, the structure of the cap 9, which is an embodiment of the present invention, will be described in detail.

The cap 9 coupled to the lighting cylinder 7 is to be supported on the outer surface of the ceiling finish, such as textile, plywood, gypsum board when the downlight luminaire is embedded in the ceiling, the ceiling inside the The leaf spring is inserted and fixed from the ceiling by the support angle α of the leaf spring (see FIG. 12 or FIG. 13) fastened to the illumination cylinder 7, and the cap 9 is suspended from the ceiling outside the ceiling. Will catch.

The cap 9 serves to mount the cover lens 11 of plastic resin, such as glass, polycarbonate, or acrylic, to diffuse light emitted from the LED.

A screw thread 10 is formed on the inner surface of the cap 9 to assemble the lighting cylinder 7, and a support 12 is provided on the lower inner circumferential surface of the cap 9 to support the cover lens 11.

The cap 9 is configured to be fixed or attached regardless of the thickness of the cover lens 11 within the range of thread transfer distance for assembly at the lower side of the illumination cylinder (7), separate screws or clamps, It was possible to assemble without an auxiliary material such as an adhesive.

The cover lens 11 generally uses a diffusion plate containing a diffusion material so that no glare phenomenon or LED lighting source is generated by the light emitted by the LED, and the glare phenomenon is reduced according to the thickness of the diffusion plate and the LED is reduced. The cover lens may have a thickness within a predetermined range by preventing a dot from being turned on and adjusting a conveying distance of threads formed on the illumination cylinder 7 and the cap 9 regardless of the thickness of the cover lens 11 ( 11) assembly is possible fluidly.

12 is a side view of the leaf spring fastened to the guide groove shown in Figure 4, Figure 13 is a plan view of the leaf spring fastened to the guide groove shown in Figure 4, Figure 14 is a leaf spring according to another embodiment of the present invention It is a top view showing.

12 to 14, the leaf spring is described in detail when the leaf spring is inserted into the spring guide groove 18 formed in the illumination cylinder (see FIGS. 1 and 7) as shown in FIG. 12. It is formed to have a structure bent 23 as shown in Figure 13 so as to reduce the mechanical separation distance by the thickness of the leaf spring, and to be in close contact with the spring guide groove 18 to have a heat dissipation function.

And the leaf spring can be fixed regardless of the thickness of the ceiling finishing material, such as textile, plywood, gypsum board within the α range that the support spring 21 is formed to be inclined. Therefore, the downlight luminaire may be installed in a flexible manner depending on the thickness of the ceiling finish.

14 is a plan view showing a leaf spring according to another embodiment of the present invention.

Referring to FIG. 14, in some cases, the plate spring may be provided on the leaf spring so that the leaf spring is in close contact with the spring guide groove 18.

FIG. 15 is a plan view illustrating a state in which a leaf spring is fastened to the guide groove illustrated in FIG. 4.

Referring to FIG. 15, when the plate spring is fastened to the guide groove 18 as shown in FIG. 13, β, the plate spring bending angle 22, may be adjusted according to the elasticity in the horizontal direction. Therefore, the plate spring is elastically attached to the outer peripheral surface of the lighting cylinder 7 until the plate spring is introduced into the ceiling, and the plate spring is unfolded by the elasticity as the plate spring enters the ceiling, and the plate spring is unfolded from the inside of the ceiling. It has a function of fixing the downlight luminaire.

In addition, the leaf spring inserted into the guide groove 18 is mounted on the step 16 of the heat sink 1, the heat sink 3, or the printed circuit board 4 formed on the top of the guide groove 18. By pressing the leaf spring is formed so as to prevent detachment on the illumination cylinder (7) and tightly fastened.

Therefore, the heat released from the printed circuit board 4 is heat transfer to the area in contact with the heat sink 1 and the step 16 is expected more efficient heat dissipation effect.

In addition, the assembly structure of the leaf spring can be improved by improving the fastening structure of the leaf spring on the lighting cylinder 7, and the downlight luminaire can be easily mounted inside the ceiling.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 heat sink 3 heat sink
4: printed circuit board 5: LED (LED)
7: lighting cylinder 8: screw
9: cap 11: cover lens
12: support 13: c-type screw groove
16 step 17: c-type screw groove
18: guide groove 21: support angle

Claims (4)

A printed circuit board on which an LED is mounted;
A heat sink for dissipating heat emitted from the LED and having a plurality of 'C'-shaped screw grooves formed on a heat dissipation fin to be coupled to a rear surface of the printed circuit board;
An illumination cylinder having a step formed on an upper inner circumferential surface thereof so as to be mounted in a state in which the printed circuit board and the heat sink are coupled to each other in a vertical shape and having a plurality of guide grooves formed on an outer circumferential surface thereof;
A leaf spring inserted into the guide groove opened in the step direction on the illumination cylinder, and coupled to the heat sink or the printed circuit board by being tightly fixed on the step;
A cap coupled to the lower end of the illumination cylinder and mounted with a transparent or translucent cover lens therein;
Recessed ceiling downlight lighting fixture comprising a. The method according to claim 1,
The cap
Ceiling mounted downlight luminaire comprising a support for projecting the inner side of the lower end of the cap to support the cover lens interposed between the illumination cylinder and the cap to support the outer circumferential surface of the cover lens. The method according to claim 1,
The leaf spring is,
One side is inserted into the guide groove is bent in the 'U' shape to be in close contact, the other side is elastically deformed ceiling-mounting downlight lighting fixture for fixing the lighting cylinder inside the ceiling. The method according to claim 1,
The leaf spring is,
Unevenness is provided to protrude toward the inner surface of the guide groove so that one side is inserted into the guide groove in close contact, the other side is elastically deformed ceiling-mounting downlight lighting fixture for fixing the lighting cylinder inside the ceiling .

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