KR20120027784A - Method for manufacturing transparent conductive film using direct liquid injection-metal-organic chemical vapor deposition(dli-mocvd) and transparent conductive film manufactured by the method - Google Patents
Method for manufacturing transparent conductive film using direct liquid injection-metal-organic chemical vapor deposition(dli-mocvd) and transparent conductive film manufactured by the method Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 14
- 239000007788 liquid Substances 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 22
- 239000002243 precursor Substances 0.000 claims abstract description 47
- 238000000151 deposition Methods 0.000 claims abstract description 21
- 230000008021 deposition Effects 0.000 claims abstract description 18
- 239000003960 organic solvent Substances 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 15
- 239000010955 niobium Substances 0.000 claims abstract description 15
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- 239000006200 vaporizer Substances 0.000 claims abstract description 10
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010936 titanium Substances 0.000 claims abstract description 9
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 9
- 239000011701 zinc Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000009834 vaporization Methods 0.000 claims abstract description 7
- 230000008016 vaporization Effects 0.000 claims abstract description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 47
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 22
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 14
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 14
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 12
- 230000000996 additive effect Effects 0.000 claims description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 12
- 239000011787 zinc oxide Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 9
- 239000012495 reaction gas Substances 0.000 claims description 9
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 150000002902 organometallic compounds Chemical class 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910001868 water Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 9
- 150000002736 metal compounds Chemical class 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 58
- 239000010409 thin film Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- OBOYOXRQUWVUFU-UHFFFAOYSA-N [O-2].[Ti+4].[Nb+5] Chemical compound [O-2].[Ti+4].[Nb+5] OBOYOXRQUWVUFU-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- ZEIWWVGGEOHESL-UHFFFAOYSA-N methanol;titanium Chemical compound [Ti].OC.OC.OC.OC ZEIWWVGGEOHESL-UHFFFAOYSA-N 0.000 description 1
- ZTILUDNICMILKJ-UHFFFAOYSA-N niobium(v) ethoxide Chemical compound CCO[Nb](OCC)(OCC)(OCC)OCC ZTILUDNICMILKJ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Abstract
Description
본 발명은 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법 및 이에 의해 제조된 투명도전막에 관한 것으로서, 보다 상세하게는 증착하고자 하는 금속 화합물을 혼합 전구체 용액으로 이용함으로써 용액의 조성을 조절할 수 있고, 이를 통해 박막의 조성을 용이하게 제어할 수 있는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법 및 이에 의해 제조된 투명도전막에 관한 것이다.The present invention relates to a method for manufacturing a transparent conductive film using a direct liquid injection type chemical vapor deposition method and a transparent conductive film prepared by the above, more specifically, the composition of the solution can be adjusted by using a metal compound to be deposited as a mixed precursor solution The present invention relates to a method for manufacturing a transparent conductive film using a direct liquid injection type chemical vapor deposition method which can easily control the composition of a thin film, and a transparent conductive film prepared thereby.
일반적으로 태양전지의 투명전극(transparent electrode), 발광다이오드(LEDs), 디스플레이의 윈도우 물질(window materials)등과 같은 광전자 소자에는 투명도전막이 이용되고 있다.
BACKGROUND ART In general, transparent conductive films are used for optoelectronic devices such as transparent electrodes of solar cells, light emitting diodes (LEDs), window materials of displays, and the like.
상기 투명도전막은 주석을 첨가한 산화인듐(ITO:Induim-tin oxide), 불소를 첨가한 산화주석(FTO:Fluorine doped tin oxide)등이 가장 널리 사용되며, 이는 10-4Ω?㎝대의 낮은 비저항과 가시광선 영역에서 90% 이상의 높은 투과도의 우수한 특성을 가지고 있다. 그러나, 소자 제작시 수소 플라즈마 분위기 속에서 장시간 노출되면 투명도전막 표면에 인듐이나 주석이 환원되어 전기 및 광학적 특성이 현저히 저하되는 단점이 있다. 또한 원재료인 인듐 고갈에 의한 공급의 한계와 인체 유해성의 대두로 대체재의 개발이 시급한 실정이다.
The transparent conductive film is most commonly used indium tin oxide (ITO), fluorinated tin oxide (FTO), etc., which has a low resistivity of 10 -4 Ω · cm It has excellent transmittance of more than 90% in the visible light region. However, when the device is exposed for a long time in a hydrogen plasma atmosphere, indium or tin is reduced on the surface of the transparent conductive film, and thus, electrical and optical properties are significantly reduced. In addition, the development of substitutes is urgent due to the limitation of supply due to the indium depletion of raw materials and the rise of human hazards.
이에 친환경, 저가 소재인 아연 산화물이나 티타늄 산화물을 기반으로 하는 투명도전막의 연구가 활발하게 이루어지고 있다. 일반적으로 아연 산화물이나 티타늄 산화물을 기반으로 하는 투명도전막의 증착 방법으로는 물리적 증착법과 화학 기상 증착법이 널리 사용되는데, 이러한 화학 기상 증착법은 물리적 증착법에 비해 증착속도가 빠르고, 대면적 증착이 가능하며, 층덮임(step coverage)이 우수하다.
Accordingly, researches on transparent conductive films based on zinc oxide or titanium oxide, which are eco-friendly and low-cost materials, have been actively conducted. In general, physical vapor deposition and chemical vapor deposition are widely used as the deposition method of the transparent conductive film based on zinc oxide or titanium oxide, and the chemical vapor deposition method is faster than the physical vapor deposition method, and it is possible to deposit a large area. Excellent step coverage.
특히, 아연 산화물 기반의 투명도전막 소재의 경우 박막 제조시 널리 사용되는 플라즈마 화학 기상 증착 공정에서 발생되는 수소에 대한 내환원성이 우수한 것으로 알려져 있다. 그러나, 현재 제조되고 있는 아연 산화물과 티타늄 산화물을 기반으로 하는 투명도전막은 전기적 특성이 다소 떨어지는 단점을 가지고 있다.
In particular, the zinc oxide-based transparent conductive film material is known to have excellent reduction resistance against hydrogen generated in a plasma chemical vapor deposition process which is widely used in manufacturing thin films. However, currently manufactured transparent conductive films based on zinc oxide and titanium oxide have a disadvantage in that electrical characteristics are somewhat deteriorated.
또한, 기존의 버블러(bubber)형 화학 기상 증착법은 증착시 사용되는 전구체가 액상인 경우 재현성 있는 기화와 증착이 가능하나 고상인 경우 재현성 있는 원료의 기화가 어려워 도전막의 조성 제어가 용이하지 않은 단점이 있다. 또한 고상의 전구체는 대체적으로 증기압이 낮아 100℃ 이상의 높은 온도를 유지해야 하는데 이때 증발 중 점진적인 분해반응으로 인한 전구체 변질의 문제점이 있다.
In addition, the conventional bubbler type chemical vapor deposition method is capable of reproducible vaporization and deposition when the precursor used in the liquid phase is liquid, but it is difficult to control the composition of the conductive film because it is difficult to vaporize the reproducible raw material in the solid phase. There is this. In addition, the precursor of the solid phase is generally low vapor pressure to maintain a high temperature of more than 100 ℃ at this time there is a problem of precursor deterioration due to the gradual decomposition reaction during evaporation.
본 발명은 상기 문제점을 해결하기 위한 것으로서, 도전막의 조성 제어가 용이하고, 효율적으로 대면적 증착이 가능한 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법 및 이에 의해 제조된 투명도전막을 제공하고자 하는 것이다.The present invention is to solve the above problems, to provide a method for manufacturing a transparent conductive film using a direct liquid injection type chemical vapor deposition method that can easily control the composition of the conductive film, and can efficiently deposit a large area, and to provide a transparent conductive film prepared thereby It is.
본 발명은 아연 또는 티타늄을 포함하는 유기 금속 화합물을 유기 용매에 녹인 전구체 용액과 알루미늄, 갈륨 및 니오븀으로 이루어지는 그룹으로부터 선택된 1종 이상을 포함하는 첨가물을 유기 용매에 녹인 전구체 용액을 혼합하는 단계; 상기 혼합된 전구체 용액을 용액 주입기를 통해 기화기에 주입하여 기화시키는 단계; 상기 기화작용에 의해 생성된 증기와 반응 기체를 증착반응기에 도입하는 단계; 및 상기 도입된 증기와 반응 기체를 유리 기판과 접촉시켜 도전막을 형성시키는 단계를 포함하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법을 제공한다.
The present invention comprises the steps of mixing a precursor solution of an organic metal compound containing zinc or titanium in an organic solvent and a precursor solution of an additive comprising at least one selected from the group consisting of aluminum, gallium and niobium in an organic solvent; Injecting the mixed precursor solution into a vaporizer through a solution injector to vaporize the mixed precursor solution; Introducing vapor and reaction gas generated by the vaporization into a deposition reactor; And forming a conductive film by contacting the introduced vapor and the reaction gas with a glass substrate to provide a method of manufacturing a transparent conductive film using a direct liquid injection type chemical vapor deposition method.
이 때, 상기 유기 금속 화합물을 유기 용매에 녹인 전구체 용액과 상기 첨가물을 유기 용매에 녹인 전구체 용액은 1 : 0.001~1의 농도비로 혼합되는 것이 바람직하다.
At this time, the precursor solution in which the organometallic compound is dissolved in an organic solvent and the precursor solution in which the additive is dissolved in an organic solvent are preferably mixed at a concentration ratio of 1: 0.001 to 1.
또한, 상기 유기 용매는 헥산, 헵탄, 옥탄, n-부틸아세테이트 및 테트라하이드로퓨란(THF)으로 이루어지는 그룹으로부터 선택된 1종 이상인 것이 바람직하며, 상기 반응 기체는 산소, 물, 과산화수소, 질소산화물 및 이산화탄소로 이루어지는 그룹으로부터 선택된 1종 이상인 것이 바람직하다.
In addition, the organic solvent is at least one selected from the group consisting of hexane, heptane, octane, n-butyl acetate and tetrahydrofuran (THF), the reaction gas is oxygen, water, hydrogen peroxide, nitrogen oxides and carbon dioxide It is preferable that it is 1 or more types chosen from the group which consists of.
이에 더하여, 상기 도전막을 형성시키는 단계는 200~600℃의 온도에서 이루어질 수 있으며, 플라즈마를 이용하여 실온~250℃의 온도범위에서 이루어질 수 있다.
In addition, the step of forming the conductive film may be made at a temperature of 200 ~ 600 ℃, it may be made in a temperature range of room temperature ~ 250 ℃ using a plasma.
본 발명은 상기 제조방법에 의해 제조된 투명도전막을 제공한다.
The present invention provides a transparent conductive film prepared by the above manufacturing method.
상기 투명도전막은 갈륨이 첨가된 산화아연(GZO)도전막, 알루미늄이 첨가된 산화아연(AZO)도전막 및 니오븀이 첨가된 산화티타늄(TNO)도전막으로 이루어진 그룹으로부터 선택된 1종 이상인 것이 바람직하다.The transparent conductive film is preferably at least one selected from the group consisting of gallium-added zinc oxide (GZO) conductive films, aluminum-added zinc oxide (AZO) conductive films, and niobium-containing titanium oxide (TNO) conductive films. .
본 발명에 의하면 첨가물의 주입 조절이 용이하므로, 도전막의 조성 제어가 쉽고, 대면적 증착이 가능하며, 제조비용이 절감될 수 있는 투명도전막의 제조방법을 제공할 수 있다.According to the present invention, it is possible to provide a method for manufacturing a transparent conductive film that can easily control the injection of additives, which allows easy control of the composition of the conductive film, enables large-area deposition, and reduced manufacturing costs.
도 1은 본 발명의 실시예 1 및 2에 따라 변화하는 혼합 전구체 용액의 농도비에 의해 변화하는 박막내 원자비를 나타내는 그래프이다.
도 2는 본 발명의 실시예 1 및 2에 따라 제조된 투명도전막의 Al 및 Nb의 함량 변화에 따라 변화하는 전도도를 나타내는 그래프이다.
도 3은 투명도전막 제조시 증착 온도가 변화함에 따른 증착 속도를 나타내는 그래프이다.
도 4는 본 발명의 실시예 1 및 2에 따라 제조된 투명도전막의 투명도 변화를 나타내는 그래프이다.1 is a graph showing the atomic ratio in a thin film which is changed by the concentration ratio of the mixed precursor solution which changes according to Examples 1 and 2 of the present invention.
Figure 2 is a graph showing the conductivity changes in accordance with the content of Al and Nb content of the transparent conductive film prepared according to Examples 1 and 2 of the present invention.
3 is a graph showing the deposition rate as the deposition temperature changes during the manufacture of the transparent conductive film.
4 is a graph showing the change in transparency of the transparent conductive film prepared according to Examples 1 and 2 of the present invention.
본 발명자들은 투명도전막 제조 시 직접 용액 주입형 화학 기상 증착법을 이용할 경우, 첨가물의 주입 조절을 용이하게 할 수 있고, 이를 통해 도전막의 조성 제어를 쉽게 할 수 있다는 사실을 인지하고, 연구와 실험을 통해 본 발명을 완성하기에 이르렀다.
The present inventors recognize that when the direct solution injection type chemical vapor deposition method is used in the manufacture of a transparent conductive film, it is possible to easily control the injection of additives, thereby making it easier to control the composition of the conductive film. The present invention has been completed.
이하 본 발명을 상세히 설명한다.
Hereinafter, the present invention will be described in detail.
본 발명이 제안하는 투명도전막의 제조방법은 기존의 화학 기상 증착법과는 다르게 액체를 직접 주입하여 기상 증착시켜 투명도전막을 제조하는 것이다. 즉, 본 발명은 아연 또는 티타늄을 포함하는 유기 금속 화합물을 유기 용매에 녹인 전구체 용액(이하 '화합물 전구체 용액'이라 함)과 알루미늄, 갈륨 및 니오븀으로 이루어지는 그룹으로부터 선택된 1종 이상을 포함하는 첨가물을 유기 용매에 녹인 전구체 용액(이하 '첨가물 전구체 용액'이라 함)을 혼합하게 되는데, 기화기에 주입될 용액을 미리 제조하게 됨으로써, 용액의 농도 조절을 용이하게 할 수 있게 된다.
Unlike the conventional chemical vapor deposition method, the method for manufacturing a transparent conductive film proposed by the present invention is to prepare a transparent conductive film by directly injecting a liquid to vapor deposition. That is, the present invention provides an additive containing a precursor solution (hereinafter referred to as a 'compound precursor solution') in which an organic metal compound containing zinc or titanium is dissolved in an organic solvent and at least one selected from the group consisting of aluminum, gallium and niobium. The precursor solution dissolved in the organic solvent (hereinafter referred to as 'additive precursor solution') is mixed, and the solution to be injected into the vaporizer is prepared in advance, thereby facilitating the concentration control of the solution.
이 때, 상기 화합물 전구체 용액과 상기 첨가물 전구체 용액은 1 : 0.001~1의 농도비로 혼합되는 것이 바람직한데, 상기 농도비가 1:0.001 미만인 경우, 첨가 물질의 도핑 효과가 나타나지 않으며, 1:1을 초과하는 경우에는 첨가물의 함량이 증착시키고자 하는 금속의 함량을 초과하게 되므로, 도전막의 특성을 잃어버리게 된다.
At this time, the compound precursor solution and the additive precursor solution is preferably mixed at a concentration ratio of 1: 0.001 to 1, when the concentration ratio is less than 1: 0.001, doping effect of the additive material does not appear, more than 1: 1 In this case, since the content of the additive exceeds the content of the metal to be deposited, the characteristics of the conductive film are lost.
또한, 상기 유기 용매는 헥산, 헵탄, 옥탄, n-부틸아세테이트 및 테트라하이드로퓨란(THF)으로 이루어지는 그룹으로부터 선택된 1종 이상인 것이 바람직하다.
In addition, the organic solvent is preferably at least one member selected from the group consisting of hexane, heptane, octane, n-butyl acetate and tetrahydrofuran (THF).
이어서, 상기 화합물 전구체 용액과 상기 첨가물 전구체 용액이 혼합된 전구체 용액(이하 '혼합 전구체 용액'이라 함)을 용액 주입기를 통해 기화기에 주입하여 기화시키게 된다. 상기 기화기의 조건, 즉 기화온도 등은 상기 혼합 전구체 용액의 조성 혹은 농도비 등을 고려하여 기화가 가능한 범위로 적절하게 설정할 수 있다.
Subsequently, a precursor solution (hereinafter, referred to as a 'mixed precursor solution') in which the compound precursor solution and the additive precursor solution are mixed is injected into a vaporizer through a solution injector to vaporize. The conditions of the vaporizer, that is, the vaporization temperature and the like may be appropriately set in a range in which vaporization is possible in consideration of the composition or the concentration ratio of the mixed precursor solution.
상기 기화작용에 의해 생성된 증기는 반응 기체와 함께 증착반응기에 도입하게 되는데, 이 때 상기 반응 기체는 산소, 물, 과산화수소, 질소산화물 및 이산화탄소로 이루어지는 그룹으로부터 선택된 1종 이상인 것이 바람직하다.
The vapor generated by the vaporization is introduced into the deposition reactor together with the reaction gas, wherein the reaction gas is preferably at least one selected from the group consisting of oxygen, water, hydrogen peroxide, nitrogen oxides and carbon dioxide.
상기 도입된 증기와 반응 기체를 유리 기판과 접촉시켜 도전막을 형성시킴으로써 투명도전막의 제조를 완료하게 된다. 이 때, 상기 도전막을 형성시키는 단계는 200~600℃의 온도에서 이루어질 수 있다. 상기 온도 범위에서 증착시킴으로써 투명도전막의 증착 속도를 일정 수준 이상으로 확보할 수 있다.
The introduction of the vapor and the reaction gas in contact with the glass substrate to form a conductive film to complete the manufacture of the transparent conductive film. At this time, the step of forming the conductive film may be made at a temperature of 200 ~ 600 ℃. By depositing in the above temperature range it is possible to ensure the deposition rate of the transparent conductive film to a predetermined level or more.
한편, 상기 도전막 형성 단계는 플라즈마를 이용하여 실온~250℃의 온도범위에서도 이루어질 수 있는데, 플라즈마 전력(plasma power)을 50~500W의 범위로 가함으로써 플라즈마에 의한 산소 라디칼을 이용하여 투명도전막을 제작할 수 있다. 즉, 본 발명에 따른 도전막 증착은 실온에서 600℃까지 다양한 범위에서 이루어질 수 있다.
On the other hand, the conductive film forming step may be made in the temperature range of room temperature ~ 250 ℃ using a plasma, by applying a plasma power (plasma power) in the range of 50 ~ 500W by using oxygen radicals by the plasma to form a transparent conductive film I can make it. That is, the conductive film deposition according to the present invention can be made in a variety of ranges from room temperature to 600 ℃.
상기 제조방법에 의해 제조되는 투명도전막은 갈륨이 첨가된 산화아연(GZO:gallium doped zinc oxide)도전막, 알루미늄이 첨가된 산화아연(AZO:Aluminium doped zinc oxide)도전막 및 니오븀이 첨가된 산화티타늄(TNO:Titanium-niobium oxide)도전막으로 이루어진 그룹으로부터 선택된 1종 이상인 것이 바람직하다.
The transparent conductive film prepared by the manufacturing method includes a gallium-added zinc oxide (GZO) conductive film, an aluminum-added zinc oxide (AZO) conductive film, and niobium-containing titanium oxide. (TNO: Titanium-niobium oxide) It is preferable that it is 1 or more types chosen from the group which consists of a conductive film.
이하 실시예를 통해 본 발명을 상세하게 설명한다. 다만, 하기 실시예는 본 발명을 에시하기 위한 것일 뿐 본 발명의 권리범위가 이들만으로 한정되는 것은 아니다.
Hereinafter, the present invention will be described in detail through examples. However, the following examples are only for illustrating the present invention, and the scope of the present invention is not limited thereto.
(실시예 1)(Example 1)
알루미늄이 첨가된 산화아연(AZO)도전막의 제조
Preparation of Aluminum Addition Zinc Oxide (AZO) Conductive Film
아연을 포함하는 유기 금속 화합물로서 다이에틸징크(diethylzinc)와 첨가물로서 트리메틸알루미늄(trimethylaluminium)을 각각 유기 용매인 헥산에 용해시킨 뒤, 아연 전구체 용액과 알루미늄 전구체 용액의 농도비를 1 : 0.1~0.5로 달리하여 혼합 전구체 용액을 제조하였다. 상기 혼합 전구체 용액을 0.1ml/분의 속도로 기화기에 주입한 뒤, 150sccm의 산소를 유리 기판이 위치한 증착반응기로 도입하여 알루미늄이 첨가된 산화아연 투명도전막을 제조하였다. 이 때, 기화기 온도는 150℃, 기판온도는 300℃로 유지하였으며, 운반기체로써 Ar 150sccm을 사용하고, 반응기 내의 압력은 1.2torr로 유지하였다.
Diethylzinc as an organometallic compound containing zinc and trimethylaluminium as an additive were dissolved in hexane, an organic solvent, respectively, and then the concentration ratio of zinc precursor solution and aluminum precursor solution was changed to 1: 0.1 to 0.5. To prepare a mixed precursor solution. The mixed precursor solution was injected into the vaporizer at a rate of 0.1 ml / min, and then 150 sccm of oxygen was introduced into the deposition reactor in which the glass substrate was placed to prepare a zinc oxide transparent conductive film to which aluminum was added. At this time, the vaporizer temperature was maintained at 150 ℃, the substrate temperature was 300 ℃, Ar 150sccm was used as the carrier gas, the pressure in the reactor was maintained at 1.2torr.
(실시예 2)(Example 2)
니오븀이 첨가된 산화티타늄(TNO)도전막의 제조
Preparation of Titanium Oxide (TNO) Conductive Film with Niobium
티타늄을 포함하는 유기 금속 화합물로서 티타늄 메톡사이드(Titanium methoxide)와 첨가물로서 니오븀 에톡사이드(Niobium ethoxide)를 각각 유기 용매인 n-부틸아세테이트에 용해시킨 뒤, 티타늄 전구체 용액과 니오븀 전구체 용액의 농도비를 1 : 0.1~0.5로 달리하여 혼합 전구체 용액을 제조하였다. 상기 혼합 전구체 용액을 0.1ml/분의 속도로 기화기에 주입한 뒤, 200sccm의 산소를 유리 기판이 위치한 증착반응기로 도입하여 니오븀이 첨가된 산화티타늄 투명도전막을 제조하였다. 이 때, 기화기 온도는 140℃, 기판온도는 320℃로 유지하였으며, 운반기체로써 Ar 150sccm을 사용하고, 반응기 내의 압력은 1.2torr로 유지하였다.
Titanium methoxide as an organometallic compound containing titanium and niobium ethoxide as an additive were dissolved in n-butyl acetate as an organic solvent, respectively, and the concentration ratio of the titanium precursor solution and niobium precursor solution was 1 : 0.1 to 0.5 to prepare a mixed precursor solution. The mixed precursor solution was injected into the vaporizer at a rate of 0.1 ml / min, and then 200 sccm of oxygen was introduced into the deposition reactor in which the glass substrate was placed, thereby preparing a titanium oxide transparent conductive film containing niobium. At this time, the vaporizer temperature was maintained at 140 ℃, substrate temperature was 320 ℃, Ar 150sccm was used as the carrier gas, the pressure in the reactor was maintained at 1.2torr.
상기 실시예 1 및 2에 기재된 혼합 전구체 용액들의 농도비 변화에 따라 변화되는 박막내 Al/Zn 및 Nb/Ti 원자비를 측정한 후, 그 결과를 도 1에 나타내었다. 도 1을 통해, Al/Zn 및 Nb/Ti의 농도비가 0.1에서 0.5로 증가됨에 따라 도전막의 Al/Zn 및 Nb/Ti의 원자비 또한 비례하여 증가하는 것을 알 수 있다. 이는 곧 박막의 조성 제어가 용이하게 이루어질 수 있다는 것을 의미한다.
After measuring the atomic ratio of Al / Zn and Nb / Ti in the thin film that changes according to the change in the concentration ratio of the mixed precursor solutions described in Examples 1 and 2, the results are shown in FIG. 1, it can be seen that as the concentration ratio of Al / Zn and Nb / Ti is increased from 0.1 to 0.5, the atomic ratio of Al / Zn and Nb / Ti of the conductive film also increases proportionally. This means that the composition of the thin film can be easily controlled.
도 2는 상기 실시예 1 및 2에 따라 제조된 투명도전막의 Al 및 Nb의 함량 변화에 따라 변화하는 전도도를 나타내는 그래프이다. 도 2를 통해, 본 발명이 제안하는 혼합 전구체 용액의 농도비에 따라 제조된 투명도전막은 도전막 내의 Al 또는 Nb의 함량이 변화하게 되나, 최소값이 900/Ω㎝ 이상의 전도도를 가지게 됨을 알 수 있다. 본 발명의 투명도전막은 상기한 바와 같이 일정 수준 이상의 전도도를 지니게 되므로, 여러 응용 분야에 사용될 수 있음을 어렵지 않게 알 수 있다.
Figure 2 is a graph showing the conductivity changes in accordance with the content of Al and Nb content of the transparent conductive film prepared according to Examples 1 and 2. 2, it can be seen that the transparent conductive film prepared according to the concentration ratio of the mixed precursor solution proposed by the present invention changes the Al or Nb content in the conductive film, but the minimum value has a conductivity of 900 / Ωcm or more. Since the transparent conductive film of the present invention has a conductivity of a certain level or more as described above, it can be easily seen that it can be used in various applications.
도 3은 AZO 및 TNO 투명도전막 제조시 실시예 1 및 2의 조건에서 증착 온도만을 달리하여 투명도전막을 제조한 후, 상기 투명도전막들의 도전막 증착 속도를 측정한 결과를 나타낸 그래프이다. 이 때, AZO 투명도전막 제조시, 혼합 전구체 용액의 농도비는 0.4였으며, TNO 투명도전막 제조시, 혼합 전구체 용액의 농도비는 0.5였다. 도 3을 통해, 본 발명의 범위에 만족하는 증착 온도로 박막을 증착할 경우, 박막의 증착 속도가 약 10nm/min 이상, 즉 일정 수준이상의 성장 속도를 가지게 됨을 알 수 있다.
FIG. 3 is a graph illustrating a result of measuring deposition rates of conductive layers of the transparent conductive layers after manufacturing the transparent conductive layers by only changing the deposition temperature under the conditions of Examples 1 and 2 during the manufacture of the AZO and TNO transparent conductive layers. At this time, the concentration ratio of the mixed precursor solution was 0.4 when preparing the AZO transparent conductive film, and the concentration ratio of the mixed precursor solution was 0.5 when preparing the TNO transparent conductive film. 3, when depositing a thin film at a deposition temperature satisfying the scope of the present invention, it can be seen that the deposition rate of the thin film has a growth rate of about 10 nm / min or more, that is, a predetermined level or more.
도 4는 파장 변화에 따른 투명도전막의 투명도 변화를 나타내는 그래프이다. 도 4에 나타난 AZO 투명도전막은 혼합 전구체 용액의 농도비가 1:0.4였으며, 실시예 1의 조건과 동일하게 제조되었으며, TNO 투명도전막은 혼합 전구체 용액의 농도비가 1:0.5였으며, 실시예 2의 조건과 동일하게 제조되었다. 도 4에서 알 수 있드시, 상기 투명도전막들은 파장이 약 400nm 이상일 경우, 투명도가 약 80% 수준을 보이고 있음을 알 수 있다. 이러한 투명도 수치는 투명도전막의 투명도 기준을 만족한다.4 is a graph showing the change in transparency of the transparent conductive film according to the wavelength change. The concentration ratio of the mixed precursor solution was 1: 0.4, and the concentration ratio of the mixed precursor solution was prepared in the same manner as in Example 1, and the concentration ratio of the mixed precursor solution was 1: 0.5 in the AZO transparent conductive film shown in FIG. 4. Was prepared in the same manner. As can be seen in FIG. 4, when the wavelength is about 400 nm or more, it can be seen that transparency is about 80%. This transparency value satisfies the transparency standard of the transparent conductive film.
Claims (8)
상기 혼합된 전구체 용액을 용액 주입기를 통해 기화기에 주입하여 기화시키는 단계;
상기 기화작용에 의해 생성된 증기와 반응 기체를 증착반응기에 도입하는 단계; 및
상기 도입된 증기와 반응 기체를 유리 기판과 접촉시켜 도전막을 형성시키는 단계를 포함하는 직접 액체 주입형 화학 기상 증착법을 이용한 투명도전막의 제조방법.
Mixing a precursor solution obtained by dissolving an organometallic compound including zinc or titanium in an organic solvent and an precursor solution obtained by dissolving an additive including at least one selected from the group consisting of aluminum, gallium, and niobium in an organic solvent;
Injecting the mixed precursor solution into a vaporizer through a solution injector to vaporize the mixed precursor solution;
Introducing vapor and reaction gas generated by the vaporization into a deposition reactor; And
A method of manufacturing a transparent conductive film using a direct liquid injection type chemical vapor deposition method comprising the step of contacting the introduced vapor and the reaction gas with a glass substrate to form a conductive film.
The direct liquid injection type chemical vapor deposition method according to claim 1, wherein the precursor solution in which the organometallic compound is dissolved in an organic solvent and the precursor solution in which the additive is dissolved in an organic solvent are mixed at a concentration ratio of 1: 0.001 to 1. Method for producing a transparent conductive film used.
The transparent conductive film of claim 1, wherein the organic solvent is at least one selected from the group consisting of hexane, heptane, octane, n-butyl acetate, and tetrahydrofuran (THF). Manufacturing method.
The method of claim 1, wherein the reaction gas is at least one selected from the group consisting of oxygen, water, hydrogen peroxide, nitrogen oxides, and carbon dioxide.
The method of claim 1, wherein the forming of the conductive film is performed at a temperature of 200 ° C. to 600 ° C. 6.
The method of claim 1, wherein the forming of the conductive film is performed in a temperature range of room temperature to 250 ° C. using a plasma.
The transparent conductive film manufactured by the manufacturing method in any one of Claims 1-6.
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