KR20120023046A - Vibration card - Google Patents

Abstract

PURPOSE: A vibration type card is provided to easily determine the recognition of a card by generating vibration when a user uses the card. CONSTITUTION: A vibration module RF(Radio Frequency) antenna(120) receives an electric wave from an RF reader. A vibration module driving circuit(130) executes switching operation in order to generate vibration according to the electric wave reception of the vibration module RF antenna. An IC chip RF antenna(110) receives the electric wave including transaction information from the RF reader. An IC chip(140) controls the switching operation of the vibration module operation circuit by creating a vibration generating signal which generates the vibration of a pattern according to the transaction information. A vibration module generates the vibration corresponding to the switching operation.

Description

Vibration Card {VIBRATION CARD}

The present invention relates to an electronic card, comprising a vibration card having a vibration module.

In recent years, the use of electronic cards that can store a certain amount of value electronically in semiconductor chips and the like and use them in cash is rapidly increasing. In addition, the use of the electronic card is added to a variety of functions such as online financial transactions, securities transactions, transportation cards in addition to a simple payment method.

An object of the present invention is to provide a vibrating card equipped with a vibration module that reacts in contact with the RF reader.

The present invention for achieving the above object, the vibration module RF antenna for receiving a radio wave from the RF reader, a vibration module driving circuit for turning on / off the switching operation for generating vibration in accordance with whether the vibration module RF antenna received; An IC chip RF antenna for receiving radio waves including transaction information from the RF reader, and a vibration generation signal for generating vibrations of different patterns according to transaction information received through the IC chip RF antenna, thereby driving the vibration module driving circuit. It provides an oscillating card comprising an IC chip for controlling the switching operation of the vibration module and a vibration module for generating a vibration corresponding to the switching operation of the vibration module driving circuit.

As described above, the vibration card according to an embodiment of the present invention, the user can easily determine whether the card is recognized by the vibration when using the card in the field.

1 is a view schematically showing the configuration of an RF inlay sheet formed with a vibration module insert for inserting a haptic vibration module according to an embodiment of the present invention,
Figure 2 is a front view schematically showing the structure of a vibration card is inserted vibration module according to an embodiment of the present invention,
Figure 3 is a front view schematically showing the structure of a vibration card is inserted vibration module according to another embodiment of the present invention,
Figure 4 is a side view schematically showing the structure of a vibration module according to an embodiment of the present invention,
5 is a view illustrating a thickness calculation method of a vibration type card is inserted vibration module according to an embodiment of the present invention,
6 to 8 are graphs showing the vibration pattern of the vibration module implemented according to the information according to an embodiment of the present invention.
9 is a view showing an example of a vibration card including a plurality of vibration modules.
10 is a view showing the strength of vibration when the vibration module is present individually.
FIG. 11 is a diagram illustrating the strength of vibration when a plurality of vibration modules exist together in a predetermined space.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention that can specifically realize the above object will be described. At this time, the configuration and operation of the present invention shown in the drawings and described by it will be described as at least one embodiment, by which the technical spirit of the present invention and its core configuration and operation is not limited.

The terms used in the present invention have been selected as widely used general terms as possible in consideration of the functions in the present invention, but may vary according to the intention or custom of the person skilled in the art, the emergence of new technologies, and the like. In addition, in certain cases, there is also a term arbitrarily selected by the applicant, in which case the meaning will be described in detail in the description of the invention. Therefore, it is intended that the terms used in the present invention should be defined based on the meanings of the terms and the general contents of the present invention, rather than simply the names of the terms.

Throughout the present specification, the vibration module generates vibration in a 'haptic' manner using a piezo film. The 'haptic' is derived from the adjective 'haptesthai', which means 'touching' in Greek, and is also referred to as computer tactile technology. The haptic may allow the user to feel tactile feeling, power, and sense of motion through a keyboard, a mouse, a joystick, a touch screen, and the like, which are user input devices.

Throughout this specification, a piezoelectric film is a piezoelectric sensor that converts an electrical signal into a mechanical signal in the form of a film. Piezoelectric film uses a piezoelectric phenomenon that converts electrical energy into mechanical energy by the resonance phenomenon of the piezoelectric sensor. The piezoelectric phenomenon is a phenomenon in which positive and negative electric charges are generated according to the force when pressure is applied from the outside. Therefore, the piezoelectric film may convert vibration energy into electrical energy and electrical energy into mechanical vibration energy by the piezoelectric phenomenon as described above.

Throughout this specification, an RF card is an electronic payment means of a method of exchanging information with an RF reader using radio waves. When the RF card is placed on the RF reader, the RF reader automatically reads the information contained in the card. The RF card may be used as a means of transportation, security system, payment and payment. The RF card is widely used worldwide due to the convenience of contactlessness due to wireless communication.

In-Lay as used throughout this specification includes that a specific device is embedded or engraved in a specific site. Generally, the inlay is utilized to insert a coil for the antenna inside the RF card for RF communication.

1 is a view schematically showing the configuration of the RF inlay sheet formed with a vibration module insert for inserting a haptic vibration module according to an embodiment of the present invention.

The vibrating card may be applied to, for example, an RF card. Accordingly, as shown in FIG. 1, the RF inlay sheet 100 according to the present invention includes an IC chip RF antenna 110, a vibration module RF antenna 120, a vibration module driving circuit 130, and an IC chip 140. And a vibration module insertion unit 150. Each of the parts can be inlayed on a sheet.

First, when a user places the RF card on an RF reader for payment of goods and services, the IC chip RF antenna 110 and the vibration module RF antenna 120 receive radio waves generated from the RF reader. do. The RF card is settled in a contactless manner using a radio frequency. When the RF card is placed on the RF reader, an electromagnetic field generated by the RF reader is wirelessly transmitted to each of the IC chip RF antenna 110 and the vibration module RF antenna 120 of the RF card by electromagnetic induction. Can be. That is, the radio wave generated from the RF reader may be transmitted to the IC chip RF antenna 110 and also to the vibration module RF antenna 120. In this case, the radio wave received by the IC chip RF antenna 110 may include transaction information made at the time of payment using the RF card. On the other hand, the vibration module RF antenna 120 transmits the radio wave received from the RF reader to the vibration module driving circuit 130.

The vibration module driving circuit 130 converts and amplifies the radio wave supplied from the vibration module RF antenna 120 to supply power to a vibration module (not shown). That is, when the vibration module driving circuit 130 receives the radio wave from the RF reader through the vibration module RF antenna 120, it may convert the received radio wave into a power source for driving the vibration module. In addition, the vibration module driving circuit 130 may amplify the converted power.

The IC chip 140 receives a radio wave transmitted from the IC chip RF antenna 110. The IC chip 140 may convert a radio wave received from the IC chip RF antenna 110 and use it as a power source. In this case, the radio wave may include transaction information transmitted from the RF reader. The transaction information may include whether or not payment is made using the RF card. The transaction information may further include a use amount of the card, a use history, a place of use, and the like. In addition, the transaction information may further include identification information such as traffic card use, credit card use, ID card use.

The vibration module insertion unit 150 may be manufactured in the form of a hole. In addition, the vibration module insertion unit 150 is manufactured in a size corresponding to the size of the vibration module to be inserted. The vibration module insertion unit 150 may be formed in the RF inlay sheet 100 in which all components for implementing the vibration card are inlayed. Accordingly, the thickness of the RF inlay sheet 100 may be determined according to the thickness of the vibration module inserted into the vibration module insertion unit 150.

Therefore, by in-laying all the components for implementing the vibrating card in one sheet, the vibrating card can be easily mass-produced. In addition, by fixing a part to one RF inlay sheet to produce, it is possible to improve the performance of the vibrating card, and to increase the lamination efficiency with other sheets.

2 is a front view schematically showing the structure of a vibration card is inserted vibration module according to an embodiment of the present invention, Figure 3 is a schematic view of the structure of a vibration card is inserted vibration module according to another embodiment of the present invention It is a front view shown as.

The vibration type RF cards 200 and 300 illustrated in FIGS. 2 and 3 may include IC chip RF antennas 210 and 310, vibration module RF antennas 220 and 320, vibration module driving circuits 230 and 330, and IC chips. 240 and 340 and vibration modules 250 and 350.

The IC chip RF antenna (210, 310) and the vibration module RF antenna (220, 320), when the user brings the vibration type RF card (200, 300) to the RF reader for payment of goods and services, Receives a radio wave generated from the RF reader. That is, when the vibrating RF card (200, 300) is brought to the RF reader, the electric magnetic field generated by the RF reader is an IC chip RF antenna (210, 310) of the vibrating RF card (200, 300) by the electromagnetic induction phenomenon ) And the vibration module are wirelessly transmitted to the RF antennas 220 and 320, respectively.

The vibration module driving circuits 230 and 330 convert and amplify radio waves supplied from the vibration module RF antennas 220 and 320 and transmit them to the vibration modules 250 and 350. That is, when the vibration module driving circuits 230 and 330 receive radio waves from the RF reader through the vibration module RF antennas 220 and 320, the vibration module driving circuits 230 and 330 may drive the received radio waves to drive the vibration modules 250 and 350. It is converted into power and supplied to the vibration modules 250 and 350. In this case, the vibration module driving circuits 230 and 330 may amplify the converted power.

As illustrated in FIG. 3, the vibration module driving circuit 330 and the IC chip 340 may be electrically connected to each other through a tax line 360. The radio wave received by the IC chip RF antennas 210 and 310 from the RF reader may include transaction information of a transaction made at the time of payment using the vibrating RF card. At this time, if the vibration module driving circuit 330 and the IC chip 340 is electrically connected, the vibration module driving circuit 330 is to the transaction information transmitted from the IC chip 340 through the electrical connection. The vibration generation signal can be received. The transaction information is received from the RF reader, and may include whether or not payment is made using the vibrating RF card 300. The transaction information may further include a use amount, a use history, a use place, etc. paid using the vibrating RF cards 200 and 300. In addition, the transaction information may further include identification information of the vibration type RF card (200, 300) implemented as a traffic card, credit card, ID card.

In addition, the IC chip 340 may control the vibration module driving circuit 330 and the vibration module 350 to generate different types of vibrations according to the transaction information. That is, the vibration generating signal generated by the IC chip 340 controls the switching operation of the vibration module driving circuit 330 so that the intensity or shape of the vibration generated in the vibration module 350 is changed. Can be. Accordingly, the IC chip 340 may control the generation mode of the vibration according to the vibration generation signal. The strength and shape of the vibration controlled by the vibration module driving circuit 330 will be described later with reference to FIGS. 6A to 6C.

The vibration modules 250 and 350 may receive power from the vibration module driving circuits 230 and 330 to generate vibrations. The vibration modules 250 and 260 may include piezoelectric films 251 and 351, housings 252 and 352, and vibration pads 253 and 353.

The piezoelectric films (Piezo Film, 251, 351) is made of a piezoelectric sensor in the form of a film that converts electrical signals into physical mechanical signals. The piezoelectric films 251 and 351 generate vibrations in a haptic manner, and the user who uses the vibration type RF cards 200 and 300 is tactile at the time of a transaction using the vibration type RF cards 200 and 300. Can be implemented to feel. The piezoelectric films 251 and 351 use a piezoelectric phenomenon that converts electrical energy into mechanical energy by a resonance phenomenon of the piezoelectric sensor. That is, the piezoelectric phenomenon generates a positive voltage and a negative voltage as pressure is applied from the outside. Due to the piezoelectric phenomenon as described above, the piezoelectric films 251 and 351 may mutually convert vibration energy into electrical energy and mechanical energy into mechanical vibration energy. The piezoelectric films 251 and 351 may be manufactured using a piezoelectric actuator of unimorph or bimorph type. The piezoelectric films 251 and 351 receive vibration generation signals transmitted from the vibration module driving circuits 230 and 330 and generate vibrations corresponding thereto.

The housings 252 and 352 transmit vibrations generated from the piezoelectric films 251 and 351 to the surfaces of the vibration type RF cards 200 and 300. In this case, two connection terminals of the bimorph type piezoelectric films 251 and 351 may be exposed to the outside through a thin groove located in the lid of the housing 252 and 352 to be connected to the circuit. The housings 252 and 352 may be made thin and strong to maintain the mechanical strength of the vibration modules 250 and 350. In addition, the housings 252 and 352 may be made of a material that can be mutually bonded with an in-lay sheet to be attached well.

The vibration pads 253 and 353 may adjust the intensity of vibration generated from the piezoelectric films 251 and 351. The vibration pads 253 and 353 may be manufactured to amplify the vibration intensity, or may be manufactured to reduce the vibration intensity. Whether the vibration pads 253 and 353 are inserted may be determined by the strength of vibration generated in the piezoelectric films 251 and 351.

Figure 4 is a side view schematically showing the structure of a vibration module according to an embodiment of the present invention.

As shown in FIG. 4, the vibration module inserted into the vibration card according to the present invention may include a piezoelectric film 410, a housing 420, and a vibration pad 430.

The piezo film 410 generates vibration in accordance with a signal received from an IC chipset. The piezoelectric film 410 is made of a piezoelectric sensor in the form of a film that converts an electrical signal into a physical mechanical signal. The piezoelectric film 410 generates vibration in a haptic manner, and is a technology implemented so that a user who uses the card feels a touch during a transaction using the card.

The housing 420 transmits vibration generated in the piezoelectric film 410 to the card surface. For example, in the vibration module according to the present invention, the piezoelectric film 410 is bent by the vibration generated in the piezoelectric film 410, and the end of the piezoelectric film 410 taps the housing 420. Vibration may be transmitted to the surface of the card.

The vibration pad 430 may be attached to an end of the piezoelectric film 410 to amplify or alleviate the vibration of the piezoelectric film 410. The use of the vibration pad 430 may vary depending on the strength of vibration generated in the piezoelectric film 410. Therefore, whether the vibration pad 430 is attached may be determined according to the vibration intensity of the piezoelectric film 410.

FIG. 5 is a view illustrating a thickness calculation method of a vibrating card into which a vibration module is inserted according to an embodiment of the present invention.

As shown in Fig. 5, when using a bimorph type piezoelectric film having a thickness of 23 mm,

On the back, the formula for the basic deformation amount and force of the vibration module is as shown in Equation 1 below.

For example, 100 kV is applied to two connection terminals of a 9 micrometer piezoelectric film. In this case, the method of calculating the strength of vibration is shown in Equation (2).

Therefore, even if the input voltage is lowered to 5 mA, the deformation amount is sufficiently counted to 0.426 mm. However, as the voltage drops, the force hitting the front of the card is reduced to 1/20.

As described above, the vibration module according to the present invention may be produced in the form of a film in consideration of the thickness of the card. The vibration module may be in-layed on any particular sheet of the plurality of sheets constituting the card. In addition, the vibration module may be provided with a plurality of layers for protecting the inlay sheet on the front, rear of the sheet to be inlayed. In addition, the housing of the vibration module is strong and thin to maintain the mechanical strength of the vibration module, it can be made of a material that can be bonded to the inlay sheet.

6 to 8 are graphs showing the vibration pattern of the vibration module implemented according to the information according to an embodiment of the present invention.

The vibration module according to the present invention may implement vibration in a pattern as shown in FIGS. 6 to 8 under the control of the IC chip. 6 to 8 show the time duration of the vibration and (F) shows the intensity of the vibration. And p1, p2, and p3 represent the periods in which the vibration is performed once.

First, when paying with a vibrating RF card, when the card is placed on the RF reader, the radio wave generated in the RF reader is received through the RF antenna unit of the card. In this case, the radio wave received from the RF reader may include transaction information using the card. The transaction information may include identification information of the card implemented as a traffic card, a credit card, an ID card, or the like. The payment information may further include whether or not the payment is made using the card, the amount of use of the card, a history of use, a place of use, and the like. Radio waves received through the antenna unit are transmitted to the IC chip. The IC chip generates vibration signals for generating different vibration patterns, and transmits them to the vibration module driving circuit according to the transaction information included in the radio wave.

Then, the vibration module driving circuit switches according to the transmitted vibration generating signal, and the vibration module generates vibration correspondingly. At this time, the vibration module driving circuit is switched by the vibration generation signal transmitted from the IC chip to cause the vibration module to generate vibrations of different patterns and intensities, respectively. For example, if the information received from the IC chip is traffic card identification information, the IC chip may control the switching operation of the vibration module driving circuit so that the vibration module generates vibration in the pattern shown in FIG. When the information received from the IC chip is card payment approval information, the IC chip may control a switching operation of the vibration module driving circuit to generate vibration in the pattern shown in FIG. 7. In addition, when the limit information of the card is received from the RF reader, the IC chip may control the switching operation of the vibration module driving circuit so that the vibration module generates vibration of the pattern shown in FIG. 8. 6 to 8 may be arbitrarily set by a user or a card company, and each of the vibration patterns may be continuously performed.

Therefore, the IC chip controls the vibration module to generate different patterns of vibrations according to the transaction information received from the RF reader during payment using the vibrating RF card, thereby allowing the card user to generate vibrations from the card. Depending on the pattern of the payment and transaction situation can be easily recognized.

On the other hand, the vibration card according to an embodiment of the present invention may be a plurality of vibration modules distributed arrangement.

9 is a diagram illustrating an example of a vibration card including a plurality of vibration modules.

9 (a) shows a vibrating card in which two vibration modules are distributed. Description of the configuration of the vibrating card already described with reference to FIGS. 1 to 6 will be omitted.

As shown, the vibration card 700a includes a vibration module driving circuit 710, a first vibration module 721, and a second vibration module 722. The vibration module driving circuit 710 may give a vibration command to the first vibration module 721 and the second vibration module 722 through the supplied power. According to the vibration command, the first vibration module 721 and the second vibration module 722 may generate vibrations. When vibration occurs through the first vibration module 721 and the second vibration module 722 disposed in the vibration module region, the strength of vibration may be amplified by the overlapping effect. A detailed description thereof will be described later.

9 (b) shows a vibration card in which three vibration modules are distributed.

As shown, the vibration card 700b includes a vibration module driving circuit 760, a first vibration module 771, a second vibration module 772, and a third vibration module 773. Since the principle of generating vibration is the same as that of 9 (a), it will be omitted here. However, when there are three vibration modules, the overlapping effect of vibration may be greater than when two vibration modules are provided.

Next, the overlapping effect of vibration will be described in detail. For convenience, the overlapping effect on the vibrating card 700a when there are two vibration modules will be described.

10 is a view showing the strength of vibration when the vibration module is present individually.

10 (a) and 10 (b) show the intensity of vibration that appears when the vibration modules 721 and 722 individually generate vibrations. In this case, the amplitude may be generated according to the characteristics of each vibration module. . For example, the first vibration module 721 is -a? Generate vibration in the range + a, the second vibration module 722 is -b? Vibration can be generated in the + b range.

11 is a diagram illustrating the intensity of vibration when a plurality of vibration modules exist together in a predetermined space.

When the first vibration module 721 and the second vibration module 722 are arranged together with a predetermined area (for example, the vibration module area shown in FIG. 9), such as the vibration card 700a, the generated vibration may be applied to the overlapping effect. The intensity can be amplified by this. For example, when the first vibration module 721 and the second vibration module 722 are arranged together with a predetermined area, the maximum displacement width C of the vibration is the maximum displacement of the first vibration module 721 due to the overlapping effect. It may be equal to or more than the simple sum (absolute value a + absolute value b) of the width (absolute value a) and the maximum displacement width (absolute value b) of the second vibration module 722. That is, it can be "absolute value C> absolute value a + absolute value b" by the superposition effect.

As described above, by distributing a plurality of vibration modules in a predetermined area, the bending of the card can be solved. In addition, it is possible to amplify the intensity of vibration generated through the overlap effect.

Although specific embodiments of the present invention have been described with reference to the drawings, this is intended to be easily understood by those of ordinary skill in the art, and is not intended to limit the technical scope of the present invention. Therefore, the technical scope of the present invention is determined by the matters described in the claims, and the embodiments described with reference to the drawings may be modified or modified as much as possible within the technical spirit and scope of the present invention.

Claims (6)

Vibration module RF antenna for receiving radio waves from the RF reader;
A vibration module driving circuit for turning on / off a switching operation for generating vibration according to whether the vibration module RF antenna is received;
IC chip RF antenna for receiving a radio wave containing transaction information from the RF reader;
An IC chip for generating a vibration generation signal for generating vibrations of different patterns according to the transaction information received through the IC chip RF antenna to control the switching operation of the vibration module driving circuit; And
And a vibration module for generating vibration corresponding to the switching operation of the vibration module driving circuit. The method of claim 1,
The vibration module,
A piezoelectric film vibrating according to the received signal;
And a housing for transmitting the vibration generated in the piezoelectric film to the card surface. The method of claim 2,
The piezoelectric film is a vibration type card, characterized in that the unimorphous (Unimorph) or bimorph (Pimorph) type piezoelectric actuator (Actuator). The method of claim 2,
And a vibration pad attached to an end of the piezoelectric film to amplify or alleviate the vibration of the piezoelectric film. The method of claim 1,
The vibration module is made in the form of a film in consideration of the thickness of the vibration card is a vibration type card, characterized in that inlay (in-lay) to any one of the plurality of sheets constituting the vibration card. The card of claim 1, wherein the vibrating card is
At least two vibration modules in a predetermined area.

Images