KR20110111656A - Vaporizing device and method of vaporizing using the same - Google Patents

Abstract

Provided is a vaporization apparatus and a vaporization method using the same. The vaporization device is a cylindrical shape having an inner space for accommodating the compound, the main body including the inlet and outlet, the inlet line connected to the inner space through the inlet, the outlet line connected to the inner space through the outlet, the inlet line and First constant temperature maintaining means for maintaining the connected internal space in the first temperature range, and second constant temperature maintaining means for maintaining the internal space connected with the discharge line in the second temperature range, the first temperature range being the second temperature range; It may be lower than the temperature range.

Description

Vaporizing device and Method of vaporizing using the same}

The present invention relates to a vaporization apparatus and a vaporization method using the same, and more particularly, to an apparatus for stably vaporizing a compound having a high vapor pressure and a vaporization method using the same.

Vaporization devices for vaporizing compounds in liquid or solid state are utilized in various technical fields.

Depending on the field of application, the vaporization apparatus vaporizes low vapor pressure compounds or high vapor pressure compounds, and when used in technical fields such as the LED field, for example, can vaporize high vapor pressure compounds.

On the other hand, when vaporizing a compound of high vapor pressure, it is necessary to maintain the vapor pressure stably and to prevent the vaporized compound from condensation.

One technical problem to be achieved by the present invention is to provide a vaporization apparatus and method for stably vaporizing a high vapor pressure source compound.

One technical problem to be achieved by the present invention is to provide a vaporization apparatus and method for stably evaporating the source compound of high vapor pressure without condensation.

The problem to be solved by the present invention is not limited to the above-mentioned problem, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

One embodiment according to the inventive concept provides a vaporization apparatus. The vaporization device is a cylindrical shape having an inner space for accommodating the compound, the main body including the inlet and outlet, the inlet line connected to the inner space through the inlet, the outlet line connected to the inner space through the outlet, the inlet line and First constant temperature maintaining means for maintaining the connected internal space in the first temperature range, and second constant temperature maintaining means for maintaining the internal space connected with the discharge line in the second temperature range, the first temperature range being the second temperature range; It may be lower than the temperature range.

Another embodiment according to the inventive concept provides a vaporization method. The vaporization method includes the steps of injecting a carrier gas into a source compound contained in a body through an injection line, pressurizing the source compound into a gaseous compound by the inert gas, and discharging the gaseous compound contained in the body into a discharge line. Including the step of discharging to the outside through, maintaining the space of the body in which the source compound is injected in a first temperature range, maintaining the space in which the gaseous compound is discharged to a second temperature range higher than the first temperature range You can.

According to embodiments in accordance with the concept of the present invention, by providing a cooling unit that operates in a dry or water-cooled manner, the cooling unit may be installed adjacent to the heating unit. Thereby, the source compound and the gaseous compound can be cooled and heated more efficiently. Three-way valves and connecting lines can also be used to remove dirt in the inlet and outlet lines.

1 and 2 are cross-sectional views illustrating a vaporization apparatus according to an embodiment of the present invention.
3A, 3B and 4 are cross-sectional views illustrating a vaporization apparatus according to another embodiment of the present invention.
5 is a cross-sectional view for describing an organometallic chemical vapor deposition apparatus including a vaporization apparatus according to embodiments of the present invention.
7 is a flowchart illustrating a vaporization method using a vaporization apparatus according to embodiments of the present invention.
8 is a flowchart illustrating a purge method using a vaporization apparatus according to embodiments of the present invention.

Objects, other objects, features and advantages of the present invention will be readily understood through the following preferred embodiments associated with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In the present specification, when a component is mentioned as being on another component, it means that it may be formed directly on the other component or a third component may be interposed therebetween. In addition, in the drawings, the thickness of the components are exaggerated for the effective description of the technical content.

Embodiments described herein will be described with reference to cross-sectional and / or plan views, which are ideal exemplary views of the present invention. In the drawings, the thicknesses of films and regions are exaggerated for effective explanation of technical content. Accordingly, shapes of the exemplary views may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include variations in forms generated by the manufacturing process. For example, the etched regions shown at right angles may be rounded or have a predetermined curvature. Thus, the regions illustrated in the figures have attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of regions of the elements and are not intended to limit the scope of the invention. Although the terms first, second, etc. have been used in various embodiments of the present disclosure to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another. The embodiments described and illustrated herein also include complementary embodiments thereof.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the words 'comprises' and / or 'comprising' do not exclude the presence or addition of one or more other components.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First Example -Vaporization device)

1 and 2 are cross-sectional views illustrating a vaporization apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the vaporization apparatus 100 may include a main body 110, a cooling unit 130, a heating unit 120, an injection line 140, a first valve 142, a discharge line 150, and a first It may include two valves (152). The vaporization apparatus illustrated in FIG. 1 is relatively simply illustrated to facilitate understanding of the present invention. In an actual implementation, elements not shown in FIG. 1 may be additionally included.

The main body 110 has a cylindrical shape and has a space for accommodating a compound in a liquid or solid state (hereinafter referred to as a 'source compound') and a gaseous compound (hereinafter referred to as a 'gas compound'). A lid 155 covering the space.

As used herein, "first zone" refers to all or at least a portion of the space where the source compound remains in a liquid or solid state, and "second zone" refers to the internal spaces connected to the discharge line, It is used to mean an existing space and / or a space in which the discharge line and the main body are connected (for example, a lid 155 positioned on the upper part of the main body).

For example, the 'first region' may refer to a space in which the source compound exists as an internal space connected to the injection line 140, and the 'second region' may refer to an internal space connected to the discharge line 150. It may mean a space in which a gaseous compound is present. According to an embodiment of the present invention, the second area may mean a space indicated by a or b in FIG. 1.

Meanwhile, spaces such as 'first area', 'second area', space a, or space b shown in FIG. 1 are exemplary and the present invention is not limited to that shown in FIG. Of course, it can be set differently if it is not out of spirit.

According to an embodiment of the present invention, the second region 104 may be formed on the first region 102. The source compound 106 may be contained in the first region 102 and the gaseous compound 108 may be contained in the second region 104.

For example, source compound 106 may comprise an alkyl compound of Group 3 elements. For example, source compound 106 may comprise tri methyl gallium (TMGa), tri ethyl gallium (TEGa), tri methyl indium (TMIn), tri methyl allumium (TMAl) and bis It may be at least one selected from the group consisting of bis-cyclopentadienyl magnesium (Cp2 Mg). Of the above-mentioned source compounds, TMGa, TMIn and Cp 2 Mg may be in a solid state at room temperature. The source compounds in the solid state may be used in a dissolved state by a solvent. In addition, TEGa and TMAl may be in a liquid state. The above-mentioned source compounds 106 are materials whose vapor pressure is high and needs to be cooled normally.

The body 110 may be made of a material that does not react with the source compound 106 or the gas phase compound 108, and may be made of a material capable of withstanding the vapor pressure of the source compound 106 and the gas phase compound 108.

The cooling unit 130 keeps the vapor pressure of the source compound 106 stable so that the source compound does not vaporize rapidly. The cooling unit 130 maintains the temperature in the first temperature range in order to stably maintain the vapor pressure of the source compound 106. Here, the first temperature range may be lower than the ambient temperature where the cooling device is located, and has a temperature range lower than the second temperature range described later. In addition, the first temperature range may vary depending on the type of the source compound, and means a temperature range maintained so that the source compound can be stably evaporated.

According to one embodiment of the invention a temperature gradient exists between a space maintained in the first temperature range and a space maintained in the second temperature range. For example, the temperature may gradually increase from the space maintained in the first temperature range to the space maintained in the second temperature range.

As a result, a large amount of the source compound can be vaporized all at once, thereby suppressing a rapid increase in the vapor pressure in the main body 110. According to some embodiments of the present disclosure, the cooling unit 130 may be provided to surround the lower surface of the main body 110 and the lower side of the main body 110.

According to an embodiment of the present invention, the cooling unit 130 may operate in a dry manner. Cooling unit 130 shown in Figure 1 may be built in means such as a thermoelectric element.

The cooling unit 130 may be configured using at least one of a thermoelectric element, a fan, or an air-cooled cooler. The thermoelectric element connects both ends of two kinds of metals, and then applies a current to the metals. The thermoelectric element uses one end to absorb heat and the other end to generate heat according to the current direction. The thermoelectric element may switch between endothermic and exothermic according to the current direction, and thus the endothermic amount and calorific value may be adjusted according to the amount of current. Using this mechanism, the thermoelectric element can perform heating as well as cooling.

The air-cooled cooler is a device that cools heat using gas. There are a natural air-cooled cooler that cools by contacting natural air and a forced air-cooled cooler that uses a fan.

According to another embodiment of the present invention, the cooling unit 130 may operate in a water-cooled manner using a pipe. Conventional cooling unit uses a bath-type wet cooling method. Thus, the heating unit may not be provided adjacent to the wet cooling unit in the bath form. In order to solve this problem, the cooling unit 130 according to another embodiment of the present invention may be disposed adjacent to the heating unit 120 in a water-cooled manner using a pipe to cool the lower portion of the main body 110.

In FIG. 1, the cooling unit 130 is illustrated in a form surrounding the lower portion of the main body 110, but for the sake of easy understanding of the present disclosure, the cooling unit 130 may be implemented in various forms.

For example, in the case of using a natural air-cooled cooler or a fan, the main body 110 may be in close contact with the means for contacting the gas, or may be disposed to be spaced apart from the main body 110 by a predetermined distance. For another example, in the case of using a water-cooled system using pipes, the pipes are formed on the lower surface of the main body and the lower sidewall of the main body to position a plurality of pipes surrounding the main body 110 or form an internal space connected to the injection line. It can be configured in such a way that water flows through the pipe.

The heating unit 120 may be arranged to maintain the gaseous compound 108 in a gaseous state.

The heating unit 120 maintains the temperature in the second temperature range so that the source compound remains in a gaseous state without condensation. Here, the second temperature range has a higher temperature range than the above-described first temperature range, and may vary depending on the type of source compound. The second temperature range means a temperature range that allows the vaporized compound to remain in the gaseous state without condensation.

There is a correlation between the second temperature range maintained by the heater 120 and the first temperature range maintained by the cooling unit 130. For example, the first temperature range and the second temperature range form a temperature gradient inside the main body 110. Thus, the source compound is stably evaporated and not condensed by the first temperature range and the second temperature range. Will be discharged.

According to some embodiments of the present disclosure, the heating unit 120 may be provided surrounding the upper surface of the main body 110 and the upper side of the main body 110.

The heating unit 120 may be installed adjacent to the cooling unit 130. For example, both ends of the cooling unit 130 may be provided in contact with both ends of the heating unit 120. In this case, since the cooling unit 130 operates in a dry manner, the cooling unit 130 may be provided adjacent to or in contact with the heating unit 120. Thus, the source compound 106 in the body 110 can be maintained in a liquid or state, and the gaseous compound 108 can be more efficiently in the gaseous state, respectively.

The heating unit 120 may include a thermoelectric element, a Kapton film heater, and a block heater.

The injection line 140 is connected to the internal space of the main body 110 through the injection port as shown in FIG. 1 and may be arranged to inject the carrier gas into the source compound 106 in the main body. According to some embodiments of the invention, the injection line 140 may be arranged to penetrate one side of the body 110 and extend to the first region 102 in which the source compound 106 is received. For example, the injection line 140 may extend through the top of the body 110. In addition, one end of the injection line 140 may communicate with the second region 104, and the other end may be connected with the inert gas reservoir.

The carrier gas is mainly an inert gas, and the inert gas may include group 18 elements of the periodic table and nitrogen gas. Group 18 elements of the periodic table may include helium (He) or argon (Ar). The inert gas may perform the function of pressurizing the source compound 106 and the function of moving the vaporized gaseous compound 108 together. In addition, the inert gas may be bubbling to substantially widen the contact area with the source compound 106 to further facilitate vaporization of the source compound.

The first valve 142 may be installed in the injection line 140. Referring to FIG. 1, the first valve 142 is closed and the injection line 140 is closed. Referring to FIG. 2, the second valve 152 is opened and the injection line 140 is opened. In this case, the inert gas may move from the inert gas reservoir toward the main body 110 through the injection line 140. The inert gas moving through the injection line 140 can only move in this direction. That is, the inert gas cannot move in the direction of the inert gas storage from the main body 110.

Discharge line 150 may be arranged to discharge gaseous compound 108 to the outside.

The discharge line 150 is connected to the internal space of the main body 110 through the discharge port as shown in Figure 1, according to some embodiments of the present invention, the discharge line 150 is connected to one side of the main body 110 It penetrates and can be arranged to extend into the received second region 104. For example, the discharge line 150 may extend through the upper portion of the body 110. In addition, one end of the discharge line 150 may be in communication with the second region 104, and the other end may be connected to a process chamber or a gaseous compound 108 reservoir in which the gaseous compound 108 is used.

The second valve 152 may be installed in the discharge line 150. Referring to FIG. 1, the second valve 152 is closed, and the discharge line 150 is closed. Referring to FIG. 2, the second valve 152 is opened and the discharge line 150 is opened. In this case, the gaseous compound 108 may move from the body 110 to the outside through the discharge line 150. The gaseous compound 108 moving through the discharge line 150 can only move in this direction. That is, the gaseous compound 108 cannot move from the outside to the body 110.

In the case of using the vaporization apparatus 100 as described above, the cooling unit 130 that operates in a dry manner may be provided, and the heating unit 120 may be provided adjacent to the cooling unit 130. Therefore, the source compound 106 contained in the main body 110 can be more efficiently maintained in the liquid or solid state and the gas phase compound 108 in the gas state.

In this embodiment, the heating section and the cooling section are respectively used as constant temperature maintaining means for maintaining the inside of the main body in a predetermined temperature range. Both the heating section and the cooling section are constant temperature maintaining means, often in the present specification the cooling section may be referred to as the first constant temperature maintaining means and the heating section may be referred to as the second constant temperature maintaining means. In addition, the predetermined temperature range maintained by the first constant temperature maintaining means is called the first temperature range, and the predetermined temperature range maintained by the second constant temperature maintenance means is called the second temperature range.

It should also be appreciated that the present invention can be used in a variety of environments.

For example, when the first temperature range <temperature of the environment in which the vaporization apparatus is located <second temperature range, the first constant temperature means is used to heat the surrounding heat such as a thermoelectric element, a fan or an air-cooled cooler as described above. It can be configured as a means of taking away.

As another example, when the temperature of the environment in which the vaporization apparatus is located <first temperature range <second temperature range, the first constant temperature means may be composed of heating means. In this case, both the first temperature regulating means and the second temperature regulating means will consist of heating means.

According to one embodiment of the present invention, although the first constant temperature means consists of a cooler and the second constant temperature means consists of a heater, depending on the environment in which the vaporization apparatus is located, both the first constant temperature means and the second constant temperature means It may be configured as a heating means.

(Second Example -Vaporization device)

3A, 3B, and 4 are diagrams for describing a vaporization apparatus according to another embodiment of the present invention.

Referring to FIG. 3A, the vaporization device 200 includes a main body 210, a cooling unit 230, a heating unit 220, injection lines 240 and 244, a first valve 242, and an discharge line 250. 254, a second valve 252, a connection line 260, and a lead 255.

The first valve 242 may be installed in the injection lines 240 and 244. The injection line may be divided into a first line 240 and a second line 244 by the first valve 242. For example, the first line 240 connects the inert gas reservoir and the first valve 242, and the second line 244 connects the first valve 242 and the first region 202 of the body 210. Can connect

The first valve 242 can be a three-way valve. That is, the first valve 242 may include three passages. One passage of the first valve 242 may be connected to the first line 240 of the injection line, the other passage to the second line 244 of the injection line, and the other passage to the connection line 260, respectively.

The second valve 252 may be installed in the discharge lines 250 and 254. The discharge lines 250 and 254 may be divided into a third line 250 and a fourth line 254 by the second valve 252. For example, the third line 250 connects the second valve 252 and the exterior (process chamber or product reservoir), and the fourth line 254 is the second region 204 and the second of the body 210. The valve 252 may be connected.

The second valve 252 may be a three-way valve. That is, the second valve 252 may include three passages. One passage of the second valve 252 may be connected to the third line 250 of the discharge line, the other passage may be connected to the fourth line 254 of the discharge line, and the other passage may be connected to the connection line 260, respectively.

The connection line 260 may connect between the first valve 242 and the second valve 252. The material moving inside the connection line 260 may move only in the direction of the second valve 252 from the first valve 242.

Referring to FIG. 3A, one passage and the other passage of the first valve 242 may be opened to communicate the first line 240 and the second line 244 of the injection line. In addition, one passage and the other passage of the second valve 252 may be opened to communicate the third line 250 and the fourth line 254 of the discharge line. In this way, the inert gas may be injected into the source compound 206 received in the first region 202 of the body 210 through the injection lines 240 and 244. In addition, the gaseous compound 208 contained in the second region 204 of the body 210 may be discharged to the outside through the discharge lines 250 and 254.

Referring to FIG. 4, one passage and another passage of the first valve 242 may be opened to communicate the first line 240 and the connection line 260 of the injection line. In addition, one passage and the other passage of the second valve 252 may be opened to communicate the third line 250 and the connection line 260. Therefore, the first line 240, the connection line 260, and the third line 250 may communicate with each other. In this case, a purge gas is injected into the first line 240 of the injection line, and the injected purge gas moves to the connection line 260 and the third line 250 through the first line 240. Can be. Residues remaining in the first line 240, the connection line 260, and the third line 250 while the purge gas moves through the first line 240, the connection line 260, and the third line 250. Can be discharged to the outside. The dirt may be a residual inert gas, source compound 206 or gas phase compound 208. An inert gas can be used as a purge gas. For example, the purge gas may be Group 18 elements of the periodic table, nitrogen gas or ozone gas.

In the present embodiment, the main body 210, the cooling unit 230, the heating unit 220, the injection lines 240 and 244, the first valve 242, the discharge lines 250 and 254, the second valve 252, The detailed description of the lead 255 is substantially the same as or similar to that described in the first embodiment of FIGS. 1 and 2 and will be omitted.

In addition, the configuration or arrangement of the three-way valves adopted for injecting the carrier gas or injecting the purge gas in the present embodiment is exemplary, and may be modified in other configurations as long as it is included in the concept of the present invention described herein. Of course.

Figure 3b is another embodiment of the present invention, to illustrate that the present invention can be implemented in a variety of configurations. 3B is basically the same as FIG. 1 or FIG. 3A, but the connection configuration of the valves 142 and 152 existing on the main body 110 is different. Referring to the embodiment of FIG. 3B in comparison with the embodiment of FIG. 3A, there is no functional difference between the two except that the injection and discharge lines are different in direction, and the valves 142, 152 of FIG. 3B are also three-way valves. , Carrier gas injection, purge gas injection, vaporized compound discharge, and the like.

As such, it can be seen that the present invention can be utilized in a vaporization apparatus having various configurations.

(Third Example -Organometallic chemical vapor deposition apparatus)

5 is a cross-sectional view for describing an organometallic chemical vapor deposition apparatus including a vaporization apparatus according to embodiments of the present invention.

Referring to FIG. 5, the organometallic chemical vapor deposition apparatus 300 may include a process chamber 302, a substrate support unit 304, a vaporization unit 310, and a vacuum unit 308.

Process chamber 302 may be arranged to define process space 306. Process space 306 may maintain a predetermined process temperature and pressure.

The substrate support unit 304 may be provided in the process chamber 302. The substrate support unit 304 may support and fix the substrate W during the deposition process on the substrate W. As shown in FIG. For example, the substrate W may be fixed on the substrate support unit 304 in a vacuum manner. As another example, the substrate W may be fixed on the substrate support unit 304 in an electrostatic manner.

The vaporization unit 310 includes a main body 312, a cooling unit 324, a heating unit 322, an injection line 326, 330, a first valve 328, a discharge line 332, 336, and a second valve. 334 and connection line 338.

The main body 312 has a cylindrical shape and has a space for accommodating a compound in a liquid or solid state (hereinafter referred to as a 'source compound') and a gaseous compound (hereinafter referred to as a 'gas compound'). A lid 355 covering the space.

 According to an embodiment of the present invention, discharge lines 332 and 336 may be in communication with the process chamber 302.

The vaporization unit 310 of the present embodiment is substantially the same as or similar in structure and function to the vaporization apparatus described in the first and second embodiments, and a description thereof will be omitted.

The vacuum unit 308 can maintain a constant pressure in the process space 306 in the process chamber 302. Vacuum unit 308 may include a pump and a vacuum line.

(Fourth Example -Vaporization device)

6 is a cross-sectional view for describing a vaporization apparatus according to an embodiment of the present invention.

Referring to FIG. 6, the vaporization apparatus 400 may include a main body 410, a cooling unit 430, a heating unit 420, an injection line 440, a first valve 442, a discharge line 450, and a first agent. It may include two valves 452, a lid 455. The vaporization apparatus illustrated in FIG. 6 is relatively simply illustrated to facilitate understanding of the present invention. In an actual implementation, elements not shown in FIG. 6 may be additionally included.

According to an embodiment of the present invention, the first region may mean a space indicated by c or d in FIG. 6. The second region may mean a space indicated by a or b in FIG. 6. Spaces such as 'first area', 'second area', space a, or space b, space c, space d, etc., shown in FIG. 6 of the present application are exemplary, and the present invention is limited to those shown in FIG. 6. It is also possible to set differently without departing from the spirit of the present invention.

6 is different from the embodiment of FIG. 1 in that the injection line 440 is not directly connected to the solid or liquid source compound, but only extends to the upper portion of the inner space formed by the main body. Other than that, it can be seen that it has the same configuration.

Accordingly, the main body 410, the cooling unit 430, the heating unit 420, the injection line 440, the first valve 442, the discharge line 450, the second valve 452, the lead 455, and the like. Detailed description thereof will be omitted since it is substantially the same as or similar to that described in the first embodiment of FIGS. 1 and 2.

(Fifth) Example -Vaporization method)

7 is a schematic flowchart illustrating a vaporization method using a vaporization apparatus according to embodiments of the present invention.

Referring to FIG. 7, an inert gas may be injected into the first region of the main body by opening the first valve (step S100).

According to an embodiment, when the first valve is a two-way valve, the first valve may be opened to open the injection line. According to another embodiment, when the first valve is a three-way valve, the first valve opening and closing may be adjusted to open the first and second lines of the injection line and close the connection line.

An inert gas reservoir and a first region of the body may be in communication along the opened injection line. The source compound may be contained in the first region of the body. At this time, the source compound may maintain a liquid or gas state by the cooling unit.

The inert gas can be converted to a gaseous compound by pressurizing the source compound (step S110). The gaseous compound may be contained in the second region of the body. At this time, the gaseous compound may be maintained in a gaseous state by a heater.

The second valve may be opened to discharge the gaseous compound from the second region of the main body to the outside (step S130).

According to an embodiment, when the second valve is a two-way valve, the second valve may be opened to open the discharge line. According to another embodiment, when the second valve is a three-way valve, the second valve opening and closing may be adjusted to open the third and fourth lines of the discharge line and close the connection line.

A second area and the outside of the body may be in communication along the opened discharge line. The exterior may be a process chamber or gaseous compound reservoir in which the gaseous compound is used. At this time, the gaseous compound may be maintained in a gaseous state by a heater.

(The sixth Example -Fuzzy method)

8 is a flowchart illustrating a method of purging using a vaporization apparatus according to embodiments of the present invention.

Referring to FIG. 8, the first line of the injection line, the connection line, and the third line of the discharge line may be opened (step S200).

In more detail, the opening and closing of the first valve may be controlled to open the first line and the connection line of the injection line and close the second line of the injection line. Thus, the first line and the connecting line can communicate. By opening and closing the second valve, the third line of the connection line and the discharge line can be opened, and the fourth line of the discharge line can be closed. Thus, the connection line and the third line can communicate. In this way, the first line of the injection line, the connection line and the third line of the discharge line can communicate.

The purge gas may be injected into the first line of the injection line (step S210). The injected purge gas may move to the third line of the connection line and the discharge line communicating with the first line (step S220).

The purge gas may be discharged through the third line of the discharge line. When the purge gas is discharged, dirt in the first line, the connection line, and the third line may be discharged together (step S230). The dirt may comprise an inert gas, a source compound or a gaseous compound.

Thus, by using the three-way valve, by periodically discharging the dirt in the injection line and the discharge line, it is possible to prevent problems such as clogging of the injection line and the discharge line.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Vaporizer: 100 body: 110, 210, 312
Cooling section: 130, 230, 324 Heating section: 120, 220, 322
Injection line: 140, 240 First valve: 142, 242
Outlet line: 150, 250 Second valve: 152, 252

Claims (12)

A main body including an inlet and an outlet having a cylindrical shape having an inner space capable of accommodating the compound;
First constant temperature maintaining means for maintaining at least a portion of an internal space in which the source compound stored in the main body exists in a first temperature range; And
And a second constant temperature maintaining means for maintaining at least a portion of the internal space in which the gaseous compound in which the source compound is vaporized is maintained in a second temperature range,
Wherein the first temperature range is lower than the second temperature range. The method of claim 1,
And the first constant temperature maintaining means is a cooling unit operating in a dry manner or in a water-cooled cooling manner using a pipe. The method of claim 1,
And a temperature gradient exists between the internal space maintained in the second temperature range and the internal space maintained in the first temperature range. The method of claim 1,
And said second constant temperature maintaining means is a heating unit which is any one of a thermoelectric element, a kepton film heater, and a block heater. The method of claim 1,
And a discharge line connected to the internal space through the discharge port.
And the second constant temperature maintaining means maintains an internal space connected to the discharge line in a second temperature range. The method of claim 1,
And an injection line connected to the internal space through the injection hole.
And the first constant temperature maintaining means maintains an internal space connected to the injection line in a first temperature range. The method of claim 2,
And the cooling unit is positioned to surround a lower surface of the main body and a lower sidewall of the main body forming an inner space maintained in the first temperature range. The method of claim 2,
And the heating unit is positioned to surround an upper surface of the main body and an upper sidewall of the main body forming an inner space maintained at the second temperature range. Injecting a carrier gas into a source compound contained within the body via an injection line;
Pressurizing the source compound by the inert gas to convert the source compound into a gaseous compound; And
Discharging the gaseous compound contained in the body to the outside through the discharge line,
Maintaining the space of the body into which the source compound is injected in a first temperature range,
And a space in which the gaseous compound is discharged is maintained in a second temperature range higher than the first temperature range. 10. The method of claim 9,
The method of maintaining in the first temperature range is a vaporization method, characterized in that carried out in a dry method or a water-cooled method using a pipe. 10. The method of claim 9,
And a temperature gradient exists between the space maintained in the second temperature range and the space maintained in the first temperature range. 10. The method of claim 9,
When the space in which the gaseous compound is discharged is maintained at a temperature higher than the predetermined temperature range, it is carried out using any one of a thermoelectric element, a Kapton film heater or a block heat.

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