KR20110109723A - System and method for teaching an automatical machine - Google Patents

Abstract

The present invention relates to a sensor system for position calibration of automated equipment, comprising: an image sensor and a laser sensor mounted on a work unit, and a sensing unit including a landmark; A controller including a controller; And a communication unit for transmitting the processing and the result data of the control unit to the terminal.
The calibration method of the position calibration sensor system includes reference data obtained when the work unit is in the correct position among data acquired from a laser sensor and an image sensor mounted on the calibration work unit and a landmark located in the data acquisition range of these sensors. And comparative data obtained at the position where the work unit is required to be calibrated are compared and analyzed so that position calibration of the work unit is performed, and the laser data obtained from the laser sensor is first placed so that the work unit is located within the calibration range by the image sensor. Is implemented.
Because of this, if the z-axis deviation of the work unit is so large that the image data acquired from the image sensor is difficult to compare and analyze, the correction range is first corrected by the laser sensor and then precisely corrected by the image sensor, thereby providing a correction range for the z-axis. Is enlarged.

Description

System and method for position calibration of automation equipment {System and method for teaching an automatical machine}

The present invention relates to the calibration of the position of the automation equipment, and more particularly to a system and a calibration method for inspecting and correcting the position of the automation equipment, such as industrial robots in place.

In general, automation equipment including various industrial robots such as robots for transferring wafers for semiconductors, robots for assembly lines, robots for transport of logistics, robots for inspection, robots for clean rooms, robots for LCD manufacturing, and precision stages are inputted in advance for a long time. The program is programmed to repeat the same task through a defined path.

Here, it is confirmed whether the movement path and the working position of the robot or the precision stage are correctly implemented, and when the operation position is found to be in error, the position is corrected by using the position calibration system.

Consider the case where the position correction system is used in the semiconductor manufacturing process.

The wafer is transferred through a substrate transfer system to a processing unit (or process chamber) that processes resist solution application, exposure and development for a photolithography process to form a resist pattern in a semiconductor process.

The substrate transfer system includes a transfer robot for accurately transferring a wafer to a processing unit, by which the wafer is repeatedly transferred to a plurality of processing units performing respective processes. It is very important here that the wafer is correctly placed at the set position of the plate in the processing unit.

Therefore, a teaching is performed to adjust the position of the robot at a predetermined time interval before the wafer transfer process starts or during the process, and also during the wafer transfer process, such as an input window or a table (or wafer chuck) of the processing unit. Teaching was also performed when the moving position of the transfer robot deviated from the initial set position while colliding, and when the initial set position deviated by the stress accumulated by the continuous repetitive work.

As a conventional technique for such teaching, as shown in FIGS. 1 to 3, there is an ATS (Auto Teaching System) manufactured by Cyber Optics Semiconductor, Inc., and the operation of the ATS is briefly described. The camera attached to the lower part compares the reference image data obtained at the initial set position among the image data obtained by photographing the target hole located below and the comparison image data obtained in the situation requiring correction, to calculate an error. Based on this error, the position of the ATS was corrected and the position of the robot was corrected.

Looking at the case where the ATS is actually applied to the substrate transfer system, the ATS is placed in place of the wafer in the holding portion of the wafer transfer robot arm of the substrate transfer system in place of the wafer, and the holding portion of the ATS is set to a predetermined position, that is, the wafer. Moves to the position on the table (or wafer chuck), the ATS acquires the comparison image data of the target holes formed on the table and compares them with the reference image data of the target holes previously obtained so that each target hole is concentric. In part, the position of the gripping portion on which the wafer is seated is corrected, thereby completing the position correction of the robot arm by the ATS.

However, since the ATS corrects the position of the industrial robot using only image data, the error of the position about the x-axis and the y-axis can be accurately analyzed, but the error analysis function of the position about the z-axis is low and the robot rotates in the plane. There is no function to analyze the error of the displacement and distortion of the angle. Therefore, only some of the various conditions required for precisely calibrating the position of the robot are satisfied. Therefore, other conditions have to be recalibrated using a different system or a position calibration in a neglected situation.

In addition, if the error is confirmed during the operation of the robot, since the ATS was used after a separate time to stop the operation of the robot, the product at the time of the error is already defective. Therefore, since a separate time is required for position correction, a loss occurs in which a wafer transfer operation cannot be made, and a loss due to a product defect also occurs.

The present invention has been made to solve the above-mentioned problems, check whether a work unit such as an industrial robot or a precision stage is located in the correct position through a comparative analysis between the data obtained from the laser sensor and the image sensor, In case of deviation, it is made to correct to the right position, and the comparative analysis process and the result of the data are transmitted to the manager through the communication network, and the position of the automation equipment that can be checked and corrected in real time while the work unit is working. The purpose is to provide a system for position correction.

In addition, a laser sensor, an image sensor, and a controller are directly mounted on the wafer transfer robot arm so that a part of the grip portion on which the wafer is seated is protruded from the robot arm so that the laser sensor and the image sensor are mounted, and the protrusion of the grip portion is mounted. Another object of the present invention is to provide a system for calibrating the position of an automated equipment, in which an extension panel in which a controller is installed is mounted at a predetermined position.

On the other hand, when the work unit is calibrated, first, the z-axis position of the work unit is calibrated by the laser sensor to be positioned within the calibration range by the image sensor, and then the x-axis, y-axis, and z-axis precision of the work unit by the image sensor is corrected. Calibration and torsion, the displacement of the rotational angle on the plane is precisely calibrated, and the position calibration work can be performed irrespective of the work unit's work performance and the position calibration work can be directly instructed and executed by the administrator. It is another object to provide a position correction method.

The sensor system for position calibration of automated equipment according to the present invention for achieving the above object is mounted on a work unit to obtain position data of a work unit moving in a preset path and applying a laser beam in the same plane as the landmark. A detector including a laser sensor for emitting light and receiving the light to obtain position data of the work unit, and an image sensor mounted to the work unit to acquire a position data of the work unit by photographing a landmark;

And a controller including a controller for instructing a position calibration of a work unit by calculating an error between laser data acquired by the laser sensor and an error between the image data obtained by the image sensor. The data obtained from the laser sensor is analyzed to first instruct the work unit to be positioned within the calibration range of the image sensor, and then the data obtained from the image sensor is analyzed and instructed to calibrate precisely in place, and the work unit is operated. It is instructed to correct the position even during the operation.

Herein, the controller is configured to correct an error calculated between reference laser data including a reference distance from the laser sensor to a landmark previously acquired from the laser sensor and comparison laser data including a comparison distance obtained in a situation in which calibration is required. First, the calibration unit is instructed so that the working unit is positioned within the calibration range of the unit by the image sensor, and the reference image data of the landmark previously acquired in the image sensor and the landmark acquired in the situation where calibration is required. The error calculated between the comparative image data is corrected to instruct to precisely correct the position of the work unit with respect to the x-axis, y-axis, and z-axis precision adjustment and torsional, displacement of the plane of rotation.

In addition, the position calibration system of the automation equipment is processed and the result data of the control unit is transmitted and stored in the administrator terminal, regardless of whether the work unit of the work unit, the administrator can directly instruct the position correction command to the control unit via the terminal. The communication unit may be further included.

On the other hand, the work unit is a wafer transfer robot arm comprising a grip portion on which the wafer is seated so as to transfer the wafer for semiconductor, and the highest moving shaft connected to the grip portion, one side of the grip portion protrudes, A case in which a laser sensor and an image sensor are installed on a lower surface of the protrusion is mounted, and data from the laser sensor and the image sensor are received and calculated by a controller in a position proximate to the sensors, and the photographing range of the image sensor is seated on a table. In this state, two landmarks adjacent to each other are positioned at one edge of the table outside the overlapped range directly below the wafer.

Here, the controller is installed in the extension panel mounted on the projection of the gripping portion.

In addition, the image sensor is a camera, the laser sensor is a laser device having a light emitting portion and a light receiving portion.

On the other hand, in the method for the calibration of the position of the automated equipment, by calculating the error between the reference laser data and the comparative laser data for the landmark obtained by the laser sensor, the z-axis position of the work unit is located within the calibration range by the image sensor A first step of first correcting to; By calculating the error between the reference image data and the comparative image data for the landmark obtained from the image sensor, the precise adjustment of the x-axis, y-axis, z-axis of the work unit, and the position of the displacement of the torsional, on-plane rotation angle is corrected And a second step of being performed, and the position correcting work is performed while the work unit performs the work.

In addition, in the location calibration method, the processing and the result data executed during the first and second steps are transmitted and stored by the communication network to the manager terminal, and the administrator directly corrects the location regardless of whether the location calibration is performed. The process may further include instructing a task to the controller.

On the other hand, the work unit is a robot arm for transporting the wafer, the robot arm comprises a holding part on which the wafer is seated and the highest moving shaft connected to the holding part, the case where the laser sensor and the image sensor is installed Mounted on one protruding side of the gripping portion, the controller is installed on an extension panel that is coupled to the protruding portion of the holding portion, when the landmark is located on one side of the table, the first step, the laser sensor By low precision adjustment, the position relative to the z-axis of the gripper is first calibrated so as to be located within the calibration range of the gripper by the image sensor, and the second step is the high-precision adjustment of the gripper by the x-axis The position for the precise adjustment of the y-axis, the z-axis, the torsion, and the displacement of the rotational angle in the plane is precisely corrected.

Here, the landmarks are located on the edge of the table outside the overlapping range of the wafer directly below the wafer in the state seated on the table, and the two landmarks are adjacent to each other, and between the reference image data and the comparative image data photographing the landmarks. In-situ calibration is performed by the error calculation.

According to the present invention as described above, if the z-axis deviation error of the work unit is so large that the image data obtained from the image sensor is difficult to compare and analyze, by first correcting by the laser sensor and then precisely corrected in the image sensor, z The calibration range for the axis is expanded.

In addition, through the data obtained from two or more landmarks, the torsion of the work unit and the displacement of the rotation angle on the plane, which are difficult to correct only by the concentric comparison between the existing target holes, can be precisely corrected.

In addition, an image sensor, a laser sensor, and a landmark may be mounted on a work unit requiring calibration so that the position of the work unit is always tracked while the work of the work unit continues, and the position calibration may be performed.

In addition, in the wafer transfer robot arm, the shape of the grip portion on which the wafer is seated is manufactured to have a protruding one side, and a case in which a laser sensor and an image sensor are mounted on the lower surface of the protrusion is mounted on the protruding portion of the grip portion. By mounting the extension panel equipped with a controller, the laser sensor, the image sensor, the controller is fixed to the robot arm can be performed in real time irrespective of the wafer transfer operation of the robot arm.

On the other hand, the comparative analysis and results of the data for the location correction is transmitted to the terminal through the communication network, and the administrator can check this from time to time, as well as a separate calibration work by the administrator's judgment will be carried out regardless of whether the work unit is performed. As a result, the defect of the product can be minimized, and the loss of the existing production which is caused by stopping the work of the work unit for the calibration work can be prevented.

In addition, by selecting a method in which coarse tuning by the laser sensor is performed first and then fine tuning by the image sensor is performed, a precise position calibration operation can be performed, and one sensor Cost savings can be achieved with the development of technology and production of products that have low and high precision adjustments.

1 is a perspective view schematically showing a conventional position calibration system for an industrial robot,
2 and 3 are schematic diagrams showing the manner of operation of the position calibration system shown in FIG.
Figure 4 is a schematic diagram showing a system for position calibration of the automated equipment according to an embodiment of the present invention,
5A and 5B are schematic diagrams showing an operation of the position calibration system shown in FIG. 4;
6A and 6B are a bottom view and a perspective view showing a state in which a system for position calibration of the automated equipment shown in FIG. 4 is mounted on a robot arm for a wafer.

Based on the accompanying drawings, the sensor system for position calibration of the automated equipment according to an embodiment of the present invention will be described in detail.

First, as shown in FIG. 4, the sensor system for calibrating the position of the automated equipment according to the present invention 100 includes: an image sensor 110 for acquiring image data of a landmark 140 located below; A sensing unit including a laser sensor 120 including a light emitting unit 121 and a light receiving unit 122 of a laser beam returning from a plane on which a landmark 140 located at a location is formed; And a control unit including a controller 150 which receives the data obtained by the sensing unit, compares and analyzes the data, calculates a degree of deviation from the reference position for position correction, and then instructs the position correction operation.

In addition, the communication unit for transmitting the analysis process and the result in the detection unit to the terminal 170 of the manager is further included.

The plane on which the laser beam is reflected may be any plane located below the laser sensor 120, and information about the position of the plane may be input to the controller 150 to be used for later analysis between data.

The sensor system 100 for positioning correction is configured to include various industrial robots such as robots for transferring wafers for semiconductors, robots for assembly lines, logistics robots, inspection robots, clean room robots, LCD manufacturing robots, and precision stages. It is installed and used semi-permanently in automation equipment including precision stages or when it is needed for calibration.

Of course, it is preferable that the position correction sensor system 100 is semi-permanently installed in the work unit to check in real time whether the moved position of the work unit has moved away from the reference position, so that the correction can be made immediately after the position deviation.

Here, the work unit is a part that can be separated from the path and the designated position by the internal and external factors by repeatedly moving the path input as part of the automation equipment, and refers to the site where the position correction is performed by the controller. For example, a robot arm for performing a predetermined path in a repetitive operation, and a precision stage for moving and rotating.

Therefore, the position calibration sensor system 100 may be programmed to operate at any time, such as immediately before the work of the work unit is performed by a pre-input program, a time when the position is released during work, a time when the set work time elapses, This program is performed by the control unit.

Here, the controller 150 compares the reference data for position calibration with data of the image sensor 110 and the laser sensor 120 to calculate an error, and instructs the position calibration when a calibration task is required. ) Is included.

In addition, the sensor system 100 for position calibration includes data generated while checking the position of a work unit in real time, and the calculated and processed values and results of the data are connected to a wired LAN, a wireless LAN, a Wi-Fi, a Bluetooth, and the like. It is transmitted to the administrator's terminal 170 through the wired / wireless communication unit included therein, and the manager is configured to directly instruct the control unit to perform the calibration work, in addition to the case where it is programmed, based on these data and result values. .

On the other hand, the method for calibrating the position of the work unit of the position calibration sensor system 100 is located within the data acquisition range of the laser sensor 120 and the image sensor 110 and the sensors 110 and 120 mounted on the work unit. Among the data obtained from the landmarks 140, the reference data obtained when the working unit is in the correct position, and the laser data and image data obtained at the position of the working unit requiring calibration are compared and analyzed in the controller 150. The position calibration of the unit is made to be carried out, in which case the working unit is first executed to be within the calibration range by the image sensor 110 by means of the laser data obtained from the laser sensor 120.

When the classification is described according to the calibration step, the first step that is first corrected by the laser sensor 120; And a second step of being precisely calibrated by the image sensor 110.

here. Process data and result data executed during the first and second steps are transmitted and stored from the controller 150 to the administrator terminal 170 by wire / wireless communication, and the manager directly controls the controller 150 as necessary. ) Can be instructed to correct the position.

In the first step, the z-axis position of the work unit is calibrated to be within a calibration range by the image sensor 110 by calculating an error between reference data for position calibration and laser data obtained from the laser sensor 120. .

Further, in the second step, by calculating the error between the reference data for the position correction and the image data for the landmark obtained by the image sensor, the fine adjustment of the x-axis, y-axis, z-axis of the work unit, and the twist, plane The position with respect to the displacement of the phase rotation angle is precisely corrected.

Here, the laser sensor 120 includes a laser device, an optical sensor, an ultrasonic sensor, an electron beam sensor, and the like.

On the other hand, the image sensor 110 is a camera, the laser sensor 120 is a laser device configured to emit and receive a laser beam, the landmark 140 is located within the shooting range of the camera plane the laser beam is reflected An example of the case formed at will be described.

First, when the reference data for the position correction and the laser data obtained through the laser beam which is emitted from the laser device when the working unit is at the position away from the reflected light in the plane where the landmark 140 is formed, the comparative analysis, the camera The calibration on the height z-axis is preferentially done so that the work unit is located within a distance range in which the image data obtained at can have utility value as data.

Thereafter, the reference data for position calibration and the image data for the landmark 140 obtained by the camera when the z-axis is calibrated by the laser device while the working unit is in a displaced position are compared and analyzed. Precise adjustments to the x-, y-, and z-axes are precisely corrected for torsional and displacement in-plane rotational angles.

As such, precise position calibration of the work unit by the image sensor 110 followed by position calibration of the work unit by the laser sensor 120 is performed when the work unit is excessively displaced from the home position to the z-axis. This is because the sensor 110 only has to be inaccurately positioned in the z-axis, and in this case, it is difficult to perform the precise position calibration that is performed next.

Of course, the image sensor 110 may also be manufactured or purchased using a technology that may extend the calibration range of the z-axis of the image sensor 110, but in this case, a technology development cost and a manufacturing cost may be required or an expensive image sensor ( The effectiveness is low because it is necessary to purchase 110).

Therefore, by selecting a method in which low tuning by the laser sensor 120 is performed first and then fine tuning by the image sensor 110 is performed, a cost reduction effect can be obtained. Can be.

In addition, although the laser sensor 120 may be manufactured or purchased by applying a technology that may include a calibration function of the image sensor 110, in this case, the commercial use value is also low in cost.

That is, the position calibration of the work unit may be performed in a separate unit configuration by increasing the precision of the laser sensor 120 or the image sensor 110, but if the precision of each of the sensors 110 and 120 is increased, the manufacturing cost is increased. As management costs can rise, it is good practice to allow sensors with relatively low product costs to work together.

On the other hand, the measurement principle for the positional deviation using the laser sensor 120, the image sensor 110 and the landmark 140 will be described with reference to Figures 5a and 5b.

First, when the work unit is in the home position, reference data is obtained.

Then, when the work unit is out of position, the laser sensor 120 measures the distance to the plane on which the landmark 140 is formed to obtain laser data on the z-axis, and then the image sensor 110 The landmark 140 is photographed to obtain image data.

Comparing and analyzing the reference data, laser data and image data to calculate the position error of the work unit and correct the position. In the position calibration, the reference data and the laser data are compared and analyzed first, and image data is utilized as data. The position of the work unit is calibrated within a distance range which may have At this time, the z-axis may be corrected by the error distance calculated by comparing the reference data and the laser data at this time, but in the present invention, precise calibration may be performed by the image data acquired by the image sensor 110. It is desirable to correct only preferentially. The reason is explained above.

Then, the reference data and the image data are compared and analyzed.

At this time, the error of the X axis is obtained after "X offset = Xo-Xc",

It is calculated as "X offset (n + 1) = X offset (n) * scale".

In addition, the error of the Y axis is obtained after "Y offset = Yo-Yc",

Obtain "Y offset (n + 1) =" Y offset (n) * scale ".

In addition, the error of θ angle is obtained by “θ offset = θo-θc”.

here,

Co: center coordinate of one of two landmarks in reference data,

Cc: center coordinate of one side landmark among two measured Co in image data,

Do: Distance between centers of two landmarks in reference data,

Dc: distance between the centers of two landmarks in the image data,

Xo, Yo: Coordinates of the centers of the lines connecting the centers of two landmarks in the reference data,

scale: Do / Dc,

Xc, Yc: the coordinates of the center of the line connecting the centers of two landmarks in the image data,

θo: The angle formed by the line connecting the centers of two landmarks in the reference data with respect to the horizontal line,

θc: The angle formed by the line connecting the centers of two landmarks in the image data with respect to the horizontal line.

(Where 'o' is 'original', 'c' is 'current', 'n' is a natural number from '1' to '∞', 'X' refers to 'X axis', 'Y' 'Refers to the' Y axis'.)

Therefore, the error of the X axis is obtained by X offset (n + 1) calculated by repeatedly updating the X offset (n), and the error of the Y axis is calculated by repeatedly updating the Y offset (n) by Y offset (n + 1). The rotational displacement angle on the plane is obtained by θ offset.

In addition, warping is corrected in a horizontal state by recognizing the work unit as being in a twisted state rather than in a horizontal state when the two landmarks have different precisions, and having the two landmarks have the same precision.

In addition, the rotation angle on the plane is calculated by comparing the angle formed by the line connecting the centers of two landmarks with respect to the horizontal line to correct the error of the rotation angle on the plane.

In addition, the error of the z axis by the image sensor 110 is calculated by calculating the reference position Do obtained from the reference data and the position Dc secured by preferentially performing the distance of the z axis by the laser sensor 120. Can be expressed as D offset = Do-Dc. Alternatively, the error of the z axis by the image sensor 110 may be calculated by using a triangular measurement formed between the image sensor 100 and two landmarks alone, or may be calculated by using the D offset.

Therefore, the correction on the z axis is first corrected to the displacement value obtained through the laser sensor 120 and then again to the displacement value of the center distance between two landmarks 140 obtained through the image sensor 110. In this case, after performing coarse tuning with the laser sensor 120, fine tuning is performed sequentially with the image sensor 110 to be calibrated.

On the other hand, when the working unit is located within the calibration range by the image sensor 110 because the error of the z-axis is small, calibration by the laser sensor 120 is excluded, only calibration by the image sensor 110 is made.

In addition, the position of the work unit is the position of the z-axis, but when the error occurs in the x-axis, y-axis, distortion, the rotation angle on the plane, only the calibration by the image sensor 110 is also made.

This determination is made at the controller 150.

Hereinafter, an example in which the position calibration sensor system 100 is applied when the work unit is a substrate transfer system for transferring wafers will be described in detail. In addition, description overlapping with the above-mentioned calibration sensor system and the calibration method by this system is simplified, and the structure and calibration method applied to the board | substrate conveyance system are demonstrated concretely.

As shown in FIGS. 6A and 6B, the sensor system 100 for position calibration of the automated equipment according to the present invention is applied to a substrate transfer system for transferring wafers. First, a brief description will be made of the substrate transfer system.

The robot arm 200 for directly transferring a wafer in the substrate transfer system includes a grip portion 210 on which a wafer is seated and a top moving shaft (not shown) connected to the grip portion 210. The branch 210 and the highest moving shaft are configured to repeatedly move a predetermined path by a pre-programmed program.

One side portion of the gripping portion 210 protrudes, and a case 130 is mounted on a lower surface of the protruding portion 210, and the image sensor 110 and the laser sensor 120 are installed in close proximity to the case 130. In this case, the image sensor 110 and the laser sensor 120 is naturally installed to be able to shoot and irradiate downward.

In addition, the extension panel 160 is mounted to the protrusion of the gripping portion 210, and the controller 150 is mounted on the extension panel 160. In this case, the extension panel 160 may be mounted on the uppermost moving shaft or simultaneously mounted on the gripper 210 and the moving shaft.

Meanwhile, the two landmarks 140 positioned below the sensors 110 and 120 are positioned at one side edge of the table (or wafer chuck) on which the wafer is seated, that is, within the photographing range of the image sensor 110. 120 is formed in the plane providing the regression point. At this time, the two landmarks 140 are preferably located close to each other at the edge of the table deviating from the overlapping range of the directly below the wafer when the wafer is placed on the table.

The image sensor 110, the laser sensor 120, the controller 150, and the landmark 140 may be detachably installed, but are preferably fixed semi-permanently.

Therefore, the robot arm 200 continuously tracks the position of the grip arm 210 at the point where the robot arm 200, in detail, the wafer is seated on the table, while the robot arm 200 transfers the wafer. Position correction of 210 is made in real time. That is, the holding unit 210 may be calibrated not only through a separate working time while the wafer transfer operation is stopped, but also during the transfer operation.

In addition, data such as the position tracking and position calibration operation of the gripper 210 is transmitted to the terminal 170 of the manager through the controller 150, and the position calibration operation is controlled by the controller 170 through the terminal 170 at the administrator's discretion. Directly to 150 may be indicated. In this case, a wired communication network may be used, but wireless communication networks such as WLAN, Wi-Fi, and Bluetooth are preferably used.

On the other hand, the position correction of the gripper 210 is first calibrated so that the position of the z-axis through the data of the laser sensor 120 is located within the range that can be precisely corrected by the image sensor 110, and then the image sensor ( The data of 110) precisely corrects the positions of the x, y and z axes of the work unit and the displacement of the torsional and angular rotation angles.

Sensor system for position calibration 110 image sensor,
120 ... laser sensor 130 ... case,
140 ... landmark 150 ... controller,
160 ... Extended Panel 170 ... Terminal,
200 ... wafer transfer robot arm, 210 ... gripper.

Claims (10)

In the automated equipment that includes a work unit that performs work while traveling in a predetermined path, and requires position correction for precise work,
A detector including a laser sensor mounted on the work unit and an image sensor to obtain position data of the work unit;
A controller including a controller for instructing position calibration of the work unit by comparing and analyzing the laser data acquired from the laser sensor and the image data obtained from the image sensor with reference data for position calibration;
Is made, including,
The control unit first instructs the work unit to be positioned within the calibration range of the image sensor by analyzing the data obtained from the laser sensor that emits the laser beam and receives the work beam, and then analyzes the data obtained by photographing the image sensor. In addition to instructing this to be precisely in place,
A system for calibrating the position of the automated equipment, characterized in that the position calibration can be made in a separate position calibration work time, as well as instructing the work unit to correct the position even while working. The method of claim 1,
The control unit,
By calculating the error of the reference data for position calibration and the laser data with respect to the plane on which the landmarks acquired by the laser sensor are formed, the first calibration is performed so that the z-axis position of the work unit is positioned within the calibration range by the image sensor. Instruct,
The error between the reference data of the position correction and the image data acquired by the image sensor photographing two landmarks, that is, the center distance and the center position between each landmark, the precision of each landmark, and the center of two landmarks. Automated equipment, characterized in that it calculates the angle the line makes with the horizontal line to precisely correct the position of the work unit with respect to the precise adjustment and twist of the x, y and z axes of the work unit, the displacement of the rotational angle in the plane System for position calibration. The method of claim 2,
The processing and the result data of the control unit is transmitted to and stored in the administrator terminal, and further comprising a communication unit that allows the administrator to directly direct the position correction command to the control unit through the terminal regardless of whether the work unit is performed or not. System for position calibration of automated equipment. The method of claim 3,
The work unit is a wafer transfer robot arm comprising a grip portion on which a semiconductor wafer is seated, and a top moving shaft connected to the grip portion,
The gripping portion is formed in a shape protruding one side, the case is mounted on the lower surface of the gripping portion of the gripping portion, the system for position calibration of the automated equipment, characterized in that the laser sensor and the image sensor is installed on the case. The method of claim 4, wherein
An extension panel is mounted on the projection of the gripping portion, and a controller is installed on the extension panel. The method of claim 5,
The landmark is a photographing range of the image sensor, the position correction system of the automated equipment, characterized in that located on one side edge of the table out of the overlapping range of directly below the wafer in the state seated on the table. The method of claim 4, wherein
And said image sensor is a camera and said laser sensor is a laser device having a light emitting portion and a light receiving portion. In the automated equipment that includes a work unit that performs work while traveling in a predetermined path, and requires position correction for precise work,
A first step of first correcting such that the z-axis position of the work unit is within a calibration range by the image sensor by calculating an error between reference data for position calibration and laser data obtained from the laser sensor;
Precise adjustment of the x-axis, y-axis, and z-axis of the work unit by calculating the error between the reference data for position correction and the image data for the landmark obtained from the image sensor photographing two mutually adjacent image sensors. A second step of correcting a position with respect to the displacement of the rotational angle on the plane;
Is made, including,
The position calibration method of the automated equipment, characterized in that the position calibration can be made in addition to the separate position calibration work time is also performed while the work unit is working. The method of claim 8,
The processing and result data executed during the first and second steps are transmitted and stored by the communication network to the manager terminal, and the manager can directly instruct the controller to correct the position correction regardless of whether the position correction is performed. Position calibration method of the automated equipment, characterized in that the. The method of claim 8,
The work unit is a robot arm for transporting a wafer, and the robot arm includes a gripping portion on which the wafer is seated and a top moving shaft connected to the gripping portion, and a case in which the laser sensor and the image sensor are installed is a gripping portion. Mounted on one protruding side of the controller, the controller is installed on an extension panel that is coupled to the protruding portion of the grip, and when two landmarks are located on one side of the table,
The first step is a low precision adjustment by the laser sensor, first corrected so that the position with respect to the z axis of the gripping portion is located within the calibration range of the gripping portion by the image sensor,
The second step is a high-precision adjustment by the image sensor, characterized in that the precise position of the grip, x-axis, y-axis, z-axis precision adjustment, twisting, displacement of the rotational angle on the plane is precisely corrected How to calibrate the position.

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