KR20110107100A - Coverlay and fabricating method thereof - Google Patents

Abstract

The present invention relates to a coverlay and a method of manufacturing the same, and more particularly, a coverlay for coating a functional material composed of a dot / adhesive, a primer, an inorganic filler, an organic binder on a plastic film such as PET film, polyimide film and the like. It relates to a manufacturing method.
Coverlay according to the invention is a plastic film as a base material,
A primer layer formed on the surface of the plastic film to improve adhesion between the plastic film and the white coating layer;
A white coating layer formed on the primer layer and serving to reflect a lamp;
A point / adhesive layer applied to the back surface of the plastic film and attached to the surface of the substrate,
It is configured to include a release material to be attached to the release / adhesive layer to protect the point / adhesive layer.

Description

Coverlay and its manufacturing method {Coverlay and Fabricating Method eg}

The present invention relates to a coverlay and a method of manufacturing the same, and more particularly, a coverlay for coating a functional material composed of a dot / adhesive, a primer, an inorganic filler, an organic binder on a plastic film such as PET film, polyimide film and the like. It relates to a manufacturing method.

A conductive pattern constituting the circuit is printed on substrates such as a printed circuit board and a flexible printed circuit board.

In order to protect the pattern during the manufacturing process and use of the substrate, the coverlay is pre-attached to the surface of the substrate, and the coverlay is not attached to the place where the electronic component is to be mounted.

On one surface of a plastic film such as a polyimide film, a dot / adhesive is applied, and the dot / adhesive melts and adheres to the surface of the substrate when heat or pressure is applied.

This point / adhesive is protected by a release material, and a coverlay consisting of a plastic film, a point / adhesive and a release material is wound or rolled into a roll.

Meanwhile, the coverlay may be attached to protect the lead of the semiconductor in addition to the substrate, and applied to the LED BLU (Back Light Unit) to serve as a reflection of the LED lamp.

However, due to the circuit formation technology, thinning of electronic products, and pursuit of various functions, the quality requirements applied to the coverlay will also increase.

For example, foreign matter management and uniformity of coating surface are basic and crack problems and solvent resistance after hot press, discoloration in electroless plating solution, cracks or burrs accompanying reflection, and reflectance and soldering It is necessary to satisfy conditions such as necessary heat resistance.

In addition, as the type of plastic film used as the substrate is diversified, the surface of most of the materials becomes nonpolar, and the thickness of the film is thinned, the adhesion between the substrate and the functional material, which can be the basis of all required physical properties, is an important variable. To act as.

The present invention has been made to solve the problems that may occur in the above coverlay products, it is possible to improve the adhesion between the plastic film and the functional material as a base material by which the plastic film and the white coating layer is separated when punched out It is an object of the present invention to provide a coverlay and a manufacturing method thereof that can be prevented.

The coverlay according to the present invention for achieving the above object is formed on the surface of the plastic film and the plastic film as a base material to improve the adhesion between the plastic film and the white coating layer, and formed on the primer layer It consists of a white coating layer that serves as a reflection of the lamp, a dot / adhesive layer applied to the back surface of the plastic film and attached to the surface of the substrate, and a release material attached to be released to the adhesive / adhesive layer to protect the point / adhesive layer.

In addition, the method of manufacturing a coverlay according to the present invention by applying a primer coating on one surface of the plastic film while moving the plastic film at a predetermined speed to form a primer coating layer and drying, the coating agent for the lamp reflection on the primer coating layer Forming a white coating layer by applying a semi-finished product manufacturing step consisting of drying;

Finished product manufacturing step consisting of applying a dot / adhesive to one surface of the release material while moving the release material at a predetermined speed to form a point / adhesive layer and drying, laminating the release material and the semi-finished product and pressing and laminating ; It is configured to include.

According to the above-mentioned means for solving the problem, it is possible to improve the adhesion between the plastic film as the substrate and the functional material, thereby preventing the plastic film and the white coating layer from being separated when punched.

1 is a structural diagram of a coverlay according to the present invention,
2a and 2b is a view showing the manufacturing process of the coverlay according to the present invention,

Hereinafter, the configuration and operation of the present invention will be described with reference to the accompanying drawings.

1 is a structural diagram of a coverlay according to the present invention.

As shown in the drawing, the coverlay 10 has a primer layer 20 and a white coating layer 30 formed on a surface of the plastic film 10 serving as a base material, and a release material ( 50) is attached.

The plastic film 10 is made of a polyester film (PET), a polyimide film (PI), a polycarbonate film (PC), or the like as a base layer, and determines the shape of the product.

The primer layer 20 serves to improve the adhesion between the plastic film 10 and the white coating layer 30, and in particular exhibits an excellent effect on punchability and bendability and is applied in a thickness of 1 to 20 microns.

The primer layer 10 is 25 to 35% by weight of polyurethane resin (polyurethane resin), 19 to 21% by weight of N, N-dimethylformamide (N, N-dimethylformamide), methyl ethyl ketone (Methyl Ethyl Ketone) 20 to 99.6% by weight of modified polyisocyanate in main component (A) consisting of 24% by weight, 7-9% by weight of toluene, 19-21% by weight of xylene, Hexamethylene Di- Isocyanate: HDI) The hardening | curing agent (B) which consists of 0.4 weight% is degassed for 8 hours after mixing in the ratio of 100: 4 (A: B).

The white coating layer 30 is a layer that acts as a reflection of the LED lamp when applied to the LED BLU, acrylic acid, methacrylic acid, maleic acid, acryl amide, styrene Monomers such as (Styrene), Acrylonitrile, Vinyl Acetate, 2-Hydroxyethyl Methacrylate (HEMA), Glycidyl methacrylate, etc. ), Crosslinking agents and additives such as epoxy, isocyanates, melamine laurylmethacrylate, N-methyl acryl amide, and amine acid. 20 to 50 parts by weight of a filler, such as 100 parts by weight of an organic binder which is a polymerized acrylic ester copolymer, titanium dioxide (TiO ₂ ), silicon oxide (SiO ₂ ), calcium carbonate (CaCO ₃ ), solvent 50 to 200 Parts by weight, other leveling agents, etc. It consists of a functional material, the use of the isocyanate, curing agents (Curing Agent) in the amines (Amines), if necessary.

The medicament of the above composition is formed by applying and drying on the primer layer 20 using a suitable coating method such as gravure, microgravure.

The coating thickness of the white coating layer 30 is 10 to 50 microns, the thickness may vary depending on reflectivity, mold repellency, interfacial adhesion with the primer layer, etc., and the composition ratio is changed in consideration of heat resistance, acid resistance, solvent resistance, and the like. .

The point / adhesive layer 40 is a layer attached to the surface of the substrate and has a thickness of 5 to 50 microns, and can be largely divided into silicone, acrylic, rubber, epoxy, and the like.

Silicone resins are polymers containing siloxane (Si-O-Si) groups and generally include functional groups such as hydroxyl (-OH) or methoxy (-OCH ₃ ), methyl (-CH ₃ ) or phenyl (-C6H5) groups. Functional group).

Acrylic resins include acrylic acid, methacrylic acid, maleic acid, acrylamide, styrene, acrylonitrile, vinyl acetate, lauryl methacrylate, N-methylacrylamide, 2-hydroxyethyl methacrylate, and glycidyl methacryl. It refers to an acrylic ester copolymer polymerized using monomers such as late, a crosslinking agent such as epoxy, isocyanate, melamine chelate, and amine acid, and additives, and is classified into a solvent type, an emulsion type, and a hot melt type.

Rubber includes natural rubber, SBR (Styrene-butadiene rubber), SIS (Styrene Isoprene Styrene Block Copolymer), SBS (Styrene-butadiene-styrene block copolymer), butyl rubber, etc. By addition.

Epoxy can be bisphenol A (Bisphenol-A), Novolac type, Bisphenol F (Bisphenol-F) type and the like, and has excellent chemical resistance, heat resistance, and insulation properties.

The release material 50 protects the point / adhesive layer 40, and is made of paper or polyethylene terephthalate (PET) coated with a releasing material having other releasing force such as fluorine and silicon, in particular, PET or paper. Most preferred is a siliconized material.

At this time, the release force used may vary depending on the type and required physical properties of the point / adhesive 40 and mainly uses 5g / In ~ 300g / In.

2A and 2B are views illustrating a manufacturing process of a coverlay according to the present invention.

As shown in FIG. 2A, while unwinding the plastic film 10 wound around the unwinder and moving at a predetermined speed, one side of the plastic film 10 is coated with a coating agent described in FIG. 1 with a thickness of 1 to 20 microns (S20). ) After forming the primer layer 21 and drying (S22), a white coating having a thickness of 10 to 50 microns with a coating agent of the white coating layer 30 described in Figure 1 on the same surface (S23).

After drying (S24) and then wound with a rewinder to complete the semi-finished product (2).

The coating method used at this time is a roll coating of gravure, reverse gravure, kiss gravure, microgravure and the like, and the line speed is 5 to 80 M / min depending on the required coating thickness and the temperature at drying is 50 to 180 ° C.

As shown in FIG. 2B, the release material 50 wound on the unwinder is unwound and moved to a predetermined line speed while applying a dot / adhesive to a thickness of 5 to 50 microns (S25) and then drying (S26).

At this time, the coating method used is roll coating, knife coating method according to required properties, coating thickness, type of point / adhesive, viscosity, etc., and line speed is 5 ~ 80M / min, drying depending on required coating thickness. The temperature of the time is 50-180 degreeC.

The dried mold release material 50 and the semi-finished product 2 prepared in FIG. 2A are laminated by lamination by pressing the upper and lower rollers and laminated (S27), and then wound on a rewinder.

The pressure used in the stacking of the semi-finished product 2 and the release material 50 is 1 ~ 20kg / cm ² , the temperature is 5 ~ 200 ℃.

The laminated finished product (coverlay) 1 may be subdivided into rolls or plates in a later step.

≪ Example 1 >

In Example 1, the thickness (thickness) of the primer layer 20 was changed to 1 to 2, 3 to 4, 5 to 6, and 7 microns or more on the polyimide film 12.5 microns with the plastic film 10 to form the substrate (poly Mid film) The physical properties of the adhesiveness and mold repellency were confirmed.

Thickness (micron) 1-2 3 to 4 5 ~ 6 7 or more Remarks Substrate Adhesiveness (%) 98 100 100 100 Cross cut Mold punchability Good Great Great Great

As shown in Table 1, it can be seen that the thickness of the primer layer 10 shows excellent physical properties at 4 microns or more.

<Example 2>

In Example 2, the change of the average reflectance was considered by changing the thickness of the white coating layer 30 to 15, 20, 25, 30, 35 microns.

Thickness 15 20 25 30 35 Remarks Average
reflectivity Before heat treatment 81.25 84.23 88.90 90.12 91.63 After Hot Press 81.12 84.03 88.72 90.01 91.45

As shown in Table 2, it can be seen that the change in reflectance is hardly observed when the thickness of the white coating layer 30 is 30 microns or more.

<Example 3>

In Example 3, changes in physical properties of acid resistance, heat resistance, and solvent resistance according to the ink type of the white coating layer 30 were confirmed.

Properties Acid resistance
(20% sulfuric acid solution) Heat resistance
(250 ° C 10 minutes) Solvent resistance
(MEK) Remarks Ink A discoloration discoloration Good Ink B Unchanged Unchanged Good

As shown in Table 3, it can be seen that other characteristics are shown in acid resistance and heat resistance.

<Example 4>

In Example 4, the coverlays 1 were prepared by combining the above-described Examples 1 to 3, and the physical properties of the coverlays were compared with those of other companies.

Compare Invention Third Party Products Remarks


Properties


White coating layer (thickness) 30 micron 30 micron Adhesion 100 92 Heat resistance Unchanged Unchanged Acid resistance Unchanged Unchanged Solvent resistance Unchanged Unchanged Mold punchability Great Burr occurrence reflectivity 90.12 89.45

As shown in Table 4, it can be seen that the coverlay 10 according to the present invention is superior to the coverlays of other companies in mold repellency and substrate adhesion.

As described above, according to the present invention, problems such as burrs and cracks of the white coating layer 30, which may occur due to adhesion problems between the plastic film 10 and the functional drug, do not occur.

1: coverlay 10: plastic film
20: primer layer 30: white coating layer
40: point / adhesive layer 50: release material

Claims (7)

Plastic film as a base material;
A primer layer formed on a surface of the plastic film to improve adhesion between the plastic film and the white coating layer;
A white coating layer formed on the primer layer to serve as a reflection of the lamp;
A dot / adhesive layer applied to the back surface of the plastic film and attached to the surface of the substrate;
A coverlay comprising a release material that is attached to the adhesive / adhesive layer to be released to protect the point / adhesive layer. The method of claim 1,
The primer layer is 25 to 35% by weight of polyurethane resin (polyurethane resin), 19 to 21% by weight of N, N-dimethylformamide (N, N-dimethylformamide), 20 to 24% by weight of methyl ethyl ketone (Methyl Ethyl Ketone) , 9-9% by weight of modified polyisocyanate in main component (A) consisting of 7 to 9% by weight of toluene, 19 to 21% by weight of xylene, and diisocyanate (Hexamethylene Di-Isocyanate: HDI) ) A coverlay formed by degassing the curing agent (B) made of 0.4% by weight at a ratio of 100: 4 (A: B) for 8 hours. The method of claim 1,
The release material is polyethylene terephthalate (PET) or coverlay, characterized in that the siliconized on paper. The method of claim 1,
The thickness of the primer layer is 4 to 20 microns, the thickness of the white coating layer is a coverlay, characterized in that 30 to 50 microns. A primer coating is applied to one surface of the plastic film while the plastic film is moved at a predetermined speed to form a primer coating layer and dried, and a white coating layer is formed by applying a coating agent for lamp reflection on the primer coating layer and drying the coating film. A semifinished product manufacturing step;
Finished product manufacturing step consisting of applying a dot / adhesive to one surface of the release material while moving the release material at a predetermined speed to form a point / adhesive layer and drying, laminating the release material and the semi-finished product and pressing and laminating ;
Coverlay manufacturing method comprising a. The method of claim 5, wherein
Line speed of the plastic film and the release material is 5 ~ 80M / min, the drying temperature is 50 ~ 180 ℃ manufacturing method of the coverlay. The method of claim 5, wherein
The pressure used in the stacking of the semi-finished product and the release material is 1 ~ 20kg / cm ² , the temperature is a coverlay manufacturing method, characterized in that 5 ~ 200 ℃.

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