KR20110105471A - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
KR20110105471A
KR20110105471A KR1020100024618A KR20100024618A KR20110105471A KR 20110105471 A KR20110105471 A KR 20110105471A KR 1020100024618 A KR1020100024618 A KR 1020100024618A KR 20100024618 A KR20100024618 A KR 20100024618A KR 20110105471 A KR20110105471 A KR 20110105471A
Authority
KR
South Korea
Prior art keywords
housing
hole
piezoelectric
speaker
fan
Prior art date
Application number
KR1020100024618A
Other languages
Korean (ko)
Inventor
김한상
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020100024618A priority Critical patent/KR20110105471A/en
Publication of KR20110105471A publication Critical patent/KR20110105471A/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The electronic device includes a housing provided with a hole and a piezoelectric fan installed inside the housing to discharge air from the housing through the hole, and the air inside the housing heated by heat generated from a circuit board or electronic component installed inside the housing. Since the heat is radiated by the piezoelectric fan through the hole, the temperature inside the housing can be maintained at an appropriate level or less.

Description

Electronic device {ELECTRONIC APPARATUS}

The present invention relates to an electronic device capable of maintaining a temperature inside a housing below a certain level.

In general, the electronic device includes a housing that forms an exterior, and a circuit board disposed in the housing, and various electronic components are installed to control the electronic device to perform an operation according to its use.

Among these electronic devices, portable electronic devices such as mobile phones, portable game consoles, and MP3 plays are widely used, and these portable electronic devices are being miniaturized to be easily portable.

When the electronic device is miniaturized as described above, since the space inside the housing is very narrow, heat dissipation of heat generated from a circuit board or an electronic component installed inside the housing becomes difficult, so that the temperature inside the housing may rise to an appropriate level or more.

One aspect of the present invention is to provide an electronic device capable of maintaining a temperature inside a housing at an appropriate level or less.

An electronic device according to an aspect of the present invention includes a housing forming an exterior, a hole provided in the housing, and a piezoelectric fan disposed inside the housing to flow air toward the hole.

In addition, the piezoelectric fan is formed in a plate shape and includes a fan blade for vibrating and moving air, and a pair of piezoelectric elements installed on one end of each side of the fan blade to cause vibration of the other end of the fan blade.

In addition, a circuit board installed in the housing and an electronic component installed to correspond to the hole in the circuit board, the piezoelectric fan includes a pair of piezoelectric fans disposed opposite to each other on the electronic component.

The housing also includes a guide portion extending obliquely from the hole abutment into the housing.

The apparatus may further include a speaker disposed inside the housing to generate sound, and the hole may include a speaker hole to allow sound generated by the speaker to be transferred to the outside of the housing.

As described above, heat is radiated to the outside of the housing together with air discharged to the outside of the housing through the hole by the piezoelectric fan, so that the temperature inside the housing is prevented from rising to an appropriate level.

1 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention.
2 is a perspective view of a piezoelectric fan applied to an electronic device according to an embodiment of the present invention.
3 is a cross-sectional view schematically showing the air flow flowing by the piezoelectric fan applied to the present invention.

Hereinafter, one preferred embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the electronic device includes a housing 10 forming an exterior thereof, and a circuit board 11 disposed in the housing 10 to control various operations of the electronic device. ), Various electronic components 12 are installed.

A speaker 13 for generating a sound is disposed in the housing 10, and the speaker hole 10a is provided in the housing 10 so that the sound generated from the speaker 13 can be easily transmitted to the outside of the housing 10. The speaker 13 is installed inside the speaker hole 10a.

In addition, the electronic device includes a piezoelectric fan 14 for allowing heat generated from the circuit board 11 and the electronic component 12 to be easily radiated to the outside of the housing 10.

The piezoelectric fan 14 is installed on the circuit board 11 inside the housing 10 to generate a blowing force so that air in the housing 10 flows toward the speaker hole 10a. 2) is formed in a plate shape as shown in Figure 2 and the fan blade 14a for vibrating the other end around the one end and the air to move from one end side to the other end side, and on both sides of one end of the fan blade 14a Each of which includes a pair of piezoelectric elements 14b installed to cause vibration of the other end of the fan blade 14a.

At this time, the other end of the fan blade 14a of the piezoelectric fan 14 is disposed to face the space between the speaker hole 10a and the circuit board so that the air inside the housing 10 is supplied to the speaker hole 10a and the circuit board 11. It is supposed to lead to the space between them.

In addition, as described above, a variety of electronic components 12 are installed in the circuit board 11, and the electronic components 12 which generate a lot of heat among these electronic components 12 correspond to the speaker holes 10a. If the circuit board 11 is designed to be placed on the. Since the heat generated from the electronic component 12 that generates a lot of heat can be more effectively radiated, it is advantageous to lower the temperature inside the housing 10.

In this embodiment, a pair of piezoelectric fans 14 are provided so as to face each other on both sides of the electronic component 12 provided at a position corresponding to the speaker hole 10a. That is, the other ends of the fan blades 14a of the two piezoelectric fans 14 are installed to face each other. When the two piezoelectric fans 14 are installed in such a manner, the air flowing by the two piezoelectric fans 14 is collided with each other where the electronic component 12 is installed, and thus the two piezoelectric fans 14 The direction of flowing air is switched to move to the speaker hole 10a.

The housing 10 is formed with a guide portion 10b for allowing air moved between the circuit board 11 and the speaker hole 10a by the piezoelectric fan 14 to be more easily guided to the speaker hole 10a. . The guide portion 10b extends the housing 10 inclined from the adjacent portion of the speaker hole 10a to the inside of the housing 10.

Therefore, when power is applied to the piezoelectric fan 14, as shown in FIG. 3, the other end of the fan blade 14a vibrates about one end of the fan blade 14a provided with the piezoelectric element 14b and the housing 10. The inside of the fan blade 14a moves from one end of the fan blade 14a to the other end so that the air inside the housing 10 moves between the speaker hole 10a where the electronic component 12 is located and the substrate 11. Air moved between the speaker hole 10a and the substrate 11 by the two piezoelectric fans 14 collides with each other, and its direction is changed and guided to the speaker hole 10a by the guide part 10b of the housing 10. It is discharged out of the housing 10 through the speaker hole 10a.

As such, the heat generated from the electronic component 12 is dissipated through the speaker hole 10a together with the discharged air while the air inside the housing 10 is discharged to the outside through the speaker hole 10a. The temperature of the interior space can be maintained at an appropriate level.

In addition, if the heat dissipation is made through the speaker hole 10a as in the present embodiment, the appearance of the housing 10 may be maintained as it is regardless of whether the piezoelectric fan 14 is applied.

In this embodiment, the piezoelectric fan 14 guides the air inside the housing 10 to the speaker hole 10a so as to discharge air to the outside of the housing 10 through the speaker hole 10a. The present invention is not limited thereto, and the piezoelectric fan 14 is installed to guide air to various other holes provided in the housing 10 in addition to the speaker hole 10a. It is also possible to make it happen.

It is apparent to those skilled in the art that the present invention is not limited to the above-described embodiments, and that various modifications and variations can be made without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

10: housing 10a: speaker hole
10b: guide part 11: circuit board
12: Electronic component 13: Speaker
14: piezoelectric fan

Claims (5)

A housing forming an appearance,
A hole provided in the housing,
And a piezoelectric fan disposed inside the housing to flow air toward the hole. The method of claim 1,
The piezoelectric fan includes a fan blade which is formed in a plate shape and vibrates and moves air, and a pair of piezoelectric elements installed on one end of both sides of the fan blade to cause vibration of the other end of the fan blade. The method of claim 1,
A circuit board installed in the housing and an electronic component installed in the circuit board to correspond to the hole;
The piezoelectric fan includes a pair of piezoelectric fans disposed opposite to each other on both sides of the electronic component. The method of claim 1,
The housing includes a guide portion extending inclined from the hole adjacent portion into the housing. The method of claim 1,
A speaker disposed inside the housing to generate sound;
The hole is an electronic device including a speaker hole to allow the sound generated in the speaker to be transmitted to the outside of the housing.
KR1020100024618A 2010-03-19 2010-03-19 Electronic apparatus KR20110105471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100024618A KR20110105471A (en) 2010-03-19 2010-03-19 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100024618A KR20110105471A (en) 2010-03-19 2010-03-19 Electronic apparatus

Publications (1)

Publication Number Publication Date
KR20110105471A true KR20110105471A (en) 2011-09-27

Family

ID=44955806

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100024618A KR20110105471A (en) 2010-03-19 2010-03-19 Electronic apparatus

Country Status (1)

Country Link
KR (1) KR20110105471A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019156487A1 (en) * 2018-02-09 2019-08-15 삼성전자 주식회사 Heat radiating structure and electronic device including same
CN113597192A (en) * 2020-04-30 2021-11-02 维沃移动通信有限公司 Electronic equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019156487A1 (en) * 2018-02-09 2019-08-15 삼성전자 주식회사 Heat radiating structure and electronic device including same
CN113597192A (en) * 2020-04-30 2021-11-02 维沃移动通信有限公司 Electronic equipment
CN113597192B (en) * 2020-04-30 2024-02-02 维沃移动通信有限公司 Electronic equipment

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E601 Decision to refuse application