KR20110091320A - Light emitting device package and method of manufacturing the same - Google Patents

Light emitting device package and method of manufacturing the same Download PDF

Info

Publication number
KR20110091320A
KR20110091320A KR1020100011099A KR20100011099A KR20110091320A KR 20110091320 A KR20110091320 A KR 20110091320A KR 1020100011099 A KR1020100011099 A KR 1020100011099A KR 20100011099 A KR20100011099 A KR 20100011099A KR 20110091320 A KR20110091320 A KR 20110091320A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
main body
fixing hole
device package
Prior art date
Application number
KR1020100011099A
Other languages
Korean (ko)
Inventor
이수환
Original Assignee
삼성엘이디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성엘이디 주식회사 filed Critical 삼성엘이디 주식회사
Priority to KR1020100011099A priority Critical patent/KR20110091320A/en
Publication of KR20110091320A publication Critical patent/KR20110091320A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting device package and a method of manufacturing the same are provided.
The light emitting device package according to the present invention includes a light emitting device; A main body having an electrode terminal and mounting the light emitting element to be electrically connected to the electrode terminal; A lens unit provided on the main body unit; And a binding part including a fixing hole penetratingly formed in the main body and a fixing protrusion protruding from the lens to be coupled to the fixing hole.

Description

Light Emitting Device Package and Method of Manufacturing The Same

The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, to a light emitting device package and a method of manufacturing the same that can increase the coupling force of the lens unit and the main body.

A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light by forming a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, and InGaInP.

Such light emitting devices are widely used in various fields such as TVs, computers, lighting, automobiles, etc. due to their excellent monochromatic peak wavelength, excellent light efficiency, miniaturization, eco-friendliness, and low power consumption. It is going out.

Light emitted from the light emitting device passes through the encapsulant on the substrate or package on which the light emitting device is mounted and is emitted to the outside. At this time, the amount of light can be extracted to the outside depending on the shape of the light emitting surface in contact with the outside, in order to reduce the total reflection to increase the light extraction efficiency by forming a lens on the light emitting surface of the light emitting device package have.

However, the light emitting device generates a lot of heat in accordance with the increase of the applied current, which may cause the lens to be separated from the substrate or the package due to heat generated during operation of the light emitting device or heat or impact applied from the outside. have.

Disclosure of Invention An object of the present invention is to provide a light emitting device package and a method of manufacturing the same, which can prevent a defect of a product by increasing a bonding force so that a lens unit provided on a main body portion on which a light emitting device is mounted is not separated by heat or impact.

A light emitting device package according to an embodiment of the present invention includes a light emitting device; A substrate unit having an electrode terminal and mounting the light emitting element to be electrically connected to the electrode terminal; A lens unit provided on the substrate unit; And a binding part including a fixing hole penetratingly formed in the substrate and a fixing protrusion protruding from the lens to be coupled to the fixing hole.

In addition, the binding portion may be formed such that the size of the cross-sectional area exposed to the upper surface of the fixing hole is smaller than the size of the cross-sectional area exposed to the lower surface of the substrate.

In addition, the fixing hole may be formed such that the inner circumferential surface is inclined from the upper surface to the lower surface of the substrate so that the size of the cross-sectional area is increased toward the lower surface.

In addition, the fixing hole is formed to have a stepped structure so that the size of the cross-sectional area may increase toward the lower surface.

In addition, the fixing part may have the fixing hole penetrating the electrode terminal and the substrate.

In addition, the binding portion may be formed such that the fixing protrusion has a shape corresponding to the shape of the fixing hole.

In addition, the electrode terminal may be formed along the surface of the body portion.

In addition, the body portion may include a pair of lead frames exposed to the bottom surface of the body portion or to the top and bottom surfaces of the body portion, and the light emitting device may be mounted on any one side of the lead frame.

On the other hand, the method of manufacturing a light emitting device package according to an embodiment of the present invention comprises the steps of repeatedly provided through the fixing hole for each predetermined position in the body portion base for mounting a plurality of light emitting devices electrically connected to the electrode terminal; Injecting and hardening a lens unit material after mounting the main body substrate in a jig and a mold; Separating the jig and the mold to prepare a body part substrate including a lens part formed on each light emitting device; And dicing the main body substrate along a cutting line.

In addition, in the step of forming the fixing hole, the fixing hole may be formed such that the size of the cross-sectional area exposed to the upper surface of the body portion substrate is smaller than the size of the cross-sectional area exposed to the lower surface of the body portion substrate. .

The method may further include forming a fixing protrusion having a shape corresponding to the shape of the fixing hole by filling the lens portion material in the fixing hole formed in the main body portion in the curing of the lens unit material. .

According to the present invention, the lens part is not easily separated from the main body part even by heat generated by the operation of the light emitting device or heat or impact applied from the external environment, and thus has a stable structure, thus improving the reliability of the product.

In addition, it is easy to manufacture and mass production is possible, there is an advantage that the productivity is increased.

1 is a perspective view schematically showing a light emitting device package according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating the light emitting device package illustrated in FIG. 1.
FIG. 3 is a plan view illustrating the light emitting device package illustrated in FIG. 1 and a cross-sectional view illustrating a state cut along the x-x 'axis.
4 is a cross-sectional view illustrating embodiments of another structure of a fixing hole in the light emitting device package shown in FIG. 1.
5 is a perspective view schematically showing another embodiment of the electrode terminal in the light emitting device package shown in FIG.
6 is a schematic view sequentially illustrating a manufacturing process of the light emitting device package shown in FIG. 1.
7 is a schematic view illustrating another manufacturing process of the light emitting device package shown in FIG. 1.

A light emitting device package and a method for manufacturing the same according to an embodiment of the present invention will be described with reference to the drawings.

However, embodiments of the present invention may be modified in many different forms and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

Therefore, the shape and size of the components shown in the drawings may be exaggerated for more clear description, components having substantially the same configuration and function in the drawings will use the same reference numerals.

1 is a perspective view schematically showing a light emitting device package according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing a light emitting device package shown in FIG. 1, and FIG. 3 is a plan view showing the light emitting device package shown in FIG. And a cross-sectional view showing a state cut along the x-x 'axis.

4 is a cross-sectional view illustrating embodiments of another structure of a fixing hole in the light emitting device package illustrated in FIG. 1, and FIG. 5 is a perspective view schematically showing another embodiment of an electrode terminal in the light emitting device package illustrated in FIG. 1. to be.

1 to 5, a light emitting device package according to an embodiment of the present invention 1 includes a light emitting device 10, a main body 20, a lens unit 30, and a binding unit 40. It is composed.

The light emitting device 10 is a kind of semiconductor device that emits light of a predetermined wavelength by a power source applied from the outside, and in the embodiment according to the present invention, a single light emitting device 10 is illustrated. The present invention is not limited thereto and may include a plurality of light emitting devices.

The main body 20 on which the light emitting device 10 is mounted is a kind of a printed circuit board (PCB), which is formed of an organic resin material containing epoxy, triazine, silicon, and other organic resin materials, or may be AlN, Al 2 O It may be formed of a ceramic material such as three .

In addition, the main body 20 includes an electrode terminal 21 electrically connected to the light emitting device 10.

As shown in FIGS. 2 and 3, the electrode terminals 21a and 21b may be formed by attaching a pair along the flat surface of the main body 20 in a printed or thin film form. In this case, the electrode terminals 21a may be formed. 21b is provided at the lower side of the main body 20 by forming the electrode connection plating layers 23 on opposite sides of the main body 20 so as to supply power from the outside. 22b) and may be electrically connected to each other.

The electrode connection plating layer 23 and the connection terminals 22a and 22b extend from the electrode terminals 21a and 21b exposed to both side surfaces of the main body 20 and extend along the side of the main body 20. It is also possible to be formed in a structure integral with the electrode terminals (21a, 21b) by bending.

In addition, the electrode terminals 21a and 21b may be electrically connected to the connection terminals 22a and 22b through internal electrodes provided in the main body 20, that is, conductive vias (not shown).

Meanwhile, as shown in FIG. 5, the main body 20 includes a pair of lead frames 21'a, which are respectively exposed to the lower surface, the upper surface and the lower surface of the main body 20, and both side surfaces facing each other. 21'b).

The lead frames 21'a and 21'b may be formed to have a thickness corresponding to the thickness of the main body 20, and the light emitting device 10 may include the pair of lead frames 21'a. , 21'b) may be mounted on either side.

As such, when the pair of lead frames 21 ′ a and 21 ′ b are exposed to the upper and lower surfaces of the main body 20, the heat generated from the light emitting device 10 is the lead frame. It can be emitted directly through (21'a, 21'b) it is possible to improve the heat radiation efficiency.

In addition, it can have a stable mounting structure in accordance with the increase in the mounting area has the advantage that the reliability can be improved.

In order to improve the heat dissipation efficiency, the lead frames 21'a and 21'b are preferably made of metal having high thermal conductivity, such as copper, copper, aluminum, silver, molybdenum, or an alloy thereof.

The lens unit is provided on the main body to encapsulate the light emitting device.

The lens unit 30 may be formed of a transparent silicone resin, an epoxy resin, or a resin in which the two materials are mixed, or may be formed of glass having high heat resistance.

As shown in the figure, the lens unit 30 is preferably formed in the shape of a convex dome (dome) to the upper side to form a curved surface in order to increase the light extraction efficiency or to emit light in a predetermined direction. However, the present invention is not limited thereto, and the upper surface may be formed in a flat structure according to the purpose of use, and the central portion of the upper surface may be formed in a recessed structure.

The lens unit 30 is generally formed on the main body 20 through a molding process, or is manufactured through a separate process and then coupled to the main body 20. In this case, the coupling between the lens unit 30 and the main body 20 depends on the adhesion between the material of the lens unit 30 and the main body 20 in the molding process, and the adhesion at this time is the lens unit 30. When the curing is to be made by the covalent chemical bond and electrostatic attraction that occurs between the main body portion 20 and.

When the completed lens unit 30 is bonded onto the main body unit 20, the lens unit 30 is bonded using a thermosetting adhesive (not shown) or the like.

This conventional method provides sufficient adhesion to prevent the lens unit 30 from being separated from the main body unit 20 by high temperature heat generated during operation of the light emitting device 10 or heat or impact applied from an external environment. Did not exercise.

In the present invention has a structural feature to achieve a mechanical coupling by providing a binding portion 40 between the lens portion 30 and the body portion 20 in a way to solve this problem.

The binding unit 40 is to generate a locking fixing force so that the lens unit 30 is not easily separated from the main body 20, and the fixing hole 42 is formed through the main body 20; A fixing protrusion 41 protruding from the lens unit 30 to be coupled to the fixing hole 42 may be included.

The fixing holes 42 are formed to penetrate at least one or more to generate stable fixing force, and are provided near the edge of the main body 20 to prevent interference with light emitted from the light emitting device 10. It is preferable. That is, as shown in the figure may be formed near the corner of the body portion 20, it may be formed on the side between the corner. In this case, in order to distribute the force, the fixing holes 42 are preferably formed to be spaced apart from each other at symmetrical intervals, but are not limited thereto.

In order to generate the locking force, the fixing hole 42 has a conical structure such that the size of the cross-sectional area exposed to the upper surface of the main body 20 is smaller than the size of the cross-sectional area exposed to the lower surface of the main body 20. It is preferable to form.

In this case, as shown in FIGS. 3 and 4a, the fixing hole 42 has an inner circumferential surface formed to be inclined from the upper surface of the main body 20 to the lower surface so that the size of the cross-sectional area increases toward the lower surface. Can be. In addition, as shown in Figure 4b the fixing hole 42 may be formed to have a stepped structure so that the size of the cross-sectional area is increased to the lower surface.

The fixing hole 42 may be formed to penetrate only the main body 20 according to the shape of the electrode terminals 21a and 21b or may be formed to penetrate together with the electrode terminals 21a and 21b. Alternatively, as shown in FIG. 5, only the electrode terminals 21 ′ a and 21 ′ b may be penetrated.

Meanwhile, the fixing protrusion 41 protrudes from the lower surface of the lens unit 30 facing the main body 20, and the position of the fixing hole 42 formed in the main body 20. It may be provided at a corresponding position.

In addition, the fixing protrusion 41 is preferably provided in the same number as the number of the fixing hole 42, in particular, the fixing protrusion 41 to have a shape corresponding to the shape of the fixing hole 42. Can be formed.

In this way, the locking fixing force is generated through the coupling part 40 including the fixing hole 42 and the fixing protrusion 41 to increase the coupling force between the lens part 30 and the main body part 20. The binding unit 40 has a simple structure and is easy to manufacture, which has the advantage of allowing mass production.

6 and 7 will be described in detail with respect to the manufacturing method of the light emitting device package according to an embodiment of the present invention.

6 is a schematic view sequentially showing a manufacturing process of the light emitting device package shown in FIG. 1, and FIG. 7 is a schematic view showing another manufacturing process of the light emitting device package shown in FIG.

First, as shown in FIG. 6A, an electrode terminal (not shown) is provided, and a fixing hole 42 is provided in a body part base 20 ′ on which a plurality of light emitting devices 10 are electrically connected to the electrode terminal. ) Is repeatedly provided at predetermined positions and provided.

In this case, a plurality of fixing holes 42 may be formed through the circumference of each light emitting device 10 with respect to the light emitting devices 10 arranged at regular intervals.

In particular, the fixing hole 42 has a conical shape such that the size of the cross-sectional area exposed to the upper surface of the main body substrate 20 'is smaller than the size of the cross-sectional area exposed to the lower surface of the main body substrate 20'. It is characterized by being formed into a structure.

Next, as shown in FIG. 6B, the main body substrate 20 ′ including the plurality of light emitting devices 10 and the fixing holes 42 is fixed in the jig M2.

Then, the mold M1 having a shape corresponding to that of the lens unit 30 is mounted on the jig M2, and then the lens unit material 30 ′ is injected through the injection hole and cured. At this time, the fixing hole 42 formed in the base of the main body 20 'is filled with a lens material material 30' so that the fixing protrusion 41 having a shape corresponding to the shape of the fixing hole 42 is formed.

Then, as shown in FIG. 6C, the mold M1 and the jig M2 are separated to provide a main body substrate 30 ′ including the lens unit 30 on each light emitting device 10. As described above, the main body substrate 30 ′ may be diced along the cutting line C to form a light emitting device package divided into a plurality of single products.

On the other hand, as shown in Figure 7 based on the mold (M'1) having a shape corresponding to the shape of the lens unit 30, the electrode in the state in which the lens unit material 30 'is filled in the mold (M'1) After mounting the main body substrate 20 'including the terminal, the light emitting device 10, and the fixing hole 42 in an inverted state so that the light emitting device 10 faces the mold M'1, the jig ( It is also possible to combine M'2) on the mold M'1 and to harden it.

10 ....... Light emitting element 20 ....... Main body
21a, 21b .. Electrode terminals 22a, 22b .. Connection terminals
23 ....... Plating layer 30 ....... Lens section
40 ....... Binding section 41 .......
42 ....... Mounting Hole M1 ....... Mold
M2 ....... Jig

Claims (11)

A light emitting element;
A main body having an electrode terminal and mounting the light emitting element to be electrically connected to the electrode terminal;
A lens unit provided on the main body unit; And
A binding part including a fixing hole penetratingly formed in the main body and a fixing protrusion protruding from the lens to be coupled to the fixing hole;
Light emitting device package comprising a.
The method of claim 1,
The binding unit is a light emitting device package, characterized in that the size of the cross-sectional area exposed to the upper surface of the fixing hole is smaller than the size of the cross-sectional area exposed to the lower surface of the body portion.
The method of claim 2,
The fixing hole is a light emitting device package, characterized in that the inner circumferential surface is formed to be inclined from the upper surface to the lower surface of the body portion so that the size of the cross-sectional area increases toward the lower surface.
The method of claim 2,
The fixing hole is formed to have a stepped structure, the light emitting device package, characterized in that the size of the cross-sectional area increases toward the lower surface.
The method according to claim 1 or 2,
The binding part is a light emitting device package, characterized in that the fixing hole is formed through the electrode terminal and the body portion.
The method according to claim 1 or 2,
The binding part is a light emitting device package, characterized in that the fixing protrusion is formed to have a shape corresponding to the shape of the fixing hole.
The method of claim 1,
The electrode terminal is a light emitting device package, characterized in that formed along the surface of the body portion.
The method of claim 1,
The main body unit includes a pair of lead frames exposed to the lower surface of the main body portion or the upper and lower surfaces of the main body portion, wherein the light emitting device is mounted on any one side of the lead frame.
Repeating the fixing holes through predetermined positions in the body unit base on which the plurality of light emitting devices electrically connected to the electrode terminals are formed;
Injecting and hardening a lens unit material after mounting the main body substrate in a jig and a mold;
Separating the jig and the mold to prepare a body part substrate including a lens part formed on each light emitting device; And
Dicing the body substrate along a cutting line;
Method of manufacturing a light emitting device package comprising a.
10. The method of claim 9,
In the step of forming the fixing hole,
The fixing hole is a manufacturing method of a light emitting device package, characterized in that the size of the cross-sectional area exposed to the upper surface of the body portion substrate is smaller than the size of the cross-sectional area exposed to the lower surface of the body portion substrate.
10. The method of claim 9,
Injecting and curing the lens material,
And forming a fixing protrusion having a shape corresponding to the shape of the fixing hole by filling the lens unit material in the fixing hole formed in the base of the main body.
KR1020100011099A 2010-02-05 2010-02-05 Light emitting device package and method of manufacturing the same KR20110091320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100011099A KR20110091320A (en) 2010-02-05 2010-02-05 Light emitting device package and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100011099A KR20110091320A (en) 2010-02-05 2010-02-05 Light emitting device package and method of manufacturing the same

Publications (1)

Publication Number Publication Date
KR20110091320A true KR20110091320A (en) 2011-08-11

Family

ID=44928776

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100011099A KR20110091320A (en) 2010-02-05 2010-02-05 Light emitting device package and method of manufacturing the same

Country Status (1)

Country Link
KR (1) KR20110091320A (en)

Similar Documents

Publication Publication Date Title
CN105895792B (en) Light emitting assembly
KR101007131B1 (en) Light emitting device package
US9673361B2 (en) Light-emitting apparatus with leads coated with metal films
CN106663659B (en) Surface mountable semiconductor device and method of manufacturing the same
US9512968B2 (en) LED module
JP5813467B2 (en) Substrate, light emitting device, and method of manufacturing substrate
US8952404B2 (en) Light-emitting device package and method of manufacturing the light-emitting device package
CN108054254B (en) Semiconductor light emitting structure and semiconductor packaging structure
US10667345B2 (en) Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
TWI505519B (en) Light-emitting diode light bar and the method for manufacturing the same
US20150171282A1 (en) Resin package and light emitting device
US20130292812A1 (en) Lead frame for semiconductor device and semiconductor device package using the lead frame
JP2017107965A (en) Method of manufacturing package, method of manufacturing light-emitting device, and package and light-emitting device
KR20090028709A (en) Light-emitting device mounting substrate and method for producing same, light-emitting device module and method for manufacturing same, display, illuminating device, and traffic signal system
JP6205894B2 (en) Package molded body for light emitting device and light emitting device using the same
US10964637B2 (en) Package and light emitting device
TWI565101B (en) Light emitting diode package and method for forming the same
JP2012216654A (en) Resin mold frame and optical semiconductor device
KR101273045B1 (en) Package of light emitting diode
KR20110091320A (en) Light emitting device package and method of manufacturing the same
US20230197886A1 (en) Semiconductor apparatus
TWI521745B (en) Light emitting diode package and method for manufacuring the same
JP2015038917A (en) Lead frame, lead frame with resin, multifaceted body of lead frame, multifaceted body of lead frame with resin, optical semiconductor device, multifaceted body of optical semiconductor device
JP2008103402A (en) Package assembly for upper/lower electrode type light emitting diode, and its manufacturing method
KR101507132B1 (en) Light emitting device

Legal Events

Date Code Title Description
N231 Notification of change of applicant
WITN Withdrawal due to no request for examination