KR20110020635A - Wafer level package for inkjet head, inkjet head of array-type and method of manufacturing inkjet head - Google Patents

Abstract

PURPOSE: A wafer level package for an inkjet head, the inkjet head of an array-type and a method of manufacturing the inkjet head are provided to prevent crosstalk which is generated in forming a plurality of nozzle in one body by arranging head bodies which are manufactured respectively to be adhered to each other closely. CONSTITUTION: In a wafer level package for an inkjet head, the inkjet head of an array-type and a method of manufacturing the inkjet head, a flow path wafer(110) comprises a plurality of ink chambers. A middle wafer(120) is overlapped with one side of the flow path wafer A nozzle wafer(130) is bonded with the bottom of the middle wafer to be overlapped with each other. The nozzle wafer includes a nozzle for discharging ink outside. The flow path wafer and the nozzle wafer are cut by a head body unit having one nozzle.

Description

Wafer level package for inkjet head, inkjet head of array-type and method of manufacturing inkjet head}

The present invention relates to a wafer level package for an inkjet head, an inkjet head assembly of an array type, and a manufacturing method of an inkjet head, and more particularly, to a wafer level package for an inkjet head having a low defect rate in a manufacturing process, and a head manufactured from a wafer level package. An inkjet head assembly of an array type that arrays a body, and a method of manufacturing an inkjet head manufactured using a wafer level package.

In general, an inkjet head is a structure that converts an electrical signal into a physical force so that ink is ejected in the form of droplets through a small nozzle.

Recently, piezoelectric inkjet heads are also used in industrial inkjet printers. For example, by spraying ink made by melting metals such as gold and silver on a printed circuit board (PCB) to form a circuit pattern directly, or manufacturing industrial graphics, liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), Used for solar cells and the like.

In general, an inlet and outlet for inflow and outflow of ink from a cartridge, a reservoir for storing inflowing ink, and a chamber for transmitting the driving force of the actuator to move the ink in the reservoir to the nozzle are formed in the head of the inkjet printer. .

However, the inkjet head of a conventional inkjet printer has a disadvantage in that a plurality of nozzles are formed in one inkjet head at the time of manufacture, so that even if only one nozzle fails, the head cannot be used. Required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object thereof is to manufacture a wafer level package, an array type inkjet head assembly, and an inkjet head, which simultaneously produce a plurality of inkjet heads and produce inkjet heads having excellent mass productivity. To provide a way.

A wafer level package for an inkjet head according to the present invention comprises: a flow path wafer having a plurality of ink chambers in which ink is stored; And a nozzle wafer bonded to the flow path wafer and having a nozzle connected to the ink chamber to discharge the ink to the outside, wherein the flow path wafer and the nozzle wafer are bonded to each other. It may be characterized in that the cutting to the body unit.

In addition, the wafer level package for an inkjet head according to the present invention may further include a piezoelectric actuator formed on the surface of the flow path wafer so as to correspond to the ink chamber, respectively.

In addition, the flow path wafer and the nozzle wafer of the wafer level package for an ink jet head according to the present invention may be formed in a circular shape.

In addition, the flow path wafer and the nozzle wafer of the wafer level package for an inkjet head according to the present invention may be formed in a rectangular shape.

The wafer level package for an inkjet head according to the present invention may further include an intermediate wafer disposed between the flow path wafer and the nozzle wafer, the intermediate wafer including a damper for connecting the ink chamber and the nozzle. Can be.

In addition, an array type inkjet head assembly according to the present invention includes a head body formed by cutting a wafer level package formed by adhering a flow path wafer and a nozzle wafer to include one ink chamber and one nozzle; And a frame having a plurality of the head bodies arranged thereon.

In addition, the plurality of the head body of the array type inkjet head assembly according to the present invention may be characterized in that arranged in parallel.

In addition, the plurality of head bodies of the array type inkjet head assembly according to the present invention may be arranged side by side in two rows.

In addition, the plurality of head bodies of the array type inkjet head assembly according to the present invention may be arranged in two rows, and may be formed such that each head body is positioned diagonally to each other.

In addition, the inkjet head manufacturing method according to the present invention provides a nozzle wafer having a flow path wafer having a plurality of ink chambers for storing the ink, and a nozzle connected to the ink chamber for ejecting the ink to the outside step; Bonding the flow path wafer and the nozzle wafer to each other; And cutting the flow path wafer and the nozzle wafer bonded to each other by a head body unit in which one nozzle is formed.

In addition, the step of cutting in the head body unit of the inkjet head manufacturing method according to the present invention may be characterized in that it comprises cutting by dicing (dicing).

In addition, a groove corresponding to the ink chamber is formed in the flow path wafer of the inkjet head manufacturing method according to the present invention by an etching process, and a groove corresponding to the nozzle is formed in the nozzle wafer in an etching process. Can be.

In addition, the method of manufacturing an inkjet head according to the present invention may be characterized in that an intermediate wafer including a damper for connecting the ink chamber and the nozzle is disposed between the flow path wafer and the nozzle wafer.

The wafer level package for the inkjet head, the array type inkjet head assembly, and the inkjet head manufacturing method according to the present invention are manufactured in a unit of a head body including one chamber and one nozzle, so that even if one nozzle is defective, defects may occur. The productivity is improved by only discarding the generated head body.

In addition, the wafer level package for an inkjet head, the array type inkjet head assembly, and the manufacturing method of the inkjet head according to the present invention can cope with a variety of arrays of a head body including one chamber and one nozzle to meet the needs of users. It is easier to do.

A wafer level package for an inkjet head, an array type inkjet head assembly, and a method of manufacturing an inkjet head according to the present invention will be described in more detail with reference to FIGS. 1 to 10. Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention.

However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may deteriorate other inventions or the present invention by adding, modifying, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be readily proposed, but they will also be included within the scope of the inventive concept.

1 is a schematic perspective view illustrating a wafer level package for an inkjet head in an embodiment of the present invention, FIG. 2 is an exploded perspective view for explaining a method of manufacturing a wafer level package for an inkjet head in FIG. 1, and FIG. 3. Is a cross-sectional view for explaining an inkjet head individual to the wafer level package for the inkjet head of FIG.

1 to 3, the wafer level package 100 for an inkjet head may include a flow path wafer 110, an intermediate wafer 120, and a nozzle wafer 130.

Since the wafer level package 100 for the inkjet head is formed of a circular plate, the wafer level package 100 may be designed to be a single head body 101 by dicing in the same manner as cutting a semiconductor chip.

In addition, a plurality of head bodies 101 may be formed in the wafer level package 100, which may be used separately. Specifically, the head bodies 101 may be individually except for a dummy part which is not necessary. A plurality of cutting lines 103 that can be cut are formed in a horizontal direction and a vertical direction.

As shown in FIG. 2, the wafer level package 100 is manufactured by bonding the flow path wafer 110, the intermediate wafer 120, and the nozzle wafer 130, respectively, into one package unit.

The flow path wafer 110 is formed to include a plurality of ink chambers 10 for storing ink, and the ink chambers 10 are provided in a number corresponding to the head body 101, respectively.

In this case, the flow path wafer 110 is formed in a circular shape, similar to the shape of the wafer level package 100, and a plurality of cutting lines for cutting the head body 101, which is an individual cut, may be provided on the surface thereof.

This circular shape is preferably formed in the same shape not only in the flow path wafer 110 but also in the intermediate wafer 120 and the nozzle wafer 130. However, the shapes of the flow path wafer 110, the intermediate wafer 120, and the nozzle wafer 130 are not limited to these shapes.

In addition, an ink inlet 20 for injecting ink into each head body 101 may be separately manufactured in the flow path wafer 110.

In addition, the intermediate wafer 120 is bonded so as to overlap one surface of the flow path wafer 110, and a manifold for moving ink to the damper 50 and the ink chamber 10 connected to each ink chamber 10. 30 can be formed.

However, although the intermediate wafer 120 is shown in the present embodiment, it may be omitted according to the intention of the designer, so that the flow path wafer, the intermediate wafer, and the nozzle wafer are composed of one body, and the respective components are formed in the body. Various designs, such as being provided, are also possible.

The nozzle wafer 130 is bonded to overlap the bottom surface of the intermediate wafer 120, and a wafer level package 100 is manufactured in which a plurality of head bodies 101 are arranged side by side.

The nozzle wafer 130 may be connected to an ink chamber 10 formed in one head body 101 and include one nozzle 60 for discharging the ink to the outside. In addition, a plurality of such nozzles 60 are provided on the nozzle wafer 130 so as to correspond to the head bodies 101.

Therefore, when the wafer level package according to the present embodiment is cut into one head body 101 through a dicing process, one nozzle 60 is formed in one head body 101.

The following describes the manufacturing method of the ink jet head according to the present embodiment.

As shown in FIG. 2, a method of manufacturing an inkjet head includes an intermediate path including a flow path wafer 110 having a plurality of ink chambers 10 in which ink is stored, and a damper 50 connected to the ink chamber 10. Providing a nozzle wafer 130 having a wafer 120 and a nozzle connected to the ink chamber 10 to eject ink to the outside.

In addition, a plurality of ink chambers 10 are formed in the flow path wafer 110 so as to correspond to one head body 101. The ink chambers 10 are provided by grooves in which a space is formed. Through these grooves can be provided at once through the effect is that the manufacturing is simple. In addition, the intermediate wafer 120 and the nozzle wafer 130 may also be formed at one time through the etching process.

In this case, although the intermediate wafer 120 is shown in the present embodiment, such a configuration may be omitted.

And adhering the flow path wafer 110, the intermediate wafer 120, and the nozzle wafer 130 to each other. At this time, in the step of adhering, each may be adhered using a separate adhesive.

As described above, after adhering the flow path wafer 110, the intermediate wafer 120, and the nozzle wafer 130 to each other, cutting the wafer level package into a head body unit in which one nozzle is formed may be included. At this time, the step of cutting can be easily formed through the dicing process.

Therefore, the manufacturing method of the inkjet head according to the present embodiment is simply cut by using the dicing apparatus by the wafer level package 100 formed in the same shape as the semiconductor shape, so that the existing equipment is not manufactured without manufacturing separate design equipment. There is an economic advantage to using.

Referring to FIG. 3, the head body 110 cut into one discharges ink to the outside by driving the piezoelectric actuator 4. In this case, the head body 110 may include a flow path plate 112, an intermediate plate 114, and a nozzle plate 116.

In this case, the flow path plate 1 is a part cut from the flow path wafer 110, the middle plate 2 is an intermediate wafer, and the nozzle plate 3 is a part cut from the nozzle wafer 130.

A plurality of ink chambers 10 are formed in the flow path plate 1, and an ink inlet 20 for introducing ink is provided. In this case, the ink inlet 20 is provided to be directly connected to the manifold 30, and the manifold 30 serves to supply ink to the ink chamber 10 through the restrictor 40.

The ink chamber 10 is provided below the position at which the piezoelectric actuator 4 is mounted. At this time, the portion forming the ceiling of the ink chamber 10 of the flow path plate 1 serves as a diaphragm.

Therefore, when a driving signal is applied to the piezoelectric actuator 4 for ejecting ink, the volume of the ink chamber 10 is reduced while the diaphragm below the piezoelectric actuator 4 is deformed.

As a result, the ink I in the ink chamber 10 may be discharged to the outside through the damper 50 and the nozzle 60 to be printed on paper or the like by the increase in the pressure in the ink chamber 10.

In addition, the intermediate plate 2 may include a manifold 30 extending in the longitudinal direction and a damper 50 connecting the nozzle 60 and the ink chamber 10.

The manifold 30 receives ink from the ink inlet 20 and supplies ink to the ink chamber 10. The manifold 30 and the ink chamber 10 are connected by the restrictor 40. .

In this case, the manifold 30 may be formed in one large space and connected to the plurality of ink chambers 10, but is not limited thereto. A plurality of manifolds 30 may be formed to correspond to the respective ink chambers 10.

The damper 50 receives ink discharged by the piezoelectric actuator 4 from the ink chamber 10 and discharges the ink to the outside through the nozzle 60.

In this case, the damper 50 may optionally be deleted, and in this case, the inkjet head may be configured by only the flow path plate 1 and the nozzle plate 3.

The nozzle plate 3 is formed to correspond to each ink chamber 10, and ink passing through the damper 50 is discharged to the outside through the nozzle 60. And the nozzle plate 3 is adhere | attached to the lower part of the intermediate plate 2.

The nozzle 60 causes the ink moving through the flow path formed in the inkjet head to be ejected into the droplets.

At this time, the flow path plate 1, the intermediate plate 2 and the nozzle plate 3 may be a silicon substrate widely used in semiconductor integrated circuits.

In addition, the piezoelectric actuator 4 may be formed with an electrode electrically connected to the upper and lower surfaces, and may be made of PZT (Lead Zirconate Titanate) ceramic material.

Therefore, the wafer level package for the inkjet head according to the present embodiment is manufactured in units of the head body 101 including one ink chamber 10 and one nozzle through a dicing process, so that one nozzle 60 is defective. Even if this occurs, only one head body 101 in which a defect is generated is disposed, and thus productivity is improved.

4 is an exploded perspective view illustrating a wafer level package for an inkjet head according to another embodiment of the present invention.

Referring to FIG. 4, the wafer level package 200 includes a flow path wafer 210, an intermediate wafer 220, and a nozzle wafer 230.

In this case, the flow path wafer 210, the intermediate wafer 220, and the nozzle wafer 230 may be formed in a quadrangular shape, and the wafers may be sequentially bonded to each other to form a wafer level package.

Therefore, the wafer level package formed in the rectangular shape corresponds to the head body formed in the rectangular shape, thereby reducing the dummy portion.

5 to 10 are front views illustrating various embodiments for explaining an array type inkjet head assembly of the present invention.

5 to 10, the array type inkjet head assembly may include a head body 101 and a frame 105.

Here, the head body 101 may be formed by cutting a wafer level package formed by adhering the above-mentioned flow path wafer and nozzle wafer to include one ink chamber and one nozzle.

In addition, the frame 105 is a plurality of head body 101 is arranged on top, this arrangement may be set in various ways according to the intention of the designer. The frame 105 may be a cartridge for providing ink to the head body 101, but is not limited thereto and may be a separate body for fixing the inkjet head.

As shown in FIG. 5, the plurality of head bodies 101 are arranged in two rows and are arranged in a horizontal direction in close contact with each other. In this case, the head body 101 may be individually cut through a dicing process in a wafer level package and arranged as shown in FIG. 5.

In addition, as shown in Figure 6, the head body 101 may be characterized in that arranged side by side in a line.

Therefore, the array type inkjet head assembly according to the present embodiment arranges the head bodies 101 formed individually in close contact with each other, thereby preventing crosstalk, which may occur when a plurality of nozzles are formed in one body. Can be.

Here, the crosstalk phenomenon refers to a phenomenon in which vibration generated in the vibrator adversely affects the surrounding chamber.

However, it is not limited to cutting each head body 101 separately as described above, and it is also possible to cut and use a plurality of head bodies 101 to be a single row.

In addition, as shown in FIG. 7, the plurality of head bodies 101 may be arranged in two rows, and the head bodies 101 may be formed to be in diagonal directions with each other. And, as shown in Figure 8, each head body 101 may be disposed spaced apart from each other by a predetermined interval.

As shown in FIGS. 7 and 8, since the head bodies 101 are spaced apart from each other without contact with each other, crosstalk may be completely prevented. Therefore, the array type inkjet head assembly according to the present embodiment is more preferably used in a field requiring sophisticated printing operation.

However, the present invention is not limited to this structure and may be manufactured in a structure in which one frame 105 is formed in one head body 101 according to a designer's intention.

In addition, referring to FIG. 9, the head body 101 and the adjacent head body 101 are cut to be in contact with each other, and the two head bodies 101 thus contacted are arranged side by side in two rows, and the diagonal direction of each other is arranged. Arrange to be located at.

At this time, the head body 101 is more preferably arranged to cut in two units.

In addition, as shown in Figure 10, each head body may be arranged to be inclined around the center line (C) of the frame, each head body 101 may be arranged to be positioned in a diagonal direction with each other.

However, the array type inkjet head assembly according to the present embodiment is not limited thereto and may be designed in various structures according to the intention of the designer.

Therefore, the array type inkjet head assembly by this structure can design the number of nozzles as desired by the designer, and since the arrangement can also be set freely, the freedom of design is higher.

1 is a schematic perspective view illustrating a wafer level package for an inkjet head in an embodiment of the present invention.

FIG. 2 is an exploded perspective view for explaining the assembly of the wafer level package for the inkjet head of FIG. 1.

FIG. 3 is a cross-sectional view illustrating an inkjet head individual in the wafer level package for the inkjet head of FIG. 1.

4 is an exploded perspective view illustrating a wafer level package for an inkjet head according to another embodiment of the present invention.

5 to 10 are front views illustrating various embodiments for explaining an array type inkjet head assembly of the present invention.

Explanation of symbols on the main parts of the drawings

100 .... Wafer Level Package 101 .... Head Body

110 .... Euro Wafer 120 .... Intermediate Wafer

130 .... Nozzle Wafer

Claims (13)

A flow path wafer having a plurality of ink chambers in which ink is stored; And And a nozzle wafer adhered to the flow path wafer, the nozzle wafer being connected to the ink chamber and having a nozzle for discharging the ink to the outside. The flow path wafer and the nozzle wafer bonded to each other, the wafer level package for an ink jet head, characterized in that the cutting to the head body unit having one nozzle. The method of claim 1, And a piezoelectric actuator formed on a surface of the flow path wafer so as to correspond to the ink chamber, respectively. The method of claim 1, The flow path wafer and the nozzle wafer is a wafer level package for an ink jet head, characterized in that formed in a circular shape. The method of claim 1, The flow path wafer and the nozzle wafer is a wafer level package for an ink jet head, characterized in that formed in the shape of a rectangle. The method of claim 1, And an intermediate wafer disposed between the flow path wafer and the nozzle wafer, the intermediate wafer having a damper for connecting the ink chamber and the nozzle. A head body in which a wafer level package formed by adhering the flow path wafer and the nozzle wafer is cut and formed to have one ink chamber and one nozzle; And A frame having a plurality of the head bodies arranged thereon; Array type inkjet head assembly comprising a. The method of claim 6, And a plurality of the head bodies are arranged side by side in an array. The method of claim 6, And a plurality of the head bodies are arranged side by side in two rows. The method of claim 6, The plurality of the head body is arranged in two rows, the array type inkjet head assembly, characterized in that each head body is formed so as to be in a diagonal direction to each other. Providing a nozzle wafer having a flow path wafer having a plurality of ink chambers in which ink is stored, and a nozzle connected to the ink chamber for discharging the ink to the outside; Bonding the flow path wafer and the nozzle wafer to each other; And Cutting the flow path wafer and the nozzle wafer bonded to each other by a head body unit in which one nozzle is formed; Method of manufacturing an inkjet head comprising a. The method of claim 10, The cutting of the head body unit may include cutting by dicing (dicing). The method of claim 10, The grooves corresponding to the ink chambers are formed in the flow path wafer by an etching process, and the grooves corresponding to the nozzles are formed in the nozzle wafer by an etching process. The method of claim 10, An intermediate wafer including a damper for connecting the ink chamber and the nozzle is disposed between the flow path wafer and the nozzle wafer.

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