KR20100121973A - Cooling device of light emitting diode and image projection apparatus having the same - Google Patents

Abstract

PURPOSE: An LED cooling device and an image projecting device having the same are provided to realize the short transferring path to the heat transferring module having a plurality of paths inside, thereby realizing effective cooling. CONSTITUTION: A heat transferring module receives heat from LED(Light Emitting Diode) modules(120). A heat sink(170) is mounted to a heat transferring module to emit the heat and comprises a connecting hole. The heat transferring module comprises a body, a plurality of conduit lines formed inside the body, volatile fluid which is built in conduit lines and evaporates with the heat and a penetration hole(163) which is formed in the location corresponding to the connecting hole. The connecting hole passes through the body in order to cross at least one part among conduit lines.

Description

Light emitting diode cooling device and image projection device having same {COOLING DEVICE OF LIGHT EMITTING DIODE AND IMAGE PROJECTION APPARATUS HAVING THE SAME}

The present invention relates to a light emitting diode cooling device that emits heat from a plurality of light emitting diode (LED) modules to maintain a temperature of a light emitting diode below a specific value, and an image projection device having the same.

As the information age evolves rapidly, the importance of display devices for implementing large screens is being emphasized. An example of a device for implementing such a large screen is an image projection apparatus having a function of magnifying and projecting an image.

An image projection device refers to a device that implements an image by using light generated from a light source and projects the implemented image, and examples thereof include a projector and a projection television.

Recently, as the portable function of the image projection apparatus is important, various new attempts have been applied in terms of hardware or software. As an example, there is an attempt to miniaturize an image projection value using light emitting diodes generating light of different colors as a light source.

Light emitting diodes exhibit temperature-sensitive behavior, and therefore, a method of cooling the light emitting diode more efficiently may be considered.

An object of the present invention is to provide a light emitting diode cooling device for cooling the light emitting diode by a method different from the conventional method and an image projection having the same.

Another object of the present invention is to provide a light emitting diode cooling apparatus for maintaining isothermal temperature of different light emitting diodes more efficiently and an image projection having the same.

A light emitting diode cooling device according to an embodiment of the present invention for realizing the above object includes a heat transfer module and a heat sink. The heat transfer module receives heat from the plurality of light emitting diode modules, and the heat sink module is mounted to the heat transfer module to discharge the heat and includes at least one fastening hole. The heat transfer module includes a body, a plurality of conduits, volatile fluids and fastening holes. The body is plate-shaped. The light emitting diode module is mounted on one surface of the body and the heat sink is mounted on the other surface. The conduits extend parallel to one another and extend in one direction and are formed to be sealed inside the body. Volatile fluid is embedded in the conduits to transfer heat along the plane of the body and is evaporated by the heat. A through hole penetrates the body to cross at least some of the conduits. The through hole is formed at a position corresponding to the fastening hole.

According to an aspect of the present invention, the light emitting diode modules are formed to generate light of different colors, respectively, and include a metal circuit board on which the light emitting diodes are mounted. The circuit board is mounted in surface contact with one surface of the body. The conduits are each formed to be independent and can be defined by a body.

According to another aspect of the invention, the body has first and second mounting regions orthogonal to one another. Light emitting diode modules generating light of different colors are mounted in the first and second mounting regions, respectively. The heat transfer module may include first and second bodies. First and second mounting regions may be formed in the first body. The second body may be equipped with a light emitting diode module that generates light of a different color from the light emitting diode modules mounted in the first and second mounting regions, respectively. The second body may be formed with pipelines independent of the pipelines of the first body. The second body may be disposed parallel to one of the first and second mounting regions and orthogonal to the other. The light emitting diode cooling apparatus may include a cooling fan disposed between the first and second bodies.

In addition, the present invention discloses an image projection device in order to realize the above problem. The image projector includes a plurality of light emitting diode modules, a display panel, an illumination optical unit, and a projection optical unit. The image projecting device includes the light emitting diode cooling device configured to emit heat of the light emitting diode modules. The display panel forms an image using light generated by the light emitting diode modules. The illumination optics is disposed between the light emitting diode modules and the display panel to illuminate the light on the display panel. The projection optics magnifies and projects the image.

The light emitting diode cooling apparatus and the image projecting device having the same according to the present invention configured as described above may implement a shorter heat transfer path by a heat transfer module having a plurality of conduits formed therein. This results in more efficient cooling.

In addition, according to the present invention, as the plurality of light emitting diode modules are mounted on the plate-shaped body, the plurality of light emitting diodes can be cooled to isothermal cooling. Accordingly, the present invention mitigates or prevents color shift and white balance mismatch in the image projection apparatus.

In addition, according to the present invention, since the first and second bodies are provided, the plurality of light emitting diode modules may be divided into first and second groups for cooling control.

Hereinafter, a light emitting diode cooling apparatus and an image projection apparatus including the same according to the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are assigned to the same or similar configurations in different embodiments, and the description thereof is replaced with the first description. As used herein, the singular forms "a", "an" and "the" include plural forms unless the context clearly indicates otherwise.

The image projection apparatus described herein includes not only a projector and a projection TV, but also a mobile terminal equipped with a projector function, a laptop computer, a personal digital assistant (PDA), and a PMP. (Portable Multimedia Player), navigation, etc. may be included. Hereinafter, the image projection unit related to the present invention will be described based on the projector.

1 is a perspective view of the image projection apparatus 100 according to the present invention viewed from the front.

Since the components shown in FIG. 1 are not essential, the image projection apparatus 100 may have more components or fewer components.

The external appearance of the image projection apparatus 100 is formed by the upper and lower cases 111 and 112. Various optical parts and electronic parts are embedded in the space formed by the upper and lower cases 111 and 112. At least one intermediate case may be further disposed between the upper and lower cases 111 and 112.

The operation unit 113 may be disposed on the upper case 111. The operation unit 113 may be employed in any manner as long as the user is tactile manner to operate while having a tactile feeling.

The operation unit 113 receives a command for controlling the operation of the image projection apparatus 100. In functional terms, the operation unit 113 may be used to input menus such as start, end, and the like.

In addition, the operation unit 113 may be manipulated to zoom in or zoom out an image projected by the image projection apparatus 100. The operation unit 113 may be operated to focus the image projected by the image projection apparatus 100.

The projection optical unit 114, the first air flow unit 115a, and the like may be disposed in the lower case 112.

The projection optical unit 114 is formed to enlarge an image projected by the image projection apparatus 100. The projection optical unit 114 may be formed of, for example, a lens group in which respective magnification projection lenses are arranged at predetermined intervals. The projection optical unit 114 may be formed such that the distance between the lenses for magnification projection is adjusted by the manipulation of the manipulation unit 113. Through this, the zoom or focusing function of the image projection apparatus 100 may be implemented.

The first air flow unit 115a is formed of a plurality of through holes to allow air to flow into the image projection apparatus 100. Through this, cooling of the image projection apparatus 100 using forced convection is possible.

2 is a perspective view of the image projection apparatus 100 of FIG.

The lower case 112 may include a second air flow unit 115b, an interface 116, a power supply unit 117, and the like.

The second air flow unit 115b is formed of a plurality of through holes like the first air flow unit 116a (see FIG. 1) to allow air to flow into the image projection apparatus 100.

The interface 116 may be a path through which the image projection apparatus 100 may exchange data with an external device. Image data corresponding to an image to be projected by the image projection apparatus 100 through the interface 116 may be input from the outside. Referring to this figure, the interface 116 includes a connection terminal that can be electrically connected to an electronic device capable of supplying video or audio data, for example, a computer, a DVD player, or the like.

The power supply unit 117 is mounted on the lower case 112 for supplying power to the image projection apparatus 100. The power supply unit 117 may be configured to receive, for example, AC power to be converted into DC power. However, the configuration of the power supply unit 117 is not limited to this, and may be detachably coupled for charging as a rechargeable battery.

One of the upper and lower cases 111 and 112 may include a sound output unit in the form of a speaker, and an antenna for receiving a broadcast signal may be additionally disposed.

3 is an exploded view of the image projection apparatus 100 of FIG. 1, FIG. 4 is a plan view of the LED cooling apparatus of FIG. 3, and FIGS. 5A and 5B are lines VA-Va and VB-Vb of FIG. 4, respectively. Are cross-sectional views taken along

The image projector 100 includes a plurality of light emitting diode (LED) modules 120, a display panel 130, and an illumination optical unit 140.

The light emitting diode modules 120 may be formed by mounting the light emitting diodes 122 on the circuit board 121. The circuit board 121 is formed of a metal material and may be a control device for driving the light emitting diode 122.

The plurality of light emitting diode (LED) modules 120 may be formed to generate one of three primary colors of light, respectively. The light emitting diode modules 120 may include, for example, three light emitting diode modules 123a, 123b, and 123c, respectively, generating blue, green, and red light. , Green and red light emitting diode modules. The blue, green and red light emitting diode modules 123a, 123b, and 123c face each other, and the other 123b faces between the light emitting diode modules 123a and 123c facing each other. Can be arranged to view.

In the drawings and the following description, the light emitting diode modules 120 are each provided with one light emitting diode, but the present invention is not limited thereto. For example, the blue, green, and red light emitting diode modules 123a, 123b, and 123c each have a plurality of red, blue, and green light emitting diodes arranged such that the blue, green, and red light emitting diodes have light emitting surfaces facing a common direction. It may comprise an array.

The display panel 130 forms an image using light generated by the light emitting diode modules 120. The display panel 130 may be arranged to reflect the implemented image to the projection optical unit 114.

The display panel 130 may be a digitally controlled electronic device. The electronic device may include a plurality of micro mirrors, each of which can be driven. The plurality of micro mirrors independently reflects composite light corresponding to the image to be implemented. The electronic device may be, for example, a digital micromirror device (DMD) in which a micromirror in which the inclination angle is changed to an ON state and an OFF state is arranged in a lattice on a plane. In addition, the electronic device may be a liquid crystal on silicon (LCOS) panel capable of realizing an image by reflecting synthetic light among liquid crystal display devices.

The illumination optical unit 140 is disposed between the light emitting diode modules 120 and the display panel 130 to illuminate the light generated by the light emitting diode modules 120 to the display panel 130. For example, the illumination optical unit 140 may be configured of a series of lenses constituting an optical system, and may be formed to synthesize and collect light of three primary colors generated by the three light emitting diode modules 123a, 123b, and 123c.

The cooling fan 180 may be mounted on the lower case 112 to assist the plurality of light emitting diode (LED) modules 120, the display panel 130, and the illumination optical unit 140. The cooling fan 180 is configured to generate forced convection to cool the light emitting diode (LED) modules 120, the display panel 130, the illumination optical unit 140, and the like.

The image projection apparatus 100 includes a light emitting diode cooling device 150 formed to emit heat of the light emitting diode modules 120.

Referring to the drawings, the light emitting diode cooling device 150 includes a heat transfer module 160 and a heat sink (170, heatsink).

The heat transfer module 160 is formed to receive heat from the plurality of light emitting diode modules 120, and the heat sink 170 emits heat received by the heat transfer module 160 from the plurality of light emitting diode modules 120. It is mounted to the heat transfer module 160 to.

The heat sink 170 may be formed of, for example, a material having high thermal conductivity such as aluminum and copper. The heat sink 170 may include a base 171 and a heat dissipation fin 172.

The base 171 may be formed in a plate shape to be in surface contact with the heat transfer module 160, and the heat dissipation fins 172 may be formed in plural to be spaced apart from each other. The separation space may be a flow path through which a fluid flows. Form.

A medium may be disposed between the base 171 and the heat transfer module 160 to reduce contact thermal resistance. The medium may be, for example, a thermal pad, a thermal grease, or the like.

The base 171 is provided with a fastening hole 173 for mounting on the heat transfer module 160. The fastening hole 173 may be a hole corresponding to the diameter of the screw or pin, for screw coupling or pin coupling.

The heat transfer module 160 includes a body 161, a plurality of conduits 162, a volatile fluid and a through hole 163.

The body 161 is formed in a plate shape, the light emitting diode modules 120 are mounted on one surface thereof, and the heat sink 170 is mounted on the other surface thereof. The body 161 may be formed of, for example, a material such as aluminum. Referring to the drawings, the circuit board 121 of the light emitting diode modules 120 may be mounted in surface contact with one surface of the body 161.

The body 161 may include first and second mounting regions 161a and 161b orthogonal to each other. The first and second mounting regions 161a and 161b can be simply formed by, for example, bending the body 161 of the flat plate through sheet metal or the like. Light emitting diode modules 123a and 123b for generating light of different colors may be mounted in the first and second mounting regions 161a and 161b, respectively. For example, blue and green light emitting diode modules 123a and 123b are thermally connected by the body 161.

A plurality of conduits 162 are formed in the body 161. The body 161 is a very thin plate and the conduits 162 can be microchannels having a diameter in microns. The conduits 162 are formed to extend in one direction and are parallel to each other.

Conduits 162 contain a volatile fluid to transfer the heat along the plane of the body 161. The conduits 162 are sealed with the volatile fluid embedded therein. The volatile fluid can be acetone, for example. Acetone condenses after transferring heat inside conduits 162 through evaporation. Through this, the body 161 is to maintain isothermal.

Referring to this figure, the conduits 162 serving as heat transfer paths may be formed to be independent of each other, and are defined by the body 161. As the conduits 162 are defined by the body 161, a shorter heat transfer path leading to the circuit board 121, the body 161 and the volatile fluid of the light emitting diode modules 120 is realized. This results in more efficient cooling.

Since the brightness of light varies according to the temperature of the light emitting diodes, color shifts may occur when the temperatures of the light emitting diodes generating light of different colors are different, and color balance may be inconsistent. Since the body 161 maintains isothermal temperature by the plurality of conduits 162, the light emitting diode also maintains isothermal temperature. Through this, color shift and white balance mismatch of the image projection apparatus 100 may be alleviated or prevented.

In addition, even if some of the conduits 162 end of life, the rest of the conduits 162 may serve as a heat transfer path, thereby improving the operation reliability of the heat transfer module 160.

The heat transfer module 160 has a through hole 163 penetrating the body 161.

The through hole 163 is formed to cross at least some of the conduits 162 and is formed at a position corresponding to the fastening hole 173 of the heat sink 170. The body 161 and the heat sink 170 may be coupled using the through hole 163. For example, a screw or a pin may be inserted into the through hole 163 and the fastening hole 173 for the coupling. However, the present invention is not limited thereto, and a separate structure designed for coupling may be inserted into the through hole 163 and the fastening hole 173.

Even if the through hole 163 is provided, most of the conduits 162 independent of each other may be kept sealed, and thus the body 161 may maintain isothermal temperature. Through this, the mounting structure in which the heat sink 170 is mounted on the body 161 may be simpler and slimmer.

6A and 6B are perspective views illustrating other embodiments of the light emitting diode cooling apparatus of FIG. 3.

Referring to FIG. 6A, blue, green, and red light emitting diode modules 223a, 223b, and 223c are thermally connected by one body 261. The body 2636 may be formed in a shape of “c” so that all of the blue, green, and red light emitting diode modules 223a, 223b, and 223c are mounted in. The blue, green, and red light emitting diode modules 223a, 223b and 223c can be cooled controlled at a time.

Referring to this figure, one cooling fan 280 may be disposed to face the heat sink 270c connected to any one of the blue, green, and red light emitting diode modules 223a, 223b, and 223c. have. One of the above may be a red light emitting diode module 223c. Through this, a cooling device for cooling the red light emitting diode module 223c having the lowest brightness at the same temperature by direct blowing and cooling the blue and green light emitting diode modules 223a and 223b by indirect blowing may be implemented. .

Referring to FIG. 6B, the heat transfer module 360 includes first and second bodies 361 and 364.

First and second mounting regions 361a and 361b that are perpendicular to each other are formed in the first body 361. For example, blue and green light emitting diode modules 323a and 323b may be mounted in the first and second mounting regions 361a and 361b, respectively.

The second body 364 includes a light emitting diode module for generating light of a different color from the light emitting diode modules mounted in the first and second mounting regions 361a and 361b, for example, a red light emitting diode module 323c. Is mounted.

In the second body 364, conduits independent of the conduits of the first body 361 are formed. To this end, the first and second bodies 361 and 364 may be separate bodies from each other. The second body 364 is disposed to be parallel to one of the first and second mounting regions 361a and 361b and orthogonal to the other. Through this, the red light emitting diode module 323c may be cooled and controlled independently of the blue and green light emitting diode modules 323a and 323b.

The cooling fan 380 may be disposed between the first and second bodies 361 and 364. Referring to FIG. 6B, the fluid is divided into the first and second bodies 361 and 364 by the position of the cooling fan 380. The flow rate of the fluid cooling the first and second bodies 361 and 364 may be adjusted by one cooling fan 380. Through this, the blue and green light emitting diode modules 323a and 323b are maintained at an isothermal temperature, and the red light emitting diode module 323c has a cooling device that maintains a lower temperature than the blue and green light emitting diode modules 323a and 323b. Is implemented.

The light emitting diode cooling apparatus described above can be applied not only to an image projection apparatus but also to an electronic device using a light emitting diode, for example, a light emitting diode display board, a light emitting diode television, and the like.

The light emitting diode cooling apparatus and the image projection device including the same are not limited to the configuration and method of the above-described embodiments, but the embodiments may be selectively changed in whole or in part to various modifications. It may be configured in combination.

1 is a perspective view of the image projection device according to the present invention from the front.

Figure 2 is a perspective view of the image projection of Figure 1 from the back.

3 is an exploded view of the image projection apparatus of FIG.

4 is a plan view of the LED cooling apparatus of FIG.

5A and 5B are cross-sectional views taken along the lines Va-Va and Vb-Vb of FIG. 4, respectively.

6A and 6B are perspective views illustrating other embodiments of the light emitting diode cooling apparatus of FIG. 3.

Claims (8)

A heat transfer module receiving heat from the plurality of light emitting diode (LED) modules; And A heat sink mounted to the heat transfer module to release the heat and having at least one fastening hole; The heat transfer module, A body made of a plate shape, the light emitting diode modules mounted on one surface thereof, and the heat sink mounted on the other surface thereof; A plurality of conduits which are parallel to each other and extend in one direction and are sealed to the inside of the body; A volatile fluid embedded in the conduits to transfer the heat along the plane of the body and evaporated by the heat; And And a through-hole penetrating the body to cross at least a portion of the conduits and formed at a position corresponding to the fastening hole. The method of claim 1, The light emitting diode modules are formed to generate light of different colors, respectively, and include a metal circuit board on which the light emitting diodes are mounted. The circuit board is mounted on the surface of the light emitting diode cooling device, characterized in that the surface contact. The method of claim 1, The body has a first and a second mounting area orthogonal to each other, The light emitting diode cooling apparatus of claim 1, wherein the light emitting diode modules generating light of different colors are mounted in the first and second mounting regions, respectively. The method of claim 3, The heat transfer module, A first body in which the first and second mounting regions are formed; And A light emitting diode module configured to generate light of a different color from the light emitting diode modules mounted in the first and second mounting regions, respectively, and including a second body in which conduits independent of the conduits of the first body are formed; LED cooling device. The method of claim 4, wherein And the second body is disposed parallel to one of the first and second mounting regions and orthogonal to the other. The method of claim 4, wherein LED cooling device further comprises a cooling fan disposed between the first and the second body. The method of claim 1, The conduits are formed to be independent of each other, characterized in that defined by the body of the light emitting diode cooling device. A plurality of light emitting diode modules; A light emitting diode cooling device configured to emit heat of the light emitting diode modules and according to any one of claims 1 to 7; A display panel which forms an image using light generated by the light emitting diode modules; An illumination optical unit disposed between the light emitting diode modules and the display panel to illuminate the light on the display panel; And And an projection optical unit to enlarge and project the image.

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