KR20100119334A - A uhf radio frequency identification tag for metal and method for producing rfid tag - Google Patents

Abstract

PURPOSE: A radio frequency identification tag for metal and a method for producing a radio frequency identification tag are provided to bond an RFID label tag with a dielectric layer and a ground surface, thereby simplifying a manufacture process and reducing production costs. CONSTITUTION: A label tag(104) includes a front patch, a power supply unit for supplying power to the front patch, and a loop for connecting the front patch with the power supply unit. The power supply unit includes an IC chip. A dielectric layer(106) is located in the lower part of the label tag and includes permittivity. A ground surface(105) is located in the lower part of the dielectric layer and functions as a grounding function. An adhesive(107) adheres the label tag with the dielectric layer, and the dielectric layer with the ground surface.

Description

RF ID tag for metal and production method {A UHF RADIO FREQUENCY IDENTIFICATION TAG FOR METAL AND METHOD FOR PRODUCING RFID TAG}

The present invention relates to an RFID tag for metal and a production method, and more particularly, after forming an antenna pattern on a dielectric film and inputting information on an article to which a label tag is attached through an RFID printer, The present invention relates to an RFID tag for metal that can be used in metal and the like, by producing a label tag by displaying a label on which information is printed, and bonding a dielectric layer and a ground plane thereto.

RFID is a system for exchanging information by using radio waves from a tag attached to an object or providing a service such as tracking, managing, or recording an item. The RFID includes a tag, a reader, a middleware, and an application service platform. Among the components of the RFID system, the tag of the RFID UHF band is composed of an IC chip having unique information of each object and an antenna transmitting unique information to a reader. Among the tags of the UHF band, the passive RFID tag receives microwave electromagnetic signals transmitted from the reader, converts them into power required for driving the chip, and modulates information stored in the tag chip to perform backscattering. The reader again receives and demodulates this signal to extract the unique information of the tag.

In the case of the passive tag of the UHF band, since the data transmission speed is fast, has a relatively long recognition distance, and can be used at a relatively low price, it is used in many RFID systems, and at present, many low-cost label tags are used. . These label tags are made by forming an antenna pattern with a thickness of 9 to 10um on a 50um thin PET film, and are used in many RFID systems because the process is simple when production or tag information is input.

However, these thin labels have a high dielectric constant (such as water bottles) or conductive (metallic materials such as canned foods) when attached to an article to prevent the voltage required to drive the chip due to electromagnetic boundary conditions. There was a problem that does not work properly. Therefore, a tag attached to a metal article is developed and used as a tag in a package form different from that of the label since there is a limit to the attachable article of a label tag currently used. The most common among them is the PIFA type antenna on the PCB board. The PIFA-type antenna has a short-circuit on a portion of the patch that is radiated, allowing the current to flow, reducing the overall size of the tag and operating on metal surfaces. However, in the case of PIFA type tags of such PCB boards, the frequency bandwidth is narrow, which limits the environment in actual application, and has the disadvantages of complexity of production process and high manufacturing cost. In addition, there is a drawback in that it takes a considerable amount of time because the information must be input to the tag separately in relation to the input process.

On the other hand, it can be used at regular intervals between the tag and the metal surface in a way to avoid the influence of water or metal on the label tag. In this case, in order for the tag to operate normally, the space must be separated by a distance of λ / 4 of the use frequency. In the case of tags in the UHF band (860 MHz to 960 MHz), an interval of about 8 cm should be spaced to reduce performance deterioration due to metal. However, such a gap may not only make the overall tag size large but also have a thick thickness, and thus may be easily removed when the tag is attached to an actual article, and it may be easily recognized that the tag is attached to the article, which may be artificially damaged.

The present invention has been made to overcome the problems described above, by producing an RFID label tag, and by adhering it with a dielectric layer and a ground plane to produce a metal RFID tag, to simplify the tag manufacturing process, reduce production costs An object of the present invention is to provide an RFID tag for metal and a method of producing the same.

In addition, when the label tag is attached to the dielectric layer and the ground plane required to operate as a metal tag, the label tag facilitates the impedance adjustment of the label tag according to the dielectric constant of the dielectric and operates in various dielectrics. It is another object of the present invention to provide an RFID tag for a metal that can be easily resonated and a method of producing the same.

Further, another object of the present invention is to provide an RFID tag for metal and a method of producing the same, which can be used for various articles by attaching to a non-conductive object such as plastic and wood using only a label tag when necessary.

In addition, in the present invention, since the process of inputting the unique information of the article on the chip included in the label tag and the process of displaying the label on which the tag information is printed are all performed in one process, time and cost in the production process can be reduced. Another object is to provide an RFID tag for a metal and a method of producing the same.

The present invention has been made to overcome the problems described above, according to an aspect of the present invention, a front patch, a feeder for supplying power to the front patch and a loop connecting the front patch and the feeder A configured label tag, wherein the feeder includes an IC chip, a dielectric layer having a dielectric constant below the label tag, a ground plane positioned below the dielectric layer and serving as a ground, and the label tag and the dielectric layer It can provide a metal RFID tag comprising an adhesive for bonding between and between the dielectric layer and the ground plane.

Here, the label tag may be configured to be formed on the dielectric film surface.

The label tag receives an RF signal from an external reader, drives an IC chip included in the power supply unit by the received RF signal, and modulates the received RF signal and information included in the IC chip. In addition, the modulated RF signal may be configured to be transmitted to an external reader through the front patch.

In addition, the label tag, by adjusting the length of the long side and the short side of the front patch or the horizontal and vertical radius of the loop, the impedance of the IC chip and the label tag included in the feed section It can be configured to match its impedance.

In addition, the loop may be formed in a C-shape to be coupled to the short side of the front patch.

The feeder may be configured to exist on the loop.

According to another aspect of the invention, in the method for producing a RFID tag for metal, the first step of producing the label tag in the form of a roll using the dielectric film, the information on the label tag produced by the first step And a third step of displaying a label on which the information of the input tag is printed at the same time as inputting the label, and bonding the label tag produced by the second step to the dielectric layer, the dielectric layer, and the ground plane. A method of producing RFID tags for metals can be provided.

Herein, the first step may include forming a pattern of the label tag on a dielectric film surface to produce a label tag, and attaching an IC chip to a feeding part of the generated label tag. It can be configured to include steps.

According to the present invention, by producing an RFID label tag, and by adhering it with a dielectric layer and a ground plane to produce a metal RFID tag, the RFID tag for metal and its production method that can simplify the tag production process, and reduce the production cost Can be provided.

In addition, according to the present invention, when a label tag is attached to a dielectric layer and a ground plane required to operate as a metal tag, the label tag facilitates impedance adjustment of the label tag according to the dielectric constant of the dielectric tag, and operates on various dielectrics. Provided are an RFID tag for a metal that can be easily resonated in a region, and a method of producing the same.

In addition, according to the present invention, by attaching to non-conductive objects such as plastic and wood using only label tags when necessary, it is possible to provide a metal RFID tag and a method of producing the same that can be used for various articles.

In addition, according to the present invention, the process of inputting the unique information of the article on the chip included in the label tag and the process of displaying the label with the tag information printed in one process, thereby reducing the time and cost in the production process A metal RFID tag and a production method thereof can be provided.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3 are views for explaining the overall configuration of the RFID tag for metal according to the present invention.

1 to 3, an RFID tag for a metal according to an embodiment of the present invention includes a front patch 101, a feeder 102, a loop 103, and a label tag 104 composed of them, and a ground plane ( 105, a dielectric layer 106, and an adhesive tag 107 that bonds the label tag 104 and the dielectric layer 106 and between the dielectric layer 106 and the ground plane 105.

As shown in Figs. 1 to 3, the front patch 101 is in the form of a rectangle consisting of a long side on the horizontal side and a short side on the vertical side. The front patch forms the label tag 104 together with the feeder 102 and the loop 103, and adjusts the length of the long side of the front patch 101 to adjust the impedance and resonant frequency of the label tag. I can adjust it. The operation and impedance of the label tag 104 will be described later.

The feeder 102 serves to supply power to the front patch 101. An IC chip is attached to the power supply unit 102, and the IC chip stores information on the article to which the label tag 104 or the metal RFID tag according to the present invention is attached. On the other hand, the power supply unit 102 is on the loop 103 to be described below.

The loop 103 is C-shaped and is coupled to the left side of the short side of the front patch 101 as shown in FIGS. 1 to 3. Of course, such a loop 103 may be configured to be coupled to the right side of the short side, and the loop 103 of the present invention is characterized in that it is coupled to one short side of the front patch 101.

The label tag 104 is composed of the front patch 101, the feeder 102, and the loop 103 described above, and have a rectangular shape as shown in FIGS. 1 to 3. The label tag 104 may be manufactured in the form of a roll by forming a pattern of the label tag on the surface of the dielectric film, and may be produced as a roll-shaped sticker by adding an adhesive component to the bottom of the label tag 104. The label tag 104 is a RFID label tag is completed when the information on the article to be attached and the information of the input tag to display the printed label. Since the label tag 104 itself operates as a general label tag for a non-conductive object, a problem occurs in the case of an object having a large dielectric constant or a conductive object, so that the ground plane 105 and the dielectric layer will be described later. It will be used after bonding the 106. In this case, when used as a label tag, it may have a gain of about 1/2 of the metal tag gain developed according to the attached article.

Referring to the operation principle of the label tag 104, first transmit an RF signal from an external reader, the label tag 104 operates as an antenna to receive the RF signal transmitted by the reader. The current is supplied to the IC chip attached to the power supply unit 102 by the RF signal received by the label tag 104, and the RF signal and the IC received through the logic circuit embedded in the IC chip using the supplied current. The modulation process is performed to mix the information of the items stored in the chip. The modulated signal is transmitted to an external reader through the front patch 101. The external reader receiving the modulated RF signal through such a process can verify the information by obtaining information on the article stored in the IC chip through the demodulation process and displaying the information.

The dielectric layer 106 is located under the label tag 104. The dielectric layer 106 may be any material having a dielectric constant of any kind. However, the thickness of the dielectric layer 106 is changed according to the dielectric constant of each material to be used as the dielectric layer 106, which will vary the thickness of the metal RFID tag according to the present invention. When the dielectric layer 106 is attached to a metallic material having a conductivity, the dielectric layer 106 does not acquire a voltage required for driving the chip due to the boundary condition of the electromagnetic wave, and thus may not operate properly. In order to attach and use a metal material, the dielectric layer 106 should be attached to the lower portion of the label tag 104.

The ground plane 105 is positioned below the dielectric layer 106, the label tag 104 is positioned above the dielectric layer 106, and the ground plane 105 is positioned below the dielectric layer 106, thereby providing a label tag 104. And the medium property between the ground plane 105 and the ground plane 105 are kept constant, and serves to preserve the electromagnetic energy formed between the label tag 104 and the ground plane 105. On the other hand, by adjusting the distance between the label tag 104 and the ground plane 105, the capacitive reactance value among the impedance components of the label tag 104 can be adjusted.

The adhesive 107 serves to bond between the label tag 104 and the dielectric layer 106 and between the dielectric layer 106 and the ground plane 105, and any adhesive may be used as long as the adhesive can be double-sided.

4 is a view for explaining the resonant frequency of the frequency of the metal RFID tag according to an embodiment of the present invention, Figure 5 is a view for explaining the change in frequency according to the length of the front patch of the metal RFID tag.

4 to 5, as described above, when the label tag 104 receives an RF signal from an external reader, the received RF signal supplies current to the IC chip attached to the power supply unit 102. . In this case, in order to supply the maximum current to the IC chip, the impedance of the IC chip and the impedance of the label tag 104 must be matched, which is a problem directly related to the performance of the tag. For this impedance matching, the shape and size of the loop 103 may be changed according to the impedance of the IC chip, and the length of the front patch 101 may be changed according to the permittivity of the dielectric to be attached and the frequency to be resonated. The amount of current supplied to the IC chip can be maximized.

The label tag 101 according to an exemplary embodiment of the present invention is a case where the label tag 101 is resonated at a center frequency of 910 MHz of 910-914 MHz, which is a domestic UHF frequency range, and the length of the front patch is 78 mm. The label tag 104 according to the present invention has a low resonance frequency when the length of the long side of the front patch 101 is increased, and conversely, when the length of the long side of the front patch 101 is decreased, the resonance frequency is increased. Therefore, the resonance frequency can be adjusted by adjusting the length of the long side surface of the front patch 101. In addition, the width of the short side of the front patch 101 serves to determine the gain of the label tag 104. As the width of the short side of the front patch 101 decreases, the gain decreases. As the width increases, the gain also increases. In this case, however, the resonance frequency does not change depending on the width of the short side surface of the front patch 101.

6 is a view for explaining a radiation pattern when the metal plane of the metal RFID tag is attached.

4 to 5, the maximum radiation occurs in the loop 103 close to the feeding point when the maximum current flows through the feeding part through impedance matching. Referring to Figure 6, when the metal RFID tag of the present invention is attached to a metal surface shows a radiation pattern. Referring to FIG. 8, the radiation pattern does not change even when the shape of the loop 103 changes to an ellipse, a circle, or a rectangle. In the case of the label tag 104 of the present invention, the component of the capacitive reactance decreases as the size of the elliptical loop 104 increases (when the horizontal and vertical radius increase).

7 is a view for explaining the overall procedure of the production method of the RFID tag for metal according to another embodiment of the present invention.

Method for producing a metal RFID tag according to the present invention, first, to produce a label tag 104 in the form of a roll using a dielectric film (S701). Here, the step 701 is a process of producing a pattern of the label tag 104 in the form of a roll on the surface of the dielectric film, and attaching the IC chip to the feed portion of the generated label of the label tag 104. This IC chip attaching process is performed by a chip bonding apparatus. Then, the information is input to the label tag 104 produced in step 701 using the RFID printer, and at the same time, the label on which the information of the input tag is printed is displayed (S702). Here, the method of producing a metal RFID tag according to the present invention is performed by using an RFID printer, and at the same time, the RFID printer processes the input of the information and the labeling process on which the tag information is printed, thereby reducing the production time of the existing metal tag. It shortens and has the effect of preventing the risk of missing information. When the process of step 702 is performed, the label tag 104 according to the present invention including the information of the article to be attached is produced, and the dielectric layer 106 is disposed below the label tag 104 and the lower portion of the dielectric layer 106. By positioning the ground plane 105 on the surface and adhering the label tag 104, the dielectric layer 106, and the ground plane 105 with the adhesive 107, it is possible to operate normally on a conductive object such as a metal. The RFID tag for metal will be produced (703).

In the above, the configuration of the present invention has been described with reference to the preferred embodiment of the present invention, but the present invention is not limited to the above embodiments, and various modifications, additions, and modifications based on the appended claims and drawings. It should be noted that implementation is possible.

1 to 3 are views for explaining the overall configuration of the RFID tag for metal according to the present invention.

4 is a view for explaining the resonant frequency of the frequency of the RFID tag for metal according to an embodiment of the present invention,

5 is a view for explaining a change in frequency according to the length of the front patch of the RFID tag for metal;

6 is a view for explaining a radiation pattern when the metal plane of the metal RFID tag is attached.

7 is a view for explaining the overall procedure of the production method of the RFID tag for metal according to another embodiment of the present invention.

Claims (8)

A label tag comprising a front patch, a feeder for supplying power to the front patch, and a loop connecting the front patch and the feeder, wherein the feeder comprises an IC chip; A dielectric layer positioned below the label tag and having a dielectric constant; A ground plane positioned below the dielectric layer and serving as a ground; And An adhesive for bonding between the label tag and the dielectric layer and between the dielectric layer and the ground plane Metal RFID tag comprising a. The method of claim 1, And said label tag is formed on a dielectric film surface. The method of claim 1, The label tag receives an RF signal from an external reader, drives an IC chip included in the power supply unit based on the received RF signal, modulates the received RF signal and information included in the IC chip, RFID tag for metal, characterized in that for transmitting the modulated RF signal to the external reader through the front patch. The method of claim 1, The label tag may be configured to match the impedance of the label tag itself with the impedance of the IC chip included in the feeding part by adjusting the length of the long side of the front patch or by adjusting the horizontal and vertical radius of the loop. An RFID tag for metal. The method of claim 1, The loop is formed in a C-shaped RFID tag for metal, characterized in that coupled to the short side of the front patch. The method of claim 1, The feeder, RFID tag for metal, characterized in that present on the loop. In the method of producing an RFID tag for metal according to any one of claims 1 to 6, A first step of producing the label tag in a roll form using the dielectric film; A second step of inputting information into the label tag produced by the first step and displaying a label on which the information of the input tag is printed; A third step of adhering the label tag produced by the second step and the dielectric layer and the dielectric layer and the ground plane RFID tag for metal production method comprising a. The method of claim 7, wherein The first step, A first step of forming a label tag by forming a pattern of the label tag on a dielectric film surface; And Step 1-2 of attaching the IC chip to the feeder of the generated label tag Metal RFID tag production method comprising a.

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